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Last updated: April 19, 2026

Alliance Ip, LLC - Intel

116 pending office actions • 3 clients

Portfolio Summary

116
Total Pending OAs
34
Final Rejections
82
Non-Final OAs

Client Portfolio (3 clients)

Client (Assignee)Pending OAs
Intel Corporation 112
Intel Corporation 3
Intel Corporation 1

Pending Office Actions

App #TitleClientExaminerArt UnitStatusFiled
18899209 Untitled Intel Corporation MISHLER, ROBIN J 2628 Non-Final OA
19075313 ISOLATED POWER DOMAINS IN A COMPUTING DEVICE Intel Corporation DARE, RYAN A 2132 Non-Final OA Mar 10, 2025
18956235 POTENTIAL COLLISION WARNING SYSTEM BASED ON ROAD USER INTENT PREDICTION Intel Corporation DUNNE, KENNETH MICHAEL 3669 Non-Final OA Nov 22, 2024
18940819 Tall DIMM Structural Retention Intel Corporation KRIM, PETER 2841 Non-Final OA Nov 07, 2024
18893499 POOLED MEMORY ADDRESS TRANSLATION Intel Corporation FRANKLIN, RICHARD B 2181 Non-Final OA Sep 23, 2024
18794497 IN-SYSTEM VALIDATION OF INTERCONNECTS BY ERROR INJECTION AND MEASUREMENT Intel Corporation XU, MICHAEL 2113 Non-Final OA Aug 05, 2024
18759822 EMULATION AND AUTONOMOUS DEVICE MANAGEMENT OF EMBEDDED DEVICES OPERATING ON VARIOUS INTERCONNECTS VIA A MULTI-DEVICE HOST CONTROLLER Intel Corporation OBERLY, ERIC T 2184 Non-Final OA Jun 29, 2024
18664533 ELECTRONIC DEVICE HAVING AN ORGANIC LIGHT EMITTING DISPLAY Intel Corporation KUSUMAKAR, KAREN M 2897 Non-Final OA May 15, 2024
18619578 SYSTEMS AND METHODS FOR MANAGEMENT OF DISPLAY ELECTRONICS DURING AUDIO/VIDEO CONFERENCING Intel Corporation JONES, CARISSA ANNE 2691 Non-Final OA Mar 28, 2024
18620866 TECHNOLOGIES FOR PROGRAMMABLE MICRORING RESONATORS Intel Corporation KIANNI, KAVEH C 2874 Non-Final OA Mar 28, 2024
18399354 TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES Intel Corporation KHAN, IBRAHIM A 2628 Non-Final OA Dec 28, 2023
18535544 APPARATUS FOR UE MEASUREMENT DELAY AND GRANULARITY FOR NEW RADIO POSITIONING MEASUREMENT Intel Corporation EISNER, RONALD 2644 Non-Final OA Dec 11, 2023
18557269 USER EQUIPMENT (UE) SWITCHING BETWEEN NETWORKS USING MEASUREMENT GAPS Intel Corporation HO, CHUONG T 2412 Non-Final OA Oct 25, 2023
18458919 MULTI-ORIENTATION DISPLAY DEVICE Intel Corporation WU, JERRY 2841 Non-Final OA Aug 30, 2023
18264214 TECHNOLOGIES FOR WIRELESS SENSOR NETWORKS Intel Corporation SANTARISI, ABDUL AZIZ 2465 Final Rejection Aug 03, 2023
18344061 KEYBOARD SWITCH DESIGN FOR ULTRATHIN COMPUTING DEVICES Intel Corporation HAUGHTON, ANTHONY MICHAEL 2841 Final Rejection Jun 29, 2023
18137811 NON-LINEAR MULTITASK SUPPORT VECTOR MACHINES Intel Corporation ILES, TYLER EDWARD 2122 Non-Final OA Apr 21, 2023
18194553 MULTI-KEY MEMORY ENCRYPTION PROVIDING EFFICIENT ISOLATION FOR MULTITHREADED PROCESSES Intel Corporation SCHWARTZ, DARREN B 2435 Non-Final OA Mar 31, 2023
18188297 ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT Intel Corporation TSO, STANLEY 2847 Non-Final OA Mar 22, 2023
18182796 STANDARDS-COMPLIANT ENCODING OF VISUAL DATA IN UNSUPPORTED FORMATS Intel Corporation CHIO, TAT CHI 2486 Final Rejection Mar 13, 2023
18115711 LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME Intel Corporation GARCES, NELSON Y 2814 Non-Final OA Feb 28, 2023
18168927 ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC INTEGRATED CIRCUIT (PIC) Intel Corporation SMITH, CHAD 2874 Non-Final OA Feb 14, 2023
18091676 TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN NUMBERS Intel Corporation JEAN BAPTISTE, WILNER 2899 Non-Final OA Dec 30, 2022
18091616 TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING Intel Corporation SRINIVASAN, SESHA SAIRAMAN 2812 Non-Final OA Dec 30, 2022
18091583 TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING Intel Corporation HANUMASAGAR, SHAMITA S 2814 Non-Final OA Dec 30, 2022
18148617 TECHNOLOGIES FOR HIGH-PERFORMANCE MAGNETOELECTRIC SPIN-ORBIT LOGIC Intel Corporation RAMPERSAUD, PRIYA M Non-Final OA Dec 30, 2022
18092012 GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION Intel Corporation ARROYO, TERESA M 2893 Non-Final OA Dec 30, 2022
18091714 TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN CHANNEL DIMENSIONS Intel Corporation PAYEN, MARVIN 2899 Non-Final OA Dec 30, 2022
18148871 FIELD EFFECT TRANSISTOR COMPRISING TRANSITION METAL DICHALCOGENIDE (TMD) AND FERROELECTRIC MATERIAL Intel Corporation ALAM, MOHAMMED R 2897 Non-Final OA Dec 30, 2022
18091188 ELECTRICAL LAYER WITH ROUGHENED SURFACES Intel Corporation REMAVEGE, CHRISTOPHER 1713 Non-Final OA Dec 29, 2022
18148147 VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL Intel Corporation BOWEN, ADAM S 2897 Non-Final OA Dec 29, 2022
18147457 ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER Intel Corporation LOHAKARE, PRATIKSHA JAYANT 2818 Non-Final OA Dec 28, 2022
18090420 REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS Intel Corporation VU, HUNG K 2897 Non-Final OA Dec 28, 2022
18089022 MECHANISM TO RECOMPOSE WORKLOAD PACKAGES IN A COMPUTING ENVIRONMENT Intel Corporation AKBARI, FARAZ TIMA 2196 Non-Final OA Dec 27, 2022
18146332 TECHNOLOGIES FOR OPTICAL DEMULTIPLEXING WITH BACKWARDS COMPATIBILITY Intel Corporation LEPISTO, RYAN A 2874 Non-Final OA Dec 23, 2022
18145231 VAPOR CHAMBER FOR DUAL CAVITY HEAT SOURCES Intel Corporation KNUDSON, BRAD ALLAN 2817 Non-Final OA Dec 22, 2022
18083493 PROBABILISTIC AND DETERMINISTIC LOGIC DEVICES WITH REDUCED SYMMETRY MATERIALS Intel Corporation KING, DOUGLAS 2824 Non-Final OA Dec 17, 2022
18066271 DYNAMICALLY MODIFIABLE AIR MOVERS AND CONTROL THEREOF Intel Corporation WOLCOTT, BRIAN P 3711 Non-Final OA Dec 14, 2022
18061954 MEMORY TAGGING AND TRACKING FOR OFFLOADED FUNCTIONS AND CALLED MODULES Intel Corporation SUN, CHARLIE 2198 Non-Final OA Dec 05, 2022
18074253 MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN Intel Corporation CLINTON, EVAN GARRETT 2899 Non-Final OA Dec 02, 2022
18061109 PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING Intel Corporation FREAL, JOHN BRENDAN 2847 Non-Final OA Dec 02, 2022
18061083 POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES Intel Corporation JEFFERSON, QUOVAUNDA 2899 Non-Final OA Dec 02, 2022
18061237 INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) Intel Corporation AHMADI, MOHSEN 2896 Non-Final OA Dec 02, 2022
17991811 EXECUTABLE PASSING USING MAILBOX REGISTERS Intel Corporation SPANN, COURTNEY P 2183 Non-Final OA Nov 21, 2022
17988051 BUMPLESS HYBRID ORGANIC GLASS INTERPOSER Intel Corporation ZARNEKE, DAVID A Non-Final OA Nov 16, 2022
17921549 FEDERATED LEARNING FOR MULTIPLE ACCESS RADIO RESOURCE MANAGEMENT OPTIMIZATIONS Intel Corporation SHEN, QUN 2662 Final Rejection Oct 26, 2022
17972670 MECHANISM TO DETERMINE CABLE INFORMATION Intel Corporation DALEY, CHRISTOPHER ANTHONY 2184 Non-Final OA Oct 25, 2022
17920839 FEDERATED LEARNING OPTIMIZATIONS Intel Corporation MAUNI, HUMAIRA ZAHIN 2141 Final Rejection Oct 24, 2022
17969321 CORRECTABLE ERROR TRACKING AND LINK RECOVERY Intel Corporation CHU, GABRIEL L 2114 Non-Final OA Oct 19, 2022
17967037 COARSE AND HIERARCHICAL SWEEP SAMPLING IN MEMORY TRAINING Intel Corporation SADLER, NATHAN 2139 Final Rejection Oct 17, 2022
17958395 INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS Intel Corporation IMTIAZ, S M SOHEL 2812 Non-Final OA Oct 01, 2022
17957953 HARDWARE ACCELERATION FOR INTERFACE TYPE CONVERSIONS Intel Corporation HEBERT, THEODORE E 2199 Non-Final OA Sep 30, 2022
17958053 METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS Intel Corporation CHEN, YU 2896 Non-Final OA Sep 30, 2022
17957590 INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION Intel Corporation YASMEEN, NISHATH 2811 Non-Final OA Sep 30, 2022
17956421 DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING Intel Corporation CHEN, YU 2896 Non-Final OA Sep 29, 2022
17956296 TECHNOLOGIES FOR PEROVSKITE TRANSISTORS Intel Corporation OZDEN, ILKER NMN 2812 Non-Final OA Sep 29, 2022
17954131 TECHNOLOGIES FOR HYBRID DIGITAL/ANALOG PROCESSORS FOR A QUANTUM COMPUTER Intel Corporation WAJE, CARLO C 2151 Non-Final OA Sep 27, 2022
17953648 STACKED PEROVSKITE FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICES Intel Corporation RAHMAN, MOHAMMAD A 2898 Non-Final OA Sep 27, 2022
17952120 ADAPTIVE FRAMEWORK TO MANAGE WORKLOAD EXECUTION BY COMPUTING DEVICE INCLUDING ONE OR MORE ACCELERATORS Intel Corporation EWALD, JOHN ROBERT DAKITA 2199 Non-Final OA Sep 23, 2022
17952161 VERTICAL FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES Intel Corporation RAHMAN, MOHAMMAD A 2898 Non-Final OA Sep 23, 2022
17950773 SYSTEMS AND METHODS FOR CODE GENERATION FOR A PLURALITY OF ARCHITECTURES Intel Corporation COYER, RYAN D 2191 Non-Final OA Sep 22, 2022
17949417 TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR Intel Corporation RADKOWSKI, PETER 2874 Non-Final OA Sep 21, 2022
17947071 FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES Intel Corporation AHMED, SHAHED 2813 Non-Final OA Sep 16, 2022
17943354 TECHNOLOGIES FOR GLASS CORE INDUCTOR Intel Corporation MCDONALD, JASON ANDREW 2898 Non-Final OA Sep 13, 2022
17941960 SELECTIVE CHECKING FOR ERRORS Intel Corporation PERRY, VICTOR NICHOLAS 2111 Final Rejection Sep 09, 2022
17903856 SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS Intel Corporation XU, ZHIJUN 2818 Non-Final OA Sep 06, 2022
17870719 PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AND SYSTEM INCLUDING SAME Intel Corporation ENDRESEN, KIRSTEN DANIELA 2874 Non-Final OA Jul 21, 2022
17868408 OPTIMIZATIONS FOR VIRTUAL ENVIRONMENT EXECUTION IN A NETWORK Intel Corporation KIM, DONG U 2197 Final Rejection Jul 19, 2022
17856982 LOW-RESISTANCE AND THERMALLY STABLE CONTACTS WITH BORIDE, INDIUM, OR GALLIUM METAL COMPOUND LAYERS Intel Corporation HARRISON, MONICA D 2815 Final Rejection Jul 02, 2022
17856206 SOURCE AND DRAIN REFRACTORY METAL CAP Intel Corporation JAHAN, BILKIS 2817 Non-Final OA Jul 01, 2022
17855947 MULTIMODAL USER EXPERIENCE DEGRADATION DETECTION Intel Corporation BUTLER, SARAI E 2114 Final Rejection Jul 01, 2022
17856742 MODULAR FIRMWARE UPDATE Intel Corporation KABIR, MOHAMMAD H 2192 Final Rejection Jul 01, 2022
17856620 CAPPING SOURCE AND DRAIN REGIONS OF TRANSISTORS TO PREVENT DIFFUSION OF DOPANTS DURING FABRICATION Intel Corporation TRAPANESE, WILLIAM C 2812 Non-Final OA Jul 01, 2022
17854799 ONE-DIMENSIONAL OVERLAY MARKS Intel Corporation SEVEN, EVREN 2812 Non-Final OA Jun 30, 2022
17855568 SINX BASED SURFACE FINISH ARCHITECTURE Intel Corporation DOAN, THERESA T 2814 Non-Final OA Jun 30, 2022
17853329 DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP) Intel Corporation PARTHASARATHY, ROHIT 2899 Non-Final OA Jun 29, 2022
17853502 DIE-TO-DIE INTERCONNECT PROTOCOL LAYER Intel Corporation HUYNH, KIM T 2184 Non-Final OA Jun 29, 2022
17851968 LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME Intel Corporation WANG, NICHOLAS A 1734 Final Rejection Jun 28, 2022
17849207 MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF Intel Corporation SIPLING, KENNETH MARK 2818 Non-Final OA Jun 24, 2022
17847111 TECHNOLOGIES FOR OVERLAY METROLOGY MARKS Intel Corporation BARZYKIN, VICTOR V 2893 Non-Final OA Jun 22, 2022
17843976 VALLEYTRONIC LOGIC DEVICES COMPRISING MONOCHALCOGENIDES Intel Corporation MILLER, JAMI VALENTINE 2818 Non-Final OA Jun 18, 2022
17833648 GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Intel Corporation ZARNEKE, DAVID A 2891 Non-Final OA Jun 06, 2022
17833650 GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Intel Corporation ZARNEKE, DAVID A 2891 Final Rejection Jun 06, 2022
17750231 BILAYER ENCAPSULATION OF A MEMORY CELL Intel Corporation HOSSAIN, MOAZZAM 2898 Non-Final OA May 20, 2022
17750016 COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS Intel Corporation TSO, STANLEY 2847 Final Rejection May 20, 2022
17733625 DATA CENTER CLUSTER ARCHITECTURE Intel Corporation YU, XIANG 2455 Final Rejection Apr 29, 2022
17733302 TECHNOLOGIES FOR SIGNAL AMPLIFICATION FOR A PHOTONIC INTEGRATED CIRCUIT Intel Corporation MOONEY, MICHAEL P 2874 Non-Final OA Apr 29, 2022
17712094 PERFORMANCE MODELING OF GRAPH PROCESSING COMPUTING ARCHITECTURES Intel Corporation CASTANEDA, IVAN ALEXANDER 2195 Final Rejection Apr 02, 2022
17711671 PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS Intel Corporation CHAVEZ, RENEE D 2186 Final Rejection Apr 01, 2022
17711113 TECHNOLOGIES FOR A LOW-NOISE-GENERATING INDUCTOR Intel Corporation LIAN, MANG TIN BIK 2837 Final Rejection Apr 01, 2022
17711978 MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME Intel Corporation MUNOZ, ANDRES F 2818 Non-Final OA Apr 01, 2022
17711922 TECHNOLOGIES FOR TERMINATION FOR MICRORING MODULATORS Intel Corporation TAVLYKAEV, ROBERT FUATOVICH 2896 Final Rejection Apr 01, 2022
17710584 VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS Intel Corporation MARUF, SHEIKH 2897 Non-Final OA Mar 31, 2022
17709481 THREE-DIMENSIONAL STACK COOLING WINGS Intel Corporation LE, THAO P 2818 Non-Final OA Mar 31, 2022
17709630 TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES Intel Corporation PATEL, PARESH H 2858 Final Rejection Mar 31, 2022
17707340 RIBBON SHIELD DEVICE AND METHOD Intel Corporation KIM, JAHAE 2897 Final Rejection Mar 29, 2022
17707882 ON-CHIP BACK REFLECTION FILTERING Intel Corporation BAGHDASARYAN, HOVHANNES 3645 Final Rejection Mar 29, 2022
17707366 THIN CLIENT FORM FACTOR ASSEMBLY Intel Corporation TRAN, THANH Y 2817 Final Rejection Mar 29, 2022
17698928 PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX Intel Corporation SYLVIA, CHRISTINA A 2817 Non-Final OA Mar 18, 2022
17699031 MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES OF A CORE SUBSTRATE, AND METHOD OF MAKING SAME Intel Corporation TRAN, TONY 2893 Final Rejection Mar 18, 2022
17561915 FORMATION OF METAL CONTACTS TO SILICON GERMANIUM LAYERS WITH ETCH RESISTIVE CAP LAYERS Intel Corporation FAYETTE, NATHALIE RENEE 2812 Non-Final OA Dec 24, 2021
17561463 TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING Intel Corporation PILLAY, DEVINA 1726 Non-Final OA Dec 23, 2021
17561323 TECHNOLOGIES FOR LOW-POWER SELECTIVE FRAME UPDATE ON A DISPLAY Intel Corporation KIYABU, KARIN A 2626 Final Rejection Dec 23, 2021
17560847 PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORTION FOR PHOTONICS INTEGRATED CIRCUIT AND LENS ASSEMBLY Intel Corporation TRAN, HOANG Q 2874 Non-Final OA Dec 23, 2021
17556159 TECHNOLOGIES FOR A CONTROLLER HUB WITH A USB CAMERA Intel Corporation BORROMEO, JUANITO C 2184 Final Rejection Dec 20, 2021
17550663 SYNTHETIC ANTIFERROMAGNET-BASED PROBABILISTIC COMPUTING DEVICES Intel Corporation CRAWFORD EASON, LATANYA N 2813 Final Rejection Dec 14, 2021
17548189 TECHNOLOGIES FOR A PLUGGABLE CONNECTOR FOR PHOTONIC INTEGRATED CIRCUITS Intel Corporation MANHEIM, MARC ETIENNE 2874 Final Rejection Dec 10, 2021
17482131 MAGNETOELECTRIC SPIN-ORBIT LOGIC DEVICE WITH A TOPOLOGICAL INSULATOR SUPERLATTICE Intel Corporation LAWSON, SETH DOUGLAS FRIE 2893 Final Rejection Sep 22, 2021
17480168 PREDICTIVE ANALYTICS MODEL MANAGEMENT USING COLLABORATIVE FILTERING Intel Corporation PARK, GRACE A 2144 Non-Final OA Sep 21, 2021
17479871 SEMICONDUCTOR DEVICE HAVING SOLDER-FREE DIE CONNECTION TO REDISTRIBUTION LAYER Intel Corporation CAO, PHAT X 2817 Non-Final OA Sep 20, 2021
17475123 SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT Intel Corporation VAN ROY, TOD THOMAS 2828 Final Rejection Sep 14, 2021
17434721 AUTONOMOUS VEHICLE SYSTEM Intel Corporation BUTLER, RODNEY ALLEN 3666 Final Rejection Aug 27, 2021
17405953 LEAKAGE INSENSITIVE TRANSISTOR CIRCUITS Intel Corporation GREWAL, HEIM KIRIN 2812 Final Rejection Aug 18, 2021
17402313 STRUCTURES FOR MICRO LED LASER RELEASE Intel Corporation CRITE, ANTONIO B 2817 Final Rejection Aug 13, 2021
17343280 TECHNOLOGIES FOR PHOTONIC DEMULTIPLEXERS Intel Corporation LE, UYEN CHAU N 2874 Non-Final OA Jun 09, 2021
17076776 DYNAMIC NETWORK CONTROLLER POWER MANAGEMENT Intel Corporation YEN, PAUL JUEI-FU 2175 Final Rejection Oct 21, 2020

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