Prosecution Insights
Prosecution Insights
84 pending office actions • 1 client • 79 examiners • 56 art units • 72 of 84 (86%) have an AI response strategy ready • 135 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 83 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 83 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 8 (10%) |
| §103 only | 21 (25%) |
| §102 only | 3 (4%) |
| §112 only | 1 (1%) |
| Double-patenting + other | 5 (6%) |
| Multi-statute (no §101) | 46 (55%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| DOAN, THERESA T | 2 | 88.3% | +5.3% |
| TSO, STANLEY | 2 | 76.5% | +34.0% |
| JEAN BAPTISTE, WILNER | 2 | 86.4% | +5.4% |
| ZARNEKE, DAVID A | 2 | 70.9% | +10.6% |
| CHEN, YU | 2 | 67.7% | +29.9% |
| MISHLER, ROBIN J | 1 | 69.1% | +5.3% |
| DARE, RYAN A | 1 | 75.4% | +7.1% |
| DUNNE, KENNETH MICHAEL | 1 | 76.6% | +10.8% |
| KNAPP, JUSTIN R | 1 | 84.6% | +8.2% |
| FRANKLIN, RICHARD B | 1 | 83.3% | +1.2% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18129702 | CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | DOAN, THERESA T | 56d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17479871 | SEMICONDUCTOR DEVICE HAVING SOLDER-FREE DIE CONNECTION TO REDISTRIBUTION LAYER | CAO, PHAT X | 139d overdue |
| 18194553 | MULTI-KEY MEMORY ENCRYPTION PROVIDING EFFICIENT ISOLATION FOR MULTITHREADED PROCESSES | SCHWARTZ, DARREN B | 132d overdue |
| 17475123 | SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT | VAN ROY, TOD THOMAS | 111d overdue |
| 17750016 | COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS | TSO, STANLEY | 105d overdue |
| 17550663 | SYNTHETIC ANTIFERROMAGNET-BASED PROBABILISTIC COMPUTING DEVICES | CRAWFORD EASON, LATANYA N | 89d overdue |
| 17709481 | THREE-DIMENSIONAL STACK COOLING WINGS | LE, THAO P | 79d overdue |
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | MUNOZ, ANDRES F | 77d overdue |
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | PILLAY, DEVINA | 73d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17750016 | COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS | TSO, STANLEY | 105d overdue |
| 18956235 | POTENTIAL COLLISION WARNING SYSTEM BASED ON ROAD USER INTENT PREDICTION | DUNNE, KENNETH MICHAEL | 32d overdue |
| 17956421 | DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING | CHEN, YU | 12d |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | ZARNEKE, DAVID A | 22d |
| 17958053 | METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS | CHEN, YU | 22d |
| 18188297 | ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT | TSO, STANLEY | 71d |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | ZARNEKE, DAVID A | 78d |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 84 |
| Art Unit | Apps |
|---|---|
| 2812 | 6 |
| 2847 | 4 |
| 2818 | 4 |
| 2897 | 3 |
| 2899 | 3 |
| 2893 | 3 |
| 2817 | 3 |
| 2628 | 2 |
| 2874 | 2 |
| 2814 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18899209 | FLEXIBLE MOUNTING STRUCTURES FOR SURFACE MOUNT COMPONENTS | Intel Corporation | MISHLER, ROBIN J | 2628 | §103 | Non-Final OA | 15d overdue | Pending | |
| 19075313 | ISOLATED POWER DOMAINS IN A COMPUTING DEVICE | Intel Corporation | DARE, RYAN A | 2132 | §103§112 | Non-Final OA | 40d | Pending | Mar 10, 2025 |
| 18956235 | POTENTIAL COLLISION WARNING SYSTEM BASED ON ROAD USER INTENT PREDICTION | Intel Corporation | DUNNE, KENNETH MICHAEL | 3669 | DPOther | Non-Final OA | 32d overdue | AI Ready | Nov 22, 2024 |
| 18920362 | CHARACTERIZING AND MARGINING MULTI-VOLTAGE SIGNAL ENCODING FOR INTERCONNECTS | Intel Corporation | KNAPP, JUSTIN R | 2112 | §101§103§112DPOther | Non-Final OA | 40d | AI Ready | Oct 18, 2024 |
| 18893499 | POOLED MEMORY ADDRESS TRANSLATION | Intel Corporation | FRANKLIN, RICHARD B | 2181 | §102§103§112 | Non-Final OA | 14d | AI Ready | Sep 23, 2024 |
| 18794497 | IN-SYSTEM VALIDATION OF INTERCONNECTS BY ERROR INJECTION AND MEASUREMENT | Intel Corporation | XU, MICHAEL | 2113 | §103DP | Non-Final OA | 26d | AI Ready | Aug 05, 2024 |
| 18834151 | CODEBOOK SUPPORT FOR DIFFERENT ANTENNA STRUCTURES AND ENHANCED OPERATION FOR FULL POWER MODE 2 | Intel Corporation | TAYONG, HELENE E | 2631 | §103 | Final Rejection | 41d | AI Ready | Jul 29, 2024 |
| 18664533 | ELECTRONIC DEVICE HAVING AN ORGANIC LIGHT EMITTING DISPLAY | Intel Corporation | KUSUMAKAR, KAREN M | 2897 | §102DP | Non-Final OA | 42d | AI Ready | May 15, 2024 |
| 18619578 | SYSTEMS AND METHODS FOR MANAGEMENT OF DISPLAY ELECTRONICS DURING AUDIO/VIDEO CONFERENCING | Intel Corporation | JONES, CARISSA ANNE | 2691 | §103 | Non-Final OA | 28d | AI Ready | Mar 28, 2024 |
| 18399354 | TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES | Intel Corporation | KHAN, IBRAHIM A | 2628 | §102§103 | Non-Final OA | 1d overdue | AI Ready | Dec 28, 2023 |
| 18399416 | TECHNOLOGIES FOR MICRO-LED OPTICAL COMMUNICATION VIA GLASS WAVEGUIDES | Intel Corporation | CAPUTO, LISA M | 2874 | §102§103 | Non-Final OA | 56d overdue | AI Ready | Dec 28, 2023 |
| 18395162 | VIRTUAL ENVIRONMENT MODIFICATIONS BASED ON USER BEHAVIOR OR CONTEXT | Intel Corporation | BLAUFELD, JUSTIN R | 2151 | §102§103§112 | Non-Final OA | 54d | AI Ready | Dec 22, 2023 |
| 18535544 | APPARATUS FOR UE MEASUREMENT DELAY AND GRANULARITY FOR NEW RADIO POSITIONING MEASUREMENT | Intel Corporation | EISNER, RONALD | 2644 | §103DP | Non-Final OA | 7d | AI Ready | Dec 11, 2023 |
| 18557269 | USER EQUIPMENT (UE) SWITCHING BETWEEN NETWORKS USING MEASUREMENT GAPS | Intel Corporation | HO, CHUONG T | 2412 | §103 | Non-Final OA | 26d | AI Ready | Oct 25, 2023 |
| 18492007 | COMPOSABLE TRUSTED EXECUTION ENVIRONMENTS | Intel Corporation | MILLS, PAUL V | 2196 | §103DP | Non-Final OA | 41d | AI Ready | Oct 23, 2023 |
| 18458919 | MULTI-ORIENTATION DISPLAY DEVICE | Intel Corporation | WU, JERRY | 2841 | §102§103 | Non-Final OA | 23d | AI Ready | Aug 30, 2023 |
| 18264214 | TECHNOLOGIES FOR WIRELESS SENSOR NETWORKS | Intel Corporation | JOHNSON, AMY COHEN | 2465 | §103 | Non-Final OA | 14d | AI Ready | Aug 03, 2023 |
| 18340584 | OBJECT TRACKING AND IDENTIFICATION USING INTELLIGENT CAMERA ORCHESTRATION | Intel Corporation | GORADIA, SHEFALI DINESH | 2676 | §101§102§103 | Final Rejection | 62d | AI Ready | Jun 23, 2023 |
| 18308595 | DISTRIBUTABLE RUNTIME SNAPSHOTS | Intel Corporation | CUNNINGHAM II, GREGORY S | 3694 | §102§103 | Non-Final OA | 61d | Pending | Apr 27, 2023 |
| 18131783 | ADAPTIVE MULTIMODAL EVENT DETECTION | Intel Corporation | LE, PETER D | 2488 | §102§103 | Non-Final OA | 62d | Pending | Apr 06, 2023 |
| 18194553 | MULTI-KEY MEMORY ENCRYPTION PROVIDING EFFICIENT ISOLATION FOR MULTITHREADED PROCESSES | Intel Corporation | SCHWARTZ, DARREN B | 2435 | §101§103§112 | Non-Final OA | 132d overdue | Pending | Mar 31, 2023 |
| 18194303 | VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | Intel Corporation | ERDEM, FAZLI | 2812 | §102 | Non-Final OA | 56d | Pending | Mar 31, 2023 |
| 18194550 | SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS | Intel Corporation | WILLS-BURNS, CHINEYERE D | 2673 | §102§103 | Non-Final OA | 62d | Pending | Mar 31, 2023 |
| 18194338 | SIMULTANEOUS LOCALIZATION AND MAPPING USING DEPTH MODELING | Intel Corporation | KRASNIC, BERNARD | 2671 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18129702 | CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | Intel Corporation | DOAN, THERESA T | 2814 | §103 | Non-Final OA | 56d | Pending | Mar 31, 2023 |
| 18192601 | INTEGRATED CIRCUIT DEVICE WITH HETEROGENOUS TRANSISTORS | Intel Corporation | GHYKA, ALEXANDER G | 2812 | §102§103 | Non-Final OA | 50d | Pending | Mar 29, 2023 |
| 18188297 | ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT | Intel Corporation | TSO, STANLEY | 2847 | §102§103§112 | Final Rejection | 71d | AI Ready | Mar 22, 2023 |
| 18121315 | DYNAMIC SPEAKER COILS AS RADIO FREQUENCY ANTENNAS IN MOBILE COMPUTING DEVICES | Intel Corporation | SELLERS, DANIEL R | 2637 | §102 | Non-Final OA | 84d | Pending | Mar 14, 2023 |
| 18091676 | TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN NUMBERS | Intel Corporation | JEAN BAPTISTE, WILNER | 2899 | §102§112 | Non-Final OA | 23d overdue | AI Ready | Dec 30, 2022 |
| 18148617 | TECHNOLOGIES FOR HIGH-PERFORMANCE MAGNETOELECTRIC SPIN-ORBIT LOGIC | Intel Corporation | RAMPERSAUD, PRIYA M | §102§103§112 | Non-Final OA | 3d overdue | AI Ready | Dec 30, 2022 | |
| 18091188 | ELECTRICAL LAYER WITH ROUGHENED SURFACES | Intel Corporation | REMAVEGE, CHRISTOPHER | 1713 | §102§112 | Non-Final OA | 22d overdue | AI Ready | Dec 29, 2022 |
| 18148147 | VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL | Intel Corporation | BOWEN, ADAM S | 2897 | §102§103 | Non-Final OA | 3d overdue | AI Ready | Dec 29, 2022 |
| 18066271 | DYNAMICALLY MODIFIABLE AIR MOVERS AND CONTROL THEREOF | Intel Corporation | WOLCOTT, BRIAN P | 3711 | §102§103 | Non-Final OA | 2d overdue | AI Ready | Dec 14, 2022 |
| 18061954 | MEMORY TAGGING AND TRACKING FOR OFFLOADED FUNCTIONS AND CALLED MODULES | Intel Corporation | SUN, CHARLIE | 2198 | §103 | Non-Final OA | 16d overdue | AI Ready | Dec 05, 2022 |
| 18061283 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Intel Corporation | JEAN BAPTISTE, WILNER | 2899 | §102§103§112 | Non-Final OA | 46d | AI Ready | Dec 02, 2022 |
| 18061109 | PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING | Intel Corporation | FREAL, JOHN BRENDAN | 2847 | §102§103 | Non-Final OA | 14d | AI Ready | Dec 02, 2022 |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §102§103 | Non-Final OA | 31d overdue | AI Ready | Dec 02, 2022 |
| 18061181 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Intel Corporation | GEYER, SCOTT B | 2812 | §102§103§112 | Non-Final OA | 63d | Pending | Dec 02, 2022 |
| 17991811 | EXECUTABLE PASSING USING MAILBOX REGISTERS | Intel Corporation | SPANN, COURTNEY P | 2183 | §103 | Non-Final OA | 12d | AI Ready | Nov 21, 2022 |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | Intel Corporation | ZARNEKE, DAVID A | §102§103 | Non-Final OA | 22d | AI Ready | Nov 16, 2022 | |
| 17920839 | FEDERATED LEARNING OPTIMIZATIONS | Intel Corporation | MAUNI, HUMAIRA ZAHIN | 2141 | §101§103 | Final Rejection | 19d overdue | AI Ready | Oct 24, 2022 |
| 17967037 | COARSE AND HIERARCHICAL SWEEP SAMPLING IN MEMORY TRAINING | Intel Corporation | SADLER, NATHAN | 2139 | §103§112 | Final Rejection | 29d | AI Ready | Oct 17, 2022 |
| 17958395 | INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §102§103§112 | Non-Final OA | 15d overdue | AI Ready | Oct 01, 2022 |
| 17957953 | HARDWARE ACCELERATION FOR INTERFACE TYPE CONVERSIONS | Intel Corporation | HEBERT, THEODORE E | 2199 | §101§103 | Non-Final OA | 4d overdue | AI Ready | Sep 30, 2022 |
| 17958053 | METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | 22d | AI Ready | Sep 30, 2022 |
| 17956421 | DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | 12d | AI Ready | Sep 29, 2022 |
| 17956296 | TECHNOLOGIES FOR PEROVSKITE TRANSISTORS | Intel Corporation | OZDEN, ILKER NMN | 2812 | §102§103 | Non-Final OA | 4d overdue | AI Ready | Sep 29, 2022 |
| 17953648 | STACKED PEROVSKITE FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICES | Intel Corporation | RAHMAN, MOHAMMAD A | 2898 | §112 | Non-Final OA | 5d | AI Ready | Sep 27, 2022 |
| 17950773 | SYSTEMS AND METHODS FOR CODE GENERATION FOR A PLURALITY OF ARCHITECTURES | Intel Corporation | COYER, RYAN D | 2191 | §101§112 | Non-Final OA | 35d overdue | AI Ready | Sep 22, 2022 |
| 17947071 | FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES | Intel Corporation | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | 16d | AI Ready | Sep 16, 2022 |
| 17943354 | TECHNOLOGIES FOR GLASS CORE INDUCTOR | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103§112 | Non-Final OA | 23d | AI Ready | Sep 13, 2022 |
| 17941960 | SELECTIVE CHECKING FOR ERRORS | Intel Corporation | PERRY, VICTOR NICHOLAS | 2111 | §103 | Final Rejection | 29d | AI Ready | Sep 09, 2022 |
| 17899336 | TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES | Intel Corporation | AYCHILLHUM, ANDARGIE M | 2847 | §103 | Non-Final OA | 47d | AI Ready | Aug 30, 2022 |
| 17868408 | OPTIMIZATIONS FOR VIRTUAL ENVIRONMENT EXECUTION IN A NETWORK | Intel Corporation | KIM, DONG U | 2197 | §103§112 | Final Rejection | 11d overdue | AI Ready | Jul 19, 2022 |
| 17856742 | MODULAR FIRMWARE UPDATE | Intel Corporation | KABIR, MOHAMMAD H | 2192 | §101§103 | Final Rejection | 17d overdue | AI Ready | Jul 01, 2022 |
| 17855568 | SINX BASED SURFACE FINISH ARCHITECTURE | Intel Corporation | DOAN, THERESA T | 2814 | §102§103 | Non-Final OA | 49d overdue | AI Ready | Jun 30, 2022 |
| 17853502 | DIE-TO-DIE INTERCONNECT PROTOCOL LAYER | Intel Corporation | HUYNH, KIM T | 2184 | §103 | Non-Final OA | 12d | AI Ready | Jun 29, 2022 |
| 17851968 | LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME | Intel Corporation | WANG, NICHOLAS A | 1734 | §103 | Final Rejection | 12d | AI Ready | Jun 28, 2022 |
| 17849207 | MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF | Intel Corporation | SIPLING, KENNETH MARK | 2818 | §102§103§112 | Non-Final OA | 28d | AI Ready | Jun 24, 2022 |
| 17847111 | TECHNOLOGIES FOR OVERLAY METROLOGY MARKS | Intel Corporation | BARZYKIN, VICTOR V | 2893 | §102§103 | Non-Final OA | 15d overdue | AI Ready | Jun 22, 2022 |
| 17843976 | VALLEYTRONIC LOGIC DEVICES COMPRISING MONOCHALCOGENIDES | Intel Corporation | MILLER, JAMI VALENTINE | 2818 | §102§103§112 | Non-Final OA | 8d | AI Ready | Jun 18, 2022 |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §103§112 | Non-Final OA | 78d | AI Ready | Jun 06, 2022 |
| 17750016 | COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS | Intel Corporation | TSO, STANLEY | 2847 | §102§103 | Final Rejection | 105d overdue | AI Ready | May 20, 2022 |
| 17733625 | DATA CENTER CLUSTER ARCHITECTURE | Intel Corporation | YU, XIANG | 2455 | §103 | Final Rejection | 77d overdue | AI Ready | Apr 29, 2022 |
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | Intel Corporation | MUNOZ, ANDRES F | 2818 | §102§103§112 | Non-Final OA | 77d overdue | AI Ready | Apr 01, 2022 |
| 17711113 | TECHNOLOGIES FOR A LOW-NOISE-GENERATING INDUCTOR | Intel Corporation | LIAN, MANG TIN BIK | 2837 | §103 | Final Rejection | 15d overdue | AI Ready | Apr 01, 2022 |
| 17711671 | PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS | Intel Corporation | CHAVEZ, RENEE D | 2186 | §101§102 | Final Rejection | 5d | AI Ready | Apr 01, 2022 |
| 17709481 | THREE-DIMENSIONAL STACK COOLING WINGS | Intel Corporation | LE, THAO P | 2818 | §102§103 | Non-Final OA | 79d overdue | AI Ready | Mar 31, 2022 |
| 17710584 | VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS | Intel Corporation | MARUF, SHEIKH | 2897 | §102§103 | Non-Final OA | 70d overdue | AI Ready | Mar 31, 2022 |
| 17709630 | TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES | Intel Corporation | PATEL, PARESH H | 2858 | §102§103 | Final Rejection | 41d | AI Ready | Mar 31, 2022 |
| 17707366 | THIN CLIENT FORM FACTOR ASSEMBLY | Intel Corporation | TRAN, THANH Y | 2817 | §102§103 | Final Rejection | 14d | AI Ready | Mar 29, 2022 |
| 17698928 | PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX | Intel Corporation | SYLVIA, CHRISTINA A | 2817 | §103 | Non-Final OA | 30d | AI Ready | Mar 18, 2022 |
| 17699031 | MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES OF A CORE SUBSTRATE, AND METHOD OF MAKING SAME | Intel Corporation | TRAN, TONY | 2893 | §103 | Final Rejection | 12d | AI Ready | Mar 18, 2022 |
| 17561915 | FORMATION OF METAL CONTACTS TO SILICON GERMANIUM LAYERS WITH ETCH RESISTIVE CAP LAYERS | Intel Corporation | FAYETTE, NATHALIE RENEE | 2812 | §103 | Non-Final OA | 43d overdue | AI Ready | Dec 24, 2021 |
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | Intel Corporation | PILLAY, DEVINA | 1726 | §102§103§112 | Non-Final OA | 73d overdue | AI Ready | Dec 23, 2021 |
| 17556159 | TECHNOLOGIES FOR A CONTROLLER HUB WITH A USB CAMERA | Intel Corporation | BORROMEO, JUANITO C | 2184 | §102 | Final Rejection | 11d overdue | AI Ready | Dec 20, 2021 |
| 17550663 | SYNTHETIC ANTIFERROMAGNET-BASED PROBABILISTIC COMPUTING DEVICES | Intel Corporation | CRAWFORD EASON, LATANYA N | 2813 | §102§103 | Final Rejection | 89d overdue | AI Ready | Dec 14, 2021 |
| 17482131 | MAGNETOELECTRIC SPIN-ORBIT LOGIC DEVICE WITH A TOPOLOGICAL INSULATOR SUPERLATTICE | Intel Corporation | LAWSON, SETH DOUGLAS FRIE | 2893 | §103 | Final Rejection | 114d overdue | AI Ready | Sep 22, 2021 |
| 17480168 | PREDICTIVE ANALYTICS MODEL MANAGEMENT USING COLLABORATIVE FILTERING | Intel Corporation | PARK, GRACE A | 2144 | §102§103§112 | Non-Final OA | 14d | AI Ready | Sep 21, 2021 |
| 17479871 | SEMICONDUCTOR DEVICE HAVING SOLDER-FREE DIE CONNECTION TO REDISTRIBUTION LAYER | Intel Corporation | CAO, PHAT X | 2817 | §102§103§112 | Non-Final OA | 139d overdue | AI Ready | Sep 20, 2021 |
| 17475123 | SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT | Intel Corporation | VAN ROY, TOD THOMAS | 2828 | §103§112 | Final Rejection | 111d overdue | AI Ready | Sep 14, 2021 |
| 17434721 | AUTONOMOUS VEHICLE SYSTEM | Intel Corporation | BUTLER, RODNEY ALLEN | 3666 | §103 | Final Rejection | 30d overdue | AI Ready | Aug 27, 2021 |
| 17343280 | TECHNOLOGIES FOR PHOTONIC DEMULTIPLEXERS | Intel Corporation | CONNELLY, MICHELLE R | 2874 | §103 | Non-Final OA | 74d overdue | AI Ready | Jun 09, 2021 |
| 17076776 | DYNAMIC NETWORK CONTROLLER POWER MANAGEMENT | Intel Corporation | YEN, PAUL JUEI-FU | 2175 | §103 | Final Rejection | 2d overdue | AI Ready | Oct 21, 2020 |
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