68 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18789626 | MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME | GAMINO, CARLOS J | 1735 | Non-Final OA | Jul 30, 2024 |
| 18731672 | EMERGENCY RESPONSE SYSTEM | CHUNG, MONG-SHUNE | 2118 | Non-Final OA | Jun 03, 2024 |
| 18675189 | DIE EJECTOR HAVING INDEPENDENTLY ENGAGED EJECTOR RODS, METHOD OF PERFORMING DIE PICK-UP WITH THE DIE EJECTOR, AND DIE EJECTOR SYSTEM INCLUDING THE DIE EJECTOR | NGUYEN, THUKHANH T | 1743 | Non-Final OA | May 28, 2024 |
| 18422479 | MEMORY DEVICE WITH FLAT-TOP BOTTOM ELECTRODES AND METHODS FOR FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | Non-Final OA | Jan 25, 2024 |
| 18421102 | TUNABLE PHOTONIC COUPLERS FOR ELECTRONIC/PHOTONIC SYSTEMS AND METHODS OF FORMING THE SAME | LEPISTO, RYAN A | 2874 | Non-Final OA | Jan 24, 2024 |
| 18415751 | WAFER RETAINING DEVICE | NEJAD, MAHDI H | 3723 | Non-Final OA | Jan 18, 2024 |
| 18411068 | FIBER ARRAY UNIT INCLUDING FRONT SIDE MIRROR AND METHOD OF MAKING THE SAME | KIANNI, KAVEH C | 2874 | Non-Final OA | Jan 12, 2024 |
| 18412021 | APPARATUS AND METHOD FOR GENERATING AN OPTICAL SIGNAL | RADKOWSKI, PETER | 2874 | Non-Final OA | Jan 12, 2024 |
| 18409922 | Systems and Methods for Classifying PUF Signature Modules of Integrated Circuits | CATTUNGAL, DEREENA T | 2431 | Final Rejection | Jan 11, 2024 |
| 18393829 | PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORMING THE SAME | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Dec 22, 2023 |
| 18393846 | COPLANARITY ASSIST UNIT, SEMICONDUCTOR TESTING APPARATUS INCLUDING THE COPLANARITY ASSIST UNIT AND METHOD OF SETTING COPLANARITY | SHAH, NEEL D | 2858 | Non-Final OA | Dec 22, 2023 |
| 18538093 | Semiconductor Devices Having an Electro-static Discharge Protection Structure | DYKES, LAURA M | 2892 | Final Rejection | Dec 13, 2023 |
| 18526086 | PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTOR DIE AND A THERMALLY CONDUCTIVE UNDERFILL LAYER ON THE BACKSIDE METAL FILM AND METHODS OF FORMING THE SAME | HENRY, CALEB E | 2818 | Non-Final OA | Dec 01, 2023 |
| 18524416 | AUTOMATED MATERIAL HANDLING SYSTEM | PATEL, JAIMIN GHANSHYAM | 3652 | Non-Final OA | Nov 30, 2023 |
| 18515396 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | TAYLOR, EARL N | 2896 | Non-Final OA | Nov 21, 2023 |
| 18514243 | SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING THE SAME | JAHAN, BILKIS | 2817 | Non-Final OA | Nov 20, 2023 |
| 18512077 | THREE-DIMENSIONAL PHOTONIC INTERCONNECTS | PENG, CHARLIE YU | 2874 | Final Rejection | Nov 17, 2023 |
| 18471233 | PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FINS AND METHODS OF FORMING THE SAME | SCHOENHOLTZ, JOSEPH | 2893 | Non-Final OA | Sep 20, 2023 |
| 18470557 | FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHODS OF FORMING THE SAME | PATERSON, BRIGITTE A | 2896 | Non-Final OA | Sep 20, 2023 |
| 18464399 | SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS FOR FORMING THE SAME | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Sep 11, 2023 |
| 18457523 | REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME | PARTHASARATHY, ROHIT | 2899 | Non-Final OA | Aug 29, 2023 |
| 18455698 | PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 2817 | Non-Final OA | Aug 25, 2023 |
| 18452601 | SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSIONS AND METHODS FOR FORMING THE SAME | TYNES JR., LAWRENCE C | 2899 | Non-Final OA | Aug 21, 2023 |
| 18451043 | SHIELDED THROUGH SUBSTRATE VIA STRUCTURES FOR A SILICON INTERCONNECT DIE AND METHODS OF FORMING THE SAME | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Aug 16, 2023 |
| 18231403 | SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING | REMAVEGE, CHRISTOPHER | 1713 | Non-Final OA | Aug 08, 2023 |
| 18230720 | SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-WAFER BONDING AND METHODS OF FORMING THE SAME | BARZYKIN, VICTOR V | 2893 | Non-Final OA | Aug 07, 2023 |
| 18357797 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Jul 24, 2023 |
| 18354680 | CAPACITOR HAVING A BOTTOM CAPACITOR PLATE WITH A ROUGH UPPER SURFACE, SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR AND AND METHODS OF FORMING THE SAME | VU, DAVID | 2818 | Non-Final OA | Jul 19, 2023 |
| 18349412 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME | FAN, SU JYA | 2818 | Non-Final OA | Jul 10, 2023 |
| 18346925 | SEMICONDUCTOR DEVICE INCLUDING A METAL OXIDE INTERFACE LAYER AND METHODS FOR FORMING THE SAME | WARREN, MATTHEW E | 2815 | Non-Final OA | Jul 05, 2023 |
| 18218222 | SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF | BARZYKIN, VICTOR V | 2893 | Non-Final OA | Jul 05, 2023 |
| 18346457 | PACKAGE MODULE INCLUDING AN INTERPOSER WITH A DUMMY VIA, PACKAGE STRUCTURE INCLUDING THE PACKAGE MODULE AND METHODS OF FORMING THE SAME | BRASFIELD, QUINTON A | 2814 | Final Rejection | Jul 03, 2023 |
| 18344900 | PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE | CLINTON, EVAN GARRETT | 2899 | Non-Final OA | Jun 30, 2023 |
| 18206876 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ZHONG, XIN Y | 2855 | Non-Final OA | Jun 07, 2023 |
| 18327921 | PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARATUS FOR EFFECTING THE SAME | DYKES, LAURA M | 2892 | Non-Final OA | Jun 02, 2023 |
| 18327908 | FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME | DYKES, LAURA M | 2892 | Non-Final OA | Jun 02, 2023 |
| 18327432 | PHASE CHANGE MATERIAL SWITCH WITH OVONIC THRESHOLD SWITCHING MATERIAL SELECTOR AND METHODS FOR FORMING THE SAME | AMER, MOUNIR S | 2818 | Non-Final OA | Jun 01, 2023 |
| 18323481 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | WILCZEWSKI, MARY A | 2898 | Non-Final OA | May 25, 2023 |
| 18321081 | PHASE CHANGE MATERIAL SWITCH WITH REDUCED INSERTION LOSS AND METHODS FOR FORMING THE SAME | AMER, MOUNIR S | 2818 | Non-Final OA | May 22, 2023 |
| 18321116 | PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE | OH, JAEHWAN | 2899 | Non-Final OA | May 22, 2023 |
| 18321088 | BACK-END-OF-LINE CMOS INVERTER WITH VERTICAL CHANNELS AND METHODS OF FORMING THE SAME | YUSHINA, GALINA G | 2811 | Non-Final OA | May 22, 2023 |
| 18196070 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | JEAN BAPTISTE, WILNER | 2899 | Non-Final OA | May 11, 2023 |
| 18311907 | THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND METHODS OF FORMING THE SAME | HO, ANTHONY | 2817 | Non-Final OA | May 04, 2023 |
| 18303641 | CHIP PACKAGE AND METHODS FOR FORMING THE SAME | PHAM, LONG | 2897 | Non-Final OA | Apr 20, 2023 |
| 18303663 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METHODS FOR MAKING THE SAME | CULLEN, PATRICK LAWRENCE | 2899 | Non-Final OA | Apr 20, 2023 |
| 18302020 | PHOTONIC SILICON-INSULATOR-SILICON MODULATOR AND METHODS FOR FORMING THE SAME | BEDTELYON, JOHN M | 2874 | Non-Final OA | Apr 18, 2023 |
| 18300104 | ALIGNMENT MARK VIA ASSEMBLIES FOR A COMPOSITE INTERPOSER AND METHODS OF USING THE SAME | CHANG, JAY C | 2817 | Non-Final OA | Apr 13, 2023 |
| 18126767 | SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION | MENZ, LAURA MARY | 2813 | Non-Final OA | Mar 27, 2023 |
| 18126630 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | KIM, JAY C | 2815 | Non-Final OA | Mar 27, 2023 |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | CHAN, CANDICE | 2813 | Final Rejection | Mar 27, 2023 |
| 18189299 | DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT AND METHODS FOR FORMING THE SAME | PHAM, LONG | 2897 | Non-Final OA | Mar 24, 2023 |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | CHANG, JAY C | 2817 | Non-Final OA | Mar 01, 2023 |
| 18110085 | PHASE CHANGE MATERIAL SWITCH WITH EFFICIENT HEAT SPREADER AND METHODS FOR FORMING THE SAME | AMER, MOUNIR S | 2818 | Non-Final OA | Feb 15, 2023 |
| 18109211 | BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND METHODS OF FORMING THE SAME | PARENDO, KEVIN A | 2896 | Non-Final OA | Feb 13, 2023 |
| 17849755 | THERMALLY ENHANCED SELECTOR STRUCTURE AND METHODS OF FORMING THE SAME | AMER, MOUNIR S | 2818 | Non-Final OA | Jun 27, 2022 |
| 17842672 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | NGUYEN, SOPHIA T | 2893 | Non-Final OA | Jun 16, 2022 |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 2898 | Non-Final OA | Jun 02, 2022 |
| 17735536 | MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME | NGUYEN, CUONG B | 2818 | Non-Final OA | May 03, 2022 |
| 17708348 | SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS OF FORMING THE SAME | DINKE, BITEW A | 2812 | Final Rejection | Mar 30, 2022 |
| 17654927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | BELL, LAUREN R | 2896 | Non-Final OA | Mar 15, 2022 |
| 17693534 | DYNAMIC RANDOM ACCESS MEMORY DEVICES WITH ENHANCED DATA RETENTION AND METHODS OF FORMING THE SAME | BAUMAN, SCOTT E | 2815 | Non-Final OA | Mar 14, 2022 |
| 17691233 | HIGH DENSITY CAPACITOR AND METHOD OF MAKING THE SAME | NETTLES, CORALIE ANN | 2893 | Final Rejection | Mar 10, 2022 |
| 17654158 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Mar 09, 2022 |
| 17647526 | SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION | KURPLE, KARL | 1717 | Non-Final OA | Jan 10, 2022 |
| 17565220 | WORK FUNCTION MATERIAL AND MANUFACTURING PROCESS THEREOF | ASHBAHIAN, ERIC K | 2891 | Non-Final OA | Dec 29, 2021 |
| 17460589 | METAL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING THE SAME | SCHODDE, CHRISTOPHER A | 2898 | Final Rejection | Aug 30, 2021 |
| 17458751 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | ISAAC, STANETTA D | 2898 | Non-Final OA | Aug 27, 2021 |
| 17159863 | FAULT DETECTION OF CIRCUIT BASED ON VIRTUAL DEFECTS | GIRI, PURSOTTAM | 2186 | Final Rejection | Jan 27, 2021 |
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