Prosecution Insights
Prosecution Insights
46 pending office actions • 17 art units • 42 examiners • 0 of 46 (0%) have an AI response strategy ready • 49 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 46 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 46 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 36 (78%) |
| §102 only | 5 (11%) |
| §112 only | 4 (9%) |
| No statute on record | 1 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| PRASAD, NEIL R | 2 | 85.2% | +9.4% |
| ANDERSON, ERIK ARTHUR | 2 | 92.9% | +15.0% |
| GHEYAS, SYED I | 2 | 82.5% | +4.3% |
| AHMAD, KHAJA | 2 | 80.9% | +26.6% |
| HO, ALLEN C | 1 | 86.8% | +17.7% |
| CHI, SUBERR L | 1 | 84.2% | +2.8% |
| TIKU, SISAY G | 1 | 91.4% | +9.4% |
| JALALI, AMIR A. | 1 | 78.6% | +22.0% |
| MAZUMDER, DIDARUL A | 1 | 86.5% | +8.1% |
| BRATLAND JR, KENNETH A | 1 | 56.3% | +16.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 17d overdue |
| 18175231 | Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices | AHMAD, KHAJA | 15d overdue |
| 18333632 | Low Contact Resistance in Semiconductor Devices with Implanted Regions | GHEYAS, SYED I | 4d overdue |
| 18154353 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2d overdue |
| 18759356 | Multi-Channel Workpiece Inspection System | HO, ALLEN C | 22d |
| 18337657 | INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICATIONS AND METHODS OF FABRICATING THE SAME | ANDERSON, ERIK ARTHUR | 27d |
| 18680764 | Treatments for Improving Fracture Strength for Semiconductor Workpiece | CHI, SUBERR L | 30d |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | MAZUMDER, DIDARUL A | 33d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18417295 | Thermal Management Enhancement of Electronic Components | JALALI, AMIR A. | 15d overdue |
| 18175231 | Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices | AHMAD, KHAJA | 15d overdue |
| 18394999 | Carrier-Assisted Method for Parting Crystalline Material Along Laser Damage Region | BRATLAND JR, KENNETH A | 1d overdue |
| 18759356 | Multi-Channel Workpiece Inspection System | HO, ALLEN C | 22d |
| 18337657 | INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICATIONS AND METHODS OF FABRICATING THE SAME | ANDERSON, ERIK ARTHUR | 27d |
| 18121782 | METAL STACK WITH PHONON SCATTERING LAYER THAT FORMS A NON-OHMIC CONTACT TO A SEMICONDUCTOR LAYER | AHMAD, KHAJA | 34d |
| 17977003 | SEMICONDUCTOR DEVICES WITH ADDITIONAL MESA STRUCTURES FOR REDUCED SURFACE ROUGHNESS | ANDERSON, ERIK ARTHUR | 77d |
| Art Unit | Apps |
|---|---|
| 2812 | 10 |
| 2893 | 8 |
| 2897 | 4 |
| 2813 | 4 |
| 2817 | 3 |
| 2815 | 3 |
| 2899 | 3 |
| 2838 | 2 |
| 2884 | 1 |
| 2835 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18759356 | Multi-Channel Workpiece Inspection System | HO, ALLEN C | 2884 | §103 | Non-Final OA | 22d | Pending | Jun 28, 2024 |
| 18680764 | Treatments for Improving Fracture Strength for Semiconductor Workpiece | CHI, SUBERR L | 2893 | §102 | Non-Final OA | 30d | Pending | May 31, 2024 |
| 18589080 | DC LINK SNUBBER DEVICE CONFIGURED FOR CONNECTION TO A POWER MODULE AND/OR THE LIKE AND PROCESSES OF IMPLEMENTING THE SAME | TIKU, SISAY G | 2838 | §103 | Final Rejection | 70d | Pending | Feb 27, 2024 |
| 18417295 | Thermal Management Enhancement of Electronic Components | JALALI, AMIR A. | 2835 | §103 | Non-Final OA | 15d overdue | Pending | Jan 19, 2024 |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | MAZUMDER, DIDARUL A | 2812 | §103 | Non-Final OA | 33d | Pending | Jan 05, 2024 |
| 18394999 | Carrier-Assisted Method for Parting Crystalline Material Along Laser Damage Region | BRATLAND JR, KENNETH A | 1714 | §103 | Non-Final OA | 1d overdue | Pending | Dec 22, 2023 |
| 18541571 | Engineered Interconnect Structures for Enhanced Bonding Strength | ALAM, MOHAMMED R | 2897 | §103 | Non-Final OA | 84d | Pending | Dec 15, 2023 |
| 18537427 | Substrates for Power Semiconductor Devices | YI, CHANGHYUN | 2812 | §103 | Non-Final OA | 10d overdue | Pending | Dec 12, 2023 |
| 18526986 | MULTI-GATE SWITCH FIELD EFFECT TRANSISTOR | BOWEN, ADAM S | 2897 | §103 | Non-Final OA | 41d | Pending | Dec 01, 2023 |
| 18502911 | POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE POWER DEVICES | SMITH, SAMUEL JONATHAN | 2817 | §103 | Non-Final OA | 35d | Pending | Nov 06, 2023 |
| 18493838 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §103 | Non-Final OA | 7d | Pending | Oct 25, 2023 |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 2817 | §103 | Non-Final OA | 22d | Pending | Oct 17, 2023 |
| 18482105 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SHAPED DEEP SUPPORT SHIELDS THAT REDUCE CELL PITCH AND ON-STATE RESISTANCE | YUSHIN, NIKOLAY K | 2893 | §102 | Non-Final OA | 24d overdue | Pending | Oct 06, 2023 |
| 18476452 | POWER SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH SELECTIVE JFET IMPLANTS THAT ARE SELF-ALIGNED WITH THE WELL REGIONS AND METHODS OF MAKING SUCH DEVICES | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 39d | Pending | Sep 28, 2023 |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | 18d overdue | Pending | Sep 27, 2023 |
| 18472343 | BURIED SHIELD STRUCTURES FOR POWER SEMICONDUCTOR DEVICES INCLUDING SEGMENTED SUPPORT SHIELD STRUCTURES FOR REDUCED ON-RESISTANCE AND RELATED FABRICATION METHODS | RAHMAN, MOHAMMAD A | 2898 | §112 | Non-Final OA | 5d overdue | Pending | Sep 22, 2023 |
| 18466031 | SEMICONDUCTOR TRANSISTORS HAVING MINIMUM GATE-TO-SOURCE VOLTAGE CLAMP CIRCUITS | QUDDUS, NUSRAT | 2838 | §103 | Non-Final OA | 26d overdue | Pending | Sep 13, 2023 |
| 18456782 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2897 | §103 | Non-Final OA | 35d | Pending | Aug 28, 2023 |
| 18453414 | POWER SEMICONDUCTOR DEVICES HAVING GATE TRENCHES WITH ASYMMETRICALLY ROUNDED UPPER AND LOWER TRENCH CORNERS AND/OR RECESSED GATE ELECTRODES AND METHODS OF FABRICATING SUCH DEVICES | CHEN, YU | 2896 | §102 | Non-Final OA | 56d | Pending | Aug 22, 2023 |
| 18355683 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS | CHAN, CANDICE | 2813 | §103 | Non-Final OA | 43d | Pending | Jul 20, 2023 |
| 18340418 | LOW REVERSE LEAKAGE CURRENT POWER SCHOTTKY DIODES HAVING REDUCED CURRENT CROWDING AT THE LOWER BLOCKING JUNCTION CORNERS | HARRISON, MONICA D | 2815 | §102 | Non-Final OA | 10d overdue | Pending | Jun 23, 2023 |
| 18340471 | Implantation for Isolated Channel Structures in Group III-Nitride Semiconductor Devices | MUSE, ISMAIL A | 2812 | §103 | Final Rejection | 30d | Pending | Jun 23, 2023 |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 2812 | §103 | Non-Final OA | 16d overdue | Pending | Jun 23, 2023 |
| 18337657 | INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICATIONS AND METHODS OF FABRICATING THE SAME | ANDERSON, ERIK ARTHUR | 2812 | §112 | Final Rejection | 27d | Pending | Jun 20, 2023 |
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 22d overdue | Pending | Jun 16, 2023 |
| 18333632 | Low Contact Resistance in Semiconductor Devices with Implanted Regions | GHEYAS, SYED I | 2893 | §103 | Final Rejection | 4d overdue | Pending | Jun 13, 2023 |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 2893 | §103 | Final Rejection | 17d overdue | Pending | Apr 21, 2023 |
| 18302843 | SEMICONDUCTOR POWER DEVICES HAVING MULTIPLE GATE TRENCHES AND METHODS OF FORMING SUCH DEVICES | ANYA, IGWE U | 2891 | §103 | Final Rejection | 43d | Pending | Apr 19, 2023 |
| 18187924 | HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | Other | Non-Final OA | 29d overdue | Pending | Mar 22, 2023 |
| 18187804 | DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | ARORA, AJAY | 2892 | §102 | Non-Final OA | 23d overdue | Pending | Mar 22, 2023 |
| 18121782 | METAL STACK WITH PHONON SCATTERING LAYER THAT FORMS A NON-OHMIC CONTACT TO A SEMICONDUCTOR LAYER | AHMAD, KHAJA | 2813 | §103 | Final Rejection | 34d | Pending | Mar 15, 2023 |
| 18175231 | Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices | AHMAD, KHAJA | 2813 | §103 | Non-Final OA | 15d overdue | Pending | Feb 27, 2023 |
| 18168985 | Vias for Semiconductor Devices Formed from Multiple Etching | MIHALIOV, DMITRI | 2812 | §103 | Final Rejection | 19d | Pending | Feb 14, 2023 |
| 18107537 | POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DIE FOR ENHANCED MECHANICAL ROBUSTNESS AND REDUCED STRESS AND ELECTRIC FIELD CONCENTRATIONS | AHMED, SHAHED | 2813 | §103 | Non-Final OA | 11d overdue | Pending | Feb 09, 2023 |
| 18164205 | Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer | KIM, JAY C | 2815 | §103 | Non-Final OA | 5d | Pending | Feb 03, 2023 |
| 18164249 | Semiconductor Structure for Improved Radio Frequency Thermal Management | PATEL, REEMA | 2812 | §112 | Non-Final OA | 75d | Pending | Feb 03, 2023 |
| 18161144 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | 45d overdue | Pending | Jan 30, 2023 |
| 18154353 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2897 | §103 | Final Rejection | 2d overdue | Pending | Jan 13, 2023 |
| 17977003 | SEMICONDUCTOR DEVICES WITH ADDITIONAL MESA STRUCTURES FOR REDUCED SURFACE ROUGHNESS | ANDERSON, ERIK ARTHUR | 2812 | §112 | Non-Final OA | 77d | Pending | Oct 31, 2022 |
| 17893277 | ELECTRONIC DEVICES WITH REDUCED OHMIC TO OHMIC DIMENSIONS | TRAN, TAN N | 2812 | §103 | Final Rejection | 72d | Pending | Aug 23, 2022 |
| 17849037 | METHODS OF FORMING UNIFORMLY DOPED DEEP IMPLANTED REGIONS IN SILICON CARBIDE AND SILICON CARBIDE LAYERS INCLUDING UNIFORMLY DOPED IMPLANTED REGIONS | SEHAR, FAKEHA | 2893 | §103 | Final Rejection | 55d | Pending | Jun 24, 2022 |
| 17736720 | DYNAMIC PERFORMANCE OF ON-CHIP CURRENT SENSORS | SMITH, BRADLEY | 2817 | §103 | Non-Final OA | 348d overdue | Pending | May 04, 2022 |
| 17705172 | POWER SEMICONDUCTOR DEVICE WITH SHALLOW CONDUCTION REGION | BOATMAN, CASEY PAUL | 2893 | §103 | Final Rejection | 33d | Pending | Mar 25, 2022 |
| 17138193 | PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT | CHAMPAGNE, LUNA | 3627 | §103 | Non-Final OA | 13d | Pending | Dec 30, 2020 |
| 16704644 | Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection | BOYLE, ABBIGALE A | 2899 | §103 | Final Rejection | 22d | Pending | Dec 05, 2019 |
| 14212991 | IGBT STRUCTURE FOR WIDE BAND-GAP SEMICONDUCTOR MATERIALS | CHEN, DAVID Z | 2815 | §103 | Final Rejection | 40d | Pending | Mar 14, 2014 |
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