266 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 19022869 | SEMICONDUCTOR WAFER STORAGE DEVICE | GEHMAN, BRYON P | 3736 | Non-Final OA | Jan 15, 2025 |
| 19001089 | DEPOSITION SYSTEM AND METHOD | MCDONALD, RODNEY GLENN | 1794 | Non-Final OA | Dec 24, 2024 |
| 18981170 | PERMEANCE MAGNETIC ASSEMBLY | OTT, PATRICK S | 1794 | Non-Final OA | Dec 13, 2024 |
| 18936841 | GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR QUALIFYING DYNAMIC ON-STATE RESISTANCE DEGRADATION | RETEBO, METASEBIA T | 2842 | Non-Final OA | Nov 04, 2024 |
| 18935100 | SYSTEM AND METHOD FOR WAFER MANUFACTURING PROCESS MANAGEMENT | PATTON, SPENCER D | 3656 | Non-Final OA | Nov 01, 2024 |
| 18790426 | STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE | BUI, THA-O H | 2825 | Non-Final OA | Jul 31, 2024 |
| 18790296 | METHOD AND APPARATUS FOR LOGIC CELL-BASED PUF GENERATORS | JOHNSON, AMY COHEN | 2400 | Non-Final OA | Jul 31, 2024 |
| 18790969 | APPARATUS AND METHODS FOR CLEANING A PACKAGE | KO, JASON Y | 1711 | Non-Final OA | Jul 31, 2024 |
| 18788717 | DEPOSITION APPARATUS AND METHOD WITH EM RADIATION | TUROCY, DAVID P | 1718 | Non-Final OA | Jul 30, 2024 |
| 18787934 | VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING | MOORE, KARLA A | 1716 | Non-Final OA | Jul 29, 2024 |
| 18786966 | METHOD OF FORMING A 3D STACKED CHIP INCLUDING FORMING A FIRST DIE ON ONE SIDE OF A THROUGH-SUBSTRATE VIA (TSV) AND FORMING A SECOND DIE ON OPPOSITE SIDE OF THE TSV AFTER THINNING OF THE SUBSTRATE TO EXPOSE THE TSV | MAI, ANH D | 2893 | Non-Final OA | Jul 29, 2024 |
| 18785067 | BONDING SYSTEM AND METHOD FOR USING THE SAME | WRIGHT, ALEXANDER SCOTT | 1745 | Non-Final OA | Jul 26, 2024 |
| 18784608 | SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION | PHAM, THOMAS T | 1713 | Non-Final OA | Jul 25, 2024 |
| 18783178 | SYSTEM AND METHOD FOR CLEANING AN EUV MASK | RIDDLE, CHRISTINA A | 2882 | Non-Final OA | Jul 24, 2024 |
| 18782988 | IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING | CHEN, CHIA WEI A | 2637 | Non-Final OA | Jul 24, 2024 |
| 18781567 | SYSTEM AND METHOD FOR MONITORING AND CONTROLLING EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY PROCESSES | RIDDLE, CHRISTINA A | 2882 | Non-Final OA | Jul 23, 2024 |
| 18781018 | Metal Contacts on Metal Gates and Methods Thereof | CULBERT, CHRISTOPHER A | 2815 | Final Rejection | Jul 23, 2024 |
| 18781721 | SYSTEM AND METHOD FOR DETECTING DEBRIS IN A PHOTOLITHOGRAPHY SYSTEM | RIDDLE, CHRISTINA A | 2882 | Non-Final OA | Jul 23, 2024 |
| 18770552 | ELECTRICAL PASSIVE ELEMENTS OF AN ESD POWER CLAMP IN A BACKSIDE BACK END OF LINE (B-BEOL) PROCESS | PATEL, DHARTI HARIDAS | 2838 | Non-Final OA | Jul 11, 2024 |
| 18767858 | CIRCUITS AND METHODS FOR COMPENSATING A MISMATCH IN A SENSE AMPLIFIER | BEGUM, SULTANA | 2824 | Non-Final OA | Jul 09, 2024 |
| 18767843 | METHOD AND APPARATUS FOR PUF GENERATOR CHARACTERIZATION | FAROOQUI, QUAZI | 2491 | Non-Final OA | Jul 09, 2024 |
| 18757659 | SEMICONDUCTOR STRUCTURE HAVING BOTH GATE-ALL-AROUND DEVICES AND PLANAR DEVICES | GEBREMARIAM, SAMUEL A | 2811 | Non-Final OA | Jun 28, 2024 |
| 18751423 | SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE | LUND, JEFFRIE ROBERT | 1716 | Non-Final OA | Jun 24, 2024 |
| 18737457 | HANDLER WITH COOLING HEAD AND DOUBLE-SIDED FIN STRUCTURE | AURORA, REENA | 2858 | Non-Final OA | Jun 07, 2024 |
| 18679091 | A STRUCTURE COMPRISING A RECONSTRUCTED PACKAGE SUBSTRATE INCLUDING AN ENCAPSULATED SUBSTRATE BLOCK | NGUYEN, KHIEM D | 2892 | Non-Final OA | May 30, 2024 |
| 18677345 | LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES | MENZ, DOUGLAS M | 2897 | Final Rejection | May 29, 2024 |
| 18674351 | COIL STRUCTURE AND METHOD OF MAKING SAME | MOURAD, RASEM | 2836 | Non-Final OA | May 24, 2024 |
| 18655568 | MEMORY DEVICES WITH GATE ALL AROUND TRANSISTORS | TRAN, ANTHAN | 2825 | Non-Final OA | May 06, 2024 |
| 18654268 | Structure and Method of Forming a Joint Assembly | RAMPERSAUD, PRIYA M | 2897 | Non-Final OA | May 03, 2024 |
| 18626229 | SEMICONDUCTOR DEVICE WITH ELONGATED PATTERN | HO, TU TU V | 2818 | Non-Final OA | Apr 03, 2024 |
| 18616604 | CONNECTOR FOR OPTICAL FIBER ALIGNMENT | PEACE, RHONDA S | 2874 | Non-Final OA | Mar 26, 2024 |
| 18615403 | GATE STRUCTURE AND PATTERNING METHOD | OH, JAEHWAN | 2899 | Non-Final OA | Mar 25, 2024 |
| 18610375 | CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD | MCFARLAND, TYLER JAMES | 3723 | Non-Final OA | Mar 20, 2024 |
| 18593661 | SEMICONDUCTOR DEVICE | KIM, SU C | 2899 | Non-Final OA | Mar 01, 2024 |
| 18582240 | SELF-ALIGNED METHOD FOR FORMING AN OPTICAL MODULATOR | ENDRESEN, KIRSTEN DANIELA | 2874 | Non-Final OA | Feb 20, 2024 |
| 18439614 | AUTOMATIC LEVELING IMMERSION COOLING TANK AND METHOD OF OPERATING THE SAME | FENG, ZHENGFU J | 2835 | Non-Final OA | Feb 12, 2024 |
| 18439340 | Photolithography Methods and Resulting Structures | DUCLAIR, STEPHANIE P. | 1713 | Non-Final OA | Feb 12, 2024 |
| 18431187 | PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | TAVLYKAEV, ROBERT FUATOVICH | 2896 | Non-Final OA | Feb 02, 2024 |
| 18415770 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | Non-Final OA | Jan 18, 2024 |
| 18415092 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | TAVLYKAEV, ROBERT FUATOVICH | 2896 | Non-Final OA | Jan 17, 2024 |
| 18412358 | VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES | KREILING, AMANDA J | 3726 | Non-Final OA | Jan 12, 2024 |
| 18410329 | VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS | TRAN, TAN N | 2812 | Non-Final OA | Jan 11, 2024 |
| 18410060 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME | ISAAC, STANETTA D | 2898 | Non-Final OA | Jan 11, 2024 |
| 18402944 | ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES | GREER, RIANNA BLISS | 2814 | Non-Final OA | Jan 03, 2024 |
| 18401851 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | WONG, TINA MEI SENG | 2874 | Non-Final OA | Jan 02, 2024 |
| 18402061 | System on Integrated Chips (SoIC) and Semiconductor Structures with Integrated SoIC | JAHAN, BILKIS | 2817 | Non-Final OA | Jan 02, 2024 |
| 18532787 | SMART WAFER TRANSPORT CASE WITH SENSOR SYSTEM | EL-BATHY, IBRAHIM N | 3628 | Non-Final OA | Dec 07, 2023 |
| 18530102 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2814 | Non-Final OA | Dec 05, 2023 |
| 18526828 | CONTACT AIR GAP FORMATION AND STRUCTURES THEREOF | BOWEN, ADAM S | 2897 | Non-Final OA | Dec 01, 2023 |
| 18526084 | Low-K Gate Spacer and Methods for Forming the Same | CHANG, JAY C | 2817 | Non-Final OA | Dec 01, 2023 |
| 18526496 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | ABEL, GARY ROBERT | 2897 | Non-Final OA | Dec 01, 2023 |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | ENAD, CHRISTINE A | 2811 | Non-Final OA | Dec 01, 2023 |
| 18526397 | TRANSISTOR ISOLATION REGIONS AND METHODS OF FORMING THE SAME | BOWEN, ADAM S | 2897 | Non-Final OA | Dec 01, 2023 |
| 18524627 | FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | FAN, SU JYA | 2818 | Non-Final OA | Nov 30, 2023 |
| 18524386 | MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Nov 30, 2023 |
| 18521726 | ADJUSTABLE NOZZLE DEVICE | TADESSE, YEWEBDAR T | 1717 | Non-Final OA | Nov 28, 2023 |
| 18518081 | Metal Contact Structure and Method of Forming the Same in a Semiconductor Device | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Nov 22, 2023 |
| 18516478 | SEMICONDUCTOR DEVICE STRUCTURE FOR CHIP IDENTIFICATION | YI, CHANGHYUN | 2812 | Non-Final OA | Nov 21, 2023 |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Nov 20, 2023 |
| 18512194 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Nov 17, 2023 |
| 18512146 | WAFER CHUCK ASSEMBLY | KACKAR, RAM N | 1716 | Non-Final OA | Nov 17, 2023 |
| 18510091 | METHOD OF FORMING SEMICONDUCTOR DEVICE | ISAAC, STANETTA D | 2898 | Non-Final OA | Nov 15, 2023 |
| 18507726 | Semiconductor Package With Thermal Conductive Structure and the Methods of Forming the Same | HARRISTON, WILLIAM A | 2899 | Non-Final OA | Nov 13, 2023 |
| 18504714 | CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS | JEFFERSON, QUOVAUNDA | 2899 | Non-Final OA | Nov 08, 2023 |
| 18502485 | ANTI-PLASMA COATING | GRUSBY, REBECCA LYNN | 1785 | Non-Final OA | Nov 06, 2023 |
| 18499908 | FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Nov 01, 2023 |
| 18489994 | Auto Recipe Generation and Dicing Process | FARINA, MICHAEL VINCENT | 2115 | Non-Final OA | Oct 19, 2023 |
| 18490363 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | NGUYEN, CUONG B | 2818 | Non-Final OA | Oct 19, 2023 |
| 18490014 | PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING | ZHU, SHENG-BAI | 2897 | Non-Final OA | Oct 19, 2023 |
| 18482954 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Oct 09, 2023 |
| 18476591 | DIE STRUCTURES AND METHODS OF FORMING THE SAME | TRAPANESE, WILLIAM C | 2812 | Non-Final OA | Sep 28, 2023 |
| 18476619 | SELECTIVE BOTTOM SEED LAYER FORMATION FOR BOTTOM-UP EPITAXY | MUNOZ, ANDRES F | 2818 | Non-Final OA | Sep 28, 2023 |
| 18475782 | Middle Dielectric Isolation in Complementary Field-Effect Transistor Devices | ASHBAHIAN, ERIC K | 2891 | Non-Final OA | Sep 27, 2023 |
| 18471739 | Integrated Circuit Packages and Methods of Forming the Same | ENAD, CHRISTINE A | 2811 | Non-Final OA | Sep 21, 2023 |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | CUTLER, ETHAN EDWARD | 2892 | Non-Final OA | Sep 12, 2023 |
| 18463596 | BACKSIDE GATE CONTACT, BACKSIDE GATE ETCH STOP LAYER, AND METHODS OF FORMING SAME | GREAVING, JASON JAMES | 2893 | Non-Final OA | Sep 08, 2023 |
| 18463710 | OPTICAL DEVICES | CHIEM, DINH D | 2874 | Final Rejection | Sep 08, 2023 |
| 18463466 | CHANNEL REGIONS IN STACKED TRANSISTORS AND METHODS OF FORMING THE SAME | HARRISON, MONICA D | 2815 | Non-Final OA | Sep 08, 2023 |
| 18459171 | INTEGRATED CIRCUIT PACKAGE AND METHOD | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | Non-Final OA | Aug 31, 2023 |
| 18240065 | SEMICONDUCTOR PACKAGE AND METHOD | PARENDO, KEVIN A | 2896 | Non-Final OA | Aug 30, 2023 |
| 18239283 | CONTACTS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | CHI, SUBERR L | 2893 | Non-Final OA | Aug 29, 2023 |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Aug 29, 2023 |
| 18455857 | PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF | BAIG, ANEESA RIAZ | 2814 | Non-Final OA | Aug 25, 2023 |
| 18451984 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | WONG, ERIC K | 2874 | Non-Final OA | Aug 18, 2023 |
| 18451269 | STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD | MAZUMDER, DIDARUL A | 2812 | Non-Final OA | Aug 17, 2023 |
| 18449196 | Tuning Work Functions of Complementary Transistors | ENAD, CHRISTINE A | 2811 | Final Rejection | Aug 14, 2023 |
| 18448686 | OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE | TRAN, HOANG Q | 2874 | Final Rejection | Aug 11, 2023 |
| 18232718 | Contact Structure For Semiconductor Device | AU, BAC H | 2898 | Non-Final OA | Aug 10, 2023 |
| 18232713 | Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via | SYLVIA, CHRISTINA A | 2817 | Non-Final OA | Aug 10, 2023 |
| 18446753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | LI, MEIYA | 2811 | Non-Final OA | Aug 09, 2023 |
| 18446564 | Deposition Apparatus and Method with EM Radiation | MILLER, JR, JOSEPH ALBERT | 1712 | Final Rejection | Aug 09, 2023 |
| 18446858 | WAFER DRYING SYSTEM | YUEN, JESSICA JIPING | 3762 | Final Rejection | Aug 09, 2023 |
| 18232171 | Semiconductor Device With Isolation Structures | HOANG, TUAN A | 2898 | Non-Final OA | Aug 09, 2023 |
| 18366771 | Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same | KLEIN, JORDAN M | 2893 | Non-Final OA | Aug 08, 2023 |
| 18446392 | STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE | ROLLAND, ALEX A | 1759 | Non-Final OA | Aug 08, 2023 |
| 18366255 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | FERNANDES, ERROL V | 2893 | Non-Final OA | Aug 07, 2023 |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 2813 | Non-Final OA | Aug 07, 2023 |
| 18366370 | STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE | KOO, LAMONT B | 2813 | Non-Final OA | Aug 07, 2023 |
| 18366297 | Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same | RAHMAN, MOIN M | 2898 | Non-Final OA | Aug 07, 2023 |
| 18366469 | CONTACT PLUG STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | DOAN, THERESA T | 2814 | Non-Final OA | Aug 07, 2023 |
| 18365050 | OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE | MOONEY, MICHAEL P | 2874 | Non-Final OA | Aug 03, 2023 |
| 18364588 | Warm Wafer After Ion Cryo-Implantation | CHOI, JAMES J | 2878 | Non-Final OA | Aug 03, 2023 |
| 18364964 | CMOS Fabrication Methods for Back-Gate Transistor | HA, NATHAN W | 2814 | Final Rejection | Aug 03, 2023 |
| 18365068 | Memory Array and Methods of Forming Same | LI, MEIYA | 2811 | Non-Final OA | Aug 03, 2023 |
| 18364614 | METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARIZATION | BAUMAN, SCOTT E | 2815 | Non-Final OA | Aug 03, 2023 |
| 18363096 | INTEGRATED CIRCUIT PACKAGE AND METHOD | NGUYEN, THANH T | 2893 | Non-Final OA | Aug 01, 2023 |
| 18228333 | Micro-Electro-Mechanical System (MEMS) Thermal Sensor | JOHNSON, CHRISTOPHER A | 2899 | Non-Final OA | Jul 31, 2023 |
| 18362649 | System Formed Through Package-In-Package Formation | SHAMSUZZAMAN, MOHAMMED | 2897 | Non-Final OA | Jul 31, 2023 |
| 18362835 | MAGNETIC TUNNEL JUNCTION STRUCTURES AND RELATED METHODS | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Jul 31, 2023 |
| 18361832 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | Non-Final OA | Jul 29, 2023 |
| 18361622 | LEAKAGE REDUCTION METHODS AND STRUCTURES THEREOF | PARKER, JOHN M | 2899 | Non-Final OA | Jul 28, 2023 |
| 18361402 | BOTTOM ANTIREFLECTIVE COATING MATERIALS | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Jul 28, 2023 |
| 18361569 | BENT FIN DEVICES | KOO, LAMONT B | 2813 | Non-Final OA | Jul 28, 2023 |
| 18360447 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING | NETTLES, CORALIE ANN | 2893 | Non-Final OA | Jul 27, 2023 |
| 18359180 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | Final Rejection | Jul 26, 2023 |
| 18358634 | Integrated Circuits Having Protruding Interconnect Conductors | GEYER, SCOTT B | 2812 | Non-Final OA | Jul 25, 2023 |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jul 19, 2023 |
| 18352556 | MATERIALS AND METHODS FOR FORMING RESIST BOTTOM LAYER | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Jul 14, 2023 |
| 18352727 | PHOTONIC DEVICE | STAHL, MICHAEL J | 2874 | Non-Final OA | Jul 14, 2023 |
| 18221160 | Methods Of Forming Contact Structure In Semiconductor Devices | MCCUTCHEON, COLIN RUSSELL | 2892 | Non-Final OA | Jul 12, 2023 |
| 18350583 | Multi-Layer Structures and Methods of Forming | KNUDSON, BRAD ALLAN | 2817 | Final Rejection | Jul 11, 2023 |
| 18348967 | Cut Metal Gate Refill With Buffer Layer | WELLINGTON, ANDREA L | 2800 | Non-Final OA | Jul 07, 2023 |
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 07, 2023 |
| 18347188 | Optical Transceiver and Manufacturing Method Thereof | STAHL, MICHAEL J | 2874 | Non-Final OA | Jul 05, 2023 |
| 18345070 | TRANSISTOR CONTACTS AND METHODS OF FORMING THEREOF | TAYLOR, EARL N | 2896 | Non-Final OA | Jun 30, 2023 |
| 18344635 | CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME | KOCH, GEORGE R | 1745 | Non-Final OA | Jun 29, 2023 |
| 18343447 | GUARD RING CAPACITOR METHOD AND STRUCTURE | SANDVIK, BENJAMIN P | 2812 | Non-Final OA | Jun 28, 2023 |
| 18341897 | SEMICONDUCTOR PACKAGE AND METHOD | MAZUMDER, DIDARUL A | 2812 | Non-Final OA | Jun 27, 2023 |
| 18339672 | DYNAMIC EXHAUST FOR CHEMICAL PROCESSING | MALLON, BRETT PETERSON | 3762 | Final Rejection | Jun 22, 2023 |
| 18338759 | Fin Field Effect Transistor (FinFET) Device and Method for Forming the Same | JOHNSON, CHRISTOPHER A | 2899 | Non-Final OA | Jun 21, 2023 |
| 18338107 | Multi-Level Stacking of Wafers and Chips | GOODWIN, DAVID J | 2817 | Non-Final OA | Jun 20, 2023 |
| 18335852 | PHOTO LIGAND DESIGN FOR EUV OR E-BEAM METALLIC PHOTORESISTS | CHU, JOHN S Y | 1737 | Non-Final OA | Jun 15, 2023 |
| 18335741 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Jun 15, 2023 |
| 18334695 | Integrated Circuit Package and Methods of Forming the Same | TRAN, TRANG Q | 2811 | Non-Final OA | Jun 14, 2023 |
| 18334650 | Redistribution Lines and The Method Forming the Same Through Stitching | ABRAHAM, JOSE K | 3729 | Final Rejection | Jun 14, 2023 |
| 18333197 | SRAM CELL WITH BALANCED WRITE PORT | JUNGE, BRYAN R. | 2897 | Non-Final OA | Jun 12, 2023 |
| 18331305 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | MIHALIOV, DMITRI | 2812 | Non-Final OA | Jun 08, 2023 |
| 18330492 | VOLTAGE SUPPLY SELECTION CIRCUIT | CHEN, SIBIN | 2896 | Non-Final OA | Jun 07, 2023 |
| 18330229 | FIELD EFFECT TRANSISTOR WITH STRAINED CHANNELS AND METHOD | DUREN, TIMOTHY EDWARD | 2817 | Final Rejection | Jun 06, 2023 |
| 18329472 | ETCH PROFILE CONTROL OF GATE CONTACT OPENING | HOANG, TUAN A | 2898 | Non-Final OA | Jun 05, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | 2898 | Final Rejection | Jun 05, 2023 |
| 18328982 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2818 | Non-Final OA | Jun 05, 2023 |
| 18327998 | Front Side to Backside Interconnection for CFET Devices | DUREN, TIMOTHY EDWARD | 2817 | Final Rejection | Jun 02, 2023 |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | KIELIN, ERIK J | 2814 | Non-Final OA | Jun 01, 2023 |
| 18201099 | APPARATUS AND METHODS FOR HANDLING DIE CARRIERS | JARRETT, RONALD P | 3652 | Non-Final OA | May 23, 2023 |
| 18320566 | LITHOGRAPHY SYSTEM AND METHODS | ANGEBRANNDT, MARTIN J | 1737 | Non-Final OA | May 19, 2023 |
| 18319854 | Optical Devices and Methods of Manufacture | CHU, CHRIS H | 2874 | Final Rejection | May 18, 2023 |
| 18172240 | DEVICE WITH THROUGH VIA AND RELATED METHODS | SEHAR, FAKEHA | 2893 | Non-Final OA | May 17, 2023 |
| 18318985 | Integrated Circuit Packages and Methods | HUTSON, NICHOLAS LELAND | 2818 | Final Rejection | May 17, 2023 |
| 18317003 | METHOD AND SYSTEM FOR PERFORMING CHEMICAL MECHANICAL POLISHING | ZAWORSKI, JONATHAN R | 3723 | Non-Final OA | May 12, 2023 |
| 18314446 | Complementary Field Effect Transistors and Methods of Forming the Same | TURNER, BRIAN | 2818 | Final Rejection | May 09, 2023 |
| 18310925 | CROSS-LINKABLE PHOTORESIST FOR EXTREME ULTRAVIOLET LITHOGRAPHY | LEE, ALEXANDER N | 1737 | Non-Final OA | May 02, 2023 |
| 18308355 | Transistor Gate Contacts and Methods of Forming the Same | LEE, WOO KYUNG | 2815 | Non-Final OA | Apr 27, 2023 |
| 18308266 | Stealth Patterning Formation for Bonding Improvement | DUCLAIR, STEPHANIE P. | 1713 | Final Rejection | Apr 27, 2023 |
| 18303989 | STI LOSS MITIGATION BY RADICAL OXIDATION TREATMENT | NICELY, JOSEPH C | 2813 | Final Rejection | Apr 20, 2023 |
| 18302948 | NFET and PFET with Different Fin Numbers in FinFET Based CFET | BOWEN, ADAM S | 2897 | Non-Final OA | Apr 19, 2023 |
| 18302935 | Bump-on-Trace Design for Enlarge Bump-to-Trace Distance | CHI, SUBERR L | 2893 | Non-Final OA | Apr 19, 2023 |
| 18298351 | IMAGE SENSOR | JOHNSON, CHRISTOPHER A | 2899 | Non-Final OA | Apr 10, 2023 |
| 18297807 | Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices | HOANG, TUAN A | 2898 | Non-Final OA | Apr 10, 2023 |
| 18192521 | Semiconductor Packages and Methods of Forming the Same | NGUYEN, THANH T | 2893 | Non-Final OA | Mar 29, 2023 |
| 18128129 | Passive Device Dies With Measurement Structures | NGUYEN, DUY T V | 2818 | Final Rejection | Mar 29, 2023 |
| 18191702 | GATE STRUCTURE FOR SEMICONDUCTOR DEVICES | JUNGE, BRYAN R. | 2897 | Non-Final OA | Mar 28, 2023 |
| 18190370 | Semiconductor Devices and Methods of Manufacture | HAYES, MARY A | 2874 | Non-Final OA | Mar 27, 2023 |
| 18188314 | Crystallization of High-K Dielectric Layer | HOANG, TUAN A | 2898 | Non-Final OA | Mar 22, 2023 |
| 18187233 | Semiconductor Devices and Methods of Designing and Forming the Same | ANDERSON, ERIK ARTHUR | 2812 | Non-Final OA | Mar 21, 2023 |
| 18186413 | Optical Device and Method of Manufacture | ST CYR, DANIEL | 2876 | Non-Final OA | Mar 20, 2023 |
| 18181085 | SEMICONDUCTOR DEVICES WITH ASYMMETRIC SOURCE/DRAIN DESIGN | OZDEN, ILKER NMN | 2812 | Non-Final OA | Mar 09, 2023 |
| 18178229 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE | RADKOWSKI, PETER | 2874 | Non-Final OA | Mar 03, 2023 |
| 18175266 | SWITCHABLE POWER SUPPLY | TRAN, NGUYEN | 2838 | Non-Final OA | Feb 27, 2023 |
| 18113561 | NOVEL GATE FEATURE IN FINFET DEVICE | NARAGHI, ALI | 2817 | Non-Final OA | Feb 23, 2023 |
| 18167741 | SWITCHABLE SUBSTRATE FOR EXTREME ULTRAVIOLET OR E-BEAM METALLIC RESIST | LAN, YAN | 1782 | Non-Final OA | Feb 10, 2023 |
| 18163746 | CFET SRAM WITH BUTT CONNECTION ON ACTIVE AREA | RAHIM, NILUFA | 2893 | Non-Final OA | Feb 02, 2023 |
| 18156978 | INTEGRATED CIRCUIT INCLUDING EFUSE CELL | RAHIM, NILUFA | 2893 | Non-Final OA | Jan 19, 2023 |
| 18153978 | CHILLER SYSTEM WITH INTELLIGENT CONTROL | AHMED, ISTIAQUE | 2116 | Non-Final OA | Jan 12, 2023 |
| 18153661 | Optical Device and Method of Manufacture | MOONEY, MICHAEL P | 2874 | Non-Final OA | Jan 12, 2023 |
| 18153532 | Semiconductor Device and Method of Manufacture | VU, HUNG K | 2897 | Non-Final OA | Jan 12, 2023 |
| 18153116 | Photonic Package and Method of Manufacture | MANHEIM, MARC ETIENNE | 2874 | Non-Final OA | Jan 11, 2023 |
| 18152511 | Semiconductor Devices and Methods of Manufacture | HOSSAIN, MOAZZAM | 2898 | Final Rejection | Jan 10, 2023 |
| 18152314 | Water Cooling System for Semiconductor Package | HIBBERT, DANIEL JOHNATHAN | 2899 | Final Rejection | Jan 10, 2023 |
| 18152539 | Fan-Out Stacked Package and Methods of Making the Same | TRAN, TRANG Q | 2811 | Final Rejection | Jan 10, 2023 |
| 18152454 | Etch Stop Region for Semiconductor Device Substrate Thinning | NGUYEN, SOPHIA T | 2893 | Non-Final OA | Jan 10, 2023 |
| 18152502 | INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | Non-Final OA | Jan 10, 2023 |
| 18151761 | METHOD OF FORMING A NANO-FET SEMICONDUCTOR DEVICE | XU, ZHIJUN | 2818 | Non-Final OA | Jan 09, 2023 |
| 18151643 | INTEGRATED CIRCUIT PACKAGES AND METHODS | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Jan 09, 2023 |
| 18151714 | Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resulting Structures | ONUTA, TIBERIU DAN | 2814 | Final Rejection | Jan 09, 2023 |
| 18151856 | Die Structures and Methods of Forming the Same | TRAN, TRANG Q | 2811 | Non-Final OA | Jan 09, 2023 |
| 18151689 | MEMS Structure with Reduced Peeling and Methods Forming the Same | GEBREMARIAM, SAMUEL A | 2811 | Non-Final OA | Jan 09, 2023 |
| 18151061 | Well Modulation for Defect Inspection | OH, JIYOUNG | 2818 | Final Rejection | Jan 06, 2023 |
| 18150912 | SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING | PATERSON, BRIGITTE A | 2896 | Non-Final OA | Jan 06, 2023 |
| 18150525 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | ONUTA, TIBERIU DAN | 2814 | Final Rejection | Jan 05, 2023 |
| 18149935 | Semiconductor Devices and Methods of Manufacture | NGUYEN, KHIEM D | 2892 | Final Rejection | Jan 04, 2023 |
| 18149265 | Via Structures | BOULGHASSOUL, YOUNES | 2814 | Final Rejection | Jan 03, 2023 |
| 18149336 | Optical Engine Including Fiber Deflection Unit and Method Forming the Same | PATEL, PREET BAKUL | 2874 | Final Rejection | Jan 03, 2023 |
| 17929180 | Dielectric Blocking Layer and Method Forming the Same | RAMOS-DIAZ, FERNANDO JOSE | 2818 | Final Rejection | Sep 01, 2022 |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ENAD, CHRISTINE A | 2811 | Final Rejection | Aug 26, 2022 |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Non-Final OA | Aug 19, 2022 |
| 17819381 | Semiconductor Device and Method of Manufacture | ISAAC, STANETTA D | 2898 | Non-Final OA | Aug 12, 2022 |
| 17884636 | PMOSFET SOURCE DRAIN | NARAGHI, ALI | 2817 | Non-Final OA | Aug 10, 2022 |
| 17818785 | Semiconductor Device and Method | KOO, LAMONT B | 2813 | Non-Final OA | Aug 10, 2022 |
| 17818640 | Semiconductor Structure with Pull-in Planarization Layer and Method Forming the Same | WHALEN, DANIEL B | 2893 | Non-Final OA | Aug 09, 2022 |
| 17882817 | HIGH VOLTAGE DEVICE | WILCZEWSKI, MARY A | 2898 | Final Rejection | Aug 08, 2022 |
| 17818230 | EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Aug 08, 2022 |
| 17883128 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE | KLUNK, MARGARET D | 1716 | Non-Final OA | Aug 08, 2022 |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | OH, JIYOUNG | 2818 | Non-Final OA | Aug 02, 2022 |
| 17879556 | ISOLATION STRUCTURES IN IMAGE SENSORS | TRAN, TAN N | 2812 | Non-Final OA | Aug 02, 2022 |
| 17876779 | MULTI-TIP OPTICAL COUPLING DEVICES | MOONEY, MICHAEL P | 2874 | Non-Final OA | Jul 29, 2022 |
| 17876438 | APPARATUS AND METHODS FOR EFFECTIVE IMPURITY GETTERING | GRAY, AARON J | 2897 | Non-Final OA | Jul 28, 2022 |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 2817 | Final Rejection | Jul 27, 2022 |
| 17875199 | SOIC CHIP ARCHITECTURE | PATERSON, BRIGITTE A | 2896 | Final Rejection | Jul 27, 2022 |
| 17815088 | Semiconductor Package and Method | OH, JIYOUNG | 2818 | Non-Final OA | Jul 26, 2022 |
| 17814995 | Sensor Package and Method | GOODWIN, DAVID J | 2817 | Non-Final OA | Jul 26, 2022 |
| 17815078 | Semiconductor Device and Method of Manufacturing the Same | KEAGY, ROSE ALYSSA | 2818 | Non-Final OA | Jul 26, 2022 |
| 17872750 | Semiconductor Package and Method of Manufacturing the Same | GOODWIN, DAVID J | 2817 | Non-Final OA | Jul 25, 2022 |
| 17814725 | Semiconductor Device and Method | WILCZEWSKI, MARY A | 2898 | Final Rejection | Jul 25, 2022 |
| 17872439 | Semiconductor Device With Facet S/D Feature And Methods Of Forming The Same | NARAGHI, ALI | 2817 | Non-Final OA | Jul 25, 2022 |
| 17872945 | SYSTEM AND METHOD FOR MONITORING AND PERFORMING THIN FILM DEPOSITION | KURPLE, KARL | 1717 | Final Rejection | Jul 25, 2022 |
| 17871890 | IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME | NARAGHI, ALI | 2817 | Non-Final OA | Jul 22, 2022 |
| 17870251 | SLURRY RECYCLING FOR CHEMICAL MECHANICAL POLISHING SYSTEM | KEYWORTH, PETER | 1777 | Non-Final OA | Jul 21, 2022 |
| 17870423 | Fan-Out Packages and Methods of Forming the Same | TURNER, BRIAN | 2818 | Non-Final OA | Jul 21, 2022 |
| 17869558 | Dual Dopant Source/Drain Regions and Methods of Forming Same | WILCZEWSKI, MARY A | 2898 | Non-Final OA | Jul 20, 2022 |
| 17868635 | Methods Of Forming Metal Gate Spacer | CULBERT, CHRISTOPHER A | 2815 | Final Rejection | Jul 19, 2022 |
| 17861052 | COMPLEMENTARY FET (CFET) DEVICES AND METHODS | PARK, SAMUEL | 2818 | Non-Final OA | Jul 08, 2022 |
| 17858970 | DOPANT PROFILE CONTROL IN GATE STRUCTURES FOR SEMICONDUCTOR DEVICES | NEWTON, VALERIE N | 2897 | Non-Final OA | Jul 06, 2022 |
| 17809912 | Chemical Composition for Tri-Layer Removal | PHAM, THOMAS T | 1713 | Final Rejection | Jun 30, 2022 |
| 17809039 | SEMICONDUCTOR PACKAGE AND METHOD | KOLB, THADDEUS J | 2817 | Final Rejection | Jun 27, 2022 |
| 17848875 | METHOD FOR ISOLATION STRUCTURE FORMATION WITH RECESSED SOURCE/DRAIN EPITAXY STRUCTURES | CHIU, TSZ K | 2898 | Final Rejection | Jun 24, 2022 |
| 17844476 | PACKAGE WITH PERMALLOY CORE INDUCTOR AND MANUFACTURING METHOD THEREOF | KHALIFA, MOATAZ | 2817 | Non-Final OA | Jun 20, 2022 |
| 17840362 | Molding Structures for Integrated Circuit Packages and Methods of Forming the Same | WARD, DAVID WILLIAM | 2891 | Non-Final OA | Jun 14, 2022 |
| 17806329 | Packages Including Interconnect Die Embedded in Package Substrates | KIELIN, ERIK J | 2814 | Non-Final OA | Jun 10, 2022 |
| 17836628 | FIN PROFILE MODULATION | STEPHENSON, KENNETH STEPHEN | 2898 | Final Rejection | Jun 09, 2022 |
| 17834606 | INTEGRATED CIRCUIT (IC) DESIGN METHODS USING PROCESS FRIENDLY CELL ARCHITECTURES | TAT, BINH C | 2851 | Final Rejection | Jun 07, 2022 |
| 17805034 | Metal Pillars Preventing Wetting on Sidewalls and Method Forming Same | HRNJIC, ADIN | 2817 | Non-Final OA | Jun 02, 2022 |
| 17750145 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | TUROCY, DAVID P | 1718 | Final Rejection | May 20, 2022 |
| 17750148 | SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT | TALBOT, BRIAN K | 1712 | Non-Final OA | May 20, 2022 |
| 17663278 | SEMICONDUCTOR DEVICE AND METHOD | WARD, DAVID WILLIAM | 2891 | Final Rejection | May 13, 2022 |
| 17742943 | Transistor Isolation Regions and Methods of Forming the Same | WARD, DAVID WILLIAM | 2891 | Final Rejection | May 12, 2022 |
| 17740618 | Semiconductor Devices and Methods of Manufacture | STARK, JARRETT J | 2898 | Final Rejection | May 10, 2022 |
| 17738293 | Radiation Control in Semiconductor Processing | REVERMAN, CHAD ANDREW | 2877 | Non-Final OA | May 06, 2022 |
| 17717731 | METHOD OF FORMING A SEMICONDUCTOR DEVICE HAVING A LOWER CONDUCTIVE LAYER OF A MULTI-LAYERED STRUCTURE BEING PLASMA TREATED BEFORE FORMING A SECOND CONDUCTIVE LAYER | MAI, ANH D | 2893 | Non-Final OA | Apr 11, 2022 |
| 17713014 | Semiconductor Device and Method of Forming the Same | CHEEK, EDWARD RHETT | 2813 | Final Rejection | Apr 04, 2022 |
| 17705804 | Semiconductor Devices and Methods of Formation | NARAGHI, ALI | 2817 | Non-Final OA | Mar 28, 2022 |
| 17703700 | METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION | CAZAN, LIVIUS RADU | 3729 | Non-Final OA | Mar 24, 2022 |
| 17655637 | DOPED WELL FOR SEMICONDUCTOR DEVICES | KARIMY, TIMOR | 2818 | Final Rejection | Mar 21, 2022 |
| 17654886 | FILM DEPOSITION AND TREATMENT PROCESS FOR SEMICONDUCTOR DEVICES | PRASAD, NEIL R | 2897 | Final Rejection | Mar 15, 2022 |
| 17654627 | SEMICONDUCTOR DEVICE AND METHOD | NETTLES, CORALIE ANN | 2893 | Non-Final OA | Mar 14, 2022 |
| 17675558 | Methods of Manufacturing Semiconductor Devices | NGUYEN, DUY T V | 2818 | Non-Final OA | Feb 18, 2022 |
| 17651329 | Oxygen-Free Protection Layer Formation in Wafer Bonding Process | CULLEN, PATRICK LAWRENCE | 2899 | Final Rejection | Feb 16, 2022 |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | Non-Final OA | Feb 15, 2022 |
| 17648431 | Atomic Layer Etching to Reduce Pattern Loading in High-K Dielectric Layer | STEVENSON, ANDRE C | 2899 | Non-Final OA | Jan 20, 2022 |
| 17457728 | Hybrid Dielectric Scheme in Packages | MAIGA, SIDI MOHAMED | 2847 | Non-Final OA | Dec 06, 2021 |
| 17476418 | FIELD EFFECT TRANSISTOR AND METHOD | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Sep 15, 2021 |
| 17396948 | Semiconductor Device and Method | TRAN, DZUNG | 2893 | Final Rejection | Aug 09, 2021 |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 2898 | Non-Final OA | Jul 22, 2021 |
| 17374811 | ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION | RAHMAN, MOIN M | 2898 | Final Rejection | Jul 13, 2021 |
| 17352133 | DEPOSITION SYSTEM AND METHOD | KURPLE, KARL | 1717 | Final Rejection | Jun 18, 2021 |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | WOLDEGEORGIS, ERMIAS T | 2893 | Non-Final OA | Jun 04, 2021 |
| 17318810 | GATE BASED RESISTANCE CONTROL UNITS | MCINTOSH, ANDREW T | 2144 | Non-Final OA | May 12, 2021 |
| 17317968 | MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUTIONS FOR CMP | HUANG, STEVEN | 3723 | Final Rejection | May 12, 2021 |
| 17215555 | Chip on Package Structure and Method | MIYOSHI, JESSE Y | 2898 | Final Rejection | Mar 29, 2021 |
| 17107420 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | Non-Final OA | Nov 30, 2020 |
| 17068375 | System and Method of Chemical Mechanical Polishing | POON, DANA LEE | 3723 | Final Rejection | Oct 12, 2020 |
| 17001446 | Metal Contacts on Metal Gates and Methods Thereof | CULBERT, CHRISTOPHER A | 2815 | Non-Final OA | Aug 24, 2020 |
| 16655156 | CONDUCTIVE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | Non-Final OA | Oct 16, 2019 |
| 16585859 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | Final Rejection | Sep 27, 2019 |
| 16283838 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | Non-Final OA | Feb 25, 2019 |
| 15057734 | THERMOELECTRIC GENERATOR | TRINH, THANH TRUC | 1726 | Non-Final OA | Mar 01, 2016 |
IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial