39 pending office actions • 1 client
| Client (Assignee) | Pending OAs |
|---|---|
| Micron Technology, Inc. | 39 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 19026306 | MEMORY DEVICE WITH DYNAMIC CACHE MANAGEMENT | Micron Technology, Inc. | ROJAS, MIDYS | 2133 | Non-Final OA | Jan 16, 2025 |
| 18979404 | ERROR INJECTION METHODS USING SOFT POST-PACKAGE REPAIR (sPPR) TECHNIQUES AND MEMORY DEVICES AND MEMORY SYSTEMS EMPLOYING THE SAME | Micron Technology, Inc. | SCHELL, JOSEPH O | 2114 | Non-Final OA | Dec 12, 2024 |
| 18965820 | CACHE MEMORIES IN VERTICALLY INTEGRATED MEMORY SYSTEMS AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | SAIN, GAUTAM | 2135 | Non-Final OA | Dec 02, 2024 |
| 18789682 | VOLTAGE-THRESHOLD VIOLATION DETECTION CIRCUITS IN MEMORY DEVICES AND SYSTEMS | Micron Technology, Inc. | NGUYEN, VAN THU T | 2824 | Non-Final OA | Jul 31, 2024 |
| 18789344 | SEMICONDUCTOR MEMORY DEVICE WITH PER-CHANNEL ALERT OF ROW HAMMER ATTACK | Micron Technology, Inc. | TANG, ANTHONY THINH | 2827 | Non-Final OA | Jul 30, 2024 |
| 18749416 | VERTICALLY INTEGRATED MEMORY SYSTEM AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | HIDALGO, FERNANDO N | 2827 | Non-Final OA | Jun 20, 2024 |
| 18652581 | PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT | Micron Technology, Inc. | TRAN, BINH BACH THANH | 2848 | Non-Final OA | May 01, 2024 |
| 18649986 | SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT | Micron Technology, Inc. | ABDELAZIEZ, YASSER A | 2898 | Non-Final OA | Apr 29, 2024 |
| 18625212 | MEMORY DEVICE WITH MULTIPLE PHYSICAL INTERFACES | Micron Technology, Inc. | TRAN, ANTHAN | 2825 | Non-Final OA | Apr 03, 2024 |
| 18614583 | SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS | Micron Technology, Inc. | JEAN BAPTISTE, WILNER | 2899 | Non-Final OA | Mar 22, 2024 |
| 18424766 | STRING DRIVER WITH THROUGH SILICON ISOLATION | Micron Technology, Inc. | REIDA, MOLLY KAY | 2899 | Non-Final OA | Jan 27, 2024 |
| 18407428 | STACKED SEMICONDUCTOR DEVICE | Micron Technology, Inc. | BRECHT, CHARLES MATTHEW | 2817 | Non-Final OA | Jan 08, 2024 |
| 18406068 | HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | NGUYEN, CUONG B | 2818 | Non-Final OA | Jan 05, 2024 |
| 18403103 | SEMICONDUCTOR DEVICE WITH VERTICAL BODY CONTACT AND METHODS FOR MANUFACTURING THE SAME | Micron Technology, Inc. | CUNNINGHAM, KIERAN MURRAY | 2893 | Non-Final OA | Jan 03, 2024 |
| 18514563 | ENGINEERED SEMICONDUCTOR SUBSTRATE | Micron Technology, Inc. | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Nov 20, 2023 |
| 18514763 | COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY | Micron Technology, Inc. | MENZ, LAURA MARY | 2813 | Non-Final OA | Nov 20, 2023 |
| 18508239 | SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS | Micron Technology, Inc. | LEE, KYOUNG | 2817 | Non-Final OA | Nov 14, 2023 |
| 18507019 | APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS | Micron Technology, Inc. | LIU, XIAOMING | 2812 | Non-Final OA | Nov 10, 2023 |
| 18505928 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME | Micron Technology, Inc. | GARCES, NELSON Y | 2814 | Non-Final OA | Nov 09, 2023 |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | Micron Technology, Inc. | SEVEN, EVREN | 2812 | Non-Final OA | Aug 23, 2023 |
| 18237174 | SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION | Micron Technology, Inc. | RAMIREZ, ALEXANDRE XAVIER | 2812 | Non-Final OA | Aug 23, 2023 |
| 18320930 | SOLID-STATE TRANSDUCER ASSEMBLIES WITH REMOTE CONVERTER MATERIAL FOR IMPROVED LIGHT EXTRACTION EFFICIENCY AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | MUSE, ISMAIL A | 2812 | Final Rejection | May 19, 2023 |
| 18111424 | MODIFIED SEMICONDUCTOR DIE CARRIER AND CARRIER TAPE | Micron Technology, Inc. | TURNER, BRIAN | 2818 | Final Rejection | Feb 17, 2023 |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | Micron Technology, Inc. | DYKES, LAURA M | 2892 | Non-Final OA | Feb 17, 2023 |
| 18111496 | SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFACES OF 3D STRUCTURES | Micron Technology, Inc. | FAYETTE, NATHALIE RENEE | 2812 | Final Rejection | Feb 17, 2023 |
| 18151378 | METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYSTEMS | Micron Technology, Inc. | PURVIS, SUE A | 2893 | Final Rejection | Jan 06, 2023 |
| 17976625 | SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | HOQUE, MOHAMMAD M | 2817 | Final Rejection | Oct 28, 2022 |
| 17937358 | APPARATUS WITH DYNAMIC ARBITRATION MECHANISM AND METHODS FOR OPERATING THE SAME | Micron Technology, Inc. | YUN, CARINA | 2194 | Non-Final OA | Sep 30, 2022 |
| 17899577 | SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME | Micron Technology, Inc. | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | Final Rejection | Aug 30, 2022 |
| 17898184 | APPARATUS INCLUDING ADJUSTED WELLS AND METHODS OF MANUFACTURING THE SAME | Micron Technology, Inc. | HELBERG, DAVID MICHAEL | 2815 | Final Rejection | Aug 29, 2022 |
| 17894063 | SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT | Micron Technology, Inc. | FAN, SU JYA | 2818 | Final Rejection | Aug 23, 2022 |
| 17892034 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILICON VIAS FOR CONTROLLER ATTACHMENT | Micron Technology, Inc. | ZABEL, ANDREW JOHN | 2818 | Non-Final OA | Aug 19, 2022 |
| 17888324 | SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | IQBAL, HAMNA FATHIMA | 2817 | Final Rejection | Aug 15, 2022 |
| 17885439 | SEMICONDUCTOR DEVICE WITH POWER-SAVING MODE AND ASSOCIATED METHODS AND SYSTEMS | Micron Technology, Inc. | KERVEROS, DEMETRIOS C | 2111 | Final Rejection | Aug 10, 2022 |
| 17884484 | THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES | Micron Technology, Inc. | WYATT, JOSHUA SCOTT | 2815 | Final Rejection | Aug 09, 2022 |
| 17882441 | MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIATED SYSTEMS AND DEVICES | Micron Technology, Inc. | NGUYEN, DUY T V | 2818 | Non-Final OA | Aug 05, 2022 |
| 17874206 | HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATED METHODS | Micron Technology, Inc. | DAS, PINAKI | 2898 | Final Rejection | Jul 26, 2022 |
| 17741200 | WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INTO MOLD | Micron Technology, Inc. | SCHODDE, CHRISTOPHER A | 2898 | Final Rejection | May 10, 2022 |
| 16826651 | VIAS AND CONDUCTIVE ROUTING LAYERS IN SEMICONDUCTOR SUBSTRATES | Micron Technology, Inc. | ISAAC, STANETTA D | 2898 | Non-Final OA | Mar 23, 2020 |
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