Prosecution Insights
Prosecution Insights
84 pending office actions • 1 client • 81 examiners • 39 art units • 42 of 84 (50%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 35 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 35 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 5 (6%) |
| §103 only | 44 (52%) |
| §102 only | 3 (4%) |
| §112 only | 1 (1%) |
| Double-patenting only | 4 (5%) |
| Multi-statute (no §101) | 27 (32%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| KAMRAN, MEHRAN | 2 | 89.9% | +14.2% |
| CHEN, YU | 2 | 67.9% | +29.7% |
| VALENZUELA, PATRICIA D | 2 | 90.2% | +2.1% |
| CHOUDHURY, AZIZUL Q | 1 | 77.6% | +12.5% |
| THIEU, BENJAMIN M | 1 | 84.2% | +15.5% |
| JOO, JOSHUA | 1 | 78.4% | +23.4% |
| TALUKDAR, ARVIND | 1 | 80.6% | +4.0% |
| WILLIAMS, CLAYTON R | 1 | 81.8% | -5.1% |
| ZAIDI, IQBAL | 1 | 90.4% | +6.8% |
| NOWLIN, ERIC | 1 | 88.4% | +5.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18127960 | SERVICE MESH ARCHITECTURE FOR INTEGRATION WITH ACCELERATOR SYSTEMS | KAMRAN, MEHRAN | 9d overdue |
| 19039522 | MULTI-TENANT ISOLATED DATA REGIONS FOR COLLABORATIVE PLATFORM ARCHITECTURES | THIEU, BENJAMIN M | — |
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | WILLIAMS, CLAYTON R | — |
| 18793623 | ACCELERATED NETWORK PACKET PROCESSING | ZAIDI, IQBAL | — |
| 18788960 | USING STATEFUL TRAFFIC MANAGEMENT DATA TO PERFORM PACKET PROCESSING | NOWLIN, ERIC | — |
| 18734891 | VIRTUAL EXECUTION ENVIRONMENT POWER USAGE | KAMRAN, MEHRAN | — |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | VALENZUELA, PATRICIA D | — |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | XU, ZHIJUN | 66d overdue |
| 17560927 | SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY | CHEN, YU | 60d overdue |
| 17560915 | INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK | ADHIKARI DAWADI, BIPANA | 45d overdue |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | CHEN, YU | 44d overdue |
| 18106259 | CRYPTOGRAPHIC OPERATIONS IN EDGE COMPUTING NETWORKS | WICKRAMASURIYA, SAMEERA | 35d overdue |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | HANUMASAGAR, SHAMITA S | 18d overdue |
| 17953184 | SHORT PIPELINE FOR FAST RECOVERY FROM A BRANCH MISPREDICTION | SPANN, COURTNEY P | 17d overdue |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | KOLB, THADDEUS J | 10d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17560927 | SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY | CHEN, YU | 60d overdue |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | CHEN, YU | 44d overdue |
| 18127960 | SERVICE MESH ARCHITECTURE FOR INTEGRATION WITH ACCELERATOR SYSTEMS | KAMRAN, MEHRAN | 9d overdue |
| 19060359 | TECHNOLOGIES FOR DYNAMIC ACCELERATOR SELECTION | CHOUDHURY, AZIZUL Q | — |
| 19039522 | MULTI-TENANT ISOLATED DATA REGIONS FOR COLLABORATIVE PLATFORM ARCHITECTURES | THIEU, BENJAMIN M | — |
| 19019032 | TECHNOLOGIES FOR TRANSPARENT FUNCTION AS A SERVICE ARBITRATION FOR EDGE SYSTEMS | JOO, JOSHUA | — |
| 18734891 | VIRTUAL EXECUTION ENVIRONMENT POWER USAGE | KAMRAN, MEHRAN | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 84 |
| Art Unit | Apps |
|---|---|
| 2812 | 6 |
| 2898 | 5 |
| 2899 | 5 |
| 2874 | 4 |
| 2196 | 3 |
| 2896 | 3 |
| 2183 | 3 |
| 2443 | 2 |
| 2815 | 2 |
| 2893 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19060359 | TECHNOLOGIES FOR DYNAMIC ACCELERATOR SELECTION | Intel Corporation | CHOUDHURY, AZIZUL Q | §103Other | Non-Final OA | — | Pending | Feb 21, 2025 | |
| 19039522 | MULTI-TENANT ISOLATED DATA REGIONS FOR COLLABORATIVE PLATFORM ARCHITECTURES | Intel Corporation | THIEU, BENJAMIN M | DP | Non-Final OA | — | Pending | Jan 28, 2025 | |
| 19019032 | TECHNOLOGIES FOR TRANSPARENT FUNCTION AS A SERVICE ARBITRATION FOR EDGE SYSTEMS | Intel Corporation | JOO, JOSHUA | 2445 | §103 | Non-Final OA | — | Pending | Jan 13, 2025 |
| 18868623 | VARIABLE CACHELINE SET MAPPING | Intel Corporation | TALUKDAR, ARVIND | 2132 | §102§103 | Final Rejection | — | Pending | Nov 22, 2024 |
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | Intel Corporation | WILLIAMS, CLAYTON R | 2443 | §103 | Final Rejection | — | AI Ready | Oct 11, 2024 |
| 18793623 | ACCELERATED NETWORK PACKET PROCESSING | Intel Corporation | ZAIDI, IQBAL | DP | Non-Final OA | — | Pending | Aug 02, 2024 | |
| 18788960 | USING STATEFUL TRAFFIC MANAGEMENT DATA TO PERFORM PACKET PROCESSING | Barefoot Networks, Inc. | NOWLIN, ERIC | DP | Non-Final OA | — | Pending | Jul 30, 2024 | |
| 18778493 | TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA THE CLOUD | Intel Corporation | BODDEN, EVRAL E | §102§112 | Non-Final OA | 90d | Pending | Jul 19, 2024 | |
| 18734891 | VIRTUAL EXECUTION ENVIRONMENT POWER USAGE | Intel Corporation | KAMRAN, MEHRAN | 2196 | §103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18621790 | SILICON PHOTONIC INTEGRATED CIRCUITS WITH ENHANCED THERMAL ISOLATION OF HEATER ELEMENTS | Intel Corporation | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621811 | SWITCH-BASED PHOTONIC INTEGRATED CIRCUIT ARCHITECTURES FOR MULTI-POINT SENSING APPLICATIONS | Intel Corporation | PATEL, SANJIV D | §102§103§112 | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18598837 | TECHNOLOGIES FOR DYNAMICALLY SHARING REMOTE RESOURCES ACROSS REMOTE COMPUTING NODES | Intel Corporation | CHEN, CAI Y | 2425 | DP | Non-Final OA | 15d | AI Ready | Mar 07, 2024 |
| 18399494 | Comb Laser Source Architectures for Photonic integrated Circuits | Intel Corporation | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | 71d | AI Ready | Dec 28, 2023 |
| 18389625 | INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING | Intel Corporation | MIYOSHI, JESSE Y | 2898 | §102§112 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18562694 | TRAFFIC ENGINEERING IN FABRIC TOPOLOGIES WITH DETERMINISTIC SERVICES | Intel Corporation | PATEL, PARTHKUMAR | 2479 | §103 | Final Rejection | 19d | AI Ready | Nov 20, 2023 |
| 18243896 | PACKET PROCESSING WITH REDUCED LATENCY | Intel Corporation | VOGEL, JAY L. | 2478 | §103Other | Non-Final OA | 4d overdue | AI Ready | Sep 08, 2023 |
| 18217049 | METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES | Intel Corporation | MCCOY, THOMAS WILSON | §103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18343607 | METHODS AND APPARATUS FOR AUTONOMOUS MOBILE ROBOTS | Intel Corporation | PAIGE, TYLER D | §103 | Non-Final OA | — | Pending | Jun 28, 2023 | |
| 18212308 | VARIABLE GAIN AMPLIFIER WITH COMPLEMENTARILY SWITCHED NEUTRALIZED DIFFERENTIAL PAIR | Intel Corporation | NGUYEN, KHANH V | §103 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18209361 | DEVICE, METHOD AND SYSTEM FOR IMPROVED ELECTROSTATIC DISCHARGE PROTECTION | Intel Corporation | PATEL, DHARTI HARIDAS | 2838 | §103 | Non-Final OA | — | Pending | Jun 13, 2023 |
| 18204864 | SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS | Intel Corporation | LEE, CHEUNG | §103 | Non-Final OA | — | Pending | Jun 01, 2023 | |
| 18201656 | OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS | Intel Corporation | MINNEY, GABRIEL SEBASTIAN | §103 | Non-Final OA | — | Pending | May 24, 2023 | |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | Intel Corporation | COMBER, KEVIN J | §103 | Non-Final OA | — | Pending | May 24, 2023 | |
| 18197255 | SENSOR-BASED CONTROL FOR DEBUG INVASIVENESS | Intel Corporation | HURUY, FEVEN HABTEMARIAM | §101§103 | Non-Final OA | — | Pending | May 15, 2023 | |
| 18139204 | INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION | Intel Corporation | WOODS, BRANDON SEAN | §102§103 | Non-Final OA | — | Pending | Apr 25, 2023 | |
| 18139206 | MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NANOCOMPOSITE DEVICES | Intel Corporation | NGUYEN, DANNY | §102§103§112 | Non-Final OA | — | Pending | Apr 25, 2023 | |
| 18136972 | HARDWARE-BASED ACCELERATORS IN CLOUD NATIVE APPLICATIONS WRITTEN IN HIGH LEVEL PROGRAMMING LANGUAGES | Intel Corporation | DASCOMB, JACOB D | 2198 | §103 | Non-Final OA | 21d | AI Ready | Apr 20, 2023 |
| 18296264 | DISPLAY SYNCHRONIZATION FOR TIME SENSITIVE NETWORKING | Intel Corporation | JOHNSON, AMY COHEN | §102§103 | Non-Final OA | 83d | Pending | Apr 05, 2023 | |
| 18129704 | PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON OXIDIZABLE MATERIAL | Intel Corporation | MOVVA, AMAR | 2898 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Intel Corporation | STARK, JARRETT J | 2898 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18129688 | BACKSIDE CONTACT ETCH BEFORE CAVITY SPACER FORMATION FOR BACKSIDE CONTACT OF TRANSISTOR SOURCE/DRAIN | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103§112 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18127960 | SERVICE MESH ARCHITECTURE FOR INTEGRATION WITH ACCELERATOR SYSTEMS | Intel Corporation | KAMRAN, MEHRAN | 2196 | §103 | Final Rejection | 9d overdue | AI Ready | Mar 29, 2023 |
| 18122250 | FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY | Intel Corporation | ANYA, IGWE U | 2815 | §102 | Non-Final OA | — | Pending | Mar 16, 2023 |
| 18116940 | IN-ORDER STREAMING IN-NETWORK COMPUTATION | Intel Corporation | BARRY, LANCE LEONARD | 2443 | §103 | Non-Final OA | — | Pending | Mar 03, 2023 |
| 18113414 | CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD | Intel Corporation | PAGHADAL, PARESH H | 2847 | §102§103§112 | Non-Final OA | — | Pending | Feb 23, 2023 |
| 18106259 | CRYPTOGRAPHIC OPERATIONS IN EDGE COMPUTING NETWORKS | Intel Corporation | WICKRAMASURIYA, SAMEERA | 2494 | §101§103§112 | Non-Final OA | 35d overdue | AI Ready | Feb 06, 2023 |
| 18091264 | STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE | Intel Corporation | LIU, BENJAMIN T | 2893 | §102 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18091265 | DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §103 | Final Rejection | — | AI Ready | Dec 29, 2022 |
| 18090707 | DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING | Intel Corporation | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103§112 | Non-Final OA | — | AI Ready | Dec 29, 2022 |
| 18090140 | SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES | Intel Corporation | ARMAND, MARC ANTHONY | 2813 | §103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18089934 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | CHU, CHRIS H | 2874 | §103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18089871 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | JORDAN, ANDREW | 2874 | §102§103 | Non-Final OA | 30d | AI Ready | Dec 28, 2022 |
| 18069252 | SYSTEM, APPARATUS AND METHODS FOR OFFLOADING DEBUG OPERATIONS FROM HOST TO PEER | Intel Corporation | BUI, HANH THI MINH | 2192 | §103 | Final Rejection | — | AI Ready | Dec 21, 2022 |
| 18086232 | GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | §102§103 | Non-Final OA | — | Pending | Dec 21, 2022 |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Final Rejection | 18d overdue | AI Ready | Dec 19, 2022 |
| 18073221 | IN-TRANSIT PACKET DETECTION TO REDUCE REAL-TIME RECEIVER PACKET JITTER | Intel Corporation | LEWIS-TAYLOR, DAYTON A. | 2181 | §112 | Non-Final OA | 77d | Pending | Dec 01, 2022 |
| 17992818 | INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES & SELF-ALIGNED VIAS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | 72d | Pending | Nov 22, 2022 |
| 17966441 | INPUT WORK ITEM FLOW METRIC FOR COMPUTING ENVIRONMENT TELEMETRY | Intel Corporation | TONG, JUSTIN CHE-CHUN | 2196 | §101§102§103DP | Final Rejection | 22d | AI Ready | Oct 14, 2022 |
| 17957719 | METHOD AND APPARATUS TO DETECT NETWORK IDLENESS IN A NETWORK DEVICE TO PROVIDE POWER SAVINGS IN A DATA CENTER | Intel Corporation | SAMPATH, GAYATHRI | 2176 | §103 | Final Rejection | — | AI Ready | Sep 30, 2022 |
| 17957721 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MATERIALS | Intel Corporation | DULKA, JOHN P | 2817 | §102§103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957359 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Intel Corporation | FARMER, EMILY NICOLE | 2812 | §103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957992 | SELF-CHECKING DIAGNOSTICS FRAMEWORK FOR MULTICAST IN A PACKET FORWARDING DEVICE | Intel Corporation | MILLS, DONALD L | 2462 | §103 | Final Rejection | 5d overdue | AI Ready | Sep 30, 2022 |
| 17957957 | MEMORY ARRAY COMPRISING A FERROELECTRIC DATA STORAGE ELEMENT | Intel Corporation | LUU, PHO M | 2824 | §102 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17956188 | ULTRA-LOW VOLTAGE TRANSISTOR CELL DESIGN USING GATE CUT LAYOUT | Intel Corporation | GREAVING, JASON JAMES | 2893 | §103 | Final Rejection | 44d overdue | AI Ready | Sep 29, 2022 |
| 17955187 | SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | 27d | AI Ready | Sep 28, 2022 |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | Intel Corporation | CHEN, YU | 2896 | §103§112 | Final Rejection | 44d overdue | AI Ready | Sep 28, 2022 |
| 17953184 | SHORT PIPELINE FOR FAST RECOVERY FROM A BRANCH MISPREDICTION | Intel Corporation | SPANN, COURTNEY P | 2183 | §102§103 | Final Rejection | 17d overdue | AI Ready | Sep 26, 2022 |
| 17953002 | ADJUSTING POWER PARAMETERS FOR FREQUENCY CONTROL IN COMPUTE SYSTEMS | Intel Corporation | CHEN, XUXING | 2176 | §103 | Non-Final OA | — | AI Ready | Sep 26, 2022 |
| 17903327 | METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION | Intel Corporation | KE, PENG | 2194 | §101§102§103 | Final Rejection | 9d | AI Ready | Sep 06, 2022 |
| 17891735 | THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES | Intel Corporation | SEVEN, EVREN | 2812 | §103 | Non-Final OA | 22d overdue | AI Ready | Aug 19, 2022 |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | 10d overdue | AI Ready | Aug 19, 2022 |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Aug 19, 2022 |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Intel Corporation | XU, ZHIJUN | 2818 | §103§112 | Final Rejection | 66d overdue | AI Ready | Aug 19, 2022 |
| 17856869 | INDEPENDENT GATE STACK FOR SINGLE NANOWIRE STANDARD CELL TRANSISTORS | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Final Rejection | — | AI Ready | Jul 01, 2022 |
| 17855961 | POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD | Intel Corporation | ESKRIDGE, CORY W | 3624 | §103 | Final Rejection | 12d | AI Ready | Jul 01, 2022 |
| 17856877 | BACKSIDE REVEAL FOR LAYERED MULTI-CAPACITOR SINGLE TRANSISTOR MEMORY SYSTEMS | Intel Corporation | LEE, WOO KYUNG | 2815 | §102§103 | Final Rejection | 56d | AI Ready | Jul 01, 2022 |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | AI Ready | Jun 30, 2022 |
| 17850455 | METHOD AND APPARATUS TO PERFORM BANK SPARING FOR ADAPTIVE DOUBLE DEVICE DATA CORRECTION | Intel Corporation | YOON, ALEXANDER J | 2135 | §103 | Final Rejection | 38d overdue | AI Ready | Jun 27, 2022 |
| 17841555 | PROCESSOR CIRCUITRY TO DETERMINE A STATE OF ENABLEMENT OF A SYNCHRONIZATION CONTROL FOR THREADS OF EXECUTION | Intel Corporation | HUISMAN, DAVID J | 2183 | §103 | Final Rejection | 32d overdue | AI Ready | Jun 15, 2022 |
| 17838703 | MANAGEMENT OF PORT CONGESTION | Intel Corporation | BAYARD, DJENANE M | 2444 | §102§103 | Non-Final OA | 78d | Pending | Jun 13, 2022 |
| 17836720 | MAXIMIZING RESOURCE BANDWIDTH WITH EFFICIENT TEMPORAL ARBITRATION | Intel Corporation | RIGOL, YAIMA | 2135 | §103 | Final Rejection | 47d | AI Ready | Jun 09, 2022 |
| 17831100 | HEAT REMOVAL IN INTEGRATED CIRCUITS WITH TRANSISTORS AND DOUBLE-SIDED METAL INTERCONNECTS | Intel Corporation | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Final Rejection | — | Pending | Jun 02, 2022 |
| 17829788 | TECHNOLOGIES FOR NETWORK PACKET PROCESSING BETWEEN CLOUD AND TELECOMMUNICATIONS NETWORKS | Intel Corporation | MENSAH, PRINCE AKWASI | 2474 | §103 | Final Rejection | 46d overdue | AI Ready | Jun 01, 2022 |
| 17825340 | INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN | Intel Corporation | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | — | AI Ready | May 26, 2022 |
| 17711878 | LASER-INDUCED THERMAL STRESSING OF INTEGRATED CIRCUITS | Intel Corporation | LE, THANG XUAN | 2858 | §103 | Non-Final OA | 31d overdue | AI Ready | Apr 01, 2022 |
| 17710658 | CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103§112 | Final Rejection | — | AI Ready | Mar 31, 2022 |
| 17708890 | HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 30d overdue | AI Ready | Mar 30, 2022 |
| 17708933 | CONTROL REGISTER SET TO FACILITATE PROCESSOR EVENT BASED SAMPLING | Intel Corporation | VICARY, KEITH E | 2183 | §101§112 | Final Rejection | — | Pending | Mar 30, 2022 |
| 17677829 | ADDITIVELY MANUFACTURED HEAT DISSIPATION DEVICE | Intel Corporation | AL SAMIRI, KHALED AHMED ALI | 3763 | §103§112 | Final Rejection | — | Pending | Feb 22, 2022 |
| 17667415 | NETWORK RESOURCE MONITORING | Intel Corporation | BARKER, TODD L | 2449 | §103Other | Final Rejection | — | AI Ready | Feb 08, 2022 |
| 17560927 | SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 60d overdue | AI Ready | Dec 23, 2021 |
| 17560915 | INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Final Rejection | 45d overdue | AI Ready | Dec 23, 2021 |
| 17559342 | FORMATION OF CAVITY SPACER AND SOURCE-DRAIN EPITAXIAL GROWTH FOR SCALING OF GATE-ALL-AROUND TRANSISTORS | Intel Corporation | DEGRASSE, IAN ISAAC | 2818 | §103 | Final Rejection | — | Pending | Dec 22, 2021 |
| 17323881 | INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL ROUTING | Intel Corporation | TRAN, HOANG Q | 2874 | §103 | Non-Final OA | 62d | AI Ready | May 18, 2021 |
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