Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2817
This examiner grants 67% of resolved cases
Srinivasan, Sesha Sairaman is a patent examiner assigned to Tech Center 2800 and Art Unit 2812. The examiner has reached a final resolution on 49 cases. The data shows an allowance rate of 67.3 percent, which provides a baseline for applicants to understand the frequency of patent grants in this specific unit. This percentage serves as a primary metric for evaluating the likelihood of success during the examination process.
The prosecution timeline is characterized by a median of 1356 days to allowance. This figure represents the typical duration for an application to move from filing to a successful issuance. Practitioners should incorporate this 1356 day median into their long-term strategic planning and client expectations regarding the speed of prosecution under this examiner.
Direct communication appears to be a productive strategy, as evidenced by an interview lift of 27.4 percent. This metric indicates that the probability of an allowance increases when an interview is conducted. The 27.4 percent lift suggests that verbal engagement is an effective tool for resolving outstanding issues. These combined statistics from Art Unit 2812 offer a data-grounded view of the examiner's historical performance.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17965268 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18530291 | FRAME STRUCTURES IN SEMICONDUCTOR PACKAGES | Final Rejection | Apple Inc. |
| 17707294 | PAD STRUCTURE, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Display Co., LTD. |
| 18369278 | DISPLAY DEVICE | Final Rejection | LG DISPLAY CO., LTD. |
| 18394347 | VERTICAL FIELD-EFFECT TRANSISTOR STRUCTURE AND METHOD FOR PRODUCING A VERTICAL FIELD-EFFECT TRANSISTOR STRUCTURE | Non-Final OA | Robert Bosch GmbH |
| 18739185 | HIGH-BANDWIDTH MEMORY (HBM) PACKAGE-ON-PACKAGE (POP) DYNAMIC RANDOM-ACCESS MEMORY (DRAM) WITH SEMICONDUCTOR PILLARS | Non-Final OA | QUALCOMM Incorporated |
| 18091616 | TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING | Non-Final OA | Intel Corporation |
| 17975654 | LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS | Final Rejection | Intel Corporation |
| 18050527 | PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY | Final Rejection | Intel Corporation |
| 18047033 | PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS | Non-Final OA | Intel Corporation |
| 17848630 | HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD | Final Rejection | Intel Corporation |
| 18499383 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | MEDIATEK INC. |
| 18228261 | STACKED FIELD EFFECT TRANSISTORS | Final Rejection | International Business Machines Corporation |
| 18290714 | POWER SEMICONDUCTOR DEVICE | Non-Final OA | Hitachi Energy Ltd |
| 18237059 | THERMAL SPREADER | Final Rejection | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18465759 | MAGNETIC MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18465748 | SEMICONDUCTOR DEVICE WITH BOTTOM DIELECTRIC ISOLATOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18096389 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17832443 | Passive Device Structure | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18555342 | METHODS AND APPLICATIONS OF NOVEL AMORPHOUS HIGH-K METAL-OXIDE DIELECTRICS BY SUPER-CYCLE ATOMIC LAYER DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18147684 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18435227 | METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR CHIP WITH CHIP OUTLINE OF VARIOUS SHAPES AT WAFER LEVEL | Non-Final OA | SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION |
| 18464761 | VERTICAL ALUMINUM GALLIUM NITRIDE DEVICES ON CRYSTALLINE METALLIC SUBSTRATES | Final Rejection | University of South Carolina |
| 17658031 | CUTTING METHOD OF WAFER | Final Rejection | DISCO CORPORATION |
| 18118736 | ELECTRONIC PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17494689 | METHOD OF MANUFACTURING ELECTRICAL PACKAGES USING HALF-CUT AND GRINDING OPERATIONS OF ELECTRONIC UNITS | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18744675 | Semiconductor structure including silicon-on-insulator substrate and its manufacturing method | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18473998 | POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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