Akona Ip Pc - Intel - Patent Prosecution (76 Pending OAs)

Portfolio Summary

76

Total Pending OAs

48

Non-Final OAs

24

Final Rejections

4

Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 76 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

34

Overdue

3

Due this week

24

Due this month

7

Due in next 60 days

8

Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 76 of the docket's apps have a known mailing date.

Overdue (34)Due ≤ 7 days (3)Due ≤ 30 days (24)Due ≤ 60 days (7)Due later (8)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

40

Hard (53%)

35

Medium (46%)

0

Easy (0%)

1

Unknown (1%)

Rejection Statute Mix

Bucket	Cases
§101 + other	14 (18%)
§103 only	24 (32%)
§102 only	6 (8%)
Double-patenting + other	5 (7%)
Multi-statute (no §101)	26 (34%)
No statute on record	1 (1%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

1

Life Sciences

1% of docket

20

Information Tech

26% of docket

8

Communications

11% of docket

47

Semiconductors

62% of docket

0

Mechanical / Eng

0% of docket

0

Business / Other

0% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

760 h

Manual time on pending OAs

152 h

Time saved (low, 20%)

266 h

Time saved (mid, 35%)

6.7 wks

FTE-weeks freed (mid)

Top Examiners on this docket

Examiner	Apps on this docket	Allow rate	Interview lift
BULLARD-CONNOR, GENEVIEVE GRACE	4	50.0%	+0.0%
VARNDELL, ROSS E	2	84.5%	+13.2%
PARTHASARATHY, ROHIT	2	90.6%	+12.5%
MCCOY, THOMAS WILSON	2	92.9%	+12.5%
ARMAND, MARC ANTHONY	2	83.3%	+3.9%
TRAN, THANH Y	2	86.1%	+9.0%
YAP, DOUGLAS ANTHONY	2	87.5%	+15.4%
VILLANUEVA, MARKUS ANTHONY	2	52.3%	+39.4%
PHILIPPE, GIMS S	1	85.5%	+1.4%
LOTFI, KYLE M	1	63.8%	+7.2%

Quick Wins (7)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.

App #	Title	Examiner	Due in
17517152	NO-REMELT SOLDER ENFORCEMENT JOINT	MCCOY, THOMAS WILSON	147d overdue
17557134	TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY	YAP, DOUGLAS ANTHONY	126d overdue
17707157	GLASS BRIDGE FOR CONNECTING DIES	YAP, DOUGLAS ANTHONY	111d overdue
17957003	HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE	PARTHASARATHY, ROHIT	9d
17842093	CHIP-FIRST LAYERED PACKAGING ARCHITECTURE	TRAN, THANH Y	19d
17846086	PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES	TRAN, THANH Y	30d
18991939	DETERMINING ADAPTIVE QUANTIZATION MATRICES USING MACHINE LEARNING FOR VIDEO CODING	PHILIPPE, GIMS S	62d

Hard Cases (40)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.

App #	Title	Examiner	Due in
17698322	MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS	SEHAR, FAKEHA	188d overdue
17552845	PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTPUT INTERFACES	STEPHENSON, KENNETH STEPHEN	140d overdue
17978290	METHOD AND SYSTEM OF VIDEO CODING WITH INLINE DOWNSCALING HARDWARE	HANSELL JR., RICHARD A	45d overdue
17477323	GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE	BRASFIELD, QUINTON A	38d overdue
17705878	PACKAGE LAYERS FOR STRESS MONITORING AND METHOD	BULLARD-CONNOR, GENEVIEVE GRACE	31d overdue
18624198	CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT	STAHL, MICHAEL J	30d overdue
17544598	SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS	MARU, MATIYAS T	25d overdue
17546461	METAL CARBON BARRIER REGION FOR NMOS DEVICE CONTACTS	MILLER, ALEXANDER MICHAEL	24d overdue

Interview Candidates (10)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.

App #	Title	Examiner	Due in
17517152	NO-REMELT SOLDER ENFORCEMENT JOINT	MCCOY, THOMAS WILSON	147d overdue
17643652	PEAK SELF-NORMALIZATION GAIN CONTROL BASED ON HOPF RESONATORS CASCADE SIGNAL SPECTRAL DECOMPOSITION	VILLANUEVA, MARKUS ANTHONY	140d overdue
17557134	TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY	YAP, DOUGLAS ANTHONY	126d overdue
17707157	GLASS BRIDGE FOR CONNECTING DIES	YAP, DOUGLAS ANTHONY	111d overdue
17957003	HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE	PARTHASARATHY, ROHIT	9d
17935627	INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS	MCCOY, THOMAS WILSON	13d
18527490	3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS	VARNDELL, ROSS E	27d
17847434	PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS	PARTHASARATHY, ROHIT	34d

Client Portfolio (1 client)

Client (Assignee)	Pending OAs
Intel	76

Top Art Units

Art Unit	Apps
2899	10
2898	5
2813	4
2814	4
2817	4
2897	3
2151	3
2893	3
2874	2
2674	2

Pending Office Actions

App #	Title	Client	Examiner	Art Unit	Statutes	Status	Due in	AI	Filed
18991939	DETERMINING ADAPTIVE QUANTIZATION MATRICES USING MACHINE LEARNING FOR VIDEO CODING	Intel Corporation	PHILIPPE, GIMS S	2424	§103	Non-Final OA	62d	Pending	Dec 23, 2024
18921274	ADAPTIVE QUALITY BOOSTING FOR LOW LATENCY VIDEO CODING	Intel Corporation	LOTFI, KYLE M	2425	§103§112DP	Non-Final OA	29d	AI Ready	Oct 21, 2024
18896006	AUDIO SPATIALIZATION	Intel Corporation	ELAHEE, MD S	2694	§102DP	Non-Final OA	84d	Pending	Sep 25, 2024
18794326	UNIFIED PROGRAMMING INTERFACE FOR REGRAINED TILE EXECUTION	Intel Corporation	DORAIS, CRAIG C	2198	§101§102§112	Non-Final OA	84d	Pending	Aug 05, 2024
18761473	INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES	Intel Corporation	LOTTER, DAVID E	2845	§103	Non-Final OA	6d	AI Ready	Jul 02, 2024
18624198	CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT	Intel Corporation	STAHL, MICHAEL J	2874	§102§103§112	Non-Final OA	30d overdue	AI Ready	Apr 02, 2024
18613293	OPTICAL TRANSCEIVERS WITH MULTI-LASER MODULES	Intel Corporation	DOBSON, DANIEL G	2634	§102§103DP	Non-Final OA	16d overdue	AI Ready	Mar 22, 2024
18411542	IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS	Intel Corporation	VARNDELL, ROSS E	2674	§101§102§103	Non-Final OA	40d	AI Ready	Jan 12, 2024
18396922	DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS	Intel Corporation	BOWEN, ADAM S	2897	§103DP	Non-Final OA	14d	AI Ready	Dec 27, 2023
18527490	3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS	Intel Corporation	VARNDELL, ROSS E	2674	§101§103§112DP	Non-Final OA	27d	AI Ready	Dec 04, 2023
18491266	SYSTEMS AND METHODS FOR PROVIDING NON-LEXICAL CUES IN SYNTHESIZED SPEECH	Intel Corporation	MASTERS, KRISTEN MICHELLE	2659	§101§103	Final Rejection	41d	AI Ready	Oct 20, 2023
18333758	INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE	Intel Corporation	KOO, LAMONT B	2813	§102§103	Non-Final OA	22d	AI Ready	Jun 13, 2023
18325267	CAUSAL EXPLANATION OF ATTENTION-BASED NEURAL NETWORK OUTPUT	Intel Corporation	SAX, STEVEN PAUL	2146	§101§103	Non-Final OA	54d	AI Ready	May 30, 2023
18325348	NEURAL NETWORK TRAINING AND INFERENCE WITH HIERARCHICAL ADJACENCY MATRIX	Intel Corporation	HOANG, HAU HAI	2154	§101§102§103	Non-Final OA	20d	AI Ready	May 30, 2023
18314862	LOGIC CIRCUITS USING VERTICAL TRANSISTORS WITH BACKSIDE SOURCE OR DRAIN REGIONS	Intel Corporation	RAMALLO, GUSTAVO G	2812	§102§103§112	Non-Final OA	9d overdue	AI Ready	May 10, 2023
18304713	DETECTING AND MITIGATING FAULT IN SPARSITY COMPUTATION IN DEEP NEURAL NETWORK	Intel Corporation	YI, HYUNGJUN B	2146	§101§103	Non-Final OA	9d	AI Ready	Apr 21, 2023
18135958	ACCELERATING NEURAL NETWORKS WITH LOW PRECISION-BASED MULTIPLICATION AND EXPLOITING SPARSITY IN HIGHER ORDER BITS	Intel Corporation	WERNER, MARSHALL L	2125	§101§103§112	Non-Final OA	1d overdue	AI Ready	Apr 18, 2023
18187001	THREE-DIMENSIONAL POWER COMBINERS	Intel Corporation	RAHMAN, HAFIZUR	2843	§102§103	Non-Final OA	63d	Pending	Mar 21, 2023
18176252	METHODS AND APPARATUS FOR REAL-TIME VOICE TYPE DETECTION IN AUDIO DATA	Intel Corporation	SIDDO, IBRAHIM	2681	§102§103	Non-Final OA	30d	AI Ready	Feb 28, 2023
18148358	END-TO-END NEUROMORPHIC ACOUSTIC PROCESSING	Intel Corporation	BECKER, TYLER JUSTIN	2657	§102§103	Non-Final OA	6d	AI Ready	Dec 29, 2022
18089963	OPTICAL SEMICONDUCTOR PACKAGE AND METHOD	Intel Corporation	JORDAN, ANDREW	2874	§102§103	Non-Final OA	28d	AI Ready	Dec 28, 2022
18089417	INTERCONNECT DEVICE AND METHOD	Intel Corporation	CHOUDHRY, MOHAMMAD M	2899	§102§103	Non-Final OA	1d overdue	AI Ready	Dec 27, 2022
18145038	PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOTORESIST	Intel Corporation	COSGROVE, JAYSON D	1737	§103	Non-Final OA	1d overdue	AI Ready	Dec 22, 2022
18068601	High Density Transistor and Routing Track Architecture	Intel Corporation	MEMULA, SURESH	2851	§102§103	Non-Final OA	9d	AI Ready	Dec 20, 2022
18078051	EQUALIZING AND TRACKING SPEAKER VOICES IN SPATIAL CONFERENCING	Intel Corporation	KAZEMINEZHAD, FARZAD	2653	§101§102§103	Non-Final OA	4d overdue	AI Ready	Dec 08, 2022
18055315	ACCELERATING DATA LOAD AND COMPUTATION IN FRONTEND CONVOLUTIONAL LAYER	Intel Corporation	SPANN, COURTNEY P	2183	§101§103§112	Non-Final OA	22d overdue	AI Ready	Nov 14, 2022
17978290	METHOD AND SYSTEM OF VIDEO CODING WITH INLINE DOWNSCALING HARDWARE	Intel Corporation	HANSELL JR., RICHARD A	2486	§102§103§112	Non-Final OA	45d overdue	AI Ready	Nov 01, 2022
18050929	CALIBRATING CONFIDENCE OF CLASSIFICATION MODELS	Intel Corporation	BRAHMACHARI, MANDRITA	2144	—	Final Rejection	90d	AI Ready	Oct 28, 2022
18050944	DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING ACTIVATION COMPRESSION	Intel Corporation	BOSTWICK, SIDNEY VINCENT	2124	§102§103	Final Rejection	34d	Pending	Oct 28, 2022
17972923	COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE	Intel Corporation	MCDONALD, JASON ANDREW	2898	§102§103	Non-Final OA	57d	AI Ready	Oct 25, 2022
18046635	PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS	Intel Corporation	LOPEZ, JORGE ANDRES	2897	§103	Non-Final OA	14d	AI Ready	Oct 14, 2022
17957003	HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE	Intel Corporation	PARTHASARATHY, ROHIT	2899	§103	Non-Final OA	9d	AI Ready	Sep 30, 2022
17937248	HIGH DYNAMIC RANGE DIGITIZATION TECHNOLOGY FOR ANALOG COMPUTE-IN-MEMORY AND EDGE AI APPLICATIONS	Intel Corporation	YAARY, MICHAEL D	2151	§102	Non-Final OA	29d	AI Ready	Sep 30, 2022
17957637	POROUS POLYMER DIELECTRIC LAYER ON CORE	Intel Corporation	ARORA, AJAY	2892	§103	Non-Final OA	5d overdue	AI Ready	Sep 30, 2022
17953511	OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS	Intel Corporation	CHEN, YU	2896	§102§103§112	Non-Final OA	4d overdue	AI Ready	Sep 27, 2022
17935627	INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS	Intel Corporation	MCCOY, THOMAS WILSON	2814	§103§112	Final Rejection	13d	AI Ready	Sep 27, 2022
17948586	THIN FILM CAPACITORS	Intel Corporation	DIAZ, JOSE R	2815	§102	Non-Final OA	10d overdue	AI Ready	Sep 20, 2022
17947642	SPARSITY PROCESSING ON UNPACKED DATA	Intel Corporation	METZGER, MICHAEL J	2122	§103	Non-Final OA	77d	Pending	Sep 19, 2022
17930841	FULL WAFER DEVICE WITH BACK SIDE INTERCONNECTS AND WAFER-SCALE INTEGRATION	Intel Corporation	ARMAND, MARC ANTHONY	2813	§102§103	Non-Final OA	22d	AI Ready	Sep 09, 2022
17929749	NEURAL NETWORK FACILITATING FIXED-POINT EMULATION OF FLOATING-POINT COMPUTATION	Intel Corporation	BUI, KENNY KIM	2182	§101§103§112	Non-Final OA	28d	AI Ready	Sep 05, 2022
17929471	MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE	Intel Corporation	HANUMASAGAR, SHAMITA S	2814	§103	Final Rejection	2d overdue	AI Ready	Sep 02, 2022
17899670	FULL WAFER DEVICE WITH MULTIPLE DIRECTIONAL INDICATORS	Intel Corporation	ARMAND, MARC ANTHONY	2813	§102§103	Non-Final OA	20d	AI Ready	Aug 31, 2022
17820900	DEEP NEURAL NETWORK (DNN) ACCELERATORS WITH HETEROGENEOUS TILING	Intel Corporation	STORK, KYLE R	2128	§103	Final Rejection	14d	AI Ready	Aug 19, 2022
17821009	QUASI-MONOLITHIC DIE ARCHITECTURES	Intel Corporation	RODRIGUEZ VILLANU, SANDRA MILENA	2898	§103	Final Rejection	61d	Pending	Aug 19, 2022
17820593	NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS	Intel Corporation	SPRAUL III, VINCENT ANTON	2129	§101§103	Non-Final OA	19d overdue	AI Ready	Aug 18, 2022
17847434	PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS	Intel Corporation	PARTHASARATHY, ROHIT	2899	§102§103	Non-Final OA	34d	AI Ready	Jun 23, 2022
17847257	PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS	Intel Corporation	ULLAH, ELIAS	2893	§102	Non-Final OA	37d overdue	AI Ready	Jun 23, 2022
17846153	PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES	Intel Corporation	VU, HUNG K	2897	§102§103	Non-Final OA	14d	AI Ready	Jun 22, 2022
17846086	PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES	Intel Corporation	TRAN, THANH Y	2817	DPOther	Non-Final OA	30d	AI Ready	Jun 22, 2022
17846129	PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES	Intel Corporation	GREEN, TELLY D	2898	§103	Non-Final OA	38d overdue	AI Ready	Jun 22, 2022
17842093	CHIP-FIRST LAYERED PACKAGING ARCHITECTURE	Intel Corporation	TRAN, THANH Y	2817	§102	Non-Final OA	19d	AI Ready	Jun 16, 2022
17825558	SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD	Intel Corporation	CRUM, GAGE STEPHEN	2841	§103	Final Rejection	25d overdue	AI Ready	May 26, 2022
17728147	PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING	Intel Corporation	GOODWIN, DAVID J	2817	§103§112	Final Rejection	20d	AI Ready	Apr 25, 2022
17709796	DYNAMIC COMPENSATION OF ANALOG CIRCUITRY IMPAIRMENTS IN NEURAL NETWORKS	Intel Corporation	LEWIS, MATTHEW LEE	2144	§101§102§103	Non-Final OA	15d overdue	AI Ready	Mar 31, 2022
17707157	GLASS BRIDGE FOR CONNECTING DIES	Intel Corporation	YAP, DOUGLAS ANTHONY	2899	§103	Final Rejection	111d overdue	AI Ready	Mar 29, 2022
17705878	PACKAGE LAYERS FOR STRESS MONITORING AND METHOD	Intel Corporation	BULLARD-CONNOR, GENEVIEVE GRACE	2899	§102§103	Final Rejection	31d overdue	AI Ready	Mar 28, 2022
17698322	MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS	Intel Corporation	SEHAR, FAKEHA	2893	§102§103	Non-Final OA	188d overdue	AI Ready	Mar 18, 2022
17698365	MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS	Intel Corporation	BULLARD-CONNOR, GENEVIEVE GRACE	2899	§102	Final Rejection	91d overdue	AI Ready	Mar 18, 2022
17698430	MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS	Intel Corporation	BULLARD-CONNOR, GENEVIEVE GRACE	2899	§103	Non-Final OA	4d overdue	AI Ready	Mar 18, 2022
17690358	TRANSISTOR ARRANGEMENTS WITH REDUCED DIMENSIONS AT THE GATE	Intel Corporation	AHMED, SHAHED	2813	§103	Final Rejection	103d overdue	AI Ready	Mar 09, 2022
17678928	SHARED CONTACT DEVICES WITH CONTACTS EXTENDING INTO A CHANNEL LAYER	Intel Corporation	CRAMER, HALEE PAIGE	2891	§102§103	Final Rejection	75d	AI Ready	Feb 23, 2022
17677909	VERTICAL TUNNELING FIELD-EFFECT TRANSISTOR	Intel Corporation	BOATMAN, CASEY PAUL	2893	§102	Final Rejection	114d overdue	AI Ready	Feb 22, 2022
17557134	TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY	Intel Corporation	YAP, DOUGLAS ANTHONY	2899	§103	Final Rejection	126d overdue	AI Ready	Dec 21, 2021
17557128	INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS	Intel Corporation	FAYETTE, NATHALIE RENEE	2812	§103	Final Rejection	22d	AI Ready	Dec 21, 2021
17555401	MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER	Intel Corporation	IQBAL, HAMNA FATHIMA	2817	§103	Non-Final OA	1d overdue	AI Ready	Dec 18, 2021
17554004	INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS	Intel Corporation	OH, JIYOUNG	2818	§103	Final Rejection	2d overdue	AI Ready	Dec 17, 2021
17552845	PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTPUT INTERFACES	Intel Corporation	STEPHENSON, KENNETH STEPHEN	2898	§103§112	Final Rejection	140d overdue	AI Ready	Dec 16, 2021
17552581	MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS	Intel Corporation	BULLARD-CONNOR, GENEVIEVE GRACE	2899	§103	Non-Final OA	29d	AI Ready	Dec 16, 2021
17643652	PEAK SELF-NORMALIZATION GAIN CONTROL BASED ON HOPF RESONATORS CASCADE SIGNAL SPECTRAL DECOMPOSITION	Intel Corporation	VILLANUEVA, MARKUS ANTHONY	2151	§103	Final Rejection	140d overdue	AI Ready	Dec 10, 2021
17546461	METAL CARBON BARRIER REGION FOR NMOS DEVICE CONTACTS	Intel Corporation	MILLER, ALEXANDER MICHAEL	2898	§102§103	Non-Final OA	24d overdue	AI Ready	Dec 09, 2021
17544598	SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS	Intel Corporation	MARU, MATIYAS T	2148	§101§103	Non-Final OA	25d overdue	Pending	Dec 07, 2021
17517152	NO-REMELT SOLDER ENFORCEMENT JOINT	Intel Corporation	MCCOY, THOMAS WILSON	2814	§103	Final Rejection	147d overdue	AI Ready	Nov 02, 2021
17482681	MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES	Intel Corporation	TIVARUS, CRISTIAN ALEXANDRU	2899	§103§112	Final Rejection	7d	AI Ready	Sep 23, 2021
17477323	GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE	Intel Corporation	BRASFIELD, QUINTON A	2814	§102§103	Final Rejection	38d overdue	AI Ready	Sep 16, 2021
17473414	PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE	Intel Corporation	NGUYEN, DUY T V	2818	§103	Final Rejection	29d	AI Ready	Sep 13, 2021
17358868	AREA AND ENERGY EFFICIENT MULTI-PRECISION MULTIPLY-ACCUMULATE UNIT-BASED PROCESSOR	Intel Corporation	VILLANUEVA, MARKUS ANTHONY	2151	§103	Non-Final OA	56d	AI Ready	Jun 25, 2021

Show all 76 rows (26 more)

Akona Ip Pc - Intel