Prosecution Insights
Prosecution Insights
Technology areas: Semiconductors, Circuits & Optics • Medical Devices & Mechanical Engineering
81 pending office actions • 23 art units • 66 examiners • 0 of 81 (0%) have an AI response strategy ready • 124 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 25 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 25 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 40 (49%) |
| §102 only | 6 (7%) |
| §112 only | 2 (2%) |
| Multi-statute (no §101) | 33 (41%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SHUM, KENT N | 4 | 37.7% | +50.3% |
| PETERSON, ERIK T | 4 | 76.5% | +11.0% |
| MARKMAN, MAKENA | 3 | 59.8% | +38.6% |
| NEIBAUR, ROBERT F | 3 | 76.8% | +31.6% |
| ECKARDT, ADAM MICHAEL | 3 | 65.3% | +40.6% |
| DONG, LIANG | 2 | 53.2% | +32.9% |
| NGUYEN, DUSTIN T | 2 | 72.5% | +17.5% |
| WIBLIN, MATTHEW | 2 | 74.7% | +23.4% |
| HANSEN, JONATHAN M | 1 | 79.4% | +11.4% |
| BERGNER, ERIN FLANAGAN | 1 | 76.5% | +30.6% |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17658031 | CUTTING METHOD OF WAFER | SRINIVASAN, SESHA SAIRAMAN | 49d overdue |
| 18345120 | CLEANING TOOL AND WORKPIECE PROCESSING METHOD | COOK, KYLE A | 24d overdue |
| 18461077 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | CASE, SARAH CATHERINE | 16d overdue |
| 18452756 | LASER PROCESSING MACHINE | WALTHOUR, SCOTT J | 15d overdue |
| 18325480 | MANUFACTURING METHOD OF WAFER | WIBLIN, MATTHEW | 7d |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | PETERSON, ERIK T | 8d |
| 18165058 | SURFACE IRREGULARITY REDUCING METHOD AND SURFACE IRREGULARITY REDUCING APPARATUS | DION, MARCEL T | 39d |
| 17823754 | ROBOT HAND | WILKINSON, RALPH DAVID | 72d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18186323 | GRINDING METHOD OF WAFER | SHUM, KENT N | 35d overdue |
| 18325480 | MANUFACTURING METHOD OF WAFER | WIBLIN, MATTHEW | 7d |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | PETERSON, ERIK T | 8d |
| 18543090 | WORKPIECE GRINDING METHOD | NGUYEN, DUSTIN T | 9d |
| 17652537 | GRINDING APPARATUS | SHUM, KENT N | 20d |
| 18366182 | CUTTING APPARATUS | DONG, LIANG | 26d |
| 18816079 | DIVIDING METHOD | DONG, LIANG | 27d |
| 18321411 | MANUFACTURING METHOD OF CHIPS | PETERSON, ERIK T | 28d |
| Art Unit | Apps |
|---|---|
| 3723 | 10 |
| 3745 | 9 |
| 2898 | 7 |
| 3724 | 4 |
| 1742 | 2 |
| 1746 | 2 |
| 3761 | 2 |
| 2811 | 1 |
| 1713 | 1 |
| 2892 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19175185 | SHEET FIXING APPARATUS AND METHOD OF MANUFACTURING COMBINATION OF WORKPIECE AND SHEET FIXED THERETO | HANSEN, JONATHAN M | — | §103 | Non-Final OA | — | Pending | Apr 10, 2025 |
| 19093830 | PROTECTIVE LAYER FORMING METHOD AND WORKPIECE PROCESSING METHOD | BERGNER, ERIN FLANAGAN | — | §102§103 | Non-Final OA | — | Pending | Mar 28, 2025 |
| 19051429 | CLEANING APPARATUS AND CLEANING METHOD | ORTA, LAUREN GRACE | — | §102 | Non-Final OA | — | Pending | Feb 12, 2025 |
| 18987473 | WORKPIECE PROCESSING METHOD | MARKMAN, MAKENA | — | §103§112 | Non-Final OA | — | Pending | Dec 19, 2024 |
| 18968045 | SEPARATION START POINT FORMING METHOD AND SEPARATION METHOD | DANIELS, MATTHEW J | 1742 | §103 | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18894292 | METHOD OF PROCESSING WORKPIECE | CRANDALL, JOEL DILLON | — | §102 | Non-Final OA | — | Pending | Sep 24, 2024 |
| 18894401 | WORKPIECE PROCESSING METHOD | ESKRIDGE, CORY W | — | §102 | Non-Final OA | — | Pending | Sep 24, 2024 |
| 18890092 | POLISHING APPARATUS AND POLISHING METHOD | MARKMAN, MAKENA | — | §102§112 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18823105 | PROCESSING METHOD | NEIBAUR, ROBERT F | — | §102 | Non-Final OA | — | Pending | Sep 03, 2024 |
| 18820928 | DEVICE CHIP MANUFACTURING METHOD | DYKES, LAURA M | — | §103§112 | Non-Final OA | — | Pending | Aug 30, 2024 |
| 18820758 | METHOD OF MANUFACTURING WAFER | NEIBAUR, ROBERT F | — | §103 | Non-Final OA | — | Pending | Aug 30, 2024 |
| 18816079 | DIVIDING METHOD | DONG, LIANG | 3724 | §103 | Final Rejection | 27d | Pending | Aug 27, 2024 |
| 18812168 | METHOD OF MANUFACTURING WAFER | DAS, PINAKI | — | §103 | Non-Final OA | — | Pending | Aug 22, 2024 |
| 18809484 | BREAKING METHOD | TRAN, BENJAMIN HOANG | — | §103 | Non-Final OA | — | Pending | Aug 20, 2024 |
| 18794112 | METHOD OF PROCESSING CARBON-CONTAINED MONOCRYSTALLINE SUBSTRATE | QI, HUA | — | §102§103 | Non-Final OA | — | Pending | Aug 05, 2024 |
| 18787386 | METHOD OF GRINDING WAFER | DO, NHAT CHIEU Q | — | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18784200 | PROCESSING METHOD FOR WORKPIECE | FULL, SIDNEY DANIELLE | — | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782393 | PROCESSING METHOD OF BONDED WAFER | GUMP, MICHAEL ANTHONY | — | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18765518 | METHOD OF PROCESSING WORKPIECE | KNUDSON, BRAD ALLAN | 3724 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18761626 | GRINDING METHOD OF WAFER | ISHAQ, ISHAQ MOHAMED SAID | — | §103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18753610 | PROCESSING METHOD OF WAFER | OMGBA, ESSAMA | — | §103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18750001 | WAFER GRINDING METHOD | REITZ, MICHAEL K. | 3745 | §103§112 | Final Rejection | — | Pending | Jun 21, 2024 |
| 18742173 | WAFER PROCESSING METHOD | BRECHT, CHARLES MATTHEW | — | §102§103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18679889 | CHUCK TABLE AND EDGE TRIMMING APPARATUS | SAENZ, ALBERTO | — | §103§112 | Non-Final OA | — | Pending | May 31, 2024 |
| 18664720 | WAFER PROCESSING METHOD | MANN, WILLIAM ROBERT | — | §103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18653031 | PROCESSING TOOL | NG, DIEGO JESUS | — | §103 | Non-Final OA | — | Pending | May 02, 2024 |
| 18625388 | PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE | ROSARIO-APONTE, ALBA T | — | §102§112 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18616457 | METHOD FOR MANUFACTURING CHIPS | MACEDA, KRYSTENE NHE BANDONG | — | §103 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18609620 | LASER PROCESSING APPARATUS | BELAY, DILNESSA B | — | §102§103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18581575 | PROCESSING METHOD OF WAFER | YUSHINA, GALINA G | 2811 | §103§112 | Final Rejection | — | Pending | Feb 20, 2024 |
| 18439028 | PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WORKPIECE | LAOBAK, ANDREW KEELAN | 1713 | §103 | Non-Final OA | 6d | Pending | Feb 12, 2024 |
| 18437847 | WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §102§103§112 | Final Rejection | — | Pending | Feb 09, 2024 |
| 18429574 | ADHESIVE AND ADHERING METHOD | PATWARDHAN, ABHISHEK A | 1746 | §103 | Non-Final OA | 28d | Pending | Feb 01, 2024 |
| 18413229 | LASER OSCILLATING DEVICE | NORTON, JOHN J | — | §102§103§112 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18543090 | WORKPIECE GRINDING METHOD | NGUYEN, DUSTIN T | 3745 | §103 | Non-Final OA | 9d | Pending | Dec 18, 2023 |
| 18539676 | GRINDING WHEEL AND GRINDING METHOD | NGUYEN, DUSTIN T | 3745 | §103 | Final Rejection | — | Pending | Dec 14, 2023 |
| 18539713 | LASER PROCESSING APPARATUS | ECKARDT, ADAM MICHAEL | — | §103§112 | Non-Final OA | — | Pending | Dec 14, 2023 |
| 18526079 | LASER PROCESSING APPARATUS | NGUYEN, PHUONG T | — | §103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18515846 | DRESSING MEMBER | DAVIS, JASON GREGORY | 3745 | §103 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18513908 | RESIN MEMBER AND DIVIDING APPARATUS | KIM, YUNJU | 1742 | §103 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18499723 | LASER PROCESSING APPARATUS AND PROCESSING METHOD | TRAN, THIEN S | — | §103 | Non-Final OA | — | Pending | Nov 01, 2023 |
| 18492240 | PROCESSING METHOD OF BONDED WAFER | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Final Rejection | — | Pending | Oct 23, 2023 |
| 18479948 | METHOD OF PROCESSING WAFER | PATEL, VISHAL I | 1746 | §103 | Non-Final OA | 36d overdue | Pending | Oct 03, 2023 |
| 18470857 | CUTTING APPARATUS AND CUTTING METHOD | RILEY, JONATHAN G | 3724 | §103§112 | Non-Final OA | — | Pending | Sep 20, 2023 |
| 18467860 | MANUFACTURING METHOD OF CHIPS | GOODLING, DEVIN KIRK | 2898 | §103 | Final Rejection | 19d overdue | Pending | Sep 15, 2023 |
| 18461077 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | CASE, SARAH CATHERINE | 1731 | §103§112 | Non-Final OA | 16d overdue | Pending | Sep 05, 2023 |
| 18461214 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | OLADAPO, TAIWO | 1771 | §103 | Non-Final OA | 26d | Pending | Sep 05, 2023 |
| 18452756 | LASER PROCESSING MACHINE | WALTHOUR, SCOTT J | 3741 | §102§112 | Final Rejection | 15d overdue | Pending | Aug 21, 2023 |
| 18451923 | DIVIDING METHOD OF WAFER | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Aug 18, 2023 |
| 18446658 | GRINDSTONE | HAWKINS, JASON KHALIL | 3723 | §103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18366182 | CUTTING APPARATUS | DONG, LIANG | 3724 | §103 | Final Rejection | 26d | Pending | Aug 07, 2023 |
| 18363939 | WORKPIECE PROCESSING METHOD | CHANG, SUKWOO JAMES | 3723 | §103§112 | Final Rejection | — | Pending | Aug 02, 2023 |
| 18359083 | WORKPIECE GRINDING METHOD | SHUM, KENT N | 3723 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18350164 | WORKPIECE GRINDING METHOD | SHUM, KENT N | 3723 | §103 | Non-Final OA | — | Pending | Jul 11, 2023 |
| 18348533 | METHOD AND APPARATUS FOR PROCESSING A SINGLE CRYSTAL BLANK | SONG, MATTHEW J | 1714 | §103 | Non-Final OA | 1d overdue | Pending | Jul 07, 2023 |
| 18347723 | LASER PROCESSING MACHINE | LESLIE, MICHAEL S | 3745 | §102§103 | Non-Final OA | — | Pending | Jul 06, 2023 |
| 18345120 | CLEANING TOOL AND WORKPIECE PROCESSING METHOD | COOK, KYLE A | 3726 | §103§112Other | Non-Final OA | 24d overdue | Pending | Jun 30, 2023 |
| 18342103 | MANUFACTURING METHOD OF SUBSTRATE | COLLINS, DANIEL S. | 3745 | §102 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18332920 | LASER PROCESSING APPARATUS | WIBLIN, MATTHEW | 3745 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2023 |
| 18331487 | PROCESSING APPARATUS AND PROCESSING METHOD | WALTERS, RYAN J | 3799 | §103§112 | Non-Final OA | — | Pending | Jun 08, 2023 |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | PETERSON, ERIK T | 2898 | §103§112 | Final Rejection | 8d | Pending | Jun 05, 2023 |
| 18325480 | MANUFACTURING METHOD OF WAFER | WIBLIN, MATTHEW | 3745 | §102§103§112 | Non-Final OA | 7d | Pending | May 30, 2023 |
| 18324274 | DEBURRING UNIT AND CUTTING MACHINE | MARKMAN, MAKENA | 3723 | §102§103 | Non-Final OA | 76d | Pending | May 26, 2023 |
| 18321411 | MANUFACTURING METHOD OF CHIPS | PETERSON, ERIK T | 2898 | §103 | Final Rejection | 28d | Pending | May 22, 2023 |
| 18304676 | MANUFACTURING METHOD OF SUBSTRATE | CHRISTENSEN, DANIELLE M | 3745 | §102 | Non-Final OA | 21d | Pending | Apr 21, 2023 |
| 18298749 | WAFER MANUFACTURING METHOD | ECKARDT, ADAM MICHAEL | 3761 | §112 | Final Rejection | — | Pending | Apr 11, 2023 |
| 18295926 | PROCESSING APPARATUS | NEIBAUR, ROBERT F | 3723 | §103 | Non-Final OA | 63d | Pending | Apr 05, 2023 |
| 18194785 | SPINDLE UNIT | HOLIZNA, CALEB ANDREW | 3723 | §103 | Final Rejection | 20d | Pending | Apr 03, 2023 |
| 18186339 | PROCESSING METHOD FOR WORKPIECE | HUNTER, JOHN S | 3761 | §103Other | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18186323 | GRINDING METHOD OF WAFER | SHUM, KENT N | 3723 | §103 | Non-Final OA | 35d overdue | Pending | Mar 20, 2023 |
| 18178794 | CHIP MANUFACTURING METHOD | PETERSON, ERIK T | 2898 | §103 | Non-Final OA | — | Pending | Mar 06, 2023 |
| 18168827 | WAFER PROCESSING METHOD | PETERSON, ERIK T | 2898 | §103 | Non-Final OA | — | Pending | Feb 14, 2023 |
| 18165058 | SURFACE IRREGULARITY REDUCING METHOD AND SURFACE IRREGULARITY REDUCING APPARATUS | DION, MARCEL T | 3723 | §102§103§112 | Final Rejection | 39d | Pending | Feb 06, 2023 |
| 18153402 | MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE | WOO, JONATHAN BRIAN | 1754 | §103 | Final Rejection | — | Pending | Jan 12, 2023 |
| 17936819 | TREATMENT APPARATUS FOR TREATING WORKPIECE | FORD, NATHAN K | 1716 | §103 | Non-Final OA | 79d overdue | Pending | Sep 29, 2022 |
| 17823754 | ROBOT HAND | WILKINSON, RALPH DAVID | 3654 | §103§112 | Non-Final OA | 72d | Pending | Aug 31, 2022 |
| 17809701 | METHOD OF PROCESSING WAFER | ADHIKARI DAWADI, BIPANA | 2898 | §103 | Non-Final OA | — | Pending | Jun 29, 2022 |
| 17806832 | MANUFACTURING METHOD FOR DEVICE CHIP | NIX, NORA TAYLOR | 2891 | §103 | Final Rejection | — | Pending | Jun 14, 2022 |
| 17663744 | LASER PROCESSING APPARATUS | ECKARDT, ADAM MICHAEL | 3700 | §103 | Final Rejection | — | Pending | May 17, 2022 |
| 17658031 | CUTTING METHOD OF WAFER | SRINIVASAN, SESHA SAIRAMAN | 2812 | §102§103 | Final Rejection | 49d overdue | Pending | Apr 05, 2022 |
| 17652537 | GRINDING APPARATUS | SHUM, KENT N | 3723 | §112 | Non-Final OA | 20d | Pending | Feb 25, 2022 |
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