Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
23 pending office actions • 7 art units • 21 examiners • 0 of 23 (0%) have an AI response strategy ready • 50 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 3 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 3 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 7 (30%) |
| §102 only | 1 (4%) |
| Multi-statute (no §101) | 15 (65%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MALSAWMA, LALRINFAMKIM HMAR | 2 | 90.5% | +8.8% |
| NGUYEN, SOPHIA T | 2 | 44.7% | +14.4% |
| DINH, TUAN T | 1 | 78.8% | +22.1% |
| JOHNSON, CHRISTOPHER A | 1 | 84.4% | +8.2% |
| STARK, JARRETT J | 1 | 70.5% | +11.5% |
| SENGDARA, VONGSAVANH | 1 | 72.2% | +18.4% |
| RAMOS FELICIANO, ELISEO | 1 | 35.6% | +17.4% |
| MELLINGER, CORBYN DAVID | 1 | 78.4% | +40.0% |
| HARBOTTLE, CHARLOTTE ELIZABETH | 1 | 100.0% | +0.0% |
| RIRIE, EVERETT TRAJAN | 1 | 50.0% | +0.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18605841 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18302503 | Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL | NGUYEN, SOPHIA T | 5d overdue |
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 46d |
| 18765338 | METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES | JOHNSON, CHRISTOPHER A | — |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | STARK, JARRETT J | — |
| 18740630 | SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS | SENGDARA, VONGSAVANH | — |
| 18673384 | SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME | RAMOS FELICIANO, ELISEO | — |
| 18656286 | Semiconductor Devices and Methods of Making and Using Solder Bumps on FO-WLP | MELLINGER, CORBYN DAVID | — |
| 18655254 | ELECTRONIC PACKAGE AND A PACKAGING METHOD | HARBOTTLE, CHARLOTTE ELIZABETH | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18302503 | Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL | NGUYEN, SOPHIA T | 5d overdue |
| 18902287 | Antenna-in-Package Devices and Methods of Making | DINH, TUAN T | — |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | STARK, JARRETT J | — |
| 18740630 | SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS | SENGDARA, VONGSAVANH | — |
| 18673384 | SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME | RAMOS FELICIANO, ELISEO | — |
| 18656286 | Semiconductor Devices and Methods of Making and Using Solder Bumps on FO-WLP | MELLINGER, CORBYN DAVID | — |
| 18395626 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, SOPHIA T | — |
| Art Unit | Apps |
|---|---|
| 2893 | 4 |
| 2892 | 3 |
| 2899 | 2 |
| 2818 | 1 |
| 1718 | 1 |
| 2813 | 1 |
| 2898 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18902287 | Antenna-in-Package Devices and Methods of Making | DINH, TUAN T | — | §103 | Final Rejection | — | Pending | Sep 30, 2024 |
| 18765338 | METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES | JOHNSON, CHRISTOPHER A | — | §103§112 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | STARK, JARRETT J | — | §103§112 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18740630 | SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS | SENGDARA, VONGSAVANH | — | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18673384 | SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME | RAMOS FELICIANO, ELISEO | — | §102§103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18656286 | Semiconductor Devices and Methods of Making and Using Solder Bumps on FO-WLP | MELLINGER, CORBYN DAVID | — | §102§103§112 | Non-Final OA | — | Pending | May 06, 2024 |
| 18655254 | ELECTRONIC PACKAGE AND A PACKAGING METHOD | HARBOTTLE, CHARLOTTE ELIZABETH | — | §103§112 | Non-Final OA | — | Pending | May 04, 2024 |
| 18646867 | SENSOR PACKAGE AND METHOD FOR FORMING THE SAME | RIRIE, EVERETT TRAJAN | — | §103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646903 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | THROCKMORTON, ROBERT EMIL | 2818 | §102§103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646629 | Semiconductor Device and Method of Making a Wafer-Level Substrate | SPRENGER, JAIME LYNN | — | §103 | Final Rejection | — | Pending | Apr 25, 2024 |
| 18644515 | Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge | BAREFORD, KATHERINE A | 1718 | §102§103§112 | Final Rejection | 46d | Pending | Apr 24, 2024 |
| 18638733 | SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE | TRAN, DZUNG | — | §103 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18605841 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18605842 | PARTIALLY SHIELDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18414500 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18406924 | Semiconductor Device and Method of Making a Molded IPD-CoW | ISAAC, STANETTA D | 2898 | §102 | Final Rejection | — | Pending | Jan 08, 2024 |
| 18395626 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, SOPHIA T | 2893 | §103§112 | Final Rejection | — | Pending | Dec 25, 2023 |
| 18462612 | Semiconductor Device and Method of Forming FOWLP with Pre-Molded Embedded Discrete Electrical Component | MCCUTCHEON, COLIN RUSSELL | 2892 | §102§112 | Final Rejection | — | Pending | Sep 07, 2023 |
| 18448913 | Semiconductor Device and Method Using Lead Frame Interposer in Bump Continuity Test | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | — | Pending | Aug 12, 2023 |
| 18447315 | SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 9d | Pending | Aug 10, 2023 |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Jul 24, 2023 |
| 18302503 | Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL | NGUYEN, SOPHIA T | 2893 | §103§112 | Non-Final OA | 5d overdue | Pending | Apr 18, 2023 |
| 17648146 | Semiconductor Device and Method of Stabilizing Heat Spreader on Semiconductor Package | CHEN, JACK S J | 2893 | §102§103§112 | Final Rejection | — | Pending | Jan 17, 2022 |
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