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Last updated: April 19, 2026

Akona Ip Pc - Intel

104 pending office actions • 2 clients

Portfolio Summary

104
Total Pending OAs
32
Final Rejections
72
Non-Final OAs

Client Portfolio (2 clients)

Client (Assignee)Pending OAs
Intel Corporation 102
Intel Corporation 2

Pending Office Actions

App #TitleClientExaminerArt UnitStatusFiled
18954764 NEURAL NETWORK ACCELERATOR WITH MEMORY HAVING BANK-SPECIFIC CLOCK DOMAIN CROSSING BUFFERS Intel Corporation TALUKDAR, ARVIND 2132 Non-Final OA Nov 21, 2024
18921274 ADAPTIVE QUALITY BOOSTING FOR LOW LATENCY VIDEO CODING Intel Corporation LOTFI, KYLE M 2425 Non-Final OA Oct 21, 2024
18906648 SCHEDULE-AWARE DYNAMICALLY RECONFIGURABLE ADDER TREE ARCHITECTURE FOR PARTIAL SUM ACCUMULATION IN MACHINE LEARNING ACCELERATORS Intel Corporation DOMAN, SHAWN 2183 Final Rejection Oct 04, 2024
18770496 REAL-TIME DYNAMIC NOISE REDUCTION USING CONVOLUTIONAL NETWORKS Intel Corporation LE, THUYKHANH 2655 Non-Final OA Jul 11, 2024
18761473 INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES Intel Corporation LOTTER, DAVID E 2845 Non-Final OA Jul 02, 2024
18740726 QUANTUM DOT BASED QUBIT DEVICES WITH ON-CHIP MICROCOIL ARRANGEMENTS Intel Corporation SCHOENHOLTZ, JOSEPH 2893 Non-Final OA Jun 12, 2024
18624198 CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT Intel Corporation STAHL, MICHAEL J 2874 Non-Final OA Apr 02, 2024
18613293 OPTICAL TRANSCEIVERS WITH MULTI-LASER MODULES Intel Corporation DOBSON, DANIEL G 2634 Non-Final OA Mar 22, 2024
18601774 PACKAGE STACKING USING CHIP TO WAFER BONDING Intel Corporation MUNOZ, ANDRES F 2818 Non-Final OA Mar 11, 2024
18396922 DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS Intel Corporation BOWEN, ADAM S 2897 Non-Final OA Dec 27, 2023
18527490 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS Intel Corporation VARNDELL, ROSS E 2674 Non-Final OA Dec 04, 2023
18260810 INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS Intel Corporation NGUYEN, DAO H 2818 Non-Final OA Jul 10, 2023
18333758 INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE Intel Corporation KOO, LAMONT B 2813 Non-Final OA Jun 13, 2023
18333711 INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN Intel Corporation HIBBERT, DANIEL JOHNATHAN 2899 Non-Final OA Jun 13, 2023
18325348 NEURAL NETWORK TRAINING AND INFERENCE WITH HIERARCHICAL ADJACENCY MATRIX Intel Corporation HOANG, HAU HAI 2154 Non-Final OA May 30, 2023
18314862 LOGIC CIRCUITS USING VERTICAL TRANSISTORS WITH BACKSIDE SOURCE OR DRAIN REGIONS Intel Corporation RAMALLO, GUSTAVO G 2812 Non-Final OA May 10, 2023
18304713 DETECTING AND MITIGATING FAULT IN SPARSITY COMPUTATION IN DEEP NEURAL NETWORK Intel Corporation YI, HYUNGJUN B 2146 Non-Final OA Apr 21, 2023
18135958 ACCELERATING NEURAL NETWORKS WITH LOW PRECISION-BASED MULTIPLICATION AND EXPLOITING SPARSITY IN HIGHER ORDER BITS Intel Corporation WERNER, MARSHALL L 2125 Non-Final OA Apr 18, 2023
18091548 GLASS SUBSTRATE FABRICATION USING HYBRID BONDING Intel Corporation WEGNER, AARON MICHAEL 2897 Non-Final OA Dec 30, 2022
18148533 PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS Intel Corporation JANG, BO BIN Non-Final OA Dec 30, 2022
18090879 MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES Intel Corporation DINKE, BITEW A 2812 Non-Final OA Dec 29, 2022
18147820 HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES Intel Corporation VU, VU A 2897 Non-Final OA Dec 29, 2022
18148358 END-TO-END NEUROMORPHIC ACOUSTIC PROCESSING Intel Corporation BECKER, TYLER JUSTIN 2657 Non-Final OA Dec 29, 2022
18147107 PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DEPROTECTION Intel Corporation NELSON, JACOB THEODORE 2815 Non-Final OA Dec 28, 2022
18089963 OPTICAL SEMICONDUCTOR PACKAGE AND METHOD Intel Corporation JORDAN, ANDREW 2874 Non-Final OA Dec 28, 2022
18090427 DETECTION OF NOISE SUPPRESSION PROCESSING CAPABILITY OF CONNECTED DEVICES Intel Corporation FAHNERT, FRIEDRICH 2692 Non-Final OA Dec 28, 2022
18089417 INTERCONNECT DEVICE AND METHOD Intel Corporation CHOUDHRY, MOHAMMAD M 2899 Non-Final OA Dec 27, 2022
18145038 PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOTORESIST Intel Corporation COSGROVE, JAYSON D 1737 Non-Final OA Dec 22, 2022
18068601 High Density Transistor and Routing Track Architecture Intel Corporation MEMULA, SURESH 2851 Non-Final OA Dec 20, 2022
18068732 PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST Intel Corporation ANGEBRANNDT, MARTIN J 1737 Non-Final OA Dec 20, 2022
18078051 EQUALIZING AND TRACKING SPEAKER VOICES IN SPATIAL CONFERENCING Intel Corporation KAZEMINEZHAD, FARZAD 2653 Non-Final OA Dec 08, 2022
18060080 INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES Intel Corporation RAMOS-DIAZ, FERNANDO JOSE 2814 Final Rejection Nov 30, 2022
18059089 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES Intel Corporation MOONEY, MICHAEL P 2874 Non-Final OA Nov 28, 2022
18058980 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES Intel Corporation BLEVINS, JERRY M 2874 Non-Final OA Nov 28, 2022
18056331 SYSTEM AND METHOD FOR STRUCTURING A TENSOR NETWORK Intel Corporation CHEN, KUANG FU 2143 Non-Final OA Nov 17, 2022
18055315 ACCELERATING DATA LOAD AND COMPUTATION IN FRONTEND CONVOLUTIONAL LAYER Intel Corporation SPANN, COURTNEY P 2183 Non-Final OA Nov 14, 2022
18054211 PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS Intel Corporation RODRIGUEZ VILLANU, SANDRA MILENA 2898 Non-Final OA Nov 10, 2022
17978290 METHOD AND SYSTEM OF VIDEO CODING WITH INLINE DOWNSCALING HARDWARE Intel Corporation HANSELL JR., RICHARD A 2486 Non-Final OA Nov 01, 2022
18050929 CALIBRATING CONFIDENCE OF CLASSIFICATION MODELS Intel Corporation BRAHMACHARI, MANDRITA 2144 Non-Final OA Oct 28, 2022
18047415 DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING QUANTIZED INFERENCE Intel Corporation SANKS, SCHYLER S 2129 Non-Final OA Oct 18, 2022
18046635 PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS Intel Corporation LOPEZ, JORGE ANDRES 2897 Non-Final OA Oct 14, 2022
18046256 HALO TRANSFER FOR CONVOLUTION WORKLOAD PARTITION Intel Corporation LEE, TSU-CHANG 2128 Non-Final OA Oct 13, 2022
17938784 PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS Intel Corporation RAMOS-DIAZ, FERNANDO JOSE 2814 Non-Final OA Oct 07, 2022
17957225 INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS Intel Corporation LEE, WOO KYUNG 2815 Non-Final OA Sep 30, 2022
17937248 HIGH DYNAMIC RANGE DIGITIZATION TECHNOLOGY FOR ANALOG COMPUTE-IN-MEMORY AND EDGE AI APPLICATIONS Intel Corporation YAARY, MICHAEL D 2151 Non-Final OA Sep 30, 2022
17957637 POROUS POLYMER DIELECTRIC LAYER ON CORE Intel Corporation ARORA, AJAY 2892 Non-Final OA Sep 30, 2022
17957094 GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INTEGRATED CIRCUITS Intel Corporation BEDTELYON, JOHN M 2874 Non-Final OA Sep 30, 2022
17957003 HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE Intel Corporation PARTHASARATHY, ROHIT 2899 Non-Final OA Sep 30, 2022
17953511 OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS Intel Corporation CHEN, YU 2896 Non-Final OA Sep 27, 2022
17935639 ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAPACITORS Intel Corporation KHALIFA, MOATAZ 2815 Non-Final OA Sep 27, 2022
17935647 INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM Intel Corporation HATFIELD, MARSHALL MU-NUO 2897 Final Rejection Sep 27, 2022
17935627 INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS Intel Corporation MCCOY, THOMAS WILSON 2814 Final Rejection Sep 27, 2022
17948586 THIN FILM CAPACITORS Intel Corporation DIAZ, JOSE R 2815 Non-Final OA Sep 20, 2022
17933589 HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY Intel Corporation PAGE, STEVEN MITCHELL CHR 2812 Final Rejection Sep 20, 2022
17933000 INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER Intel Corporation GHEYAS, SYED I 2893 Non-Final OA Sep 16, 2022
17946231 DEEP NEURAL NETWORK (DNN) ACCELERATORS WITH WEIGHT LAYOUT REARRANGEMENT Intel Corporation LE, UYEN T 2156 Non-Final OA Sep 16, 2022
17930825 FULL WAFER DEVICE WITH FRONT SIDE PASSIVE ELECTRONIC COMPONENTS Intel Corporation ARORA, AJAY 2892 Non-Final OA Sep 09, 2022
17930801 FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS Intel Corporation LEE, ALVIN LYNGHI 2813 Non-Final OA Sep 09, 2022
17930841 FULL WAFER DEVICE WITH BACK SIDE INTERCONNECTS AND WAFER-SCALE INTEGRATION Intel Corporation ARMAND, MARC ANTHONY 2813 Non-Final OA Sep 09, 2022
17929749 NEURAL NETWORK FACILITATING FIXED-POINT EMULATION OF FLOATING-POINT COMPUTATION Intel Corporation BUI, KENNY KIM 2182 Non-Final OA Sep 05, 2022
17929471 MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE Intel Corporation HANUMASAGAR, SHAMITA S 2814 Final Rejection Sep 02, 2022
17823602 THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES Intel Corporation LIU, BENJAMIN T 2893 Non-Final OA Aug 31, 2022
17899670 FULL WAFER DEVICE WITH MULTIPLE DIRECTIONAL INDICATORS Intel Corporation ARMAND, MARC ANTHONY 2813 Non-Final OA Aug 31, 2022
17820900 DEEP NEURAL NETWORK (DNN) ACCELERATORS WITH HETEROGENEOUS TILING Intel Corporation STORK, KYLE R 2128 Final Rejection Aug 19, 2022
17820982 MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY CIRCUITS WITH QUASI-MONOLITHIC CHIP LAYERS Intel Corporation SMITH, SAMUEL JONATHAN 2817 Non-Final OA Aug 19, 2022
17856185 ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES Intel Corporation LIU, BENJAMIN T 2893 Non-Final OA Jul 01, 2022
17854728 MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THROUGH DIELECTRIC VIA Intel Corporation VU, HUNG K 2897 Non-Final OA Jun 30, 2022
17851957 INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER Intel Corporation AYCHILLHUM, ANDARGIE M 2847 Final Rejection Jun 28, 2022
17847257 PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS Intel Corporation ULLAH, ELIAS 2893 Non-Final OA Jun 23, 2022
17846153 PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES Intel Corporation VU, HUNG K 2897 Non-Final OA Jun 22, 2022
17846129 PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES Intel Corporation GREEN, TELLY D 2898 Non-Final OA Jun 22, 2022
17842093 CHIP-FIRST LAYERED PACKAGING ARCHITECTURE Intel Corporation TRAN, THANH Y 2817 Non-Final OA Jun 16, 2022
17825558 SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD Intel Corporation CRUM, GAGE STEPHEN 2841 Final Rejection May 26, 2022
17730011 BINARY-WEIGHTED CAPACITOR CHARGE-SHARING FOR MULTIPLICATION Intel Corporation RIVERA, MARIA DE JESUS 2151 Final Rejection Apr 26, 2022
17728147 PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING Intel Corporation GOODWIN, DAVID J 2817 Final Rejection Apr 25, 2022
17709796 DYNAMIC COMPENSATION OF ANALOG CIRCUITRY IMPAIRMENTS IN NEURAL NETWORKS Intel Corporation LEWIS, MATTHEW LEE 2144 Final Rejection Mar 31, 2022
17707157 GLASS BRIDGE FOR CONNECTING DIES Intel Corporation YAP, DOUGLAS ANTHONY 2899 Final Rejection Mar 29, 2022
17705878 PACKAGE LAYERS FOR STRESS MONITORING AND METHOD Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 Final Rejection Mar 28, 2022
17699209 MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS Intel Corporation DUREN, TIMOTHY EDWARD 2817 Final Rejection Mar 21, 2022
17698365 MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 Final Rejection Mar 18, 2022
17698430 MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 Non-Final OA Mar 18, 2022
17698322 MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS Intel Corporation SEHAR, FAKEHA 2893 Non-Final OA Mar 18, 2022
17690358 TRANSISTOR ARRANGEMENTS WITH REDUCED DIMENSIONS AT THE GATE Intel Corporation AHMED, SHAHED 2813 Final Rejection Mar 09, 2022
17677909 VERTICAL TUNNELING FIELD-EFFECT TRANSISTOR Intel Corporation BOATMAN, CASEY PAUL 2893 Final Rejection Feb 22, 2022
17666616 PROVIDING FILL PATTERNS FOR INTEGRATED CIRCUIT DEVICES Intel Corporation KIM, JAHAE 2897 Final Rejection Feb 08, 2022
17583485 PACKAGING ARCHITECTURE WITH EDGE RING ANCHORING Intel Corporation TRAN, TRANG Q 2811 Non-Final OA Jan 25, 2022
17561637 SUBSTRATE WARPAGE REDUCTION TECHNIQUES WITH LAMINATE GLASS CLOTH WEAVE Intel Corporation TATESURE, VINCENT 1786 Final Rejection Dec 23, 2021
17557128 INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS Intel Corporation FAYETTE, NATHALIE RENEE 2812 Final Rejection Dec 21, 2021
17557134 TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY Intel Corporation YAP, DOUGLAS ANTHONY 2899 Final Rejection Dec 21, 2021
17555401 MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER Intel Corporation IQBAL, HAMNA FATHIMA 2817 Non-Final OA Dec 18, 2021
17554004 INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS Intel Corporation OH, JIYOUNG 2818 Final Rejection Dec 17, 2021
17552845 PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTPUT INTERFACES Intel Corporation STEPHENSON, KENNETH STEPHEN 2898 Final Rejection Dec 16, 2021
17552581 MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 Non-Final OA Dec 16, 2021
17549427 LIQUID METAL CONNECTION DEVICE AND METHOD Intel Corporation YAP, DOUGLAS ANTHONY 2899 Non-Final OA Dec 13, 2021
17643652 PEAK SELF-NORMALIZATION GAIN CONTROL BASED ON HOPF RESONATORS CASCADE SIGNAL SPECTRAL DECOMPOSITION Intel Corporation VILLANUEVA, MARKUS ANTHONY 2151 Final Rejection Dec 10, 2021
17517152 NO-REMELT SOLDER ENFORCEMENT JOINT Intel Corporation MCCOY, THOMAS WILSON 2814 Final Rejection Nov 02, 2021
17482681 MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES Intel Corporation TIVARUS, CRISTIAN ALEXANDRU 2899 Final Rejection Sep 23, 2021
17477323 GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE Intel Corporation BRASFIELD, QUINTON A 2814 Final Rejection Sep 16, 2021
17473414 PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE Intel Corporation NGUYEN, DUY T V 2818 Final Rejection Sep 13, 2021
17470588 GLASS INTERPOSER OPTICAL MODULATOR DEVICE AND METHOD Intel Corporation RADKOWSKI, PETER 2874 Non-Final OA Sep 09, 2021
17397141 MULTI-LAYERED HYBRID INTEGRATED CIRCUIT ASSEMBLY Intel Corporation BEDTELYON, JOHN M 2874 Non-Final OA Aug 09, 2021
17358073 STACKED TWO-LEVEL BACKEND MEMORY Intel Corporation LIN, JOHN 2815 Final Rejection Jun 25, 2021
17354773 QUASI-MONOLITHIC HIERARCHICAL INTEGRATION ARCHITECTURE Intel Corporation CHOUDHRY, MOHAMMAD M 2899 Final Rejection Jun 22, 2021
17256121 Fast Convolution over Sparse and Quantization Neural Network Intel Corporation NGUYEN, CHAU T 2145 Final Rejection Dec 24, 2020

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