Prosecution Insights
Prosecution Insights
Technology areas: Computing & Software • Semiconductors, Circuits & Optics
93 pending office actions • 1 client • 89 examiners • 33 art units • 38 of 93 (41%) have an AI response strategy ready
Essential Patents Group, LLP. has processed 2847 career applications in the Semiconductors, Circuits & Optics technology area. The firm has achieved a resolved allowance rate of 91.87 percent, showing a high level of performance in this field. This metric indicates the firm's ability to successfully navigate the examination process for a large portfolio.
The firm averages 3.17 office actions per allowance during the prosecution process. Currently, the firm is addressing 62 pending office actions, which reflects its active engagement in Semiconductors, Circuits & Optics relative to its 2847 career applications. This data provides a measure of the firm's historical success and current administrative tasks for practitioners evaluating its capabilities.
Based on the USPTO statutory response window for each pending office action. 27 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 27 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 4 (4%) |
| §103 only | 42 (45%) |
| §102 only | 5 (5%) |
| §112 only | 2 (2%) |
| Double-patenting only | 2 (2%) |
| Double-patenting + other | 2 (2%) |
| Multi-statute (no §101) | 35 (38%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| COMBER, KEVIN J | 2 | 82.6% | +11.8% |
| SAMPATH, GAYATHRI | 2 | 78.0% | +37.9% |
| KOLB, THADDEUS J | 2 | 84.8% | +21.7% |
| VALENZUELA, PATRICIA D | 2 | 90.3% | +2.0% |
| RECEK, JASON D | 1 | 70.9% | +22.4% |
| JOO, JOSHUA | 1 | 78.4% | +23.1% |
| TALUKDAR, ARVIND | 1 | 80.6% | +4.2% |
| MADU, FAVOUR ONYINYECHI | 1 | — | — |
| WILLIAMS, CLAYTON R | 1 | 81.9% | -5.0% |
| ZAIDI, IQBAL | 1 | 90.4% | +6.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | WILLIAMS, CLAYTON R | — |
| 18793623 | ACCELERATED NETWORK PACKET PROCESSING | ZAIDI, IQBAL | — |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | COMBER, KEVIN J | — |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | COMBER, KEVIN J | — |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | VALENZUELA, PATRICIA D | — |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | XU, ZHIJUN | 66d overdue |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | CHEN, YU | 44d overdue |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | HANUMASAGAR, SHAMITA S | 18d overdue |
| 17953184 | SHORT PIPELINE FOR FAST RECOVERY FROM A BRANCH MISPREDICTION | SPANN, COURTNEY P | 17d overdue |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | KOLB, THADDEUS J | 10d overdue |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | ANGUIANO, MICHAEL | 5d overdue |
| 17903327 | METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION | KE, PENG | 9d |
| 18091270 | IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS | AU, BAC H | 15d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | KOLB, THADDEUS J | 10d overdue |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | KOLB, THADDEUS J | 30d |
| 19260043 | TECHNOLOGIES FOR ALLOCATING RESOURCES ACROSS DATA CENTERS | RECEK, JASON D | — |
| 19019032 | TECHNOLOGIES FOR TRANSPARENT FUNCTION AS A SERVICE ARBITRATION FOR EDGE SYSTEMS | JOO, JOSHUA | — |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | COMBER, KEVIN J | — |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | COMBER, KEVIN J | — |
| 18110603 | COPROCESSOR POWER MANAGEMENT IN HYBRID ARCHITECTURES | SAMPATH, GAYATHRI | — |
| 17957719 | METHOD AND APPARATUS TO DETECT NETWORK IDLENESS IN A NETWORK DEVICE TO PROVIDE POWER SAVINGS IN A DATA CENTER | SAMPATH, GAYATHRI | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 93 |
| Art Unit | Apps |
|---|---|
| 2812 | 7 |
| 2898 | 6 |
| 2874 | 5 |
| 2899 | 4 |
| 2176 | 3 |
| 2817 | 3 |
| 2183 | 3 |
| 2818 | 3 |
| 2443 | 2 |
| 2896 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19260043 | TECHNOLOGIES FOR ALLOCATING RESOURCES ACROSS DATA CENTERS | Intel Corporation | RECEK, JASON D | §103 | Non-Final OA | — | Pending | Jul 03, 2025 | |
| 19019032 | TECHNOLOGIES FOR TRANSPARENT FUNCTION AS A SERVICE ARBITRATION FOR EDGE SYSTEMS | Intel Corporation | JOO, JOSHUA | 2445 | §103 | Final Rejection | — | Pending | Jan 13, 2025 |
| 18868623 | VARIABLE CACHELINE SET MAPPING | Intel Corporation | TALUKDAR, ARVIND | 2132 | §102§103 | Final Rejection | — | Pending | Nov 22, 2024 |
| 18868648 | SYSTEMS, APPARATUS, ARTICLES OF MANUFACTURE, AND METHODS FOR DEVICE AUTHENTICATION IN A DEDICATED PRIVATE NETWORK | Intel Corporation | MADU, FAVOUR ONYINYECHI | §103 | Non-Final OA | — | Pending | Nov 22, 2024 | |
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | Intel Corporation | WILLIAMS, CLAYTON R | 2443 | §103Other | Final Rejection | — | AI Ready | Oct 11, 2024 |
| 18793623 | ACCELERATED NETWORK PACKET PROCESSING | Intel Corporation | ZAIDI, IQBAL | DP | Non-Final OA | — | Pending | Aug 02, 2024 | |
| 18762478 | PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER | Intel Corporation | GEYER, SCOTT B | §102DP | Non-Final OA | — | Pending | Jul 02, 2024 | |
| 18668042 | MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES | Intel Corporation | PATEL, REEMA | §102§103DP | Non-Final OA | — | Pending | May 17, 2024 | |
| 18621790 | SILICON PHOTONIC INTEGRATED CIRCUITS WITH ENHANCED THERMAL ISOLATION OF HEATER ELEMENTS | Intel Corporation | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621811 | SWITCH-BASED PHOTONIC INTEGRATED CIRCUIT ARCHITECTURES FOR MULTI-POINT SENSING APPLICATIONS | Intel Corporation | PATEL, SANJIV D | §102§103§112 | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18598837 | TECHNOLOGIES FOR DYNAMICALLY SHARING REMOTE RESOURCES ACROSS REMOTE COMPUTING NODES | Intel Corporation | CHEN, CAI Y | 2425 | DP | Non-Final OA | 15d | AI Ready | Mar 07, 2024 |
| 18399494 | Comb Laser Source Architectures for Photonic integrated Circuits | Intel Corporation | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | 71d | AI Ready | Dec 28, 2023 |
| 18399503 | SILICON PHOTONIC INTEGRATED CIRCUITS WITH LOCALIZED THICK BURIED INSULATOR | Intel Corporation | GREEN, TAJANAE NICOLE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18389625 | INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING | Intel Corporation | MIYOSHI, JESSE Y | 2898 | §102§112 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18501826 | OPTICAL TRANSCEIVER BANDWIDTH SCALING THROUGH DIRECT OPTICAL WIRE FIBER TERMINATION | Intel Corporation | CHIEM, DINH D | 2874 | §103 | Non-Final OA | — | Pending | Nov 03, 2023 |
| 18478589 | METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MANAGE NETWORK COMMUNICATIONS IN TIME SENSITIVE NETWORKS | Intel Corporation | WIDHALM DE RODRIG, ANGELA MARIE | §102 | Non-Final OA | — | Pending | Sep 29, 2023 | |
| 18477370 | HARDWARE ENFORCED SECURITY FOR SERVICE MESH | Intel Corporation | DAVIS, ZACHARY A | §102§112 | Non-Final OA | — | Pending | Sep 28, 2023 | |
| 18233199 | DEVICE, METHOD AND SYSTEM FOR IN-FIELD LANE TESTING AND REPAIR WITH A THREE-DIMENSIONAL INTEGRATED CIRCUIT | Intel Corporation | ALEJNIKOV JR, ROBERT P | §102§103 | Non-Final OA | — | Pending | Aug 11, 2023 | |
| 18217056 | FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY | Intel Corporation | ANYA, IGWE U | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18217049 | METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES | Intel Corporation | MCCOY, THOMAS WILSON | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18216436 | HARDWARE-BASED CRYPTOGRAPHIC PROTECTION OF TOKENS | Intel Corporation | ZARRINEH, SHAHRIAR | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18344793 | METHODS AND APPARATUS FOR ADAPTIVE PLATFORM POWER MANAGEMENT | Intel Corporation | SUN, CHARLIE | §101§102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18216352 | DEVICE, METHOD, AND SYSTEM TO PROVIDE A LIMITED POWER STATES MODE FOR MANAGING PROCESSOR OPERATION | Intel Corporation | HARRINGTON, CHERI L. | §102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18216493 | PERFORMANCE OPTIMIZATION OF TRANSISTORS SHARING CHANNEL STRUCTURES OF VARYING WIDTH | Intel Corporation | KIM, TONG-HO | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18216447 | HIGH-FREQUENCY INTERFACE CIRCUIT PROTECTION FROM ELECTROSTATIC DISCHARGE EVENTS | Intel Corporation | SREEVATSA, SREEYA | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18216525 | THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES | Intel Corporation | LIU, XIAOMING | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18343671 | METHODS AND APPARATUS TO INCREASE PRIVACY FOR FOLLOW-ME SERVICES | Intel Corporation | NOAMAN, BASSAM A | §103 | Non-Final OA | — | Pending | Jun 28, 2023 | |
| 18343607 | METHODS AND APPARATUS FOR AUTONOMOUS MOBILE ROBOTS | Intel Corporation | PAIGE, TYLER D | §102§103Other | Non-Final OA | — | Pending | Jun 28, 2023 | |
| 18215033 | DISTRIBUTED CIRCUIT FOR ELECTROSTATIC DISCHARGE PROTECTION FOR A SIGNAL PAD | Intel Corporation | JACKSON, STEPHEN W | §102 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18212308 | VARIABLE GAIN AMPLIFIER WITH COMPLEMENTARILY SWITCHED NEUTRALIZED DIFFERENTIAL PAIR | Intel Corporation | NGUYEN, KHANH V | §102§103§112 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18209361 | DEVICE, METHOD AND SYSTEM FOR IMPROVED ELECTROSTATIC DISCHARGE PROTECTION | Intel Corporation | PATEL, DHARTI HARIDAS | 2838 | §103 | Non-Final OA | — | Pending | Jun 13, 2023 |
| 18331799 | METHODS AND APPARATUS TO SLICE NETWORKS FOR WIRELESS SERVICES | Intel Corporation | HSU, BAILOR CHIA-JONG | §112 | Non-Final OA | — | Pending | Jun 08, 2023 | |
| 18328214 | METHODS AND APPARATUS TO DIRECT TRANSMISSION OF DATA BETWEEN NETWORK-CONNECTED DEVICES | Intel Corporation | COULTER, KENNETH R | §102 | Non-Final OA | — | Pending | Jun 02, 2023 | |
| 18204864 | SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS | Intel Corporation | LEE, CHEUNG | §103 | Non-Final OA | — | Pending | Jun 01, 2023 | |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | Intel Corporation | COMBER, KEVIN J | §103Other | Non-Final OA | — | Pending | May 24, 2023 | |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | Intel Corporation | COMBER, KEVIN J | §103 | Non-Final OA | — | Pending | May 24, 2023 | |
| 18201656 | OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS | Intel Corporation | MINNEY, GABRIEL SEBASTIAN | §103 | Non-Final OA | — | Pending | May 24, 2023 | |
| 18197255 | SENSOR-BASED CONTROL FOR DEBUG INVASIVENESS | Intel Corporation | HURUY, FEVEN HABTEMARIAM | §101§103 | Non-Final OA | — | Pending | May 15, 2023 | |
| 18139078 | EXECUTION OF CONTAINER IMAGES IN A TRUSTED EXECUTION ENVIRONMENT | Intel Corporation | COYER, RYAN D | 2191 | §103 | Final Rejection | 33d | AI Ready | Apr 25, 2023 |
| 18139204 | INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION | Intel Corporation | WOODS, BRANDON SEAN | §102§103 | Non-Final OA | — | Pending | Apr 25, 2023 | |
| 18133353 | OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES | Intel Corporation | KIANNI, KAVEH C | §102 | Non-Final OA | — | Pending | Apr 11, 2023 | |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Intel Corporation | STARK, JARRETT J | 2898 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18129688 | BACKSIDE CONTACT ETCH BEFORE CAVITY SPACER FORMATION FOR BACKSIDE CONTACT OF TRANSISTOR SOURCE/DRAIN | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103§112 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18129690 | CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE | Intel Corporation | CHOWDHURY, TARIFUR RASHID | 2877 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18129704 | PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON OXIDIZABLE MATERIAL | Intel Corporation | MOVVA, AMAR | 2898 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18127960 | SERVICE MESH ARCHITECTURE FOR INTEGRATION WITH ACCELERATOR SYSTEMS | Intel Corporation | KAMRAN, MEHRAN | 2196 | §103 | Final Rejection | 9d overdue | AI Ready | Mar 29, 2023 |
| 18116940 | IN-ORDER STREAMING IN-NETWORK COMPUTATION | Intel Corporation | BARRY, LANCE LEONARD | 2443 | §103 | Final Rejection | — | Pending | Mar 03, 2023 |
| 18114120 | PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Final Rejection | 28d | AI Ready | Feb 24, 2023 |
| 18110603 | COPROCESSOR POWER MANAGEMENT IN HYBRID ARCHITECTURES | Intel Corporation | SAMPATH, GAYATHRI | 2176 | §102§103 | Final Rejection | — | Pending | Feb 16, 2023 |
| 18109774 | TECHNOLOGIES FOR COORDINATING DISAGGREGATED ACCELERATOR DEVICE RESOURCES | Intel Corporation | CAO, DIEM K | 2196 | §103 | Non-Final OA | — | Pending | Feb 14, 2023 |
| 18106259 | CRYPTOGRAPHIC OPERATIONS IN EDGE COMPUTING NETWORKS | Intel Corporation | WICKRAMASURIYA, SAMEERA | 2494 | — | Final Rejection | 35d overdue | AI Ready | Feb 06, 2023 |
| 18091264 | STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE | Intel Corporation | LIU, BENJAMIN T | 2893 | §102 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18091270 | IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS | Intel Corporation | AU, BAC H | 2898 | §102§103§112 | Final Rejection | 15d | AI Ready | Dec 29, 2022 |
| 18091265 | DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §103 | Final Rejection | — | AI Ready | Dec 29, 2022 |
| 18090258 | ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE | Intel Corporation | TRAN, HOANG Q | 2874 | §103 | Final Rejection | 20d | AI Ready | Dec 28, 2022 |
| 18090140 | SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES | Intel Corporation | ARMAND, MARC ANTHONY | 2813 | §103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Intel Corporation | LINDSEY, COLE LEON | 2812 | §103 | Final Rejection | 9d overdue | AI Ready | Dec 22, 2022 |
| 18069252 | SYSTEM, APPARATUS AND METHODS FOR OFFLOADING DEBUG OPERATIONS FROM HOST TO PEER | Intel Corporation | BUI, HANH THI MINH | 2192 | §103 | Non-Final OA | — | AI Ready | Dec 21, 2022 |
| 18086232 | GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | §103 | Final Rejection | — | Pending | Dec 21, 2022 |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Final Rejection | 18d overdue | AI Ready | Dec 19, 2022 |
| 18080152 | INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES | Intel Corporation | JORDAN, ANDREW | 2874 | §103 | Final Rejection | 12d | AI Ready | Dec 13, 2022 |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | 30d | AI Ready | Sep 30, 2022 |
| 17957721 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MATERIALS | Intel Corporation | DULKA, JOHN P | 2817 | §102§103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957359 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Intel Corporation | FARMER, EMILY NICOLE | 2812 | §103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957969 | DEVICE, METHOD AND SYSTEM TO DETERMINE A MODE OF PROCESSOR OPERATION BASED ON PAGE TABLE METADATA | Intel Corporation | VICARY, KEITH E | 2183 | §112 | Non-Final OA | — | AI Ready | Sep 30, 2022 |
| 17957945 | DEVICE, METHOD AND SYSTEM TO PROVIDE A RANDOM ACCESS MEMORY WITH A FERROELECTRIC RESISTIVE JUNCTION | Intel Corporation | LEBOEUF, JEROME LARRY | 2824 | §102§103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957719 | METHOD AND APPARATUS TO DETECT NETWORK IDLENESS IN A NETWORK DEVICE TO PROVIDE POWER SAVINGS IN A DATA CENTER | Intel Corporation | SAMPATH, GAYATHRI | 2176 | §103 | Non-Final OA | — | AI Ready | Sep 30, 2022 |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | Intel Corporation | ANGUIANO, MICHAEL | 2899 | §103§112 | Final Rejection | 5d overdue | AI Ready | Sep 30, 2022 |
| 17955245 | SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Final Rejection | 7d | AI Ready | Sep 28, 2022 |
| 17955187 | SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103§112 | Final Rejection | 27d | AI Ready | Sep 28, 2022 |
| 17955269 | RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE | Intel Corporation | VU, HUNG K | 2897 | §103 | Final Rejection | 41d | AI Ready | Sep 28, 2022 |
| 17955262 | LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS | Intel Corporation | MELLINGER, CORBYN DAVID | 2899 | §103 | Non-Final OA | — | Pending | Sep 28, 2022 |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | Intel Corporation | CHEN, YU | 2896 | §103§112 | Final Rejection | 44d overdue | AI Ready | Sep 28, 2022 |
| 17953184 | SHORT PIPELINE FOR FAST RECOVERY FROM A BRANCH MISPREDICTION | Intel Corporation | SPANN, COURTNEY P | 2183 | §102§103 | Final Rejection | 17d overdue | AI Ready | Sep 26, 2022 |
| 17953002 | ADJUSTING POWER PARAMETERS FOR FREQUENCY CONTROL IN COMPUTE SYSTEMS | Intel Corporation | CHEN, XUXING | 2176 | §103 | Non-Final OA | — | AI Ready | Sep 26, 2022 |
| 17903327 | METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION | Intel Corporation | KE, PENG | 2194 | §101§102§103 | Final Rejection | 9d | AI Ready | Sep 06, 2022 |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Aug 19, 2022 |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Intel Corporation | XU, ZHIJUN | 2818 | §103§112 | Final Rejection | 66d overdue | AI Ready | Aug 19, 2022 |
| 17891735 | THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES | Intel Corporation | SEVEN, EVREN | 2812 | §103 | Non-Final OA | 22d overdue | AI Ready | Aug 19, 2022 |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | 10d overdue | AI Ready | Aug 19, 2022 |
| 17856869 | INDEPENDENT GATE STACK FOR SINGLE NANOWIRE STANDARD CELL TRANSISTORS | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | AI Ready | Jul 01, 2022 |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | AI Ready | Jun 30, 2022 |
| 17841555 | PROCESSOR CIRCUITRY TO DETERMINE A STATE OF ENABLEMENT OF A SYNCHRONIZATION CONTROL FOR THREADS OF EXECUTION | Intel Corporation | HUISMAN, DAVID J | 2183 | §103 | Final Rejection | 32d overdue | AI Ready | Jun 15, 2022 |
| 17836720 | MAXIMIZING RESOURCE BANDWIDTH WITH EFFICIENT TEMPORAL ARBITRATION | Intel Corporation | RIGOL, YAIMA | 2135 | §103 | Final Rejection | 47d | AI Ready | Jun 09, 2022 |
| 17829788 | TECHNOLOGIES FOR NETWORK PACKET PROCESSING BETWEEN CLOUD AND TELECOMMUNICATIONS NETWORKS | Intel Corporation | MENSAH, PRINCE AKWASI | 2474 | §103 | Final Rejection | 46d overdue | AI Ready | Jun 01, 2022 |
| 17825340 | INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN | Intel Corporation | TRAN, TRANG Q | 2811 | §103 | Final Rejection | — | AI Ready | May 26, 2022 |
| 17723216 | COMPRESSION AS A SOLUTION FOR CONGESTION CONTROL ON AI WORKLOADS | Intel Corporation | WONG, WILLIAM | 2144 | §101§103§112 | Final Rejection | — | Pending | Apr 18, 2022 |
| 17711878 | LASER-INDUCED THERMAL STRESSING OF INTEGRATED CIRCUITS | Intel Corporation | LE, THANG XUAN | 2858 | §103 | Non-Final OA | 31d overdue | AI Ready | Apr 01, 2022 |
| 17710658 | CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103§112 | Final Rejection | — | AI Ready | Mar 31, 2022 |
| 17677829 | ADDITIVELY MANUFACTURED HEAT DISSIPATION DEVICE | Intel Corporation | AL SAMIRI, KHALED AHMED ALI | 3763 | §103§112 | Final Rejection | — | Pending | Feb 22, 2022 |
| 17559342 | FORMATION OF CAVITY SPACER AND SOURCE-DRAIN EPITAXIAL GROWTH FOR SCALING OF GATE-ALL-AROUND TRANSISTORS | Intel Corporation | DEGRASSE, IAN ISAAC | 2818 | §103 | Final Rejection | — | Pending | Dec 22, 2021 |
| 17358921 | WAVEGUIDE PHOTODETECTORS FOR SILICON PHOTONIC INTEGRATED CIRCUITS | Intel Corporation | LE, UYEN CHAU N | 2800 | §103§112 | Final Rejection | — | Pending | Jun 25, 2021 |
| 17308853 | METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELECTRIC | Intel Corporation | OH, JIYOUNG | 2818 | §103 | Final Rejection | 6d | AI Ready | May 05, 2021 |
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