Prosecution Insights
Prosecution Insights
Technology areas: Computing & Software • Semiconductors, Circuits & Optics
117 pending office actions • 1 client • 107 examiners • 40 art units • 42 of 117 (36%) have an AI response strategy ready • 165 patents granted in the last 365 days
Akona IP PC - Intel is a patent law firm that specializes in Semiconductors, Circuits & Optics, where it has managed 1720 career applications. The firm maintains a resolved allowance rate of 83.54 percent, reflecting a consistent ability to secure patent grants in these technical fields. This volume of applications indicates a depth of experience in the semiconductor sector.
The firm currently has 74 pending office actions. Their prosecution history shows an average of 2.69 office actions per allowance. This metric suggests an efficient interaction with the USPTO, typically requiring the rounds of communication recorded in the data to reach a grant. Practitioners can use the 2.69 average to estimate the timeline and effort for new applications in Semiconductors, Circuits & Optics.
The 1720 career applications provide a data set for evaluating the firm's long-term performance. The 83.54 percent allowance rate and 2.69 office actions per allowance together characterize a firm that is both experienced and efficient. The 74 pending office actions represent a current workload that requires ongoing management.
Based on the USPTO statutory response window for each pending office action. 32 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 32 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 2 (2%) |
| §101 + other | 17 (15%) |
| §103 only | 39 (33%) |
| §102 only | 5 (4%) |
| §112 only | 1 (1%) |
| Double-patenting only | 2 (2%) |
| Double-patenting + other | 1 (1%) |
| Multi-statute (no §101) | 49 (42%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BULLARD-CONNOR, GENEVIEVE GRACE | 3 | 45.8% | +41.4% |
| NGUYEN, DUY T V | 2 | 78.9% | +16.7% |
| FAYETTE, NATHALIE RENEE | 2 | 96.0% | +5.7% |
| VARNDELL, ROSS E | 2 | 84.7% | +13.3% |
| JUNG, MICHAEL YOO LIM | 2 | 82.7% | +10.5% |
| WALL, VINCENT | 2 | 62.5% | +24.4% |
| VU, HUNG K | 2 | 87.6% | +9.4% |
| MCDONALD, JASON ANDREW | 2 | 57.1% | +80.0% |
| IQBAL, HAMNA FATHIMA | 2 | 83.3% | +20.0% |
| GUYTON, PHILIP A | 1 | 83.9% | +8.6% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | IQBAL, HAMNA FATHIMA | 1d overdue |
| 17557128 | INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS | FAYETTE, NATHALIE RENEE | 22d |
| 18411542 | IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS | VARNDELL, ROSS E | 40d |
| 19251520 | SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE | GUYTON, PHILIP A | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17544598 | SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS | MARU, MATIYAS T | 25d overdue |
| 18055315 | ACCELERATING DATA LOAD AND COMPUTATION IN FRONTEND CONVOLUTIONAL LAYER | SPANN, COURTNEY P | 22d overdue |
| 17820593 | NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS | SPRAUL III, VINCENT ANTON | 19d overdue |
| 18005804 | METHODS AND APPARATUS TO DYNAMICALLY NORMALIZE DATA IN NEURAL NETWORKS | GORMLEY, AARON PATRICK | 10d overdue |
| 17953511 | OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS | CHEN, YU | 4d overdue |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | TIVARUS, CRISTIAN ALEXANDRU | 7d |
| 18304713 | DETECTING AND MITIGATING FAULT IN SPARSITY COMPUTATION IN DEEP NEURAL NETWORK | YI, HYUNGJUN B | 9d |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | MCCOY, THOMAS WILSON | 13d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | BULLARD-CONNOR, GENEVIEVE GRACE | 4d overdue |
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | IQBAL, HAMNA FATHIMA | 1d overdue |
| 18527490 | 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS | VARNDELL, ROSS E | 27d |
| 17552581 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS | BULLARD-CONNOR, GENEVIEVE GRACE | 29d |
| 17473414 | PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE | NGUYEN, DUY T V | 29d |
| 18411542 | IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS | VARNDELL, ROSS E | 40d |
| 17972923 | COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE | MCDONALD, JASON ANDREW | 57d |
| 18806287 | IMPROVING SIZE AND EFFICIENCY OF DIES | NGUYEN, DUY T V | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 117 |
| Art Unit | Apps |
|---|---|
| 2899 | 7 |
| 2812 | 6 |
| 2817 | 5 |
| 2897 | 5 |
| 2874 | 4 |
| 2898 | 4 |
| 2813 | 3 |
| 2893 | 3 |
| 2814 | 3 |
| 2818 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19251520 | SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE | Intel Corporation | GUYTON, PHILIP A | 2192 | §102 | Non-Final OA | — | Pending | Jun 26, 2025 |
| 18990080 | MULTI-VARIATE STRIDED READ OPERATIONS FOR ACCESSING MATRIX OPERANDS | Intel Corporation | METZGER, MICHAEL J | §103 | Non-Final OA | — | Pending | Dec 20, 2024 | |
| 18944243 | RADIO FREQUENCY FRONT-END STRUCTURES | Intel Corporation | DIAZ, JOSE | DP | Non-Final OA | — | Pending | Nov 12, 2024 | |
| 18932092 | EFFICIENT SUPER-SAMPLING IN VIDEOS USING HISTORICAL INTERMEDIATE FEATURES | Intel Corporation | DEODHAR, OMKAR A | §103 | Non-Final OA | — | Pending | Oct 30, 2024 | |
| 18922038 | METHODS AND APPARATUS TO TILE WALK A TENSOR FOR CONVOLUTION OPERATIONS | Intel Corporation | JEON, JAE UK | §101 | Non-Final OA | — | Pending | Oct 21, 2024 | |
| 18856123 | MULTI-DIMENSIONAL ATTENTION FOR DYNAMIC CONVOLUTIONAL KERNEL | Intel Corporation | SHERALI, ISHRAT I | §101 | Non-Final OA | — | Pending | Oct 11, 2024 | |
| 18855943 | RESOLUTION-SWITCHABLE SEGMENTATION NETWORKS | Intel Corporation | YAO, JULIA ZHI-YI | §103 | Non-Final OA | — | Pending | Oct 10, 2024 | |
| 18824152 | MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS | Intel Corporation | LEE, BENNY T | 2843 | §103§112Other | Final Rejection | — | Pending | Sep 04, 2024 |
| 18806287 | IMPROVING SIZE AND EFFICIENCY OF DIES | Intel Corporation | NGUYEN, DUY T V | DP | Non-Final OA | — | Pending | Aug 15, 2024 | |
| 18730464 | INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS | Intel Corporation | SALERNO, SARAH KATE | §102DP | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18724510 | DYNAMIC TRIPLET CONVOLUTION FOR CONVOLUTIONAL NEURAL NETWORKS | Intel Corporation | ELCHANTI, ZEINA | §112 | Non-Final OA | — | Pending | Jun 26, 2024 | |
| 18630302 | MICROELECTRONIC ASSEMBLIES | Intel Corporation | FAYETTE, NATHALIE RENEE | 2812 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18601774 | PACKAGE STACKING USING CHIP TO WAFER BONDING | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103§112 | Final Rejection | — | AI Ready | Mar 11, 2024 |
| 18423577 | TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING | Intel Corporation | MACARTHUR, SYLVIA | 2899 | §103 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18411542 | IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS | Intel Corporation | VARNDELL, ROSS E | 2674 | §103 | Final Rejection | 40d | AI Ready | Jan 12, 2024 |
| 18539957 | EMBEDDED SAR-ADC WITH LEAST SIGNIFICANT BIT SKIPPING BASED RELU ACTIVATION FUNCTION | Intel Corporation | JEANGLAUDE, JEAN BRUNER | §102 | Non-Final OA | — | Pending | Dec 14, 2023 | |
| 18527490 | 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS | Intel Corporation | VARNDELL, ROSS E | 2674 | §101§103Other | Final Rejection | 27d | AI Ready | Dec 04, 2023 |
| 18489327 | SOLVING OPTIMIZATION PROBLEMS USING SPIKING NEUROMORPHIC NETWORK | Intel Corporation | KIM, SEHWAN | 4100 | §101§102§103 | Non-Final OA | — | Pending | Oct 18, 2023 |
| 18459664 | INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES | Intel Corporation | NGUYEN, DAO H | §102§112 | Non-Final OA | — | Pending | Sep 01, 2023 | |
| 18459824 | LONG DURATION STRUCTURED VIDEO ACTION SEGMENTATION | Intel Corporation | COUSO, JOSE L | §102§103 | Non-Final OA | — | Pending | Sep 01, 2023 | |
| 18457002 | TRAINING NEURAL NETWORK WITH BUDDING ENSEMBLE ARCHITECTURE BASED ON DIVERSITY LOSS | Intel Corporation | LEE, WILLIAM MICHAEL | 2145 | §101§103§112 | Final Rejection | — | Pending | Aug 28, 2023 |
| 18453715 | PRUNING ACTIVATIONS AND WEIGHTS OF NEURAL NETWORKS WITH PROGRAMMABLE THRESHOLDS | Intel Corporation | PENG, STEVEN | §101§103 | Non-Final OA | — | Pending | Aug 22, 2023 | |
| 18233803 | Method and System of Audio Detection of a Target Audio Source in Noisy Environments | Intel Corporation | SNIEZEK, ANDREW L | §102§103 | Non-Final OA | — | Pending | Aug 14, 2023 | |
| 18360999 | INTEGRATED PHOTONIC DEVICES AND SYSTEMS WITH THERMAL DRIFT COMPENSATION | Intel Corporation | GOLUB-MILLER, MARCIA A | 2828 | §103§112 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18346966 | GRAPH SEARCH USING NEURAL NETWORK WITH SPIKING NEUROMORPHIC ARCHITECTURE | Intel Corporation | LE, HUNG VAN | §101§103 | Non-Final OA | — | Pending | Jul 05, 2023 | |
| 18345437 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | FOX, BRANDON C | §102§103§112 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18344260 | PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | JUNG, MICHAEL YOO LIM | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18343892 | MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION | Intel Corporation | TORNOW, MARK W | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18342112 | Integrated Waveguides for Semiconductor Technology | Intel Corporation | MARUF, SHEIKH | §103§112 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18341875 | ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS | Intel Corporation | STOYTCHEV, MARIN STOYTCHEV | §103§112 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18342564 | METHODS AND APPARATUS TO IMPROVE AUDIO QUALITY BASED ON LOAD IMPEDANCE SENSING | Intel Corporation | ADDY, THJUAN KNOWLIN | §102 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18214884 | METHOD AND SYSTEM OF SOUND LOCALIZATION USING BINAURAL AUDIO CAPTURE | Intel Corporation | SUTHERS, DOUGLAS JOHN | 2695 | §101§102§103 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18341852 | THREE-DIMENSIONAL FLOATING BODY MEMORY | Intel Corporation | IMTIAZ, S M SOHEL | §103§112 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18340072 | INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCRIBE LINES | Intel Corporation | JANG, BO BIN | §102§103 | Non-Final OA | — | Pending | Jun 23, 2023 | |
| 18338395 | INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES | Intel Corporation | LIU, MIKKA H | §102§112 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18212409 | METHOD AND SYSTEM OF BINAURAL AUDIO EMULATION | Intel Corporation | TRAN, CON P | §102§103 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18338404 | MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS | Intel Corporation | WALL, VINCENT | §102§103 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18337655 | DEEP NEURAL NETWORK ACCELERATOR WITH MEMORY HAVING TWO-LEVEL TOPOLOGY | Intel Corporation | STANLEY, JEREMY L | §103 | Non-Final OA | — | Pending | Jun 20, 2023 | |
| 18333711 | INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN | Intel Corporation | HIBBERT, DANIEL JOHNATHAN | 2899 | §102 | Final Rejection | 10d overdue | AI Ready | Jun 13, 2023 |
| 18333758 | INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE | Intel Corporation | KOO, LAMONT B | 2813 | §102§103 | Final Rejection | 22d | AI Ready | Jun 13, 2023 |
| 18332918 | TWO-TERMINAL INTEGRATED CIRCUIT DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION | Intel Corporation | MUSLIM, SHAWN SHAW | §102§103 | Non-Final OA | — | Pending | Jun 12, 2023 | |
| 18206742 | MULTI-MICROPHONE AUDIO SIGNAL UNIFIER AND METHODS THEREFOR | Intel Corporation | WONG, LINDA | §102§112 | Non-Final OA | — | Pending | Jun 07, 2023 | |
| 18327968 | INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES | Intel Corporation | TRAPANESE, WILLIAM C | §102§103 | Non-Final OA | — | Pending | Jun 02, 2023 | |
| 18328107 | ANTENNA MODULES AND COMMUNICATION DEVICES | Intel Corporation | WOODS, BRANDON SEAN | §103§112 | Non-Final OA | — | Pending | Jun 02, 2023 | |
| 18325374 | FEDERATED LEARNING ADAPTIVE TO CAPABILITIES OF CONTRIBUTING DEVICES | Intel Corporation | GOLAN, MATTHEW BRYCE | 2123 | §103§112 | Final Rejection | — | Pending | May 30, 2023 |
| 18325298 | SPARSITY-BASED REDUCTION OF GATE SWITCHING IN DEEP NEURAL NETWORK ACCELERATORS | Intel Corporation | MAIDO, MAGGIE T | §101§102§103 | Non-Final OA | — | Pending | May 30, 2023 | |
| 18325267 | CAUSAL EXPLANATION OF ATTENTION-BASED NEURAL NETWORK OUTPUT | Intel Corporation | SAX, STEVEN PAUL | 2146 | §101§103 | Final Rejection | 54d | AI Ready | May 30, 2023 |
| 18306399 | MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS | Intel Corporation | SMITH, SAMUEL JONATHAN | §102§103 | Non-Final OA | — | Pending | Apr 25, 2023 | |
| 18304713 | DETECTING AND MITIGATING FAULT IN SPARSITY COMPUTATION IN DEEP NEURAL NETWORK | Intel Corporation | YI, HYUNGJUN B | 2146 | §101§103 | Final Rejection | 9d | AI Ready | Apr 21, 2023 |
| 18304659 | INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN | Intel Corporation | KEAGY, ROSE ALYSSA | §102§103 | Non-Final OA | — | Pending | Apr 21, 2023 | |
| 18303932 | NANORIBBON-BASED TRANSISTOR WITH UNIFORM OXIDE | Intel Corporation | CHOWDHARY, NIMARTA KAUR | §103 | Non-Final OA | — | Pending | Apr 20, 2023 | |
| 18191273 | PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS | Intel Corporation | KIANNI, KAVEH C | 2874 | §103 | Non-Final OA | — | Pending | Mar 28, 2023 |
| 18187782 | INTEGRATED CIRCUIT DEVICE WITH PERFORMANCE-ENHANCING LAYOUT | Intel Corporation | DAGNEW, MEKONNEN D | 2638 | §103 | Non-Final OA | — | Pending | Mar 22, 2023 |
| 18187950 | RECONFIGURABLE MULTIBIT ANALOG IN-MEMORY COMPUTING WITH COMPACT COMPUTATION | Intel Corporation | VILLANUEVA, MARKUS ANTHONY | §102§103 | Non-Final OA | — | Pending | Mar 22, 2023 | |
| 18184921 | DYNAMIC UNCOMPRESSION FOR CHANNEL-SEPARABLE OPERATION IN NEURAL NETWORK | Intel Corporation | CADY, MATTHEW ALAN | §101§103§112 | Final Rejection | — | Pending | Mar 16, 2023 | |
| 18183505 | MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE | Intel Corporation | HO, ANTHONY | 2817 | §102 | Non-Final OA | — | Pending | Mar 14, 2023 |
| 18181598 | FABRICATION OF NANORIBBON-BASED TRANSISTORS USING PATTERNED FOUNDATION | Intel Corporation | SHAMSUZZAMAN, MOHAMMED | 2897 | §102§103§112 | Non-Final OA | — | Pending | Mar 10, 2023 |
| 18181155 | INTEGRATED CIRCUIT DEVICE WITH BACKSIDE FIN TRIM ISOLATION | Intel Corporation | RIRIE, EVERETT TRAJAN | 2876 | §102§103§112 | Non-Final OA | — | Pending | Mar 09, 2023 |
| 18180415 | SCHEDULING COMPUTATIONS IN DEEP NEURAL NETWORK BASED ON SPARSITY | Intel Corporation | DASCOMB, JACOB D | 2195 | §103 | Final Rejection | — | Pending | Mar 08, 2023 |
| 18175591 | METAL GATE FABRICATION FOR NANORIBBON-BASED TRANSISTORS | Intel Corporation | SEVEN, EVREN | 2812 | §102§103 | Final Rejection | — | Pending | Feb 28, 2023 |
| 18159220 | TECHNOLOGY TO REALIZE SIGNED MULTIPLY-ACCUMULATE OPERATION IN THE ANALOG DOMAIN WITH A DIFFERENTIAL SIGNAL PATH AND INTRINSIC PROCESS, VOLTAGE AND TEMPERATURE VARIATION TOLERANCE | Intel Corporation | STRAPP, MATTHEW JACOB | §103 | Non-Final OA | — | Pending | Jan 25, 2023 | |
| 18005804 | METHODS AND APPARATUS TO DYNAMICALLY NORMALIZE DATA IN NEURAL NETWORKS | Intel Corporation | GORMLEY, AARON PATRICK | 2148 | §101§103§112 | Final Rejection | 10d overdue | AI Ready | Jan 17, 2023 |
| 18090879 | MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES | Intel Corporation | DINKE, BITEW A | 2812 | §103 | Non-Final OA | — | AI Ready | Dec 29, 2022 |
| 18148358 | END-TO-END NEUROMORPHIC ACOUSTIC PROCESSING | Intel Corporation | BECKER, TYLER JUSTIN | 2657 | §103 | Final Rejection | 6d | AI Ready | Dec 29, 2022 |
| 18089871 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | JORDAN, ANDREW | 2874 | §102§103 | Final Rejection | 30d | AI Ready | Dec 28, 2022 |
| 18089916 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | TRAN, HOANG Q | 2874 | §103 | Final Rejection | 19d | AI Ready | Dec 28, 2022 |
| 18145038 | PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOTORESIST | Intel Corporation | COSGROVE, JAYSON D | 1737 | — | Final Rejection | 1d overdue | AI Ready | Dec 22, 2022 |
| 18145035 | SYSTEM FOR EXPOSURE OF ULTRA-VIOLET LIGHT TO A PHOTORESIST DEVELOPER SOLUTION | Intel Corporation | NGUYEN, HUNG | 2852 | §103 | Final Rejection | — | Pending | Dec 22, 2022 |
| 18068732 | PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST | Intel Corporation | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | — | AI Ready | Dec 20, 2022 |
| 18067031 | INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES | Intel Corporation | VU, HUNG K | 2897 | §102§103 | Final Rejection | — | Pending | Dec 16, 2022 |
| 18066301 | SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAYER WITH CUT | Intel Corporation | SHEKER, RHYS PONIENTE | 2813 | §102§103 | Non-Final OA | — | Pending | Dec 15, 2022 |
| 18065657 | TRANSISTOR GATE-CHANNEL ARRANGEMENTS WITH MULTIPLE DIPOLE MATERIALS | Intel Corporation | ROLAND, CHRISTOPHER M | 2893 | §103 | Final Rejection | — | Pending | Dec 14, 2022 |
| 18064362 | MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW | Intel Corporation | WALL, VINCENT | 2898 | §103§112 | Final Rejection | — | AI Ready | Dec 12, 2022 |
| 18078051 | EQUALIZING AND TRACKING SPEAKER VOICES IN SPATIAL CONFERENCING | Intel Corporation | KAZEMINEZHAD, FARZAD | 2653 | §103 | Final Rejection | 4d overdue | AI Ready | Dec 08, 2022 |
| 18055315 | ACCELERATING DATA LOAD AND COMPUTATION IN FRONTEND CONVOLUTIONAL LAYER | Intel Corporation | SPANN, COURTNEY P | 2183 | §101§112 | Non-Final OA | 22d overdue | AI Ready | Nov 14, 2022 |
| 18050944 | DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING ACTIVATION COMPRESSION | Intel Corporation | BOSTWICK, SIDNEY VINCENT | 2124 | §103 | Non-Final OA | 34d | Pending | Oct 28, 2022 |
| 17972975 | INTEGRATED INDUCTOR OVER TRANSISTOR LAYER | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103 | Final Rejection | — | Pending | Oct 25, 2022 |
| 17972923 | COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103 | Final Rejection | 57d | AI Ready | Oct 25, 2022 |
| 18047415 | DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING QUANTIZED INFERENCE | Intel Corporation | SANKS, SCHYLER S | 2129 | §102§103§112 | Non-Final OA | — | AI Ready | Oct 18, 2022 |
| 18047033 | PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Non-Final OA | — | Pending | Oct 17, 2022 |
| 17938784 | PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS | Intel Corporation | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §102§103 | Final Rejection | — | AI Ready | Oct 07, 2022 |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §103§112 | Final Rejection | 13d | AI Ready | Sep 27, 2022 |
| 17953511 | OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 4d overdue | AI Ready | Sep 27, 2022 |
| 17935647 | INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM | Intel Corporation | HATFIELD, MARSHALL MU-NUO | 2897 | §103 | Non-Final OA | — | AI Ready | Sep 27, 2022 |
| 17935639 | ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAPACITORS | Intel Corporation | KHALIFA, MOATAZ | 2815 | §103 | Final Rejection | — | AI Ready | Sep 27, 2022 |
| 17934721 | MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT | Intel Corporation | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Final Rejection | — | Pending | Sep 23, 2022 |
| 17932624 | MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES | Intel Corporation | IQBAL, HAMNA FATHIMA | 2817 | §102§103 | Non-Final OA | — | AI Ready | Sep 15, 2022 |
| 17930801 | FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS | Intel Corporation | LEE, ALVIN LYNGHI | 2813 | §103 | Final Rejection | 10d overdue | AI Ready | Sep 09, 2022 |
| 17929749 | NEURAL NETWORK FACILITATING FIXED-POINT EMULATION OF FLOATING-POINT COMPUTATION | Intel Corporation | BUI, KENNY KIM | 2182 | §101§103§112 | Final Rejection | 28d | AI Ready | Sep 05, 2022 |
| 17823602 | THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES | Intel Corporation | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | AI Ready | Aug 31, 2022 |
| 17821009 | QUASI-MONOLITHIC DIE ARCHITECTURES | Intel Corporation | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 61d | Pending | Aug 19, 2022 |
| 17820900 | DEEP NEURAL NETWORK (DNN) ACCELERATORS WITH HETEROGENEOUS TILING | Intel Corporation | STORK, KYLE R | 2128 | §101§103§112 | Non-Final OA | 14d | AI Ready | Aug 19, 2022 |
| 17820593 | NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS | Intel Corporation | SPRAUL III, VINCENT ANTON | 2129 | §101§103 | Non-Final OA | 19d overdue | AI Ready | Aug 18, 2022 |
| 17853018 | INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS | Intel Corporation | DINH, TUAN T | 2847 | §103 | Non-Final OA | — | AI Ready | Jun 29, 2022 |
| 17848660 | VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT | Intel Corporation | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | — | AI Ready | Jun 24, 2022 |
| 17846153 | PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES | Intel Corporation | VU, HUNG K | 2897 | §102§103 | Final Rejection | 14d | AI Ready | Jun 22, 2022 |
| 17846303 | SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES | Intel Corporation | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Final Rejection | — | Pending | Jun 22, 2022 |
| 17829706 | INTEGRATED CIRCUIT DEVICES WITH TRANSISTORS HAVING ANGLED GATES | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | — | Pending | Jun 01, 2022 |
| 17728147 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | 20d | AI Ready | Apr 25, 2022 |
| 17702593 | TRANSISTOR GATE STACKS WITH THICK HYSTERETIC ELEMENTS | Intel Corporation | RAHIM, NILUFA | 2893 | §103§112 | Final Rejection | — | Pending | Mar 23, 2022 |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 4d overdue | AI Ready | Mar 18, 2022 |
| 17685496 | PACKAGING ARCHITECTURE WITH ACTIVE COOLING | Intel Corporation | MELLINGER, CORBYN DAVID | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 03, 2022 |
| 17678928 | SHARED CONTACT DEVICES WITH CONTACTS EXTENDING INTO A CHANNEL LAYER | Intel Corporation | CRAMER, HALEE PAIGE | 2891 | §102§103 | Final Rejection | 75d | AI Ready | Feb 23, 2022 |
| 17666616 | PROVIDING FILL PATTERNS FOR INTEGRATED CIRCUIT DEVICES | Intel Corporation | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | AI Ready | Feb 08, 2022 |
| 17557128 | INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS | Intel Corporation | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 22d | AI Ready | Dec 21, 2021 |
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | Intel Corporation | IQBAL, HAMNA FATHIMA | 2817 | §103 | Final Rejection | 1d overdue | AI Ready | Dec 18, 2021 |
| 17552581 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103 | Non-Final OA | 29d | AI Ready | Dec 16, 2021 |
| 17550520 | OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD | Intel Corporation | THOMASON, DARBY MARGARET | 2874 | §102§103 | Non-Final OA | — | Pending | Dec 14, 2021 |
| 17550236 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | — | Pending | Dec 14, 2021 |
| 17544598 | SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS | Intel Corporation | MARU, MATIYAS T | 2148 | §101§103 | Non-Final OA | 25d overdue | Pending | Dec 07, 2021 |
| 17544506 | SYSTEM AND METHOD OF USING NEUROEVOLUTION-ENHANCED MULTI-OBJECTIVE OPTIMIZATION FOR MIXED-PRECISION QUANTIZATION OF DEEP NEURAL NETWORKS | Intel Corporation | PHUNG, QUOC LY PHU | 2156 | §101§103 | Non-Final OA | — | Pending | Dec 07, 2021 |
| 17530156 | RUNTIME CONFIGURABLE REGISTER FILES FOR ARTIFICIAL INTELLIGENCE WORKLOADS | Intel Corporation | HUISMAN, DAVID J | 2183 | §102§103§112 | Non-Final OA | — | Pending | Nov 18, 2021 |
| 17518376 | SOUND MODIFICATION OF SPEECH IN AUDIO SIGNALS OVER MACHINE COMMUNICATION CHANNELS | Intel Corporation | ZEVITZ, DANIELLE ELIZABETH | 2655 | §103 | Non-Final OA | — | Pending | Nov 03, 2021 |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Final Rejection | 7d | AI Ready | Sep 23, 2021 |
| 17473414 | PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE | Intel Corporation | NGUYEN, DUY T V | 2818 | §103 | Final Rejection | 29d | AI Ready | Sep 13, 2021 |
| 17372612 | MEMORY CELLS WITH NON-PLANAR FERROELECTRIC OR ANTIFERROELECTRIC MATERIALS | Intel Corporation | JONES, ERIC W | 2892 | §103 | Final Rejection | — | Pending | Jul 12, 2021 |
| 17345969 | SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES | Intel Corporation | PURVIS, SUE A | 2800 | §102§103 | Final Rejection | — | Pending | Jun 11, 2021 |
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