91 pending office actions • 3 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 88 |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 2 |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 1 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 19227765 | SPACER FILM SCHEME FORM POLARIZATION IMPROVEMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | SASINOWSKI, ANDREW | 2625 | Non-Final OA | Jun 04, 2025 |
| 18785636 | MEMORY DEVICE WITH CONTENT ADDRESSABLE MEMORY UNITS | Taiwan Semiconductor Manufacturing Company, Ltd. | YANG, HAN | 2824 | Non-Final OA | Jul 26, 2024 |
| 18783610 | DATA BACKUP UNIT FOR STATIC RANDOM-ACCESS MEMORY DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BEGUM, SULTANA | 2824 | Non-Final OA | Jul 25, 2024 |
| 18782475 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | PHAM, THOMAS T | 1713 | Final Rejection | Jul 24, 2024 |
| 18780873 | TOP NOTCH SLIT PROFILE FOR MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | JOSHI, SUNITA | 2691 | Non-Final OA | Jul 23, 2024 |
| 18780815 | GAS DISTRIBUTION RING FOR PROCESS CHAMBER | Taiwan Semiconductor Manufacturing Company, Ltd. | TOLIN, MICHAEL A | 1745 | Non-Final OA | Jul 23, 2024 |
| 18777692 | ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM | Taiwan Semiconductor Manufacturing Company, Ltd. | GOLIGHTLY, ERIC WAYNE | 1714 | Non-Final OA | Jul 19, 2024 |
| 18768150 | SEMICONDUCTOR MEMS STRUCTURE AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | JOHNSON, RASHAD H | 2834 | Non-Final OA | Jul 10, 2024 |
| 18675225 | BARRIER LAYER ON A PIEZOELECTRIC-DEVICE PAD | Taiwan Semiconductor Manufacturing Company, Ltd. | HUBER, PAUL W | 2691 | Non-Final OA | May 28, 2024 |
| 18659470 | DYNAMIC LIQUID COOLING FOR INTEGRATED DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | DECKER, JAMIL ALEXANDER | 2835 | Non-Final OA | May 09, 2024 |
| 18655397 | GATE STRUCTURE IN HIGH-K METAL GATE TECHNOLOGY | Taiwan Semiconductor Manufacturing Company, Ltd. | PHAM, HOAI V | 2892 | Final Rejection | May 06, 2024 |
| 18642889 | COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | HOSSAIN, MOAZZAM | 2898 | Non-Final OA | Apr 23, 2024 |
| 18636372 | INTEGRATED CIRCUIT INTER-DIE COMMUNICATION USING OPTICAL TRANSMISSION STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | PENG, CHARLIE YU | 2874 | Non-Final OA | Apr 16, 2024 |
| 18635478 | TAPERED LIGHT ABSORPTION STRUCTURE FOR INTEGRATED CIRCUIT PHOTODETECTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SMITH, CHAD | 2874 | Non-Final OA | Apr 15, 2024 |
| 18630160 | ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | MOORE, DEVON TYLEN | 3763 | Non-Final OA | Apr 09, 2024 |
| 18617730 | DUAL SUBSTRATE SIDE ESD DIODE FOR HIGH SPEED CIRCUIT | Taiwan Semiconductor Manufacturing Company, Ltd. | ZHU, SHENG-BAI | 2897 | Final Rejection | Mar 27, 2024 |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | Taiwan Semiconductor Manufacturing Company, Ltd. | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Mar 14, 2024 |
| 18597981 | TWO-DIMENSIONAL (2D) MATERIAL FOR OXIDE SEMICONDUCTOR (OS) FERROELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | WALL, VINCENT | 2898 | Final Rejection | Mar 07, 2024 |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | Non-Final OA | Feb 28, 2024 |
| 18425202 | VERTICAL GATE-ALL-AROUND (GAA) MEMORY CELL AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | ALAM, MOHAMMED R | 2897 | Non-Final OA | Jan 29, 2024 |
| 18425224 | INTEGRATED CIRCUIT DEVICE INCLUDING A BOND-BASED CAPACITOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SEDOROOK, DAVID PAUL | 2812 | Non-Final OA | Jan 29, 2024 |
| 18425333 | OXYGEN AFFINITY LAYER TO IMPROVE RRAM CELL PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | AHMED, SHAHED | 2813 | Non-Final OA | Jan 29, 2024 |
| 18422245 | METHOD FOR FORMING A MFMIS MEMORY DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | WARREN, MATTHEW E | 2817 | Non-Final OA | Jan 25, 2024 |
| 18419915 | INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CHAMBLISS, ALONZO | 2897 | Non-Final OA | Jan 23, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | TUTTLE, ETHAN ALEXANDER | 2897 | Non-Final OA | Jan 09, 2024 |
| 18401749 | METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TAN N | 2812 | Non-Final OA | Jan 02, 2024 |
| 18401746 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | CHIU, TSZ K | 2898 | Non-Final OA | Jan 02, 2024 |
| 18401747 | MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Jan 02, 2024 |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | Taiwan Semiconductor Manufacturing Company, Ltd. | REAMES, MATTHEW L | 2896 | Non-Final OA | Jan 02, 2024 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | Taiwan Semiconductor Manufacturing Company, Ltd. | CHANG, JAY C | 2817 | Non-Final OA | Dec 29, 2023 |
| 18397217 | INTEGRATED CIRCUIT DEVICE USING OXIDE SEMICONDUCTOR WITH OXYGEN VACANCY STABILIZING MATERIAL | Taiwan Semiconductor Manufacturing Company, Ltd. | SEVEN, EVREN | 2812 | Non-Final OA | Dec 27, 2023 |
| 18511016 | THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | Non-Final OA | Nov 16, 2023 |
| 18490893 | INSERTION LAYER BETWEEN CHANNEL AND PASSIVATION FOR TRANSISTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | RODELA, EDUARDO A | 2893 | Non-Final OA | Oct 20, 2023 |
| 18480551 | IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | SLUTSKER, JULIA | 2891 | Non-Final OA | Oct 04, 2023 |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | Non-Final OA | Sep 22, 2023 |
| 18459565 | INTEGRATED CIRCUIT CONDUCTIVE STRUCTURE FOR CIRCUIT PROBE TESTING | Taiwan Semiconductor Manufacturing Company, Ltd. | ANDERSON, ERIK ARTHUR | 2812 | Non-Final OA | Sep 01, 2023 |
| 18454107 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SANDVIK, BENJAMIN P | 2812 | Non-Final OA | Aug 23, 2023 |
| 18366845 | METHODS FOR FORMING IMAGE SENSORS | Taiwan Semiconductor Manufacturing Company, Ltd. | LI, MEIYA | 2811 | Non-Final OA | Aug 08, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, DAVID Z | 2815 | Non-Final OA | Aug 01, 2023 |
| 18362101 | CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS | Taiwan Semiconductor Manufacturing Company, Ltd. | RAHIM, NILUFA | 2893 | Non-Final OA | Jul 31, 2023 |
| 18360214 | METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | Non-Final OA | Jul 27, 2023 |
| 18358199 | OPTICAL ROUTING STRUCTURE ON BACKSIDE OF SUBSTRATE FOR PHOTONIC DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | BEDTELYON, JOHN M | 2874 | Non-Final OA | Jul 25, 2023 |
| 18357264 | IN-SITU THERMAL ANNEALING OF ELECTRODE TO FORM SEED LAYER FOR IMPROVING FERAM PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | MARUF, SHEIKH | 2897 | Non-Final OA | Jul 24, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | Non-Final OA | Jul 24, 2023 |
| 18354217 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR NARROWED BY EPITAXY GROWTH | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | Non-Final OA | Jul 18, 2023 |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 18, 2023 |
| 18351784 | QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, DAVID WILLIAM | 2891 | Non-Final OA | Jul 13, 2023 |
| 18351761 | HIGH ELECTRON MOBILITY TRANSISTOR WITH HELPING GATE | Taiwan Semiconductor Manufacturing Company, Ltd. | RAMIREZ, ALEXANDRE XAVIER | 2812 | Non-Final OA | Jul 13, 2023 |
| 18346530 | IMAGE SENSOR INTEGRATED CHIP STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | WRIGHT, TUCKER J | 2891 | Non-Final OA | Jul 03, 2023 |
| 18346568 | ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | Non-Final OA | Jul 03, 2023 |
| 18346506 | HIGH EFFICIENCY OPTICAL COUPLER | Taiwan Semiconductor Manufacturing Company, Ltd. | PETKOVSEK, DANIEL | 2874 | Non-Final OA | Jul 03, 2023 |
| 18346544 | MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | Non-Final OA | Jul 03, 2023 |
| 18341205 | METALENS FOR NEAR INFRARED PHOTODETECTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | LAU, EDMOND C | 2871 | Non-Final OA | Jun 26, 2023 |
| 18329881 | BUFFER STRUCTURE WITH INTERLAYER BUFFER LAYERS FOR HIGH VOLTAGE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, JAY C | 2815 | Non-Final OA | Jun 06, 2023 |
| 18324415 | PIXEL WITH DUAL-PD LAYOUT | Taiwan Semiconductor Manufacturing Company, Ltd. | WRIGHT, TUCKER J | 2891 | Non-Final OA | May 26, 2023 |
| 18324201 | ISOLATION STRUCTURE FOR ACTIVE DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | JAHAN, BILKIS | 2817 | Non-Final OA | May 26, 2023 |
| 18323465 | STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONTROL PRESSURE AT HIGH TEMPERATURE | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | Non-Final OA | May 25, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | Non-Final OA | May 22, 2023 |
| 18319703 | FLASH MEMORY WITH STACKABLE MEMORY CELLS | Taiwan Semiconductor Manufacturing Company, Ltd. | BOOTH, RICHARD A | 2812 | Non-Final OA | May 18, 2023 |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | Non-Final OA | May 12, 2023 |
| 18314184 | FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | May 09, 2023 |
| 18312718 | TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | GHYKA, ALEXANDER G | 2812 | Non-Final OA | May 05, 2023 |
| 18306488 | FLASH MEMORY CELL WITH TUNABLE TUNNEL DIELECTRIC CAPACITANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHAN, CANDICE | 2813 | Non-Final OA | Apr 25, 2023 |
| 18305442 | POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGULATOR | Taiwan Semiconductor Manufacturing Company, Ltd. | HUTSON, NICHOLAS LELAND | 2818 | Final Rejection | Apr 24, 2023 |
| 18301450 | SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD | Taiwan Semiconductor Manufacturing Company, Ltd. | HAN, JONATHAN | 2818 | Non-Final OA | Apr 17, 2023 |
| 18298351 | IMAGE SENSOR | Taiwan Semiconductor Manufacturing Co., Ltd. | JOHNSON, CHRISTOPHER A | 2899 | Non-Final OA | Apr 10, 2023 |
| 18297182 | EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS | Taiwan Semiconductor Manufacturing Company, Ltd. | LIU, XIAOMING | 2812 | Non-Final OA | Apr 07, 2023 |
| 18297162 | ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY | Taiwan Semiconductor Manufacturing Company, Ltd. | WARREN, MATTHEW E | 2815 | Non-Final OA | Apr 07, 2023 |
| 18193777 | BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS | Taiwan Semiconductor Manufacturing Company, Ltd. | GEBREMARIAM, SAMUEL A | 2811 | Non-Final OA | Mar 31, 2023 |
| 18192704 | MICRO-RING WAVEGUIDE HEATER | Taiwan Semiconductor Manufacturing Company, Ltd. | BLEVINS, JERRY M | 2874 | Non-Final OA | Mar 30, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Taiwan Semiconductor Manufacturing Company, Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | Feb 16, 2023 |
| 18164845 | MAGNETIC TUNNEL JUNCTION (MTJ) HAVING A DIFFUSION BLOCKING SPACER LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, WOO KYUNG | 2815 | Final Rejection | Feb 06, 2023 |
| 18155912 | SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | ASSOUMAN, HERVE-LOUIS Y | 2812 | Final Rejection | Jan 18, 2023 |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | Non-Final OA | Jan 06, 2023 |
| 18150385 | INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY | Taiwan Semiconductor Manufacturing Company, Ltd. | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Jan 05, 2023 |
| 18149767 | DIELECTRIC STRUCTURE FOR SMALL PIXEL DESIGNS | Taiwan Semiconductor Manufacturing Company, Ltd. | FAYETTE, NATHALIE RENEE | 2812 | Final Rejection | Jan 04, 2023 |
| 18149783 | ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELL, LAUREN R | 2896 | Final Rejection | Jan 04, 2023 |
| 18149712 | 3D SEMICONDUCTOR STRUCTURE FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | KARIMY, TIMOR | 2818 | Non-Final OA | Jan 04, 2023 |
| 18149789 | CRUCIFORM BONDING STRUCTURE FOR 3D-IC | Taiwan Semiconductor Manufacturing Company, Ltd. | GOODWIN, DAVID J | 2817 | Final Rejection | Jan 04, 2023 |
| 18149312 | THRESHOLD VOLTAGE MODULATION FOR THIN FILM TRANSISTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, EUGENE | 2815 | Final Rejection | Jan 03, 2023 |
| 17883668 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | GRAY, AARON J | 2897 | Final Rejection | Aug 09, 2022 |
| 17866924 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | LIN, JOHN | 2815 | Non-Final OA | Jul 18, 2022 |
| 17857382 | IMAGE SENSOR HAVING A LATERAL PHOTODETECTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | SRINIVASAN, SESHA SAIRAMAN | 2817 | Non-Final OA | Jul 05, 2022 |
| 17847450 | IMAGE SENSOR GATE STRUCTURE AND DOPING PROFILE | Taiwan Semiconductor Manufacturing Company, Ltd. | XU, ZHIJUN | 2818 | Non-Final OA | Jun 23, 2022 |
| 17834274 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | MULERO FLORES, ERIC MANUEL | 2898 | Final Rejection | Jun 07, 2022 |
| 17750951 | DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS | Taiwan Semiconductor Manufacturing Company, Ltd. | NADAV, ORI | 2811 | Final Rejection | May 23, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | Taiwan Semiconductor Manufacturing Company, Ltd. | SON, ERIKA HEERA | 2893 | Final Rejection | May 23, 2022 |
| 17690685 | ANTI-FERROELECTRIC TUNNEL JUNCTION WITH ASYMMETRICAL METAL ELECTRODES | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Mar 09, 2022 |
| 17672355 | FERROELECTRIC MEMORY DEVICE WITH LEAKAGE BARRIER LAYERS | Taiwan Semiconductor Manufacturing Company, Ltd. | ANGUIANO, MICHAEL | 2899 | Non-Final OA | Feb 15, 2022 |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | Taiwan Semiconductor Manufacturing Co., Ltd. | WOLDEGEORGIS, ERMIAS T | 2893 | Non-Final OA | Jun 04, 2021 |
| 17317968 | MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUTIONS FOR CMP | Taiwan Semiconductor Manufacturing Co., Ltd. | HUANG, STEVEN | 3723 | Final Rejection | May 12, 2021 |
IP Author helps law firms respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial