| 19230629 |
Method and System to Measure Optical Characteristics of Light-Transmissive Materials |
DOUMBIA, MOHAMED |
2877 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Jun 06, 2025 |
| 18930630 |
DUAL INLINE POWER MODULE |
TRAN, BINH BACH THANH |
2847 |
§102§103 |
Non-Final OA |
— |
Pending |
Oct 29, 2024 |
| 18915457 |
CIRCUITRY FOR ALLOWING MULTIPLE SENSORS ON A SEMICONDUCTOR DIE TO SHARE A COMMON SENSOR PAD |
GIBSON, RANDY W |
2855 |
§102 |
Non-Final OA |
— |
Pending |
Oct 15, 2024 |
| 18910403 |
SEMICONDUCTOR DEVICES WITH LENGTH-GRADED CHANNEL |
DULKA, JOHN P |
2817 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Oct 09, 2024 |
| 18830731 |
POWER SEMICONDUCTOR DEVICES INCLUDING DEEP SHIELDING REGIONS |
ZHU, SHENG-BAI |
2897 |
§102§103 |
Non-Final OA |
— |
Pending |
Sep 11, 2024 |
| 18828024 |
LARGE DIMENSION SILICON CARBIDE SINGLE CRYSTALLINE MATERIALS WITH REDUCED CRYSTALLOGRAPHIC STRESS |
KUNEMUND, ROBERT M |
1714 |
§102§103 |
Non-Final OA |
— |
Pending |
Sep 09, 2024 |
| 18792813 |
POWER SEMICONDUCTOR DEVICES INCLUDING ANGLED GATE TRENCHES |
ANYA, IGWE U |
2891 |
§102§103 |
Non-Final OA |
— |
Pending |
Aug 02, 2024 |
| 18775934 |
Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods |
GHEYAS, SYED I |
2893 |
§103Other |
Non-Final OA |
— |
Pending |
Jul 17, 2024 |
| 18759385 |
High Throughput High Dynamic Range (HDR) Microscopy |
THIRUGNANAM, GANDHI |
2672 |
§101§102§103§112 |
Non-Final OA |
— |
Pending |
Jun 28, 2024 |
| 18755884 |
GATE-CONTROLLED SEMICONDUCTOR DEVICES HAVING TEMPERATURE COMPENSATED GATE RESISTANCES |
MOVVA, AMAR |
2898 |
§102§103 |
Non-Final OA |
— |
Pending |
Jun 27, 2024 |
| 18751832 |
REDUCED OPTICAL ABSORPTION FOR SILICON CARBIDE CRYSTALLINE MATERIALS |
AHMAD, KHAJA |
2813 |
§103 |
Non-Final OA |
— |
Pending |
Jun 24, 2024 |
| 18742626 |
TRENCH BASED SEMICONDUCTOR DEVICES WITH INCREASED PLANARITY |
SUN, YU-HSI DAVID |
2817 |
§102 |
Non-Final OA |
— |
Pending |
Jun 13, 2024 |
| 18737609 |
Method and System to Measure Optical Characteristics of Light-Transmissive Materials |
DOUMBIA, MOHAMED |
2877 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Jun 07, 2024 |
| 18733442 |
POWER DISCRETE PACKAGE HAVING SYMMETRIC PINOUTS AND PROCESS OF IMPLEMENTING THE SAME |
BOOTH, RICHARD A |
2812 |
§103§112 |
Non-Final OA |
— |
Pending |
Jun 04, 2024 |
| 18663862 |
Workpiece Surface Processing System for Semiconductor Wafers |
ISHAQ, ISHAQ MOHAMED SAID |
3723 |
§102§103§112 |
Non-Final OA |
— |
Pending |
May 14, 2024 |
| 18663985 |
SEMICONDUCTOR DEVICES WITH GATE BUS LAYOUTS FOR HANDLING UNCLAMPED INDUCTIVE SWITCHING CURRENT |
THROCKMORTON, ROBERT EMIL |
2818 |
§102§103§112 |
Non-Final OA |
— |
Pending |
May 14, 2024 |
| 18655542 |
SEMICONDUCTOR DEVICES HAVING METAL GATE RUNNERS WITH ASYMMETRIC OUTER GATE RUNNERS, UNEVENLY-SPACED INNER GATE RUNNERS AND/OR SPINE-RIB INNER GATE RUNNERS WITH MULTIPLE RIBS |
HA, NATHAN W |
2814 |
§102§103 |
Non-Final OA |
— |
Pending |
May 06, 2024 |
| 18636381 |
POWER TRANSISTOR WITH SOFT RECOVERY BODY DIODE |
ALAM, MOHAMMED R |
2897 |
§102§103DP |
Non-Final OA |
— |
Pending |
Apr 16, 2024 |
| 18633618 |
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING ENHANCED AVALANCHE ROBUSTNESS AND METHODS OF FORMING SUCH DEVICES |
SALERNO, SARAH KATE |
2814 |
§102 |
Non-Final OA |
— |
Pending |
Apr 12, 2024 |
| 18612356 |
POWER DEVICES WITH BARRIER METAL EXTENSION AND SEALING |
GHEYAS, SYED I |
2893 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 21, 2024 |
| 18610394 |
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND METHODS OF FORMING THE SAME |
SPALLA, DAVID C |
2893 |
§102 |
Non-Final OA |
— |
Pending |
Mar 20, 2024 |
| 18598866 |
MOSFETS WITH IMPLANTED CHARGE COMPENSATION REGIONS |
MEHTA, RATISHA |
2817 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 07, 2024 |
| 18589080 |
DC LINK SNUBBER DEVICE CONFIGURED FOR CONNECTION TO A POWER MODULE AND/OR THE LIKE AND PROCESSES OF IMPLEMENTING THE SAME |
TIKU, SISAY G |
2838 |
§103 |
Non-Final OA |
70d |
Pending |
Feb 27, 2024 |
| 18586142 |
DEVICE PACKAGE HAVING A CONTACTLESS SENSOR AND PROCESS OF IMPLEMENTING THE SAME |
CHIU, TSZ K |
2898 |
§102§103 |
Final Rejection |
— |
Pending |
Feb 23, 2024 |
| 18584179 |
Integrated Active Cooling in Power Packages |
TRAPANESE, WILLIAM C |
2812 |
§103 |
Final Rejection |
— |
Pending |
Feb 22, 2024 |
| 18581339 |
SILICON CARBIDE POWER DEVICES HAVING EXPANDED CREEPAGE DISTANCES |
TORNOW, MARK W |
2891 |
§102§103 |
Non-Final OA |
— |
Pending |
Feb 19, 2024 |
| 18443031 |
Layered Metallization in Power Semiconductor Packages |
VALENZUELA, PATRICIA D |
2812 |
§103 |
Non-Final OA |
— |
Pending |
Feb 15, 2024 |
| 18422617 |
Anti-Reflective Layer for Protecting an N-Polar Group III-Nitride Semiconductor Structure |
MULERO FLORES, ERIC MANUEL |
2898 |
§103§112 |
Final Rejection |
— |
Pending |
Jan 25, 2024 |
| 18422677 |
Thermally Stable FinFET Device for High Temperature Operation |
LOHAKARE, PRATIKSHA JAYANT |
2818 |
§103 |
Final Rejection |
— |
Pending |
Jan 25, 2024 |
| 18412190 |
Power Semiconductor Device Having Improved Transient Handling Without Field Insulating Layer |
GALVAN, ANGELICA ROS ESTIGOY |
2815 |
§102§112 |
Non-Final OA |
— |
Pending |
Jan 12, 2024 |
| 18405721 |
Power Semiconductor Devices Including Shape-Memory Metallization |
MAZUMDER, DIDARUL A |
2812 |
§102§103 |
Final Rejection |
33d |
Pending |
Jan 05, 2024 |
| 18403068 |
SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH RING-SHAPED CHANNEL REGIONS AND/OR CHANNEL REGIONS THAT EXTEND IN MULTIPLE DIRECTIONS IN PLAN VIEW |
LEE, EUGENE |
2815 |
§103 |
Final Rejection |
— |
Pending |
Jan 03, 2024 |
| 18545648 |
Electroless Deposition Process for Semiconductor Devices |
PAGE, STEVEN MITCHELL CHR |
2812 |
§102 |
Final Rejection |
— |
Pending |
Dec 19, 2023 |
| 18540135 |
ASYMMETRIC EDGE TERMINATION |
WALL, VINCENT |
2898 |
§103 |
Non-Final OA |
— |
Pending |
Dec 14, 2023 |
| 18518105 |
REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE POWER MODULE |
HOQUE, MOHAMMAD M |
2817 |
§102§103 |
Non-Final OA |
— |
Pending |
Nov 22, 2023 |
| 18514038 |
MASK INTEGRATION FOR TRENCHED SEMICONDUCTOR DEVICE STRUCTURES |
CHANG, JAY C |
2817 |
§102 |
Final Rejection |
— |
Pending |
Nov 20, 2023 |
| 18510756 |
ENHANCED ISOLATION FOR ON-CHIP CURRENT SENSORS |
LOPEZ, JORGE ANDRES |
2897 |
§103 |
Non-Final OA |
— |
Pending |
Nov 16, 2023 |
| 18510734 |
GATE TRENCH POWER SEMICONDUCTOR DEVICES WITH DEEP JFET PATTERNS |
MCDONALD, JASON ANDREW |
2898 |
§103 |
Non-Final OA |
— |
Pending |
Nov 16, 2023 |
| 18505197 |
PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS OF IMPLEMENTING THE SAME |
NGUYEN, KHIEM D |
2892 |
§102§103Other |
Final Rejection |
— |
Pending |
Nov 09, 2023 |
| 18383733 |
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WITH A LOW RESISTANCE CONTACT LAYER FOR SOURCE AND/OR DRAIN CONTACTS AND PROCESS FOR IMPLEMENTING THE SAME |
MENZ, DOUGLAS M |
2897 |
§102§103 |
Final Rejection |
— |
Pending |
Oct 25, 2023 |
| 18493838 |
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS |
RAMOS-DIAZ, FERNANDO JOSE |
2818 |
§102§103§112 |
Final Rejection |
7d |
Pending |
Oct 25, 2023 |
| 18488284 |
Direct Bonded Semiconductor Die Package |
SUN, YU-HSI DAVID |
2817 |
§102§103 |
Final Rejection |
22d |
Pending |
Oct 17, 2023 |
| 18487665 |
Multifunctional Adhesion Promoter for Semiconductor Device Packages |
FANG, SHANE |
1766 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Oct 16, 2023 |
| 18476452 |
POWER SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH SELECTIVE JFET IMPLANTS THAT ARE SELF-ALIGNED WITH THE WELL REGIONS AND METHODS OF MAKING SUCH DEVICES |
NGUYEN, SOPHIA T |
2893 |
§103 |
Final Rejection |
39d |
Pending |
Sep 28, 2023 |
| 18475370 |
Semiconductor Die Bonding |
LIU, MIKKA H |
2817 |
§103 |
Final Rejection |
— |
Pending |
Sep 27, 2023 |
| 18475298 |
Power Semiconductor Device Having Shaped Trench Ends |
RAHIM, NILUFA |
2893 |
§102§103§112 |
Final Rejection |
18d overdue |
Pending |
Sep 27, 2023 |
| 18471003 |
Corrosion Resistant Metal Structures for Wide Bandgap Semiconductor Devices |
HAN, JONATHAN |
2818 |
§103 |
Non-Final OA |
— |
Pending |
Sep 20, 2023 |
| 18456782 |
Thermal Enhanced Power Semiconductor Package |
PRASAD, NEIL R |
2897 |
§102§103Other |
Final Rejection |
35d |
Pending |
Aug 28, 2023 |
| 18453414 |
POWER SEMICONDUCTOR DEVICES HAVING GATE TRENCHES WITH ASYMMETRICALLY ROUNDED UPPER AND LOWER TRENCH CORNERS AND/OR RECESSED GATE ELECTRODES AND METHODS OF FABRICATING SUCH DEVICES |
CHEN, YU |
2896 |
§103 |
Final Rejection |
56d |
Pending |
Aug 22, 2023 |
| 18213500 |
SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS |
LIU, XIAOMING |
2812 |
§102§103 |
Non-Final OA |
16d overdue |
Pending |
Jun 23, 2023 |
| 18336358 |
Semiconductor Package |
VALENZUELA, PATRICIA D |
2812 |
§103 |
Final Rejection |
10d overdue |
Pending |
Jun 16, 2023 |
| 18336376 |
Die-Attach Fillet Height Reduction |
VALENZUELA, PATRICIA D |
2812 |
§103 |
Non-Final OA |
22d overdue |
Pending |
Jun 16, 2023 |
| 18304869 |
Power Semiconductor Devices Including Beryllium Metallization |
GHEYAS, SYED I |
2893 |
§103 |
Final Rejection |
17d overdue |
Pending |
Apr 21, 2023 |
| 18125655 |
SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS |
LIU, XIAOMING |
2812 |
§103 |
Non-Final OA |
16d overdue |
Pending |
Mar 23, 2023 |
| 18187924 |
HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME |
YAP, DOUGLAS ANTHONY |
2899 |
§103 |
Non-Final OA |
29d overdue |
Pending |
Mar 22, 2023 |
| 18187804 |
DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME |
ARORA, AJAY |
2892 |
§102§103 |
Non-Final OA |
23d overdue |
Pending |
Mar 22, 2023 |
| 18169492 |
Electroless Die-Attach Process for Semiconductor Packaging |
ISAAC, STANETTA D |
2898 |
§102§103 |
Non-Final OA |
— |
Pending |
Feb 15, 2023 |
| 18168985 |
Vias for Semiconductor Devices Formed from Multiple Etching |
MIHALIOV, DMITRI |
2812 |
§103 |
Non-Final OA |
19d |
Pending |
Feb 14, 2023 |
| 18164205 |
Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer |
KIM, JAY C |
2815 |
§102§103 |
Non-Final OA |
5d |
Pending |
Feb 03, 2023 |
| 18164249 |
Semiconductor Structure for Improved Radio Frequency Thermal Management |
PATEL, REEMA |
2812 |
§112 |
Final Rejection |
75d |
Pending |
Feb 03, 2023 |
| 18154353 |
Thermal Enhanced Power Semiconductor Package |
PRASAD, NEIL R |
2897 |
§102§103Other |
Non-Final OA |
2d overdue |
Pending |
Jan 13, 2023 |
| 18093343 |
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SELF-ALIGNED TRENCH SHIELDING REGIONS AND RELATED METHODS |
CHEN, JACK S J |
2893 |
§112 |
Non-Final OA |
— |
Pending |
Jan 05, 2023 |
| 18063787 |
TRANSISTOR DEVICES INCLUDING SELF-ALIGNED OHMIC CONTACTS AND CONTACT REGIONS AND RELATED FABRICATION METHODS |
NICELY, JOSEPH C |
2813 |
§103 |
Non-Final OA |
— |
Pending |
Dec 09, 2022 |
| 17935509 |
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME |
ISAAC, STANETTA D |
2898 |
§102§103 |
Non-Final OA |
— |
Pending |
Sep 26, 2022 |
| 17867801 |
Multi-Cavity Package Having Single Metal Flange |
WHALEN, DANIEL B |
2893 |
§102§103 |
Non-Final OA |
— |
Pending |
Jul 19, 2022 |
| 17849316 |
TOP SIDE COOLED SEMICONDUCTOR PACKAGES |
PAGE, DALE E |
2899 |
§103 |
Final Rejection |
— |
Pending |
Jun 24, 2022 |
| 17736720 |
DYNAMIC PERFORMANCE OF ON-CHIP CURRENT SENSORS |
SMITH, BRADLEY |
2817 |
§102§103§112 |
Final Rejection |
348d overdue |
Pending |
May 04, 2022 |
| 17138193 |
PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT |
CHAMPAGNE, LUNA |
3627 |
§103§112 |
Non-Final OA |
13d |
Pending |
Dec 30, 2020 |
| 14212991 |
IGBT STRUCTURE FOR WIDE BAND-GAP SEMICONDUCTOR MATERIALS |
CHEN, DAVID Z |
2815 |
§103 |
Non-Final OA |
40d |
Pending |
Mar 14, 2014 |