Prosecution Insights
Prosecution Insights
51 pending office actions • 1 client • 50 examiners • 19 art units • 0 of 51 (0%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 10 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 10 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 14 (27%) |
| §102 only | 5 (10%) |
| Double-patenting only | 2 (4%) |
| Double-patenting + other | 2 (4%) |
| Multi-statute (no §101) | 26 (51%) |
| No statute on record | 2 (4%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| FERNANDES, ERROL V | 2 | 85.3% | +10.9% |
| ROJAS, MIDYS | 1 | 87.7% | +7.8% |
| YEW, CHIE W | 1 | 75.2% | +24.9% |
| BUTLER, SARAI E | 1 | 88.1% | +10.8% |
| JAMSHIDI, GHODRAT | 1 | 86.8% | +15.2% |
| PHAM, LY D | 1 | 94.0% | +3.3% |
| PEYTON, TAMMARA R | 1 | 90.9% | +6.0% |
| SAIN, GAUTAM | 1 | 67.4% | +22.8% |
| BERMUDEZ LOZADA, ALFREDO | 1 | 89.3% | +1.9% |
| SIDDIQUE, MUSHFIQUE | 1 | 89.6% | +6.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19239375 | APPARATUS WITH MEMORY CELL CALIBRATION MECHANISM AND METHODS FOR OPERATING THE SAME | ROJAS, MIDYS | — |
| 19055384 | DATA SECURITY FOR MEMORY AND COMPUTING SYSTEMS | JAMSHIDI, GHODRAT | — |
| 19048183 | APPARATUS WITH NON-LINEAR REFRESH MECHANISM AND METHODS FOR OPERATING THE SAME | PHAM, LY D | — |
| 19007423 | VERTICALLY STACKED HIGH BANDWIDTH STORAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS | PEYTON, TAMMARA R | — |
| 18787831 | FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH | FERNANDES, ERROL V | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17884484 | THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES | WYATT, JOSHUA SCOTT | 46d overdue |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | DYKES, LAURA M | 43d overdue |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | SEVEN, EVREN | 2d overdue |
| 18320930 | SOLID-STATE TRANSDUCER ASSEMBLIES WITH REMOTE CONVERTER MATERIAL FOR IMPROVED LIGHT EXTRACTION EFFICIENCY AND ASSOCIATED SYSTEMS AND METHODS | MUSE, ISMAIL A | 22d |
| 17976625 | SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES | HOQUE, MOHAMMAD M | 63d |
| 19069215 | MEMORY WITH ENHANCED FAIL TRACKING, INCLUDING ENHANCED ERROR CHECK AND SCRUB FAIL TRACKING, AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | BUTLER, SARAI E | — |
| 18923616 | APPARATUS WITH MULTI-MODE-REGISTER READ AND WRITE COMMANDS | BERMUDEZ LOZADA, ALFREDO | — |
| 18923597 | APPARATUS WITH MULTI-MODE-REGISTER READ AND WRITE COMMANDS | SIDDIQUE, MUSHFIQUE | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19206913 | APPARATUS WITH POST-MANUFACTURING DATA UPDATE MECHANISM AND METHODS FOR OPERATING THE SAME | YEW, CHIE W | — |
| 19069215 | MEMORY WITH ENHANCED FAIL TRACKING, INCLUDING ENHANCED ERROR CHECK AND SCRUB FAIL TRACKING, AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | BUTLER, SARAI E | — |
| 19055384 | DATA SECURITY FOR MEMORY AND COMPUTING SYSTEMS | JAMSHIDI, GHODRAT | — |
| 18965820 | CACHE MEMORIES IN VERTICALLY INTEGRATED MEMORY SYSTEMS AND ASSOCIATED SYSTEMS AND METHODS | SAIN, GAUTAM | — |
| 18787831 | FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH | FERNANDES, ERROL V | — |
| 18602553 | SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | FERNANDES, ERROL V | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Micron | 51 |
| Art Unit | Apps |
|---|---|
| 2817 | 6 |
| 2818 | 5 |
| 2893 | 4 |
| 2825 | 3 |
| 2892 | 3 |
| 2812 | 3 |
| 2899 | 2 |
| 2813 | 2 |
| 2814 | 2 |
| 2898 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19239375 | APPARATUS WITH MEMORY CELL CALIBRATION MECHANISM AND METHODS FOR OPERATING THE SAME | Micron Technology, Inc. | ROJAS, MIDYS | §102§112DP | Non-Final OA | — | Pending | Jun 16, 2025 | |
| 19206913 | APPARATUS WITH POST-MANUFACTURING DATA UPDATE MECHANISM AND METHODS FOR OPERATING THE SAME | Micron Technology, Inc. | YEW, CHIE W | Other | Non-Final OA | — | Pending | May 13, 2025 | |
| 19069215 | MEMORY WITH ENHANCED FAIL TRACKING, INCLUDING ENHANCED ERROR CHECK AND SCRUB FAIL TRACKING, AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | Micron Technology, Inc. | BUTLER, SARAI E | 2114 | §102§103§112 | Non-Final OA | — | Pending | Mar 03, 2025 |
| 19055384 | DATA SECURITY FOR MEMORY AND COMPUTING SYSTEMS | Micron Technology, Inc. | JAMSHIDI, GHODRAT | DP | Non-Final OA | — | Pending | Feb 17, 2025 | |
| 19048183 | APPARATUS WITH NON-LINEAR REFRESH MECHANISM AND METHODS FOR OPERATING THE SAME | Micron Technology, Inc. | PHAM, LY D | §102 | Non-Final OA | — | Pending | Feb 07, 2025 | |
| 19007423 | VERTICALLY STACKED HIGH BANDWIDTH STORAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | PEYTON, TAMMARA R | 2184 | §102 | Non-Final OA | — | Pending | Dec 31, 2024 |
| 18965820 | CACHE MEMORIES IN VERTICALLY INTEGRATED MEMORY SYSTEMS AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | SAIN, GAUTAM | 2135 | §103 | Final Rejection | — | Pending | Dec 02, 2024 |
| 18923616 | APPARATUS WITH MULTI-MODE-REGISTER READ AND WRITE COMMANDS | Micron Technology, Inc. | BERMUDEZ LOZADA, ALFREDO | 2825 | §102§112 | Non-Final OA | — | Pending | Oct 22, 2024 |
| 18923597 | APPARATUS WITH MULTI-MODE-REGISTER READ AND WRITE COMMANDS | Micron Technology, Inc. | SIDDIQUE, MUSHFIQUE | 2825 | §103§112 | Non-Final OA | — | Pending | Oct 22, 2024 |
| 18830525 | INTERLEAVED STRING DRIVERS, STRING DRIVER WITH NARROW ACTIVE REGION, AND GATED LDD STRING DRIVER | Micron Technology, Inc. | NGUYEN, TUAN DUC | 2824 | Other | Non-Final OA | — | Pending | Sep 10, 2024 |
| 18787831 | FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH | Micron Technology, Inc. | FERNANDES, ERROL V | §102 | Non-Final OA | — | Pending | Jul 29, 2024 | |
| 18777870 | THERMAL DISSIPATION IN STACKED MEMORY DEVICES AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | YI, CHANGHYUN | §102§103 | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18751061 | THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | JONES, ERIC W | 2892 | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18733586 | SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTURING THE SAME | Micron Technology, Inc. | JEFFERSON, QUOVAUNDA | §102§103§112 | Non-Final OA | — | Pending | Jun 04, 2024 | |
| 18668134 | SEMICONDUCTOR DEVICES WITH A CURRENT GAIN LAYOUT | Micron Technology, Inc. | DINKE, BITEW A | §102§103 | Non-Final OA | — | Pending | May 18, 2024 | |
| 18652581 | PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT | Micron Technology, Inc. | TRAN, BINH BACH THANH | 2848 | §103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18649297 | HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION | Micron Technology, Inc. | GUMEDZOE, PENIEL M | 2899 | §102 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18647354 | METHOD AND APPARATUS OF MEMORY ARRAY DEVICE WITH LOW ARCING RISK | Micron Technology, Inc. | THROCKMORTON, ROBERT EMIL | §103§112 | Non-Final OA | — | Pending | Apr 26, 2024 | |
| 18625212 | MEMORY DEVICE WITH MULTIPLE PHYSICAL INTERFACES | Micron Technology, Inc. | TRAN, ANTHAN | 2825 | §102§103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18608868 | SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME | Micron Technology, Inc. | ELLIOTT, DANIEL KURT | §102§103Other | Non-Final OA | — | Pending | Mar 18, 2024 | |
| 18602553 | SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | Micron Technology, Inc. | FERNANDES, ERROL V | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18443166 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS | Micron Technology, Inc. | LIU, MIKKA H | 2817 | §102§103§112 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18439689 | PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | GAUTHIER, STEVEN B | 2813 | §103§112DP | Final Rejection | — | Pending | Feb 12, 2024 |
| 18426271 | STACKED SEMICONDUCTOR DEVICE | Micron Technology, Inc. | TYNES JR., LAWRENCE C | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18410769 | SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME | Micron Technology, Inc. | FREAL, JOHN BRENDAN | 2847 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18407428 | STACKED SEMICONDUCTOR DEVICE | Micron Technology, Inc. | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18406068 | HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | NGUYEN, CUONG B | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18403007 | METHODS FOR MECHANICAL SELF-ALIGNMENT AND SLIP-RESISTANCE IN BONDING SEMICONDUCTOR SUBSTRATES, AND SEMICONDUCTOR DEVICES COMPRISING MECHANICAL SELF-ALIGNMENT STRUCTURES | Micron Technology, Inc. | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403103 | SEMICONDUCTOR DEVICE WITH VERTICAL BODY CONTACT AND METHODS FOR MANUFACTURING THE SAME | Micron Technology, Inc. | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401195 | SOLID STATE LIGHTING DEVICE WITH DIFFERENT ILLUMINATION PARAMETERS AT DIFFERENT REGIONS OF AN EMITTER ARRAY | Micron Technology, Inc. | LEBENTRITT, MICHAEL | 2893 | DP | Non-Final OA | 84d | Pending | Dec 29, 2023 |
| 18536073 | WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18514763 | COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY | Micron Technology, Inc. | MENZ, LAURA MARY | 2813 | §102§103 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18507019 | APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS | Micron Technology, Inc. | LIU, XIAOMING | 2812 | §102 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18505928 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME | Micron Technology, Inc. | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Nov 09, 2023 |
| 18368449 | METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE SEPARATION | Micron Technology, Inc. | TURNER, BRIAN | 2818 | §102§103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | Micron Technology, Inc. | SEVEN, EVREN | 2812 | §102§103 | Final Rejection | 2d overdue | Pending | Aug 23, 2023 |
| 18217827 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME | Micron Technology, Inc. | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | 70d | Pending | Jul 03, 2023 |
| 18320930 | SOLID-STATE TRANSDUCER ASSEMBLIES WITH REMOTE CONVERTER MATERIAL FOR IMPROVED LIGHT EXTRACTION EFFICIENCY AND ASSOCIATED SYSTEMS AND METHODS | Micron Technology, Inc. | MUSE, ISMAIL A | 2812 | §103§112 | Final Rejection | 22d | Pending | May 19, 2023 |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | Micron Technology, Inc. | DYKES, LAURA M | 2892 | §103§112 | Final Rejection | 43d overdue | Pending | Feb 17, 2023 |
| 17976625 | SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | HOQUE, MOHAMMAD M | 2817 | §102§103§112 | Non-Final OA | 63d | Pending | Oct 28, 2022 |
| 17974435 | LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL | Micron Technology, Inc. | KARIMY, TIMOR | 2818 | §103 | Non-Final OA | — | Pending | Oct 26, 2022 |
| 17937358 | APPARATUS WITH DYNAMIC ARBITRATION MECHANISM AND METHODS FOR OPERATING THE SAME | Micron Technology, Inc. | YUN, CARINA | 2194 | §103§112 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17899577 | SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME | Micron Technology, Inc. | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §103 | Non-Final OA | 77d | Pending | Aug 30, 2022 |
| 17896030 | EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Non-Final OA | — | Pending | Aug 25, 2022 |
| 17892034 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILICON VIAS FOR CONTROLLER ATTACHMENT | Micron Technology, Inc. | ZABEL, ANDREW JOHN | 2818 | §103 | Final Rejection | — | Pending | Aug 19, 2022 |
| 17888324 | SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES | Micron Technology, Inc. | IQBAL, HAMNA FATHIMA | 2817 | §103 | Non-Final OA | 34d | Pending | Aug 15, 2022 |
| 17884484 | THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES | Micron Technology, Inc. | WYATT, JOSHUA SCOTT | 2815 | §102§103§112 | Final Rejection | 46d overdue | Pending | Aug 09, 2022 |
| 17882416 | BONDED SEMICONDUCTOR DEVICE | Micron Technology, Inc. | WEGNER, AARON MICHAEL | 2897 | §102§103 | Non-Final OA | — | Pending | Aug 05, 2022 |
| 17741200 | WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INTO MOLD | Micron Technology, Inc. | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | — | Pending | May 10, 2022 |
| 17719241 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCTURES FOR THERMAL DISSIPATION AND METHODS OF MAKING THE SAME | Micron Technology, Inc. | DAS, PINAKI | 2898 | §103 | Non-Final OA | — | Pending | Apr 12, 2022 |
| 17690981 | STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES | Micron Technology, Inc. | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | 54d | Pending | Mar 09, 2022 |
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