Prosecution Insights
Prosecution Insights
48 pending office actions • 2 clients • 44 examiners • 21 art units • 0 of 48 (0%) have an AI response strategy ready • 3 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 19 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 19 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 17 (35%) |
| §102 only | 3 (6%) |
| §112 only | 2 (4%) |
| Multi-statute (no §101) | 26 (54%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| TIVARUS, CRISTIAN ALEXANDRU | 2 | 77.8% | +21.9% |
| PETERSON, ERIK T | 2 | 77.1% | +11.1% |
| ISLA, RICHARD | 2 | 77.1% | +15.2% |
| VALENZUELA, PATRICIA D | 2 | 90.2% | +2.1% |
| YENINAS, STEVEN LEE | 1 | 73.4% | +4.7% |
| FAYE, MAMADOU | 1 | 78.5% | +6.7% |
| MUSE, ISMAIL A | 1 | 86.7% | +7.9% |
| ASFAW, MESFIN T | 1 | 82.8% | +14.0% |
| FENG, ZHENGFU J | 1 | 75.4% | +38.8% |
| YEUNG LOPEZ, FEIFEI | 1 | 81.2% | -2.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | MUSE, ISMAIL A | — |
| 18355171 | COPPER FEATURES AND RELATED METHODS OF FORMING | VALENZUELA, PATRICIA D | — |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17137773 | SEMICONDUCTOR DESIGN OPTIMIZATION USING AT LEAST ONE NEURAL NETWORK | WU, NICHOLAS S | 134d overdue |
| 18523726 | ACOUSTIC OBSTACLE DETECTION WITH ENHANCED RESISTANCE TO SYSTEMATIC INTERFERENCE | ATMAKURI, VIKAS NMN | 97d overdue |
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 28d overdue |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 18d overdue |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | QI, HUA | 16d overdue |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 6d |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | PETERSON, ERIK T | 12d |
| 18954353 | INDUCTIVE ANGULAR POSITION SENSOR | YENINAS, STEVEN LEE | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18430787 | ROTOR FOR INDUCTIVE POSITION SENSOR | ISLA, RICHARD | 8d overdue |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 4d overdue |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | PETERSON, ERIK T | 12d |
| 18392317 | CURRENT-BASED BUILT-IN SELF-TEST FOR CIRCUIT COMPONENTS ARRANGED IN VARIED CONFIGURATIONS | ISLA, RICHARD | 70d |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | ASFAW, MESFIN T | — |
| 18732248 | COOLER ASSEMBLY FOR ELECTRONIC MODULES | FENG, ZHENGFU J | — |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | — |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | PETERSON, ERIK T | — |
| Client (Assignee) | Pending OAs |
|---|---|
| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 47 |
| SWIR Vision Systems Inc. | 1 |
| Art Unit | Apps |
|---|---|
| 2899 | 9 |
| 2898 | 6 |
| 2812 | 4 |
| 2896 | 3 |
| 2884 | 2 |
| 1714 | 2 |
| 2818 | 2 |
| 2858 | 2 |
| 2893 | 2 |
| 2882 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18954353 | INDUCTIVE ANGULAR POSITION SENSOR | Semiconductor Components Industries, LLC | YENINAS, STEVEN LEE | §102§112 | Non-Final OA | — | Pending | Nov 20, 2024 | |
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | Semiconductor Components Industries, LLC | FAYE, MAMADOU | 2884 | §102§103 | Non-Final OA | 28d overdue | Pending | Jul 09, 2024 |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | Semiconductor Components Industries, LLC | MUSE, ISMAIL A | §103 | Non-Final OA | — | Pending | Jun 26, 2024 | |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | Semiconductor Components Industries, LLC | ASFAW, MESFIN T | 2882 | §102§103 | Final Rejection | — | Pending | Jun 25, 2024 |
| 18732248 | COOLER ASSEMBLY FOR ELECTRONIC MODULES | Semiconductor Components Industries, LLC | FENG, ZHENGFU J | 2835 | §102§103§112 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18668408 | SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES | Semiconductor Components Industries, LLC | YEUNG LOPEZ, FEIFEI | 2899 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18661875 | MANAGING GROWTH OF SILICON CARBIDE CRYSTALS | Semiconductor Components Industries, LLC | BRATLAND JR, KENNETH A | 1714 | §103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18657148 | SYSTEM AND METHOD FOR DRIVING A HYBRID SWITCH | Semiconductor Components Industries, LLC | ALMO, KHAREEM E | 2849 | §103 | Non-Final OA | 82d | Pending | May 07, 2024 |
| 18649686 | c/o onsemi | Semiconductor Components Industries, LLC | CHI, SUBERR L | §103 | Non-Final OA | — | Pending | Apr 29, 2024 | |
| 18648897 | High-Definition Broad-Band Visible-shortwave Infrared (SWIR) Sensors for Laser Detection | Swir Vision Systems Inc. | YUN, JURIE | 2884 | §112 | Non-Final OA | 22d overdue | Pending | Apr 29, 2024 |
| 18617325 | POWER MODULE WITH OVERLAPPING TERMINALS | Semiconductor Components Industries, LLC | MUIR, MATTHEW SINCLAIR | §102§103 | Non-Final OA | — | Pending | Mar 26, 2024 | |
| 18602261 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | ABDELAZIEZ, YASSER A | 2898 | §103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18594145 | FIDUCIAL DESIGNS AND RELATED METHODS FOR WIRE BOND PATTERN RECOGNITION | Semiconductor Components Industries, LLC | WHITESELL, STEVEN H | 1759 | §102§103 | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | Semiconductor Components Industries, LLC | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | Semiconductor Components Industries, LLC | PETERSON, ERIK T | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18441484 | DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES | Semiconductor Components Industries, LLC | MUNOZ, ANDRES F | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 14, 2024 |
| 18434625 | JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES USING MONOLITHIC MICROSTRUCTURES | Semiconductor Components Industries, LLC | NIEVES, NELSON J | 2899 | §102 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18430787 | ROTOR FOR INDUCTIVE POSITION SENSOR | Semiconductor Components Industries, LLC | ISLA, RICHARD | 2858 | §103 | Non-Final OA | 8d overdue | Pending | Feb 02, 2024 |
| 18391981 | CROSS CAPACITORS FOR MULTISTAGE POWER CONVERTERS | Semiconductor Components Industries, LLC | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §102 | Final Rejection | — | Pending | Dec 21, 2023 |
| 18392317 | CURRENT-BASED BUILT-IN SELF-TEST FOR CIRCUIT COMPONENTS ARRANGED IN VARIED CONFIGURATIONS | Semiconductor Components Industries, LLC | ISLA, RICHARD | 2858 | §112 | Non-Final OA | 70d | Pending | Dec 21, 2023 |
| 18543644 | WIRE BONDING USING A FLOATING PAD | Semiconductor Components Industries, LLC | WALL, VINCENT | 2898 | §103 | Final Rejection | 9d overdue | Pending | Dec 18, 2023 |
| 18538533 | OPTICAL SENSOR PACKAGE | Semiconductor Components Industries, LLC | BENTON, CHLOE ELAINE | 2899 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18534804 | ETCHED DIE SINGULATION SYSTEMS AND RELATED METHODS | Semiconductor Components Industries, LLC | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18526088 | ASYMMETRIC OPERATIONAL AMPLIFIER | Semiconductor Components Industries, LLC | SHAMIRYAN, NAREH | 2843 | §102§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18523726 | ACOUSTIC OBSTACLE DETECTION WITH ENHANCED RESISTANCE TO SYSTEMATIC INTERFERENCE | Semiconductor Components Industries, LLC | ATMAKURI, VIKAS NMN | 3645 | §102§103 | Non-Final OA | 97d overdue | Pending | Nov 29, 2023 |
| 18508551 | SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE | Semiconductor Components Industries, LLC | BOOTH, RICHARD A | 2812 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18507381 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP | Semiconductor Components Industries, LLC | REIDA, MOLLY KAY | 2899 | §103 | Non-Final OA | 63d | Pending | Nov 13, 2023 |
| 18558593 | STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES | Semiconductor Components Industries, LLC | WINTERS, SEAN AYERS | 2892 | §102§103§112 | Final Rejection | — | Pending | Nov 02, 2023 |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | Semiconductor Components Industries, LLC | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | 4d overdue | Pending | Oct 20, 2023 |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | Semiconductor Components Industries, LLC | PETERSON, ERIK T | 2898 | §103§112 | Non-Final OA | 12d | Pending | Oct 20, 2023 |
| 18489961 | SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION | Semiconductor Components Industries, LLC | RAHMAN, MOIN M | 2898 | §102§112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18488628 | ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK | Semiconductor Components Industries, LLC | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Oct 17, 2023 |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | Semiconductor Components Industries, LLC | NADAV, ORI | 2811 | §103 | Final Rejection | 21d | Pending | Oct 12, 2023 |
| 18473659 | BLACK MASK ON GLASS SYSTEMS AND RELATED METHODS | Semiconductor Components Industries, LLC | SELBY, GEVELL V | 2638 | §102 | Final Rejection | 16d | Pending | Sep 25, 2023 |
| 18355171 | COPPER FEATURES AND RELATED METHODS OF FORMING | Semiconductor Components Industries, LLC | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jul 19, 2023 |
| 18354863 | TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE | Semiconductor Components Industries, LLC | CLINTON, EVAN GARRETT | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 19, 2023 |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | Semiconductor Components Industries, LLC | AHMADI, MOHSEN | 2896 | §102§103 | Final Rejection | 18d overdue | Pending | Jul 11, 2023 |
| 18349440 | SEMICONDUCTOR DEVICE PACKAGE | Semiconductor Components Industries, LLC | NIELSEN, DEREK LANG | 2899 | §103§112 | Final Rejection | — | Pending | Jul 10, 2023 |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | Semiconductor Components Industries, LLC | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | Pending | Jul 05, 2023 |
| 18313425 | STRUCTURE AND METHOD FOR POWER METAL LINES | Semiconductor Components Industries, LLC | PROSTOR, ANDREW VICTOR | 2812 | §103 | Final Rejection | — | Pending | May 08, 2023 |
| 18194811 | CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS | Semiconductor Components Industries, LLC | BOYLE, ABBIGALE A | 2899 | §102§112 | Non-Final OA | — | Pending | Apr 03, 2023 |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | Semiconductor Components Industries, LLC | ARROYO, TERESA M | 2893 | §102§103§112 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18169780 | SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Semiconductor Components Industries, LLC | PARENDO, KEVIN A | 2896 | §103 | Final Rejection | 15d | Pending | Feb 15, 2023 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | Semiconductor Components Industries, LLC | CIESLEWICZ, ANETA B | 2893 | §103 | Final Rejection | 16d overdue | Pending | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | Semiconductor Components Industries, LLC | QI, HUA | 1714 | §103§112 | Final Rejection | 16d overdue | Pending | Nov 09, 2022 |
| 17931770 | SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE | Semiconductor Components Industries, LLC | WARD, ERIC A | 2891 | §103 | Non-Final OA | 22d | Pending | Sep 13, 2022 |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | LUKE, DANIEL M | 2896 | §102§103§112 | Final Rejection | 6d | Pending | Sep 07, 2022 |
| 17137773 | SEMICONDUCTOR DESIGN OPTIMIZATION USING AT LEAST ONE NEURAL NETWORK | Semiconductor Components Industries, LLC | WU, NICHOLAS S | 2148 | §103§112 | Final Rejection | 134d overdue | Pending | Dec 30, 2020 |
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