Onsemi (Bhb)

Portfolio Summary

31

Total Pending OAs

25

Non-Final OAs

4

Final Rejections

2

Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 31 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

13

Overdue

3

Due this week

11

Due this month

1

Due in next 60 days

3

Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 31 of the docket's apps have a known mailing date.

Overdue (13)Due ≤ 7 days (3)Due ≤ 30 days (11)Due ≤ 60 days (1)Due later (3)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

0

Hard (0%)

30

Medium (97%)

1

Easy (3%)

0

Unknown (0%)

Rejection Statute Mix

Bucket	Cases
§103 only	25 (81%)
§102 only	4 (13%)
§112 only	1 (3%)
Double-patenting + other	1 (3%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

2

Life Sciences

6% of docket

1

Information Tech

3% of docket

1

Communications

3% of docket

27

Semiconductors

87% of docket

0

Mechanical / Eng

0% of docket

0

Business / Other

0% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

310 h

Manual time on pending OAs

62 h

Time saved (low, 20%)

108 h

Time saved (mid, 35%)

2.7 wks

FTE-weeks freed (mid)

Top Examiners on this docket

Examiner	Apps on this docket	Allow rate	Interview lift
ASSOUMAN, HERVE-LOUIS Y	2	91.1%	+4.2%
CHAMBLISS, ALONZO	2	90.0%	-25.1%
FAYE, MAMADOU	1	78.3%	+7.1%
ISLA, RICHARD	1	76.6%	+15.4%
TRAN, NHAN T	1	86.7%	+13.2%
REIDA, MOLLY KAY	1	82.7%	+1.6%
PETERSON, ERIK T	1	76.9%	+11.8%
TIVARUS, CRISTIAN ALEXANDRU	1	77.8%	+18.9%
LEE, EUGENE	1	81.9%	+5.1%
NADAV, ORI	1	60.3%	+20.9%

Quick Wins (7)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.

App #	Title	Examiner	Due in
18532236	CHARGE-TO-VOLTAGE CONVERSION CIRCUIT WITH INLINE AMPLIFICATION	TRAN, NHAN T	16d overdue
18397847	HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES	ASSOUMAN, HERVE-LOUIS Y	1d overdue
18345308	TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE	CHAMBLISS, ALONZO	7d
18172904	PROTECTION DAM FOR A POWER MODULE WITH SPACERS	ASSOUMAN, HERVE-LOUIS Y	7d
18487835	ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS	LEE, EUGENE	8d
18344292	FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES	CHAMBLISS, ALONZO	22d
18507381	DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP	REIDA, MOLLY KAY	63d

Interview Candidates (5)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.

App #	Title	Examiner	Due in
18532236	CHARGE-TO-VOLTAGE CONVERSION CIRCUIT WITH INLINE AMPLIFICATION	TRAN, NHAN T	16d overdue
18491369	MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES	TIVARUS, CRISTIAN ALEXANDRU	4d overdue
18490923	PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE	PETERSON, ERIK T	12d
18485966	POWER MODULE PACKAGE HAVING MIRRORED LEADS	NADAV, ORI	21d
18392317	CURRENT-BASED BUILT-IN SELF-TEST FOR CIRCUIT COMPONENTS ARRANGED IN VARIED CONFIGURATIONS	ISLA, RICHARD	70d

Client Portfolio (1 client)

Client (Assignee)	Pending OAs
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC	31

Top Art Units

Art Unit	Apps
2899	4
2893	4
2897	3
2812	2
2898	2
2817	2
2896	2
2818	2
2884	1
2858	1

Pending Office Actions

App #	Title	Client	Examiner	Art Unit	Statutes	Status	Due in	AI	Filed
18766902	SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION	Semiconductor Components Industries, LLC	FAYE, MAMADOU	2884	§103	Non-Final OA	28d overdue	Pending	Jul 09, 2024
18397847	HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES	Semiconductor Components Industries, LLC	ASSOUMAN, HERVE-LOUIS Y	2812	§103	Non-Final OA	1d overdue	Pending	Dec 27, 2023
18392317	CURRENT-BASED BUILT-IN SELF-TEST FOR CIRCUIT COMPONENTS ARRANGED IN VARIED CONFIGURATIONS	Semiconductor Components Industries, LLC	ISLA, RICHARD	2858	§112	Non-Final OA	70d	Pending	Dec 21, 2023
18532236	CHARGE-TO-VOLTAGE CONVERSION CIRCUIT WITH INLINE AMPLIFICATION	Semiconductor Components Industries, LLC	TRAN, NHAN T	2638	§102	Non-Final OA	16d overdue	Pending	Dec 07, 2023
18507381	DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP	Semiconductor Components Industries, LLC	REIDA, MOLLY KAY	2899	§103	Non-Final OA	63d	Pending	Nov 13, 2023
18490923	PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE	Semiconductor Components Industries, LLC	PETERSON, ERIK T	2898	§103	Non-Final OA	12d	Pending	Oct 20, 2023
18491369	MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES	Semiconductor Components Industries, LLC	TIVARUS, CRISTIAN ALEXANDRU	2899	§103	Non-Final OA	4d overdue	Pending	Oct 20, 2023
18487835	ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS	Semiconductor Components Industries, LLC	LEE, EUGENE	2815	§103	Non-Final OA	8d	Pending	Oct 16, 2023
18485966	POWER MODULE PACKAGE HAVING MIRRORED LEADS	Semiconductor Components Industries, LLC	NADAV, ORI	2811	§103	Non-Final OA	21d	Pending	Oct 12, 2023
18485565	SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED METHODS	Semiconductor Components Industries, LLC	LEE, KYOUNG	2817	§102	Non-Final OA	7d	Pending	Oct 12, 2023
18480897	FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE	Semiconductor Components Industries, LLC	JONES, ERIC W	2892	§103	Non-Final OA	9d overdue	Pending	Oct 04, 2023
18471703	LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING	Semiconductor Components Industries, LLC	TOBERGTE, NICHOLAS J	2817	§103	Non-Final OA	29d overdue	Pending	Sep 21, 2023
18350474	PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE	Semiconductor Components Industries, LLC	AHMADI, MOHSEN	2896	§103	Non-Final OA	18d overdue	Pending	Jul 11, 2023
18345308	TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE	Semiconductor Components Industries, LLC	CHAMBLISS, ALONZO	2897	§103	Non-Final OA	7d	Pending	Jun 30, 2023
18344292	FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES	Semiconductor Components Industries, LLC	CHAMBLISS, ALONZO	2897	§103	Non-Final OA	22d	Pending	Jun 29, 2023
18341958	ELECTROPLATING SYSTEMS AND METHODS	Semiconductor Components Industries, LLC	MENDEZ, ZULMARIAM	1794	§103	Non-Final OA	12d	Pending	Jun 27, 2023
18309933	CHIP STACKING WITH BOND PAD ABOVE A BONDLINE	Semiconductor Components Industries, LLC	NGUYEN, DAO H	2818	§103	Non-Final OA	10d overdue	Pending	May 01, 2023
18308467	MOLDED POWER MODULES	Semiconductor Components Industries, LLC	KLEIN, JORDAN M	2893	§103	Non-Final OA	28d	Pending	Apr 27, 2023
18186842	HEAT TRANSFER FOR POWER MODULES	Semiconductor Components Industries, LLC	KUPP, BENJAMIN MICHAEL	2893	§103	Non-Final OA	23d overdue	Pending	Mar 20, 2023
18179744	OPTICAL SENSOR PACKAGE	Semiconductor Components Industries, LLC	INOUSSA, MOULOUCOULAY	2818	§103	Final Rejection	15d	Pending	Mar 07, 2023
18172904	PROTECTION DAM FOR A POWER MODULE WITH SPACERS	Semiconductor Components Industries, LLC	ASSOUMAN, HERVE-LOUIS Y	2812	§103	Non-Final OA	7d	Pending	Feb 22, 2023
18169780	SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME	Semiconductor Components Industries, LLC	PARENDO, KEVIN A	2896	§103	Non-Final OA	15d	Pending	Feb 15, 2023
18055123	POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET	Semiconductor Components Industries, LLC	CIESLEWICZ, ANETA B	2893	§103	Non-Final OA	16d overdue	Pending	Nov 14, 2022
18053796	SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL	Semiconductor Components Industries, LLC	QI, HUA	1714	§103	Non-Final OA	16d overdue	Pending	Nov 09, 2022
17931770	SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE	Semiconductor Components Industries, LLC	WARD, ERIC A	2891	§102	Non-Final OA	22d	Pending	Sep 13, 2022
17822405	SIDEWALL PROTECTED IMAGE SENSOR PACKAGE	Semiconductor Components Industries, LLC	PRASAD, NEIL R	2897	§103	Non-Final OA	14d	Pending	Aug 25, 2022
17822403	IMAGE SENSOR BALL GRID ARRAY PACKAGE	Semiconductor Components Industries, LLC	LASASSO, VICTOR JOSEPH	2898	§103	Final Rejection	53d	Pending	Aug 25, 2022
17814566	HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL	Semiconductor Components Industries, LLC	BULLARD-CONNOR, GENEVIEVE GRACE	2899	§103	Non-Final OA	23d	Pending	Jul 25, 2022
17814750	POWER DEVICE INCLUDING METAL LAYER	Semiconductor Components Industries, LLC	NGUYEN, THANH T	2893	DPOther	Final Rejection	79d	Pending	Jul 25, 2022
17813972	STACKED CHIP SCALE OPTICAL SENSOR PACKAGE	Semiconductor Components Industries, LLC	JEAN BAPTISTE, WILNER	2899	§102	Non-Final OA	140d overdue	Pending	Jul 21, 2022
17137773	SEMICONDUCTOR DESIGN OPTIMIZATION USING AT LEAST ONE NEURAL NETWORK	Semiconductor Components Industries, LLC	WU, NICHOLAS S	2148	§103	Final Rejection	134d overdue	Pending	Dec 30, 2020