Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
61 pending office actions • 17 art units • 51 examiners • 0 of 61 (0%) have an AI response strategy ready • 53 patents granted in the last 365 days
Wolfspeed Inc. operates within the Semiconductors, Circuits & Optics technology area with a total of 60 pending office actions. These 60 pending office actions are distributed across 17 distinct art units. This distribution shows that the number of pending actions is higher than the number of 17 distinct art units involved in the prosecution process. The company interacts with 50 distinct examiners to manage these filings.
The busiest examiner identified in the data is VALENZUELA, PATRICIA D, who is currently handling 4 busiest examiner pending office actions. These 4 busiest examiner pending office actions are a subset of the total pending office actions currently active for the company. The 50 distinct examiners assigned to the portfolio are more numerous than the 17 distinct art units where the cases are being reviewed. This indicates that many art units contain multiple examiners working on the company's matters.
Practitioners should note that VALENZUELA, PATRICIA D manages 4 busiest examiner pending office actions, while the other actions are spread among the other distinct examiners. The Semiconductors, Circuits & Optics technology area serves as the primary classification for this work. With 50 distinct examiners, the portfolio shows engagement with the patent office staff across the various art units identified in the data.
Based on the USPTO statutory response window for each pending office action. 19 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 19 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 18 (30%) |
| §102 only | 4 (7%) |
| §112 only | 1 (2%) |
| Double-patenting + other | 1 (2%) |
| Multi-statute (no §101) | 37 (61%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| VALENZUELA, PATRICIA D | 4 | 90.3% | +2.0% |
| GHEYAS, SYED I | 3 | 82.5% | +3.9% |
| DOUMBIA, MOHAMED | 2 | 72.9% | +29.6% |
| SUN, YU-HSI DAVID | 2 | 77.5% | +8.4% |
| RAMOS-DIAZ, FERNANDO JOSE | 2 | 82.4% | +1.5% |
| PRASAD, NEIL R | 2 | 85.4% | +9.8% |
| LIU, XIAOMING | 2 | 86.5% | +10.7% |
| TRAN, BINH BACH THANH | 1 | 80.8% | +12.1% |
| GIBSON, RANDY W | 1 | 75.7% | +22.2% |
| KUNEMUND, ROBERT M | 1 | 82.0% | +13.2% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 22d overdue |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 17d overdue |
| 18125655 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS | LIU, XIAOMING | 16d overdue |
| 18336358 | Semiconductor Package | VALENZUELA, PATRICIA D | 10d overdue |
| 18775934 | Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods | GHEYAS, SYED I | — |
| 18443031 | Layered Metallization in Power Semiconductor Packages | VALENZUELA, PATRICIA D | — |
| 18430866 | Power Semiconductor Devices with Stacked Layers | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17736720 | DYNAMIC PERFORMANCE OF ON-CHIP CURRENT SENSORS | SMITH, BRADLEY | 348d overdue |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | RAHIM, NILUFA | 18d overdue |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 16d overdue |
| 18154353 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2d overdue |
| 18164205 | Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer | KIM, JAY C | 5d |
| 18493838 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS | RAMOS-DIAZ, FERNANDO JOSE | 7d |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 22d |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | MAZUMDER, DIDARUL A | 33d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 16d overdue |
| 18125655 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS | LIU, XIAOMING | 16d overdue |
| 19230629 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — |
| 18930630 | DUAL INLINE POWER MODULE | TRAN, BINH BACH THANH | — |
| 18915457 | CIRCUITRY FOR ALLOWING MULTIPLE SENSORS ON A SEMICONDUCTOR DIE TO SHARE A COMMON SENSOR PAD | GIBSON, RANDY W | — |
| 18828024 | LARGE DIMENSION SILICON CARBIDE SINGLE CRYSTALLINE MATERIALS WITH REDUCED CRYSTALLOGRAPHIC STRESS | KUNEMUND, ROBERT M | — |
| 18737609 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — |
| Art Unit | Apps |
|---|---|
| 2817 | 9 |
| 2812 | 8 |
| 2897 | 7 |
| 2893 | 6 |
| 2898 | 4 |
| 2818 | 3 |
| 4100 | 2 |
| 2891 | 2 |
| 2815 | 2 |
| 2899 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19230629 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — | §102§103§112 | Non-Final OA | — | Pending | Jun 06, 2025 |
| 18930630 | DUAL INLINE POWER MODULE | TRAN, BINH BACH THANH | — | §102§103 | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18915457 | CIRCUITRY FOR ALLOWING MULTIPLE SENSORS ON A SEMICONDUCTOR DIE TO SHARE A COMMON SENSOR PAD | GIBSON, RANDY W | 2855 | §102 | Non-Final OA | — | Pending | Oct 15, 2024 |
| 18828024 | LARGE DIMENSION SILICON CARBIDE SINGLE CRYSTALLINE MATERIALS WITH REDUCED CRYSTALLOGRAPHIC STRESS | KUNEMUND, ROBERT M | 1714 | §102§103 | Non-Final OA | — | Pending | Sep 09, 2024 |
| 18792813 | POWER SEMICONDUCTOR DEVICES INCLUDING ANGLED GATE TRENCHES | ANYA, IGWE U | — | §102§103 | Non-Final OA | — | Pending | Aug 02, 2024 |
| 18782438 | Multilayer Printed Circuit Board with Filling Segment Structures | NORRIS, JEREMY C | 2847 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780825 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SHALLOW TRENCH SHIELDS AND DEEP SUPOORT SHIELDS | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18775934 | Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods | GHEYAS, SYED I | — | §103Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18742626 | TRENCH BASED SEMICONDUCTOR DEVICES WITH INCREASED PLANARITY | SUN, YU-HSI DAVID | 2817 | §102 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18737609 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — | §102§103§112 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18733442 | POWER DISCRETE PACKAGE HAVING SYMMETRIC PINOUTS AND PROCESS OF IMPLEMENTING THE SAME | BOOTH, RICHARD A | — | §103§112 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18663985 | SEMICONDUCTOR DEVICES WITH GATE BUS LAYOUTS FOR HANDLING UNCLAMPED INDUCTIVE SWITCHING CURRENT | THROCKMORTON, ROBERT EMIL | 2818 | §102§103§112 | Non-Final OA | — | Pending | May 14, 2024 |
| 18663862 | Workpiece Surface Processing System for Semiconductor Wafers | ISHAQ, ISHAQ MOHAMED SAID | 4100 | §102§103§112 | Non-Final OA | — | Pending | May 14, 2024 |
| 18655542 | SEMICONDUCTOR DEVICES HAVING METAL GATE RUNNERS WITH ASYMMETRIC OUTER GATE RUNNERS, UNEVENLY-SPACED INNER GATE RUNNERS AND/OR SPINE-RIB INNER GATE RUNNERS WITH MULTIPLE RIBS | HA, NATHAN W | — | §102§103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18636381 | POWER TRANSISTOR WITH SOFT RECOVERY BODY DIODE | ALAM, MOHAMMED R | 2897 | §102§103DP | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18612356 | POWER DEVICES WITH BARRIER METAL EXTENSION AND SEALING | GHEYAS, SYED I | — | §102§103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18610394 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND METHODS OF FORMING THE SAME | SPALLA, DAVID C | — | §102 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18607712 | SEMICONDUCTOR DEVICES HAVING INTRINSIC GATE-TO-DRAIN CAPACITANCES THAT ARE ONLY PARTLY IN SERIES WITH A GATE RESISTOR | RAMOS-DIAZ, FERNANDO JOSE | 4100 | §102§103§112 | Non-Final OA | — | Pending | Mar 18, 2024 |
| 18598866 | MOSFETS WITH IMPLANTED CHARGE COMPENSATION REGIONS | MEHTA, RATISHA | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18589080 | DC LINK SNUBBER DEVICE CONFIGURED FOR CONNECTION TO A POWER MODULE AND/OR THE LIKE AND PROCESSES OF IMPLEMENTING THE SAME | TIKU, SISAY G | 2838 | §103 | Non-Final OA | 70d | Pending | Feb 27, 2024 |
| 18586142 | DEVICE PACKAGE HAVING A CONTACTLESS SENSOR AND PROCESS OF IMPLEMENTING THE SAME | CHIU, TSZ K | 2898 | §102§103 | Final Rejection | — | Pending | Feb 23, 2024 |
| 18581339 | SILICON CARBIDE POWER DEVICES HAVING EXPANDED CREEPAGE DISTANCES | TORNOW, MARK W | 2891 | §102§103 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18443031 | Layered Metallization in Power Semiconductor Packages | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18438015 | DEVICES IMPLEMENTING SELECTIVE CAP LAYERS AND PROCESSES FOR IMPLEMENTING THE SAME | KIM, TONG-HO | 2897 | §102§103 | Final Rejection | — | Pending | Feb 09, 2024 |
| 18430866 | Power Semiconductor Devices with Stacked Layers | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18430542 | POWER SEMICONDUCTOR DEVICES INCLUDING INTEGRATED POLYSILICON DEVICES | HO, ANTHONY | 2817 | §102 | Non-Final OA | — | Pending | Feb 01, 2024 |
| 18422677 | Thermally Stable FinFET Device for High Temperature Operation | LOHAKARE, PRATIKSHA JAYANT | 2818 | §103 | Final Rejection | — | Pending | Jan 25, 2024 |
| 18422617 | Anti-Reflective Layer for Protecting an N-Polar Group III-Nitride Semiconductor Structure | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Final Rejection | — | Pending | Jan 25, 2024 |
| 18412190 | Power Semiconductor Device Having Improved Transient Handling Without Field Insulating Layer | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | MAZUMDER, DIDARUL A | 2812 | §102§103 | Final Rejection | 33d | Pending | Jan 05, 2024 |
| 18545517 | GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WITH A LOW RESISTANCE CONTACT LAYER FOR SOURCE AND/OR DRAIN CONTACTS AND PROCESS FOR IMPLEMENTING THE SAME | MENZ, DOUGLAS M | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18540135 | ASYMMETRIC EDGE TERMINATION | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Dec 14, 2023 |
| 18524126 | Underfill for Large Area Attaches for Semiconductor Packages | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 30, 2023 |
| 18518105 | REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE POWER MODULE | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18510756 | ENHANCED ISOLATION FOR ON-CHIP CURRENT SENSORS | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18502911 | POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE POWER DEVICES | SMITH, SAMUEL JONATHAN | 2817 | §102§103 | Final Rejection | 35d | Pending | Nov 06, 2023 |
| 18493838 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §102§103§112 | Final Rejection | 7d | Pending | Oct 25, 2023 |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 2817 | §102§103 | Final Rejection | 22d | Pending | Oct 17, 2023 |
| 18487665 | Multifunctional Adhesion Promoter for Semiconductor Device Packages | FANG, SHANE | 1766 | §102§103§112 | Non-Final OA | — | Pending | Oct 16, 2023 |
| 18476452 | POWER SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH SELECTIVE JFET IMPLANTS THAT ARE SELF-ALIGNED WITH THE WELL REGIONS AND METHODS OF MAKING SUCH DEVICES | NGUYEN, SOPHIA T | 2893 | §103 | Final Rejection | 39d | Pending | Sep 28, 2023 |
| 18475370 | Semiconductor Die Bonding | LIU, MIKKA H | 2817 | §103 | Final Rejection | — | Pending | Sep 27, 2023 |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | RAHIM, NILUFA | 2893 | §102§103§112 | Final Rejection | 18d overdue | Pending | Sep 27, 2023 |
| 18471003 | Corrosion Resistant Metal Structures for Wide Bandgap Semiconductor Devices | HAN, JONATHAN | 2818 | §102§103 | Non-Final OA | — | Pending | Sep 20, 2023 |
| 18456782 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2897 | §102§103Other | Final Rejection | 35d | Pending | Aug 28, 2023 |
| 18346561 | POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY | KLEIN, JORDAN M | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 2812 | §102§103 | Final Rejection | 16d overdue | Pending | Jun 23, 2023 |
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 22d overdue | Pending | Jun 16, 2023 |
| 18336358 | Semiconductor Package | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 10d overdue | Pending | Jun 16, 2023 |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 2893 | §103 | Final Rejection | 17d overdue | Pending | Apr 21, 2023 |
| 18125655 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS | LIU, XIAOMING | 2812 | §103 | Non-Final OA | 16d overdue | Pending | Mar 23, 2023 |
| 18187924 | HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | §103 | Non-Final OA | 29d overdue | Pending | Mar 22, 2023 |
| 18168985 | Vias for Semiconductor Devices Formed from Multiple Etching | MIHALIOV, DMITRI | 2812 | §103 | Non-Final OA | 19d | Pending | Feb 14, 2023 |
| 18164205 | Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer | KIM, JAY C | 2815 | §102§103 | Non-Final OA | 5d | Pending | Feb 03, 2023 |
| 18161144 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Final Rejection | 45d overdue | Pending | Jan 30, 2023 |
| 18154353 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2897 | §102§103Other | Non-Final OA | 2d overdue | Pending | Jan 13, 2023 |
| 18093343 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SELF-ALIGNED TRENCH SHIELDING REGIONS AND RELATED METHODS | CHEN, JACK S J | 2893 | §112 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18063787 | TRANSISTOR DEVICES INCLUDING SELF-ALIGNED OHMIC CONTACTS AND CONTACT REGIONS AND RELATED FABRICATION METHODS | NICELY, JOSEPH C | 2813 | §103 | Non-Final OA | — | Pending | Dec 09, 2022 |
| 17961032 | Implanted Regions for Semiconductor Structures with Deep Buried Layers | NIX, NORA TAYLOR | 2891 | §102§103 | Non-Final OA | — | Pending | Oct 06, 2022 |
| 17935509 | HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | ISAAC, STANETTA D | 2898 | §102§103 | Non-Final OA | — | Pending | Sep 26, 2022 |
| 17867801 | Multi-Cavity Package Having Single Metal Flange | WHALEN, DANIEL B | 2893 | §102§103 | Final Rejection | — | Pending | Jul 19, 2022 |
| 17736720 | DYNAMIC PERFORMANCE OF ON-CHIP CURRENT SENSORS | SMITH, BRADLEY | 2817 | §102§103§112 | Final Rejection | 348d overdue | Pending | May 04, 2022 |
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