Prosecution Insights
Prosecution Insights
58 pending office actions • 20 art units • 51 examiners • 0 of 58 (0%) have an AI response strategy ready • 51 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 20 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 20 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 22 (38%) |
| §102 only | 7 (12%) |
| §112 only | 1 (2%) |
| Multi-statute (no §101) | 28 (48%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| GHEYAS, SYED I | 3 | 82.5% | +3.9% |
| VALENZUELA, PATRICIA D | 3 | 90.2% | +2.1% |
| CHEN, JACK S J | 3 | 76.6% | +5.2% |
| KLEIN, JORDAN M | 2 | 85.5% | +8.7% |
| NORRIS, JEREMY C | 1 | 86.6% | +4.4% |
| MATTABONI, TIMOTHY JAMES | 1 | — | — |
| DOUMBIA, MOHAMED | 1 | 72.2% | +30.6% |
| ISHAQ, ISHAQ MOHAMED SAID | 1 | — | — |
| SLUTSKER, JULIA | 1 | 76.9% | +12.5% |
| NEIBAUR, ROBERT F | 1 | 76.5% | +32.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 22d overdue |
| 18336358 | Semiconductor Package | VALENZUELA, PATRICIA D | 10d overdue |
| 18612356 | POWER DEVICES WITH BARRIER METAL EXTENSION AND SEALING | GHEYAS, SYED I | — |
| 18430866 | Power Semiconductor Devices with Stacked Layers | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 17d overdue |
| 18537427 | Substrates for Power Semiconductor Devices | YI, CHANGHYUN | 10d overdue |
| 18472343 | BURIED SHIELD STRUCTURES FOR POWER SEMICONDUCTOR DEVICES INCLUDING SEGMENTED SUPPORT SHIELD STRUCTURES FOR REDUCED ON-RESISTANCE AND RELATED FABRICATION METHODS | RAHMAN, MOHAMMAD A | 5d overdue |
| 18333632 | Low Contact Resistance in Semiconductor Devices with Implanted Regions | GHEYAS, SYED I | 4d overdue |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 22d |
| 18340471 | Implantation for Isolated Channel Structures in Group III-Nitride Semiconductor Devices | MUSE, ISMAIL A | 30d |
| 18164249 | Semiconductor Structure for Improved Radio Frequency Thermal Management | PATEL, REEMA | 75d |
| 17977003 | SEMICONDUCTOR DEVICES WITH ADDITIONAL MESA STRUCTURES FOR REDUCED SURFACE ROUGHNESS | ANDERSON, ERIK ARTHUR | 77d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18737609 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — |
| 18646883 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SPLIT GATE ELECTRODES | SLUTSKER, JULIA | — |
| 18643511 | Method and System for Conditioning a Polishing Pad | NEIBAUR, ROBERT F | — |
| Art Unit | Apps |
|---|---|
| 2812 | 12 |
| 2893 | 7 |
| 2817 | 6 |
| 2897 | 5 |
| 2847 | 2 |
| 4100 | 2 |
| 2818 | 2 |
| 2815 | 2 |
| 2898 | 2 |
| 2899 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18782438 | Multilayer Printed Circuit Board with Filling Segment Structures | NORRIS, JEREMY C | 2847 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780825 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SHALLOW TRENCH SHIELDS AND DEEP SUPOORT SHIELDS | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18737609 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — | §102§103§112 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18663862 | Workpiece Surface Processing System for Semiconductor Wafers | ISHAQ, ISHAQ MOHAMED SAID | 4100 | §103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18646883 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SPLIT GATE ELECTRODES | SLUTSKER, JULIA | — | §102 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18643511 | Method and System for Conditioning a Polishing Pad | NEIBAUR, ROBERT F | 3723 | §103 | Final Rejection | — | Pending | Apr 23, 2024 |
| 18627134 | Method of Uniform NiSi Deposition | HO, TU TU V | — | §102§103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18612356 | POWER DEVICES WITH BARRIER METAL EXTENSION AND SEALING | GHEYAS, SYED I | — | §103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18610394 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND METHODS OF FORMING THE SAME | SPALLA, DAVID C | — | §102 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18607712 | SEMICONDUCTOR DEVICES HAVING INTRINSIC GATE-TO-DRAIN CAPACITANCES THAT ARE ONLY PARTLY IN SERIES WITH A GATE RESISTOR | RAMOS-DIAZ, FERNANDO JOSE | 4100 | §103 | Non-Final OA | — | Pending | Mar 18, 2024 |
| 18430866 | Power Semiconductor Devices with Stacked Layers | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18431115 | EDGE TERMINATION USING IMPLANT DAMAGE | VU, VU A | 2897 | §102§103§112 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18430542 | POWER SEMICONDUCTOR DEVICES INCLUDING INTEGRATED POLYSILICON DEVICES | HO, ANTHONY | 2817 | §102 | Non-Final OA | — | Pending | Feb 01, 2024 |
| 18422677 | Thermally Stable FinFET Device for High Temperature Operation | LOHAKARE, PRATIKSHA JAYANT | 2818 | §103 | Final Rejection | — | Pending | Jan 25, 2024 |
| 18412190 | Power Semiconductor Device Having Improved Transient Handling Without Field Insulating Layer | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18394999 | Carrier-Assisted Method for Parting Crystalline Material Along Laser Damage Region | BRATLAND JR, KENNETH A | 1714 | §103 | Final Rejection | 1d overdue | Pending | Dec 22, 2023 |
| 18545517 | GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WITH A LOW RESISTANCE CONTACT LAYER FOR SOURCE AND/OR DRAIN CONTACTS AND PROCESS FOR IMPLEMENTING THE SAME | MENZ, DOUGLAS M | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18545648 | Electroless Deposition Process for Semiconductor Devices | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18541571 | Engineered Interconnect Structures for Enhanced Bonding Strength | ALAM, MOHAMMED R | 2897 | §102§103 | Non-Final OA | 84d | Pending | Dec 15, 2023 |
| 18537435 | Power Semiconductor Devices | MAZUMDER, DIDARUL A | 2812 | §103 | Non-Final OA | — | Pending | Dec 12, 2023 |
| 18537427 | Substrates for Power Semiconductor Devices | YI, CHANGHYUN | 2812 | §102§103 | Final Rejection | 10d overdue | Pending | Dec 12, 2023 |
| 18524126 | Underfill for Large Area Attaches for Semiconductor Packages | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 30, 2023 |
| 18514038 | MASK INTEGRATION FOR TRENCHED SEMICONDUCTOR DEVICE STRUCTURES | CHANG, JAY C | 2817 | §102 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18510756 | ENHANCED ISOLATION FOR ON-CHIP CURRENT SENSORS | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18508322 | SPLIT SUPPORT SHIELD STRUCTURES FOR TRENCHED SEMICONDUCTOR DEVICES WITH INTEGRATED SCHOTTKY DIODES | BOOTH, RICHARD A | 2812 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 2817 | §102§103 | Final Rejection | 22d | Pending | Oct 17, 2023 |
| 18472343 | BURIED SHIELD STRUCTURES FOR POWER SEMICONDUCTOR DEVICES INCLUDING SEGMENTED SUPPORT SHIELD STRUCTURES FOR REDUCED ON-RESISTANCE AND RELATED FABRICATION METHODS | RAHMAN, MOHAMMAD A | 2898 | §102§103§112 | Final Rejection | 5d overdue | Pending | Sep 22, 2023 |
| 18471003 | Corrosion Resistant Metal Structures for Wide Bandgap Semiconductor Devices | HAN, JONATHAN | 2818 | §102§103 | Final Rejection | — | Pending | Sep 20, 2023 |
| 18466487 | Power Semiconductor Device with Balancing Shunt Structure | HOQUE, MOHAMMAD M | 2817 | §102 | Non-Final OA | — | Pending | Sep 13, 2023 |
| 18449458 | Wide Bandgap Trench Gate Semiconductor Device with Buried Gate | CHEN, YU | 2896 | §102§103 | Final Rejection | — | Pending | Aug 14, 2023 |
| 18346561 | POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY | KLEIN, JORDAN M | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 2812 | §103 | Final Rejection | 16d overdue | Pending | Jun 23, 2023 |
| 18340471 | Implantation for Isolated Channel Structures in Group III-Nitride Semiconductor Devices | MUSE, ISMAIL A | 2812 | §102§103 | Final Rejection | 30d | Pending | Jun 23, 2023 |
| 18340418 | LOW REVERSE LEAKAGE CURRENT POWER SCHOTTKY DIODES HAVING REDUCED CURRENT CROWDING AT THE LOWER BLOCKING JUNCTION CORNERS | HARRISON, MONICA D | 2815 | §102 | Final Rejection | 10d overdue | Pending | Jun 23, 2023 |
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 22d overdue | Pending | Jun 16, 2023 |
| 18336358 | Semiconductor Package | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 10d overdue | Pending | Jun 16, 2023 |
| 18333632 | Low Contact Resistance in Semiconductor Devices with Implanted Regions | GHEYAS, SYED I | 2893 | §102§103 | Final Rejection | 4d overdue | Pending | Jun 13, 2023 |
| 18305976 | SIGNAL LOOP BUSBARS AND SEMICONDUCTOR POWER MODULES INCLUDING THE SAME AND PROCESSES OF IMPLEMENTING THE SAME | ALONZO MILLER, RHADAMES J | 2847 | §102§103 | Non-Final OA | — | Pending | Apr 24, 2023 |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 2893 | §102§103 | Non-Final OA | 17d overdue | Pending | Apr 21, 2023 |
| 18187804 | DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | ARORA, AJAY | 2892 | §103 | Final Rejection | 23d overdue | Pending | Mar 22, 2023 |
| 18187924 | HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | §103 | Non-Final OA | 29d overdue | Pending | Mar 22, 2023 |
| 18175231 | Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices | AHMAD, KHAJA | 2813 | §103 | Final Rejection | 15d overdue | Pending | Feb 27, 2023 |
| 18169492 | Electroless Die-Attach Process for Semiconductor Packaging | ISAAC, STANETTA D | 2898 | §103 | Final Rejection | — | Pending | Feb 15, 2023 |
| 18168985 | Vias for Semiconductor Devices Formed from Multiple Etching | MIHALIOV, DMITRI | 2812 | §103 | Non-Final OA | 19d | Pending | Feb 14, 2023 |
| 18164249 | Semiconductor Structure for Improved Radio Frequency Thermal Management | PATEL, REEMA | 2812 | §103§112 | Non-Final OA | 75d | Pending | Feb 03, 2023 |
| 18161144 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Final Rejection | 45d overdue | Pending | Jan 30, 2023 |
| 18160765 | Power Semiconductor Devices Including Multiple Layer Metallization | GOODWIN, DAVID J | 2817 | §103§112 | Final Rejection | — | Pending | Jan 27, 2023 |
| 18152130 | SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD | KIELIN, ERIK J | 2814 | §103 | Final Rejection | — | Pending | Jan 09, 2023 |
| 18093343 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SELF-ALIGNED TRENCH SHIELDING REGIONS AND RELATED METHODS | CHEN, JACK S J | 2893 | §112 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18145502 | POWER ELECTRONICS PACKAGE LAYOUTS, STRUCTURES, AND/OR CONFIGURATIONS FOR ONE OR MORE POWER DEVICES AND PROCESSES IMPLEMENTING THE SAME | KLEIN, JORDAN M | 2893 | §102§103 | Non-Final OA | — | Pending | Dec 22, 2022 |
| 18063787 | TRANSISTOR DEVICES INCLUDING SELF-ALIGNED OHMIC CONTACTS AND CONTACT REGIONS AND RELATED FABRICATION METHODS | NICELY, JOSEPH C | 2813 | §103 | Non-Final OA | — | Pending | Dec 09, 2022 |
| 18074079 | Core-Shell Particle Die-Attach Material | THOMAS, JAISON P | 1762 | §102§103§112 | Non-Final OA | — | Pending | Dec 02, 2022 |
| 17977003 | SEMICONDUCTOR DEVICES WITH ADDITIONAL MESA STRUCTURES FOR REDUCED SURFACE ROUGHNESS | ANDERSON, ERIK ARTHUR | 2812 | §102§103§112 | Non-Final OA | 77d | Pending | Oct 31, 2022 |
| 17961032 | Implanted Regions for Semiconductor Structures with Deep Buried Layers | NIX, NORA TAYLOR | 2891 | §102§103 | Final Rejection | — | Pending | Oct 06, 2022 |
| 17957737 | SILICON CARBIDE DEVICE WITH SINGLE METALLIZATION PROCESS FOR OHMIC AND SCHOTTKY CONTACTS | CHEN, JACK S J | 2893 | §102§103§112 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17848526 | METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTING ACTIVE DEVICES | DINH, TUAN T | 2800 | §102§103 | Final Rejection | — | Pending | Jun 24, 2022 |
| 17138193 | PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT | CHAMPAGNE, LUNA | 3627 | §103 | Final Rejection | 13d | Pending | Dec 30, 2020 |
| 16950414 | METHODS AND APPARATUSES RELATED TO SHAPING WAFERS FABRICATED BY ION IMPLANTATION | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | Nov 17, 2020 |
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