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Last updated: April 19, 2026

Essential Patents Group, Llp.

102 pending office actions • 3 clients

Portfolio Summary

102
Total Pending OAs
31
Final Rejections
71
Non-Final OAs

Client Portfolio (3 clients)

Client (Assignee)Pending OAs
Intel Corporation 100
Barefoot Networks, Inc. 1
Intel Corporation 1

Pending Office Actions

App #TitleClientExaminerArt UnitStatusFiled
18757106 Untitled Intel Corporation KRETZER, CASEY L 2635 Non-Final OA
18975721 TECHNOLOGIES FOR PROVIDING SECURE UTILIZATION OF TENANT KEYS Intel Corporation TABOR, AMARE F 2434 Non-Final OA Dec 10, 2024
18966033 ALGORITHMIC TCAM BASED TERNARY LOOKUP Barefoot Networks, Inc. WADDY JR, EDWARD 2135 Non-Final OA Dec 02, 2024
18598837 TECHNOLOGIES FOR DYNAMICALLY SHARING REMOTE RESOURCES ACROSS REMOTE COMPUTING NODES Intel Corporation CHEN, CAI Y 2425 Final Rejection Mar 07, 2024
18389625 INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING Intel Corporation MIYOSHI, JESSE Y 2898 Non-Final OA Dec 19, 2023
18562694 TRAFFIC ENGINEERING IN FABRIC TOPOLOGIES WITH DETERMINISTIC SERVICES Intel Corporation PATEL, PARTHKUMAR 2479 Non-Final OA Nov 20, 2023
18243896 PACKET PROCESSING WITH REDUCED LATENCY Intel Corporation VOGEL, JAY L. 2478 Final Rejection Sep 08, 2023
18136972 HARDWARE-BASED ACCELERATORS IN CLOUD NATIVE APPLICATIONS WRITTEN IN HIGH LEVEL PROGRAMMING LANGUAGES Intel Corporation DASCOMB, JACOB D 2198 Final Rejection Apr 20, 2023
18127960 SERVICE MESH ARCHITECTURE FOR INTEGRATION WITH ACCELERATOR SYSTEMS Intel Corporation KAMRAN, MEHRAN 2196 Non-Final OA Mar 29, 2023
18114120 PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT Intel Corporation GARCES, NELSON Y 2814 Non-Final OA Feb 24, 2023
18113414 CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD Intel Corporation PAGHADAL, PARESH H 2847 Non-Final OA Feb 23, 2023
18110603 COPROCESSOR POWER MANAGEMENT IN HYBRID ARCHITECTURES Intel Corporation SAMPATH, GAYATHRI 2176 Non-Final OA Feb 16, 2023
18106259 CRYPTOGRAPHIC OPERATIONS IN EDGE COMPUTING NETWORKS Intel Corporation WICKRAMASURIYA, SAMEERA 2494 Non-Final OA Feb 06, 2023
18092152 TRANSISTOR WITH CHANNEL MATERIAL IN A STACK WITH INSULATOR MATERIAL SUPPORTS Intel Corporation MILLER, JAMI VALENTINE 2818 Non-Final OA Dec 30, 2022
18091209 TRANSFER-FREE 2D FET AND FEFET DEVICE FABRICATION BY 2D MATERIAL GROWTH IN SUPERLATTICE WITH NITRIDES Intel Corporation HO, ANTHONY 2817 Non-Final OA Dec 29, 2022
18091201 BEOL CONTACT METALS FOR 2D TRANSISTORS Intel Corporation CRITE, ANTONIO B 2817 Non-Final OA Dec 29, 2022
18091279 PASSIVATION OF CRYSTALLINE SUBSTRATE FOR METAL CHALCOGEN MATERIAL SYNTHESIS Intel Corporation NGUYEN, NIKI HOANG 2818 Non-Final OA Dec 29, 2022
18091228 ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES Intel Corporation ARORA, AJAY 2892 Non-Final OA Dec 29, 2022
18090883 PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES Intel Corporation BOWEN, ADAM S 2897 Non-Final OA Dec 29, 2022
18091270 IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS Intel Corporation AU, BAC H 2898 Non-Final OA Dec 29, 2022
18091265 DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES Intel Corporation JEFFERSON, QUOVAUNDA 2899 Non-Final OA Dec 29, 2022
18090707 DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING Intel Corporation PALANISWAMY, KRISHNA JAYANTHI 2899 Non-Final OA Dec 29, 2022
18091211 2D NANORIBBONS UTILIZING SILICON SCAFFOLDING Intel Corporation ROLAND, CHRISTOPHER M Non-Final OA Dec 29, 2022
18091264 STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE Intel Corporation LIU, BENJAMIN T 2893 Non-Final OA Dec 29, 2022
18089916 OPTICAL SEMICONDUCTOR PACKAGE AND METHOD Intel Corporation TRAN, HOANG Q 2874 Non-Final OA Dec 28, 2022
18089934 OPTICAL SEMICONDUCTOR PACKAGE AND METHOD Intel Corporation CHU, CHRIS H 2874 Non-Final OA Dec 28, 2022
18089871 OPTICAL SEMICONDUCTOR PACKAGE AND METHOD Intel Corporation JORDAN, ANDREW 2874 Non-Final OA Dec 28, 2022
18090253 ELECTRO-OPTICAL CIRCUITS WITH LOW-VOLTAGE SWITCHABLE PHOTONIC INTERFACE Intel Corporation PAK, SUNG H 2874 Non-Final OA Dec 28, 2022
18090140 SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES Intel Corporation ARMAND, MARC ANTHONY 2813 Non-Final OA Dec 28, 2022
18090258 ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE Intel Corporation TRAN, HOANG Q 2874 Non-Final OA Dec 28, 2022
18090260 ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE Intel Corporation TAVLYKAEV, ROBERT FUATOVICH 2896 Non-Final OA Dec 28, 2022
18090305 PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS Intel Corporation LEE, CHEUNG 2812 Non-Final OA Dec 28, 2022
18087517 UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING Intel Corporation LINDSEY, COLE LEON 2812 Non-Final OA Dec 22, 2022
18069252 SYSTEM, APPARATUS AND METHODS FOR OFFLOADING DEBUG OPERATIONS FROM HOST TO PEER Intel Corporation BUI, HANH THI MINH 2192 Non-Final OA Dec 21, 2022
18086030 METHOD AND APPARATUS TO AGGREGATE OBJECTS TO BE STORED IN A MEMORY TO OPTIMIZE THE MEMORY BANDWIDTH Intel Corporation KHAN, MASUD K 2132 Non-Final OA Dec 21, 2022
18086232 GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY Intel Corporation JOHNSON, CHRISTOPHER A 2899 Non-Final OA Dec 21, 2022
18084438 LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES Intel Corporation HANUMASAGAR, SHAMITA S 2814 Non-Final OA Dec 19, 2022
18084054 COHERENCY BYPASS TAGGING FOR READ-SHARED DATA Intel Corporation TALUKDAR, ARVIND 2132 Non-Final OA Dec 19, 2022
18080152 INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES Intel Corporation JORDAN, ANDREW 2874 Non-Final OA Dec 13, 2022
18080612 LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE Intel Corporation OH, JAEHWAN 2899 Non-Final OA Dec 13, 2022
17957341 DIRECTLY COUPLED OPTICAL INTERPOSER Intel Corporation STAHL, MICHAEL J 2874 Non-Final OA Sep 30, 2022
17958012 AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES Intel Corporation JUNG, MICHAEL YOO LIM 2817 Non-Final OA Sep 30, 2022
17957992 SELF-CHECKING DIAGNOSTICS FRAMEWORK FOR MULTICAST IN A PACKET FORWARDING DEVICE Intel Corporation MILLS, DONALD L 2462 Final Rejection Sep 30, 2022
17957591 SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-CAPACITOR DEVICES Intel Corporation LOPEZ, JORGE ANDRES 2897 Non-Final OA Sep 30, 2022
17957836 FABRICATION OF RECONFIGURABLE ARCHITECTURES USING FERROELECTRICS Intel Corporation RICHARDSON, JANY 2844 Non-Final OA Sep 30, 2022
17957403 HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES Intel Corporation KOLB, THADDEUS J 2817 Non-Final OA Sep 30, 2022
17957257 EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS Intel Corporation ANGUIANO, MICHAEL 2899 Non-Final OA Sep 30, 2022
17956188 ULTRA-LOW VOLTAGE TRANSISTOR CELL DESIGN USING GATE CUT LAYOUT Intel Corporation GREAVING, JASON JAMES 2893 Non-Final OA Sep 29, 2022
17955209 FERROELECTRIC TUNNEL JUNCTION DEVICES FOR LOW VOLTAGE AND LOW TEMPERATURE OPERATION Intel Corporation PAGE, STEVEN MITCHELL CHR 2812 Non-Final OA Sep 28, 2022
17955245 SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS Intel Corporation MILLER, ALEXANDER MICHAEL 2898 Non-Final OA Sep 28, 2022
17955187 SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS Intel Corporation GREWAL, HEIM KIRIN 2812 Non-Final OA Sep 28, 2022
17955235 LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS Intel Corporation CHEN, YU 2896 Non-Final OA Sep 28, 2022
17955194 TCAM WITH HYSTERETIC OXIDE MEMORY CELLS Intel Corporation TRAN, MICHAEL THANH 2827 Non-Final OA Sep 28, 2022
17955203 BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WITH OPTIONAL CYLINDRICAL MIM CAPACITOR Intel Corporation GARCES, NELSON Y 2814 Final Rejection Sep 28, 2022
17954522 SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES Intel Corporation RAHMAN, MOHAMMAD A 2898 Non-Final OA Sep 28, 2022
17955269 RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE Intel Corporation VU, HUNG K 2897 Non-Final OA Sep 28, 2022
17955262 LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS Intel Corporation MELLINGER, CORBYN DAVID 2899 Non-Final OA Sep 28, 2022
17953002 ADJUSTING POWER PARAMETERS FOR FREQUENCY CONTROL IN COMPUTE SYSTEMS Intel Corporation CHEN, XUXING 2176 Final Rejection Sep 26, 2022
17953184 SHORT PIPELINE FOR FAST RECOVERY FROM A BRANCH MISPREDICTION Intel Corporation SPANN, COURTNEY P 2183 Final Rejection Sep 26, 2022
17903327 METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION Intel Corporation KE, PENG 2194 Final Rejection Sep 06, 2022
17891735 THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES Intel Corporation SEVEN, EVREN 2812 Non-Final OA Aug 19, 2022
17891666 DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES Intel Corporation XU, ZHIJUN 2818 Non-Final OA Aug 19, 2022
17891654 IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES Intel Corporation KOLB, THADDEUS J 2817 Non-Final OA Aug 19, 2022
17891727 INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES Intel Corporation VALENZUELA, PATRICIA D 2812 Non-Final OA Aug 19, 2022
17891530 LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES Intel Corporation PROSTOR, ANDREW VICTOR 2812 Non-Final OA Aug 19, 2022
17891880 INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES Intel Corporation PHAM, LONG 2897 Non-Final OA Aug 19, 2022
17891560 INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS Intel Corporation BARZYKIN, VICTOR V 2893 Non-Final OA Aug 19, 2022
17891536 SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES Intel Corporation NGUYEN, DAO H 2818 Non-Final OA Aug 19, 2022
17855961 POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD Intel Corporation ESKRIDGE, CORY W 3624 Final Rejection Jul 01, 2022
17856830 METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES Intel Corporation SYLVIA, CHRISTINA A 2817 Non-Final OA Jul 01, 2022
17856869 INDEPENDENT GATE STACK FOR SINGLE NANOWIRE STANDARD CELL TRANSISTORS Intel Corporation SALAZ, SAMMANTHA KATELYN 2892 Non-Final OA Jul 01, 2022
17856777 GATE-ALL-AROUND TRANSISTOR CIRCUIT MODIFICATION USING DIRECT CONTACT AND/OR ACCESS PROBE POINTS Intel Corporation PALANISWAMY, KRISHNA JAYANTHI 2899 Final Rejection Jul 01, 2022
17856879 SCALED GAIN CELL ENHANCED AT LOW TEMPERATURES Intel Corporation CAMPBELL, SHAUN M 2893 Non-Final OA Jul 01, 2022
17855145 MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES Intel Corporation VALENZUELA, PATRICIA D 2812 Non-Final OA Jun 30, 2022
17850455 METHOD AND APPARATUS TO PERFORM BANK SPARING FOR ADAPTIVE DOUBLE DEVICE DATA CORRECTION Intel Corporation YOON, ALEXANDER J 2135 Final Rejection Jun 27, 2022
17848898 METHOD AND APPARATUS TO STORE AND PROCESS TELEMETRY DATA IN A NETWORK DEVICE IN A DATA CENTER Intel Corporation PATEL, DHAIRYA A 2453 Final Rejection Jun 24, 2022
17848059 INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE Intel Corporation PHAM, LONG 2897 Non-Final OA Jun 23, 2022
17843179 SELECTIVE DISABLE OF HISTORY-BASED PREDICTORS ON MODE TRANSITIONS Intel Corporation HUISMAN, DAVID J 2183 Final Rejection Jun 17, 2022
17841555 PROCESSOR CIRCUITRY TO DETERMINE A STATE OF ENABLEMENT OF A SYNCHRONIZATION CONTROL FOR THREADS OF EXECUTION Intel Corporation HUISMAN, DAVID J 2183 Final Rejection Jun 15, 2022
17829788 TECHNOLOGIES FOR NETWORK PACKET PROCESSING BETWEEN CLOUD AND TELECOMMUNICATIONS NETWORKS Intel Corporation MENSAH, PRINCE AKWASI 2474 Non-Final OA Jun 01, 2022
17742342 PROGRAMMABLE PACKET PROCESSING PIPELINE WITH OFFLOAD CIRCUITRY Intel Corporation CHU, WUTCHUNG 2418 Final Rejection May 11, 2022
17711878 LASER-INDUCED THERMAL STRESSING OF INTEGRATED CIRCUITS Intel Corporation LE, THANG XUAN 2858 Final Rejection Apr 01, 2022
17711917 INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC DELAY Intel Corporation CIESLEWICZ, ANETA B 2893 Final Rejection Apr 01, 2022
17711926 BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING Intel Corporation PATEL, DEVANG R 1735 Final Rejection Apr 01, 2022
17710658 CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES Intel Corporation MCDONALD, JASON ANDREW 2898 Non-Final OA Mar 31, 2022
17710670 DIE BACKSIDE FILM WITH OVERHANG FOR DIE SIDEWALL PROTECTION Intel Corporation HUTSON, NICHOLAS LELAND 2818 Final Rejection Mar 31, 2022
17708890 HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 Final Rejection Mar 30, 2022
17704658 EDGE COMPUTING OVER DISAGGREGATED RADIO ACCESS NETWORK FUNCTIONS Intel Corporation MILLS, DONALD L 2462 Non-Final OA Mar 25, 2022
17694302 DUAL FEED COLD SPRAY NOZZLE WITH INDEPENDENT SOLID POWDER TEMPERATURE CONTROL AND FEEDING RATE CONTROL Intel Corporation KURPLE, KARL 1717 Final Rejection Mar 14, 2022
17560915 INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK Intel Corporation ADHIKARI DAWADI, BIPANA 2898 Final Rejection Dec 23, 2021
17560927 SRAM WITH DIPOLE DOPANT THRESHOLD VOLTAGE MODULATION FOR GREATER READ STABILITY Intel Corporation CHEN, YU 2896 Final Rejection Dec 23, 2021
17560062 METAL INSULATOR METAL (MIM) CAPACITORS WITH PYROCHLORE-BASED INSULATORS FOR INTEGRATED CIRCUIT DIE & PACKAGES Intel Corporation STEVENSON, ANDRE C 2899 Final Rejection Dec 22, 2021
17558437 EMBEDDED MEMORY WITH FERROELECTRIC CAPACITORS & INDEPENDENT TOP PLATE LINES Intel Corporation WELLINGTON, ANDREA L 2800 Final Rejection Dec 21, 2021
17557290 ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE Intel Corporation LEE, DA WEI 2817 Final Rejection Dec 21, 2021
17553476 PREFETCHER WITH LOW-LEVEL SOFTWARE CONFIGURABILITY Intel Corporation RONES, CHARLES 2168 Non-Final OA Dec 16, 2021
17550796 FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD Intel Corporation TIVARUS, CRISTIAN ALEXANDRU 2899 Final Rejection Dec 14, 2021
17521760 INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS Intel Corporation BRADFORD, PETER 2897 Final Rejection Nov 08, 2021
17484200 MATRIX OPERATION WITH MULTIPLE TILES PER MATRIX DIMENSION Intel Corporation RIVERA, MARIA DE JESUS 2151 Final Rejection Sep 24, 2021
17485149 TRANSISTORS WITH REDUCED EPITAXIAL SOURCE/DRAIN SPAN VIA ETCH-BACK FOR IMPROVED CELL SCALING Intel Corporation MCCOY, THOMAS WILSON 2814 Final Rejection Sep 24, 2021
17485158 SINGLE-SIDED NANOSHEET TRANSISTORS Intel Corporation MCCOY, THOMAS WILSON 2814 Non-Final OA Sep 24, 2021
17308853 METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELECTRIC Intel Corporation OH, JIYOUNG 2818 Non-Final OA May 05, 2021
16490504 DIELECTRIC LINING LAYERS FOR SEMICONDUCTOR DEVICES Intel Corporation ISAAC, STANETTA D 2898 Final Rejection Aug 30, 2019

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