Prosecution Insights
Prosecution Insights
32 pending office actions • 1 client • 31 examiners • 28 art units • 26 of 32 (81%) have an AI response strategy ready • 110 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 32 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 32 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 14 (44%) |
| §102 only | 2 (6%) |
| Double-patenting + other | 1 (3%) |
| Multi-statute (no §101) | 14 (44%) |
| No statute on record | 1 (3%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SRINIVASAN, SESHA SAIRAMAN | 2 | 70.0% | +50.0% |
| TADESE, BERHANU | 1 | 88.7% | +6.2% |
| HAMADYK, ANNA N | 1 | 85.4% | +9.5% |
| ABUELHAWA, MOHAMMED YOUSEF | 1 | 81.4% | +20.7% |
| DINH, TUAN T | 1 | 78.8% | +22.9% |
| ALAM, FAYYAZ | 1 | 83.3% | +11.2% |
| DULANEY, KATHLEEN YUAN | 1 | 77.1% | +23.7% |
| PASIA, REDENTOR M | 1 | 79.4% | +23.3% |
| NOH, JAE NAM | 1 | 85.8% | -9.8% |
| CHOUDHRY, SAMINA F | 1 | 83.3% | +16.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18391757 | AUTOMATIC ISOCHRONOUS ADAPTION LAYER MODE SWITCHING | ALAM, FAYYAZ | 13d |
| 18548914 | METHODS AND DEVICES OF DATA BLOCK ALLOCATION FOR REDUCED POWER CONSUMPTION IN POWER AMPLIFIERS | CHOUDHRY, SAMINA F | 16d |
| 18552928 | LONG RANGE COHERENT LIDAR | NOH, JAE NAM | 46d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17975653 | AERIAL VEHICLE, DEVICE TO DETERMINE A TARGET LOCATION, STATIC BASE STATION DEVICE AND DOCKING STATION FOR A VEHICLE | SANTOS, AARRON EDUARDO | 103d overdue |
| 18056267 | PRINTED CIRCUIT BOARDS INCLUDING STRUCTURES FOR SUPPRESSING RADIATION | ROBINSON, KRYSTAL | 30d overdue |
| 17847309 | CONTINUOUS SAFETY ADAPTION FOR VEHICLE HAZARD AND RISK ANALYSIS COMPLIANCE | HOLMAN, JOHN D | 17d overdue |
| 17841706 | VIRTUAL TOWING DEVICE, SYSTEM, AND METHOD | BRADY III, PATRICK MICHAEL | 17d overdue |
| 17985949 | DEVICES AND METHODS FOR ENHANCED TIME SYNCHRONIZATION | HSU, BAILOR CHIA-JONG | 9d overdue |
| 17975662 | ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FORMING THEREOF | LOPEZ, JORGE ANDRES | 4d overdue |
| 17975654 | LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS | SRINIVASAN, SESHA SAIRAMAN | 2d overdue |
| 17522933 | LIGHT DETECTION AND RANGING SYSTEM | CHIEM, DINH D | 20d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17975654 | LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS | SRINIVASAN, SESHA SAIRAMAN | 2d overdue |
| 18391757 | AUTOMATIC ISOCHRONOUS ADAPTION LAYER MODE SWITCHING | ALAM, FAYYAZ | 13d |
| 18556373 | COMMUNICATION DEVICE AND METHOD FOR PERFORMING COMMUNICATION SIGNAL PROCESSING | PASIA, REDENTOR M | 15d |
| 18548914 | METHODS AND DEVICES OF DATA BLOCK ALLOCATION FOR REDUCED POWER CONSUMPTION IN POWER AMPLIFIERS | CHOUDHRY, SAMINA F | 16d |
| 18956024 | CONTROL DEVICE AND METHOD FOR CONTROLLING A ROBOTIC DEVICE FOR PACKING AND/OR UNPACKING A STORAGE BOX | ABUELHAWA, MOHAMMED YOUSEF | 22d |
| 18050527 | PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY | SRINIVASAN, SESHA SAIRAMAN | 22d |
| 18679472 | SPACE-SAVING BACKPLATE ASSEMBLY FOR A COMPRESSION ATTACHED MEMORY MODULE | DINH, TUAN T | 34d |
| 18534766 | SAFETY MONITOR FOR THE INTEGRITY OF AN INSTRUMENT CLUSTER IN A VEHICLE | DULANEY, KATHLEEN YUAN | 42d |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 32 |
| Art Unit | Apps |
|---|---|
| 2845 | 3 |
| 2812 | 2 |
| 2632 | 1 |
| 3656 | 1 |
| 2848 | 1 |
| 2646 | 1 |
| 2666 | 1 |
| 2413 | 1 |
| 2481 | 1 |
| 2462 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18986757 | COMMUNICATION DEVICE | Intel Corporation | TADESE, BERHANU | 2632 | §103§112 | Non-Final OA | 33d | Pending | Dec 19, 2024 |
| 18875174 | CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION | Intel Corporation | HAMADYK, ANNA N | 2845 | §102§103§112 | Non-Final OA | 26d | Pending | Dec 16, 2024 |
| 18956024 | CONTROL DEVICE AND METHOD FOR CONTROLLING A ROBOTIC DEVICE FOR PACKING AND/OR UNPACKING A STORAGE BOX | Intel Corporation | ABUELHAWA, MOHAMMED YOUSEF | 3656 | §102§103 | Non-Final OA | 22d | AI Ready | Nov 22, 2024 |
| 18679472 | SPACE-SAVING BACKPLATE ASSEMBLY FOR A COMPRESSION ATTACHED MEMORY MODULE | Intel Corporation | DINH, TUAN T | 2848 | §103 | Non-Final OA | 34d | AI Ready | May 31, 2024 |
| 18391757 | AUTOMATIC ISOCHRONOUS ADAPTION LAYER MODE SWITCHING | Intel Corporation | ALAM, FAYYAZ | 2646 | §103 | Non-Final OA | 13d | AI Ready | Dec 21, 2023 |
| 18534766 | SAFETY MONITOR FOR THE INTEGRITY OF AN INSTRUMENT CLUSTER IN A VEHICLE | Intel Corporation | DULANEY, KATHLEEN YUAN | 2666 | §103§112 | Final Rejection | 42d | AI Ready | Dec 11, 2023 |
| 18556373 | COMMUNICATION DEVICE AND METHOD FOR PERFORMING COMMUNICATION SIGNAL PROCESSING | Intel Corporation | PASIA, REDENTOR M | 2413 | §103 | Non-Final OA | 15d | AI Ready | Oct 20, 2023 |
| 18552928 | LONG RANGE COHERENT LIDAR | Intel Corporation | NOH, JAE NAM | 2481 | §103 | Non-Final OA | 46d | Pending | Sep 28, 2023 |
| 18548914 | METHODS AND DEVICES OF DATA BLOCK ALLOCATION FOR REDUCED POWER CONSUMPTION IN POWER AMPLIFIERS | Intel Corporation | CHOUDHRY, SAMINA F | 2462 | §103 | Non-Final OA | 16d | AI Ready | Sep 04, 2023 |
| 18147736 | FREQUENCY OFFSET DETERMINATION FOR RADIO DEVICES | Intel Corporation | PUENTE, EVA YI ZHENG | §102 | Non-Final OA | 3d overdue | AI Ready | Dec 29, 2022 | |
| 18063091 | MOBILE RADIO TERMINAL DEVICE, COMMUNICATION DEVICE FOR CONFIGURING A MOBILE RADIO TERMINAL DEVICE, AND METHODS FOR CONFIGURING A MOBILE RADIO TERMINAL DEVICE | Intel Corporation | KURIAN, ANDREW SHAJI | 2464 | §103 | Non-Final OA | 175d overdue | AI Ready | Dec 08, 2022 |
| 18060578 | DRY METHOD FOR METAL-DEFINED PAD FORMATION | Intel Corporation | SAMUELS, LAWRENCE H | 3761 | §102§103 | Non-Final OA | 72d | Pending | Dec 01, 2022 |
| 18060596 | THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING | Intel Corporation | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | 28d overdue | AI Ready | Dec 01, 2022 |
| 18056267 | PRINTED CIRCUIT BOARDS INCLUDING STRUCTURES FOR SUPPRESSING RADIATION | Intel Corporation | ROBINSON, KRYSTAL | 2847 | §102§103§112 | Non-Final OA | 30d overdue | AI Ready | Nov 17, 2022 |
| 17985949 | DEVICES AND METHODS FOR ENHANCED TIME SYNCHRONIZATION | Intel Corporation | HSU, BAILOR CHIA-JONG | 2461 | §103§112 | Non-Final OA | 9d overdue | AI Ready | Nov 14, 2022 |
| 17975654 | LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2817 | §102§103 | Non-Final OA | 2d overdue | AI Ready | Oct 28, 2022 |
| 18050527 | PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Non-Final OA | 22d | AI Ready | Oct 28, 2022 |
| 17975653 | AERIAL VEHICLE, DEVICE TO DETERMINE A TARGET LOCATION, STATIC BASE STATION DEVICE AND DOCKING STATION FOR A VEHICLE | Intel Corporation | SANTOS, AARRON EDUARDO | 3663 | §103§112 | Non-Final OA | 103d overdue | AI Ready | Oct 28, 2022 |
| 17975662 | ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FORMING THEREOF | Intel Corporation | LOPEZ, JORGE ANDRES | 2897 | §102§103 | Non-Final OA | 4d overdue | AI Ready | Oct 28, 2022 |
| 17968830 | ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE | Intel Corporation | SQUIRES, BRETT STEPHEN | 2899 | §103 | Final Rejection | 43d | AI Ready | Oct 19, 2022 |
| 17955551 | PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION | Intel Corporation | DEWITT, JORDAN EDWARD | 2845 | §103 | Non-Final OA | 35d | Pending | Sep 29, 2022 |
| 17895112 | SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION | Intel Corporation | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 23d | AI Ready | Aug 25, 2022 |
| 17895107 | ADAPTIVE TRACE WIDTH IN MULTI-LAYER SUBSTRATE PACKAGE | Intel Corporation | OCHOA, JUAN CARLOS | 2186 | — | Non-Final OA | 90d | Pending | Aug 25, 2022 |
| 17895102 | ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING THEREOF | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 10d overdue | AI Ready | Aug 25, 2022 |
| 17883718 | METHODS AND TOOLS FOR PREVENTING THE COUNTERFEITING AND TAMPERING OF SEMICONDUCTOR DEVICES | Intel Corporation | SWEARINGEN, JEFFREY R | 2445 | §102 | Non-Final OA | 7d | AI Ready | Aug 09, 2022 |
| 17847309 | CONTINUOUS SAFETY ADAPTION FOR VEHICLE HAZARD AND RISK ANALYSIS COMPLIANCE | Intel Corporation | HOLMAN, JOHN D | 3667 | §102§103 | Final Rejection | 17d overdue | AI Ready | Jun 23, 2022 |
| 17841706 | VIRTUAL TOWING DEVICE, SYSTEM, AND METHOD | Intel Corporation | BRADY III, PATRICK MICHAEL | 3665 | §103§112 | Final Rejection | 17d overdue | AI Ready | Jun 16, 2022 |
| 17709493 | SAFETY AND INTEGRITY VIOLATION DETECTION SYSTEM, DEVICE, AND METHOD | Intel Corporation | LU, HUA | 2118 | §103 | Non-Final OA | 188d overdue | AI Ready | Mar 31, 2022 |
| 17698024 | METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE | Intel Corporation | TRAN, BINH X | 1713 | §103§112DP | Final Rejection | 97d overdue | AI Ready | Mar 18, 2022 |
| 17555559 | METHODS AND DEVICES FOR A SEMANTIC COMMUNICATION FRAMEWORK | Intel Corporation | GRADINARIU, LUCIA GHEORGHE | 2478 | §102§103 | Non-Final OA | 22d | AI Ready | Dec 20, 2021 |
| 17522933 | LIGHT DETECTION AND RANGING SYSTEM | Intel Corporation | CHIEM, DINH D | 2874 | §102§103 | Final Rejection | 20d | AI Ready | Nov 10, 2021 |
| 17356546 | ANTENNA ARRAY AND METHODS THEREOF | Intel Corporation | SINGH, GURBIR | 2845 | §103 | Final Rejection | 79d overdue | AI Ready | Jun 24, 2021 |
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