26 pending office actions • 2 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Intel Ndtm US LLC | 20 |
| SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | 6 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 18909805 | Untitled | SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | AHMED, ZUBAIR | 2132 | Final Rejection | |
| 18909812 | Untitled | SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | MILLER, ALAN S | 3625 | Non-Final OA | |
| 18791987 | COMMUNICATION BETWEEN A COMPUTING ELEMENT OF A MEMORY DEVICE AND AN ELECTRONIC DEVICE | SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | OBERLY, ERIC T | 2184 | Non-Final OA | Aug 01, 2024 |
| 18767876 | Multi-Processor Block Based NAND Memory Access Interfaces | SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | MATIN, TASNIMA | 2135 | Final Rejection | Jul 09, 2024 |
| 18542337 | ALD VS PVD IGZO CHANNEL AND ALOX CHANNEL PASSIVATION IN A 3D NAND VERTICAL WORDLINE DRIVER | Intel Ndtm US LLC | WRIGHT, TUCKER J | 2891 | Non-Final OA | Dec 15, 2023 |
| 18368787 | FLOATING GATE NAND CELL – METHODS AND APPROACHES FOR FABRICATION | Intel Ndtm US LLC | HAN, JONATHAN | 2818 | Non-Final OA | Sep 15, 2023 |
| 18237077 | PREVENTION OF FLOATING GATE 3D-NAND CELL RESIDUAL BY USING HYBRID PLUG PROCESS IN SUPER-DECK STRUCTURE | Intel Ndtm US LLC | BERNSTEIN, ALLISON | 2824 | Non-Final OA | Aug 23, 2023 |
| 18235766 | INTEGRATED WORD LINE CONTACT STRUCTURES IN THREE-DIMENSIONAL (3D) MEMORY ARRAY | Intel Ndtm US LLC | HSIEH, HSIN YI | 2899 | Non-Final OA | Aug 18, 2023 |
| 18227256 | PROGRESSIVE REDUNDANT ARRAY OF INEXPENSIVE DISKS (RAID) FOR MEMORY DEVICES | SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | LOONAN, ERIC T | 2137 | Non-Final OA | Jul 27, 2023 |
| 18249635 | MEMORY DEVICES WITH GRADIENT-DOPED CONTROL GATE MATERIAL | Intel Ndtm US LLC | SALAZ, SAMMANTHA KATELYN | 2892 | Final Rejection | Apr 19, 2023 |
| 18188391 | VERTICAL WORDLINE DRIVER STRUCTURES AND METHODS | Intel Ndtm US LLC | NGUYEN, DUY T V | 2818 | Non-Final OA | Mar 22, 2023 |
| 18123612 | METHODS AND SYSTEMS FOR CONTROLLING UNDERFILL BLEED-OUT IN SEMICONDUCTOR PACKAGING | SK Hynix Nand Product Solutions Corp. (Dba Solidigm) | VU, VU A | 2897 | Final Rejection | Mar 20, 2023 |
| 18148230 | MULTI-PHASE CLOCKING SCHEME FOR A MEMORY DEVICE | Intel Ndtm US LLC | PEIKARI, BEHZAD | 3992 | Non-Final OA | Dec 29, 2022 |
| 18147335 | NAND AGING PROTECTION SCHEME | Intel Ndtm US LLC | CRAWFORD, JASON | 2844 | Non-Final OA | Dec 28, 2022 |
| 18089422 | DYNAMIC NEGATIVE CHARGE PUMP FOR NON-VOLATILE MEMORY | Intel Ndtm US LLC | YOHA, CONNIE C | 2825 | Non-Final OA | Dec 27, 2022 |
| 18086315 | MULTI-DECK NAND MEMORY WITH HYBRID DECK SLC | Intel Ndtm US LLC | LOONAN, ERIC T | 2137 | Non-Final OA | Dec 21, 2022 |
| 18084100 | NAND DUTY CYCLE CORRECTION FOR DATA INPUT WRITE PATH | Intel Ndtm US LLC | LAPPAS, JASON | 2827 | Non-Final OA | Dec 19, 2022 |
| 17919730 | ORGANIC SPACER FOR INTEGRATED CIRCUITS | Intel Ndtm US LLC | CHEN, JACK S J | 2893 | Non-Final OA | Oct 18, 2022 |
| 18047097 | WORD LINE VOLTAGE DETECTION CIRCUIT FOR ENCHANCED READ OPERATION | Intel Ndtm US LLC | CHO, SUNG IL | 2825 | Non-Final OA | Oct 17, 2022 |
| 18047094 | STRUCTURE AND METHOD OF INCREASING SUBTRACTIVE BITLINE AIR GAP HEIGHT | Intel Ndtm US LLC | LEE, ALVIN LYNGHI | 2813 | Non-Final OA | Oct 17, 2022 |
| 17791175 | VARYING CHANNEL WIDTH IN THREE-DIMENSIONAL MEMORY ARRAY | Intel Ndtm US LLC | HSIEH, HSIN YI | 2899 | Non-Final OA | Jul 06, 2022 |
| 17737461 | DETECTED THRESHOLD VOLTAGE STATE DISTRIBUTION OF FIRST AND SECOND PASS PROGRAMED MEMORY PAGES | Intel Ndtm US LLC | SMET, UYEN TRAN | 2824 | Final Rejection | May 05, 2022 |
| 17705051 | INTERFACE FOR DIFFERENT INTERNAL AND EXTERNAL MEMORY IO PATHS | Intel Ndtm US LLC | SAIN, GAUTAM | 2135 | Non-Final OA | Mar 25, 2022 |
| 17702001 | THREE-DIMENSIONAL MEMORY WITH SUPER-PILLAR | Intel Ndtm US LLC | SALERNO, SARAH KATE | 2814 | Final Rejection | Mar 23, 2022 |
| 17551018 | 3D NAND MEMORY CELL WITH FLAT TRAP BASE PROFILE | Intel Ndtm US LLC | SMITH, SAMUEL JONATHAN | 2817 | Final Rejection | Dec 14, 2021 |
| 17123451 | VERTICAL CHANNEL WITH CONDUCTIVE STRUCTURES TO IMPROVE STRING CURRENT | Intel Ndtm US LLC | CHEN, YU | 2896 | Final Rejection | Dec 16, 2020 |
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