Prosecution Insights
Prosecution Insights
21 pending office actions • 10 art units • 21 examiners • 0 of 21 (0%) have an AI response strategy ready • 55 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 4 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 4 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 8 (38%) |
| §102 only | 2 (10%) |
| §112 only | 1 (5%) |
| Double-patenting only | 1 (5%) |
| Multi-statute (no §101) | 9 (43%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MAY, ROBERT J | 1 | 75.4% | +15.5% |
| JOHNSON, CHRISTOPHER A | 1 | 84.2% | +8.3% |
| RUCKER, BASEEMAH QADEER | 1 | — | — |
| ESKRIDGE, CORY W | 1 | 72.4% | +7.1% |
| RIRIE, EVERETT TRAJAN | 1 | 0.0% | +0.0% |
| ONUTA, TIBERIU DAN | 1 | 76.7% | +23.8% |
| BAREFORD, KATHERINE A | 1 | 13.7% | +28.6% |
| AHMED, SHAHED | 1 | 90.8% | -0.1% |
| LEE, WOO KYUNG | 1 | 81.3% | +15.9% |
| PATEL, REEMA | 1 | 88.7% | +6.5% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18405484 | Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core Shells | LEE, WOO KYUNG | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18302503 | Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL | NGUYEN, SOPHIA T | 5d overdue |
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 46d |
| 18765338 | METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES | JOHNSON, CHRISTOPHER A | — |
| 18646867 | SENSOR PACKAGE AND METHOD FOR FORMING THE SAME | RIRIE, EVERETT TRAJAN | — |
| 18414500 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | AHMED, SHAHED | — |
| 18395641 | METHOD FOR MAKING A SEMICONDUCTOR DEVICE USING A DOUBLE SIDE MOLDING TECHNOLOGY | PATEL, REEMA | — |
| 18503013 | Semiconductor Device and Methods of Making and Using Pre-Molded Bridge Die | RAHMAN, MOIN M | — |
| 18315098 | Semiconductor Device and Method of Making a Fan-Out Semiconductor Package with Pre-Assembled Passive Modules | BOOTH, RICHARD A | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 46d |
| 19421253 | Semiconductor Device and Method of Forming Double-Sided Rectifying Antenna on Power Module | MAY, ROBERT J | — |
| 18646853 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | ONUTA, TIBERIU DAN | — |
| 18405484 | Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core Shells | LEE, WOO KYUNG | — |
| Art Unit | Apps |
|---|---|
| 2812 | 3 |
| 2893 | 3 |
| 2899 | 3 |
| 2875 | 1 |
| 1718 | 1 |
| 2813 | 1 |
| 2815 | 1 |
| 2898 | 1 |
| 2891 | 1 |
| 2817 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19421253 | Semiconductor Device and Method of Forming Double-Sided Rectifying Antenna on Power Module | MAY, ROBERT J | 2875 | DP | Non-Final OA | — | Pending | Dec 16, 2025 |
| 18765338 | METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES | JOHNSON, CHRISTOPHER A | — | §103§112 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18673384 | SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME | RUCKER, BASEEMAH QADEER | — | §103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18650077 | SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME | ESKRIDGE, CORY W | — | §102 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18646867 | SENSOR PACKAGE AND METHOD FOR FORMING THE SAME | RIRIE, EVERETT TRAJAN | — | §103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646853 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | ONUTA, TIBERIU DAN | — | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 1718 | §102§103§112 | Final Rejection | 46d | Pending | Apr 24, 2024 |
| 18414500 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18405484 | Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core Shells | LEE, WOO KYUNG | 2815 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18395641 | METHOD FOR MAKING A SEMICONDUCTOR DEVICE USING A DOUBLE SIDE MOLDING TECHNOLOGY | PATEL, REEMA | 2812 | §102§103 | Non-Final OA | — | Pending | Dec 25, 2023 |
| 18503013 | Semiconductor Device and Methods of Making and Using Pre-Molded Bridge Die | RAHMAN, MOIN M | 2898 | §102§103 | Final Rejection | — | Pending | Nov 06, 2023 |
| 18498494 | Semiconductor Device and Method of Forming Fan-Out Package Structure with Embedded Overhanging Backside Antenna | YEMELYANOV, DMITRIY | 2891 | §102 | Final Rejection | — | Pending | Oct 31, 2023 |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | 7d | Pending | Aug 30, 2023 |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Jul 24, 2023 |
| 18332777 | MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING THE SAME | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jun 12, 2023 |
| 18328795 | METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | 16d overdue | Pending | Jun 05, 2023 |
| 18315098 | Semiconductor Device and Method of Making a Fan-Out Semiconductor Package with Pre-Assembled Passive Modules | BOOTH, RICHARD A | 2812 | §102§103 | Non-Final OA | — | Pending | May 10, 2023 |
| 18302503 | Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL | NGUYEN, SOPHIA T | 2893 | §103§112 | Non-Final OA | 5d overdue | Pending | Apr 18, 2023 |
| 18163884 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | CHANG, JAY C | 2817 | §112 | Non-Final OA | — | Pending | Feb 03, 2023 |
| 17810901 | Semiconductor Device and Method of Heat Dissipation Using Graphene | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | — | Pending | Jul 06, 2022 |
| 17648146 | Semiconductor Device and Method of Stabilizing Heat Spreader on Semiconductor Package | CHEN, JACK S J | 2893 | §102§103§112 | Final Rejection | — | Pending | Jan 17, 2022 |
IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial