Prosecution Insights
Prosecution Insights
48 pending office actions • 1 client • 47 examiners • 18 art units • 0 of 48 (0%) have an AI response strategy ready • 255 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 48 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 48 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 43 (90%) |
| §102 only | 3 (6%) |
| §112 only | 2 (4%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| WARREN, MATTHEW E | 2 | 87.5% | +5.6% |
| PHAM, THOMAS T | 1 | 51.7% | +16.3% |
| JOSHI, SUNITA | 1 | 80.8% | +6.1% |
| MARKOFF, ALEXANDER | 1 | 48.8% | +32.1% |
| MOORE, DEVON TYLEN | 1 | 47.8% | +30.9% |
| ANDERSON, WILLIAM H | 1 | 85.7% | +15.4% |
| CHIU, TSZ K | 1 | 79.2% | +10.5% |
| HA, NATHAN W | 1 | 91.1% | +7.8% |
| REAMES, MATTHEW L | 1 | 76.8% | +18.0% |
| WINTERS, SEAN AYERS | 1 | 87.9% | +21.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18422245 | METHOD FOR FORMING A MFMIS MEMORY DEVICE | WARREN, MATTHEW E | 42d overdue |
| 18297162 | ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY | WARREN, MATTHEW E | 10d overdue |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | ANDERSON, WILLIAM H | 9d overdue |
| 18780873 | TOP NOTCH SLIT PROFILE FOR MEMS DEVICE | JOSHI, SUNITA | 5d overdue |
| 18395841 | IMAGE SENSORS AND METHODS OF MANUFACTURE | WINTERS, SEAN AYERS | 55d |
| 18401751 | IMAGE SENSOR DEVICE WITH LIGHT RETENTION STRUCTURE | HA, NATHAN W | 70d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | ANDERSON, WILLIAM H | 9d overdue |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | REAMES, MATTHEW L | 4d overdue |
| 18401746 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | CHIU, TSZ K | 26d |
| 18782475 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | PHAM, THOMAS T | 28d |
| 18630160 | ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE | MOORE, DEVON TYLEN | 28d |
| 18395841 | IMAGE SENSORS AND METHODS OF MANUFACTURE | WINTERS, SEAN AYERS | 55d |
| 18675236 | PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR PROCESSING CHAMBER SIDEWALLS | MARKOFF, ALEXANDER | 70d |
| Client (Assignee) | Pending OAs |
|---|---|
| TSMC | 48 |
| Art Unit | Apps |
|---|---|
| 2812 | 7 |
| 2815 | 6 |
| 2817 | 5 |
| 2818 | 5 |
| 2893 | 4 |
| 2898 | 3 |
| 2899 | 3 |
| 2814 | 2 |
| 2896 | 2 |
| 2891 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18782475 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | PHAM, THOMAS T | 1713 | §103 | Final Rejection | 28d | Pending | Jul 24, 2024 |
| 18780873 | TOP NOTCH SLIT PROFILE FOR MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | JOSHI, SUNITA | 2691 | §102 | Non-Final OA | 5d overdue | Pending | Jul 23, 2024 |
| 18675236 | PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR PROCESSING CHAMBER SIDEWALLS | Taiwan Semiconductor Manufacturing Company, Ltd. | MARKOFF, ALEXANDER | 1711 | §103 | Non-Final OA | 70d | Pending | May 28, 2024 |
| 18630160 | ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | MOORE, DEVON TYLEN | 3763 | §103 | Non-Final OA | 28d | Pending | Apr 09, 2024 |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | Taiwan Semiconductor Manufacturing Company, Ltd. | ANDERSON, WILLIAM H | 2817 | §103 | Non-Final OA | 9d overdue | Pending | Mar 14, 2024 |
| 18422245 | METHOD FOR FORMING A MFMIS MEMORY DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | WARREN, MATTHEW E | 2817 | §112 | Non-Final OA | 42d overdue | Pending | Jan 25, 2024 |
| 18401746 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | CHIU, TSZ K | 2898 | §103 | Non-Final OA | 26d | Pending | Jan 02, 2024 |
| 18401751 | IMAGE SENSOR DEVICE WITH LIGHT RETENTION STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | HA, NATHAN W | 2814 | §103 | Non-Final OA | 70d | Pending | Jan 02, 2024 |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | Taiwan Semiconductor Manufacturing Company, Ltd. | REAMES, MATTHEW L | 2896 | §103 | Non-Final OA | 4d overdue | Pending | Jan 02, 2024 |
| 18395841 | IMAGE SENSORS AND METHODS OF MANUFACTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | WINTERS, SEAN AYERS | 2892 | §103 | Non-Final OA | 55d | Pending | Dec 26, 2023 |
| 18490893 | INSERTION LAYER BETWEEN CHANNEL AND PASSIVATION FOR TRANSISTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | 28d overdue | Pending | Oct 20, 2023 |
| 18480551 | IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | SLUTSKER, JULIA | 2891 | §103 | Non-Final OA | 20d | Pending | Oct 04, 2023 |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | §103 | Non-Final OA | 11d overdue | Pending | Sep 22, 2023 |
| 18454107 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SANDVIK, BENJAMIN P | 2812 | §102 | Non-Final OA | 20d | Pending | Aug 23, 2023 |
| 18366845 | METHODS FOR FORMING IMAGE SENSORS | Taiwan Semiconductor Manufacturing Company, Ltd. | LI, MEIYA | 2811 | §112 | Non-Final OA | 7d | Pending | Aug 08, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, DAVID Z | 2815 | §103 | Non-Final OA | 28d | Pending | Aug 01, 2023 |
| 18362101 | CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS | Taiwan Semiconductor Manufacturing Company, Ltd. | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | 23d overdue | Pending | Jul 31, 2023 |
| 18358199 | OPTICAL ROUTING STRUCTURE ON BACKSIDE OF SUBSTRATE FOR PHOTONIC DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | BEDTELYON, JOHN M | 2874 | §103 | Non-Final OA | 29d | Pending | Jul 25, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18354217 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR NARROWED BY EPITAXY GROWTH | Taiwan Semiconductor Manufacturing Company, Ltd. | NARAGHI, ALI | 2817 | §103 | Non-Final OA | 10d overdue | Pending | Jul 18, 2023 |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 18, 2023 |
| 18351784 | QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | 9d | Pending | Jul 13, 2023 |
| 18346544 | MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | 14d | Pending | Jul 03, 2023 |
| 18330531 | CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREASE CAPACITANCE DENSITY | Taiwan Semiconductor Manufacturing Company, Ltd. | DIAZ, JOSE R | 2815 | §102 | Non-Final OA | 33d | Pending | Jun 07, 2023 |
| 18329881 | BUFFER STRUCTURE WITH INTERLAYER BUFFER LAYERS FOR HIGH VOLTAGE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, JAY C | 2815 | §103 | Non-Final OA | 27d | Pending | Jun 06, 2023 |
| 18324201 | ISOLATION STRUCTURE FOR ACTIVE DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | 44d overdue | Pending | May 26, 2023 |
| 18312726 | RESISTOR STRUCTURE HAVING CAVITIES FOR INCREASED RESISTOR PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | GREWAL, HEIM KIRIN | 2812 | §103 | Non-Final OA | 62d | Pending | May 05, 2023 |
| 18312718 | TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | GHYKA, ALEXANDER G | 2812 | §103 | Non-Final OA | 10d overdue | Pending | May 05, 2023 |
| 18305442 | POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGULATOR | Taiwan Semiconductor Manufacturing Company, Ltd. | HUTSON, NICHOLAS LELAND | 2818 | §103 | Final Rejection | 22d | Pending | Apr 24, 2023 |
| 18301450 | SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD | Taiwan Semiconductor Manufacturing Company, Ltd. | HAN, JONATHAN | 2818 | §103 | Non-Final OA | 24d overdue | Pending | Apr 17, 2023 |
| 18298351 | IMAGE SENSOR | Taiwan Semiconductor Manufacturing Co., Ltd. | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | 16d overdue | Pending | Apr 10, 2023 |
| 18297182 | EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS | Taiwan Semiconductor Manufacturing Company, Ltd. | LIU, XIAOMING | 2812 | §103 | Non-Final OA | 19d overdue | Pending | Apr 07, 2023 |
| 18297162 | ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY | Taiwan Semiconductor Manufacturing Company, Ltd. | WARREN, MATTHEW E | 2815 | §103 | Non-Final OA | 10d overdue | Pending | Apr 07, 2023 |
| 18192704 | MICRO-RING WAVEGUIDE HEATER | Taiwan Semiconductor Manufacturing Company, Ltd. | BLEVINS, JERRY M | 2874 | §103 | Non-Final OA | 43d overdue | Pending | Mar 30, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Taiwan Semiconductor Manufacturing Company, Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 8d | Pending | Feb 16, 2023 |
| 18155912 | SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | 8d | Pending | Jan 18, 2023 |
| 18150385 | INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY | Taiwan Semiconductor Manufacturing Company, Ltd. | SUN, YU-HSI DAVID | 2817 | §103 | Non-Final OA | 12d | Pending | Jan 05, 2023 |
| 18149712 | 3D SEMICONDUCTOR STRUCTURE FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | KARIMY, TIMOR | 2818 | §103 | Non-Final OA | 35d overdue | Pending | Jan 04, 2023 |
| 18149767 | DIELECTRIC STRUCTURE FOR SMALL PIXEL DESIGNS | Taiwan Semiconductor Manufacturing Company, Ltd. | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 22d | Pending | Jan 04, 2023 |
| 18149783 | ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELL, LAUREN R | 2896 | §103 | Final Rejection | 27d | Pending | Jan 04, 2023 |
| 18149312 | THRESHOLD VOLTAGE MODULATION FOR THIN FILM TRANSISTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, EUGENE | 2815 | §103 | Final Rejection | 43d overdue | Pending | Jan 03, 2023 |
| 17847450 | IMAGE SENSOR GATE STRUCTURE AND DOPING PROFILE | Taiwan Semiconductor Manufacturing Company, Ltd. | XU, ZHIJUN | 2818 | §103 | Non-Final OA | 14d | Pending | Jun 23, 2022 |
| 17834274 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Final Rejection | 23d | Pending | Jun 07, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | Taiwan Semiconductor Manufacturing Company, Ltd. | SON, ERIKA HEERA | 2893 | §103 | Final Rejection | 18d overdue | Pending | May 23, 2022 |
| 17690685 | ANTI-FERROELECTRIC TUNNEL JUNCTION WITH ASYMMETRICAL METAL ELECTRODES | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | §103 | Non-Final OA | 14d | Pending | Mar 09, 2022 |
| 17672355 | FERROELECTRIC MEMORY DEVICE WITH LEAKAGE BARRIER LAYERS | Taiwan Semiconductor Manufacturing Company, Ltd. | ANGUIANO, MICHAEL | 2899 | §103 | Non-Final OA | 28d | Pending | Feb 15, 2022 |
| 17393619 | VIA RAIL SOLUTION FOR HIGH POWER ELECTROMIGRATION | Taiwan Semiconductor Manufacturing Company, Ltd. | LIN, JOHN | 2815 | §103 | Non-Final OA | 72d overdue | Pending | Aug 04, 2021 |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | Taiwan Semiconductor Manufacturing Co., Ltd. | WOLDEGEORGIS, ERMIAS T | 2893 | §103 | Non-Final OA | 4d overdue | Pending | Jun 04, 2021 |
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