Prosecution Insights
Last updated: May 29, 2026

Stats Chippac Pte. Ltd.

16 pending office actions • 9 art units • 14 examiners • 0 of 16 (0%) have an AI response strategy ready • 56 patents granted in the last 365 days

Portfolio Summary

16
Total Pending OAs
7
Non-Final OAs
8
Final Rejections
1
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 15 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

5
Overdue
3
Due this week
2
Due this month
4
Due in next 60 days
1
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 15 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (5)Due ≤ 7 days (3)Due ≤ 30 days (2)Due ≤ 60 days (4)Due later (1)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

0
Hard (0%)
16
Medium (100%)
0
Easy (0%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only13 (81%)
§102 only3 (19%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

1
Life Sciences
6% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
15
Semiconductors
94% of docket
0
Mechanical / Eng
0% of docket
0
Business / Other
0% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

160 h
Manual time on pending OAs
32 h
Time saved (low, 20%)
56 h
Time saved (mid, 35%)
1.4 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
BULLARD-CONNOR, GENEVIEVE GRACE 3 50.0% +0.0%
BAREFORD, KATHERINE A 1 13.5% +28.5%
WHALEN, DANIEL B 1 80.1% +15.8%
NGUYEN, KHIEM D 1 85.7% +12.5%
AHMAD, KHAJA 1 80.9% +26.6%
TOBERGTE, NICHOLAS J 1 94.5% +1.9%
KUPP, BENJAMIN MICHAEL 1 92.9% +10.0%
CHOUDHRY, MOHAMMAD M 1 81.6% +12.2%
LE, TUNG X 1 86.9% +3.2%
HANUMASAGAR, SHAMITA S 1 81.8% -10.7%

Quick Wins (8)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
18482849 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME NGUYEN, KHIEM D 32d overdue
18459046 INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME TOBERGTE, NICHOLAS J 2d overdue
18332023 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME HANUMASAGAR, SHAMITA S 5d
18459014 SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME KUPP, BENJAMIN MICHAEL 7d
18334375 ANTENNA MODULE, SEMICONDUCTOR DEVICE AND METHODS FOR MAKING THE SAME LE, TUNG X 12d
18468957 Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps AHMAD, KHAJA 42d
18492047 Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package Structure WHALEN, DANIEL B 83d
18357361 Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer CHOUDHRY, MOHAMMAD M

Hard Cases (1)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 1 ordered by deadline are shown.

App #TitleExaminerDue in
18644515 Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge BAREFORD, KATHERINE A 46d

Interview Candidates (6)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.

App #TitleExaminerDue in
18482849 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME NGUYEN, KHIEM D 32d overdue
18459014 SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME KUPP, BENJAMIN MICHAEL 7d
18468957 Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps AHMAD, KHAJA 42d
18644515 Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge BAREFORD, KATHERINE A 46d
18492047 Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package Structure WHALEN, DANIEL B 83d
18357361 Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer CHOUDHRY, MOHAMMAD M

Top Art Units

Art UnitApps
2899 5
2893 3
2817 2
1718 1
2892 1
2813 1
2844 1
2814 1
2896 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
18644515 Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge BAREFORD, KATHERINE A 1718 §103 Non-Final OA 46d Pending Apr 24, 2024
18492047 Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package Structure WHALEN, DANIEL B 2893 §103 Final Rejection 83d Pending Oct 23, 2023
18482849 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME NGUYEN, KHIEM D 2892 §103 Non-Final OA 32d overdue Pending Oct 07, 2023
18468957 Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps AHMAD, KHAJA 2813 §103 Final Rejection 42d Pending Sep 18, 2023
18459046 INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME TOBERGTE, NICHOLAS J 2817 §103 Non-Final OA 2d overdue Pending Aug 31, 2023
18459014 SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME KUPP, BENJAMIN MICHAEL 2893 §103 Non-Final OA 7d Pending Aug 30, 2023
18447315 SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKING THE SAME BULLARD-CONNOR, GENEVIEVE GRACE 2899 §103 Non-Final OA 9d Pending Aug 10, 2023
18357361 Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer CHOUDHRY, MOHAMMAD M 2899 §103 Final Rejection Pending Jul 24, 2023
18334375 ANTENNA MODULE, SEMICONDUCTOR DEVICE AND METHODS FOR MAKING THE SAME LE, TUNG X 2844 §102 Non-Final OA 12d Pending Jun 14, 2023
18332023 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME HANUMASAGAR, SHAMITA S 2814 §103 Final Rejection 5d Pending Jun 09, 2023
18330347 HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE BULLARD-CONNOR, GENEVIEVE GRACE 2899 §103 Final Rejection 2d overdue Pending Jun 06, 2023
18329605 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME BULLARD-CONNOR, GENEVIEVE GRACE 2899 §103 Final Rejection 5d Pending Jun 06, 2023
18328795 METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE PARTHASARATHY, ROHIT 2899 §103 Non-Final OA 16d overdue Pending Jun 05, 2023
18302503 Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDL NGUYEN, SOPHIA T 2893 §103 Final Rejection 5d overdue Pending Apr 18, 2023
18193942 Semiconductor Device and Method of Forming Interconnect Structure with Graphene Core Shells for 3D Stacking Package ANDERSON, WILLIAM H 2817 §102 Final Rejection 34d Pending Mar 31, 2023
17451166 Semiconductor Device and Method of Forming RDL Hybrid Interposer Substrate PATERSON, BRIGITTE A 2896 §102 Non-Final OA 33d Pending Oct 18, 2021

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