Prosecution Insights
Prosecution Insights
52 pending office actions • 22 art units • 46 examiners • 0 of 52 (0%) have an AI response strategy ready • 211 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 49 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 49 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 40 (77%) |
| §102 only | 6 (12%) |
| §112 only | 5 (10%) |
| No statute on record | 1 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SHAH, NEEL D | 2 | 86.9% | +7.3% |
| DYKES, LAURA M | 2 | 65.3% | +27.2% |
| JAHAN, BILKIS | 2 | 88.5% | +10.4% |
| BARZYKIN, VICTOR V | 2 | 81.9% | +3.8% |
| BULLARD-CONNOR, GENEVIEVE GRACE | 2 | 50.0% | +0.0% |
| DAS, PINAKI | 2 | 92.1% | +0.3% |
| GAMINO, CARLOS J | 1 | 35.3% | +46.0% |
| NGUYEN, SANG H | 1 | 88.6% | +11.8% |
| CHUNG, MONG-SHUNE | 1 | 76.1% | +22.3% |
| NGUYEN, THUKHANH T | 1 | 74.4% | +10.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18402774 | PROBE HEAD FOR LOOPBACK TESTING AND METHODS OF FORMING THE SAME | SHAH, NEEL D | 46d overdue |
| 18393846 | COPLANARITY ASSIST UNIT, SEMICONDUCTOR TESTING APPARATUS INCLUDING THE COPLANARITY ASSIST UNIT AND METHOD OF SETTING COPLANARITY | SHAH, NEEL D | 32d overdue |
| 18455698 | PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 8d overdue |
| 18514243 | SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING THE SAME | JAHAN, BILKIS | 4d overdue |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 3d overdue |
| 18218222 | SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF | BARZYKIN, VICTOR V | 16d |
| 18230720 | SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-WAFER BONDING AND METHODS OF FORMING THE SAME | BARZYKIN, VICTOR V | 21d |
| 18743329 | INSPECTION TOOL FOR FIBER ARRAY UNIT (FAU) QUALITY MONITORING IN THE CO-PACKAGED OPTICS APPLICATION AND METHODS FOR INSPECTING USNG THE SAME | NGUYEN, SANG H | 30d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18731672 | EMERGENCY RESPONSE SYSTEM | CHUNG, MONG-SHUNE | 43d overdue |
| 18789626 | MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME | GAMINO, CARLOS J | 38d overdue |
| 18455698 | PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 8d overdue |
| 18514243 | SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING THE SAME | JAHAN, BILKIS | 4d overdue |
| 18675189 | DIE EJECTOR HAVING INDEPENDENTLY ENGAGED EJECTOR RODS, METHOD OF PERFORMING DIE PICK-UP WITH THE DIE EJECTOR, AND DIE EJECTOR SYSTEM INCLUDING THE DIE EJECTOR | NGUYEN, THUKHANH T | 29d |
| 18743329 | INSPECTION TOOL FOR FIBER ARRAY UNIT (FAU) QUALITY MONITORING IN THE CO-PACKAGED OPTICS APPLICATION AND METHODS FOR INSPECTING USNG THE SAME | NGUYEN, SANG H | 30d |
| 18538093 | Semiconductor Devices Having an Electro-static Discharge Protection Structure | DYKES, LAURA M | 34d |
| 18327908 | FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME | DYKES, LAURA M | — |
| Art Unit | Apps |
|---|---|
| 2818 | 7 |
| 2817 | 6 |
| 2893 | 6 |
| 2896 | 4 |
| 2898 | 4 |
| 2892 | 3 |
| 2899 | 3 |
| 2812 | 2 |
| 2874 | 2 |
| 2858 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18789626 | MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME | GAMINO, CARLOS J | 1735 | §103 | Non-Final OA | 38d overdue | Pending | Jul 30, 2024 |
| 18743329 | INSPECTION TOOL FOR FIBER ARRAY UNIT (FAU) QUALITY MONITORING IN THE CO-PACKAGED OPTICS APPLICATION AND METHODS FOR INSPECTING USNG THE SAME | NGUYEN, SANG H | 2877 | §103 | Non-Final OA | 30d | Pending | Jun 14, 2024 |
| 18731672 | EMERGENCY RESPONSE SYSTEM | CHUNG, MONG-SHUNE | 2118 | §103 | Non-Final OA | 43d overdue | Pending | Jun 03, 2024 |
| 18675189 | DIE EJECTOR HAVING INDEPENDENTLY ENGAGED EJECTOR RODS, METHOD OF PERFORMING DIE PICK-UP WITH THE DIE EJECTOR, AND DIE EJECTOR SYSTEM INCLUDING THE DIE EJECTOR | NGUYEN, THUKHANH T | 1743 | §103 | Non-Final OA | 29d | Pending | May 28, 2024 |
| 18662146 | DEEP TRENCH CAPACITOR INCLUDING A COMPACT CONTACT REGION AND METHODS OF FORMING THE SAME | WIEGAND, TYLER J | 2812 | §103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18422479 | MEMORY DEVICE WITH FLAT-TOP BOTTOM ELECTRODES AND METHODS FOR FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | §112 | Non-Final OA | 35d overdue | Pending | Jan 25, 2024 |
| 18415751 | WAFER RETAINING DEVICE | NEJAD, MAHDI H | 3723 | §112 | Non-Final OA | 23d | Pending | Jan 18, 2024 |
| 18412021 | APPARATUS AND METHOD FOR GENERATING AN OPTICAL SIGNAL | RADKOWSKI, PETER | 2874 | §103 | Non-Final OA | 21d | Pending | Jan 12, 2024 |
| 18411068 | FIBER ARRAY UNIT INCLUDING FRONT SIDE MIRROR AND METHOD OF MAKING THE SAME | KIANNI, KAVEH C | 2874 | §103 | Non-Final OA | 20d | Pending | Jan 12, 2024 |
| 18409922 | Systems and Methods for Classifying PUF Signature Modules of Integrated Circuits | CATTUNGAL, DEREENA T | 2431 | §103 | Final Rejection | 28d | Pending | Jan 11, 2024 |
| 18402774 | PROBE HEAD FOR LOOPBACK TESTING AND METHODS OF FORMING THE SAME | SHAH, NEEL D | 2858 | §103 | Non-Final OA | 46d overdue | Pending | Jan 03, 2024 |
| 18393829 | PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORMING THE SAME | NGUYEN, NIKI HOANG | 2818 | §103 | Non-Final OA | 12d | Pending | Dec 22, 2023 |
| 18393846 | COPLANARITY ASSIST UNIT, SEMICONDUCTOR TESTING APPARATUS INCLUDING THE COPLANARITY ASSIST UNIT AND METHOD OF SETTING COPLANARITY | SHAH, NEEL D | 2858 | §103 | Non-Final OA | 32d overdue | Pending | Dec 22, 2023 |
| 18538093 | Semiconductor Devices Having an Electro-static Discharge Protection Structure | DYKES, LAURA M | 2892 | §103 | Final Rejection | 34d | Pending | Dec 13, 2023 |
| 18526086 | PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTOR DIE AND A THERMALLY CONDUCTIVE UNDERFILL LAYER ON THE BACKSIDE METAL FILM AND METHODS OF FORMING THE SAME | HENRY, CALEB E | 2818 | §102 | Non-Final OA | 23d | Pending | Dec 01, 2023 |
| 18515396 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | TAYLOR, EARL N | 2896 | §102 | Non-Final OA | 15d | Pending | Nov 21, 2023 |
| 18514243 | SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING THE SAME | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | 4d overdue | Pending | Nov 20, 2023 |
| 18470557 | FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHODS OF FORMING THE SAME | PATERSON, BRIGITTE A | 2896 | §103 | Non-Final OA | 29d | Pending | Sep 20, 2023 |
| 18464399 | SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS FOR FORMING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §103 | Non-Final OA | 26d | Pending | Sep 11, 2023 |
| 18455698 | PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | 8d overdue | Pending | Aug 25, 2023 |
| 18230720 | SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-WAFER BONDING AND METHODS OF FORMING THE SAME | BARZYKIN, VICTOR V | 2893 | §103 | Non-Final OA | 21d | Pending | Aug 07, 2023 |
| 18230756 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | BOATMAN, CASEY PAUL | 2893 | §103 | Final Rejection | 71d | Pending | Aug 07, 2023 |
| 18358341 | MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHODS FOR FORMING THE SAME | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | 34d | Pending | Jul 25, 2023 |
| 18357797 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | BOULGHASSOUL, YOUNES | 2814 | §103 | Non-Final OA | 36d overdue | Pending | Jul 24, 2023 |
| 18354680 | CAPACITOR HAVING A BOTTOM CAPACITOR PLATE WITH A ROUGH UPPER SURFACE, SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR AND AND METHODS OF FORMING THE SAME | VU, DAVID | 2818 | §103 | Non-Final OA | 4d overdue | Pending | Jul 19, 2023 |
| 18349412 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME | FAN, SU JYA | 2818 | §103 | Non-Final OA | 22d overdue | Pending | Jul 10, 2023 |
| 18346925 | SEMICONDUCTOR DEVICE INCLUDING A METAL OXIDE INTERFACE LAYER AND METHODS FOR FORMING THE SAME | WARREN, MATTHEW E | 2815 | §103 | Non-Final OA | 37d overdue | Pending | Jul 05, 2023 |
| 18218222 | SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF | BARZYKIN, VICTOR V | 2893 | §103 | Non-Final OA | 16d | Pending | Jul 05, 2023 |
| 18206876 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ZHONG, XIN Y | 2855 | §103 | Non-Final OA | 26d overdue | Pending | Jun 07, 2023 |
| 18327908 | FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME | DYKES, LAURA M | 2892 | §112 | Final Rejection | — | Pending | Jun 02, 2023 |
| 18323481 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | WILCZEWSKI, MARY A | 2898 | §112 | Non-Final OA | 34d | Pending | May 25, 2023 |
| 18321081 | PHASE CHANGE MATERIAL SWITCH WITH REDUCED INSERTION LOSS AND METHODS FOR FORMING THE SAME | AMER, MOUNIR S | 2818 | §103 | Non-Final OA | 15d overdue | Pending | May 22, 2023 |
| 18321129 | PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 29d overdue | Pending | May 22, 2023 |
| 18196070 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | JEAN BAPTISTE, WILNER | 2899 | §102 | Non-Final OA | 9d | Pending | May 11, 2023 |
| 18311907 | THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND METHODS OF FORMING THE SAME | HO, ANTHONY | 2817 | §102 | Non-Final OA | 10d overdue | Pending | May 04, 2023 |
| 18303641 | CHIP PACKAGE AND METHODS FOR FORMING THE SAME | PHAM, LONG | 2897 | §102 | Non-Final OA | 26d | Pending | Apr 20, 2023 |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | CHAN, CANDICE | 2813 | §103 | Final Rejection | 40d | Pending | Mar 27, 2023 |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | CHANG, JAY C | 2817 | §102 | Non-Final OA | 10d overdue | Pending | Mar 01, 2023 |
| 18110009 | THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 40d | Pending | Feb 15, 2023 |
| 18109211 | BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND METHODS OF FORMING THE SAME | PARENDO, KEVIN A | 2896 | Other | Non-Final OA | 15d overdue | Pending | Feb 13, 2023 |
| 17842672 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 28d | Pending | Jun 16, 2022 |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 2898 | §103 | Non-Final OA | 3d overdue | Pending | Jun 02, 2022 |
| 17828066 | SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 2898 | §103 | Non-Final OA | 34d | Pending | May 31, 2022 |
| 17738169 | TRANSISTOR STRUCTURE HAVING REDUCED CONTACT RESISTANCE AND METHODS OF FORMING THE SAME | WINTERS, SEAN AYERS | 2892 | §103 | Non-Final OA | 78d overdue | Pending | May 06, 2022 |
| 17735536 | MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME | NGUYEN, CUONG B | 2818 | §103 | Non-Final OA | 4d overdue | Pending | May 03, 2022 |
| 17708348 | SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS OF FORMING THE SAME | DINKE, BITEW A | 2812 | §112 | Non-Final OA | 14d | Pending | Mar 30, 2022 |
| 17654927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | BELL, LAUREN R | 2896 | §103 | Non-Final OA | 1d overdue | Pending | Mar 15, 2022 |
| 17693534 | DYNAMIC RANDOM ACCESS MEMORY DEVICES WITH ENHANCED DATA RETENTION AND METHODS OF FORMING THE SAME | BAUMAN, SCOTT E | 2815 | §103 | Non-Final OA | 8d overdue | Pending | Mar 14, 2022 |
| 17654158 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | ANDERSON, WILLIAM H | 2817 | §103 | Final Rejection | — | Pending | Mar 09, 2022 |
| 17653780 | SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORMATION AND REMOVAL | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | 54d | Pending | Mar 07, 2022 |
| 17647526 | SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION | KURPLE, KARL | 1717 | §103 | Non-Final OA | 13d | Pending | Jan 10, 2022 |
| 17458751 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | ISAAC, STANETTA D | 2898 | §103 | Non-Final OA | 6d | Pending | Aug 27, 2021 |
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