47 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18884913 | PHASE-CHANGE MEMORY INCLUDING PHASE-CHANGE ELEMENTS IN SERIES WITH RESPECTIVE HEATER ELEMENTS AND METHODS FOR MANUFACTURING, PROGRAMMING, AND READING THEREOF | HIDALGO, FERNANDO N | 2827 | Non-Final OA | Sep 13, 2024 |
| 18762215 | METHODS AND DEVICES FOR ADAPTIVE VOLTAGE STEADYING | LAUTURE, JOSEPH J | 2845 | Non-Final OA | Jul 02, 2024 |
| 18756821 | HIGH SPEED DATA TRANSMISSION IN BATTERY MANAGEMENT SYSTEMS WITH ISOLATED SPI INTERFACE | ZAMAN, FAISAL M | 2175 | Non-Final OA | Jun 27, 2024 |
| 18752274 | METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, SEMICONDUCTOR PRODUCT, DEVICE AND TESTING METHOD | ANDERSON, WILLIAM H | 2817 | Final Rejection | Jun 24, 2024 |
| 18437922 | METHOD OF UPDATING A SOFTWARE INSTALLED ON A SECURE ELEMENT | MALIK, ZEERICK ASIM | 2193 | Non-Final OA | Feb 09, 2024 |
| 18416751 | CAPACITIVE, MEMS-TYPE ACOUSTIC TRANSDUCER HAVING SEPARATE SENSITIVE AND TRANSDUCTION AREAS AND MANUFACTURING PROCESS THEREOF | BRINEY III, WALTER F | 2692 | Final Rejection | Jan 18, 2024 |
| 18520894 | HIGH VOLTAGE SEMICONDUCTOR DEVICE HAVING A DEEP TRENCH INSULATION AND MANUFACTURING PROCESS | JAHAN, BILKIS | 2817 | Non-Final OA | Nov 28, 2023 |
| 18516707 | METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING PRODUCT AND SEMICONDUCTOR DEVICE | KEAGY, ROSE ALYSSA | 2818 | Non-Final OA | Nov 21, 2023 |
| 18515075 | MICROELECTROMECHANICAL DEVICE WITH TEST STRUCTURE, TEST EQUIPMENT FOR TESTING MICROELECTROMECHANICAL DEVICES AND METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL DEVICE | BOLDUC, DAVID J | 2852 | Non-Final OA | Nov 20, 2023 |
| 18509052 | GAN-BASED, LATERAL-CONDUCTION, ELECTRONIC DEVICE WITH IMPROVED METALLIC LAYERS LAYOUT | LIU, BENJAMIN T | 2893 | Non-Final OA | Nov 14, 2023 |
| 18369583 | MEASUREMENT SYSTEM, RELATED INTEGRATED CIRCUIT AND METHOD | NGUYEN, KHIEM D | 2843 | Non-Final OA | Sep 18, 2023 |
| 18243754 | AUDIO AMPLIFICATION METHOD AND DEVICE | NGUYEN, KHANH V | 2843 | Non-Final OA | Sep 08, 2023 |
| 18450789 | SIC-BASED ELECTRONIC DEVICE WITH FUSE ELEMENT FOR SHORT-CIRCUITS PROTECTION, AND MANUFACTURING METHOD THEREOF | NIELSEN, DEREK LANG | 2899 | Non-Final OA | Aug 16, 2023 |
| 18364180 | SIC-BASED ELECTRONIC DEVICE WITH IMPROVED GATE DIELECTRIC AND MANUFACTURING METHOD THEREOF, DIODE | LIU, XIAOMING | 2812 | Non-Final OA | Aug 02, 2023 |
| 18363599 | MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT | HOSSAIN, MOAZZAM | 2898 | Non-Final OA | Aug 01, 2023 |
| 18224701 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE | DYKES, LAURA M | 2892 | Non-Final OA | Jul 21, 2023 |
| 18224805 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR PRODUCTS | KUSUMAKAR, KAREN M | 2897 | Final Rejection | Jul 21, 2023 |
| 18223838 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Non-Final OA | Jul 19, 2023 |
| 18352153 | DEVICE PICK-UP DETECTION | LEE, PAUL D | 2857 | Non-Final OA | Jul 13, 2023 |
| 18339084 | MEMS GYROSCOPE WITH ENHANCED ROBUSTNESS AGAINST VIBRATIONS AND REDUCED DIMENSIONS | SHABMAN, MARK A | 2855 | Final Rejection | Jun 21, 2023 |
| 18209605 | OPTOELECTRONIC DEVICE | VU, JIMMY T | 2844 | Non-Final OA | Jun 14, 2023 |
| 18331837 | POWER MODULE FOR HALF-BRIDGE CIRCUIT WITH SCALABLE ARCHITECTURE AND IMPROVED LAYOUT | PARTHASARATHY, ROHIT | 2899 | Final Rejection | Jun 08, 2023 |
| 18323262 | METHOD OF FABRICATION OF AN INTEGRATED THERMOELECTRIC CONVERTER, AND INTEGRATED THERMOELECTRIC CONVERTER THUS OBTAINED | PILLAY, DEVINA | 1726 | Non-Final OA | May 24, 2023 |
| 18302610 | MEMS STRUCTURE INCLUDING A BURIED CAVITY WITH ANTISTICTION PROTUBERANCES, AND MANUFACTURING METHODS THEREOF | GEBREMARIAM, SAMUEL A | 2811 | Non-Final OA | Apr 18, 2023 |
| 18301002 | DEVICE, SYSTEM, METHOD, AND COMPUTER PRODUCT FOR DETECTING AND EVALUATING ENVIRONMENTAL QUANTITIES AND EVENTS WITH MODULAR APPROACH AND VARIABLE COMPLEXITY | LOPEZ ALVAREZ, OLVIN | 2117 | Non-Final OA | Apr 14, 2023 |
| 18193095 | POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR FOR AUTOMOTIVE APPLICATIONS, AND ASSEMBLING METHOD THEREOF | HIBBERT, DANIEL JOHNATHAN | 2899 | Final Rejection | Mar 30, 2023 |
| 18174462 | HEMT DEVICE AND MANUFACTURING PROCESS THEREOF | AHMAD, KHAJA | 2813 | Non-Final OA | Feb 24, 2023 |
| 18171184 | WATERPROOF PRESSURE SENSOR DEVICE WITH IMPROVED TEMPERATURE CALIBRATION AND CORRESPONDING TEMPERATURE CALIBRATION METHOD | MORELLO, JEAN F | 2855 | Final Rejection | Feb 17, 2023 |
| 18156120 | WIDE BAND GAP TRANSISTOR WITH NANOLAMINATED INSULATING GATE STRUCTURE AND PROCESS FOR MANUFACTURING A WIDE BAND GAP TRANSISTOR | NICELY, JOSEPH C | 2813 | Non-Final OA | Jan 18, 2023 |
| 18091470 | SEMICONDUCTOR METAL OXIDE BASED GAS SENSOR ACTIVATED AT ZERO HEATER POWER | OLAMIT, JUSTIN N | 2853 | Final Rejection | Dec 30, 2022 |
| 18078561 | METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHODS FOR ELECTRICALLY TESTING AND PROTECTING THE INTEGRATED CIRCUIT | KEBEDE, BROOK | 2818 | Non-Final OA | Dec 09, 2022 |
| 18060501 | CONFIGURABLE DIGITAL BLOCK FOR INFRARED SENSORS | TIMILSINA, SHARAD | 2857 | Final Rejection | Nov 30, 2022 |
| 18070966 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | ANDERSON, WILLIAM H | 2817 | Final Rejection | Nov 29, 2022 |
| 17962090 | CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMAGE RECOVERY | SOTO, CHRISTOPHER ASHLEY | 3723 | Final Rejection | Oct 07, 2022 |
| 17949057 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE HAVING IMPROVED MECHANICAL STABILITY | VERDES, RICKY | 2898 | Non-Final OA | Sep 20, 2022 |
| 17947703 | REVERSE-CONDUCTING IGBT DEVICE AND MANUFACTURING METHOD THEREOF, INVERTER STAGE | NICELY, JOSEPH C | 2813 | Final Rejection | Sep 19, 2022 |
| 17948075 | MICROFLUIDIC MEMS DEVICE COMPRISING A BURIED CHAMBER AND MANUFACTURING PROCESS THEREOF | HYUN, PAUL SANG HWA | 1796 | Non-Final OA | Sep 19, 2022 |
| 17941886 | SEMICONDUCTOR PACKAGE OR DEVICE WITH SEALING LAYER | HANUMASAGAR, SHAMITA S | 2814 | Non-Final OA | Sep 09, 2022 |
| 17823650 | METHOD OF MANUFACTURING LEADFRAMES FOR SEMICONDUCTOR DEVICES, CORRESPONDING LEADFRAME AND SEMICONDUCTOR DEVICE | JANG, BO BIN | 2818 | Non-Final OA | Aug 31, 2022 |
| 17864217 | APPARATUS AND METHOD OF LASER SCANNING | XIAO, YUQING | 3645 | Final Rejection | Jul 13, 2022 |
| 17847824 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES TO INCLUDE LASER DIRECT STRUCTURED (LDS) ELECTRICALLY CONDUCTIVE LEADS | CHEN, DAVID Z | 2815 | Non-Final OA | Jun 23, 2022 |
| 17847679 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jun 23, 2022 |
| 17750954 | METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHOD FOR ELECTRICALLY TESTING THE INTEGRATED CIRCUIT | ANDREWS, FELIX BRYAN | 2812 | Non-Final OA | May 23, 2022 |
| 17744062 | METHOD FOR OPTIMIZING EXECUTION TIME OF AN ARTIFICIAL NEURAL NETWORK | TSAI, JAMES T | 2147 | Non-Final OA | May 13, 2022 |
| 17741310 | 4H-SIC MOSFET DEVICE AND MANUFACTURING METHOD THEREOF | NARAGHI, ALI | 2817 | Non-Final OA | May 10, 2022 |
| 17592322 | VERTICAL CONDUCTION ELECTRONIC DEVICE COMPRISING A JBS DIODE AND MANUFACTURING PROCESS THEREOF | CHEN, JACK S J | 2893 | Non-Final OA | Feb 03, 2022 |
| 17156158 | APPARATUS FOR OPERATING A NEURAL NETWORK, CORRESPONDING METHOD AND COMPUTER PROGRAM PRODUCT | SECK, ABABACAR | 2147 | Non-Final OA | Jan 22, 2021 |
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