Prosecution Insights
Prosecution Insights
112 pending office actions • 18 clients • 100 examiners • 46 art units • 0 of 112 (0%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 25 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 25 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 4 (4%) |
| §103 only | 41 (37%) |
| §102 only | 6 (5%) |
| §112 only | 5 (4%) |
| Double-patenting only | 2 (2%) |
| Multi-statute (no §101) | 54 (48%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| PARKER, JOHN M | 4 | 92.0% | +0.9% |
| NARAGHI, ALI | 4 | 86.4% | +5.4% |
| CRAWFORD EASON, LATANYA N | 3 | 78.4% | +0.5% |
| TYNES JR., LAWRENCE C | 2 | 85.3% | +8.9% |
| GEBRESLASSIE, WINTA | 2 | 75.8% | +26.2% |
| VALENZUELA, PATRICIA D | 2 | 90.2% | +2.1% |
| BELOUSOV, ALEXANDER | 2 | 76.3% | +16.5% |
| DUNNING, RYAN S | 1 | 75.9% | +23.4% |
| SLITERIS, JOSELYNN Y | 1 | 76.9% | +21.4% |
| TRAN, LOC | 1 | 83.7% | +23.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | VALENZUELA, PATRICIA D | 42d overdue |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | PARKER, JOHN M | 3d overdue |
| 19264057 | Providing Access with Separate Authentication to Secure Content in Repositories | TRAN, LOC | — |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | PARKER, JOHN M | — |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | VALENZUELA, PATRICIA D | — |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | PARKER, JOHN M | — |
| 18364736 | LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE SENSORS | NARAGHI, ALI | — |
| 18346568 | ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT | NARAGHI, ALI | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17210938 | INVERTER WITH A HOUSING HAVING A COOLING UNIT | RALIS, STEPHEN J | 175d overdue |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | ANDERSON, WILLIAM H | 9d overdue |
| 18505234 | POLYLACTIC ACID HIGH-STRENGTH LONG FIBER USING NATURAL DYE PIGMENTS AND ITS MANUFACTURING METHOD | SINGH-PANDEY, ARTI R | 5d overdue |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | REAMES, MATTHEW L | 4d overdue |
| 18329881 | BUFFER STRUCTURE WITH INTERLAYER BUFFER LAYERS FOR HIGH VOLTAGE DEVICE | KIM, JAY C | 27d |
| 18149783 | ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE | BELL, LAUREN R | 27d |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | CHEN, DAVID Z | 28d |
| 18919483 | APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING | LOGIE, MICHAEL J | 34d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19411737 | HIGH PERFORMANCE ROAD MARKING DEVICE, SYSTEM, AND MANUFACTURING METHODS | DUNNING, RYAN S | — |
| 19378141 | AIR CURTAIN DEVICE AND VEHICLE | SLITERIS, JOSELYNN Y | — |
| 19264057 | Providing Access with Separate Authentication to Secure Content in Repositories | TRAN, LOC | — |
| 18609005 | MAJOR ADVERSE CARDIOVASCULAR EVENT RISK PREDICTION BASED ON COMPREHENSIVE ANALYSIS OF CT CALCIUM SCORE EXAM | GEBRESLASSIE, WINTA | — |
| 18500473 | PREDICTING RESPONSE AND PROGNOSIS TO CDK 4/6 INHIBITORS BASED ON TUMOR VASCULARIZATION AND VESSEL SHAPE | GEBRESLASSIE, WINTA | — |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | BELOUSOV, ALEXANDER | — |
| 18364667 | EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR | BELOUSOV, ALEXANDER | — |
| Client (Assignee) | Pending OAs |
|---|---|
| TSMC | 79 |
| SMA Solar Technology AG | 6 |
| Infineon | 5 |
| Hyland Software | 4 |
| Axcelis Technologies | 3 |
| Case Western Reserve University | 3 |
| 1 Visibility Technology LLC | 1 |
| SAIC Motor | 1 |
| Waspw, LLC | 1 |
| Logicdata | 1 |
| Quality Electrodynamics, LLC | 1 |
| Grc Technologies LLC | 1 |
| Microwave Solutions GmbH | 1 |
| KNAPP AG | 1 |
| Biohm Health Inc. | 1 |
| VISIONWORLD CO., LTD. | 1 |
| RAYLASE GmbH | 1 |
| Tsc Co., Ltd. | 1 |
| Art Unit | Apps |
|---|---|
| 2893 | 6 |
| 2817 | 6 |
| 2812 | 6 |
| 2874 | 5 |
| 2818 | 5 |
| 2899 | 5 |
| 2813 | 5 |
| 2896 | 4 |
| 2897 | 4 |
| 2898 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19411737 | HIGH PERFORMANCE ROAD MARKING DEVICE, SYSTEM, AND MANUFACTURING METHODS | 1 Visibility Technology LLC | DUNNING, RYAN S | 2872 | §102§103 | Final Rejection | — | Pending | Dec 08, 2025 |
| 19378141 | AIR CURTAIN DEVICE AND VEHICLE | Yanfeng International Automotive Technology Co., Ltd. | SLITERIS, JOSELYNN Y | 3614 | §102 | Non-Final OA | — | Pending | Nov 03, 2025 |
| 19264057 | Providing Access with Separate Authentication to Secure Content in Repositories | Hyland UK Operations Limited | TRAN, LOC | §103 | Non-Final OA | — | Pending | Jul 09, 2025 | |
| 19243052 | LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING | Taiwan Semiconductor Manufacturing Company, Ltd. | MANHEIM, MARC ETIENNE | 2874 | §103§112 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19232010 | EFEM ROBOT AUTO TEACHING METHODOLOGY | Taiwan Semiconductor Manufacturing Company, Ltd. | SAMPLE, JONATHAN L | §102§103§112 | Non-Final OA | — | Pending | Jun 09, 2025 | |
| 19093485 | DOOR PROTECTION DEVICE | Waspw, LLC | MENEZES, MARCUS | 3634 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2025 |
| 19071993 | METHOD FOR OPERATING AN INVERTER | Sma Solar Technology AG | LY, XUAN | 2836 | §103 | Non-Final OA | — | Pending | Mar 06, 2025 |
| 19063918 | LOW-TEMPERATURE VAPORIZER FOR ION IMPLANTER WITH IN-VACUUM CONTROLLED FLOW | Axcelis Technologies, Inc. | CHEN, KEATH T | 1716 | §103 | Final Rejection | 132d overdue | Pending | Feb 26, 2025 |
| 19053479 | VERTICALLY STACKED LIGHT SENSORS | Taiwan Semiconductor Manufacturing Company, Ltd. | KO, TONY | §102 | Non-Final OA | — | Pending | Feb 14, 2025 | |
| 19013406 | BRIDGE CIRCUIT AND ENERGY CONVERSION SYSTEM | Sma Solar Technology AG | LEE, JYE-JUNE | §103 | Non-Final OA | — | Pending | Jan 08, 2025 | |
| 18969428 | IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | SOHN, SEUNG C | §112 | Non-Final OA | — | Pending | Dec 05, 2024 | |
| 18950296 | APPLICATION OF SECURITY PARAMETERS FOR CONTENT | Hyland UK Operations Limited | CHOY, KA SHAN | 2435 | §103 | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18944039 | FIXED POSITION FILAMENT | Axcelis Technologies, Inc. | LEE, NATHANIEL J. | 2875 | §103 | Final Rejection | 45d overdue | Pending | Nov 12, 2024 |
| 18940092 | ADJUSTABLE WAFER CHUCK | Taiwan Semiconductor Manufacturing Company, Ltd. | COMBER, KEVIN J | 2838 | §102§103 | Non-Final OA | — | Pending | Nov 07, 2024 |
| 18919483 | APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING | Axcelis Technologies, Inc. | LOGIE, MICHAEL J | 2881 | §103§112 | Non-Final OA | 34d | Pending | Oct 18, 2024 |
| 18857579 | FURNITURE SYSTEM AND METHOD FOR POWER DISTRIBUTION IN A FURNITURE SYSTEM | Logicdata Electronic & Software Entwicklungs GmbH | PEREZ BORROTO, ALFONSO | 2836 | §102§112 | Non-Final OA | — | Pending | Oct 17, 2024 |
| 18892747 | MOBILE DEVICE, METHOD FOR ASSIGNING A SECURITY LEVEL OF A MOBILE DEVICE, AND METHOD FOR DETERMINING A POSITION | Infineon Technologies AG | GADALLA, HANY S | 2493 | §103 | Final Rejection | — | Pending | Sep 23, 2024 |
| 18809559 | MULTI-ROW MAGNETIC RESONANCE IMAGING (MRI) RADIO FREQUENCY (RF) COIL WITH A DECOUPLING RING | Quality Electrodynamics, LLC | PATEL, RISHI R | 2896 | §112 | Non-Final OA | — | Pending | Aug 20, 2024 |
| 18783610 | DATA BACKUP UNIT FOR STATIC RANDOM-ACCESS MEMORY DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BEGUM, SULTANA | 2824 | §103§112Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782319 | A METHOD TO IMPROVE DATA RETENTION OF NON-VOLATILE MEMORY IN LOGIC PROCESSES | Taiwan Semiconductor Manufacturing Company, Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782345 | TECHNIQUES FOR MRAM MTJ TOP ELECTRODE TO VIA INTERFACE | Taiwan Semiconductor Manufacturing Company, Ltd. | HOSSAIN, MOAZZAM | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18779252 | STILTED PAD STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | VU, DAVID | 2818 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778993 | EXTERNAL MAGNETIC FIELD DETECTION FOR MRAM DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | KERVEROS, DEMETRIOS C | 2111 | §102§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778988 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18777692 | ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM | Taiwan Semiconductor Manufacturing Company, Ltd. | GOLIGHTLY, ERIC WAYNE | 1714 | §112 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18776361 | INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS | Taiwan Semiconductor Manufacturing Company, Ltd. | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776346 | SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFERENT THICKNESSES | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAWFORD EASON, LATANYA N | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 | |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | GEBREMARIAM, SAMUEL A | §112 | Non-Final OA | — | Pending | Jul 18, 2024 | |
| 18775100 | WAFER LEVEL IMAGE SENSOR PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | CROSS, XIA L | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 | |
| 18775749 | CLEANING CHAMBER FOR METAL OXIDE REMOVAL | Taiwan Semiconductor Manufacturing Company, Ltd. | REYES, JOSHUA NATHANIEL PI | §103 | Non-Final OA | — | Pending | Jul 17, 2024 | |
| 18774012 | STRAP-CELL ARCHITECTURE FOR EMBEDDED MEMORY | Taiwan Semiconductor Manufacturing Company, Ltd. | MEHTA, RATISHA | DP | Non-Final OA | — | Pending | Jul 16, 2024 | |
| 18767848 | STRUCTURES AND METHODS FOR REDUCING PROCESS CHARGING DAMAGES | Taiwan Semiconductor Manufacturing Co., Ltd. | SCHOENHOLTZ, JOSEPH | 2893 | §112Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18765696 | TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING | Taiwan Semiconductor Manufacturing Company, Ltd. | TOBERGTE, NICHOLAS J | DP | Non-Final OA | — | Pending | Jul 08, 2024 | |
| 18757663 | PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MORE VAPOR CHAMBERS OVER IC CHIPS | Taiwan Semiconductor Manufacturing Company, Ltd. | HO, TU TU V | §103 | Non-Final OA | — | Pending | Jun 28, 2024 | |
| 18757630 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS | Taiwan Semiconductor Manufacturing Company, Ltd. | QUINTO, KEVIN V | §102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 | |
| 18748206 | GATE ELECTRODE EXTENDING INTO A SHALLOW TRENCH ISOLATION STRUCTURE IN HIGH VOLTAGE DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOI, CALVIN Y | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 | |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | May 31, 2024 |
| 18675236 | PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR PROCESSING CHAMBER SIDEWALLS | Taiwan Semiconductor Manufacturing Company, Ltd. | BARR, MICHAEL E | 1711 | §102§103§112Other | Non-Final OA | 70d | Pending | May 28, 2024 |
| 18668631 | CO-PACKAGED OPTICAL FIBER MOUNTING UNIT AND METHOD OF FABRICATION | Taiwan Semiconductor Manufacturing Company, Ltd. | PAK, SUNG H | 2874 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18665716 | SUBMERSIBLE PUMP GAUGE WITH DOWNHOLE ANALYSIS CAPABILITY | Grc Technologies LLC | HARCOURT, BRAD | 3674 | §103 | Final Rejection | 49d | Pending | May 16, 2024 |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BODNAR, JOHN A | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18650240 | DOPPLER DIVISION MULTIPLEXING | Infineon Technologies AG | GO, RICKY | §102 | Non-Final OA | — | Pending | Apr 30, 2024 | |
| 18704999 | APPARATUS FOR IMPROVED CLEANING USING MICROWAVE ENERGY | Microwave Solutions GmbH | CORMIER, DAVID G | 1711 | §103§112 | Final Rejection | 69d | Pending | Apr 26, 2024 |
| 18644209 | CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | GEYER, SCOTT B | §102 | Non-Final OA | — | Pending | Apr 24, 2024 | |
| 18636372 | INTEGRATED CIRCUIT INTER-DIE COMMUNICATION USING OPTICAL TRANSMISSION STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | PENG, CHARLIE YU | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18629044 | SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, KHIEM D | §103 | Non-Final OA | — | Pending | Apr 08, 2024 | |
| 18624484 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | TYNES JR., LAWRENCE C | §102§103§112 | Non-Final OA | — | Pending | Apr 02, 2024 | |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | DINKE, BITEW A | §102§103Other | Non-Final OA | — | Pending | Mar 27, 2024 | |
| 18609005 | MAJOR ADVERSE CARDIOVASCULAR EVENT RISK PREDICTION BASED ON COMPREHENSIVE ANALYSIS OF CT CALCIUM SCORE EXAM | Case Western Reserve University | GEBRESLASSIE, WINTA | 2677 | §103 | Final Rejection | — | Pending | Mar 19, 2024 |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | Taiwan Semiconductor Manufacturing Company, Ltd. | ANDERSON, WILLIAM H | 2817 | §102§103 | Final Rejection | 9d overdue | Pending | Mar 14, 2024 |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18584062 | BOND PAD FOR REDUCED CONTACT RESISTANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | TYNES JR., LAWRENCE C | 2899 | §102§103Other | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18582781 | PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18425333 | OXYGEN AFFINITY LAYER TO IMPROVE RRAM CELL PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | AHMED, SHAHED | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425224 | INTEGRATED CIRCUIT DEVICE INCLUDING A BOND-BASED CAPACITOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SEDOROOK, DAVID PAUL | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | SANDVIK, BENJAMIN P | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | TUTTLE, ETHAN ALEXANDER | 2897 | §103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18406678 | COMPUTING SYSTEM FOR CONFIGURABLE OFF-CHAIN STORAGE FOR BLOCKCHAINS | Hyland Software, Inc. | NILFOROUSH, MOHAMMAD A | 3697 | §101§112 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18576921 | AUTOMATED STORAGE SYSTEM | Knapp AG | SCOTT, JACOB S | 3655 | §102§103§112 | Final Rejection | — | Pending | Jan 05, 2024 |
| 18405075 | MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | BOWEN, ADAM S | 2897 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18401751 | IMAGE SENSOR DEVICE WITH LIGHT RETENTION STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | HA, NATHAN W | 2814 | §102§103 | Non-Final OA | 70d | Pending | Jan 02, 2024 |
| 18401752 | INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANUFACTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | KARIMY, TIMOR | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401746 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | CHIU, TSZ K | 2898 | §103 | Final Rejection | 26d | Pending | Jan 02, 2024 |
| 18401747 | MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CIESLEWICZ, ANETA B | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401749 | METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TAN N | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | Taiwan Semiconductor Manufacturing Company, Ltd. | REAMES, MATTHEW L | 2896 | §103§112 | Final Rejection | 4d overdue | Pending | Jan 02, 2024 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | Taiwan Semiconductor Manufacturing Company, Ltd. | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18545231 | PREDICTING NEO-ADJUVANT CHEMOTHERAPY RESPONSE FROM PRE-TREATMENT BREAST MAGNETIC RESONANCE IMAGING USING ARTIFICIAL INTELLIGENCE AND HER2 STATUS | Case Western Reserve University | LIU, GUOZHEN | 1686 | §101§103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18570718 | PROBIOTIC COMPOSITIONS FOR ALLEVIATING GASTROINTESTINAL SYMPTOMS IN SUBJECTS WITH A NEUROLOGICAL DISORDER | Biohm Health Inc. | EDWARDS, JESSICA FAYE | 1657 | §101§102§103§112 | Non-Final OA | — | Pending | Dec 15, 2023 |
| 18513968 | MRAM DEVICE HAVING SELF-ALIGNED SHUNTING LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18511016 | THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18505234 | POLYLACTIC ACID HIGH-STRENGTH LONG FIBER USING NATURAL DYE PIGMENTS AND ITS MANUFACTURING METHOD | VISIONWORLD CO., LTD. | SINGH-PANDEY, ARTI R | 1759 | §102§103 | Non-Final OA | 5d overdue | Pending | Nov 09, 2023 |
| 18500473 | PREDICTING RESPONSE AND PROGNOSIS TO CDK 4/6 INHIBITORS BASED ON TUMOR VASCULARIZATION AND VESSEL SHAPE | Case Western Reserve University | GEBRESLASSIE, WINTA | 2677 | §103 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18487169 | PROCESSING RADAR SIGNALS | Infineon Technologies AG | ZHU, NOAH YI MIN | 3648 | §103 | Non-Final OA | — | Pending | Oct 16, 2023 |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18485341 | PLATFORM FOR SPACE-SAVING CONFIGURATION OF AN ENERGY CONVERSION INSTALLATION, AND ENERGY CONVERSION INSTALLATION | Sma Solar Technology AG | WALRAED-SULLIVAN, KYLE | 3635 | §103Other | Final Rejection | 2d overdue | Pending | Oct 12, 2023 |
| 18463463 | HIGH VOLTAGE MOSFET USING SHALLOW-SHALLOW TRENCH ISOLATION STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOU, SHIH TSUN A | 2811 | §102§103§112 | Non-Final OA | — | Pending | Sep 08, 2023 |
| 18460208 | CONTACT RESISTANCE MEASUREMENT METHOD | Infineon Technologies AG | MARINI, MATTHEW G | 2853 | §103 | Final Rejection | 7d | Pending | Sep 01, 2023 |
| 18366074 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | KENDALL, BENJAMIN R | 2896 | §103§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | — | Pending | Aug 04, 2023 |
| 18364736 | LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE SENSORS | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Aug 03, 2023 |
| 18364667 | EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | — | Pending | Aug 03, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | 28d | Pending | Aug 01, 2023 |
| 18358255 | ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY | Taiwan Semiconductor Manufacturing Company, Ltd. | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | — | Pending | Jul 25, 2023 |
| 18358325 | EXPLOSION-PROOF HOUSING | Sma Solar Technology AG | WU, JERRY | 2841 | §103 | Non-Final OA | — | Pending | Jul 25, 2023 |
| 18358267 | COMPOSITE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18357264 | IN-SITU THERMAL ANNEALING OF ELECTRODE TO FORM SEED LAYER FOR IMPROVING FERAM PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | MARUF, SHEIKH | 2897 | §103 | Final Rejection | — | Pending | Jul 24, 2023 |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 42d overdue | Pending | Jul 18, 2023 |
| 18351784 | QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | 9d | Pending | Jul 13, 2023 |
| 18346506 | HIGH EFFICIENCY OPTICAL COUPLER | Taiwan Semiconductor Manufacturing Company, Ltd. | PETKOVSEK, DANIEL | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18346568 | ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18345008 | RESOURCE PROTECTION | Infineon Technologies AG | ELAHIAN, DANIEL | 2407 | §103 | Final Rejection | — | Pending | Jun 30, 2023 |
| 18341205 | METALENS FOR NEAR INFRARED PHOTODETECTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | LAU, EDMOND C | 2871 | §103§112 | Final Rejection | — | Pending | Jun 26, 2023 |
| 18338414 | FEFET DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | WALL, VINCENT | 2898 | §103 | Final Rejection | — | Pending | Jun 21, 2023 |
| 18256973 | MAGNETIC TRAP STRUCTURE FOR A LASER MODULE | Raylase GmbH | NGUYEN, PHUONG T | 3761 | §103 | Non-Final OA | 71d | Pending | Jun 12, 2023 |
| 18329881 | BUFFER STRUCTURE WITH INTERLAYER BUFFER LAYERS FOR HIGH VOLTAGE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, JAY C | 2815 | §103§112 | Final Rejection | 27d | Pending | Jun 06, 2023 |
| 18323465 | STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONTROL PRESSURE AT HIGH TEMPERATURE | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | §103Other | Non-Final OA | — | Pending | May 25, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | May 22, 2023 |
| 18321281 | IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | PROSTOR, ANDREW VICTOR | 2812 | §103 | Final Rejection | — | Pending | May 22, 2023 |
| 18313459 | FLAT OPTICS CAMERA MODULE FOR HIGH QUALITY IMAGING | Taiwan Semiconductor Manufacturing Company, Ltd. | TABA, MONICA TERESA | 2872 | §103 | Non-Final OA | — | Pending | May 08, 2023 |
| 18306488 | FLASH MEMORY CELL WITH TUNABLE TUNNEL DIELECTRIC CAPACITANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHAN, CANDICE | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 25, 2023 |
| 18192704 | MICRO-RING WAVEGUIDE HEATER | Taiwan Semiconductor Manufacturing Company, Ltd. | BLEVINS, JERRY M | 2874 | §103 | Final Rejection | 43d overdue | Pending | Mar 30, 2023 |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | §103 | Final Rejection | — | Pending | Jan 06, 2023 |
| 18149783 | ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELL, LAUREN R | 2896 | §103§112 | Final Rejection | 27d | Pending | Jan 04, 2023 |
| 17988986 | COMPUTING SYSTEM AND METHOD FOR RELEVANCY CLASSIFICATION OF CLINICAL DATA SETS USING KNOWLEDGE GRAPHS | Hyland Software, Inc. | WILLIAMS, TERESA S | 3687 | §101§103 | Final Rejection | 69d | Pending | Nov 17, 2022 |
| 17982587 | MRAM DEVICE HAVING SELF-ALIGNED SHUNTING LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 08, 2022 |
| 17951289 | METHOD, SYSTEM AND APPARATUS FOR SUPPLYING A CONSUMER DEVICE WITH ELECTRICAL ENERGY | Sma Solar Technology AG | ROBBINS, JERRY D | 2859 | §103 | Final Rejection | 19d | Pending | Sep 23, 2022 |
| 17805132 | LOW-TOXICITY FLAME-RETARDANT POLYOLEFIN-BASED INSULATING RESIN COMPOSITION, INSULATED ELECTRIC CABLE, AND METHOD OF MANUFACTURING INSULATED ELECTRIC CABLE | Tsc Co., Ltd. | AMATO, ELIZABETH KATHRYN | 1762 | §103 | Final Rejection | 79d | Pending | Jun 02, 2022 |
| 17210938 | INVERTER WITH A HOUSING HAVING A COOLING UNIT | Sma Solar Technology AG | RALIS, STEPHEN J | 3992 | §103§112 | Final Rejection | 175d overdue | Pending | Mar 24, 2021 |
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