38 pending office actions • 4 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Intel Corporation | 32 |
| Origyn LLC | 3 |
| Phillips Screw Company | 2 |
| Intel Corporation | 1 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 18627657 | COMPACTING WASTE RECEPTACLE FOR VACUUM CLEANER | Origyn LLC | MIOTTO, ENRICO | 3763 | Non-Final OA | Apr 05, 2024 |
| 18432487 | DEPTH SETTER TOOL | Phillips Screw Company | LONG, ROBERT FRANKLIN | 3731 | Non-Final OA | Feb 05, 2024 |
| 18399237 | SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS | Intel Corporation | BAND, MICHAEL A | 1794 | Final Rejection | Dec 28, 2023 |
| 18533996 | VACUUM CLEANER | Origyn LLC | HUANG, STEVEN | 3723 | Non-Final OA | Dec 08, 2023 |
| 18485617 | VACUUM CLEANER WITH HAND NOZZLE | Origyn LLC | CARLSON, MARC | 3723 | Non-Final OA | Oct 12, 2023 |
| 18473762 | TOOL AND FASTENER WITH OVERHANG STRUCTURES TO REDUCE STRIPPING | Phillips Screw Company | SAETHER, FLEMMING | 3675 | Non-Final OA | Sep 25, 2023 |
| 18087318 | ELONGATED CONTACT FOR SOURCE OR DRAIN REGION | Intel Corporation | OH, JAEHWAN | 2899 | Non-Final OA | Dec 22, 2022 |
| 18084844 | DIELECTRIC BARRIER FOR BACKSIDE INTERCONNECT SEPARATION | Intel Corporation | LIU, BENJAMIN T | 2893 | Non-Final OA | Dec 20, 2022 |
| 18082851 | EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT | Intel Corporation | CHUNG, ANDREW | 2898 | Non-Final OA | Dec 16, 2022 |
| 18083064 | DIELECTRIC LAYER STACK FOR WIDE GATE CUT STRUCTURES | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | Non-Final OA | Dec 16, 2022 |
| 18080858 | MULTI-HEIGHT CELL LIBRARY DESIGN SOLUTION FOR INTEGRATED CIRCUITS | Intel Corporation | MEMULA, SURESH | 2851 | Non-Final OA | Dec 14, 2022 |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | Intel Corporation | TRICE III, WILLIAM CLARENCE | 2893 | Non-Final OA | Dec 08, 2022 |
| 18074814 | GATE-ALL-AROUND DEVICES WITH DIFFERENT GATE OXIDE THICKNESSES | Intel Corporation | MALEK, MALIHEH | 2813 | Non-Final OA | Dec 05, 2022 |
| 17974945 | INTEGRATED RING STRUCTURES | Intel Corporation | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Oct 27, 2022 |
| 17957821 | GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING | Intel Corporation | NGUYEN, DAO H | 2818 | Non-Final OA | Sep 30, 2022 |
| 17936952 | FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE | Intel Corporation | ENAD, CHRISTINE A | 2811 | Non-Final OA | Sep 30, 2022 |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Intel Corporation | ENAD, CHRISTINE A | 2811 | Non-Final OA | Sep 23, 2022 |
| 17943840 | TRANSISTOR DEVICES WITH INTEGRATED DIODES | Intel Corporation | WEILAND, ADAM DAVID | 2813 | Non-Final OA | Sep 13, 2022 |
| 17943812 | DIODES WITH BACKSIDE CONTACT | Intel Corporation | AHMED, SHAHED | 2813 | Non-Final OA | Sep 13, 2022 |
| 17943557 | TRANSISTOR DEVICES WITH EXTENDED DRAIN | Intel Corporation | HATFIELD, MARSHALL MU-NUO | 2897 | Non-Final OA | Sep 13, 2022 |
| 17943443 | GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT | Intel Corporation | ENAD, CHRISTINE A | 2811 | Non-Final OA | Sep 13, 2022 |
| 17943819 | WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN | Intel Corporation | LEE, ALVIN LYNGHI | 2813 | Non-Final OA | Sep 13, 2022 |
| 17940195 | BARRIER LAYER FOR DIELECTRIC RECESS MITIGATION | Intel Corporation | GARCES, NELSON Y | 2814 | Final Rejection | Sep 08, 2022 |
| 17894380 | DOUBLE-DECKED INTERCONNECT FEATURES | Intel Corporation | YUSHINA, GALINA G | 2811 | Non-Final OA | Aug 24, 2022 |
| 17809329 | DIFFUSION CUT STRESSORS FOR STACKED TRANSISTORS | Intel Corporation | GREAVING, JASON JAMES | 2893 | Non-Final OA | Jun 28, 2022 |
| 17847559 | GATE ALL AROUND TRANSISTORS ON ALTERNATE SUBSTRATE ORIENTATION | Intel Corporation | MUNOZ, ANDRES F | 2818 | Non-Final OA | Jun 23, 2022 |
| 17838637 | DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES | Intel Corporation | MENZ, LAURA MARY | 2813 | Non-Final OA | Jun 13, 2022 |
| 17833050 | 3D SOURCE AND DRAIN CONTACTS TUNED FOR VERTICALLY STACKED PMOS AND NMOS | Intel Corporation | RAMIREZ, ALEXANDRE XAVIER | 2812 | Final Rejection | Jun 06, 2022 |
| 17831800 | REMOVAL OF UPPER CHANNEL BODIES IN STACKED GATE-ALL-AROUND (GAA) DEVICE STRUCTURES | Intel Corporation | VERDES, RICKY | 2898 | Non-Final OA | Jun 03, 2022 |
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | Intel Corporation | BEARDSLEY, JONAS TYLER | 2811 | Final Rejection | May 12, 2022 |
| 17654530 | DOPED METAL-INSULATOR-METAL (MIM) CAPACITOR OF A MEMORY ARRAY | Intel Corporation | BODNAR, JOHN A | 2893 | Final Rejection | Mar 11, 2022 |
| 17556422 | REPLACEMENT DEEP VIA AND BURIED OR BACKSIDE POWER RAIL WITH BACKSIDE INTERCONNECT STRUCTURE | Intel Corporation | SIPLING, KENNETH MARK | 2818 | Final Rejection | Dec 20, 2021 |
| 17556737 | NON-REACTIVE EPI CONTACT FOR STACKED TRANSISTORS | Intel Corporation | RAMIREZ, ALEXANDRE XAVIER | 2812 | Final Rejection | Dec 20, 2021 |
| 17554791 | STACKED TRANSISTOR STRUCTURES WITH DIVERSE GATE MATERIALS | Intel Corporation | LAWSON, SETH DOUGLAS FRIE | 2893 | Non-Final OA | Dec 17, 2021 |
| 17550861 | STACKED TRANSISTORS WITH REMOVED EPI BARRIER | Intel Corporation | XU, ZHIJUN | 2818 | Non-Final OA | Dec 14, 2021 |
| 17536725 | STRAINED SEMICONDUCTOR ON INSULATOR (SSOI) BASED GATE ALL AROUND (GAA) TRANSISTOR STRUCTURES | Intel Corporation | SIPLING, KENNETH MARK | 2818 | Final Rejection | Nov 29, 2021 |
| 17473427 | GATE-ALL-AROUND SEMICONDUCTOR DEVICES HAVING A FIRST SEMICONDUCTOR DEVICE WITH MORE SEMICONDUCTOR BODIES THAN A SECOND SEMICONDUCTOR DEVICE | Intel Corporation | MAI, ANH D | 2893 | Non-Final OA | Sep 13, 2021 |
| 17406480 | SELF-ALIGNED GATE CUT STRUCTURES | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | Final Rejection | Aug 19, 2021 |
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