Prosecution Insights
Prosecution Insights
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| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19393253 | TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING | CHAN, LAUREEN | 1716 | §103 | Non-Final OA | — | Pending | Nov 18, 2025 |
| 19310794 | METHOD OF CLEANING CHAMBER COMPONENTS WITH METAL ETCH RESIDUES | ZHANG, RICHARD Z | 1714 | §103§112Other | Non-Final OA | — | Pending | Aug 26, 2025 |
| 19246617 | ELECTROSTATIC EDGE RING MOUNTING SYSTEM FOR SUBSTRATE PROCESSING | PHAM, THAI N | 2844 | §103 | Non-Final OA | — | Pending | Jun 23, 2025 |
| 19124236 | SELECTIVE MOLYBDENUM FILL | TADAYYON ESLAMI, TABASSOM | — | §102§103 | Final Rejection | — | Pending | Apr 24, 2025 |
| 19186588 | Systems and Methods for Use of Low Frequency Harmonics in Bias Radiofrequency Supply to Control Uniformity of Plasma Process Results Across Substrate | LAM, TUAN THIEU | 2836 | §102§103 | Non-Final OA | — | Pending | Apr 22, 2025 |
| 19120431 | REFRACTORY COMPONENTS FOR A SEMICONDUCTOR PROCESSING CHAMBER | CHRISTY, KATHERINE A | 1784 | §103§112 | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19120426 | COMPONENT WITH A DUAL LAYER HERMETIC ATOMIC LAYER DEPOSITION COATINGS FOR A SEMICONDUCTOR PROCESSING CHAMBER | PHAM, THAI N | 2845 | §103 | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19096252 | SYSTEMS AND METHODS FOR MULTI-LEVEL PULSING IN RF PLASMA TOOLS | HERNANDEZ, WILLIAM | 2836 | §102 | Non-Final OA | — | Pending | Mar 31, 2025 |
| 19116865 | DRY CHAMBER CLEAN USING THERMAL AND PLASMA PROCESSES | CARRILLO, BIBI SHARIDAN | 1711 | §102§103§112 | Non-Final OA | — | Pending | Mar 28, 2025 |
| 19110207 | LAYERED METAL OXIDE-SILICON OXIDE FILMS | CHEN, BRET P | 1718 | §103 | Non-Final OA | — | Pending | Mar 10, 2025 |
| 19053940 | ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH | DUCLAIR, STEPHANIE P. | 1713 | DP | Non-Final OA | — | Pending | Feb 14, 2025 |
| 19042816 | PEDESTAL THERMAL PROFILE TUNING USING MULTIPLE HEATED ZONES AND THERMAL VOID | WEDDLE, ALEXANDER MARION | 1712 | §102§103DP | Non-Final OA | — | Pending | Jan 31, 2025 |
| 19100497 | CONDUCTIVE BACKSIDE LAYER FOR BOW MITIGATION | COMBER, KEVIN J | 2838 | §103 | Non-Final OA | — | Pending | Jan 31, 2025 |
| 18881608 | IMPROVED PEDESTALS FOR SUBSTRATE PROCESSING SYSTEMS | NEJAD, MAHDI H | 3723 | §103 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 18881084 | MULTI-PLENUM GAS MANIFOLDS FOR SUBSTRATE PROCESSING SYSTEMS | LUONG, HENRY T | 2845 | §103 | Non-Final OA | — | Pending | Jan 03, 2025 |
| 18880670 | END EFFECTOR | LU, WILLIAM | 2624 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2025 |
| 19002171 | SUBSTRATE PROCESSING APARATUSES WITH ROTATING MECHANISMS INCLUDING SHAFTS WITH GAS FLOW PATHS | WILSON, LEE D | 3723 | §103 | Non-Final OA | — | Pending | Dec 26, 2024 |
| 18877152 | ISOLATION VALVE | ROST, ANDREW J | 3753 | §102§103 | Final Rejection | — | Pending | Dec 19, 2024 |
| 18983038 | JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES | WILLIAMS, JOSEPH L | 2875 | DP | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18871372 | CHUCKING SYSTEM WITH SILANE COUPLING AGENT | SREEVATSA, SREEYA | 2838 | §103 | Final Rejection | — | Pending | Dec 03, 2024 |
| 18959448 | HEAT AND VOLATILE-ORGANIC-COMPOUNDS DETECTING SYSTEMS | KIM, KIHO | — | §102§103 | Non-Final OA | — | Pending | Nov 25, 2024 |
| 18955355 | LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELECTROSTATIC CHUCK WITH MULTIPLEXED HEATERS ARRAY | BERHANE, ADOLF D | 2838 | DP | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18866767 | CUSTOMIZING ETCH SELECTIVITY AND HIGH ASPECT RATIO FEATURE LOADING THROUGH MULTI-LEVEL PULSING SCHEMES UTILIZING SINUSOIDAL AND CUSTOM RF WAVEFORMS | SATHIRAJU, SRINIVAS | 1713 | §103 | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18948444 | DUAL-FREQUENCY, DIRECT-DRIVE INDUCTIVELY COUPLED PLASMA SOURCE | LEE, WILSON | 2845 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18859433 | ORGANOCHLORIDE ETCH WITH PASSIVATION AND PROFILE CONTROL | DUCLAIR, STEPHANIE P. | 1713 | §103§112DP | Non-Final OA | — | Pending | Oct 23, 2024 |
| 18856864 | LATERAL GAP FILL | TADAYYON ESLAMI, TABASSOM | 1718 | §103 | Final Rejection | — | Pending | Oct 14, 2024 |
| 18854240 | NONCONFORMAL OXIDE FILM DEPOSITION USING CARBON-CONTAINING INHIBITOR | TADAYYON ESLAMI, TABASSOM | 1718 | §102§103§112 | Final Rejection | 10d overdue | Pending | Oct 04, 2024 |
| 18907429 | TOOL AND METHOD FOR CHANDELIER SHOWERHEAD INSTALLATION | CIGNA, JACOB JAMES | 3726 | §102§103 | Non-Final OA | — | Pending | Oct 04, 2024 |
| 18902729 | TEMPERATURE MONITORING | KAO, CHIH CHENG G | 2884 | §112Other | Non-Final OA | — | Pending | Sep 30, 2024 |
| 18847683 | REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES | MCCLURE, CHRISTINA D | 1718 | §103 | Final Rejection | 77d overdue | Pending | Sep 17, 2024 |
| 18847308 | FEEDBACK CONTROL SYSTEMS FOR IMPEDANCE MATCHING | FERNANDEZ, PEDRO C | 2844 | §103 | Non-Final OA | 24d overdue | Pending | Sep 16, 2024 |
| 18847652 | LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NITRIDE | GAMBETTA, KELLY M | 1718 | §103 | Non-Final OA | 23d overdue | Pending | Sep 16, 2024 |
| 18846216 | SPATIALLY TUNABLE INDUCTIVELY COUPLED PLASMA ANTENNA | LE, TUNG X | 2845 | §102§103 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18846229 | FAST ATOMIC LAYER ETCH | TRAN, BINH X | 1713 | §103 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18844917 | SPARK PLASMA SINTERED COMPONENT FOR CRYO-PLASMA PROCESSING | RIVERA, JOSHEL | 1746 | §102 | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18813749 | MODEL-BASED SCHEDULING FOR SUBSTRATE PROCESSING SYSTEMS | PATEL, JIGNESHKUMAR C | 2116 | §103 | Non-Final OA | — | Pending | Aug 23, 2024 |
| 18811234 | CHILLER MAKE-BREAK CONNECTOR FOR SUBSTRATE PROCESSING SYSTEMS | MYERS, GLENN F | 3652 | DP | Non-Final OA | — | Pending | Aug 21, 2024 |
| 18840453 | THERMAL FILM DEPOSITION | TADAYYON ESLAMI, TABASSOM | 1718 | §102§103 | Non-Final OA | — | Pending | Aug 21, 2024 |
| 18840339 | APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE | SREEVATSA, SREEYA | 2838 | §103§112 | Non-Final OA | — | Pending | Aug 21, 2024 |
| 18840069 | ATOMIC LAYER ETCHING USING AN INHIBITOR | LU, JIONG-PING | 1713 | §102 | Non-Final OA | — | Pending | Aug 20, 2024 |
| 18839177 | SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS | DEO, DUY VU NGUYEN | 1713 | §102§103DP | Non-Final OA | — | Pending | Aug 16, 2024 |
| 18806234 | SEMICONDUCTOR SUBSTRATE BEVEL CLEANING | GOLIGHTLY, ERIC WAYNE | 1714 | §102§103§112 | Non-Final OA | — | Pending | Aug 15, 2024 |
| 18800410 | HIGH POWER ELECTROSTATIC CHUCK WITH FEATURES PREVENTING HE HOLE LIGHT-UP/ARCING | REYES, JOSHUA NATHANIEL PI | 1718 | §103§112 | Non-Final OA | — | Pending | Aug 12, 2024 |
| 18837560 | LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS | CHEN, BRET P | 1718 | §103§112 | Non-Final OA | 22d | Pending | Aug 09, 2024 |
| 18836734 | SYSTEMS AND METHODS FOR REDUCING VARIABILITY IN FEATURES OF A SUBSTRATE | ALANKO, ANITA KAREN | 1713 | §102Other | Final Rejection | — | Pending | Aug 07, 2024 |
| 18836104 | RF ASSEMBLY FOR SUBSTRATE PROCESSING SYSTEMS | KIM, SEOKJIN | 2845 | §102 | Non-Final OA | — | Pending | Aug 06, 2024 |
| 18796246 | HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK | JONES, ERIC W | — | Other | Non-Final OA | — | Pending | Aug 06, 2024 |
| 18835982 | WAFER EDGE TILT AND ETCH RATE UNIFORMITY | SWEELY, KURT D | 1718 | §102§103 | Non-Final OA | — | Pending | Aug 05, 2024 |
| 18834451 | PORTABLE ROBOT FOR SEMICONDUCTOR EQUIPMENT MAINTENANCE TASKS | LAUGHLIN, CHARLES S | 2837 | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18785926 | FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERTICAL SCALING | MUSE, ISMAIL A | 2812 | §103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18832925 | RF POWER PATH SYMMETRY | BERMAN, JASON | 1794 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18832042 | LAYER UNIFORMITY IMPROVEMENT OF DEPOSITION-INHIBITION-DEPOSITION PROCESSES | BERMAN, JASON | 1794 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18771442 | EFFICIENT CLEANING AND ETCHING OF HIGH ASPECT RATIO STRUCTURES | DEO, DUY VU NGUYEN | 1713 | §112Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18727830 | ACTIVE TEMPERATURE CONTROL OF SHOWERHEADS FOR HIGH TEMPERATURE PROCESSES | NUCKOLS, TIFFANY Z | 1716 | §103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767915 | RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS | BENNETT, CHARLEE | 1718 | §103 | Final Rejection | 21d | Pending | Jul 09, 2024 |
| 18725503 | HIGH SELECTIVITY AND UNIFORM DIELECTRIC ETCH | CARTER, JONATHAN LANGDON | 1713 | §102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757339 | MUTUALLY INDUCED FILTERS | RAHMAN, HAFIZUR | 2843 | Other | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18721910 | ELECTROSTATIC CHUCKS WITH SELF-SEALING GAS CONDUITS AND/OR REDUCED CLOGGING DUE TO RESIDUE | GATES, ERIC ANDREW | 3722 | §103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18747743 | Method for Manufacturing ScAlN Target | LIANG, ANTHONY M | 1734 | §103 | Final Rejection | 30d | Pending | Jun 19, 2024 |
| 18720496 | MULTI-ZONE COATINGS ON PARTS FOR GALLING PREVENTION AND HIGH-TEMPERATURE CHEMICAL STABILITY | BATES, ZAKIYA W | 3674 | §103 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18720153 | ATOMIC LAYER DEPOSITION PULSE SEQUENCE ENGINEERING FOR IMPROVED CONFORMALITY FOR LOW TEMPERATURE PRECURSORS | MILLER, MICHAEL G | 1712 | §103 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18720146 | HIGH PRESSURE PLASMA INHIBITION | ULLAH, ELIAS | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18719362 | HEXAPOD-BASED PEDESTAL SYSTEMS FOR USE IN SEMICONDUCTOR PROCESSING OPERATIONS | BESLER, CHRISTOPHER JAMES | 3725 | §102§112 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18719047 | IMPROVED THERMAL AND ELECTRICAL INTERFACE BETWEEN PARTS IN AN ETCH CHAMBER | JELLETT, MATTHEW WILLIAM | 3753 | §103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18718751 | WAFER TRANSFER PADDLES WITH MINIMUM CONTACT AREA STRUCTURES FOR REDUCED BACKSIDE MARKING | JOERGER, KAITLIN S | 3655 | §102§103 | Final Rejection | — | Pending | Jun 11, 2024 |
| 18717975 | CONFORMAL DEPOSITION OF SILICON NITRIDE | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18716846 | LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS | MILLER, MICHAEL G | 1712 | §103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18715235 | DIRECT-PICK ROBOT FOR MULTI-STATION SEMICONDUCTOR PROCESSING CHAMBERS | LOWE, MICHAEL S | 3652 | §103 | Final Rejection | — | Pending | May 31, 2024 |
| 18714550 | GRADIENT LINER IN METAL FILL | SANDVIK, BENJAMIN P | 2812 | §102§103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18714506 | DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-CONTAINING DEPOSITION INHIBITORS | SNOW, COLLEEN ERIN | 2899 | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18713068 | DEPOSITION OF HIGH COMPRESSIVE STRESS THERMALLY STABLE NITRIDE FILM | EMPIE, NATHAN H | 1712 | §103 | Final Rejection | — | Pending | May 23, 2024 |
| 18710671 | SHOWERHEAD FACEPLATE CONFIGURATIONS | NUCKOLS, TIFFANY Z | 1716 | §103 | Non-Final OA | — | Pending | May 16, 2024 |
| 18709780 | CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF | HARRISTON, WILLIAM A | 2899 | §102Other | Non-Final OA | — | Pending | May 13, 2024 |
| 18656209 | LOW-K ALD GAP-FILL METHODS AND MATERIAL | GHEYAS, SYED I | 2893 | §112 | Non-Final OA | — | Pending | May 06, 2024 |
| 18654271 | SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY | BENNETT, CHARLEE | 1718 | §102§103 | Non-Final OA | — | Pending | May 03, 2024 |
| 18704173 | DEGAS SYSTEM USING INERT PURGE GAS AT CONTROLLED PRESSURE FOR A LIQUID DELIVERY SYSTEM OF A SUBSTRATE PROCESSING SYSTEM | MCDONALD, RODNEY GLENN | 1794 | §103 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18643650 | RF SIGNAL PARAMETER MEASUREMENT IN AN INTEGRATED CIRCUIT FABRICATION CHAMBER | SATANOVSKY, ALEXANDER | 2857 | §101§103DP | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18703238 | ADAPTIVE POSITIONING SYSTEMS AND ROUTINES USING AN AUTOCALIBRATION WAFER AND A CALIBRATION WAFER WITH CUTOUTS | DAVIS, JERROD I | — | §103 | Non-Final OA | — | Pending | Apr 19, 2024 |
| 18701458 | VALVE FOR SEMICONDUCTOR EQUIPMENT | PRICE, CRAIG JAMES | 3753 | §112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18701479 | STRIP WITH BEVEL CLEANING | REMAVEGE, CHRISTOPHER | 1713 | §103 | Final Rejection | — | Pending | Apr 15, 2024 |
| 18698717 | END EFFECTOR PAD DESIGN FOR BOWED WAFERS | KIO, MICHAEL TAMUNOELEKIM | 3654 | §103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18698276 | SELECTIVE CONTROL OF MULTI-STATION PROCESSING CHAMBER COMPONENTS | WALTERS JR, ROBERT S | — | §102 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18622599 | ROTATIONAL INDEXER WITH WAFER EDGE GRIP | TIGHE, BRENDAN P | 3652 | §103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18695337 | METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTION, AND QUEUE-TIME MANAGEMENT USING STIMULUS RESPONSIVE POLYMERS | SALERNO, SARAH KATE | 2814 | §103 | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18694600 | DEPOSITION AND TREATMENT OF NANO-GRAPHENE AT LOW TEMPERATURES | ENAD, CHRISTINE A | — | §103 | Final Rejection | — | Pending | Mar 22, 2024 |
| 18694949 | EDGE CAPACITIVELY COUPLED PLASMA CHAMBER STRUCTURE | CHAN, WEI | — | §103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18612809 | PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUBSTRATE | BALDWIN, GORDON | 1718 | §103§112Other | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18612005 | ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES | SMITH, BRADLEY | — | §103 | Final Rejection | — | Pending | Mar 21, 2024 |
| 18693940 | A METHOD AND APPARATUS FOR ENHANCING ION ENERGY AND REDUCING ION ENERGY SPREAD IN AN INDUCTIVELY COUPLED PLASMA | BENNETT, CHARLEE | 1713 | §102§103§112 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18688739 | ATOMIC LAYER ETCHING USING BORON TRICHLORIDE | TRAN, BINH X | 1713 | §102§103§112 | Final Rejection | — | Pending | Mar 01, 2024 |
| 18684591 | IN-SITU CORE PROTECTION IN MULTI-PATTERNING | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18681597 | AMPLITUDE MODULATION OF VOLTAGE WITH RECTIFIER AND BUCK STAGE TO CONTROL HEATER TEMPERATURE | PAIK, SANG YEOP | 3761 | §102§103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18427691 | MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA | SWEELY, KURT D | 1718 | §103 | Final Rejection | — | Pending | Jan 30, 2024 |
| 18291444 | SUBSTRATE SUPPORTS WITH MESOCHANNEL ASSEMBLIES | NIEVES, NELSON J | 3763 | §103§112 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18291200 | GRAPHENE-CAPPED COPPER IN DUAL DAMASCENE INTERCONNECT | YEUNG LOPEZ, FEIFEI | 2899 | §103 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18577115 | YTTRIUM ALUMINUM PEROVSKITE (YAP) BASED COATINGS FOR SEMICONDUCTOR PROCESSING CHAMBER COMPONENTS | KURPLE, KARL | 1717 | §103DP | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18570061 | IN-LINE MACHINE VISION SYSTEM FOR PART TRACKING OF SUBSTRATE PROCESSING SYSTEM | COLLINS, MICHAEL | 3655 | §103 | Final Rejection | 12d | Pending | Dec 13, 2023 |
| 18569213 | DRY DEVELOPMENT APPARATUS AND METHODS FOR VOLATILIZATION OF DRY DEVELOPMENT BYPRODUCTS IN WAFERS | ISKRA, JOSEPH W | 3761 | §103§112 | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18565481 | IN SITU SENSOR AND LOGIC FOR PROCESS CONTROL | DINH, PAUL | 2851 | §102§112 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18559958 | TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE | MOTT, ADAM JOSEPH | 2817 | §112 | Non-Final OA | — | Pending | Nov 09, 2023 |
| 18493614 | DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF | CHEN, KEATH T | 1716 | §103§112 | Final Rejection | 10d overdue | Pending | Oct 24, 2023 |
| 18490265 | PROTECTIVE COATING FOR ELECTROSTATIC CHUCKS | VETERE, ROBERT A | 1712 | Other | Final Rejection | — | Pending | Oct 19, 2023 |
| 18554622 | CONTROL OF DISSOLVED GAS CONCENTRATION IN ELECTROPLATING BATHS | FORRY, COLTON BUSA | 1711 | §103§112 | Non-Final OA | — | Pending | Oct 09, 2023 |
| 18283797 | SEMICONDUCTOR TOOL ARRANGEMENTS | TRINH, MINH N | — | §103 | Non-Final OA | — | Pending | Sep 23, 2023 |
| 18550664 | ADJUSTABLE DIELECTRIC CONSTANT CERAMIC WINDOW | SWEELY, KURT D | 1718 | §103 | Final Rejection | — | Pending | Sep 14, 2023 |
| 18465113 | APPARATUSES AND METHODS FOR AVOIDING ELECTRICAL BREAKDOWN FROM RF TERMINAL TO ADJACENT NON-RF TERMINAL | FORD, NATHAN K | 1716 | §103 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18278276 | TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS | ALEJANDRO MULERO, LUZ L | 1716 | §103§112 | Non-Final OA | — | Pending | Aug 22, 2023 |
| 18259953 | GENERATING DIGITAL TWINS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT | MARKS, AARIC R | 2188 | §102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18258973 | MOLYBDENUM DEPOSITION IN FEATURES | TRAN, TONY | 2893 | §103 | Final Rejection | — | Pending | Jun 22, 2023 |
| 18258497 | ADAPTIVE MODEL TRAINING FOR PROCESS CONTROL OF SEMICONDUCTOR MANUFACTURING EQUIPMENT | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102 | Final Rejection | — | Pending | Jun 20, 2023 |
| 18253196 | LOW RESISTANCE PULSED CVD TUNGSTEN | LOHAKARE, PRATIKSHA JAYANT | 2818 | §103 | Non-Final OA | — | Pending | May 18, 2023 |
| 18037537 | PROCESS KIT DE-BUBBLING | RUFO, LOUIS J | 1795 | §102§112 | Non-Final OA | — | Pending | May 17, 2023 |
| 18035200 | PEDESTAL INCLUDING SEAL | CHEN, KEATH T | 1716 | §103 | Non-Final OA | 3d overdue | Pending | May 03, 2023 |
| 18034834 | SUBSTRATE PROCESSING SYSTEM TOOLS FOR MONITORING, ASSESSING AND RESPONDING BASED ON HEALTH INCLUDING SENSOR MAPPING AND TRIGGERED DATALOGGING | BAHLS, JENNIFER E. S. | 2853 | §101 | Final Rejection | 35d overdue | Pending | May 01, 2023 |
| 18247060 | DEPOSITION RATE ENHANCEMENT OF AMORPHOUS CARBON HARD MASK FILM BY PURELY CHEMICAL MEANS | TUROCY, DAVID P | 1718 | §103 | Non-Final OA | 100d overdue | Pending | Mar 28, 2023 |
| 18187342 | ELECTRON EXCITATION ATOMIC LAYER ETCH | KLUNK, MARGARET D | 1716 | §103 | Final Rejection | 16d overdue | Pending | Mar 21, 2023 |
| 18042198 | C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud | SWEELY, KURT D | 1718 | §103 | Final Rejection | — | Pending | Feb 17, 2023 |
| 18017208 | THIN SHADOW RING FOR LOW-TILT TRENCH ETCHING | FORD, NATHAN K | 1716 | §103§112 | Final Rejection | 99d overdue | Pending | Jan 20, 2023 |
| 18005594 | PHOTORESISTS FROM SN(II) PRECURSORS | CHU, JOHN S Y | 1737 | §103 | Non-Final OA | — | Pending | Jan 13, 2023 |
| 18005571 | METAL CHELATORS FOR DEVELOPMENT OF METAL-CONTAINING PHOTORESIST | ANGEBRANNDT, MARTIN J | 1737 | §102§103§112DP | Final Rejection | — | Pending | Jan 13, 2023 |
| 18013749 | EXCLUSION RING FOR SUBSTRATE PROCESSING | WOLDEGEORGIS, ERMIAS T | 2893 | §103§112 | Final Rejection | — | Pending | Dec 29, 2022 |
| 18013475 | CONTROLLING TEMPERATURE PROFILES OF PLASMA CHAMBER COMPONENTS USING STRESS ANALYSIS | KACKAR, RAM N | 1716 | §103§112 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18012194 | IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PARTIALLY ETCHED STRUCTURES | LAOBAK, ANDREW KEELAN | 1713 | §103 | Non-Final OA | — | Pending | Dec 21, 2022 |
| 18011707 | DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST | FORD, NATHAN K | 1716 | §103 | Final Rejection | — | Pending | Dec 20, 2022 |
| 18010423 | OPTIMIZING EDGE RADICAL FLUX IN A DOWNSTREAM PLASMA CHAMBER | KENDALL, BENJAMIN R | 2896 | §103 | Non-Final OA | — | Pending | Dec 14, 2022 |
| 18000562 | IN-FEATURE WET ETCH RATE RATIO REDUCTION | MCCLURE, CHRISTINA D | 1718 | §103 | Final Rejection | — | Pending | Dec 02, 2022 |
| 17927328 | DISTRIBUTED PLASMA SOURCE ARRAY | ALEJANDRO MULERO, LUZ L | 1716 | §103§112 | Final Rejection | 30d overdue | Pending | Nov 22, 2022 |
| 17999255 | LOW RESISTIVITY CONTACTS AND INTERCONNECTS | TRAN, TONY | 2893 | §103 | Final Rejection | 60d | Pending | Nov 18, 2022 |
| 17921930 | BLENDED CONTACT FINGERS FOR PREVENTING CRACKS DURING THIN SUBSTRATE HANDLING | CONTRERAS, CIEL P | 1794 | §102§103 | Final Rejection | 28d overdue | Pending | Oct 27, 2022 |
| 17916852 | SLIDE AND PIVOT ASSEMBLIES FOR PROCESS MODULE BIAS ASSEMBLIES OF SUBSTRATE PROCESSING SYSTEMS | BURKMAN, JESSICA LYNN | 3653 | §103 | Non-Final OA | — | Pending | Oct 04, 2022 |
| 17995461 | LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 22d | Pending | Oct 04, 2022 |
| 17995243 | ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS | WITTENBERG, STEFANIE S | 1795 | §102§103 | Final Rejection | 27d | Pending | Sep 30, 2022 |
| 17915573 | EDGE RING FOR LOCALIZED DELIVERY OF TUNING GAS | REYES, JOSHUA NATHANIEL PI | 1718 | §103 | Final Rejection | 14d | Pending | Sep 29, 2022 |
| 17912358 | CERAMIC ADDITIVE MANUFACTURING TECHNIQUES FOR GAS INJECTORS | KLUNK, MARGARET D | 1716 | §102§103§112 | Non-Final OA | 41d | Pending | Sep 16, 2022 |
| 17910139 | SUBSTRATE SUPPORTS INCLUDING BONDING LAYERS WITH STUD ARRAYS FOR SUBSTRATE PROCESSING SYSTEMS | CHEN, KEATH T | 1716 | §102§103§112 | Non-Final OA | — | Pending | Sep 08, 2022 |
| 17800168 | PLANAR MULTI-LAYER RADIO FREQUENCY FILTERS INCLUDING STACKED COILS WITH STRUCTURAL CAPACITANCE | ALEJANDRO MULERO, LUZ L | 1716 | §103 | Final Rejection | 44d overdue | Pending | Aug 16, 2022 |
| 17799866 | HIGH TEMPERATURE SUBSTRATE SUPPORT WITH HEAT SPREADER | LEE, AIDEN Y | 1718 | §102§103§112 | Non-Final OA | — | Pending | Aug 15, 2022 |
| 17904005 | COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW | FORD, NATHAN K | 1716 | §103 | Non-Final OA | 29d overdue | Pending | Aug 10, 2022 |
| 17759096 | PROTECTIVE COATING FOR A SEMICONDUCTOR REACTION CHAMBER | HERNANDEZ-KENNEY, JOSE | 1717 | §103 | Non-Final OA | — | Pending | Jul 19, 2022 |
| 17792996 | ALLOY FILM ETCH | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | — | Pending | Jul 14, 2022 |
| 17792109 | YTTRIUM ALUMINUM COATING FOR PLASMA PROCESSING CHAMBER COMPONENTS | LAW, NGA LEUNG V | 1717 | §103 | Final Rejection | — | Pending | Jul 11, 2022 |
| 17758567 | POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PERFORMANCE OF METAL-CONTAINING EUV RESIST | LEE, ALEXANDER N | 1737 | §103 | Final Rejection | — | Pending | Jul 08, 2022 |
| 17769430 | MONOLITHIC ANISOTROPIC SUBSTRATE SUPPORTS | DODSON, JUSTIN C | 3700 | §112 | Final Rejection | — | Pending | Apr 15, 2022 |
| 17671211 | MOVEABLE EDGE RINGS WITH REDUCED CAPACITANCE VARIATION FOR SUBSTRATE PROCESSING SYSTEMS | MCCONNELL, AARON R | 3723 | §103§112 | Non-Final OA | 16d overdue | Pending | Feb 14, 2022 |
| 17631984 | EDGE RING SYSTEMS FOR SUBSTRATE PROCESSING SYSTEMS | MOORE, KARLA A | 1716 | §103§112 | Non-Final OA | 150d overdue | Pending | Feb 01, 2022 |
| 17620201 | USE OF ROTATION TO CORRECT FOR AZIMUTHAL NON-UNIFORMITIES IN SEMICONDUCTOR SUBSTRATE PROCESSING | MILLS JR., JOE E | 3761 | §102§103 | Non-Final OA | — | Pending | Dec 17, 2021 |
| 17612536 | SHOWERHEAD INSERT FOR UNIFORMITY TUNING | REYES, JOSHUA NATHANIEL PI | 1718 | §103§112 | Non-Final OA | 22d | Pending | Nov 18, 2021 |
| 17429909 | ELECTROSTATIC CHUCK WITH POWDER COATING | DINH, TUAN T | 2847 | §102§103 | Non-Final OA | 19d overdue | Pending | Aug 10, 2021 |
| 17419841 | METAL ATOMIC LAYER ETCH AND DEPOSITION APPARATUSES AND PROCESSES WITH METAL-FREE LIGANDS | FORD, NATHAN K | 1716 | §103§112 | Non-Final OA | — | Pending | Jun 30, 2021 |
| 18874572 | SYSTEM FOR PROCESSING WAFER-SHAPED ARTICLES | MCCLAIN, GERALD | 3652 | §102§103§112 | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18572355 | DEVICE FOR HOLDING A WAFER-SHAPED ARTICLE | ZAWORSKI, JONATHAN R | 3723 | §103 | Non-Final OA | 45d overdue | Pending | Dec 20, 2023 |
| 18028957 | APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES | WILCZEWSKI, MARY A | 2898 | §102§103§112 | Final Rejection | — | Pending | Mar 28, 2023 |