Prosecution Insights
Prosecution Insights
107 pending office actions • 1 client • 100 examiners • 46 art units • 44 of 107 (41%) have an AI response strategy ready • 136 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 37 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 37 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 4 (4%) |
| §103 only | 37 (35%) |
| §102 only | 6 (6%) |
| §112 only | 1 (1%) |
| Double-patenting + other | 5 (5%) |
| Multi-statute (no §101) | 53 (50%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MANHEIM, MARC ETIENNE | 3 | 84.6% | +18.2% |
| ERDEM, FAZLI | 2 | 85.4% | +15.8% |
| AHMADI, MOHSEN | 2 | 86.6% | +9.7% |
| JEFFERSON, QUOVAUNDA | 2 | 79.2% | +8.6% |
| ENDRESEN, KIRSTEN DANIELA | 2 | 71.6% | +12.9% |
| ZARNEKE, DAVID A | 2 | 70.8% | +10.7% |
| JANSEN II, MICHAEL J | 1 | 66.9% | +18.7% |
| DARE, RYAN A | 1 | 75.7% | +7.3% |
| YIMER, GETENTE A | 1 | 88.1% | +8.4% |
| CHASE, SHELLY A | 1 | 94.7% | +2.6% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18194303 | VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | ERDEM, FAZLI | 56d |
| 19106586 | COMMUNICATION OF MEDIA CONFIGURATION INFORMATION OVER A SERIAL COMMUNICATION INTERFACE | YIMER, GETENTE A | — |
| 19048585 | MULTI-PROTOCOL SUPPORT ON COMMON PHYSICAL LAYER | CHASE, SHELLY A | — |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | ERDEM, FAZLI | — |
| 17868557 | EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE | MANHEIM, MARC ETIENNE | — |
| 17841451 | PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING | MANHEIM, MARC ETIENNE | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | PILLAY, DEVINA | 73d overdue |
| 18399416 | TECHNOLOGIES FOR MICRO-LED OPTICAL COMMUNICATION VIA GLASS WAVEGUIDES | CAPUTO, LISA M | 56d overdue |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | JEFFERSON, QUOVAUNDA | 31d overdue |
| 17920839 | FEDERATED LEARNING OPTIMIZATIONS | MAUNI, HUMAIRA ZAHIN | 19d overdue |
| 17868408 | OPTIMIZATIONS FOR VIRTUAL ENVIRONMENT EXECUTION IN A NETWORK | KIM, DONG U | 11d overdue |
| 17956296 | TECHNOLOGIES FOR PEROVSKITE TRANSISTORS | OZDEN, ILKER NMN | 4d overdue |
| 17711671 | PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS | CHAVEZ, RENEE D | 5d |
| 17958053 | METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS | CHEN, YU | 22d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18194303 | VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | ERDEM, FAZLI | 56d |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | ZARNEKE, DAVID A | 78d |
| 19001121 | Untitled | JANSEN II, MICHAEL J | — |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | ERDEM, FAZLI | — |
| 18325512 | KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME | MANHEIM, MARC ETIENNE | — |
| 17870719 | PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AND SYSTEM INCLUDING SAME | ENDRESEN, KIRSTEN DANIELA | — |
| 17868557 | EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE | MANHEIM, MARC ETIENNE | — |
| 17849557 | TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR | ENDRESEN, KIRSTEN DANIELA | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 107 |
| Art Unit | Apps |
|---|---|
| 2874 | 9 |
| 2812 | 6 |
| 2893 | 6 |
| 2841 | 4 |
| 2897 | 4 |
| 2817 | 4 |
| 2896 | 4 |
| 2184 | 3 |
| 2814 | 3 |
| 2891 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19001121 | Untitled | Intel Corporation | JANSEN II, MICHAEL J | §102§103 | Non-Final OA | — | Pending | ||
| 19075313 | ISOLATED POWER DOMAINS IN A COMPUTING DEVICE | Intel Corporation | DARE, RYAN A | 2132 | §103§112 | Non-Final OA | 40d | Pending | Mar 10, 2025 |
| 19106586 | COMMUNICATION OF MEDIA CONFIGURATION INFORMATION OVER A SERIAL COMMUNICATION INTERFACE | Intel Corporation | YIMER, GETENTE A | §103 | Non-Final OA | — | Pending | Feb 25, 2025 | |
| 19048585 | MULTI-PROTOCOL SUPPORT ON COMMON PHYSICAL LAYER | Intel Corporation | CHASE, SHELLY A | §103 | Non-Final OA | — | Pending | Feb 07, 2025 | |
| 19010979 | FORWARD ERROR CORRECTION AND CYCLIC REDUNDANCY CHECK MECHANISMS FOR LATENCY-CRITICAL COHERENCY AND MEMORY INTERCONNECTS | Intel Corporation | NGUYEN, STEVE N | 2111 | §103§112Other | Non-Final OA | — | Pending | Jan 06, 2025 |
| 18956235 | POTENTIAL COLLISION WARNING SYSTEM BASED ON ROAD USER INTENT PREDICTION | Intel Corporation | DUNNE, KENNETH MICHAEL | 3669 | DPOther | Non-Final OA | 32d overdue | AI Ready | Nov 22, 2024 |
| 18866007 | TECHNOLOGIES FOR LID ANGLE ESTIMATION | Intel Corporation | MARINELLI, PATRICK | §103DP | Non-Final OA | — | Pending | Nov 14, 2024 | |
| 18940819 | Tall DIMM Structural Retention | Intel Corporation | KRIM, PETER | 2841 | §102§103 | Non-Final OA | — | Pending | Nov 07, 2024 |
| 18838740 | TECHNOLOGIES FOR LOW POWER INDOOR AND OUTDOOR DETECTION | Intel Corporation | TRAN, VI N | §101§102§103 | Non-Final OA | — | Pending | Aug 15, 2024 | |
| 18833340 | SHARING THE CHANNEL ACCESS OCCUPANCY TIME AMONG DEVICES IN NEW RADIO (NR) SIDELINK OPERATING IN FREQUENCY RANGE 1 (FR-1) UNLICENSED BAND | Intel Corporation | SIXTO, NANCY | §103 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18832842 | DYNAMIC TRANSFORM PRECODING INDICATION FOR PHYSICAL UPLINK SHARED CHANNEL AND/OR MSG3 TRANSMISSION | Intel Corporation | SMARTH, GERALD A | §103 | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18832835 | DOWNLINK (DL) OR UPLINK (UL) TRANSMISSION IN DUPLEX OPERATION | Intel Corporation | MORSE, CASON HENSON | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18777764 | DETECTION AND CALCULATION OF HEART RATE RECOVERY IN NON-CLINICAL SETTINGS | Intel Corporation | PORTILLO, JAIRO H | §101§102§103DP | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18759822 | EMULATION AND AUTONOMOUS DEVICE MANAGEMENT OF EMBEDDED DEVICES OPERATING ON VARIOUS INTERCONNECTS VIA A MULTI-DEVICE HOST CONTROLLER | Intel Corporation | OBERLY, ERIC T | 2184 | §102§103 | Final Rejection | — | AI Ready | Jun 29, 2024 |
| 18619578 | SYSTEMS AND METHODS FOR MANAGEMENT OF DISPLAY ELECTRONICS DURING AUDIO/VIDEO CONFERENCING | Intel Corporation | JONES, CARISSA ANNE | 2691 | §103 | Non-Final OA | 28d | AI Ready | Mar 28, 2024 |
| 18610546 | TECHNOLOGIES FOR UPSCALING DISPLAY IMAGE RESOLUTION | Intel Corporation | YICK, JORDAN WAN | 2612 | §103 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18399354 | TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES | Intel Corporation | KHAN, IBRAHIM A | 2628 | §103 | Final Rejection | 1d overdue | AI Ready | Dec 28, 2023 |
| 18399416 | TECHNOLOGIES FOR MICRO-LED OPTICAL COMMUNICATION VIA GLASS WAVEGUIDES | Intel Corporation | CAPUTO, LISA M | 2874 | §102§103 | Final Rejection | 56d overdue | AI Ready | Dec 28, 2023 |
| 18535544 | APPARATUS FOR UE MEASUREMENT DELAY AND GRANULARITY FOR NEW RADIO POSITIONING MEASUREMENT | Intel Corporation | EISNER, RONALD | 2644 | §103 | Final Rejection | 7d | AI Ready | Dec 11, 2023 |
| 18492007 | COMPOSABLE TRUSTED EXECUTION ENVIRONMENTS | Intel Corporation | MILLS, PAUL V | 2196 | §103DP | Non-Final OA | 41d | AI Ready | Oct 23, 2023 |
| 18474393 | TECHNOLOGIES FOR DUAL TUNABLE LASERS IN A PHOTONIC INTEGRATED CIRCUIT DIE | Intel Corporation | XIAO, YUQING | 3645 | §102 | Non-Final OA | — | Pending | Sep 26, 2023 |
| 18552213 | PRINTED CIRCUIT BOARD PIN FIELD SIGNAL ROUTING | Intel Corporation | SOUNDRANAYAGAM, RAYAPPU NMN | §102§103 | Non-Final OA | — | Pending | Sep 25, 2023 | |
| 18240762 | OPTICAL CONNECTIVITY FOR INTERCONNECT TECHNOLOGIES | Intel Corporation | SINGH, DALZID E | §102 | Non-Final OA | — | Pending | Aug 31, 2023 | |
| 18458919 | MULTI-ORIENTATION DISPLAY DEVICE | Intel Corporation | WU, JERRY | 2841 | §102§103 | Non-Final OA | 23d | AI Ready | Aug 30, 2023 |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | Intel Corporation | ERDEM, FAZLI | §102 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18209827 | AUTOMATIC TUNING OF HETEROGENOUS WIRELESS INFRASTRUCTURE | Intel Corporation | CHEEMA, HASAN ALI | §103 | Non-Final OA | — | Pending | Jun 14, 2023 | |
| 18326918 | REGISTER REPLAY STATE MACHINE | Intel Corporation | WHITESELL, AUDREY EMMA | §102§103§112 | Non-Final OA | — | Pending | May 31, 2023 | |
| 18325512 | KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME | Intel Corporation | MANHEIM, MARC ETIENNE | §102§103 | Non-Final OA | — | Pending | May 30, 2023 | |
| 18323812 | SOFTWARE-BASED PHYSICAL LAYER CONFIGURATION | Intel Corporation | PHAN, RAYMOND NGAN | Other | Non-Final OA | — | Pending | May 25, 2023 | |
| 18141154 | TECHNOLOGIES FOR PROCESSING PACKETS ON A NETWORK INTERFACE CONTROLLER WITH HIGH-BANDWIDTH MEMORY CHIPLETS | Intel Corporation | KIM, HARRY H | §103 | Non-Final OA | — | Pending | Apr 28, 2023 | |
| 18308595 | DISTRIBUTABLE RUNTIME SNAPSHOTS | Intel Corporation | CUNNINGHAM II, GREGORY S | 3694 | §102§103 | Non-Final OA | 61d | Pending | Apr 27, 2023 |
| 18130404 | Liquid-Proof Edge Connector Designs for Immersion Cooling | Intel Corporation | PAUMEN, GARY F | 2834 | §103 | Final Rejection | — | Pending | Apr 03, 2023 |
| 18194338 | SIMULTANEOUS LOCALIZATION AND MAPPING USING DEPTH MODELING | Intel Corporation | KRASNIC, BERNARD | 2671 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18194303 | VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | Intel Corporation | ERDEM, FAZLI | 2812 | §102 | Non-Final OA | 56d | Pending | Mar 31, 2023 |
| 18194550 | SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS | Intel Corporation | WILLS-BURNS, CHINEYERE D | 2673 | §102§103 | Non-Final OA | 62d | Pending | Mar 31, 2023 |
| 18129702 | CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | Intel Corporation | FAHMY, WAEL M | 2814 | §103 | Non-Final OA | 56d | Pending | Mar 31, 2023 |
| 18192804 | INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES | Intel Corporation | GONZALES, VICENTE ROLANDO | 2893 | §102§103§112 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18192601 | INTEGRATED CIRCUIT DEVICE WITH HETEROGENOUS TRANSISTORS | Intel Corporation | GHYKA, ALEXANDER G | 2812 | §102§103 | Non-Final OA | 50d | Pending | Mar 29, 2023 |
| 18191242 | ON-PACKAGE EMBEDDED COOLING DEVICE | Intel Corporation | WRIGHT, TUCKER J | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2023 |
| 18126833 | FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS | Intel Corporation | LIU, BENJAMIN T | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 27, 2023 |
| 18189808 | ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACKSIDE MEMORY USING HIGH PERFORMANCE (HP) THIN FILM TRANSISTOR (TFT) MATERIAL | Intel Corporation | SALERNO, SARAH KATE | 2814 | §102§103 | Non-Final OA | — | Pending | Mar 24, 2023 |
| 18188297 | ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT | Intel Corporation | TSO, STANLEY | 2847 | §102§103§112 | Final Rejection | 71d | AI Ready | Mar 22, 2023 |
| 18121315 | DYNAMIC SPEAKER COILS AS RADIO FREQUENCY ANTENNAS IN MOBILE COMPUTING DEVICES | Intel Corporation | SELLERS, DANIEL R | 2637 | §102§103 | Non-Final OA | 84d | Pending | Mar 14, 2023 |
| 18115711 | LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Feb 28, 2023 |
| 18168927 | ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC INTEGRATED CIRCUIT (PIC) | Intel Corporation | SMITH, CHAD | 2874 | §102§103§112 | Non-Final OA | — | Pending | Feb 14, 2023 |
| 18091535 | TECHNOLOGIES FOR INTEGRATED GRADED INDEX LENSES IN PHOTONIC CIRCUITS | Intel Corporation | TRAN, HOANG Q | 2874 | §102§103 | Non-Final OA | — | AI Ready | Dec 30, 2022 |
| 18091616 | TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18092012 | GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION | Intel Corporation | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18148871 | FIELD EFFECT TRANSISTOR COMPRISING TRANSITION METAL DICHALCOGENIDE (TMD) AND FERROELECTRIC MATERIAL | Intel Corporation | ALAM, MOHAMMED R | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18148355 | INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103§112 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18148338 | MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES | Intel Corporation | SYLVIA, CHRISTINA A | 2817 | §112 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18147457 | ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER | Intel Corporation | LOHAKARE, PRATIKSHA JAYANT | 2818 | §102§103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18089801 | GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES | Intel Corporation | ROLAND, CHRISTOPHER M | 2893 | §102§103 | Non-Final OA | — | AI Ready | Dec 28, 2022 |
| 18090420 | REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS | Intel Corporation | VU, HUNG K | 2897 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18146311 | TECHNOLOGIES FOR FAN MECHANISM WITH AUTOMATICALLY ADJUSTBLE SIDE VENTING | Intel Corporation | XU, PETER | 2835 | §103 | Non-Final OA | — | Pending | Dec 23, 2022 |
| 18061237 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Intel Corporation | AHMADI, MOHSEN | 2896 | §103§112 | Final Rejection | — | AI Ready | Dec 02, 2022 |
| 18061126 | POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §103 | Final Rejection | — | Pending | Dec 02, 2022 |
| 18061188 | Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein | Intel Corporation | AHMADI, MOHSEN | 2896 | §102§103§112 | Non-Final OA | — | Pending | Dec 02, 2022 |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §102§103 | Final Rejection | 31d overdue | AI Ready | Dec 02, 2022 |
| 18059923 | PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE | Intel Corporation | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | Nov 29, 2022 |
| 17972670 | MECHANISM TO DETERMINE CABLE INFORMATION | Intel Corporation | DALEY, CHRISTOPHER ANTHONY | 2184 | §102§103 | Non-Final OA | — | AI Ready | Oct 25, 2022 |
| 17920839 | FEDERATED LEARNING OPTIMIZATIONS | Intel Corporation | MAUNI, HUMAIRA ZAHIN | 2141 | §101§103 | Final Rejection | 19d overdue | AI Ready | Oct 24, 2022 |
| 17967037 | COARSE AND HIERARCHICAL SWEEP SAMPLING IN MEMORY TRAINING | Intel Corporation | SADLER, NATHAN | 2139 | §103§112 | Final Rejection | 29d | AI Ready | Oct 17, 2022 |
| 17958333 | TECHNOLOGIES FOR ADDRESS TRANSLATION CACHE RESERVATION IN OFFLOAD DEVICES | Intel Corporation | TALUKDAR, ARVIND | 2132 | §103§112DP | Non-Final OA | — | AI Ready | Oct 01, 2022 |
| 17957420 | TECHNOLOGIES FOR OVERLAY COMPONENTS FOR A COMPUTE DEVICE | Intel Corporation | MILLISER, THERON S | 2841 | §102§103 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17958094 | TECHNOLOGIES FOR TRANSISTORS WITH A THIN-FILM FERROELECTRIC | Intel Corporation | WINTERS, SEAN AYERS | 2892 | §102§103 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17958053 | METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | 22d | AI Ready | Sep 30, 2022 |
| 17957590 | INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION | Intel Corporation | YASMEEN, NISHATH | 2811 | §103 | Final Rejection | — | AI Ready | Sep 30, 2022 |
| 17956296 | TECHNOLOGIES FOR PEROVSKITE TRANSISTORS | Intel Corporation | OZDEN, ILKER NMN | 2812 | §102§103 | Non-Final OA | 4d overdue | AI Ready | Sep 29, 2022 |
| 17954131 | TECHNOLOGIES FOR HYBRID DIGITAL/ANALOG PROCESSORS FOR A QUANTUM COMPUTER | Intel Corporation | WAJE, CARLO C | 2151 | §102§103 | Non-Final OA | — | Pending | Sep 27, 2022 |
| 17952161 | VERTICAL FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES | Intel Corporation | RAHMAN, MOHAMMAD A | 2898 | §102§112 | Final Rejection | — | AI Ready | Sep 23, 2022 |
| 17951024 | ARCHITECTURAL INTERFACES FOR GUEST SOFTWARE TO SUBMIT COMMANDS TO AN ADDRESS TRANSLATION CACHE IN XPUs | Intel Corporation | FRANKLIN, RICHARD B | 2181 | §103 | Final Rejection | — | Pending | Sep 22, 2022 |
| 17947071 | FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES | Intel Corporation | AHMED, SHAHED | 2813 | §102 | Final Rejection | 16d | AI Ready | Sep 16, 2022 |
| 17943354 | TECHNOLOGIES FOR GLASS CORE INDUCTOR | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103§112 | Non-Final OA | 23d | AI Ready | Sep 13, 2022 |
| 17903856 | SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS | Intel Corporation | XU, ZHIJUN | 2818 | §102§103 | Final Rejection | — | AI Ready | Sep 06, 2022 |
| 17899336 | TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES | Intel Corporation | AYCHILLHUM, ANDARGIE M | 2847 | §103 | Non-Final OA | 47d | AI Ready | Aug 30, 2022 |
| 17871359 | MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103§112 | Final Rejection | — | Pending | Jul 22, 2022 |
| 17870719 | PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AND SYSTEM INCLUDING SAME | Intel Corporation | ENDRESEN, KIRSTEN DANIELA | 2874 | §103 | Final Rejection | — | AI Ready | Jul 21, 2022 |
| 17869372 | TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES | Intel Corporation | PENG, CHARLIE YU | 2874 | §103§112 | Non-Final OA | — | Pending | Jul 20, 2022 |
| 17868557 | EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE | Intel Corporation | MANHEIM, MARC ETIENNE | 2874 | §103 | Final Rejection | — | Pending | Jul 19, 2022 |
| 17868408 | OPTIMIZATIONS FOR VIRTUAL ENVIRONMENT EXECUTION IN A NETWORK | Intel Corporation | KIM, DONG U | 2197 | §103§112 | Final Rejection | 11d overdue | AI Ready | Jul 19, 2022 |
| 17856969 | SUBSTRATES WITH NITRIDED GLASS CORES | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | — | Pending | Jul 02, 2022 |
| 17856206 | SOURCE AND DRAIN REFRACTORY METAL CAP | Intel Corporation | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | AI Ready | Jul 01, 2022 |
| 17851968 | LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME | Intel Corporation | WANG, NICHOLAS A | 1734 | §103 | Final Rejection | 12d | AI Ready | Jun 28, 2022 |
| 17850676 | TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS | Intel Corporation | HAUGHTON, ANTHONY MICHAEL | 2841 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17849557 | TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR | Intel Corporation | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jun 24, 2022 |
| 17841451 | PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING | Intel Corporation | MANHEIM, MARC ETIENNE | 2874 | §103 | Final Rejection | — | Pending | Jun 15, 2022 |
| 17837732 | TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103§112 | Non-Final OA | — | AI Ready | Jun 10, 2022 |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103§112 | Non-Final OA | 78d | AI Ready | Jun 06, 2022 |
| 17833648 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103 | Final Rejection | — | AI Ready | Jun 06, 2022 |
| 17712090 | DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID METAL INTERCONNECTS | Intel Corporation | TADESSE, YEWEBDAR T | 1717 | §103 | Final Rejection | — | Pending | Apr 02, 2022 |
| 17711113 | TECHNOLOGIES FOR A LOW-NOISE-GENERATING INDUCTOR | Intel Corporation | LIAN, MANG TIN BIK | 2837 | §103 | Final Rejection | 15d overdue | AI Ready | Apr 01, 2022 |
| 17711671 | PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS | Intel Corporation | CHAVEZ, RENEE D | 2186 | §101§102 | Final Rejection | 5d | AI Ready | Apr 01, 2022 |
| 17710584 | VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS | Intel Corporation | MARUF, SHEIKH | 2897 | §103 | Final Rejection | 70d overdue | AI Ready | Mar 31, 2022 |
| 17710556 | TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS | Intel Corporation | MOJADDEDI, OMAR F | 2898 | §103§112DP | Non-Final OA | — | Pending | Mar 31, 2022 |
| 17709630 | TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES | Intel Corporation | PATEL, PARESH H | 2858 | §102§103§112 | Non-Final OA | 41d | AI Ready | Mar 31, 2022 |
| 17707366 | THIN CLIENT FORM FACTOR ASSEMBLY | Intel Corporation | TRAN, THANH Y | 2817 | §103 | Non-Final OA | 14d | AI Ready | Mar 29, 2022 |
| 17703245 | NEAR-DATA PROCESSING IN SHARDED STORAGE ENVIRONMENTS | Intel Corporation | MENDEL, JULIAN SCOTT | 2133 | §103 | Final Rejection | — | Pending | Mar 24, 2022 |
| 17699031 | MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES OF A CORE SUBSTRATE, AND METHOD OF MAKING SAME | Intel Corporation | TRAN, TONY | 2893 | §103 | Final Rejection | 12d | AI Ready | Mar 18, 2022 |
| 17688495 | INTERCONNECTS WITH SPINTRONIC LOGIC DEVICES | Intel Corporation | RAHIM, NILUFA | 2893 | §102§103 | Final Rejection | — | Pending | Mar 07, 2022 |
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | Intel Corporation | PILLAY, DEVINA | 1726 | §102§103§112 | Final Rejection | 73d overdue | AI Ready | Dec 23, 2021 |
| 17558291 | SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECTRIC-TO-DIELECTRIC BONDING | Intel Corporation | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | — | Pending | Dec 21, 2021 |
| 17556159 | TECHNOLOGIES FOR A CONTROLLER HUB WITH A USB CAMERA | Intel Corporation | BORROMEO, JUANITO C | 2184 | §102 | Final Rejection | 11d overdue | AI Ready | Dec 20, 2021 |
| 17484213 | CONFORMAL POWER DELIVERY STRUCTURES | Intel Corporation | PRASAD, NEIL R | 2897 | §103 | Non-Final OA | — | Pending | Sep 24, 2021 |
| 17434721 | AUTONOMOUS VEHICLE SYSTEM | Intel Corporation | BUTLER, RODNEY ALLEN | 3666 | §103 | Final Rejection | 30d overdue | AI Ready | Aug 27, 2021 |
| 17343280 | TECHNOLOGIES FOR PHOTONIC DEMULTIPLEXERS | Intel Corporation | CONNELLY, MICHELLE R | 2874 | §103 | Final Rejection | 74d overdue | AI Ready | Jun 09, 2021 |
| 17076776 | DYNAMIC NETWORK CONTROLLER POWER MANAGEMENT | Intel Corporation | YEN, PAUL JUEI-FU | 2175 | §103 | Final Rejection | 2d overdue | AI Ready | Oct 21, 2020 |
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