15 pending office actions • 4 clients • 13 examiners • 13 art units • 7 of 15 (47%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 5 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 5 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 8 (53%) |
| §102 only | 2 (13%) |
| Multi-statute (no §101) | 5 (33%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ENAD, CHRISTINE A | 2 | 84.3% | +10.3% |
| WEGNER, AARON MICHAEL | 2 | 72.2% | -1.3% |
| CARLSON, MARC | 1 | 71.1% | +23.4% |
| LONG, ROBERT FRANKLIN | 1 | 72.2% | +20.6% |
| HUANG, STEVEN | 1 | 47.1% | +35.3% |
| SLAUGHTER, ETHAN JAKOB | 1 | — | — |
| PATEL, REEMA | 1 | 88.7% | +6.5% |
| GREEN, TELLY D | 1 | 81.9% | +3.9% |
| TRICE III, WILLIAM CLARENCE | 1 | 79.6% | +31.8% |
| MUNOZ, ANDRES F | 1 | 76.4% | +18.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | ENAD, CHRISTINE A | 6d |
| 18090056 | ETCH STOP FOR OXIDE SEMICONDUCTOR DEVICES | GREEN, TELLY D | — |
| 17943443 | GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT | ENAD, CHRISTINE A | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | BEARDSLEY, JONAS TYLER | 6d |
| 18432487 | DEPTH SETTER TOOL | LONG, ROBERT FRANKLIN | — |
| 18556030 | LIDAR SYSTEM WITH SUPRESSED DOPPLER FREQUENCY SHIFT | SLAUGHTER, ETHAN JAKOB | — |
| 18125456 | CONTACT EXTENDED OVER AN ADJACENT SOURCE OR DRAIN REGION | PATEL, REEMA | — |
| 17556520 | CONDUCTIVE FEATURES FORMED USING METAL ASSISTED ETCH | WEGNER, AARON MICHAEL | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | TRICE III, WILLIAM CLARENCE | 3d overdue |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | ENAD, CHRISTINE A | 6d |
| 18627657 | COMPACTING WASTE RECEPTACLE FOR VACUUM CLEANER | CARLSON, MARC | — |
| 18432487 | DEPTH SETTER TOOL | LONG, ROBERT FRANKLIN | — |
| 18533996 | VACUUM CLEANER | HUANG, STEVEN | — |
| 17943443 | GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT | ENAD, CHRISTINE A | — |
| 17847559 | GATE ALL AROUND TRANSISTORS ON ALTERNATE SUBSTRATE ORIENTATION | MUNOZ, ANDRES F | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 11 |
| Origyn LLC | 2 |
| Phillips Screw Company | 1 |
| Ommatidia Lidar S.L. | 1 |
| Art Unit | Apps |
|---|---|
| 2811 | 3 |
| 3763 | 1 |
| 3731 | 1 |
| 3723 | 1 |
| 3648 | 1 |
| 2812 | 1 |
| 2898 | 1 |
| 2893 | 1 |
| 2818 | 1 |
| 2892 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18627657 | COMPACTING WASTE RECEPTACLE FOR VACUUM CLEANER | Origyn LLC | CARLSON, MARC | 3763 | §103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18432487 | DEPTH SETTER TOOL | Phillips Screw Company | LONG, ROBERT FRANKLIN | 3731 | §102§103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18533996 | VACUUM CLEANER | Origyn LLC | HUANG, STEVEN | 3723 | §103 | Final Rejection | — | Pending | Dec 08, 2023 |
| 18556030 | LIDAR SYSTEM WITH SUPRESSED DOPPLER FREQUENCY SHIFT | Ommatidia Lidar S.L. | SLAUGHTER, ETHAN JAKOB | 3648 | §103§112 | Non-Final OA | — | Pending | Oct 18, 2023 |
| 18125456 | CONTACT EXTENDED OVER AN ADJACENT SOURCE OR DRAIN REGION | Intel Corporation | PATEL, REEMA | 2812 | §102§103 | Non-Final OA | — | Pending | Mar 23, 2023 |
| 18090056 | ETCH STOP FOR OXIDE SEMICONDUCTOR DEVICES | Intel Corporation | GREEN, TELLY D | 2898 | §102 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | Intel Corporation | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Final Rejection | 3d overdue | AI Ready | Dec 08, 2022 |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | 6d | AI Ready | Sep 23, 2022 |
| 17943443 | GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | AI Ready | Sep 13, 2022 |
| 17847559 | GATE ALL AROUND TRANSISTORS ON ALTERNATE SUBSTRATE ORIENTATION | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103 | Final Rejection | — | AI Ready | Jun 23, 2022 |
| 17838646 | SOURCE AND DRAIN CONTACTS FORMED USING SACRIFICIAL REGIONS OF SOURCE AND DRAIN | Intel Corporation | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | — | Pending | Jun 13, 2022 |
| 17838637 | DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES | Intel Corporation | MENZ, LAURA MARY | 2813 | §102 | Non-Final OA | 90d | AI Ready | Jun 13, 2022 |
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | Intel Corporation | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | 6d | AI Ready | May 12, 2022 |
| 17556520 | CONDUCTIVE FEATURES FORMED USING METAL ASSISTED ETCH | Intel Corporation | WEGNER, AARON MICHAEL | 2800 | §103§112 | Final Rejection | — | Pending | Dec 20, 2021 |
| 17406480 | SELF-ALIGNED GATE CUT STRUCTURES | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103 | Final Rejection | 28d | AI Ready | Aug 19, 2021 |
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