40 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18759356 | Multi-Channel Workpiece Inspection System | HO, ALLEN C | 2884 | Non-Final OA | Jun 28, 2024 |
| 18660332 | EDGE TERMINATION FOR POWER SEMICONDUCTOR DEVICES AND RELATED FABRICATION METHODS | RAHMAN, KHATIB A | 2813 | Non-Final OA | May 10, 2024 |
| 18417295 | Thermal Management Enhancement of Electronic Components | JALALI, AMIR A. | 2835 | Non-Final OA | Jan 19, 2024 |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | MAZUMDER, DIDARUL A | 2812 | Non-Final OA | Jan 05, 2024 |
| 18394999 | Carrier-Assisted Method for Parting Crystalline Material Along Laser Damage Region | BRATLAND JR, KENNETH A | 1714 | Non-Final OA | Dec 22, 2023 |
| 18537427 | Substrates for Power Semiconductor Devices | YI, CHANGHYUN | 2812 | Non-Final OA | Dec 12, 2023 |
| 18525028 | Power Semiconductor Package | WALL, VINCENT | 2898 | Non-Final OA | Nov 30, 2023 |
| 18493838 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS | RAMOS-DIAZ, FERNANDO JOSE | 2814 | Non-Final OA | Oct 25, 2023 |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Oct 17, 2023 |
| 18482105 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SHAPED DEEP SUPPORT SHIELDS THAT REDUCE CELL PITCH AND ON-STATE RESISTANCE | YUSHIN, NIKOLAY K | 2893 | Non-Final OA | Oct 06, 2023 |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | RAHIM, NILUFA | 2893 | Non-Final OA | Sep 27, 2023 |
| 18472343 | BURIED SHIELD STRUCTURES FOR POWER SEMICONDUCTOR DEVICES INCLUDING SEGMENTED SUPPORT SHIELD STRUCTURES FOR REDUCED ON-RESISTANCE AND RELATED FABRICATION METHODS | RAHMAN, MOHAMMAD A | 2898 | Non-Final OA | Sep 22, 2023 |
| 18466031 | SEMICONDUCTOR TRANSISTORS HAVING MINIMUM GATE-TO-SOURCE VOLTAGE CLAMP CIRCUITS | QUDDUS, NUSRAT | 2838 | Non-Final OA | Sep 13, 2023 |
| 18449458 | Wide Bandgap Trench Gate Semiconductor Device with Buried Gate | CHEN, YU | 2896 | Non-Final OA | Aug 14, 2023 |
| 18358616 | Submounts with Stud Protrusions for Semiconductor Packages | INOUSSA, MOULOUCOULAY | 2818 | Non-Final OA | Jul 25, 2023 |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 2812 | Non-Final OA | Jun 23, 2023 |
| 18340418 | LOW REVERSE LEAKAGE CURRENT POWER SCHOTTKY DIODES HAVING REDUCED CURRENT CROWDING AT THE LOWER BLOCKING JUNCTION CORNERS | HARRISON, MONICA D | 2815 | Non-Final OA | Jun 23, 2023 |
| 18340503 | Topside Cooling for Semiconductor Device | PATEL, REEMA | 2812 | Final Rejection | Jun 23, 2023 |
| 18337657 | INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICATIONS AND METHODS OF FABRICATING THE SAME | ANDERSON, ERIK ARTHUR | 2812 | Final Rejection | Jun 20, 2023 |
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jun 16, 2023 |
| 18336358 | Semiconductor Package | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jun 16, 2023 |
| 18333632 | Low Contact Resistance in Semiconductor Devices with Implanted Regions | GHEYAS, SYED I | 2893 | Final Rejection | Jun 13, 2023 |
| 18138240 | SEMICONDUCTOR DEVICES WITH LOW BARRIER HEIGHT SCHOTTKY CONTACTS | HARRISON, MONICA D | 2815 | Final Rejection | Apr 24, 2023 |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 2893 | Final Rejection | Apr 21, 2023 |
| 18187924 | HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | Final Rejection | Mar 22, 2023 |
| 18187804 | DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | ARORA, AJAY | 2892 | Non-Final OA | Mar 22, 2023 |
| 18175231 | Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices | AHMAD, KHAJA | 2813 | Non-Final OA | Feb 27, 2023 |
| 18168985 | Vias for Semiconductor Devices Formed from Multiple Etching | MIHALIOV, DMITRI | 2812 | Final Rejection | Feb 14, 2023 |
| 18107537 | POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DIE FOR ENHANCED MECHANICAL ROBUSTNESS AND REDUCED STRESS AND ELECTRIC FIELD CONCENTRATIONS | AHMED, SHAHED | 2813 | Non-Final OA | Feb 09, 2023 |
| 18164205 | Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer | KIM, JAY C | 2815 | Final Rejection | Feb 03, 2023 |
| 18161144 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION | CHOUDHRY, MOHAMMAD M | 2899 | Non-Final OA | Jan 30, 2023 |
| 18154353 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2897 | Final Rejection | Jan 13, 2023 |
| 18145502 | POWER ELECTRONICS PACKAGE LAYOUTS, STRUCTURES, AND/OR CONFIGURATIONS FOR ONE OR MORE POWER DEVICES AND PROCESSES IMPLEMENTING THE SAME | KLEIN, JORDAN M | 2893 | Final Rejection | Dec 22, 2022 |
| 18074079 | Core-Shell Particle Die-Attach Material | THOMAS, JAISON P | 1762 | Final Rejection | Dec 02, 2022 |
| 17966081 | METHODS OF FORMING SEMICONDUCTOR STRUCTURES AND RESULTING SEMICONDUCTOR STRUCTURES | DUREN, TIMOTHY EDWARD | 2817 | Non-Final OA | Oct 14, 2022 |
| 17961032 | Implanted Regions for Semiconductor Structures with Deep Buried Layers | NIX, NORA TAYLOR | 2891 | Non-Final OA | Oct 06, 2022 |
| 17893277 | ELECTRONIC DEVICES WITH REDUCED OHMIC TO OHMIC DIMENSIONS | TRAN, TAN N | 2812 | Non-Final OA | Aug 23, 2022 |
| 17867801 | Multi-Cavity Package Having Single Metal Flange | WHALEN, DANIEL B | 2893 | Final Rejection | Jul 19, 2022 |
| 17138193 | PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT | CHAMPAGNE, LUNA | 3627 | Non-Final OA | Dec 30, 2020 |
| 16704644 | Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection | BOYLE, ABBIGALE A | 2899 | Final Rejection | Dec 05, 2019 |
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