Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2817
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17730739 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17670912 | LAYER STRUCTURE INCLUDING METAL LAYER AND CARBON LAYER, METHOD OF MANUFACTURING THE LAYER STRUCTURE, ELECTRONIC DEVICE INCLUDING THE LAYER STRUCTURE, AND ELECTRONIC APPARATUS INCLUDING THE ELECTRONIC DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18246452 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING DISPLAY SUBSTRATE, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17996774 | SEMICONDUCTOR DEVICE, POWER CONVERTER, MOVING VEHICLE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Mitsubishi Electric Corporation |
| 18076539 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17707294 | PAD STRUCTURE, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18555553 | SOLID-STATE IMAGING DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18530291 | FRAME STRUCTURES IN SEMICONDUCTOR PACKAGES | Non-Final OA | Apple Inc. |
| 18080715 | MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION | Final Rejection | Google LLC |
| 18228261 | STACKED FIELD EFFECT TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18061495 | VIA AND SOURCE/DRAIN CONTACT LANDING UNDER POWER RAIL | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17963281 | SKIP VIA WITH LATERAL LINE CONNECTION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17664671 | ANGLED CONTACT WITH A NEGATIVE TAPERED PROFILE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18555342 | METHODS AND APPLICATIONS OF NOVEL AMORPHOUS HIGH-K METAL-OXIDE DIELECTRICS BY SUPER-CYCLE ATOMIC LAYER DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 17975654 | LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS | Non-Final OA | Intel Corporation |
| 18050527 | PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY | Non-Final OA | Intel Corporation |
| 17848630 | HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD | Non-Final OA | Intel Corporation |
| 18236425 | ARRAY SUBSTRATE AND DISPLAY PANEL | Final Rejection | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18389512 | POWER MODULE | Non-Final OA | Kia Corporation |
| 17887487 | SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17838253 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17964034 | METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT | Non-Final OA | HAMAMATSU PHOTONICS K.K. |
| 17730587 | STACK PACKAGES INCLUDING BONDING WIRE INTERCONNECTIONS | Final Rejection | SK hynix Inc. |
| 17915534 | Articles Including Nanostructured Surfaces and Enclosed Voids | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 17658031 | CUTTING METHOD OF WAFER | Non-Final OA | DISCO CORPORATION |
| 18237059 | THERMAL SPREADER | Non-Final OA | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18465166 | MANUFACTURING METHOD OF MEMORY DEVICE AND MANUFACTURING METHOD OF TUNGSTEN LAYER | Non-Final OA | MACRONIX International Co., Ltd. |
| 18474201 | OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18464761 | VERTICAL ALUMINUM GALLIUM NITRIDE DEVICES ON CRYSTALLINE METALLIC SUBSTRATES | Non-Final OA | University of South Carolina |
| 17998451 | METHOD OF GROWING SEMICONDUCTOR NANOWIRES USING A CATALYST ALLOY | Final Rejection | ALIGNEDBIO AB |
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