Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
117 pending office actions • 21 clients • 102 examiners • 38 art units • 0 of 117 (0%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 17 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 17 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 2 (2%) |
| §101 + other | 7 (6%) |
| §103 only | 32 (27%) |
| §102 only | 9 (8%) |
| §112 only | 3 (3%) |
| Double-patenting only | 3 (3%) |
| Double-patenting + other | 3 (3%) |
| Multi-statute (no §101) | 57 (49%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BELOUSOV, ALEXANDER | 5 | 76.6% | +16.3% |
| PARKER, JOHN M | 5 | 92.1% | +0.9% |
| TAN, DAVE | 3 | 81.3% | -8.3% |
| KLEIN, JORDAN M | 2 | 85.5% | +8.0% |
| HO, TU TU V | 2 | 93.6% | +5.2% |
| CRAWFORD EASON, LATANYA N | 2 | 78.4% | +0.4% |
| TAVLYKAEV, ROBERT FUATOVICH | 2 | 60.6% | +12.5% |
| CHEN, JACK S J | 2 | 76.7% | +5.6% |
| STEPHENSON, DANIEL P | 1 | 86.5% | -25.6% |
| ALAM, NAEEM TASLIM | 1 | 83.8% | +10.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | TAN, DAVE | 11d overdue |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | PARKER, JOHN M | 3d overdue |
| 18781081 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | KLEIN, JORDAN M | — |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | PARKER, JOHN M | — |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | PARKER, JOHN M | — |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | TAN, DAVE | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17210938 | INVERTER WITH A HOUSING HAVING A COOLING UNIT | RALIS, STEPHEN J | 175d overdue |
| 19027128 | SYSTEM AND METHOD FOR HANDLING DIGITAL CONTENT GOVERNANCE IN AN ORGANIZATION | LE, UYEN T | 30d overdue |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | SON, ERIKA HEERA | 18d overdue |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | RODRIGUEZ VILLANU, SANDRA MILENA | 8d |
| 18753075 | CROSS-ENTERPRISE DOCUMENT SHARING (XDS) METADATA MORPHING | HAMILTON, MATTHEW L | 16d |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | CHEN, DAVID Z | 28d |
| 17992994 | PREDICTING RECURRENCE IN EARLY STAGE NON-SMALL CELL LUNG CANCER (NSCLC) WITH INTEGRATED RADIOMIC AND PATHOMIC FEATURES | NASSER, ROBERT L | 30d |
| 18919483 | APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING | LOGIE, MICHAEL J | 34d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18500423 | OPTICAL COUPLING DEVICE WITH DUST TRAP | TAVLYKAEV, ROBERT FUATOVICH | 29d |
| 19303520 | AUTOMATIC POOL CLEANING DEVICE AND ITS CONTROLLING METHOD | ALAM, NAEEM TASLIM | — |
| 18783538 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | BELOUSOV, ALEXANDER | — |
| 18778985 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | BELOUSOV, ALEXANDER | — |
| 18771095 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | BELOUSOV, ALEXANDER | — |
| 18603729 | VIA STRUCTURE FOR MULTI-STACKED CHIPS | BELOUSOV, ALEXANDER | — |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | BELOUSOV, ALEXANDER | — |
| 18302972 | OPTICAL DIGITAL-TO-ANALOG CONVERTER | TAVLYKAEV, ROBERT FUATOVICH | — |
| Art Unit | Apps |
|---|---|
| 2893 | 8 |
| 2897 | 7 |
| 2874 | 5 |
| 2818 | 5 |
| 2899 | 5 |
| 2896 | 3 |
| 2898 | 3 |
| 2813 | 3 |
| 2812 | 3 |
| 2815 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19365409 | INJECTOR HEAD GRIPPERS FOR CABLE IN OIL-WELL APPLICATIONS AND METHOD | Alkhorayef Petroleum Company | STEPHENSON, DANIEL P | 3676 | §102§103 | Non-Final OA | — | Pending | Oct 22, 2025 |
| 19303520 | AUTOMATIC POOL CLEANING DEVICE AND ITS CONTROLLING METHOD | Aiper Global Pte. Ltd. | ALAM, NAEEM TASLIM | 3668 | §102§103 | Non-Final OA | — | Pending | Aug 19, 2025 |
| 19243052 | LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING | Taiwan Semiconductor Manufacturing Company, Ltd. | MANHEIM, MARC ETIENNE | 2874 | §103§112 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19243074 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19209878 | ELECTRONIC DEVICE AND METHOD FOR RESTORING A STATE OF AN INTEGRATED CIRCUIT | Infineon Technologies AG | JACKSON, JAYLUN ARMAN | §103 | Non-Final OA | — | Pending | May 16, 2025 | |
| 19093485 | DOOR PROTECTION DEVICE | Waspw, LLC | MENEZES, MARCUS | 3634 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2025 |
| 19089118 | PROTECTION OF AI MODELS | Infineon Technologies AG | SRIRAM, ADITYA | §101§103§112 | Non-Final OA | — | Pending | Mar 25, 2025 | |
| 19073656 | POWER/AREA EFFICIENT ACCELERATION OF PROCESSOR-BASED ARTIFICIAL NEURAL NETWORK COMPUTATION | Infineon Technologies AG | SADLER, NATHAN | 2139 | §103DP | Final Rejection | — | Pending | Mar 07, 2025 |
| 19063918 | LOW-TEMPERATURE VAPORIZER FOR ION IMPLANTER WITH IN-VACUUM CONTROLLED FLOW | Axcelis Technologies, Inc. | CHEN, KEATH T | 1716 | §103 | Final Rejection | 132d overdue | Pending | Feb 26, 2025 |
| 19058173 | RESOLVING A HARDWARE FAULT OCCURRENCE IN A MULTI-DOMAIN DEVICE | Infineon Technologies AG | RUSIN, KAYO LISA | 2114 | §102§103 | Non-Final OA | — | Pending | Feb 20, 2025 |
| 19099902 | STORAGE STABLE MICROBIAL COMPOSITION | Lanbiotic GmbH | ROBINSON, HOPE A | §112 | Non-Final OA | — | Pending | Jan 30, 2025 | |
| 19027128 | SYSTEM AND METHOD FOR HANDLING DIGITAL CONTENT GOVERNANCE IN AN ORGANIZATION | Hyland UK Operations Limited | LE, UYEN T | 2156 | §101§103§112 | Final Rejection | 30d overdue | Pending | Jan 17, 2025 |
| 19028479 | PERMISSIONS-CONSTRAINED DYNAMIC FACETING OF SEARCH RESULTS IN A CONTENT MANAGEMENT SYSTEM | Hyland UK Operations Limited | WILLOUGHBY, ALICIA M | 2156 | §103Other | Non-Final OA | 33d | Pending | Jan 17, 2025 |
| 19013406 | BRIDGE CIRCUIT AND ENERGY CONVERSION SYSTEM | Sma Solar Technology AG | LEE, JYE-JUNE | §103 | Non-Final OA | — | Pending | Jan 08, 2025 | |
| 18981800 | MEMORY CELL WITH UNIPOLAR SELECTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | LAPPAS, JASON | §103 | Non-Final OA | — | Pending | Dec 16, 2024 | |
| 18980276 | WAFER ALIGNMENT, CLEANLINESS, AND SURFACE QUALITY VERIFICATION USING LASER LIGHT SCATTERING | Axcelis Technologies, Inc. | STOCK JR, GORDON J | 2877 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2024 |
| 18950296 | APPLICATION OF SECURITY PARAMETERS FOR CONTENT | Hyland UK Operations Limited | CHOY, KA SHAN | 2435 | §103 | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18935391 | MULTI-CHANNEL CONTROL SYSTEM FOR CONTROLLING PLURALITY OF SMART WINDOWS | Gooil Solution Co., Ltd. | WILSON, PAISLEY L | §102§112 | Non-Final OA | — | Pending | Nov 01, 2024 | |
| 18919483 | APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING | Axcelis Technologies, Inc. | LOGIE, MICHAEL J | 2881 | §103§112 | Final Rejection | 34d | Pending | Oct 18, 2024 |
| 18918276 | DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM | Axcelis Technologies, Inc. | MENDOZA, ALEXANDRIA ARELLANO | 2877 | §102§103§112 | Non-Final OA | 42d | Pending | Oct 17, 2024 |
| 18901408 | MEDICAL ANALYSIS USING SPATIOTEMPORAL ANALYSIS AND TRANSFORMER-BASED MODELS | Emory University | HUYNH, VAN D | §102§103 | Non-Final OA | — | Pending | Sep 30, 2024 | |
| 18892747 | MOBILE DEVICE, METHOD FOR ASSIGNING A SECURITY LEVEL OF A MOBILE DEVICE, AND METHOD FOR DETERMINING A POSITION | Infineon Technologies AG | GADALLA, HANY S | 2493 | §103 | Final Rejection | — | Pending | Sep 23, 2024 |
| 18809559 | MULTI-ROW MAGNETIC RESONANCE IMAGING (MRI) RADIO FREQUENCY (RF) COIL WITH A DECOUPLING RING | Quality Electrodynamics, LLC | PATEL, RISHI R | 2896 | §102§103§112 | Non-Final OA | — | Pending | Aug 20, 2024 |
| 18783538 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18784638 | NOVEL MIM STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | PAGE, STEVEN MITCHELL CHR | §102 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18783997 | STOPPER BUMP STRUCTURES FOR MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783824 | BOND PAD WITH ENHANCED RELIABILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | DIALLO, MAMADOU L | §102 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18783529 | BARRIER STRUCTURE CONFIGURED TO INCREASE PERFORMANCE OF III-V DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | JUNG, MICHAEL YOO LIM | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 | |
| 18782061 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | WALL, VINCENT | Other | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18782345 | TECHNIQUES FOR MRAM MTJ TOP ELECTRODE TO VIA INTERFACE | Taiwan Semiconductor Manufacturing Company, Ltd. | HOSSAIN, MOAZZAM | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18782439 | HIGH ASPECT RATIO BOSCH DEEP ETCH | Taiwan Semiconductor Manufacturing Company, Ltd. | CHAMBLISS, ALONZO | §102DP | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18781081 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | KLEIN, JORDAN M | DP | Non-Final OA | — | Pending | Jul 23, 2024 | |
| 18780581 | INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779305 | DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, ERIC A | §102§103§112Other | Non-Final OA | — | Pending | Jul 22, 2024 | |
| 18779844 | DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS | Taiwan Semiconductor Manufacturing Company, Ltd. | SARKER-NAG, AKHEE | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 | |
| 18779252 | STILTED PAD STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | VU, DAVID | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779221 | METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, ALVIN LYNGHI | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778989 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778990 | SPACER SCHEME AND METHOD FOR MRAM | Taiwan Semiconductor Manufacturing Company, Ltd. | HO, TU TU V | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 | |
| 18778985 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | §103 | Non-Final OA | — | Pending | Jul 21, 2024 | |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | GEBREMARIAM, SAMUEL A | §112 | Non-Final OA | — | Pending | Jul 18, 2024 | |
| 18776346 | SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFERENT THICKNESSES | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAWFORD EASON, LATANYA N | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 | |
| 18775100 | WAFER LEVEL IMAGE SENSOR PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | CROSS, XIA L | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 | |
| 18775130 | INTEGRATED CHIP WITH INTER-WIRE CAVITIES | Taiwan Semiconductor Manufacturing Company, Ltd. | CLINTON, EVAN GARRETT | §102 | Non-Final OA | — | Pending | Jul 17, 2024 | |
| 18775749 | CLEANING CHAMBER FOR METAL OXIDE REMOVAL | Taiwan Semiconductor Manufacturing Company, Ltd. | REYES, JOSHUA NATHANIEL PI | §103 | Non-Final OA | — | Pending | Jul 17, 2024 | |
| 18772364 | CAPPING LAYER OVER FET FERAM TO INCREASE CHARGE MOBILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | DIAZ, JOSE R | §102DP | Non-Final OA | — | Pending | Jul 15, 2024 | |
| 18771095 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | DP | Non-Final OA | — | Pending | Jul 12, 2024 | |
| 18760292 | CRACK STOP RING TRENCH TO PREVENT EPITAXY CRACK PROPAGATION | Taiwan Semiconductor Manufacturing Company, Ltd. | LE, THAO P | 2818 | DP | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18757663 | PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MORE VAPOR CHAMBERS OVER IC CHIPS | Taiwan Semiconductor Manufacturing Company, Ltd. | HO, TU TU V | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 | |
| 18757630 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS | Taiwan Semiconductor Manufacturing Company, Ltd. | QUINTO, KEVIN V | §102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 | |
| 18753075 | CROSS-ENTERPRISE DOCUMENT SHARING (XDS) METADATA MORPHING | Hyland Software, Inc. | HAMILTON, MATTHEW L | 3682 | §101 | Final Rejection | 16d | Pending | Jun 25, 2024 |
| 18749921 | IMAGE SENSING STRUCTURE AND MANUFACTURING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | SEDOROOK, DAVID PAUL | §102§103 | Non-Final OA | — | Pending | Jun 21, 2024 | |
| 18731465 | DEVICE WITH EPITAXIAL SOURCE/DRAIN REGION | Taiwan Semiconductor Manufacturing Company, Ltd. | WINTERS, SEAN AYERS | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | May 31, 2024 |
| 18676841 | PIXEL ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | KLEIN, JORDAN M | §102§103 | Non-Final OA | — | Pending | May 29, 2024 | |
| 18673792 | SEMICONDUCTOR ISOLATION STRUCTURE FOR INJECTION SUPPRESSION AND METHOD OF MAKING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | RAMIREZ, ALEXANDRE XAVIER | §102§103 | Non-Final OA | — | Pending | May 24, 2024 | |
| 18668631 | CO-PACKAGED OPTICAL FIBER MOUNTING UNIT AND METHOD OF FABRICATION | Taiwan Semiconductor Manufacturing Company, Ltd. | PAK, SUNG H | 2874 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18665716 | SUBMERSIBLE PUMP GAUGE WITH DOWNHOLE ANALYSIS CAPABILITY | Grc Technologies LLC | HARCOURT, BRAD | 3674 | §103 | Final Rejection | 49d | Pending | May 16, 2024 |
| 18659143 | AMPLIFIER CIRCUITS | Infineon Technologies AG | MARANO, NATASHA YOLANDA | §103 | Non-Final OA | — | Pending | May 09, 2024 | |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BODNAR, JOHN A | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18651752 | RISK PREDICTION OF HEART FAILURE | UNIVERSITY HOSPITALS CLEVELAND MEDICAL CENTER | GEBRESLASSIE, WINTA | 2677 | §103 | Final Rejection | — | Pending | May 01, 2024 |
| 18650240 | DOPPLER DIVISION MULTIPLEXING | Infineon Technologies AG | GO, RICKY | §102 | Non-Final OA | — | Pending | Apr 30, 2024 | |
| 18648884 | BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 | |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644209 | CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | GEYER, SCOTT B | §102 | Non-Final OA | — | Pending | Apr 24, 2024 | |
| 18635478 | TAPERED LIGHT ABSORPTION STRUCTURE FOR INTEGRATED CIRCUIT PHOTODETECTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SMITH, CHAD | 2874 | §102 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635103 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | WEILAND, ADAM DAVID | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 | |
| 18630307 | SEMICONDUCTOR WAVEGUIDE HEATER WITH HEATER CONTACTS | Taiwan Semiconductor Manufacturing Company, Ltd. | BLEVINS, JERRY M | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18629044 | SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, KHIEM D | §103 | Non-Final OA | — | Pending | Apr 08, 2024 | |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | DINKE, BITEW A | §103 | Final Rejection | — | Pending | Mar 27, 2024 | |
| 18603729 | VIA STRUCTURE FOR MULTI-STACKED CHIPS | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597086 | CONSOLIDATION OF INTERRUPT LOST EVENTS IN MULTI-LEVEL INTERRUPT SYSTEM | Infineon Technologies AG | MAMO, ELIAS | §101§102 | Non-Final OA | — | Pending | Mar 06, 2024 | |
| 18591047 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | BOOTH, RICHARD A | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591282 | IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Feb 28, 2024 |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582781 | PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18442381 | HIGH VOLTAGE DEVICE WITH BOOSTED BREAKDOWN VOLTAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | GUPTA, RAJ R | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18438538 | DUAL DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | WEGNER, AARON MICHAEL | 2897 | §102§103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18433509 | TRAPPING FILM FOR DEEP TRENCH ISOLATION STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18432197 | INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | SANDVIK, BENJAMIN P | 2812 | §103 | Final Rejection | — | Pending | Jan 26, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18406678 | COMPUTING SYSTEM FOR CONFIGURABLE OFF-CHAIN STORAGE FOR BLOCKCHAINS | Hyland Software, Inc. | NILFOROUSH, MOHAMMAD A | 3697 | §101§112 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | Taiwan Semiconductor Manufacturing Company, Ltd. | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18396810 | METHOD FOR THE STARTING OF AN ELECTROLYSIS SYSTEM, AND ELECTROLYSIS SYSTEM FOR CARRYING OUT THE METHOD | Sunfire SE | WONG, EDNA | §103§112 | Non-Final OA | — | Pending | Dec 27, 2023 | |
| 18545231 | PREDICTING NEO-ADJUVANT CHEMOTHERAPY RESPONSE FROM PRE-TREATMENT BREAST MAGNETIC RESONANCE IMAGING USING ARTIFICIAL INTELLIGENCE AND HER2 STATUS | Case Western Reserve University | LIU, GUOZHEN | 1686 | §101§103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18500423 | OPTICAL COUPLING DEVICE WITH DUST TRAP | Raylase GmbH | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Final Rejection | 29d | Pending | Nov 02, 2023 |
| 18487169 | PROCESSING RADAR SIGNALS | Infineon Technologies AG | ZHU, NOAH YI MIN | 3648 | §103§112 | Non-Final OA | — | Pending | Oct 16, 2023 |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | §103 | Final Rejection | 11d overdue | Pending | Sep 22, 2023 |
| 18460208 | CONTACT RESISTANCE MEASUREMENT METHOD | Infineon Technologies AG | MARINI, MATTHEW G | 2853 | §103 | Final Rejection | 7d | Pending | Sep 01, 2023 |
| 18366776 | REDUCED CROSS-TALK IN COLOR AND INFRARED IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | — | Pending | Aug 04, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | 28d | Pending | Aug 01, 2023 |
| 18262948 | DEVICE FOR MAGNETIC FIELD THERAPY | Niki Reiner Gleim | TRAN, LARA LINH | 3791 | §103 | Final Rejection | — | Pending | Jul 26, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18261289 | AIR-FLOW APPARATUS | Sandrier GmbH | LAU, JASON | 3762 | §103 | Final Rejection | 23d overdue | Pending | Jul 13, 2023 |
| 18346506 | HIGH EFFICIENCY OPTICAL COUPLER | Taiwan Semiconductor Manufacturing Company, Ltd. | PETKOVSEK, DANIEL | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18323553 | COMBINATION OF RADIOMIC AND PATHOMIC FEATURES IN THE PREDICTION OF PROGNOSES FOR TUMORS | Case Western Reserve University | BURKE, TIONNA M | 2178 | §101§102§103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18321268 | PIEZOELECTRIC DEVICE HAVING PIEZOELECTRIC STRUCTURE DISPOSED BETWEEN PATTERNED CONDUCTIVE STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, DONGHAI D | 2837 | §102§103 | Non-Final OA | — | Pending | May 22, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | May 22, 2023 |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 12, 2023 |
| 18302972 | OPTICAL DIGITAL-TO-ANALOG CONVERTER | Taiwan Semiconductor Manufacturing Company, Ltd. | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18300513 | METAL ISOLATION TESTING IN THE CONTEXT OF MEMORY CELLS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARIHAR, SUCHIN | 2851 | §112 | Non-Final OA | — | Pending | Apr 14, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Taiwan Semiconductor Manufacturing Company, Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103§112 | Final Rejection | 8d | Pending | Feb 16, 2023 |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | §103 | Final Rejection | — | Pending | Jan 06, 2023 |
| 17992994 | PREDICTING RECURRENCE IN EARLY STAGE NON-SMALL CELL LUNG CANCER (NSCLC) WITH INTEGRATED RADIOMIC AND PATHOMIC FEATURES | Case Western Reserve University | NASSER, ROBERT L | 3992 | §101 | Final Rejection | 30d | Pending | Nov 23, 2022 |
| 17982587 | MRAM DEVICE HAVING SELF-ALIGNED SHUNTING LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 08, 2022 |
| 17918920 | CUT-IN-SAFE ADAPTIVE CRUISE CONTROL SYSTEM FOR VEHICLES | Technische Universitaet Muenchen | MCCULLERS, AARON KYLE | 3663 | §103 | Final Rejection | — | Pending | Oct 14, 2022 |
| 17872351 | SYSTEMS, METHODS, AND DEVICES FOR A DYNAMICALLY MANAGEABLE QR DRIVEN INFORMATION PLATFORM | Godocent Inc. | OSMAN BILAL AHMED, AFAF | 3622 | §101§112 | Final Rejection | — | Pending | Jul 25, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | Taiwan Semiconductor Manufacturing Company, Ltd. | SON, ERIKA HEERA | 2893 | §103§112 | Non-Final OA | 18d overdue | Pending | May 23, 2022 |
| 17570710 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | — | Pending | Jan 07, 2022 |
| 17210938 | INVERTER WITH A HOUSING HAVING A COOLING UNIT | Sma Solar Technology AG | RALIS, STEPHEN J | 3992 | §103§112 | Final Rejection | 175d overdue | Pending | Mar 24, 2021 |
| 16525978 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | LIN, JOHN | 2815 | §103§112 | Non-Final OA | — | Pending | Jul 30, 2019 |
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