Prosecution Insights
Prosecution Insights
Technology areas: Computing & Software • Semiconductors, Circuits & Optics
108 pending office actions • 1 client • 97 examiners • 38 art units • 42 of 108 (39%) have an AI response strategy ready • 142 patents granted in the last 365 days
Alliance IP, LLC - Intel focuses its patent prosecution efforts within the Semiconductors, Circuits & Optics technology area. The firm has managed a total of 2403 career applications, establishing a substantial track record in this specialized field. Currently, the firm is handling 72 pending office actions, reflecting an active engagement with the USPTO.
The firm maintains a resolved allowance rate pct of 90.47, which indicates a high level of success in securing patent grants for its clients. This performance is achieved with an avg office actions per allowance of 3.36. This average suggests that prosecution in the Semiconductors, Circuits & Optics sector often requires several rounds of substantive negotiation and amendment.
For practitioners, the 90.47 resolved allowance rate pct serves as a benchmark for the firm's effectiveness. The 3.36 avg office actions per allowance provides a realistic expectation for the duration and complexity of the prosecution cycle. With 2403 career applications and 72 pending office actions, the firm demonstrates consistent experience in navigating the complexities of semiconductor-related intellectual property.
Based on the USPTO statutory response window for each pending office action. 33 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 33 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 5 (5%) |
| §103 only | 33 (31%) |
| §102 only | 6 (6%) |
| §112 only | 2 (2%) |
| Double-patenting only | 2 (2%) |
| Double-patenting + other | 1 (1%) |
| Multi-statute (no §101) | 59 (55%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ZARNEKE, DAVID A | 4 | 71.0% | +11.2% |
| ENDRESEN, KIRSTEN DANIELA | 3 | 71.3% | +15.6% |
| SMITH, CHAD | 3 | 78.9% | +20.3% |
| DALEY, CHRISTOPHER ANTHONY | 2 | 84.0% | +10.5% |
| MANHEIM, MARC ETIENNE | 2 | 83.0% | +19.6% |
| SYLVIA, CHRISTINA A | 2 | 87.5% | +9.6% |
| JEFFERSON, QUOVAUNDA | 2 | 79.3% | +8.7% |
| JANSEN II, MICHAEL J | 1 | 67.0% | +19.0% |
| SU, STEPHANIE T | 1 | 67.1% | +29.4% |
| DARE, RYAN A | 1 | 76.0% | +8.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17698928 | PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX | SYLVIA, CHRISTINA A | 30d |
| 19239325 | DIE-TO-DIE INTERCONNECT | DALEY, CHRISTOPHER ANTHONY | — |
| 18148338 | MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES | SYLVIA, CHRISTINA A | — |
| 17868557 | EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE | MANHEIM, MARC ETIENNE | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | MUNOZ, ANDRES F | 77d overdue |
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | PILLAY, DEVINA | 73d overdue |
| 17855568 | SINX BASED SURFACE FINISH ARCHITECTURE | ONUTA, TIBERIU DAN | 49d overdue |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | JEFFERSON, QUOVAUNDA | 31d overdue |
| 17957953 | HARDWARE ACCELERATION FOR INTERFACE TYPE CONVERSIONS | HEBERT, THEODORE E | 4d overdue |
| 18066271 | DYNAMICALLY MODIFIABLE AIR MOVERS AND CONTROL THEREOF | WOLCOTT, BRIAN P | 2d overdue |
| 17711671 | PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS | CHAVEZ, RENEE D | 5d |
| 17991811 | EXECUTABLE PASSING USING MAILBOX REGISTERS | SPANN, COURTNEY P | 12d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | ZARNEKE, DAVID A | 22d |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | ZARNEKE, DAVID A | 78d |
| 19001121 | Untitled | JANSEN II, MICHAEL J | — |
| 19288619 | INDEPENDENT SAFETY MONITORING OF AN AUTOMATED DRIVING SYSTEM | SU, STEPHANIE T | — |
| 19239325 | DIE-TO-DIE INTERCONNECT | DALEY, CHRISTOPHER ANTHONY | — |
| 18477836 | TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE | ENDRESEN, KIRSTEN DANIELA | — |
| 18346039 | PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVING PROCESS TOLERANCE | SMITH, CHAD | — |
| 18325512 | KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME | MANHEIM, MARC ETIENNE | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 108 |
| Art Unit | Apps |
|---|---|
| 2874 | 9 |
| 2184 | 4 |
| 2891 | 4 |
| 2814 | 4 |
| 2899 | 4 |
| 2897 | 4 |
| 2817 | 4 |
| 2818 | 4 |
| 2841 | 3 |
| 2812 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19001121 | Untitled | Intel Corporation | JANSEN II, MICHAEL J | §102§103 | Final Rejection | — | Pending | ||
| 19288619 | INDEPENDENT SAFETY MONITORING OF AN AUTOMATED DRIVING SYSTEM | Intel Corporation | SU, STEPHANIE T | 3662 | §103 | Non-Final OA | — | Pending | Aug 01, 2025 |
| 19239325 | DIE-TO-DIE INTERCONNECT | Intel Corporation | DALEY, CHRISTOPHER ANTHONY | 2184 | DP | Non-Final OA | — | Pending | Jun 16, 2025 |
| 19075313 | ISOLATED POWER DOMAINS IN A COMPUTING DEVICE | Intel Corporation | DARE, RYAN A | 2132 | §103§112 | Non-Final OA | 40d | Pending | Mar 10, 2025 |
| 19107813 | DISTRIBUTED ADDRESS TRANSLATION SERVICES | Intel Corporation | YOON, ALEXANDER J | 2135 | §103§112 | Final Rejection | — | Pending | Feb 28, 2025 |
| 19106586 | COMMUNICATION OF MEDIA CONFIGURATION INFORMATION OVER A SERIAL COMMUNICATION INTERFACE | Intel Corporation | YIMER, GETENTE A | §103 | Non-Final OA | — | Pending | Feb 25, 2025 | |
| 18866007 | TECHNOLOGIES FOR LID ANGLE ESTIMATION | Intel Corporation | MARINELLI, PATRICK | §103DP | Non-Final OA | — | Pending | Nov 14, 2024 | |
| 18940819 | Tall DIMM Structural Retention | Intel Corporation | KRIM, PETER | 2841 | §102§103 | Non-Final OA | — | Pending | Nov 07, 2024 |
| 18920362 | CHARACTERIZING AND MARGINING MULTI-VOLTAGE SIGNAL ENCODING FOR INTERCONNECTS | Intel Corporation | KNAPP, JUSTIN R | 2112 | DP | Final Rejection | 40d | AI Ready | Oct 18, 2024 |
| 18899209 | FLEXIBLE MOUNTING STRUCTURES FOR SURFACE MOUNT COMPONENTS | Intel Corporation | MISHLER, ROBIN J | 2628 | §103 | Final Rejection | 15d overdue | Pending | Sep 27, 2024 |
| 18843970 | MECHANISMS FOR MULTI-CARRIER TRANSMIT SWITCHING FOR NEW RADIO SYSTEMS IN 5G RAN1 | Intel Corporation | HUYNH, DUNG B. | §103§112 | Non-Final OA | — | Pending | Sep 04, 2024 | |
| 18838740 | TECHNOLOGIES FOR LOW POWER INDOOR AND OUTDOOR DETECTION | Intel Corporation | TRAN, VI N | §101§102§103 | Non-Final OA | — | Pending | Aug 15, 2024 | |
| 18833337 | SYSTEMS AND METHODS FOR TIMING CONTROL AND UCI MULTIPLEXING IN MULTI-TRP MULTI-PANEL OPERATION | Intel Corporation | COBY, FRANTZ | §103 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18833340 | SHARING THE CHANNEL ACCESS OCCUPANCY TIME AMONG DEVICES IN NEW RADIO (NR) SIDELINK OPERATING IN FREQUENCY RANGE 1 (FR-1) UNLICENSED BAND | Intel Corporation | SIXTO, NANCY | §103 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18832842 | DYNAMIC TRANSFORM PRECODING INDICATION FOR PHYSICAL UPLINK SHARED CHANNEL AND/OR MSG3 TRANSMISSION | Intel Corporation | SMARTH, GERALD A | §103 | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18777764 | DETECTION AND CALCULATION OF HEART RATE RECOVERY IN NON-CLINICAL SETTINGS | Intel Corporation | PORTILLO, JAIRO H | §101§102§103DP | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18759822 | EMULATION AND AUTONOMOUS DEVICE MANAGEMENT OF EMBEDDED DEVICES OPERATING ON VARIOUS INTERCONNECTS VIA A MULTI-DEVICE HOST CONTROLLER | Intel Corporation | OBERLY, ERIC T | 2184 | §102§103 | Final Rejection | — | AI Ready | Jun 29, 2024 |
| 18758041 | HYBRID COOLING SYSTEM AND ELECTROMAGNETIC INTERFERENCE SHIELD | Intel Corporation | JALALI, AMIR A. | 2841 | §102 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18738798 | POWER OPTIMIZED MULTI-REGIONAL UPDATE DISPLAY | Intel Corporation | AZARI, SEPEHR | 2621 | §102§103 | Final Rejection | — | AI Ready | Jun 10, 2024 |
| 18620866 | TECHNOLOGIES FOR PROGRAMMABLE MICRORING RESONATORS | Intel Corporation | KIANNI, KAVEH C | 2874 | §103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18395162 | VIRTUAL ENVIRONMENT MODIFICATIONS BASED ON USER BEHAVIOR OR CONTEXT | Intel Corporation | BLAUFELD, JUSTIN R | 2151 | §102§103§112 | Final Rejection | 54d | AI Ready | Dec 22, 2023 |
| 18535544 | APPARATUS FOR UE MEASUREMENT DELAY AND GRANULARITY FOR NEW RADIO POSITIONING MEASUREMENT | Intel Corporation | EISNER, RONALD | 2644 | §103 | Final Rejection | 7d | AI Ready | Dec 11, 2023 |
| 18565408 | METHOD AND APPARATUS FOR MODIFYING A SUBSTRATE | Intel Corporation | EVANGELISTA, THEODORE JUSTINE | §102§103§112 | Non-Final OA | — | Pending | Nov 29, 2023 | |
| 18492007 | COMPOSABLE TRUSTED EXECUTION ENVIRONMENTS | Intel Corporation | MILLS, PAUL V | 2196 | §103 | Final Rejection | 41d | AI Ready | Oct 23, 2023 |
| 18477836 | TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE | Intel Corporation | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103§112 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18552213 | PRINTED CIRCUIT BOARD PIN FIELD SIGNAL ROUTING | Intel Corporation | SOUNDRANAYAGAM, RAYAPPU NMN | §102§103 | Non-Final OA | — | Pending | Sep 25, 2023 | |
| 18240762 | OPTICAL CONNECTIVITY FOR INTERCONNECT TECHNOLOGIES | Intel Corporation | SINGH, DALZID E | §102 | Non-Final OA | — | Pending | Aug 31, 2023 | |
| 18264214 | TECHNOLOGIES FOR WIRELESS SENSOR NETWORKS | Intel Corporation | ABAZA, AYMAN A | 2465 | §103 | Non-Final OA | 14d | AI Ready | Aug 03, 2023 |
| 18362308 | TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED CIRCUIT DIES | Intel Corporation | HOLLWEG, THOMAS A | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 | |
| 18346212 | TWO-TERMINAL FERROELECTRIC PEROVSKITE DIODE MEMORY ELEMENT | Intel Corporation | STUESSY, NOLAN GABRIEL | §103 | Non-Final OA | — | Pending | Jul 01, 2023 | |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | Intel Corporation | ERDEM, FAZLI | §102 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18345208 | STREAMING FABRIC INTERFACE | Intel Corporation | HUYNH, KIM T | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18217165 | ADAPTERS FOR HETEROGENOUS OPTICAL CONNECTORS | Intel Corporation | RAHLL, JERRY T | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18345106 | TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR | Intel Corporation | JORDAN, ANDREW | §102§103§112 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18346098 | FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT | Intel Corporation | ANYA, IGWE U | §102 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18346039 | PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVING PROCESS TOLERANCE | Intel Corporation | SMITH, CHAD | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18344042 | ARCHITECTURAL INTERFACE FOR ADDRESS TRANSLATION CACHE (ATC) IN XPU TO SUBMIT COMMAND DIRECTLY TO GUEST SOFTWARE | Intel Corporation | LI, SIDNEY | §103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18342422 | TECHNOLOGIES FOR A HYBRID OPTICAL CHIP-TO-CHIP COUPLING | Intel Corporation | TAVLYKAEV, ROBERT FUATOVICH | §102§103 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18209827 | AUTOMATIC TUNING OF HETEROGENOUS WIRELESS INFRASTRUCTURE | Intel Corporation | CHEEMA, HASAN ALI | §103 | Non-Final OA | — | Pending | Jun 14, 2023 | |
| 18334025 | HARDWARE ACCELERATION IN A NETWORK INTERFACE DEVICE | Intel Corporation | NGUYEN, VAN H | §102§112 | Non-Final OA | — | Pending | Jun 13, 2023 | |
| 18326773 | DYNAMIC HARDWARE PROFILE MODIFICATION | Intel Corporation | AYERS, MICHAEL W | §102§103§112 | Non-Final OA | — | Pending | May 31, 2023 | |
| 18326918 | REGISTER REPLAY STATE MACHINE | Intel Corporation | WHITESELL, AUDREY EMMA | §102§103§112 | Non-Final OA | — | Pending | May 31, 2023 | |
| 18325512 | KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME | Intel Corporation | MANHEIM, MARC ETIENNE | §102§103 | Non-Final OA | — | Pending | May 30, 2023 | |
| 18324640 | HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES | Intel Corporation | TURNER, BRIAN | §103 | Non-Final OA | — | Pending | May 26, 2023 | |
| 18323521 | SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE | Intel Corporation | MINNEY, GABRIEL SEBASTIAN | §102§103 | Non-Final OA | — | Pending | May 25, 2023 | |
| 18323812 | SOFTWARE-BASED PHYSICAL LAYER CONFIGURATION | Intel Corporation | PHAN, RAYMOND NGAN | §101§103§112Other | Non-Final OA | — | Pending | May 25, 2023 | |
| 18130404 | Liquid-Proof Edge Connector Designs for Immersion Cooling | Intel Corporation | PAUMEN, GARY F | 2834 | §102§103 | Final Rejection | — | Pending | Apr 03, 2023 |
| 18194147 | TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES | Intel Corporation | SMITH, CHAD | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18191242 | ON-PACKAGE EMBEDDED COOLING DEVICE | Intel Corporation | WRIGHT, TUCKER J | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2023 |
| 18189808 | ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACKSIDE MEMORY USING HIGH PERFORMANCE (HP) THIN FILM TRANSISTOR (TFT) MATERIAL | Intel Corporation | SALERNO, SARAH KATE | 2814 | §102§103 | Final Rejection | — | Pending | Mar 24, 2023 |
| 18188577 | STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY | Intel Corporation | ANGUIANO, MICHAEL | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 23, 2023 |
| 18188297 | ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT | Intel Corporation | TSO, STANLEY | 2847 | §102§103 | Non-Final OA | 71d | AI Ready | Mar 22, 2023 |
| 18115711 | LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Feb 28, 2023 |
| 18168927 | ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC INTEGRATED CIRCUIT (PIC) | Intel Corporation | SMITH, CHAD | 2874 | §102§103§112 | Non-Final OA | — | Pending | Feb 14, 2023 |
| 18091616 | TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18091583 | TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18148871 | FIELD EFFECT TRANSISTOR COMPRISING TRANSITION METAL DICHALCOGENIDE (TMD) AND FERROELECTRIC MATERIAL | Intel Corporation | ALAM, MOHAMMED R | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18148338 | MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES | Intel Corporation | SYLVIA, CHRISTINA A | 2817 | §112 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18148355 | INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103 | Final Rejection | — | Pending | Dec 29, 2022 |
| 18090420 | REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS | Intel Corporation | VU, HUNG K | 2897 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18147457 | ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER | Intel Corporation | LOHAKARE, PRATIKSHA JAYANT | 2818 | §102§103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18089022 | MECHANISM TO RECOMPOSE WORKLOAD PACKAGES IN A COMPUTING ENVIRONMENT | Intel Corporation | VINCENT, ROSS MICHAEL | 2196 | §103 | Non-Final OA | — | AI Ready | Dec 27, 2022 |
| 18083493 | PROBABILISTIC AND DETERMINISTIC LOGIC DEVICES WITH REDUCED SYMMETRY MATERIALS | Intel Corporation | KING, DOUGLAS | 2824 | §103 | Non-Final OA | — | Pending | Dec 17, 2022 |
| 18066271 | DYNAMICALLY MODIFIABLE AIR MOVERS AND CONTROL THEREOF | Intel Corporation | WOLCOTT, BRIAN P | 3711 | §102§103§112 | Final Rejection | 2d overdue | AI Ready | Dec 14, 2022 |
| 18061126 | POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §103 | Final Rejection | — | Pending | Dec 02, 2022 |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §102§103 | Final Rejection | 31d overdue | AI Ready | Dec 02, 2022 |
| 18061283 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Intel Corporation | JEAN BAPTISTE, WILNER | 2899 | §102§103 | Final Rejection | 46d | AI Ready | Dec 02, 2022 |
| 18061237 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Intel Corporation | AHMADI, MOHSEN | 2896 | §103§112 | Final Rejection | — | AI Ready | Dec 02, 2022 |
| 18061181 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Intel Corporation | GEYER, SCOTT B | 2812 | §112 | Final Rejection | 63d | Pending | Dec 02, 2022 |
| 18061109 | PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING | Intel Corporation | FREAL, JOHN BRENDAN | 2847 | §102§103 | Final Rejection | 14d | AI Ready | Dec 02, 2022 |
| 17992010 | REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2022 |
| 17991811 | EXECUTABLE PASSING USING MAILBOX REGISTERS | Intel Corporation | SPANN, COURTNEY P | 2183 | §103§112 | Final Rejection | 12d | AI Ready | Nov 21, 2022 |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | Intel Corporation | ZARNEKE, DAVID A | §102§103 | Final Rejection | 22d | AI Ready | Nov 16, 2022 | |
| 17972670 | MECHANISM TO DETERMINE CABLE INFORMATION | Intel Corporation | DALEY, CHRISTOPHER ANTHONY | 2184 | §102§103 | Non-Final OA | — | AI Ready | Oct 25, 2022 |
| 17958333 | TECHNOLOGIES FOR ADDRESS TRANSLATION CACHE RESERVATION IN OFFLOAD DEVICES | Intel Corporation | TALUKDAR, ARVIND | 2132 | §103§112 | Final Rejection | — | AI Ready | Oct 01, 2022 |
| 17957590 | INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION | Intel Corporation | YASMEEN, NISHATH | 2811 | §103 | Final Rejection | — | AI Ready | Sep 30, 2022 |
| 17957953 | HARDWARE ACCELERATION FOR INTERFACE TYPE CONVERSIONS | Intel Corporation | HEBERT, THEODORE E | 2199 | §101§103 | Final Rejection | 4d overdue | AI Ready | Sep 30, 2022 |
| 17956421 | DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 12d | AI Ready | Sep 29, 2022 |
| 17954131 | TECHNOLOGIES FOR HYBRID DIGITAL/ANALOG PROCESSORS FOR A QUANTUM COMPUTER | Intel Corporation | WAJE, CARLO C | 2151 | §102§103 | Non-Final OA | — | Pending | Sep 27, 2022 |
| 17951024 | ARCHITECTURAL INTERFACES FOR GUEST SOFTWARE TO SUBMIT COMMANDS TO AN ADDRESS TRANSLATION CACHE IN XPUs | Intel Corporation | FRANKLIN, RICHARD B | 2181 | §103 | Final Rejection | — | Pending | Sep 22, 2022 |
| 17947071 | FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES | Intel Corporation | AHMED, SHAHED | 2813 | §102 | Final Rejection | 16d | AI Ready | Sep 16, 2022 |
| 17903856 | SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS | Intel Corporation | XU, ZHIJUN | 2818 | §102§103 | Final Rejection | — | AI Ready | Sep 06, 2022 |
| 17890310 | COMPUTING SYSTEM CHASSIS DESIGN FOR NOISE ISOLATION AND THERMAL AIRFLOW | Intel Corporation | MULARSKI, ROSS TERRY | 2841 | §102§103 | Final Rejection | — | Pending | Aug 18, 2022 |
| 17871443 | MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS | Intel Corporation | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Jul 22, 2022 |
| 17870719 | PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AND SYSTEM INCLUDING SAME | Intel Corporation | ENDRESEN, KIRSTEN DANIELA | 2874 | §103 | Final Rejection | — | AI Ready | Jul 21, 2022 |
| 17869372 | TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES | Intel Corporation | PENG, CHARLIE YU | 2874 | §103§112 | Non-Final OA | — | Pending | Jul 20, 2022 |
| 17868557 | EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE | Intel Corporation | MANHEIM, MARC ETIENNE | 2874 | §103 | Final Rejection | — | Pending | Jul 19, 2022 |
| 17856206 | SOURCE AND DRAIN REFRACTORY METAL CAP | Intel Corporation | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | AI Ready | Jul 01, 2022 |
| 17855568 | SINX BASED SURFACE FINISH ARCHITECTURE | Intel Corporation | ONUTA, TIBERIU DAN | 2814 | §102§103 | Final Rejection | 49d overdue | AI Ready | Jun 30, 2022 |
| 17851968 | LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME | Intel Corporation | WANG, NICHOLAS A | 1734 | §103 | Final Rejection | 12d | AI Ready | Jun 28, 2022 |
| 17849557 | TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR | Intel Corporation | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jun 24, 2022 |
| 17849207 | MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF | Intel Corporation | SIPLING, KENNETH MARK | 2818 | §102§103 | Final Rejection | 28d | AI Ready | Jun 24, 2022 |
| 17833648 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103 | Final Rejection | — | AI Ready | Jun 06, 2022 |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103§112 | Non-Final OA | 78d | AI Ready | Jun 06, 2022 |
| 17711671 | PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS | Intel Corporation | CHAVEZ, RENEE D | 2186 | §101§102 | Final Rejection | 5d | AI Ready | Apr 01, 2022 |
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | Intel Corporation | MUNOZ, ANDRES F | 2818 | §102§103 | Final Rejection | 77d overdue | AI Ready | Apr 01, 2022 |
| 17710584 | VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS | Intel Corporation | MARUF, SHEIKH | 2897 | §103 | Final Rejection | 70d overdue | AI Ready | Mar 31, 2022 |
| 17709630 | TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES | Intel Corporation | PATEL, PARESH H | 2858 | §102§103§112 | Non-Final OA | 41d | AI Ready | Mar 31, 2022 |
| 17707366 | THIN CLIENT FORM FACTOR ASSEMBLY | Intel Corporation | TRAN, THANH Y | 2817 | §103 | Non-Final OA | 14d | AI Ready | Mar 29, 2022 |
| 17698928 | PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX | Intel Corporation | SYLVIA, CHRISTINA A | 2817 | §103 | Final Rejection | 30d | AI Ready | Mar 18, 2022 |
| 17688495 | INTERCONNECTS WITH SPINTRONIC LOGIC DEVICES | Intel Corporation | RAHIM, NILUFA | 2893 | §102§103 | Final Rejection | — | Pending | Mar 07, 2022 |
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | Intel Corporation | PILLAY, DEVINA | 1726 | §102§103 | Final Rejection | 73d overdue | AI Ready | Dec 23, 2021 |
| 17558291 | SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECTRIC-TO-DIELECTRIC BONDING | Intel Corporation | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | — | Pending | Dec 21, 2021 |
| 17556159 | TECHNOLOGIES FOR A CONTROLLER HUB WITH A USB CAMERA | Intel Corporation | BORROMEO, JUANITO C | 2184 | §102 | Final Rejection | 11d overdue | AI Ready | Dec 20, 2021 |
| 17484213 | CONFORMAL POWER DELIVERY STRUCTURES | Intel Corporation | PRASAD, NEIL R | 2897 | §102§103 | Non-Final OA | — | Pending | Sep 24, 2021 |
| 17480168 | PREDICTIVE ANALYTICS MODEL MANAGEMENT USING COLLABORATIVE FILTERING | Intel Corporation | PARK, GRACE A | 2144 | §102§103§112 | Final Rejection | 14d | AI Ready | Sep 21, 2021 |
| 17343280 | TECHNOLOGIES FOR PHOTONIC DEMULTIPLEXERS | Intel Corporation | CONNELLY, MICHELLE R | 2874 | §103 | Final Rejection | 74d overdue | AI Ready | Jun 09, 2021 |
| 17076776 | DYNAMIC NETWORK CONTROLLER POWER MANAGEMENT | Intel Corporation | YEN, PAUL JUEI-FU | 2175 | §103 | Final Rejection | 2d overdue | AI Ready | Oct 21, 2020 |
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