68 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18816079 | DIVIDING METHOD | DONG, LIANG | 3724 | Non-Final OA | Aug 27, 2024 |
| 18753576 | POLISHING METHOD FOR GALLIUM NITRIDE WAFER | GOLIK, ARTHUR PAUL | 3745 | Non-Final OA | Jun 25, 2024 |
| 18742118 | COOLING MECHANISM | NIEVES, NELSON J | 3763 | Non-Final OA | Jun 13, 2024 |
| 18678755 | CHIP MANUFACTURING METHOD | NGUYEN, PHONG H | 3724 | Final Rejection | May 30, 2024 |
| 18439028 | PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WORKPIECE | LAOBAK, ANDREW KEELAN | 1713 | Non-Final OA | Feb 12, 2024 |
| 18429574 | ADHESIVE AND ADHERING METHOD | PATWARDHAN, ABHISHEK A | 1746 | Final Rejection | Feb 01, 2024 |
| 18391950 | GRINDING APPARATUS AND GRINDING METHOD | ZAMORA ALVAREZ, ERIC J | 3745 | Non-Final OA | Dec 21, 2023 |
| 18544868 | CUTTING BLADE | KEENA, ELLA LORRAINE | 3724 | Final Rejection | Dec 19, 2023 |
| 18543090 | WORKPIECE GRINDING METHOD | NGUYEN, DUSTIN T | 3745 | Non-Final OA | Dec 18, 2023 |
| 18543119 | OPTICAL PART ASSEMBLY | CHERRY, EUNCHA P | 2872 | Non-Final OA | Dec 18, 2023 |
| 18517530 | CHUCK TABLE | POON, DANA LEE | 3723 | Non-Final OA | Nov 22, 2023 |
| 18515846 | DRESSING MEMBER | DAVIS, JASON GREGORY | 3745 | Non-Final OA | Nov 21, 2023 |
| 18513969 | WAFER PROCESSING APPARATUS | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Nov 20, 2023 |
| 18513908 | RESIN MEMBER AND DIVIDING APPARATUS | KIM, YUNJU | 1742 | Final Rejection | Nov 20, 2023 |
| 18493128 | HOLDING JIG, MANUFACTURING METHOD OF HOLDING JIG, AND GRINDING METHOD OF WORKPIECE | SEABE, JUSTIN D | 3745 | Non-Final OA | Oct 24, 2023 |
| 18493149 | PROCESSING APPARATUS | SEABE, JUSTIN D | 3745 | Non-Final OA | Oct 24, 2023 |
| 18492220 | MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE | MARIN, JACOB RAUL | 2818 | Non-Final OA | Oct 23, 2023 |
| 18479948 | METHOD OF PROCESSING WAFER | SCHALLER, CYNTHIA L | 1746 | Non-Final OA | Oct 03, 2023 |
| 18467860 | MANUFACTURING METHOD OF CHIPS | GOODLING, DEVIN KIRK | 2898 | Non-Final OA | Sep 15, 2023 |
| 18461077 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | CASE, SARAH CATHERINE | 1731 | Non-Final OA | Sep 05, 2023 |
| 18461214 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | OLADAPO, TAIWO | 1771 | Final Rejection | Sep 05, 2023 |
| 18457528 | PROCESSING METHOD OF WAFER | CHIU, TSZ K | 2898 | Non-Final OA | Aug 29, 2023 |
| 18457577 | METHOD OF MANUFACTURING LAMINATED DEVICE CHIPS | DULKA, JOHN P | 2817 | Final Rejection | Aug 29, 2023 |
| 18453451 | MOUNTING METHOD AND CUTTING APPARATUS | COZART, JERMIE E | 3799 | Non-Final OA | Aug 22, 2023 |
| 18452756 | LASER PROCESSING MACHINE | WALTHOUR, SCOTT J | 3741 | Non-Final OA | Aug 21, 2023 |
| 18446658 | GRINDSTONE | HAWKINS, JASON KHALIL | 3723 | Final Rejection | Aug 09, 2023 |
| 18366182 | CUTTING APPARATUS | DONG, LIANG | 3724 | Non-Final OA | Aug 07, 2023 |
| 18363939 | WORKPIECE PROCESSING METHOD | CHANG, SUKWOO JAMES | 3723 | Non-Final OA | Aug 02, 2023 |
| 18362442 | POLISHING PAD | HAWKINS, JASON KHALIL | 3723 | Final Rejection | Jul 31, 2023 |
| 18359083 | WORKPIECE GRINDING METHOD | SHUM, KENT N | 3723 | Final Rejection | Jul 26, 2023 |
| 18351679 | CUTTING BLADE STOCK APPARATUS | YOO, JUN S | 3726 | Non-Final OA | Jul 13, 2023 |
| 18348533 | METHOD AND APPARATUS FOR PROCESSING A SINGLE CRYSTAL BLANK | SONG, MATTHEW J | 1714 | Final Rejection | Jul 07, 2023 |
| 18345120 | CLEANING TOOL AND WORKPIECE PROCESSING METHOD | COOK, KYLE A | 3726 | Non-Final OA | Jun 30, 2023 |
| 18342031 | DEVICE WAFER PROCESSING METHOD AND PROCESSING APPARATUS | OZDEN, ILKER NMN | 2812 | Non-Final OA | Jun 27, 2023 |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | PETERSON, ERIK T | 2898 | Non-Final OA | Jun 05, 2023 |
| 18328310 | METHOD OF HANDLING WAFER | PETERSON, ERIK T | 2898 | Non-Final OA | Jun 02, 2023 |
| 18325337 | WORKPIECE GRINDING METHOD | SHUM, KENT N | 3723 | Final Rejection | May 30, 2023 |
| 18325480 | MANUFACTURING METHOD OF WAFER | WIBLIN, MATTHEW | 3745 | Non-Final OA | May 30, 2023 |
| 18324274 | DEBURRING UNIT AND CUTTING MACHINE | MARKMAN, MAKENA | 3723 | Non-Final OA | May 26, 2023 |
| 18324262 | WAFER PROCESSING METHOD AND WAFER PROCESSING SYSTEM | JEFFERSON, QUOVAUNDA | 2899 | Final Rejection | May 26, 2023 |
| 18323574 | METHOD OF MANUFACTURING MONOCRYSTALLINE SILICON SUBSTRATE | MARIEN, ANDREW JAMES | 3745 | Non-Final OA | May 25, 2023 |
| 18321411 | MANUFACTURING METHOD OF CHIPS | PETERSON, ERIK T | 2898 | Non-Final OA | May 22, 2023 |
| 18321457 | LASER PROCESSING APPARATUS | FISHER, WESLEY LE | 3745 | Non-Final OA | May 22, 2023 |
| 18319801 | EXPANDING MACHINE AND EXPANDING METHOD | AHMADI, MOHSEN | 2896 | Non-Final OA | May 18, 2023 |
| 18319607 | PEELING APPARATUS | SMITH JR., JIMMY R | 1745 | Final Rejection | May 18, 2023 |
| 18304676 | MANUFACTURING METHOD OF SUBSTRATE | CHRISTENSEN, DANIELLE M | 3745 | Non-Final OA | Apr 21, 2023 |
| 18194785 | SPINDLE UNIT | HOLIZNA, CALEB ANDREW | 3723 | Non-Final OA | Apr 03, 2023 |
| 18194777 | LASER BEAM IRRADIATION APPARATUS | CLARK, RYAN C | 3745 | Non-Final OA | Apr 03, 2023 |
| 18193783 | PROCESSING APPARATUS | CLARK, RYAN C | 3745 | Non-Final OA | Mar 31, 2023 |
| 18186323 | GRINDING METHOD OF WAFER | SHUM, KENT N | 3723 | Non-Final OA | Mar 20, 2023 |
| 18168827 | WAFER PROCESSING METHOD | PETERSON, ERIK T | 2898 | Final Rejection | Feb 14, 2023 |
| 18162466 | LASER REFLOW METHOD | MALATEK, KATHERYN A | 3741 | Non-Final OA | Jan 31, 2023 |
| 18153402 | MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE | WOO, JONATHAN BRIAN | 1754 | Non-Final OA | Jan 12, 2023 |
| 18152865 | METHOD OF MANUFACTURING WAFER | REIDA, MOLLY KAY | 2899 | Final Rejection | Jan 11, 2023 |
| 18068661 | SURFACE PROCESSING MACHINE | EVANGELISTA, THEODORE JUSTINE | 3761 | Non-Final OA | Dec 20, 2022 |
| 18061556 | LASER PROCESSING APPARATUS | WUNDERLICH, ERWIN J | 3761 | Final Rejection | Dec 05, 2022 |
| 17936532 | GRINDING APPARATUS | SOTO, CHRISTOPHER ASHLEY | 3723 | Non-Final OA | Sep 29, 2022 |
| 17934024 | CLEANING ASSEMBLY | HENSON, KATINA N | 3723 | Non-Final OA | Sep 21, 2022 |
| 17931952 | PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE | LIU, CHRIS Q | 3761 | Non-Final OA | Sep 14, 2022 |
| 17820836 | GRINDING APPARATUS | MCCONNELL, AARON R | 3723 | Final Rejection | Aug 18, 2022 |
| 17806832 | MANUFACTURING METHOD FOR DEVICE CHIP | NIX, NORA TAYLOR | 2891 | Non-Final OA | Jun 14, 2022 |
| 17660667 | PROCESSING APPARATUS | SHUM, KENT N | 3723 | Final Rejection | Apr 26, 2022 |
| 17658132 | GRINDING METHOD | SHUM, KENT N | 3723 | Non-Final OA | Apr 06, 2022 |
| 17658031 | CUTTING METHOD OF WAFER | SRINIVASAN, SESHA SAIRAMAN | 2812 | Non-Final OA | Apr 05, 2022 |
| 17652537 | GRINDING APPARATUS | SHUM, KENT N | 3723 | Final Rejection | Feb 25, 2022 |
| 17457706 | WAFER MANUFACTURING APPARATUS | HOLIZNA, CALEB ANDREW | 3723 | Final Rejection | Dec 06, 2021 |
| 17443692 | Si SUBSTRATE MANUFACTURING METHOD | RILEY, JONATHAN G | 3724 | Non-Final OA | Jul 27, 2021 |
| 17380635 | Laser Processing Apparatus | EVANGELISTA, THEODORE JUSTINE | 3761 | Non-Final OA | Jul 20, 2021 |
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