16 pending office actions • 9 art units • 14 examiners • 0 of 16 (0%) have an AI response strategy ready • 56 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 15 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 15 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 13 (81%) |
| §102 only | 3 (19%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BULLARD-CONNOR, GENEVIEVE GRACE | 3 | 50.0% | +0.0% |
| BAREFORD, KATHERINE A | 1 | 13.5% | +28.5% |
| WHALEN, DANIEL B | 1 | 80.1% | +15.8% |
| NGUYEN, KHIEM D | 1 | 85.7% | +12.5% |
| AHMAD, KHAJA | 1 | 80.9% | +26.6% |
| TOBERGTE, NICHOLAS J | 1 | 94.5% | +1.9% |
| KUPP, BENJAMIN MICHAEL | 1 | 92.9% | +10.0% |
| CHOUDHRY, MOHAMMAD M | 1 | 81.6% | +12.2% |
| LE, TUNG X | 1 | 86.9% | +3.2% |
| HANUMASAGAR, SHAMITA S | 1 | 81.8% | -10.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18482849 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, KHIEM D | 32d overdue |
| 18459046 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | TOBERGTE, NICHOLAS J | 2d overdue |
| 18332023 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | HANUMASAGAR, SHAMITA S | 5d |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | KUPP, BENJAMIN MICHAEL | 7d |
| 18334375 | ANTENNA MODULE, SEMICONDUCTOR DEVICE AND METHODS FOR MAKING THE SAME | LE, TUNG X | 12d |
| 18468957 | Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps | AHMAD, KHAJA | 42d |
| 18492047 | Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package Structure | WHALEN, DANIEL B | 83d |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | CHOUDHRY, MOHAMMAD M | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 46d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18482849 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, KHIEM D | 32d overdue |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | KUPP, BENJAMIN MICHAEL | 7d |
| 18468957 | Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps | AHMAD, KHAJA | 42d |
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 46d |
| 18492047 | Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package Structure | WHALEN, DANIEL B | 83d |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | CHOUDHRY, MOHAMMAD M | — |
| Art Unit | Apps |
|---|---|
| 2899 | 5 |
| 2893 | 3 |
| 2817 | 2 |
| 1718 | 1 |
| 2892 | 1 |
| 2813 | 1 |
| 2844 | 1 |
| 2814 | 1 |
| 2896 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 1718 | §103 | Non-Final OA | 46d | Pending | Apr 24, 2024 |
| 18492047 | Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package Structure | WHALEN, DANIEL B | 2893 | §103 | Final Rejection | 83d | Pending | Oct 23, 2023 |
| 18482849 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | 32d overdue | Pending | Oct 07, 2023 |
| 18468957 | Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps | AHMAD, KHAJA | 2813 | §103 | Final Rejection | 42d | Pending | Sep 18, 2023 |
| 18459046 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §103 | Non-Final OA | 2d overdue | Pending | Aug 31, 2023 |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | 7d | Pending | Aug 30, 2023 |
| 18447315 | SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 9d | Pending | Aug 10, 2023 |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Final Rejection | — | Pending | Jul 24, 2023 |
| 18334375 | ANTENNA MODULE, SEMICONDUCTOR DEVICE AND METHODS FOR MAKING THE SAME | LE, TUNG X | 2844 | §102 | Non-Final OA | 12d | Pending | Jun 14, 2023 |
| 18332023 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | HANUMASAGAR, SHAMITA S | 2814 | §103 | Final Rejection | 5d | Pending | Jun 09, 2023 |
| 18330347 | HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 2d overdue | Pending | Jun 06, 2023 |
| 18329605 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 5d | Pending | Jun 06, 2023 |
| 18328795 | METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | 16d overdue | Pending | Jun 05, 2023 |
| 18302503 | Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL | NGUYEN, SOPHIA T | 2893 | §103 | Final Rejection | 5d overdue | Pending | Apr 18, 2023 |
| 18193942 | Semiconductor Device and Method of Forming Interconnect Structure with Graphene Core Shells for 3D Stacking Package | ANDERSON, WILLIAM H | 2817 | §102 | Final Rejection | 34d | Pending | Mar 31, 2023 |
| 17451166 | Semiconductor Device and Method of Forming RDL Hybrid Interposer Substrate | PATERSON, BRIGITTE A | 2896 | §102 | Non-Final OA | 33d | Pending | Oct 18, 2021 |
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