Prosecution Insights
Prosecution Insights
23 pending office actions • 2 clients • 20 examiners • 12 art units • 21 of 23 (91%) have an AI response strategy ready • 51 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 23 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 23 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 7 (30%) |
| §102 only | 2 (9%) |
| §112 only | 1 (4%) |
| Double-patenting + other | 2 (9%) |
| Multi-statute (no §101) | 10 (43%) |
| No statute on record | 1 (4%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ENAD, CHRISTINE A | 3 | 84.2% | +10.2% |
| NGUYEN, DAO H | 2 | 91.3% | +5.6% |
| BAND, MICHAEL A | 1 | 44.8% | +55.4% |
| CARLSON, MARC | 1 | 70.7% | +23.7% |
| OH, JAEHWAN | 1 | 84.8% | +10.3% |
| LIU, BENJAMIN T | 1 | 74.4% | +12.8% |
| JOHNSON, CHRISTOPHER A | 1 | 83.9% | +8.4% |
| MEMULA, SURESH | 1 | 87.5% | -0.4% |
| TRICE III, WILLIAM CLARENCE | 1 | 80.0% | +32.0% |
| LEE, ALVIN LYNGHI | 1 | 89.0% | +8.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18087318 | ELONGATED CONTACT FOR SOURCE OR DRAIN REGION | OH, JAEHWAN | 2d overdue |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | ENAD, CHRISTINE A | 6d |
| 18080858 | MULTI-HEIGHT CELL LIBRARY DESIGN SOLUTION FOR INTEGRATED CIRCUITS | MEMULA, SURESH | 15d |
| 18083064 | DIELECTRIC LAYER STACK FOR WIDE GATE CUT STRUCTURES | JOHNSON, CHRISTOPHER A | 22d |
| 17957106 | ETCH STOP LAYER FOR METAL GATE CUT | ENAD, CHRISTINE A | 34d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17936952 | FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE | ENAD, CHRISTINE A | 120d overdue |
| 18399237 | SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS | BAND, MICHAEL A | 105d overdue |
| 17940195 | BARRIER LAYER FOR DIELECTRIC RECESS MITIGATION | GARCES, NELSON Y | 5d overdue |
| 17957821 | GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING | NGUYEN, DAO H | 4d overdue |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | TRICE III, WILLIAM CLARENCE | 3d overdue |
| 18084844 | DIELECTRIC BARRIER FOR BACKSIDE INTERCONNECT SEPARATION | LIU, BENJAMIN T | 1d overdue |
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | BEARDSLEY, JONAS TYLER | 6d |
| 17943819 | WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN | LEE, ALVIN LYNGHI | 12d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17936952 | FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE | ENAD, CHRISTINE A | 120d overdue |
| 18399237 | SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS | BAND, MICHAEL A | 105d overdue |
| 18485617 | VACUUM CLEANER WITH HAND NOZZLE | CARLSON, MARC | 30d overdue |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | TRICE III, WILLIAM CLARENCE | 3d overdue |
| 18087318 | ELONGATED CONTACT FOR SOURCE OR DRAIN REGION | OH, JAEHWAN | 2d overdue |
| 18084844 | DIELECTRIC BARRIER FOR BACKSIDE INTERCONNECT SEPARATION | LIU, BENJAMIN T | 1d overdue |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | ENAD, CHRISTINE A | 6d |
| 17957106 | ETCH STOP LAYER FOR METAL GATE CUT | ENAD, CHRISTINE A | 34d |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 22 |
| Origyn LLC | 1 |
| Art Unit | Apps |
|---|---|
| 2811 | 4 |
| 2813 | 4 |
| 2818 | 3 |
| 2899 | 2 |
| 2893 | 2 |
| 2814 | 2 |
| 1794 | 1 |
| 3723 | 1 |
| 2851 | 1 |
| 2898 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18399237 | SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS | Intel Corporation | BAND, MICHAEL A | 1794 | §102§103 | Final Rejection | 105d overdue | AI Ready | Dec 28, 2023 |
| 18485617 | VACUUM CLEANER WITH HAND NOZZLE | Origyn LLC | CARLSON, MARC | 3723 | §103 | Non-Final OA | 30d overdue | Pending | Oct 12, 2023 |
| 18125430 | SEMICONDUCTOR DEVICES BETWEEN GATE CUTS AND DEEP BACKSIDE VIAS | Intel Corporation | NGUYEN, DAO H | 2818 | §102§103 | Non-Final OA | 60d | Pending | Mar 23, 2023 |
| 18087318 | ELONGATED CONTACT FOR SOURCE OR DRAIN REGION | Intel Corporation | OH, JAEHWAN | 2899 | §102 | Non-Final OA | 2d overdue | AI Ready | Dec 22, 2022 |
| 18084844 | DIELECTRIC BARRIER FOR BACKSIDE INTERCONNECT SEPARATION | Intel Corporation | LIU, BENJAMIN T | 2893 | §102§103§112 | Non-Final OA | 1d overdue | AI Ready | Dec 20, 2022 |
| 18083064 | DIELECTRIC LAYER STACK FOR WIDE GATE CUT STRUCTURES | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | 22d | AI Ready | Dec 16, 2022 |
| 18080858 | MULTI-HEIGHT CELL LIBRARY DESIGN SOLUTION FOR INTEGRATED CIRCUITS | Intel Corporation | MEMULA, SURESH | 2851 | §103 | Non-Final OA | 15d | AI Ready | Dec 14, 2022 |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | Intel Corporation | TRICE III, WILLIAM CLARENCE | 2893 | §102§103 | Non-Final OA | 3d overdue | AI Ready | Dec 08, 2022 |
| 17957821 | GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING | Intel Corporation | NGUYEN, DAO H | 2818 | §102§103 | Non-Final OA | 4d overdue | AI Ready | Sep 30, 2022 |
| 17957106 | ETCH STOP LAYER FOR METAL GATE CUT | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | 34d | AI Ready | Sep 30, 2022 |
| 17936952 | FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE | Intel Corporation | ENAD, CHRISTINE A | 2811 | §102§103 | Non-Final OA | 120d overdue | AI Ready | Sep 30, 2022 |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 6d | AI Ready | Sep 23, 2022 |
| 17943819 | WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN | Intel Corporation | LEE, ALVIN LYNGHI | 2813 | §102§103§112 | Non-Final OA | 12d | AI Ready | Sep 13, 2022 |
| 17943840 | TRANSISTOR DEVICES WITH INTEGRATED DIODES | Intel Corporation | WEILAND, ADAM DAVID | 2813 | §102§103§112 | Non-Final OA | 12d | AI Ready | Sep 13, 2022 |
| 17943812 | DIODES WITH BACKSIDE CONTACT | Intel Corporation | AHMED, SHAHED | 2813 | §102 | Non-Final OA | 8d | AI Ready | Sep 13, 2022 |
| 17940195 | BARRIER LAYER FOR DIELECTRIC RECESS MITIGATION | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Final Rejection | 5d overdue | AI Ready | Sep 08, 2022 |
| 17838637 | DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES | Intel Corporation | MENZ, LAURA MARY | 2813 | — | Final Rejection | 90d | AI Ready | Jun 13, 2022 |
| 17831800 | REMOVAL OF UPPER CHANNEL BODIES IN STACKED GATE-ALL-AROUND (GAA) DEVICE STRUCTURES | Intel Corporation | VERDES, RICKY | 2898 | DPOther | Non-Final OA | 13d | AI Ready | Jun 03, 2022 |
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | Intel Corporation | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | 6d | AI Ready | May 12, 2022 |
| 17556737 | NON-REACTIVE EPI CONTACT FOR STACKED TRANSISTORS | Intel Corporation | RAMIREZ, ALEXANDRE XAVIER | 2812 | §103DP | Final Rejection | 117d overdue | AI Ready | Dec 20, 2021 |
| 17550861 | STACKED TRANSISTORS WITH REMOVED EPI BARRIER | Intel Corporation | XU, ZHIJUN | 2818 | §103 | Non-Final OA | 7d | AI Ready | Dec 14, 2021 |
| 17547980 | WRAP-AROUND CONTACT WITH REDUCED RESISTANCE | Intel Corporation | PIZARRO CRESPO, MARCOS D | 2814 | §112 | Final Rejection | 34d | AI Ready | Dec 10, 2021 |
| 17406480 | SELF-ALIGNED GATE CUT STRUCTURES | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103 | Final Rejection | 28d | AI Ready | Aug 19, 2021 |
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