38 pending office actions • 1 client
| Client (Assignee) | Pending OAs |
|---|---|
| Semiconductor Components Industries, LLC | 38 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | Semiconductor Components Industries, LLC | FAYE, MAMADOU | 2884 | Non-Final OA | Jul 09, 2024 |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | Semiconductor Components Industries, LLC | ASFAW, MESFIN T | 2882 | Non-Final OA | Jun 25, 2024 |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | Semiconductor Components Industries, LLC | PETERSON, ERIK T | 2898 | Non-Final OA | Feb 16, 2024 |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | Semiconductor Components Industries, LLC | ASSOUMAN, HERVE-LOUIS Y | 2812 | Non-Final OA | Dec 27, 2023 |
| 18543644 | WIRE BONDING USING A FLOATING PAD | Semiconductor Components Industries, LLC | WALL, VINCENT | 2898 | Non-Final OA | Dec 18, 2023 |
| 18538533 | OPTICAL SENSOR PACKAGE | Semiconductor Components Industries, LLC | BENTON, CHLOE ELAINE | 2899 | Non-Final OA | Dec 13, 2023 |
| 18532236 | CHARGE-TO-VOLTAGE CONVERSION CIRCUIT WITH INLINE AMPLIFICATION | Semiconductor Components Industries, LLC | TRAN, NHAN T | 2638 | Non-Final OA | Dec 07, 2023 |
| 18507381 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP | Semiconductor Components Industries, LLC | REIDA, MOLLY KAY | 2899 | Non-Final OA | Nov 13, 2023 |
| 18506269 | OPTICAL SENSOR PACKAGE | Semiconductor Components Industries, LLC | YEMELYANOV, DMITRIY | 2891 | Non-Final OA | Nov 10, 2023 |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | Semiconductor Components Industries, LLC | PETERSON, ERIK T | 2898 | Non-Final OA | Oct 20, 2023 |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | Semiconductor Components Industries, LLC | TIVARUS, CRISTIAN ALEXANDRU | 2899 | Non-Final OA | Oct 20, 2023 |
| 18487835 | ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS | Semiconductor Components Industries, LLC | LEE, EUGENE | 2815 | Non-Final OA | Oct 16, 2023 |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | Semiconductor Components Industries, LLC | NADAV, ORI | 2811 | Non-Final OA | Oct 12, 2023 |
| 18485565 | SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED METHODS | Semiconductor Components Industries, LLC | LEE, KYOUNG | 2817 | Non-Final OA | Oct 12, 2023 |
| 18480897 | FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE | Semiconductor Components Industries, LLC | JONES, ERIC W | 2892 | Non-Final OA | Oct 04, 2023 |
| 18471703 | LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING | Semiconductor Components Industries, LLC | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Sep 21, 2023 |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | Semiconductor Components Industries, LLC | AHMADI, MOHSEN | 2896 | Non-Final OA | Jul 11, 2023 |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | Semiconductor Components Industries, LLC | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 05, 2023 |
| 18345308 | TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE | Semiconductor Components Industries, LLC | CHAMBLISS, ALONZO | 2897 | Non-Final OA | Jun 30, 2023 |
| 18344292 | FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES | Semiconductor Components Industries, LLC | CHAMBLISS, ALONZO | 2897 | Non-Final OA | Jun 29, 2023 |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | Semiconductor Components Industries, LLC | MENDEZ, ZULMARIAM | 1794 | Non-Final OA | Jun 27, 2023 |
| 18324362 | METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP | Semiconductor Components Industries, LLC | SEVEN, EVREN | 2812 | Non-Final OA | May 26, 2023 |
| 18324526 | SILICON CARBIDE TRENCH POWER DEVICE | Semiconductor Components Industries, LLC | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | May 26, 2023 |
| 18309933 | CHIP STACKING WITH BOND PAD ABOVE A BONDLINE | Semiconductor Components Industries, LLC | NGUYEN, DAO H | 2818 | Non-Final OA | May 01, 2023 |
| 18308467 | MOLDED POWER MODULES | Semiconductor Components Industries, LLC | KLEIN, JORDAN M | 2893 | Non-Final OA | Apr 27, 2023 |
| 18295217 | POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT COOLING | Semiconductor Components Industries, LLC | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Final Rejection | Apr 03, 2023 |
| 18179744 | OPTICAL SENSOR PACKAGE | Semiconductor Components Industries, LLC | INOUSSA, MOULOUCOULAY | 2818 | Final Rejection | Mar 07, 2023 |
| 18172904 | PROTECTION DAM FOR A POWER MODULE WITH SPACERS | Semiconductor Components Industries, LLC | ASSOUMAN, HERVE-LOUIS Y | 2812 | Non-Final OA | Feb 22, 2023 |
| 18169780 | SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Semiconductor Components Industries, LLC | PARENDO, KEVIN A | 2896 | Non-Final OA | Feb 15, 2023 |
| 18066738 | SELF-ALIGNED JFET DEVICE | Semiconductor Components Industries, LLC | HAIDER, WASIUL | 2812 | Non-Final OA | Dec 15, 2022 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | Semiconductor Components Industries, LLC | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | Semiconductor Components Industries, LLC | QI, HUA | 1714 | Non-Final OA | Nov 09, 2022 |
| 18053177 | TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY | Semiconductor Components Industries, LLC | NGUYEN, CUONG B | 2818 | Non-Final OA | Nov 07, 2022 |
| 17931770 | SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE | Semiconductor Components Industries, LLC | WARD, ERIC A | 2891 | Final Rejection | Sep 13, 2022 |
| 17822405 | SIDEWALL PROTECTED IMAGE SENSOR PACKAGE | Semiconductor Components Industries, LLC | PRASAD, NEIL R | 2897 | Non-Final OA | Aug 25, 2022 |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | Semiconductor Components Industries, LLC | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Non-Final OA | Jul 25, 2022 |
| 17813972 | STACKED CHIP SCALE OPTICAL SENSOR PACKAGE | Semiconductor Components Industries, LLC | JEAN BAPTISTE, WILNER | 2899 | Non-Final OA | Jul 21, 2022 |
| 17137773 | SEMICONDUCTOR DESIGN OPTIMIZATION USING AT LEAST ONE NEURAL NETWORK | Semiconductor Components Industries, LLC | WU, NICHOLAS S | 2148 | Final Rejection | Dec 30, 2020 |
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