Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2817
This examiner grants 62% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18636572 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17965268 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18530291 | FRAME STRUCTURES IN SEMICONDUCTOR PACKAGES | Non-Final OA | Apple Inc. |
| 18555553 | SOLID-STATE IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18369278 | DISPLAY DEVICE | Final Rejection | LG DISPLAY CO., LTD. |
| 18465707 | Display Device Including Oxide Semiconductor | Final Rejection | LG Display Co., Ltd. |
| 18394347 | VERTICAL FIELD-EFFECT TRANSISTOR STRUCTURE AND METHOD FOR PRODUCING A VERTICAL FIELD-EFFECT TRANSISTOR STRUCTURE | Non-Final OA | Robert Bosch GmbH |
| 18234778 | DISPLAY DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18091616 | TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING | Non-Final OA | Intel Corporation |
| 18499383 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | MEDIATEK INC. |
| 18389512 | POWER MODULE | Final Rejection | Kia Corporation |
| 18465748 | SEMICONDUCTOR DEVICE WITH BOTTOM DIELECTRIC ISOLATOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18463405 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF WITH CAP LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18096389 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17838253 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18555342 | METHODS AND APPLICATIONS OF NOVEL AMORPHOUS HIGH-K METAL-OXIDE DIELECTRICS BY SUPER-CYCLE ATOMIC LAYER DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18465759 | MAGNETIC MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18497961 | SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS | Non-Final OA | Advanced Micro Devices, Inc. |
| 18123613 | BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS | Non-Final OA | International Business Machines Corporation |
| 17893885 | FIELD-EFFECT TRANSISTORS WITH ISOLATION PILLARS | Non-Final OA | International Business Machines Corporation |
| 17664671 | ANGLED CONTACT WITH A NEGATIVE TAPERED PROFILE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18147684 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18118736 | ELECTRONIC PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17494689 | METHOD OF MANUFACTURING ELECTRICAL PACKAGES USING HALF-CUT AND GRINDING OPERATIONS OF ELECTRONIC UNITS | Final Rejection | Advanced Semiconductor Engineering, Inc. |
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