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| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19059871 | STATIC RANDOM-ACCESS MEMORY | Intel Corporation | NGUYEN, VIET Q | 2827 | §102 | Non-Final OA | — | Pending | Feb 21, 2025 |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103 | Non-Final OA | 70d | AI Ready | Jan 21, 2025 |
| 19023571 | SAWMILL BED ASSEMBLY | Norwood Industries Inc. | NGUYEN, JIMMY T | 3725 | §102§103§112 | Non-Final OA | — | Pending | Jan 16, 2025 |
| 19000286 | LOG AND CANT OPTIMIZATION | USNR, LLC | ZERVOS, NIKOLAOS PHILLIP | 2117 | §102§103§112 | Non-Final OA | — | Pending | Dec 23, 2024 |
| 18918478 | ELECTRICAL INTERCONNECT BRIDGE | Intel Corporation | MCALLISTER, MICHAEL F | 2847 | §102§103 | Final Rejection | — | Pending | Oct 17, 2024 |
| 18902427 | STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT | Intel Corporation | MOONEY, MICHAEL P | 2874 | §102 | Non-Final OA | — | Pending | Sep 30, 2024 |
| 18808992 | WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS | Intel Corporation | DINKE, BITEW A | §103Other | Non-Final OA | — | Pending | Aug 19, 2024 | |
| 18807193 | TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS | Intel Corporation | VALENZUELA, PATRICIA D | Other | Non-Final OA | — | Pending | Aug 16, 2024 | |
| 18800827 | CONFINED EPITAXIAL REGIONS FOR SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONFINED EPITAXIAL REGIONS | Intel Corporation | GREEN, TELLY D | §112Other | Non-Final OA | — | Pending | Aug 12, 2024 | |
| 18798574 | HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW | Intel Corporation | BEDTELYON, JOHN M | 2874 | §102 | Non-Final OA | — | Pending | Aug 08, 2024 |
| 18787886 | OPTICAL COHERENT RECEIVER ON A CHIP | Intel Corporation | LAMBERT, DAVID W | 2634 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18774351 | BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES | Intel Corporation | LEE, CHEUNG | 2812 | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18767458 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT ISLAND STRUCTURES | Intel Corporation | HARRISTON, WILLIAM A | 2899 | §102Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18755987 | LAYOUT DESIGN SPECIFICATIONS AND METHODOLOGY FOR GENERATING SEMICONDUCTOR CHIP METAL INTERCONNECT LAYOUT FABRICS | Intel Corporation | PETERSON, ERIK T | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18757013 | CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATION ON BOTH SIDES | Intel Corporation | NIX, NORA TAYLOR | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18755189 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH IMPROVED CAP | Intel Corporation | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18734746 | CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE | Intel Corporation | BOWEN, ADAM S | 2897 | Other | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18654739 | SAWMILL CARRIAGE, SAWMILL CARRIAGE KIT, AND METHOD OF USING SAME | Norwood Industries Inc. | LEE, LAURA MICHELLE | 3724 | §102§103 | Final Rejection | 30d overdue | Pending | May 03, 2024 |
| 18653815 | GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME | Intel Corporation | HENRY, CALEB E | 2818 | §102§103 | Non-Final OA | — | Pending | May 02, 2024 |
| 18649530 | MODULAR PRESS | USNR, LLC | NGUYEN, JIMMY T | 3725 | §102§112Other | Non-Final OA | 83d | Pending | Apr 29, 2024 |
| 18636037 | AUTOMATIC FEEDING, GRINDING, AND SORTING OF WOODWORKING KNIVES | Simonds International LLC | GUMP, MICHAEL ANTHONY | 3723 | §101§103§112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18438450 | INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 34d | Pending | Feb 10, 2024 |
| 18400772 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Intel Corporation | MUNOZ, ANDRES F | 2818 | §102 | Final Rejection | — | Pending | Dec 29, 2023 |
| 18390952 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTERNATE ETCH SELECTIVE MATERIAL | Intel Corporation | KOO, LAMONT B | 2813 | §103 | Final Rejection | 22d | AI Ready | Dec 20, 2023 |
| 18566483 | ARTIFICIAL INTELLIGENCE REGULATORY MECHANISMS | Intel Corporation | BHAT, VIBHA NARAYAN | 2142 | §101§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18516595 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITHOUT FIN END GAP | Intel Corporation | KOO, LAMONT B | 2813 | §103 | Final Rejection | 40d | AI Ready | Nov 21, 2023 |
| 18381887 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING BOTTOM-UP OXIDATION APPROACH | Intel Corporation | PATEL, REEMA | 2812 | §112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18375084 | INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING | Intel Corporation | VU, VU A | 2897 | — | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18374596 | MICROELECTRONIC ASSEMBLIES | Intel Corporation | KARIMY, TIMOR | 2818 | §103§112 | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18467659 | COMPLEX-ZERO EQUALIZER CIRCUIT | Intel Corporation | CORRIELUS, JEAN B | 2633 | — | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Intel Corporation | STARK, JARRETT J | 2898 | §103 | Final Rejection | — | AI Ready | Sep 11, 2023 |
| 18462220 | BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUIT BOARD | Intel Corporation | SAWYER, STEVEN T | 2847 | — | Non-Final OA | — | Pending | Sep 06, 2023 |
| 18242322 | PACKAGE WITH EMBEDDED CAPACITORS | Intel Corporation | TRAN, TRANG Q | 2811 | §112 | Non-Final OA | 55d | AI Ready | Sep 05, 2023 |
| 18240106 | INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG | Intel Corporation | KIM, TONG-HO | 2811 | §103Other | Non-Final OA | — | Pending | Aug 30, 2023 |
| 18236821 | TEST AND REPAIR ARCHITECTURE FOR INTER AND INTRA CLUSTER DEFECTS | Intel Corporation | LEIBOVICH, YAIR | 2114 | §112 | Non-Final OA | — | Pending | Aug 22, 2023 |
| 18223413 | INTEGRATED CIRCUIT STRUCTURES HAVING THROUGH-STACK THERMAL SINK FOR DUAL-SIDED DEVICES | Intel Corporation | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Non-Final OA | — | Pending | Jul 18, 2023 |
| 18219018 | INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §102§103§112 | Non-Final OA | — | Pending | Jul 06, 2023 |
| 18216914 | CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | STUESSY, NOLAN GABRIEL | 2812 | §102 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18216909 | INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-SIDED DEVICES | Intel Corporation | STARK, JARRETT J | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18216315 | STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216325 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT DIFFERENTIATED ACCESS | Intel Corporation | KNUDSON, BRAD ALLAN | 2817 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18215748 | INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED END CAP | Intel Corporation | BOEGEL, CHEVY JACOB | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2023 |
| 18343255 | REGIONAL BRIGHTNESS CONTROL SCHEME FOR DISPLAY POWER SAVING | Intel Corporation | PEARSON, AMANDA HYEONWOO | 2666 | §103 | Non-Final OA | — | Pending | Jun 28, 2023 |
| 18214271 | CONDUCTIVE LINES HAVING MOLYBDENUM LINER AND TUNGSTEN FILL FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | VU, DAVID | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18214262 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY | Intel Corporation | FOX, BRANDON C | 2818 | §103Other | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18214244 | INTEGRATED CAPACITOR | Intel Corporation | LIU, MIKKA H | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18214252 | INTEGRATED CAPACITOR | Intel Corporation | GHEYAS, SYED I | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18340794 | ENHANCING TEMPERATURE STABILITY IN REFERENCE CLOCK APPLICATIONS USING RESONATOR ARRAYS | Intel Corporation | SHIN, JEFFREY M | 2836 | §102§103 | Non-Final OA | — | Pending | Jun 23, 2023 |
| 18212824 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE PLUG LAST APPROACH | Intel Corporation | LIU, MIKKA H | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jun 22, 2023 |
| 18212382 | INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR ISOLATION | Intel Corporation | LIU, XIAOMING | 2812 | §103 | Non-Final OA | — | Pending | Jun 21, 2023 |
| 18338176 | DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY | Intel Corporation | LIU, XIAOMING | 2812 | §103 | Non-Final OA | — | Pending | Jun 20, 2023 |
| 18332420 | PLATFORM AND PLATFORM COMPONENT DEBUG BY MULTIPLE DEBUGGING SYSTEMS | Intel Corporation | MANOSKEY, JOSEPH D | 2113 | §101§102§112 | Non-Final OA | — | Pending | Jun 09, 2023 |
| 18204204 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT STITCHING | Intel Corporation | ROBERTSON, NOAH CHRISTOPHER | 2812 | §102§103 | Non-Final OA | — | Pending | May 31, 2023 |
| 18199269 | LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS | Intel Corporation | LEE, PETE T | 2847 | §102§103§112 | Non-Final OA | — | Pending | May 18, 2023 |
| 18318659 | SWITCHED-CAPACITOR VOLTAGE CONVERTER WITH SELECTIVE DECOUPLING CAPACITANCE | Intel Corporation | CORDOVA RODRIGUEZ, ULARISLAO | 2827 | §102§103 | Non-Final OA | — | Pending | May 16, 2023 |
| 18313242 | ROBUST PLATFORM LOW POWER MODE VIA EMBEDDED CONTROLLER-BASED HEALTH POLICY TO CORRECT ANOMALOUS COMPUTER IDLE CONDITIONS | Intel Corporation | FATIMA, AYMAN | 2176 | §103 | Final Rejection | — | Pending | May 05, 2023 |
| 18143831 | THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC MATERIALS FOR POWER DELIVERY APPLICATIONS | Intel Corporation | MCCUTCHEON, COLIN RUSSELL | 2892 | — | Final Rejection | — | Pending | May 05, 2023 |
| 18141887 | NITRIDE ETCH FOR CONSISTENT STEP HEIGHT FOR TSV REVEAL IN THE VIA MID FLOW | Intel Corporation | ERDEM, FAZLI | 2812 | §103 | Final Rejection | — | Pending | May 01, 2023 |
| 18140346 | SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STRUCTURES | Intel Corporation | HAMADYK, ANNA N | 2845 | §102§103 | Non-Final OA | — | Pending | Apr 27, 2023 |
| 18140465 | RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE ANTENNA AND THE RF DIE | Intel Corporation | JONES, ERIC W | 2892 | §103 | Final Rejection | — | Pending | Apr 27, 2023 |
| 18140361 | ANTENNA MODULE WITH CAPACITIVE COUPLING | Intel Corporation | ISLAM, HASAN Z | 2845 | §103 | Non-Final OA | — | Pending | Apr 27, 2023 |
| 18130584 | EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY | Intel Corporation | AHMAD, KHAJA | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 04, 2023 |
| 18129871 | INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION | Intel Corporation | BOOTH, RICHARD A | 2812 | §102§103§112 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129879 | SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES | Intel Corporation | SABUR, ALIA | 2812 | §103§112 | Non-Final OA | 62d | Pending | Apr 02, 2023 |
| 18129873 | INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS | Intel Corporation | CHEN, YU | 2896 | §102§103 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129878 | DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION | Intel Corporation | HENRY, CALEB E | 2818 | §102§103 | Final Rejection | — | Pending | Apr 02, 2023 |
| 18129872 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING | Intel Corporation | TRAN, DZUNG | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129651 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING MULTI-LAYER MOLYBDENUM METAL GATE STACK | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18128733 | DEVICE UNDER TEST (DUT) STRUCTURES IN FILL REGIONS OF PRODUCT DIE FOR VOLTAGE CONTRAST (VC) DEFECT DETECTION FOR IMPROVED YIELD LEARNING | Intel Corporation | GHEYAS, SYED I | 2858 | §103 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18126857 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY | Intel Corporation | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | Mar 27, 2023 |
| 18126134 | GLASS CORE SUBSTRATE WITH LGA NOTCH | Intel Corporation | HOSSAIN, MOAZZAM | 2898 | §102§103 | Final Rejection | — | Pending | Mar 24, 2023 |
| 18121331 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Intel Corporation | MANDALA, MICHELLE | 2483 | §102§103Other | Non-Final OA | — | Pending | Mar 14, 2023 |
| 18120910 | INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS | Intel Corporation | MAZUMDER, DIDARUL A | 2812 | §103 | Final Rejection | — | Pending | Mar 13, 2023 |
| 18120761 | EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCREASE OVERALL SYSTEM POWER DENSITY | Intel Corporation | TRAN, BINH BACH THANH | 2847 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18120172 | HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER | Intel Corporation | RAHMAN, MOHAMMAD A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Mar 10, 2023 |
| 18117818 | INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE HUMIDITY RELIABILITY ISSUE OF LIQUID METAL INTERCONNECT | Intel Corporation | DINH, TUAN T | 2847 | §102§103 | Final Rejection | 46d | Pending | Mar 06, 2023 |
| 18174007 | NANORIBBON-BASED TRANSISTORS WITH ETCH STOP LAYER TO ASSIST SUBFIN REMOVAL | Intel Corporation | GARCES, NELSON Y | 2814 | §102 | Final Rejection | — | Pending | Feb 24, 2023 |
| 18148578 | POWER MANAGEMENT FOR BATTERY GROUP | Intel Corporation | LEE, JAMES | 1725 | §102§103§112 | Final Rejection | 61d | Pending | Dec 30, 2022 |
| 18091014 | HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES | Intel Corporation | CHUNG, ANDREW | 2898 | §102§103§112 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18091207 | CHARGE ISOLATION ARCHITECTURE IN VOLTAGE REGULATOR FOR IMPROVED BATTERY LIFE, RESPONSIVENESS AND REDUCED ACOUSTIC NOISE | Intel Corporation | NGUYEN, PHIL K | 2176 | §103 | Final Rejection | 3d overdue | AI Ready | Dec 29, 2022 |
| 18090807 | INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY | Intel Corporation | LINDSEY, COLE LEON | 2812 | §103 | Non-Final OA | 9d overdue | AI Ready | Dec 29, 2022 |
| 18091026 | ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES | Intel Corporation | CHOUDHRY, MOHAMMAD M | 2899 | §102§103DP | Final Rejection | 56d | AI Ready | Dec 29, 2022 |
| 18091028 | ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES | Intel Corporation | SAMPLE, DAVID R | 1784 | §102§103 | Final Rejection | — | Pending | Dec 29, 2022 |
| 18090838 | DOUBLE INTERCONNECTS FOR STITCHED DIES | Intel Corporation | NADAV, ORI | 2811 | §103 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18089966 | TRANSISTOR IN A SILICON CARBIDE LAYER AND A TRANSISTOR IN A GALLIUM NITRIDE LAYER IN A CASCODE DESIGN | Intel Corporation | YEMELYANOV, DMITRIY | 2891 | §103 | Final Rejection | — | Pending | Dec 28, 2022 |
| 18089945 | TRANSISTOR INCLUDING WIDE BAND GAP MATERIALS | Intel Corporation | WALL, VINCENT | 2898 | §103 | Final Rejection | — | Pending | Dec 28, 2022 |
| 18089919 | TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS | Intel Corporation | NELSON, JACOB THEODORE | 2815 | §102§103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18089865 | INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY | Intel Corporation | LIU, BENJAMIN T | 2893 | — | Final Rejection | — | Pending | Dec 28, 2022 |
| 18089491 | LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES | Intel Corporation | WOLDEGEORGIS, ERMIAS T | 2893 | §102§103 | Non-Final OA | 8d overdue | AI Ready | Dec 27, 2022 |
| 18089489 | SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION | Intel Corporation | ESTRADA, ANGEL R | 2841 | §103 | Non-Final OA | 9d | AI Ready | Dec 27, 2022 |
| 18089499 | DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | — | Pending | Dec 27, 2022 |
| 18088546 | GALLIUM NITRIDE (GAN) TRANSISTORS WITH LATERAL DRAIN DEPLETION | Intel Corporation | NICELY, JOSEPH C | 2813 | §102§103 | Final Rejection | — | AI Ready | Dec 24, 2022 |
| 18088360 | CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE | Intel Corporation | CRUM, JACOB R | 2835 | §102§103 | Final Rejection | 62d | AI Ready | Dec 23, 2022 |
| 18076130 | LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT | Intel Corporation | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | 19d overdue | AI Ready | Dec 06, 2022 |
| 18075360 | SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103 | Non-Final OA | — | AI Ready | Dec 05, 2022 |
| 18071901 | OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT | Intel Corporation | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103§112 | Final Rejection | — | Pending | Nov 30, 2022 |
| 18072559 | INTEGRATED CIRCUIT STRUCTURES WITH SOURCE OR DRAIN CONTACTS HAVING ENHANCED CONTACT AREA | Intel Corporation | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103§112 | Final Rejection | — | Pending | Nov 30, 2022 |
| 18071246 | INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES | Intel Corporation | PENG, CHARLIE YU | 2874 | §102§103 | Non-Final OA | 1d overdue | AI Ready | Nov 29, 2022 |
| 18071257 | SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE | Intel Corporation | WOLDEGEORGIS, ERMIAS T | 2893 | §103 | Final Rejection | — | AI Ready | Nov 29, 2022 |
| 18071116 | RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES | Intel Corporation | FAN, SU JYA | 2818 | §102§103 | Final Rejection | 77d | Pending | Nov 29, 2022 |
| 17958279 | GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103 | Non-Final OA | 13d | AI Ready | Sep 30, 2022 |
| 17958302 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Intel Corporation | BOULGHASSOUL, YOUNES | 2814 | §102 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17956760 | SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING | Intel Corporation | VU, VU A | 2897 | §102 | Non-Final OA | — | AI Ready | Sep 29, 2022 |
| 17954288 | IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 26d | AI Ready | Sep 27, 2022 |
| 17953873 | HIGH ASPECT RATIO METAL GATE CUTS | Intel Corporation | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 11d overdue | AI Ready | Sep 27, 2022 |
| 17943915 | COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS | Intel Corporation | FAN, SU JYA | 2818 | §103§112 | Final Rejection | — | Pending | Sep 13, 2022 |
| 17895965 | GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE | Intel Corporation | CUTLER, ETHAN EDWARD | 2892 | — | Final Rejection | — | Pending | Aug 25, 2022 |
| 17891738 | THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES | Intel Corporation | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Aug 19, 2022 |
| 17890005 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI-HEIGHT STANDARD CELL CIRCUITS | Intel Corporation | STEVENSON, ANDRE C | 2899 | §103 | Non-Final OA | 72d | Pending | Aug 17, 2022 |
| 17886278 | ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES | Intel Corporation | CHI, SUBERR L | 2893 | — | Non-Final OA | — | AI Ready | Aug 11, 2022 |
| 17855639 | CONTACT ARCHITECTURE FOR 2D STACKED NANORIBBON TRANSISTOR | Intel Corporation | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 15d | AI Ready | Jun 30, 2022 |
| 17853487 | EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU ENABLED PACKAGES | Intel Corporation | PURVIS, SUE A | 2815 | §112 | Final Rejection | — | Pending | Jun 29, 2022 |
| 17851967 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND POWER DELIVERY | Intel Corporation | KNUDSON, BRAD ALLAN | 2817 | §103 | Final Rejection | — | Pending | Jun 28, 2022 |
| 17851985 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY | Intel Corporation | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 30d overdue | AI Ready | Jun 28, 2022 |
| 17852039 | SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT | Intel Corporation | LIU, BENJAMIN T | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2022 |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Non-Final OA | — | AI Ready | Jun 27, 2022 |
| 17849188 | EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jun 24, 2022 |
| 17848643 | ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE | Intel Corporation | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 24, 2022 |
| 17833568 | ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT | Intel Corporation | FREAL, JOHN BRENDAN | 2847 | §102§103 | Final Rejection | 71d | Pending | Jun 06, 2022 |
| 17826933 | USB TYPE-C SUBSYSTEM | Intel Corporation | UNELUS, ERNEST | 2181 | §102§103 | Non-Final OA | 4d overdue | AI Ready | May 27, 2022 |
| 17743954 | DESIGNS TO ENABLE INLINE CIRCUIT EDIT | Intel Corporation | PARIHAR, SUCHIN | 2851 | §102§103 | Non-Final OA | 29d | AI Ready | May 13, 2022 |
| 17729974 | PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS | Intel Corporation | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Final Rejection | — | Pending | Apr 26, 2022 |
| 17716940 | TECHNIQUES FOR DIE TILING | Intel Corporation | JUNGE, BRYAN R. | 2897 | — | Final Rejection | 69d | Pending | Apr 08, 2022 |
| 17711434 | GATE SPACERS WITH ADJACENT UNIFORM EPITAXIAL MATERIAL | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103§112 | Non-Final OA | — | Pending | Apr 01, 2022 |
| 17710837 | INTEGRATED CIRCUIT STRUCTURES WITH FULL-WRAP CONTACT STRUCTURE | Intel Corporation | BERRY, PAUL ANTHONY | 2898 | §103 | Final Rejection | — | Pending | Mar 31, 2022 |
| 17709360 | BARRIERS TO MODULATE UNDERFILL FLOW | Intel Corporation | BRASFIELD, QUINTON A | 2814 | §102§103 | Non-Final OA | 41d | Pending | Mar 30, 2022 |
| 17707536 | GROOVED PACKAGE | Intel Corporation | PARENDO, KEVIN A | 2896 | §103 | Final Rejection | — | Pending | Mar 29, 2022 |
| 17703730 | LOW PROFILE IMPEDANCE-TUNABLE AND CROSS-TALK CONTROLLED HIGH SPEED HYBRID SOCKET INTERCONNECT | Intel Corporation | PATEL, TULSIDAS C | 2834 | §112 | Final Rejection | 42d | AI Ready | Mar 24, 2022 |
| 17693150 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADDITIVE GATE STRUCTURES IN A TUB ARCHITECTURE | Intel Corporation | CRAMER, HALEE PAIGE | 2891 | §103 | Non-Final OA | 42d overdue | AI Ready | Mar 11, 2022 |
| 17561720 | RECONSTITUTED WAFER-TO-WAFER HYBRID BONDING INTERCONNECT ARCHITECTURE WITH KNOWN GOOD DIES | Intel Corporation | GRAHAM, KRETELIA | 2817 | §103 | Final Rejection | 33d | AI Ready | Dec 24, 2021 |
| 17561735 | SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §103 | Non-Final OA | 3d overdue | AI Ready | Dec 24, 2021 |
| 17561733 | 3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES | Intel Corporation | TRAN, TIEN | 2812 | §103 | Non-Final OA | 5d overdue | AI Ready | Dec 24, 2021 |
| 17561682 | INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL | Intel Corporation | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | 23d | AI Ready | Dec 23, 2021 |
| 17561518 | INTEGRATED CIRCUITS WITH GATE PLUGS TO INDUCE COMPRESSIVE CHANNEL STRAIN | Intel Corporation | BLACKWELL, ASHLEY NICOLE | 2897 | §103 | Non-Final OA | — | Pending | Dec 23, 2021 |
| 17561670 | POWER DELIVERY USING BACKSIDE POWER FOR STITCHED DIES | Intel Corporation | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | — | AI Ready | Dec 23, 2021 |
| 17559916 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NEIGHBORING FIN-BASED DEVICES | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103 | Final Rejection | — | AI Ready | Dec 22, 2021 |
| 17559858 | INTEGRATED OPTICAL PACKAGE | Intel Corporation | WONG, TINA MEI SENG | 2874 | §103 | Non-Final OA | — | Pending | Dec 22, 2021 |
| 17557932 | SEMICONDUCTOR STRUCTURE FOR NANORIBBON ARCHITECTURES | Intel Corporation | STEPHENSON, KENNETH STEPHEN | 2898 | — | Final Rejection | 70d | Pending | Dec 21, 2021 |
| 17558061 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE PLUG LANDED ON DIELECTRIC ANCHOR | Intel Corporation | CRAMER, HALEE PAIGE | 2891 | §103 | Non-Final OA | — | AI Ready | Dec 21, 2021 |
| 17557579 | DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER | Intel Corporation | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | — | Pending | Dec 21, 2021 |
| 17556602 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §102§103 | Non-Final OA | — | AI Ready | Dec 20, 2021 |
| 17556660 | TECHNIQUES FOR DIE TILING | Intel Corporation | JUNGE, BRYAN R. | 2897 | §103 | Final Rejection | 27d | AI Ready | Dec 20, 2021 |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Non-Final OA | 45d overdue | AI Ready | Dec 17, 2021 |
| 17553189 | POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS | Intel Corporation | DINH, TUAN T | 2848 | §103 | Non-Final OA | — | AI Ready | Dec 16, 2021 |
| 17485325 | OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE | Intel Corporation | MIHALIOV, DMITRI | 2812 | §103 | Non-Final OA | 72d | AI Ready | Sep 25, 2021 |
| 17485291 | HIGH-K OR FERROELECTRIC GATE OXIDE WITH ZERO-SIO2 IL PROCESS FOR TRANSISTOR | Intel Corporation | NGUYEN, KHIEM D | 2892 | §103Other | Non-Final OA | — | Pending | Sep 24, 2021 |
| 17485202 | CMOS INTEGRATION OF 2D MATERIAL BY END ETCH | Intel Corporation | MIHALIOV, DMITRI | 2812 | §103§112 | Non-Final OA | — | Pending | Sep 24, 2021 |
| 17482804 | IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES | Intel Corporation | CHAN, TSZFUNG JACKIE | 2837 | §103§112 | Non-Final OA | — | Pending | Sep 23, 2021 |
| 17482747 | LOCALIZED HIGH PERMEABILITY MAGNETIC REGIONS IN GLASS PATCH FOR ENHANCED POWER DELIVERY | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103 | Non-Final OA | — | Pending | Sep 23, 2021 |
| 17481237 | GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF LAYERS | Intel Corporation | ANDERSON, ERIK ARTHUR | 2812 | §103§112 | Final Rejection | 11d overdue | AI Ready | Sep 21, 2021 |
| 17481266 | GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICATIONS | Intel Corporation | CHIEM, DINH D | 2874 | §103 | Non-Final OA | — | AI Ready | Sep 21, 2021 |
| 17481234 | MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE | Intel Corporation | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | 80d overdue | Pending | Sep 21, 2021 |
| 17481257 | MOAT PROTECTION TO PREVENT CRACK PROPAGATION IN GLASS CORE SUBSTRATES OR GLASS INTERPOSERS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | — | Pending | Sep 21, 2021 |
| 17507010 | DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS | Intel Corporation | SMITH, SAMUEL JONATHAN | 2817 | §103 | Final Rejection | — | AI Ready | Sep 17, 2021 |
| 17358551 | BURIED POWER RAIL WITH A SILICIDE LAYER FOR WELL BIASING | Intel Corporation | DIAZ, JOSE R | 2815 | §102§103 | Final Rejection | — | Pending | Jun 25, 2021 |
| 17357896 | ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY | Intel Corporation | DIAZ, JOSE R | 2815 | §102§103 | Final Rejection | — | Pending | Jun 24, 2021 |
| 17357895 | NANORIBBON SUBFIN ISOLATION BY BACKSIDE SILICON SUBSTRATE REMOVAL WITH EPI PROTECTION | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Final Rejection | — | Pending | Jun 24, 2021 |
| 17356056 | DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESULTING THEREFROM | Intel Corporation | CAMPBELL, SHAUN M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jun 23, 2021 |
| 17353275 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE PASS-THROUGH CONTACT | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Final Rejection | — | Pending | Jun 21, 2021 |
| 17353263 | INTEGRATED CIRCUIT STRUCTURES HAVING PLUGGED METAL GATES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Non-Final OA | — | Pending | Jun 21, 2021 |
| 17350169 | COAXIAL STRUCTURE IN A GLASS SUBSTRATE | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103§112 | Non-Final OA | — | Pending | Jun 17, 2021 |
| 17350809 | PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE | Intel Corporation | MANHEIM, MARC ETIENNE | 2874 | §102§103 | Non-Final OA | 56d | AI Ready | Jun 17, 2021 |
| 17350184 | MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE | Intel Corporation | ANGUIANO, MICHAEL | 2899 | §103 | Non-Final OA | — | AI Ready | Jun 17, 2021 |
| 17346990 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | 11d overdue | Pending | Jun 14, 2021 |
| 17347015 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING BACKSIDE REMOVAL APPROACH | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 14, 2021 |
| 17346964 | STENT AND WRAP CONTACT | Intel Corporation | BLACKWELL, ASHLEY NICOLE | 2897 | §103 | Non-Final OA | — | AI Ready | Jun 14, 2021 |
| 17211751 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP | Intel Corporation | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 24, 2021 |
| 17129854 | METAL INSULATOR METAL (MIM) CAPACITOR WITH PEROVSKITE DIELECTRIC | Intel Corporation | SEHAR, FAKEHA | 2893 | — | Final Rejection | 15d overdue | AI Ready | Dec 21, 2020 |
| 17129838 | STIFFENER AND SOCKET EMBEDDED METAL INSERT ARCHITECTURES FOR POWER DELIVERY | Intel Corporation | LOKE, STEVEN HO YIN | 2818 | §102§112 | Non-Final OA | — | Pending | Dec 21, 2020 |
| 17126636 | MICROELECTRONIC STRUCTURES INCLUDING BRIDGES | Intel Corporation | PIZARRO CRESPO, MARCOS D | 2814 | §112 | Non-Final OA | — | Pending | Dec 18, 2020 |
| 17031719 | 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS | Intel Corporation | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | 218d overdue | Pending | Sep 24, 2020 |
| 16912136 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING STRAINED SOURCE OR DRAIN STRUCTURES ON GATE DIELECTRIC LAYER | Intel Corporation | XU, ZHIJUN | 2818 | §103 | Final Rejection | 34d | AI Ready | Jun 25, 2020 |
| 16803887 | INTERPOSER HEAT SPREADER | Intel Corporation | HAN, JONATHAN | 2818 | §102§103§112 | Non-Final OA | — | Pending | Feb 27, 2020 |
| 15859415 | PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | MIYOSHI, JESSE Y | 2898 | §112 | Final Rejection | 62d | AI Ready | Dec 30, 2017 |
