Prosecution Insights
Prosecution Insights
81 pending office actions • 1 client • 74 examiners • 35 art units • 37 of 81 (46%) have an AI response strategy ready • 169 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 32 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 32 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 4 (5%) |
| §101 + other | 7 (9%) |
| §103 only | 30 (37%) |
| §102 only | 8 (10%) |
| §112 only | 1 (1%) |
| Double-patenting only | 1 (1%) |
| Double-patenting + other | 3 (4%) |
| Multi-statute (no §101) | 27 (33%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| METZGER, MICHAEL J | 2 | 90.5% | +7.8% |
| JUNG, MICHAEL YOO LIM | 2 | 82.6% | +10.5% |
| MILLER, ALEXANDER MICHAEL | 2 | 85.7% | +33.3% |
| WEGNER, AARON MICHAEL | 2 | 72.2% | -1.3% |
| TIVARUS, CRISTIAN ALEXANDRU | 2 | 77.8% | +21.9% |
| LIU, BENJAMIN T | 2 | 75.1% | +11.9% |
| BULLARD-CONNOR, GENEVIEVE GRACE | 2 | 47.1% | +30.3% |
| GUYTON, PHILIP A | 1 | 84.0% | +8.4% |
| PHILIPPE, GIMS S | 1 | 85.6% | +1.5% |
| DEODHAR, OMKAR A | 1 | 80.2% | +19.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17546461 | METAL CARBON BARRIER REGION FOR NMOS DEVICE CONTACTS | MILLER, ALEXANDER MICHAEL | 24d overdue |
| 18991939 | DETERMINING ADAPTIVE QUANTIZATION MATRICES USING MACHINE LEARNING FOR VIDEO CODING | PHILIPPE, GIMS S | 62d |
| 17947642 | SPARSITY PROCESSING ON UNPACKED DATA | METZGER, MICHAEL J | 77d |
| 19251520 | SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE | GUYTON, PHILIP A | — |
| 18990080 | MULTI-VARIATE STRIDED READ OPERATIONS FOR ACCESSING MATRIX OPERANDS | METZGER, MICHAEL J | — |
| 18932092 | EFFICIENT SUPER-SAMPLING IN VIDEOS USING HISTORICAL INTERMEDIATE FEATURES | DEODHAR, OMKAR A | — |
| 18344260 | PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | JUNG, MICHAEL YOO LIM | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17846129 | PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES | GREEN, TELLY D | 38d overdue |
| 17477323 | GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE | BRASFIELD, QUINTON A | 38d overdue |
| 17705878 | PACKAGE LAYERS FOR STRESS MONITORING AND METHOD | BULLARD-CONNOR, GENEVIEVE GRACE | 31d overdue |
| 18624198 | CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT | STAHL, MICHAEL J | 30d overdue |
| 17544598 | SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS | MARU, MATIYAS T | 25d overdue |
| 18055315 | ACCELERATING DATA LOAD AND COMPUTATION IN FRONTEND CONVOLUTIONAL LAYER | SPANN, COURTNEY P | 22d overdue |
| 17820593 | NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS | SPRAUL III, VINCENT ANTON | 19d overdue |
| 17953511 | OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS | CHEN, YU | 4d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17705878 | PACKAGE LAYERS FOR STRESS MONITORING AND METHOD | BULLARD-CONNOR, GENEVIEVE GRACE | 31d overdue |
| 17546461 | METAL CARBON BARRIER REGION FOR NMOS DEVICE CONTACTS | MILLER, ALEXANDER MICHAEL | 24d overdue |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | BULLARD-CONNOR, GENEVIEVE GRACE | 4d overdue |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | TIVARUS, CRISTIAN ALEXANDRU | 7d |
| 18932092 | EFFICIENT SUPER-SAMPLING IN VIDEOS USING HISTORICAL INTERMEDIATE FEATURES | DEODHAR, OMKAR A | — |
| 18344260 | PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | JUNG, MICHAEL YOO LIM | — |
| 18091543 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY | MILLER, ALEXANDER MICHAEL | — |
| 18091555 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING | TIVARUS, CRISTIAN ALEXANDRU | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 81 |
| Art Unit | Apps |
|---|---|
| 2814 | 5 |
| 2897 | 5 |
| 2899 | 5 |
| 2817 | 4 |
| 2812 | 4 |
| 2898 | 4 |
| 2818 | 3 |
| 2874 | 2 |
| 2813 | 2 |
| 2183 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19251520 | SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE | Intel Corporation | GUYTON, PHILIP A | 2192 | §102 | Non-Final OA | — | Pending | Jun 26, 2025 |
| 18991939 | DETERMINING ADAPTIVE QUANTIZATION MATRICES USING MACHINE LEARNING FOR VIDEO CODING | Intel Corporation | PHILIPPE, GIMS S | 2424 | §103 | Non-Final OA | 62d | Pending | Dec 23, 2024 |
| 18990080 | MULTI-VARIATE STRIDED READ OPERATIONS FOR ACCESSING MATRIX OPERANDS | Intel Corporation | METZGER, MICHAEL J | §103 | Non-Final OA | — | Pending | Dec 20, 2024 | |
| 18932092 | EFFICIENT SUPER-SAMPLING IN VIDEOS USING HISTORICAL INTERMEDIATE FEATURES | Intel Corporation | DEODHAR, OMKAR A | §103 | Non-Final OA | — | Pending | Oct 30, 2024 | |
| 18922038 | METHODS AND APPARATUS TO TILE WALK A TENSOR FOR CONVOLUTION OPERATIONS | Intel Corporation | JEON, JAE UK | §101 | Non-Final OA | — | Pending | Oct 21, 2024 | |
| 18856123 | MULTI-DIMENSIONAL ATTENTION FOR DYNAMIC CONVOLUTIONAL KERNEL | Intel Corporation | SHERALI, ISHRAT I | §101 | Non-Final OA | — | Pending | Oct 11, 2024 | |
| 18855943 | RESOLUTION-SWITCHABLE SEGMENTATION NETWORKS | Intel Corporation | YAO, JULIA ZHI-YI | §103 | Non-Final OA | — | Pending | Oct 10, 2024 | |
| 18853619 | MULTI-EXIT VISUAL SYNTHESIS NETWORK BASED ON DYNAMIC PATCH COMPUTING | Intel Corporation | PATEL, JAYESH A | §101 | Non-Final OA | — | Pending | Oct 02, 2024 | |
| 18896006 | AUDIO SPATIALIZATION | Intel Corporation | ELAHEE, MD S | 2694 | §102DP | Non-Final OA | 84d | Pending | Sep 25, 2024 |
| 18794326 | UNIFIED PROGRAMMING INTERFACE FOR REGRAINED TILE EXECUTION | Intel Corporation | DORAIS, CRAIG C | 2198 | §101§102§112 | Non-Final OA | 84d | Pending | Aug 05, 2024 |
| 18730464 | INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS | Intel Corporation | SALERNO, SARAH KATE | §102DP | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18761453 | HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES | Intel Corporation | ULLAH, ELIAS | §102 | Non-Final OA | — | Pending | Jul 02, 2024 | |
| 18625348 | GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES | Intel Corporation | KIELIN, ERIK J | 2814 | DP | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18624198 | CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT | Intel Corporation | STAHL, MICHAEL J | 2874 | §102§112 | Non-Final OA | 30d overdue | AI Ready | Apr 02, 2024 |
| 18613293 | OPTICAL TRANSCEIVERS WITH MULTI-LASER MODULES | Intel Corporation | DOBSON, DANIEL G | 2634 | §102§103DP | Non-Final OA | 16d overdue | AI Ready | Mar 22, 2024 |
| 18601774 | PACKAGE STACKING USING CHIP TO WAFER BONDING | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103§112 | Final Rejection | — | AI Ready | Mar 11, 2024 |
| 18344260 | PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | JUNG, MICHAEL YOO LIM | §103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18212409 | METHOD AND SYSTEM OF BINAURAL AUDIO EMULATION | Intel Corporation | TRAN, CON P | §103 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18206742 | MULTI-MICROPHONE AUDIO SIGNAL UNIFIER AND METHODS THEREFOR | Intel Corporation | WONG, LINDA | §102 | Non-Final OA | — | Pending | Jun 07, 2023 | |
| 18327968 | INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES | Intel Corporation | TRAPANESE, WILLIAM C | §102§103 | Non-Final OA | — | Pending | Jun 02, 2023 | |
| 18328107 | ANTENNA MODULES AND COMMUNICATION DEVICES | Intel Corporation | WOODS, BRANDON SEAN | §103§112 | Non-Final OA | — | Pending | Jun 02, 2023 | |
| 18204856 | METHOD AND SYSTEM OF AUTOMATIC MICROPHONE SELECTION FOR MULTI-MICROPHONE ENVIRONMENTS | Intel Corporation | SNIEZEK, ANDREW L | §102§103 | Non-Final OA | — | Pending | Jun 01, 2023 | |
| 18305525 | PHOTONIC INTEGRATED CIRCUIT PACKAGES WITH SCALABLE HETEROGENEOUS INTEGRATION | Intel Corporation | THOMAS, COURTNEY D | §103 | Non-Final OA | — | Pending | Apr 24, 2023 | |
| 18304659 | INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN | Intel Corporation | KEAGY, ROSE ALYSSA | §103 | Non-Final OA | — | Pending | Apr 21, 2023 | |
| 18135958 | ACCELERATING NEURAL NETWORKS WITH LOW PRECISION-BASED MULTIPLICATION AND EXPLOITING SPARSITY IN HIGHER ORDER BITS | Intel Corporation | WERNER, MARSHALL L | 2125 | §101§103 | Final Rejection | 1d overdue | AI Ready | Apr 18, 2023 |
| 18298906 | ROW REPAIR AND ACCURACY IMPROVEMENTS IN ANALOG COMPUTE-IN-MEMORY ARCHITECTURES | Intel Corporation | KING, DOUGLAS | §102§103§112 | Non-Final OA | — | Pending | Apr 11, 2023 | |
| 18194248 | METHODS AND APPARATUS TO MODEL SPEAKER AUDIO | Intel Corporation | LEE, JANGWOEN | 2656 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18187990 | LONG CHANNEL FIN TRANSISTORS IN NANORIBBON-BASED DEVICES | Intel Corporation | MENZ, LAURA MARY | 2813 | §102Other | Non-Final OA | — | Pending | Mar 22, 2023 |
| 18187782 | INTEGRATED CIRCUIT DEVICE WITH PERFORMANCE-ENHANCING LAYOUT | Intel Corporation | DAGNEW, MEKONNEN D | 2638 | §103 | Non-Final OA | — | Pending | Mar 22, 2023 |
| 18187001 | THREE-DIMENSIONAL POWER COMBINERS | Intel Corporation | RAHMAN, HAFIZUR | 2843 | §103 | Final Rejection | 63d | Pending | Mar 21, 2023 |
| 18184921 | DYNAMIC UNCOMPRESSION FOR CHANNEL-SEPARABLE OPERATION IN NEURAL NETWORK | Intel Corporation | CADY, MATTHEW ALAN | §101§103§112 | Non-Final OA | — | Pending | Mar 16, 2023 | |
| 18183505 | MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE | Intel Corporation | HO, ANTHONY | 2817 | §102 | Non-Final OA | — | Pending | Mar 14, 2023 |
| 18181598 | FABRICATION OF NANORIBBON-BASED TRANSISTORS USING PATTERNED FOUNDATION | Intel Corporation | SHAMSUZZAMAN, MOHAMMED | 2897 | §102§103§112 | Non-Final OA | — | Pending | Mar 10, 2023 |
| 18180415 | SCHEDULING COMPUTATIONS IN DEEP NEURAL NETWORK BASED ON SPARSITY | Intel Corporation | DASCOMB, JACOB D | 2195 | §103§112 | Non-Final OA | — | Pending | Mar 08, 2023 |
| 18175591 | METAL GATE FABRICATION FOR NANORIBBON-BASED TRANSISTORS | Intel Corporation | SEVEN, EVREN | 2812 | §102§103 | Final Rejection | — | Pending | Feb 28, 2023 |
| 18091543 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §102§103§112 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18091548 | GLASS SUBSTRATE FABRICATION USING HYBRID BONDING | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §102§103§112 | Final Rejection | — | AI Ready | Dec 30, 2022 |
| 18091555 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §102§103§112 | Non-Final OA | — | Pending | Dec 30, 2022 |
| 18090879 | MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES | Intel Corporation | DINKE, BITEW A | 2812 | §102§103 | Non-Final OA | — | AI Ready | Dec 29, 2022 |
| 18089892 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | JORDAN, ANDREW | 2874 | §102§103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18068732 | PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST | Intel Corporation | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | — | AI Ready | Dec 20, 2022 |
| 18078051 | EQUALIZING AND TRACKING SPEAKER VOICES IN SPATIAL CONFERENCING | Intel Corporation | KAZEMINEZHAD, FARZAD | 2653 | §103 | Final Rejection | 4d overdue | AI Ready | Dec 08, 2022 |
| 18060080 | INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES | Intel Corporation | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §102 | Non-Final OA | — | AI Ready | Nov 30, 2022 |
| 18055315 | ACCELERATING DATA LOAD AND COMPUTATION IN FRONTEND CONVOLUTIONAL LAYER | Intel Corporation | SPANN, COURTNEY P | 2183 | §101§112 | Final Rejection | 22d overdue | AI Ready | Nov 14, 2022 |
| 17978290 | METHOD AND SYSTEM OF VIDEO CODING WITH INLINE DOWNSCALING HARDWARE | Intel Corporation | HANSELL JR., RICHARD A | 2486 | §103 | Final Rejection | 45d overdue | AI Ready | Nov 01, 2022 |
| 18047415 | DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING QUANTIZED INFERENCE | Intel Corporation | SANKS, SCHYLER S | 2129 | §102§103§112 | Final Rejection | — | AI Ready | Oct 18, 2022 |
| 18047033 | PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Final Rejection | — | Pending | Oct 17, 2022 |
| 17935647 | INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM | Intel Corporation | HATFIELD, MARSHALL MU-NUO | 2897 | §103 | Non-Final OA | — | AI Ready | Sep 27, 2022 |
| 17935639 | ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAPACITORS | Intel Corporation | KHALIFA, MOATAZ | 2815 | §103 | Final Rejection | — | AI Ready | Sep 27, 2022 |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §103§112 | Final Rejection | 13d | AI Ready | Sep 27, 2022 |
| 17953511 | OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 4d overdue | AI Ready | Sep 27, 2022 |
| 17947642 | SPARSITY PROCESSING ON UNPACKED DATA | Intel Corporation | METZGER, MICHAEL J | 2122 | §103 | Non-Final OA | 77d | Pending | Sep 19, 2022 |
| 17947587 | METHODS, SYSTEMS AND APPARATUS TO IMPROVE CONVOLUTION EFFICIENCY | Movidius Ltd. | HUISMAN, DAVID J | 2183 | §103§112 | Final Rejection | — | Pending | Sep 19, 2022 |
| 17930801 | FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS | Intel Corporation | LEE, ALVIN LYNGHI | 2813 | §103 | Final Rejection | 10d overdue | AI Ready | Sep 09, 2022 |
| 17929471 | MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Final Rejection | 2d overdue | AI Ready | Sep 02, 2022 |
| 17823602 | THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES | Intel Corporation | LIU, BENJAMIN T | 2893 | §103 | Final Rejection | — | AI Ready | Aug 31, 2022 |
| 17820900 | DEEP NEURAL NETWORK (DNN) ACCELERATORS WITH HETEROGENEOUS TILING | Intel Corporation | STORK, KYLE R | 2128 | §101§103§112 | Non-Final OA | 14d | AI Ready | Aug 19, 2022 |
| 17821009 | QUASI-MONOLITHIC DIE ARCHITECTURES | Intel Corporation | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 61d | Pending | Aug 19, 2022 |
| 17820593 | NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS | Intel Corporation | SPRAUL III, VINCENT ANTON | 2129 | §101§103 | Non-Final OA | 19d overdue | AI Ready | Aug 18, 2022 |
| 17856185 | ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES | Intel Corporation | LIU, BENJAMIN T | 2893 | §102 | Final Rejection | — | AI Ready | Jul 01, 2022 |
| 17853018 | INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS | Intel Corporation | DINH, TUAN T | 2847 | §102Other | Non-Final OA | — | AI Ready | Jun 29, 2022 |
| 17846129 | PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES | Intel Corporation | GREEN, TELLY D | 2898 | §102§103 | Final Rejection | 38d overdue | AI Ready | Jun 22, 2022 |
| 17846303 | SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES | Intel Corporation | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Final Rejection | — | Pending | Jun 22, 2022 |
| 17825558 | SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD | Intel Corporation | CRUM, GAGE STEPHEN | 2841 | §103 | Final Rejection | 25d overdue | AI Ready | May 26, 2022 |
| 17728147 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | 20d | AI Ready | Apr 25, 2022 |
| 17705878 | PACKAGE LAYERS FOR STRESS MONITORING AND METHOD | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103 | Final Rejection | 31d overdue | AI Ready | Mar 28, 2022 |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 4d overdue | AI Ready | Mar 18, 2022 |
| 17685496 | PACKAGING ARCHITECTURE WITH ACTIVE COOLING | Intel Corporation | MELLINGER, CORBYN DAVID | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 03, 2022 |
| 17678928 | SHARED CONTACT DEVICES WITH CONTACTS EXTENDING INTO A CHANNEL LAYER | Intel Corporation | CRAMER, HALEE PAIGE | 2891 | §102§103 | Final Rejection | 75d | AI Ready | Feb 23, 2022 |
| 17666616 | PROVIDING FILL PATTERNS FOR INTEGRATED CIRCUIT DEVICES | Intel Corporation | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | AI Ready | Feb 08, 2022 |
| 17557128 | INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS | Intel Corporation | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 22d | AI Ready | Dec 21, 2021 |
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | Intel Corporation | IQBAL, HAMNA FATHIMA | 2817 | §103 | Final Rejection | 1d overdue | AI Ready | Dec 18, 2021 |
| 17554004 | INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS | Intel Corporation | OH, JIYOUNG | 2818 | §103 | Final Rejection | 2d overdue | AI Ready | Dec 17, 2021 |
| 17546461 | METAL CARBON BARRIER REGION FOR NMOS DEVICE CONTACTS | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Non-Final OA | 24d overdue | AI Ready | Dec 09, 2021 |
| 17544598 | SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS | Intel Corporation | MARU, MATIYAS T | 2148 | §101§103 | Non-Final OA | 25d overdue | Pending | Dec 07, 2021 |
| 17484661 | METHODS, APPARATUS, AND ARTICLES OF MANUFACTURE TO INCREASE UTILIZATION OF NEURAL NETWORK (NN) ACCELERATOR CIRCUITRY FOR SHALLOW LAYERS OF AN NN BY REFORMATTING ONE OR MORE TENSORS | Intel Corporation | KIM, HARRISON CHAN YOUNG | 2145 | §101 | Final Rejection | — | Pending | Sep 24, 2021 |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Final Rejection | 7d | AI Ready | Sep 23, 2021 |
| 17481068 | MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §102§103 | Final Rejection | — | Pending | Sep 21, 2021 |
| 17477850 | THIN-FILM TRANSISTORS WITH SHARED CONTACTS | Intel Corporation | MAZUMDER, DIDARUL A | 2800 | §112 | Final Rejection | — | Pending | Sep 17, 2021 |
| 17477323 | GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE | Intel Corporation | BRASFIELD, QUINTON A | 2814 | §102§103 | Final Rejection | 38d overdue | AI Ready | Sep 16, 2021 |
| 17473414 | PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE | Intel Corporation | NGUYEN, DUY T V | 2818 | §103 | Final Rejection | 29d | AI Ready | Sep 13, 2021 |
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