84 pending office actions • 13 clients
| Client (Assignee) | Pending OAs |
|---|---|
| STMicroelectronics | 35 |
| STMicroelectronics | 17 |
| STMicroelectronics | 10 |
| STMicroelectronics | 6 |
| STMicroelectronics | 6 |
| STMicroelectronics | 2 |
| STMicroelectronics | 2 |
| Politecnico Di Milano | 1 |
| STMicroelectronics | 1 |
| STMicroelectronics | 1 |
| STMicroelectronics | 1 |
| STMicroelectronics | 1 |
| STMicroelectronics | 1 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 18746331 | Untitled | Politecnico Di Milano | TABA, MONICA TERESA | 2878 | Non-Final OA | |
| 18989251 | CURRENT SENSING CIRCUITS AND METHOD | STMicroelectronics | ALMO, KHAREEM E | 2849 | Non-Final OA | Dec 20, 2024 |
| 18988037 | LOW-VOLTAGE DIFFERENTIAL SIGNALING (LVDS) TRANSMITTER CIRCUIT | STMicroelectronics | KIM, JUNG H | 2842 | Non-Final OA | Dec 19, 2024 |
| 18956678 | OPTICAL SENSOR PACKAGING AND METHOD OF MANUFACTURE | STMicroelectronics | BENNETT, JENNIFER D | 2878 | Non-Final OA | Nov 22, 2024 |
| 18943113 | METHOD OF MANUFACTURING THERMOELECTRIC GENERATORS | STMicroelectronics | GOLDEN, ANDREW J | 1726 | Non-Final OA | Nov 11, 2024 |
| 18939751 | BUILT-IN SELF TEST CIRCUIT FOR SEGMENTED STATIC RANDOM ACCESS MEMORY (SRAM) ARRAY INPUT/OUTPUT | STMicroelectronics | ABRAHAM, ESAW T | 2112 | Non-Final OA | Nov 07, 2024 |
| 18938809 | CLOCK SIGNAL DETECTION CIRCUIT, CORRESPONDING ELECTRONIC DEVICE AND METHOD OF OPERATION | STMicroelectronics | CHANG, DANIEL D | 2844 | Non-Final OA | Nov 06, 2024 |
| 18886002 | NON-VOLATILE MEMORY ARCHITECTURE | STMicroelectronics | CHEN, XIAOCHUN L | 2824 | Non-Final OA | Sep 16, 2024 |
| 18815142 | VOLTAGE REGULATOR | STMicroelectronics | ZHANG, JUE | 2838 | Non-Final OA | Aug 26, 2024 |
| 18809905 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT | STMicroelectronics | AL-TAWEEL, MUAAMAR QAHTAN | 2838 | Non-Final OA | Aug 20, 2024 |
| 18781083 | ANODE SENSING CIRCUIT FOR SINGLE PHOTON AVALANCHE DIODES | STMicroelectronics | CUTLER, ALBERT H | 2637 | Non-Final OA | Jul 23, 2024 |
| 18776561 | MEMORY PROGRAM SECURIZATION METHOD | STMicroelectronics | PARSONS, THEODORE C | 2494 | Non-Final OA | Jul 18, 2024 |
| 18752274 | METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, SEMICONDUCTOR PRODUCT, DEVICE AND TESTING METHOD | STMicroelectronics | ANDERSON, WILLIAM H | 2817 | Final Rejection | Jun 24, 2024 |
| 18750140 | ELECTRONIC CIRCUIT | STMicroelectronics | NGUYEN, HAI L | 2842 | Non-Final OA | Jun 21, 2024 |
| 18678767 | VOLTAGE REGULATOR | STMicroelectronics | LEE, JYE-JUNE | 2838 | Non-Final OA | May 30, 2024 |
| 18665062 | CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS | STMicroelectronics | NATH, SUMAN KUMAR | 2855 | Non-Final OA | May 15, 2024 |
| 18660651 | METHOD FOR READING A MULTI-LEVEL NON-VOLATILE MEMORY DEVICE, IN PARTICULAR A PHASE-CHANGE MEMORY DEVICE, AND MULTI-LEVEL NON-VOLATILE MEMORY DEVICE | STMicroelectronics | RADKE, JAY W | 2827 | Non-Final OA | May 10, 2024 |
| 18620041 | METHOD FOR MAKING A HIGH ASPECT RATIO TRENCH | STMicroelectronics | DEO, DUY VU NGUYEN | 1713 | Non-Final OA | Mar 28, 2024 |
| 18619699 | BITCELL PROCESS COMPENSATED READ ASSIST SCHEME FOR SRAM | STMicroelectronics | CHO, SUNG IL | 2825 | Non-Final OA | Mar 28, 2024 |
| 18615233 | CURRENT MEASUREMENT DEVICE, CORRESPONDING MANUFACTURING METHOD AND METHOD OF USE | STMicroelectronics | ISLA, RICHARD | 2858 | Non-Final OA | Mar 25, 2024 |
| 18610440 | IDENTIFICATION OF AN APPLICATION | STMicroelectronics | ALATA, AYOUB | 2494 | Final Rejection | Mar 20, 2024 |
| 18597180 | WIRELESS POWER TRANSMISSION BETWEEN A POWER TRANSMITTER AND AN APPLIANCE | STMicroelectronics | HSIEH, PING Y | 2664 | Non-Final OA | Mar 06, 2024 |
| 18434522 | SECURE START OF A PROCESSING DEVICE | STMicroelectronics | LOUIE, HOWARD H | 2494 | Final Rejection | Feb 06, 2024 |
| 18428306 | SPLIT-GATE TRENCH POWER MOSFET WITH THICK POLY-TO-POLY ISOLATION | STMicroelectronics | TRAN, TRANG Q | 2811 | Non-Final OA | Jan 31, 2024 |
| 18429009 | HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE | STMicroelectronics | HO, TU TU V | 2818 | Non-Final OA | Jan 31, 2024 |
| 18415231 | SUBSTRATELESS CHIP SCALE OPTICAL SENSOR PACKAGE | STMicroelectronics | JAHAN, BILKIS | 2817 | Non-Final OA | Jan 17, 2024 |
| 18540482 | ELECTRONIC CIRCUIT COMPRISING A TRANSISTOR CELL | STMicroelectronics | AHMED, SHAHED | 2813 | Non-Final OA | Dec 14, 2023 |
| 18537135 | VARIABLE-CAPACITANCE DIODE | STMicroelectronics | KEAGY, ROSE ALYSSA | 2818 | Non-Final OA | Dec 12, 2023 |
| 18537473 | INTEGRATED CIRCUIT COMPRISING A TEMPERATURE SENSOR | STMicroelectronics | GIBSON, RANDY W | 2855 | Non-Final OA | Dec 12, 2023 |
| 18528961 | ELECTRONIC DEVICE POWERED BY WIRELESS CHARGING | STMicroelectronics | JOHNSON, RYAN | 2849 | Non-Final OA | Dec 05, 2023 |
| 18529064 | METHOD FOR MANUFACTURING SEVERAL INTEGRATED CIRCUIT PACKAGES | STMicroelectronics | MUNOZ, ANDRES F | 2818 | Non-Final OA | Dec 05, 2023 |
| 18526384 | INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR | STMicroelectronics | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Dec 01, 2023 |
| 18523007 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | STMicroelectronics | CRAWFORD EASON, LATANYA N | 2813 | Non-Final OA | Nov 29, 2023 |
| 18522547 | BIT LINE ACCUMULATION READOUT SCHEME FOR AN ANALOG IN-MEMORY COMPUTATION PROCESSING CIRCUIT | STMicroelectronics | CHO, SUNG IL | 2825 | Final Rejection | Nov 29, 2023 |
| 18520894 | HIGH VOLTAGE SEMICONDUCTOR DEVICE HAVING A DEEP TRENCH INSULATION AND MANUFACTURING PROCESS | STMicroelectronics | JAHAN, BILKIS | 2817 | Non-Final OA | Nov 28, 2023 |
| 18389257 | FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE | STMicroelectronics | BOEGEL, CHEVY JACOB | 2812 | Non-Final OA | Nov 14, 2023 |
| 18389020 | METHOD OF FABRICATING AN ELECTRONIC DEVICE | STMicroelectronics | GARCES, NELSON Y | 2814 | Non-Final OA | Nov 13, 2023 |
| 18387627 | TRANSISTOR MANUFACTURING METHOD | STMicroelectronics | CHANG, JAY C | 2817 | Non-Final OA | Nov 07, 2023 |
| 18387196 | QFN PACKAGE COMPRISING TWO ELECTRONIC CHIPS WITH DIFFERENT SUBSTRATES | STMicroelectronics | HAN, JONATHAN | 2818 | Non-Final OA | Nov 06, 2023 |
| 18387325 | MANUFACTURING METHOD | STMicroelectronics | AHMED, SHAHED | 2813 | Non-Final OA | Nov 06, 2023 |
| 18385996 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPONENT, SEMICONDUCTOR DEVICE AND METHOD | STMicroelectronics | DOAN, THERESA T | 2814 | Non-Final OA | Nov 01, 2023 |
| 18386069 | SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD | STMicroelectronics | MENZ, LAURA MARY | 2813 | Non-Final OA | Nov 01, 2023 |
| 18386159 | MOSFET TRANSISTOR | STMicroelectronics | BOWEN, ADAM S | 2897 | Non-Final OA | Nov 01, 2023 |
| 18379262 | ELECTRONIC CIRCUIT COMPRISING A REFERENCE VOLTAGE CIRCUIT AND A START CHECK CIRCUIT | STMicroelectronics | SHAW, LAUREN ASHLEY | 2838 | Final Rejection | Oct 12, 2023 |
| 18369441 | CHIP SIZE PACKAGE AND SYSTEM | STMicroelectronics | PHAM, HOAI V | 2892 | Non-Final OA | Sep 18, 2023 |
| 18369583 | MEASUREMENT SYSTEM, RELATED INTEGRATED CIRCUIT AND METHOD | STMicroelectronics | NGUYEN, KHIEM D | 2843 | Non-Final OA | Sep 18, 2023 |
| 18243754 | AUDIO AMPLIFICATION METHOD AND DEVICE | STMicroelectronics | NGUYEN, KHANH V | 2843 | Non-Final OA | Sep 08, 2023 |
| 18242980 | NEAR-FIELD COMMUNICATION DEVICE | STMicroelectronics | NGUYEN, TUAN HOANG | 2649 | Non-Final OA | Sep 06, 2023 |
| 18233092 | POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS | STMicroelectronics | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Aug 11, 2023 |
| 18230952 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT AND CORRESPONDING INTEGRATED CIRCUIT | STMicroelectronics | BODNAR, JOHN A | 2893 | Non-Final OA | Aug 07, 2023 |
| 18230423 | MOSFET TRANSISTOR | STMicroelectronics | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Aug 04, 2023 |
| 18228736 | PROCESS FOR COINTEGRATION OF TWO PHASE CHANGE MEMORY (PCM) ARRAYS HAVING DIFFERENT PHASE CHANGE MATERIALS, AND IN-MEMORY COMPUTATION SYSTEM UTILIZING THE TWO PCM ARRAYS | STMicroelectronics | AMER, MOUNIR S | 2818 | Non-Final OA | Aug 01, 2023 |
| 18228898 | INTEGRATED CIRCUIT PACKAGE | STMicroelectronics | INOUSSA, MOULOUCOULAY | 2818 | Final Rejection | Aug 01, 2023 |
| 18226409 | INTEGRATED CIRCUIT PACKAGE | STMicroelectronics | FAN, SU JYA | 2818 | Non-Final OA | Jul 26, 2023 |
| 18224805 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR PRODUCTS | STMicroelectronics | KUSUMAKAR, KAREN M | 2897 | Final Rejection | Jul 21, 2023 |
| 18224701 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE | STMicroelectronics | DYKES, LAURA M | 2892 | Non-Final OA | Jul 21, 2023 |
| 18224293 | METHOD FOR MANUFACTURING A SCHOTTKY DIODE AND CORRESPONDING INTEGRATED CIRCUIT | STMicroelectronics | LIU, XIAOMING | 2812 | Non-Final OA | Jul 20, 2023 |
| 18223838 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | STMicroelectronics | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Non-Final OA | Jul 19, 2023 |
| 18220082 | SINGLE PHOTON AVALANCHE DIODE | STMicroelectronics | YECHURI, SITARAMARAO S | 2893 | Non-Final OA | Jul 10, 2023 |
| 18209605 | OPTOELECTRONIC DEVICE | STMicroelectronics | VU, JIMMY T | 2844 | Non-Final OA | Jun 14, 2023 |
| 18204009 | TRIAC GATE DESIGN FOR COMMUTATION SENSITIVITY TRADE OFF IMPROVEMENT | STMicroelectronics | AHMAD, KHAJA | 2813 | Non-Final OA | May 31, 2023 |
| 18202418 | EMBEDDED SILICON NANOSTRUCTURES FOR SHORT-WAVE-INFRARED (SWIR) METAOPTICS IMPLEMENTATION | STMicroelectronics | MERLIN, JESSICA M | 2871 | Final Rejection | May 26, 2023 |
| 18197909 | TRANSISTOR | STMicroelectronics | NICELY, JOSEPH C | 2813 | Non-Final OA | May 16, 2023 |
| 18197420 | PN JUNCTION | STMicroelectronics | DUREN, TIMOTHY EDWARD | 2817 | Non-Final OA | May 15, 2023 |
| 18131543 | INTEGRATED CIRCUIT INCLUDING A METAL PILLAR IN CONTACT WITH A SILICON REGION ON AN OHMIC COUPLING REGION, AND CORRESPONDING MANUFACTURING METHOD | STMicroelectronics | ABDELAZIEZ, YASSER A | 2898 | Non-Final OA | Apr 06, 2023 |
| 18127286 | PHOTODIODE AND FABRICATION METHOD OF A PHOTODIODE | STMicroelectronics | KUPP, BENJAMIN MICHAEL | 2893 | Non-Final OA | Mar 28, 2023 |
| 18123602 | HIGH DENSITY PMUT ARRAY ARCHITECTURE FOR ULTRASOUND IMAGING | STMicroelectronics | SAN MARTIN, JAYDI A | 2837 | Non-Final OA | Mar 20, 2023 |
| 18119026 | ELECTRONIC DEVICE | STMicroelectronics | SHARMA, ADITYA | 2847 | Non-Final OA | Mar 08, 2023 |
| 18117619 | MONITORING BATTERY VOLTAGE DELIVERY | STMicroelectronics | MCFARLAND, DANIEL PATRICK | 2859 | Non-Final OA | Mar 06, 2023 |
| 18111073 | PIEZOELECTRIC MEMS ACTUATOR FOR COMPENSATING UNWANTED MOVEMENTS AND MANUFACTURING PROCESS THEREOF | STMicroelectronics | TUGBANG, ANTHONY D | 2896 | Non-Final OA | Feb 17, 2023 |
| 18106908 | POLARIZATION SWITCHABLE MULTI-ZONE ILLUMINATION SYSTEM USING A POLARIZATION SWITCHABLE LIGHT SOURCE AND POLARIZATION SENSITIVE OPTIC | STMicroelectronics | BUI PHO, PASCAL M | 3798 | Final Rejection | Feb 07, 2023 |
| 18091470 | SEMICONDUCTOR METAL OXIDE BASED GAS SENSOR ACTIVATED AT ZERO HEATER POWER | STMicroelectronics | OLAMIT, JUSTIN N | 2853 | Final Rejection | Dec 30, 2022 |
| 18079610 | THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION | STMicroelectronics | ONUTA, TIBERIU DAN | 2814 | Final Rejection | Dec 12, 2022 |
| 18078561 | METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHODS FOR ELECTRICALLY TESTING AND PROTECTING THE INTEGRATED CIRCUIT | STMicroelectronics | KEBEDE, BROOK | 2818 | Non-Final OA | Dec 09, 2022 |
| 18070966 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | STMicroelectronics | ANDERSON, WILLIAM H | 2817 | Final Rejection | Nov 29, 2022 |
| 17980101 | FAST ENABLE AND DISABLE SCHEMES FOR SPAD PIXELS | STMicroelectronics | MENZ, DOUGLAS M | 2897 | Non-Final OA | Nov 03, 2022 |
| 17887046 | ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP MOUNTED ON TOP OF A SUPPORT SUBSTRATE | STMicroelectronics | ARDEO, EMILIO | 2899 | Final Rejection | Aug 12, 2022 |
| 17884980 | INTEGRATED CIRCUIT PACKAGE | STMicroelectronics | SMITH, BRADLEY | 2817 | Non-Final OA | Aug 10, 2022 |
| 17861329 | ONE-TIME PROGRAMMABLE MEMORY CELL | STMicroelectronics | BOOTH, RICHARD A | 2812 | Non-Final OA | Jul 11, 2022 |
| 17847679 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE | STMicroelectronics | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jun 23, 2022 |
| 17847824 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES TO INCLUDE LASER DIRECT STRUCTURED (LDS) ELECTRICALLY CONDUCTIVE LEADS | STMicroelectronics | CHEN, DAVID Z | 2815 | Non-Final OA | Jun 23, 2022 |
| 17845232 | PIXEL AND DISPLAY DEVICE | STMicroelectronics | ADHIKARI DAWADI, BIPANA | 2898 | Non-Final OA | Jun 21, 2022 |
| 17839976 | ELECTRONIC CHIP | STMicroelectronics | GOODWIN, DAVID J | 2817 | Final Rejection | Jun 14, 2022 |
| 17750954 | METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHOD FOR ELECTRICALLY TESTING THE INTEGRATED CIRCUIT | STMicroelectronics | ANDREWS, FELIX BRYAN | 2812 | Non-Final OA | May 23, 2022 |
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