Prosecution Insights
Prosecution Insights
29 pending office actions • 1 client • 29 examiners • 13 art units • 0 of 29 (0%) have an AI response strategy ready • 123 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 27 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 27 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 22 (76%) |
| §102 only | 3 (10%) |
| §112 only | 1 (3%) |
| Double-patenting only | 1 (3%) |
| No statute on record | 2 (7%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ROJAS, MIDYS | 1 | 87.5% | +8.0% |
| SCHELL, JOSEPH O | 1 | 87.2% | +8.5% |
| NGUYEN, VAN THU T | 1 | 82.7% | +6.6% |
| TANG, ANTHONY THINH | 1 | 100.0% | +0.0% |
| HIDALGO, FERNANDO N | 1 | 93.3% | +1.4% |
| TRAN, BINH BACH THANH | 1 | 80.5% | +12.2% |
| LEBENTRITT, MICHAEL | 1 | 92.2% | +6.1% |
| LEE, KYOUNG | 1 | 93.2% | +5.0% |
| RAMIREZ, ALEXANDRE XAVIER | 1 | 100.0% | +0.0% |
| SEVEN, EVREN | 1 | 73.8% | +8.5% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18979404 | ERROR INJECTION METHODS USING SOFT POST-PACKAGE REPAIR (sPPR) TECHNIQUES AND MEMORY DEVICES AND MEMORY SYSTEMS EMPLOYING THE SAME | SCHELL, JOSEPH O | 42d overdue |
| 18789344 | SEMICONDUCTOR MEMORY DEVICE WITH PER-CHANNEL ALERT OF ROW HAMMER ATTACK | TANG, ANTHONY THINH | 3d overdue |
| 18789682 | VOLTAGE-THRESHOLD VIOLATION DETECTION CIRCUITS IN MEMORY DEVICES AND SYSTEMS | NGUYEN, VAN THU T | 2d overdue |
| 18508239 | SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS | LEE, KYOUNG | 22d |
| 18749416 | VERTICALLY INTEGRATED MEMORY SYSTEM AND ASSOCIATED SYSTEMS AND METHODS | HIDALGO, FERNANDO N | 26d |
| 18237174 | SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION | RAMIREZ, ALEXANDRE XAVIER | 27d |
| 18401195 | SOLID STATE LIGHTING DEVICE WITH DIFFERENT ILLUMINATION PARAMETERS AT DIFFERENT REGIONS OF AN EMITTER ARRAY | LEBENTRITT, MICHAEL | 84d |
| 18652581 | PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT | TRAN, BINH BACH THANH | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18652581 | PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT | TRAN, BINH BACH THANH | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Micron | 29 |
| Art Unit | Apps |
|---|---|
| 2817 | 5 |
| 2812 | 4 |
| 2818 | 4 |
| 2893 | 3 |
| 2898 | 3 |
| 2827 | 2 |
| 2892 | 2 |
| 2133 | 1 |
| 2114 | 1 |
| 2824 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19026306 | MEMORY DEVICE WITH DYNAMIC CACHE MANAGEMENT | Micron Technology, Inc. | ROJAS, MIDYS | 2133 | Other | Non-Final OA | 14d | Pending | Jan 16, 2025 |
| 18979404 | ERROR INJECTION METHODS USING SOFT POST-PACKAGE REPAIR (sPPR) TECHNIQUES AND MEMORY DEVICES AND MEMORY SYSTEMS EMPLOYING THE SAME | Micron Technology, Inc. | SCHELL, JOSEPH O | 2114 | §103 | Non-Final OA | 42d overdue | Pending | Dec 12, 2024 |
| 18789682 | VOLTAGE-THRESHOLD VIOLATION DETECTION CIRCUITS IN MEMORY DEVICES AND SYSTEMS | Micron Technology, Inc. | NGUYEN, VAN THU T | 2824 | §103 | Non-Final OA | 2d overdue | Pending | Jul 31, 2024 |
| 18789344 | SEMICONDUCTOR MEMORY DEVICE WITH PER-CHANNEL ALERT OF ROW HAMMER ATTACK | Micron Technology, Inc. | TANG, ANTHONY THINH | 2827 | §103 | Non-Final OA | 3d overdue | Pending | Jul 30, 2024 |
| 18749416 | VERTICALLY INTEGRATED MEMORY SYSTEM AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | HIDALGO, FERNANDO N | 2827 | §103 | Non-Final OA | 26d | Pending | Jun 20, 2024 |
| 18652581 | PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT | Micron Technology, Inc. | TRAN, BINH BACH THANH | 2848 | §103 | Final Rejection | — | Pending | May 01, 2024 |
| 18401195 | SOLID STATE LIGHTING DEVICE WITH DIFFERENT ILLUMINATION PARAMETERS AT DIFFERENT REGIONS OF AN EMITTER ARRAY | Micron Technology, Inc. | LEBENTRITT, MICHAEL | 2893 | DP | Non-Final OA | 84d | Pending | Dec 29, 2023 |
| 18508239 | SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS | Micron Technology, Inc. | LEE, KYOUNG | 2817 | §103 | Non-Final OA | 22d | Pending | Nov 14, 2023 |
| 18237174 | SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION | Micron Technology, Inc. | RAMIREZ, ALEXANDRE XAVIER | 2812 | §103 | Non-Final OA | 27d | Pending | Aug 23, 2023 |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | Micron Technology, Inc. | SEVEN, EVREN | 2812 | §103 | Non-Final OA | 2d overdue | Pending | Aug 23, 2023 |
| 18217827 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME | Micron Technology, Inc. | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | 70d | Pending | Jul 03, 2023 |
| 18320930 | SOLID-STATE TRANSDUCER ASSEMBLIES WITH REMOTE CONVERTER MATERIAL FOR IMPROVED LIGHT EXTRACTION EFFICIENCY AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | MUSE, ISMAIL A | 2812 | §103 | Final Rejection | 22d | Pending | May 19, 2023 |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | Micron Technology, Inc. | DYKES, LAURA M | 2892 | §103 | Non-Final OA | 43d overdue | Pending | Feb 17, 2023 |
| 18111496 | SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFACES OF 3D STRUCTURES | Micron Technology, Inc. | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 12d | Pending | Feb 17, 2023 |
| 18111266 | SEMICONDUCTOR MEMORY DIES BONDED TO LOGIC DIES AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | TRAN, THANH Y | 2817 | Other | Non-Final OA | 36d | Pending | Feb 17, 2023 |
| 18111424 | MODIFIED SEMICONDUCTOR DIE CARRIER AND CARRIER TAPE | Micron Technology, Inc. | TURNER, BRIAN | 2818 | §103 | Final Rejection | 23d | Pending | Feb 17, 2023 |
| 18151378 | METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYSTEMS | Micron Technology, Inc. | PURVIS, SUE A | 2893 | §112 | Final Rejection | 1d overdue | Pending | Jan 06, 2023 |
| 17976625 | SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | HOQUE, MOHAMMAD M | 2817 | §103 | Non-Final OA | 63d | Pending | Oct 28, 2022 |
| 17899577 | SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME | Micron Technology, Inc. | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §103 | Non-Final OA | 77d | Pending | Aug 30, 2022 |
| 17894063 | SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT | Micron Technology, Inc. | FAN, SU JYA | 2818 | §103 | Final Rejection | 42d overdue | Pending | Aug 23, 2022 |
| 17892034 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILICON VIAS FOR CONTROLLER ATTACHMENT | Micron Technology, Inc. | ZABEL, ANDREW JOHN | 2818 | §103 | Final Rejection | — | Pending | Aug 19, 2022 |
| 17888324 | SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | IQBAL, HAMNA FATHIMA | 2817 | §103 | Final Rejection | 34d | Pending | Aug 15, 2022 |
| 17885439 | SEMICONDUCTOR DEVICE WITH POWER-SAVING MODE AND ASSOCIATED METHODS AND SYSTEMS | Micron Technology, Inc. | KERVEROS, DEMETRIOS C | 2111 | §102 | Final Rejection | 128d overdue | Pending | Aug 10, 2022 |
| 17884484 | THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES | Micron Technology, Inc. | WYATT, JOSHUA SCOTT | 2815 | §103 | Final Rejection | 46d overdue | Pending | Aug 09, 2022 |
| 17882441 | MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIATED SYSTEMS AND DEVICES | Micron Technology, Inc. | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | 28d | Pending | Aug 05, 2022 |
| 17874206 | HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATED METHODS | Micron Technology, Inc. | DAS, PINAKI | 2898 | §103 | Final Rejection | 49d overdue | Pending | Jul 26, 2022 |
| 17858001 | CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SURFACES FOR HYBRID BONDING WITH INCREASED SURFACE AREA, BOND STRENGTH, AND ALIGNMENT | Micron Technology, Inc. | STEPHENSON, KENNETH STEPHEN | 2898 | §102 | Final Rejection | 30d | Pending | Jul 05, 2022 |
| 17690981 | STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES | Micron Technology, Inc. | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | 54d | Pending | Mar 09, 2022 |
| 16826651 | VIAS AND CONDUCTIVE ROUTING LAYERS IN SEMICONDUCTOR SUBSTRATES | Micron Technology, Inc. | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | 49d overdue | Pending | Mar 23, 2020 |
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