Prosecution Insights
Prosecution Insights
82 pending office actions • 1 client • 74 examiners • 38 art units • 72 of 82 (88%) have an AI response strategy ready • 196 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 80 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 80 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 4 (5%) |
| §103 only | 26 (32%) |
| §102 only | 5 (6%) |
| §112 only | 1 (1%) |
| Double-patenting only | 1 (1%) |
| Double-patenting + other | 2 (2%) |
| Multi-statute (no §101) | 42 (51%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| TRAN, HOANG Q | 3 | 67.5% | +33.2% |
| GARCES, NELSON Y | 2 | 80.2% | +2.7% |
| JORDAN, ANDREW | 2 | 44.4% | +17.0% |
| KOLB, THADDEUS J | 2 | 84.6% | +23.5% |
| CHEN, YU | 2 | 67.7% | +29.9% |
| PHAM, LONG | 2 | 91.5% | +5.5% |
| HUISMAN, DAVID J | 2 | 58.0% | +33.6% |
| KRETZER, CASEY L | 1 | 87.0% | +12.2% |
| TABOR, AMARE F | 1 | 82.8% | +23.0% |
| BODDEN, EVRAL E | 1 | 72.2% | +21.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18975721 | TECHNOLOGIES FOR PROVIDING SECURE UTILIZATION OF TENANT KEYS | TABOR, AMARE F | 26d |
| 18757106 | SCALABLE MULTI-BAND WDM OPTICAL COMPUTE INTERCONNECT ARCHITECTURES | KRETZER, CASEY L | 43d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17711742 | DYNAMIC LATENCY-RESPONSIVE CACHE MANAGEMENT | YU, XIANG | 131d overdue |
| 17550796 | FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD | TIVARUS, CRISTIAN ALEXANDRU | 131d overdue |
| 17557290 | ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE | LEE, DA WEI | 112d overdue |
| 17843179 | SELECTIVE DISABLE OF HISTORY-BASED PREDICTORS ON MODE TRANSITIONS | HUISMAN, DAVID J | 98d overdue |
| 17711917 | INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC DELAY | CIESLEWICZ, ANETA B | 60d overdue |
| 17560927 | SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY | CHEN, YU | 60d overdue |
| 17560915 | INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK | ADHIKARI DAWADI, BIPANA | 45d overdue |
| 17956188 | ULTRA-LOW VOLTAGE TRANSISTOR CELL DESIGN USING GATE CUT LAYOUT | GREAVING, JASON JAMES | 44d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17843179 | SELECTIVE DISABLE OF HISTORY-BASED PREDICTORS ON MODE TRANSITIONS | HUISMAN, DAVID J | 98d overdue |
| 17560927 | SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY | CHEN, YU | 60d overdue |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | CHEN, YU | 44d overdue |
| 17841555 | PROCESSOR CIRCUITRY TO DETERMINE A STATE OF ENABLEMENT OF A SYNCHRONIZATION CONTROL FOR THREADS OF EXECUTION | HUISMAN, DAVID J | 32d overdue |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | KOLB, THADDEUS J | 10d overdue |
| 18080152 | INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES | JORDAN, ANDREW | 12d |
| 18089916 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | TRAN, HOANG Q | 19d |
| 18090258 | ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE | TRAN, HOANG Q | 20d |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 82 |
| Art Unit | Apps |
|---|---|
| 2874 | 8 |
| 2817 | 7 |
| 2897 | 6 |
| 2812 | 5 |
| 2899 | 5 |
| 2814 | 4 |
| 2818 | 4 |
| 2893 | 4 |
| 2898 | 3 |
| 2183 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18757106 | SCALABLE MULTI-BAND WDM OPTICAL COMPUTE INTERCONNECT ARCHITECTURES | Intel Corporation | KRETZER, CASEY L | 2635 | §103 | Non-Final OA | 43d | Pending | |
| 18975721 | TECHNOLOGIES FOR PROVIDING SECURE UTILIZATION OF TENANT KEYS | Intel Corporation | TABOR, AMARE F | 2434 | DP | Non-Final OA | 26d | Pending | Dec 10, 2024 |
| 18778493 | TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA THE CLOUD | Intel Corporation | BODDEN, EVRAL E | — | Non-Final OA | 90d | Pending | Jul 19, 2024 | |
| 18598837 | TECHNOLOGIES FOR DYNAMICALLY SHARING REMOTE RESOURCES ACROSS REMOTE COMPUTING NODES | Intel Corporation | CHEN, CAI Y | 2425 | §103DP | Final Rejection | 15d | AI Ready | Mar 07, 2024 |
| 18399494 | Comb Laser Source Architectures for Photonic integrated Circuits | Intel Corporation | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | 71d | AI Ready | Dec 28, 2023 |
| 18562694 | TRAFFIC ENGINEERING IN FABRIC TOPOLOGIES WITH DETERMINISTIC SERVICES | Intel Corporation | PATEL, PARTHKUMAR | 2479 | §103 | Non-Final OA | 19d | AI Ready | Nov 20, 2023 |
| 18243896 | PACKET PROCESSING WITH REDUCED LATENCY | Intel Corporation | VOGEL, JAY L. | 2478 | §103DP | Final Rejection | 4d overdue | AI Ready | Sep 08, 2023 |
| 18214830 | HARDWARE-BASED GENERATION OF UNCOMPRESSED DATA BLOCKS | Intel Corporation | COULTER, KENNETH R | 2445 | §101§103DP | Non-Final OA | 60d | Pending | Jun 27, 2023 |
| 18139078 | EXECUTION OF CONTAINER IMAGES IN A TRUSTED EXECUTION ENVIRONMENT | Intel Corporation | COYER, RYAN D | 2191 | §101§102§103 | Non-Final OA | 33d | AI Ready | Apr 25, 2023 |
| 18136972 | HARDWARE-BASED ACCELERATORS IN CLOUD NATIVE APPLICATIONS WRITTEN IN HIGH LEVEL PROGRAMMING LANGUAGES | Intel Corporation | DASCOMB, JACOB D | 2198 | §103 | Final Rejection | 21d | AI Ready | Apr 20, 2023 |
| 18296264 | DISPLAY SYNCHRONIZATION FOR TIME SENSITIVE NETWORKING | Intel Corporation | MESA, JOSE M | §102§103 | Non-Final OA | 83d | Pending | Apr 05, 2023 | |
| 18127960 | SERVICE MESH ARCHITECTURE FOR INTEGRATION WITH ACCELERATOR SYSTEMS | Intel Corporation | KAMRAN, MEHRAN | 2196 | §102§103§112 | Non-Final OA | 9d overdue | AI Ready | Mar 29, 2023 |
| 18114120 | PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | 28d | AI Ready | Feb 24, 2023 |
| 18106259 | CRYPTOGRAPHIC OPERATIONS IN EDGE COMPUTING NETWORKS | Intel Corporation | WICKRAMASURIYA, SAMEERA | 2494 | §101§103§112 | Non-Final OA | 35d overdue | AI Ready | Feb 06, 2023 |
| 18091209 | TRANSFER-FREE 2D FET AND FEFET DEVICE FABRICATION BY 2D MATERIAL GROWTH IN SUPERLATTICE WITH NITRIDES | Intel Corporation | HO, ANTHONY | 2817 | §102 | Non-Final OA | 14d | AI Ready | Dec 29, 2022 |
| 18091211 | 2D NANORIBBONS UTILIZING SILICON SCAFFOLDING | Intel Corporation | ROLAND, CHRISTOPHER M | §102§103§112 | Non-Final OA | 22d | AI Ready | Dec 29, 2022 | |
| 18091201 | BEOL CONTACT METALS FOR 2D TRANSISTORS | Intel Corporation | CRITE, ANTONIO B | 2817 | §103§112 | Non-Final OA | 23d | AI Ready | Dec 29, 2022 |
| 18091270 | IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS | Intel Corporation | AU, BAC H | 2898 | §102§103§112 | Non-Final OA | 15d | AI Ready | Dec 29, 2022 |
| 18090883 | PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES | Intel Corporation | BOWEN, ADAM S | 2897 | §102§103§112 | Non-Final OA | 14d | AI Ready | Dec 29, 2022 |
| 18091279 | PASSIVATION OF CRYSTALLINE SUBSTRATE FOR METAL CHALCOGEN MATERIAL SYNTHESIS | Intel Corporation | NGUYEN, NIKI HOANG | 2818 | §102 | Non-Final OA | 3d overdue | AI Ready | Dec 29, 2022 |
| 18090258 | ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE | Intel Corporation | TRAN, HOANG Q | 2874 | §102§103 | Non-Final OA | 20d | AI Ready | Dec 28, 2022 |
| 18089916 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | TRAN, HOANG Q | 2874 | §102§103 | Non-Final OA | 19d | AI Ready | Dec 28, 2022 |
| 18089871 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Intel Corporation | JORDAN, ANDREW | 2874 | §102§103 | Non-Final OA | 30d | AI Ready | Dec 28, 2022 |
| 18090253 | ELECTRO-OPTICAL CIRCUITS WITH LOW-VOLTAGE SWITCHABLE PHOTONIC INTERFACE | Intel Corporation | PAK, SUNG H | 2874 | §103 | Non-Final OA | 2d overdue | AI Ready | Dec 28, 2022 |
| 18090305 | PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS | Intel Corporation | LEE, CHEUNG | 2812 | §102§103 | Non-Final OA | 1d overdue | AI Ready | Dec 28, 2022 |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Intel Corporation | LINDSEY, COLE LEON | 2812 | §102§103§112 | Non-Final OA | 9d overdue | AI Ready | Dec 22, 2022 |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Non-Final OA | 18d overdue | AI Ready | Dec 19, 2022 |
| 18080612 | LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE | Intel Corporation | OH, JAEHWAN | 2899 | §102 | Non-Final OA | 28d | AI Ready | Dec 13, 2022 |
| 18080152 | INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES | Intel Corporation | JORDAN, ANDREW | 2874 | §102§103 | Non-Final OA | 12d | AI Ready | Dec 13, 2022 |
| 18073221 | IN-TRANSIT PACKET DETECTION TO REDUCE REAL-TIME RECEIVER PACKET JITTER | Intel Corporation | LEWIS-TAYLOR, DAYTON A. | 2181 | §112 | Non-Final OA | 77d | Pending | Dec 01, 2022 |
| 17993675 | CHECKSUM-BASED FAULT DETECTION AND CORRECTION FOR A MATRIX COMPUTE ENGINE | Intel Corporation | MASKULINSKI, MICHAEL C | 2113 | §102§103 | Final Rejection | — | Pending | Nov 23, 2022 |
| 17992818 | INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES & SELF-ALIGNED VIAS | Intel Corporation | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | 72d | Pending | Nov 22, 2022 |
| 17957349 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Intel Corporation | VU, VU A | 2897 | §102§103 | Final Rejection | 17d overdue | AI Ready | Sep 30, 2022 |
| 17957992 | SELF-CHECKING DIAGNOSTICS FRAMEWORK FOR MULTICAST IN A PACKET FORWARDING DEVICE | Intel Corporation | MILLS, DONALD L | 2462 | §103 | Final Rejection | 5d overdue | AI Ready | Sep 30, 2022 |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103 | Non-Final OA | 30d | AI Ready | Sep 30, 2022 |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | Intel Corporation | ANGUIANO, MICHAEL | 2899 | §103§112 | Non-Final OA | 5d overdue | AI Ready | Sep 30, 2022 |
| 17956188 | ULTRA-LOW VOLTAGE TRANSISTOR CELL DESIGN USING GATE CUT LAYOUT | Intel Corporation | GREAVING, JASON JAMES | 2893 | §102§103§112 | Non-Final OA | 44d overdue | AI Ready | Sep 29, 2022 |
| 17955194 | TCAM WITH HYSTERETIC OXIDE MEMORY CELLS | Intel Corporation | TRAN, MICHAEL THANH | 2827 | §102 | Non-Final OA | 26d | AI Ready | Sep 28, 2022 |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | Intel Corporation | CHEN, YU | 2896 | §103 | Non-Final OA | 44d overdue | AI Ready | Sep 28, 2022 |
| 17955269 | RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE | Intel Corporation | VU, HUNG K | 2897 | §102§103 | Non-Final OA | 41d | AI Ready | Sep 28, 2022 |
| 17955187 | SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103 | Non-Final OA | 27d | AI Ready | Sep 28, 2022 |
| 17955245 | SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §102§103 | Non-Final OA | 7d | AI Ready | Sep 28, 2022 |
| 17955203 | BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WITH OPTIONAL CYLINDRICAL MIM CAPACITOR | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | 4d overdue | AI Ready | Sep 28, 2022 |
| 17953002 | ADJUSTING POWER PARAMETERS FOR FREQUENCY CONTROL IN COMPUTE SYSTEMS | Intel Corporation | CHEN, XUXING | 2176 | §102 | Final Rejection | — | AI Ready | Sep 26, 2022 |
| 17953184 | SHORT PIPELINE FOR FAST RECOVERY FROM A BRANCH MISPREDICTION | Intel Corporation | SPANN, COURTNEY P | 2183 | §102§103 | Final Rejection | 17d overdue | AI Ready | Sep 26, 2022 |
| 17903327 | METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION | Intel Corporation | KE, PENG | 2194 | §101§102§103 | Final Rejection | 9d | AI Ready | Sep 06, 2022 |
| 17891880 | INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES | Intel Corporation | PHAM, LONG | 2897 | §102§103 | Non-Final OA | 12d | AI Ready | Aug 19, 2022 |
| 17891536 | SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES | Intel Corporation | NGUYEN, DAO H | 2818 | §102§103 | Non-Final OA | 9d overdue | AI Ready | Aug 19, 2022 |
| 17891735 | THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES | Intel Corporation | SEVEN, EVREN | 2812 | §103 | Non-Final OA | 22d overdue | AI Ready | Aug 19, 2022 |
| 17891560 | INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS | Intel Corporation | BARZYKIN, VICTOR V | 2893 | §103§112 | Non-Final OA | 10d overdue | AI Ready | Aug 19, 2022 |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103§112 | Non-Final OA | 10d overdue | AI Ready | Aug 19, 2022 |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Intel Corporation | XU, ZHIJUN | 2818 | §103 | Non-Final OA | 66d overdue | AI Ready | Aug 19, 2022 |
| 17891530 | LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES | Intel Corporation | PROSTOR, ANDREW VICTOR | 2812 | §103 | Non-Final OA | 44d overdue | AI Ready | Aug 19, 2022 |
| 17856877 | BACKSIDE REVEAL FOR LAYERED MULTI-CAPACITOR SINGLE TRANSISTOR MEMORY SYSTEMS | Intel Corporation | LEE, WOO KYUNG | 2815 | §102§103 | Final Rejection | 56d | AI Ready | Jul 01, 2022 |
| 17855961 | POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD | Intel Corporation | ESKRIDGE, CORY W | 3624 | §103 | Final Rejection | 12d | AI Ready | Jul 01, 2022 |
| 17856830 | METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES | Intel Corporation | SYLVIA, CHRISTINA A | 2817 | §103§112 | Non-Final OA | 44d overdue | AI Ready | Jul 01, 2022 |
| 17850455 | METHOD AND APPARATUS TO PERFORM BANK SPARING FOR ADAPTIVE DOUBLE DEVICE DATA CORRECTION | Intel Corporation | YOON, ALEXANDER J | 2135 | §103 | Final Rejection | 38d overdue | AI Ready | Jun 27, 2022 |
| 17848059 | INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE | Intel Corporation | PHAM, LONG | 2897 | §102§112 | Non-Final OA | 31d overdue | AI Ready | Jun 23, 2022 |
| 17843179 | SELECTIVE DISABLE OF HISTORY-BASED PREDICTORS ON MODE TRANSITIONS | Intel Corporation | HUISMAN, DAVID J | 2183 | §102§103§112 | Final Rejection | 98d overdue | AI Ready | Jun 17, 2022 |
| 17841555 | PROCESSOR CIRCUITRY TO DETERMINE A STATE OF ENABLEMENT OF A SYNCHRONIZATION CONTROL FOR THREADS OF EXECUTION | Intel Corporation | HUISMAN, DAVID J | 2183 | §103 | Final Rejection | 32d overdue | AI Ready | Jun 15, 2022 |
| 17838703 | MANAGEMENT OF PORT CONGESTION | Intel Corporation | BAYARD, DJENANE M | 2444 | §102§103 | Non-Final OA | 78d | Pending | Jun 13, 2022 |
| 17836720 | MAXIMIZING RESOURCE BANDWIDTH WITH EFFICIENT TEMPORAL ARBITRATION | Intel Corporation | RIGOL, YAIMA | 2135 | §103 | Non-Final OA | 47d | AI Ready | Jun 09, 2022 |
| 17829788 | TECHNOLOGIES FOR NETWORK PACKET PROCESSING BETWEEN CLOUD AND TELECOMMUNICATIONS NETWORKS | Intel Corporation | MENSAH, PRINCE AKWASI | 2474 | §103 | Non-Final OA | 46d overdue | AI Ready | Jun 01, 2022 |
| 17711926 | BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING | Intel Corporation | PATEL, DEVANG R | 1735 | §103 | Final Rejection | 120d overdue | AI Ready | Apr 01, 2022 |
| 17711742 | DYNAMIC LATENCY-RESPONSIVE CACHE MANAGEMENT | Intel Corporation | YU, XIANG | 2455 | §102§103 | Non-Final OA | 131d overdue | AI Ready | Apr 01, 2022 |
| 17711917 | INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC DELAY | Intel Corporation | CIESLEWICZ, ANETA B | 2893 | §102§103§112 | Final Rejection | 60d overdue | AI Ready | Apr 01, 2022 |
| 17711878 | LASER-INDUCED THERMAL STRESSING OF INTEGRATED CIRCUITS | Intel Corporation | LE, THANG XUAN | 2858 | §103 | Final Rejection | 31d overdue | AI Ready | Apr 01, 2022 |
| 17708890 | HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 30d overdue | AI Ready | Mar 30, 2022 |
| 17694302 | DUAL FEED COLD SPRAY NOZZLE WITH INDEPENDENT SOLID POWDER TEMPERATURE CONTROL AND FEEDING RATE CONTROL | Intel Corporation | KURPLE, KARL | 1717 | §103 | Final Rejection | 44d overdue | AI Ready | Mar 14, 2022 |
| 17561832 | THROUGH-MOLD-INTERCONNECT STRUCTURE ON AN IC DIE DIRECTLY BONDED TO ANOTHER IC DIE | Intel Corporation | FREY, KIMBERLY NEWMAN | 2817 | §103§112 | Final Rejection | 41d | Pending | Dec 24, 2021 |
| 17561845 | IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING | Intel Corporation | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | 112d overdue | AI Ready | Dec 24, 2021 |
| 17560915 | INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Final Rejection | 45d overdue | AI Ready | Dec 23, 2021 |
| 17560927 | SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 60d overdue | AI Ready | Dec 23, 2021 |
| 17560062 | METAL INSULATOR METAL (MIM) CAPACITORS WITH PYROCHLORE-BASED INSULATORS FOR INTEGRATED CIRCUIT DIE & PACKAGES | Intel Corporation | STEVENSON, ANDRE C | 2899 | §103 | Final Rejection | 124d overdue | AI Ready | Dec 22, 2021 |
| 17557290 | ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE | Intel Corporation | LEE, DA WEI | 2817 | §102§103§112 | Final Rejection | 112d overdue | AI Ready | Dec 21, 2021 |
| 17558437 | EMBEDDED MEMORY WITH FERROELECTRIC CAPACITORS & INDEPENDENT TOP PLATE LINES | Intel Corporation | WELLINGTON, ANDREA L | 2800 | §103 | Final Rejection | 147d overdue | AI Ready | Dec 21, 2021 |
| 17550796 | FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Final Rejection | 131d overdue | AI Ready | Dec 14, 2021 |
| 17521760 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS | Intel Corporation | BRADFORD, PETER | 2897 | §103 | Final Rejection | 13d | AI Ready | Nov 08, 2021 |
| 17485158 | SINGLE-SIDED NANOSHEET TRANSISTORS | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §102§103 | Non-Final OA | 26d | AI Ready | Sep 24, 2021 |
| 17354446 | OPTICAL COMMUNICATION BETWEEN INTEGRATED CIRCUIT DEVICE ASSEMBLIES | Intel Corporation | HOLLWEG, THOMAS A | 2874 | §103 | Non-Final OA | 150d overdue | AI Ready | Jun 22, 2021 |
| 17323881 | INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL ROUTING | Intel Corporation | TRAN, HOANG Q | 2874 | §103 | Non-Final OA | 62d | AI Ready | May 18, 2021 |
| 17308853 | METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELECTRIC | Intel Corporation | OH, JIYOUNG | 2818 | §102§103§112 | Non-Final OA | 6d | AI Ready | May 05, 2021 |
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