Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
66 pending office actions • 2 clients • 62 examiners • 24 art units • 0 of 66 (0%) have an AI response strategy ready • 3 patents granted in the last 365 days
onsemi (BHB) manages 29923 career applications, primarily in the Semiconductors, Circuits & Optics technology area. The firm maintains a resolved allowance rate of 87.43 percent.
The firm currently has 51 pending office actions and averages 3.68 office actions per allowance. This average of 3.68 indicates a prosecution process that often requires multiple rounds of examiner interaction for its 29923 career applications.
Based on the USPTO statutory response window for each pending office action. 18 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 18 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (2%) |
| §103 only | 18 (27%) |
| §102 only | 3 (5%) |
| §112 only | 1 (2%) |
| Double-patenting only | 2 (3%) |
| Multi-statute (no §101) | 40 (61%) |
| No statute on record | 1 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BENTON, CHLOE ELAINE | 2 | — | — |
| PURVIS, SUE A | 2 | 64.0% | +11.8% |
| TIVARUS, CRISTIAN ALEXANDRU | 2 | 76.0% | +26.1% |
| ARROYO, TERESA M | 2 | 71.9% | +23.2% |
| SAAD, ERIN BARRY | 1 | 72.4% | +11.5% |
| JEAN PIERRE, PEGUY | 1 | 94.3% | -0.8% |
| ALLGOOD, ALESA M | 1 | 82.5% | +18.6% |
| NGUYEN, LINH V | 1 | 89.1% | +2.4% |
| GONZALEZ, MILTON | 1 | 77.7% | +12.7% |
| KHAN, USMAN A | 1 | 74.9% | +11.7% |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 28d overdue |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 18d overdue |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 16d overdue |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 6d |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 12d |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 23d |
| 18533355 | TRANSISTOR WITH INTEGRATED SOURCE-DRAIN DIODE | MINNEY, GABRIEL SEBASTIAN | 70d |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | NGUYEN, THANH T | 79d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 4d overdue |
| 19049380 | REFLOW JIG DESIGNS AND RELATED METHODS | SAAD, ERIN BARRY | — |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | GONZALEZ, MILTON | — |
| 19010521 | AUTOMATED MUTLI-MODAL SENSING SYNCHRONIZATION | KHAN, USMAN A | — |
| 18619594 | ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER | PURVIS, SUE A | — |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | — |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | ARROYO, TERESA M | — |
| Client (Assignee) | Pending OAs |
|---|---|
| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 65 |
| United Silicon Carbide, Inc. | 1 |
| Art Unit | Apps |
|---|---|
| 2899 | 7 |
| 2893 | 6 |
| 2898 | 4 |
| 2896 | 4 |
| 2812 | 3 |
| 2818 | 3 |
| 2845 | 2 |
| 1714 | 2 |
| 2897 | 2 |
| 1735 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19049380 | REFLOW JIG DESIGNS AND RELATED METHODS | Semiconductor Components Industries, LLC | SAAD, ERIN BARRY | 1735 | §102§103 | Final Rejection | — | Pending | Feb 10, 2025 |
| 19042666 | LOW POWER PHASE DETECTION | Semiconductor Components Industries, LLC | JEAN PIERRE, PEGUY | 2845 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2025 |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | Semiconductor Components Industries, LLC | ALLGOOD, ALESA M | §103§112 | Non-Final OA | — | Pending | Jan 22, 2025 | |
| 19021792 | BOOTSTRAPPED SWITCH CIRCUIT WITH HIGH LINEARITY | Semiconductor Components Industries, LLC | NGUYEN, LINH V | 2845 | §102§103 | Non-Final OA | — | Pending | Jan 15, 2025 |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | Semiconductor Components Industries, LLC | GONZALEZ, MILTON | Other | Non-Final OA | — | Pending | Jan 13, 2025 | |
| 19010521 | AUTOMATED MUTLI-MODAL SENSING SYNCHRONIZATION | Semiconductor Components Industries, LLC | KHAN, USMAN A | 2637 | §102§103 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 18955820 | FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM | Semiconductor Components Industries, LLC | JACKSON, STEPHEN W | DP | Non-Final OA | — | Pending | Nov 21, 2024 | |
| 18954353 | INDUCTIVE ANGULAR POSITION SENSOR | Semiconductor Components Industries, LLC | YENINAS, STEVEN LEE | §102§112 | Non-Final OA | — | Pending | Nov 20, 2024 | |
| 18917293 | SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS | Semiconductor Components Industries, LLC | LIN, AMIE CHINYU | 2436 | §101§102§103 | Final Rejection | — | Pending | Oct 16, 2024 |
| 18891830 | IMPROVED VOLTAGE BUFFER | Semiconductor Components Industries, LLC | RETEBO, METASEBIA T | 2836 | §102§103 | Non-Final OA | — | Pending | Sep 20, 2024 |
| 18799472 | IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER | Semiconductor Components Industries, LLC | RAHMAN, KHATIB A | §102§103 | Non-Final OA | — | Pending | Aug 09, 2024 | |
| 18795699 | TAPE HEATING METHODS | Semiconductor Components Industries, LLC | VU, VU A | §103 | Non-Final OA | — | Pending | Aug 06, 2024 | |
| 18791299 | LOW ENERGY PHOTON DETECTION WITH CMOS IMAGERS | Semiconductor Components Industries, LLC | DANG, PHILIP | 2488 | §103 | Non-Final OA | 26d | Pending | Jul 31, 2024 |
| 18787369 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | Semiconductor Components Industries, LLC | MIHALIOV, DMITRI | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 | |
| 18784012 | SWITCHING POWER CONVERTERS, AND METHODS AND CONTROL MODULES FOR OPERATING SAME | Semiconductor Components Industries, LLC | ZHANG, JUE | 2838 | §102§103 | Final Rejection | — | Pending | Jul 25, 2024 |
| 18775336 | METHOD OF FABRICATING SUPER-JUNCTION BASED VERTICAL GALLIUM NITRIDE JFET AND MOSFET POWER DEVICES | Semiconductor Components Industries, LLC | BOOTH, RICHARD A | DP | Non-Final OA | — | Pending | Jul 17, 2024 | |
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | Semiconductor Components Industries, LLC | FAYE, MAMADOU | 2884 | §102§103 | Non-Final OA | 28d overdue | Pending | Jul 09, 2024 |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | Semiconductor Components Industries, LLC | MUSE, ISMAIL A | §102§103 | Non-Final OA | — | Pending | Jun 26, 2024 | |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | Semiconductor Components Industries, LLC | ASFAW, MESFIN T | 2882 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18738193 | MANAGING THE GROWTH OF SILICON CARBIDE CRYSTALS | Semiconductor Components Industries, LLC | SONG, MATTHEW J | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 | |
| 18668408 | SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES | Semiconductor Components Industries, LLC | YEUNG LOPEZ, FEIFEI | 2899 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18661875 | MANAGING GROWTH OF SILICON CARBIDE CRYSTALS | Semiconductor Components Industries, LLC | BRATLAND JR, KENNETH A | 1714 | §102§103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18652203 | HIGH PHOTON RATE SPAD DEVICE | Semiconductor Components Industries, LLC | FLORES, MARK ANTHONY | §102§103 | Non-Final OA | — | Pending | May 01, 2024 | |
| 18649686 | c/o onsemi | Semiconductor Components Industries, LLC | CHI, SUBERR L | §102§103§112 | Non-Final OA | — | Pending | Apr 29, 2024 | |
| 18647326 | METHOD OF TESTING A POWER TRANSISTOR | Semiconductor Components Industries, LLC | FREDERIKSEN, DAVID B | 2858 | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18641773 | Image Sensor with Visible Light and Short Wave Infrared Detection | Semiconductor Components Industries, LLC | MENZ, DOUGLAS M | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 | |
| 18637256 | Image Sensor with Visible Light and Short Wave Infrared Detection | Semiconductor Components Industries, LLC | LEE, KYOUNG | §102 | Non-Final OA | — | Pending | Apr 16, 2024 | |
| 18701585 | TERMINATION STRUCTURES FOR MOSFETS | Semiconductor Components Industries, LLC | BENTON, CHLOE ELAINE | §102§103§112 | Non-Final OA | — | Pending | Apr 15, 2024 | |
| 18634120 | SPLIT-GATE TRENCH SEMICONDUCTOR DEVICE HAVING STEPPED SHIELD ELECTRODE AND METHOD OF MANUFACTURING | Semiconductor Components Industries, LLC | SQUIRES, BRETT STEPHEN | §102§103 | Non-Final OA | — | Pending | Apr 12, 2024 | |
| 18621338 | PARTITIONED LEADFRAME FOR MULTI-DIE DISCRETE ELECTRONIC COMPONENTS | Semiconductor Components Industries, LLC | ARMAND, MARC ANTHONY | §103 | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18621005 | METHODS AND SYSTEMS OF LIGHT DETECTING AND RANGING | Semiconductor Components Industries, LLC | HULKA, JAMES R | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 | |
| 18619594 | ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER | Semiconductor Components Industries, LLC | PURVIS, SUE A | 2800 | §103 | Final Rejection | — | Pending | Mar 28, 2024 |
| 18606922 | METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES | Semiconductor Components Industries, LLC | ZARNEKE, DAVID A | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18602261 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | ABDELAZIEZ, YASSER A | 2898 | §103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18592273 | MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING | Semiconductor Components Industries, LLC | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | Semiconductor Components Industries, LLC | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18441484 | DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES | Semiconductor Components Industries, LLC | MUNOZ, ANDRES F | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 14, 2024 |
| 18439823 | PROCESS OF FORMING A THIN SEMICONDUCTOR LAYER BONDED TO A PROCESSING SUBSTRATE AND AN ELECTRONIC DEVICE INCLUDING THE THIN SEMICONDUCTOR LAYER | Semiconductor Components Industries, LLC | LASASSO, VICTOR JOSEPH | 2898 | §102§103§112 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | Semiconductor Components Industries, LLC | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | 1d overdue | Pending | Dec 27, 2023 |
| 18543644 | WIRE BONDING USING A FLOATING PAD | Semiconductor Components Industries, LLC | WALL, VINCENT | 2898 | §103 | Final Rejection | 9d overdue | Pending | Dec 18, 2023 |
| 18538533 | OPTICAL SENSOR PACKAGE | Semiconductor Components Industries, LLC | BENTON, CHLOE ELAINE | 2899 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | Semiconductor Components Industries, LLC | HENRY, CALEB E | 2818 | §102 | Final Rejection | 22d | Pending | Dec 08, 2023 |
| 18533355 | TRANSISTOR WITH INTEGRATED SOURCE-DRAIN DIODE | United Silicon Carbide, Inc. | MINNEY, GABRIEL SEBASTIAN | 2897 | §102§103 | Final Rejection | 70d | Pending | Dec 08, 2023 |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | Semiconductor Components Industries, LLC | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18558593 | STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES | Semiconductor Components Industries, LLC | WINTERS, SEAN AYERS | 2892 | §102§103§112 | Final Rejection | — | Pending | Nov 02, 2023 |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | Semiconductor Components Industries, LLC | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | 4d overdue | Pending | Oct 20, 2023 |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | Semiconductor Components Industries, LLC | NADAV, ORI | 2811 | §103 | Final Rejection | 21d | Pending | Oct 12, 2023 |
| 18479316 | IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS | Semiconductor Components Industries, LLC | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Oct 02, 2023 |
| 18478296 | WIRE-IN-DAM PACKAGES AND RELATED SYSTEMS AND METHODS | Semiconductor Components Industries, LLC | SWANSON, ANDREW L | 2896 | §102 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18473998 | POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER | Semiconductor Components Industries, LLC | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Final Rejection | — | Pending | Sep 25, 2023 |
| 18462082 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | — | Pending | Sep 06, 2023 |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | Semiconductor Components Industries, LLC | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | 19d overdue | Pending | Aug 08, 2023 |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | Semiconductor Components Industries, LLC | AHMADI, MOHSEN | 2896 | §102§103 | Final Rejection | 18d overdue | Pending | Jul 11, 2023 |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | Semiconductor Components Industries, LLC | MENDEZ, ZULMARIAM | 1794 | §102§103 | Non-Final OA | 12d | Pending | Jun 27, 2023 |
| 18308467 | MOLDED POWER MODULES | Semiconductor Components Industries, LLC | KLEIN, JORDAN M | 2893 | §103 | Final Rejection | 28d | Pending | Apr 27, 2023 |
| 18194811 | CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS | Semiconductor Components Industries, LLC | BOYLE, ABBIGALE A | 2899 | §102§112 | Non-Final OA | — | Pending | Apr 03, 2023 |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | Semiconductor Components Industries, LLC | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18185548 | EDGE SEALS FOR SEMICONDUCTOR DEVICES | Semiconductor Components Industries, LLC | PURVIS, SUE A | 2893 | §102§103§112 | Non-Final OA | — | Pending | Mar 17, 2023 |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | Semiconductor Components Industries, LLC | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18174837 | SANDWICH PACKAGE FOR MICROELECTRONICS | Semiconductor Components Industries, LLC | HUTSON, NICHOLAS LELAND | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 27, 2023 |
| 18169780 | SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Semiconductor Components Industries, LLC | PARENDO, KEVIN A | 2896 | §103 | Final Rejection | 15d | Pending | Feb 15, 2023 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | Semiconductor Components Industries, LLC | CIESLEWICZ, ANETA B | 2893 | §103§112 | Final Rejection | 16d overdue | Pending | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | Semiconductor Components Industries, LLC | QI, HUA | 1714 | §112 | Non-Final OA | 16d overdue | Pending | Nov 09, 2022 |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | LUKE, DANIEL M | 2896 | §102§103§112 | Final Rejection | 6d | Pending | Sep 07, 2022 |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | Semiconductor Components Industries, LLC | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | 79d | Pending | Jul 25, 2022 |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | Semiconductor Components Industries, LLC | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103§112 | Final Rejection | 23d | Pending | Jul 25, 2022 |
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