Prosecution Insights
Prosecution Insights
218 pending office actions • 50 art units • 161 examiners • 0 of 218 (0%) have an AI response strategy ready • 1,041 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 216 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 216 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 2 (1%) |
| §103 only | 168 (77%) |
| §102 only | 17 (8%) |
| §112 only | 12 (6%) |
| Double-patenting + other | 2 (1%) |
| No statute on record | 17 (8%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ENAD, CHRISTINE A | 5 | 84.2% | +10.2% |
| NARAGHI, ALI | 5 | 86.3% | +5.5% |
| KOO, LAMONT B | 4 | 80.5% | +4.9% |
| WILCZEWSKI, MARY A | 4 | 85.0% | +9.9% |
| RIDDLE, CHRISTINA A | 3 | 80.8% | +13.7% |
| CULBERT, CHRISTOPHER A | 3 | 41.5% | +4.9% |
| TRAN, TAN N | 3 | 86.6% | +10.1% |
| RAMOS-DIAZ, FERNANDO JOSE | 3 | 91.7% | -16.7% |
| BOULGHASSOUL, YOUNES | 3 | 88.3% | +7.3% |
| BEARDSLEY, JONAS TYLER | 3 | 59.1% | +30.2% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 66d overdue |
| 17818785 | Semiconductor Device and Method | KOO, LAMONT B | 46d overdue |
| 18781567 | SYSTEM AND METHOD FOR MONITORING AND CONTROLLING EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY PROCESSES | RIDDLE, CHRISTINA A | 36d overdue |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 31d overdue |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | ENAD, CHRISTINE A | 24d overdue |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | ENAD, CHRISTINE A | 18d overdue |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | TRAN, TAN N | 17d overdue |
| 18328982 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 15d overdue |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18783178 | SYSTEM AND METHOD FOR CLEANING AN EUV MASK | RIDDLE, CHRISTINA A | 8d overdue |
| 17860228 | USING REDUCED READ ENERGY BASED ON THE PARTIAL-SUM | GUDAS, JAKOB OSCAR | 70d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18781567 | SYSTEM AND METHOD FOR MONITORING AND CONTROLLING EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY PROCESSES | RIDDLE, CHRISTINA A | 36d overdue |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | ENAD, CHRISTINE A | 24d overdue |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | ENAD, CHRISTINE A | 18d overdue |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | TRAN, TAN N | 17d overdue |
| 17476418 | FIELD EFFECT TRANSISTOR AND METHOD | BEARDSLEY, JONAS TYLER | 15d overdue |
| 18783178 | SYSTEM AND METHOD FOR CLEANING AN EUV MASK | RIDDLE, CHRISTINA A | 8d overdue |
| 18781721 | SYSTEM AND METHOD FOR DETECTING DEBRIS IN A PHOTOLITHOGRAPHY SYSTEM | RIDDLE, CHRISTINA A | 8d overdue |
| 18410329 | VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS | TRAN, TAN N | 22d |
| Art Unit | Apps |
|---|---|
| 2898 | 19 |
| 2817 | 18 |
| 2893 | 18 |
| 2818 | 15 |
| 2811 | 14 |
| 2812 | 12 |
| 2897 | 12 |
| 2899 | 11 |
| 2814 | 11 |
| 2874 | 9 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19022869 | SEMICONDUCTOR WAFER STORAGE DEVICE | GEHMAN, BRYON P | 3736 | Other | Non-Final OA | 4d overdue | Pending | Jan 15, 2025 |
| 18935100 | SYSTEM AND METHOD FOR WAFER MANUFACTURING PROCESS MANAGEMENT | PATTON, SPENCER D | 3656 | §103 | Non-Final OA | 12d | Pending | Nov 01, 2024 |
| 18790426 | STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE | BUI, THA-O H | 2825 | §103 | Non-Final OA | 2d overdue | Pending | Jul 31, 2024 |
| 18790969 | APPARATUS AND METHODS FOR CLEANING A PACKAGE | KO, JASON Y | 1711 | Other | Non-Final OA | 9d overdue | Pending | Jul 31, 2024 |
| 18790296 | METHOD AND APPARATUS FOR LOGIC CELL-BASED PUF GENERATORS | JOHNSON, AMY COHEN | 2400 | Other | Non-Final OA | 7d | Pending | Jul 31, 2024 |
| 18788717 | DEPOSITION APPARATUS AND METHOD WITH EM RADIATION | TUROCY, DAVID P | 1718 | §103 | Non-Final OA | 2d overdue | Pending | Jul 30, 2024 |
| 18789253 | DEPOSITION SYSTEM AND METHOD | OTT, PATRICK S | 1794 | §103 | Non-Final OA | 77d | Pending | Jul 30, 2024 |
| 18787934 | VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING | MOORE, KARLA A | 1716 | Other | Non-Final OA | 8d overdue | Pending | Jul 29, 2024 |
| 18785067 | BONDING SYSTEM AND METHOD FOR USING THE SAME | WRIGHT, ALEXANDER SCOTT | 1745 | §103 | Non-Final OA | 40d | Pending | Jul 26, 2024 |
| 18784608 | SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION | PHAM, THOMAS T | 1713 | §103 | Non-Final OA | 43d overdue | Pending | Jul 25, 2024 |
| 18782988 | IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING | CHEN, CHIA WEI A | 2637 | §103 | Non-Final OA | 8d overdue | Pending | Jul 24, 2024 |
| 18783178 | SYSTEM AND METHOD FOR CLEANING AN EUV MASK | RIDDLE, CHRISTINA A | 2882 | §101 | Non-Final OA | 8d overdue | Pending | Jul 24, 2024 |
| 18781567 | SYSTEM AND METHOD FOR MONITORING AND CONTROLLING EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY PROCESSES | RIDDLE, CHRISTINA A | 2882 | §112 | Non-Final OA | 36d overdue | Pending | Jul 23, 2024 |
| 18781018 | Metal Contacts on Metal Gates and Methods Thereof | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | 36d overdue | Pending | Jul 23, 2024 |
| 18781721 | SYSTEM AND METHOD FOR DETECTING DEBRIS IN A PHOTOLITHOGRAPHY SYSTEM | RIDDLE, CHRISTINA A | 2882 | §103 | Non-Final OA | 8d overdue | Pending | Jul 23, 2024 |
| 18770552 | ELECTRICAL PASSIVE ELEMENTS OF AN ESD POWER CLAMP IN A BACKSIDE BACK END OF LINE (B-BEOL) PROCESS | PATEL, DHARTI HARIDAS | 2838 | §102 | Non-Final OA | 12d | Pending | Jul 11, 2024 |
| 18767843 | METHOD AND APPARATUS FOR PUF GENERATOR CHARACTERIZATION | FAROOQUI, QUAZI | 2491 | Other | Non-Final OA | 46d overdue | Pending | Jul 09, 2024 |
| 18767858 | CIRCUITS AND METHODS FOR COMPENSATING A MISMATCH IN A SENSE AMPLIFIER | BEGUM, SULTANA | 2824 | §103 | Non-Final OA | 59d overdue | Pending | Jul 09, 2024 |
| 18757659 | SEMICONDUCTOR STRUCTURE HAVING BOTH GATE-ALL-AROUND DEVICES AND PLANAR DEVICES | GEBREMARIAM, SAMUEL A | 2811 | §112 | Non-Final OA | 19d overdue | Pending | Jun 28, 2024 |
| 18759649 | FIELD EFFECT TRANSISTOR WITH INNER SPACER LINER LAYER AND METHOD | OJEH, NDUKA E | 2892 | DPOther | Non-Final OA | 61d | Pending | Jun 28, 2024 |
| 18751423 | SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE | LUND, JEFFRIE ROBERT | 1716 | Other | Non-Final OA | 34d | Pending | Jun 24, 2024 |
| 18737457 | HANDLER WITH COOLING HEAD AND DOUBLE-SIDED FIN STRUCTURE | AURORA, REENA | 2858 | §112 | Non-Final OA | 43d overdue | Pending | Jun 07, 2024 |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | TRAN, TAN N | 2812 | §103 | Non-Final OA | 17d overdue | Pending | May 30, 2024 |
| 18679091 | A STRUCTURE COMPRISING A RECONSTRUCTED PACKAGE SUBSTRATE INCLUDING AN ENCAPSULATED SUBSTRATE BLOCK | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | 17d overdue | Pending | May 30, 2024 |
| 18674351 | COIL STRUCTURE AND METHOD OF MAKING SAME | MOURAD, RASEM | 2836 | §103 | Non-Final OA | 14d | Pending | May 24, 2024 |
| 18655568 | MEMORY DEVICES WITH GATE ALL AROUND TRANSISTORS | TRAN, ANTHAN | 2825 | §103 | Non-Final OA | 36d overdue | Pending | May 06, 2024 |
| 18654268 | Structure and Method of Forming a Joint Assembly | RAMPERSAUD, PRIYA M | 2897 | §103 | Non-Final OA | 66d overdue | Pending | May 03, 2024 |
| 18646469 | CMOS IMAGE SENSOR STRUCTURE | CHAN, CANDICE | 2813 | §103 | Non-Final OA | 25d overdue | Pending | Apr 25, 2024 |
| 18616604 | CONNECTOR FOR OPTICAL FIBER ALIGNMENT | PEACE, RHONDA S | 2874 | §103 | Non-Final OA | 6d | Pending | Mar 26, 2024 |
| 18615403 | GATE STRUCTURE AND PATTERNING METHOD | OH, JAEHWAN | 2899 | §103 | Non-Final OA | 48d | Pending | Mar 25, 2024 |
| 18582240 | SELF-ALIGNED METHOD FOR FORMING AN OPTICAL MODULATOR | ENDRESEN, KIRSTEN DANIELA | 2874 | §103 | Non-Final OA | 15d | Pending | Feb 20, 2024 |
| 18437960 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | CAPUTO, LISA M | 2874 | §102 | Non-Final OA | 40d | Pending | Feb 09, 2024 |
| 18431187 | PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | 26d | Pending | Feb 02, 2024 |
| 18415770 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | §103 | Non-Final OA | 21d | Pending | Jan 18, 2024 |
| 18415092 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | 45d overdue | Pending | Jan 17, 2024 |
| 18410329 | VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS | TRAN, TAN N | 2812 | §103 | Non-Final OA | 22d | Pending | Jan 11, 2024 |
| 18402944 | ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES | GREER, RIANNA BLISS | 2814 | §103 | Non-Final OA | 28d | Pending | Jan 03, 2024 |
| 18402061 | System on Integrated Chips (SoIC) and Semiconductor Structures with Integrated SoIC | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | 15d overdue | Pending | Jan 02, 2024 |
| 18402065 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | PEACE, RHONDA S | 2874 | §103 | Final Rejection | 62d | Pending | Jan 02, 2024 |
| 18401851 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | WONG, TINA MEI SENG | 2874 | §103 | Non-Final OA | 34d | Pending | Jan 02, 2024 |
| 18532787 | SMART WAFER TRANSPORT CASE WITH SENSOR SYSTEM | EL-BATHY, IBRAHIM N | 3628 | §103 | Non-Final OA | 45d overdue | Pending | Dec 07, 2023 |
| 18530102 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §103 | Non-Final OA | 9d | Pending | Dec 05, 2023 |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 24d overdue | Pending | Dec 01, 2023 |
| 18524627 | FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | FAN, SU JYA | 2818 | §103 | Non-Final OA | 26d overdue | Pending | Nov 30, 2023 |
| 18524386 | MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF | CIESLEWICZ, ANETA B | 2893 | §103 | Non-Final OA | 5d | Pending | Nov 30, 2023 |
| 18521726 | ADJUSTABLE NOZZLE DEVICE | TADESSE, YEWEBDAR T | 1717 | §103 | Non-Final OA | 1d overdue | Pending | Nov 28, 2023 |
| 18520414 | SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME | CHA, GRACE YEH-EUN SAET | 2897 | §103 | Non-Final OA | 70d | Pending | Nov 27, 2023 |
| 18518081 | Metal Contact Structure and Method of Forming the Same in a Semiconductor Device | PIZARRO CRESPO, MARCOS D | 2814 | Other | Non-Final OA | 14d | Pending | Nov 22, 2023 |
| 18516431 | CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES | HUNTER III, CARNELL | 2893 | §112 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | ANDERSON, WILLIAM H | 2817 | §103 | Non-Final OA | 71d | Pending | Nov 20, 2023 |
| 18512194 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE | NGUYEN, NIKI HOANG | 2818 | §103 | Non-Final OA | 28d | Pending | Nov 17, 2023 |
| 18513116 | STRESS LINERS IN SEMICONDUCTOR DEVICES | VU, HUNG K | 2897 | §103 | Non-Final OA | 41d | Pending | Nov 17, 2023 |
| 18510091 | METHOD OF FORMING SEMICONDUCTOR DEVICE | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | 45d overdue | Pending | Nov 15, 2023 |
| 18507726 | Semiconductor Package With Thermal Conductive Structure and the Methods of Forming the Same | HARRISTON, WILLIAM A | 2899 | Other | Non-Final OA | 44d overdue | Pending | Nov 13, 2023 |
| 18504714 | CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS | JEFFERSON, QUOVAUNDA | 2899 | Other | Non-Final OA | 49d overdue | Pending | Nov 08, 2023 |
| 18502485 | ANTI-PLASMA COATING | GRUSBY, REBECCA LYNN | 1785 | §103 | Non-Final OA | 5d | Pending | Nov 06, 2023 |
| 18499908 | FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD | ANDERSON, WILLIAM H | 2817 | §103 | Non-Final OA | 23d | Pending | Nov 01, 2023 |
| 18490363 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | NGUYEN, CUONG B | 2818 | §103 | Non-Final OA | 22d | Pending | Oct 19, 2023 |
| 18490014 | PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | 27d | Pending | Oct 19, 2023 |
| 18489367 | SEMICONDUCTOR DEVICE ISOLATION OF CONTACT AND SOURCE/DRAIN STRUCTURES | KUSUMAKAR, KAREN M | 2897 | §102 | Non-Final OA | 41d | Pending | Oct 18, 2023 |
| 18486322 | PIXEL SENSORS AND METHODS OF MANUFACTURING THE SAME | KAO, SOPHIA WEI-CHUN | 2817 | §103 | Non-Final OA | 41d | Pending | Oct 13, 2023 |
| 18482954 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | SUN, YU-HSI DAVID | 2817 | §102 | Non-Final OA | 12d | Pending | Oct 09, 2023 |
| 18476619 | SELECTIVE BOTTOM SEED LAYER FORMATION FOR BOTTOM-UP EPITAXY | MUNOZ, ANDRES F | 2818 | §103 | Non-Final OA | 29d | Pending | Sep 28, 2023 |
| 18476591 | DIE STRUCTURES AND METHODS OF FORMING THE SAME | TRAPANESE, WILLIAM C | 2812 | §102 | Non-Final OA | 20d | Pending | Sep 28, 2023 |
| 18475782 | Middle Dielectric Isolation in Complementary Field-Effect Transistor Devices | ASHBAHIAN, ERIC K | 2891 | §103 | Non-Final OA | 20d | Pending | Sep 27, 2023 |
| 18471739 | Integrated Circuit Packages and Methods of Forming the Same | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 36d | Pending | Sep 21, 2023 |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | 10d overdue | Pending | Sep 12, 2023 |
| 18463596 | BACKSIDE GATE CONTACT, BACKSIDE GATE ETCH STOP LAYER, AND METHODS OF FORMING SAME | GREAVING, JASON JAMES | 2893 | §103 | Non-Final OA | 5d overdue | Pending | Sep 08, 2023 |
| 18463466 | CHANNEL REGIONS IN STACKED TRANSISTORS AND METHODS OF FORMING THE SAME | HARRISON, MONICA D | 2815 | §102 | Non-Final OA | 37d overdue | Pending | Sep 08, 2023 |
| 18459171 | INTEGRATED CIRCUIT PACKAGE AND METHOD | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | §103 | Non-Final OA | 45d overdue | Pending | Aug 31, 2023 |
| 18240065 | SEMICONDUCTOR PACKAGE AND METHOD | PARENDO, KEVIN A | 2896 | §103 | Non-Final OA | 31d overdue | Pending | Aug 30, 2023 |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | BOULGHASSOUL, YOUNES | 2814 | §102 | Non-Final OA | 1d overdue | Pending | Aug 29, 2023 |
| 18239283 | CONTACTS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | CHI, SUBERR L | 2893 | §112 | Non-Final OA | 39d | Pending | Aug 29, 2023 |
| 18455857 | PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF | BAIG, ANEESA RIAZ | 2814 | §103 | Non-Final OA | 38d overdue | Pending | Aug 25, 2023 |
| 18451984 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | WONG, ERIC K | 2874 | §103 | Non-Final OA | 43d overdue | Pending | Aug 18, 2023 |
| 18451269 | STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD | MAZUMDER, DIDARUL A | 2812 | §103 | Non-Final OA | 8d overdue | Pending | Aug 17, 2023 |
| 18232718 | Contact Structure For Semiconductor Device | AU, BAC H | 2898 | §103 | Non-Final OA | 12d | Pending | Aug 10, 2023 |
| 18232713 | Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via | SYLVIA, CHRISTINA A | 2817 | §102 | Non-Final OA | 58d overdue | Pending | Aug 10, 2023 |
| 18232719 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103 | Final Rejection | 146d overdue | Pending | Aug 10, 2023 |
| 18446564 | Deposition Apparatus and Method with EM Radiation | MILLER, JR, JOSEPH ALBERT | 1712 | §103 | Final Rejection | 34d | Pending | Aug 09, 2023 |
| 18446918 | SEMICONDUCTOR DEVICE AND METHOD WITH WORK FUNCTION TUNING LAYERS | XU, ZHIJUN | 2818 | §103 | Final Rejection | 84d | Pending | Aug 09, 2023 |
| 18446753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | LI, MEIYA | 2811 | Other | Non-Final OA | 17d overdue | Pending | Aug 09, 2023 |
| 18446858 | WAFER DRYING SYSTEM | YUEN, JESSICA JIPING | 3762 | §103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18366771 | Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same | KLEIN, JORDAN M | 2893 | §103 | Non-Final OA | 14d | Pending | Aug 08, 2023 |
| 18366255 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | FERNANDES, ERROL V | 2893 | §103 | Non-Final OA | 13d | Pending | Aug 07, 2023 |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 2813 | §103 | Non-Final OA | 66d overdue | Pending | Aug 07, 2023 |
| 18365068 | Memory Array and Methods of Forming Same | LI, MEIYA | 2811 | Other | Non-Final OA | 28d overdue | Pending | Aug 03, 2023 |
| 18365050 | OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE | MOONEY, MICHAEL P | 2874 | §103 | Non-Final OA | 2d overdue | Pending | Aug 03, 2023 |
| 18363096 | INTEGRATED CIRCUIT PACKAGE AND METHOD | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | 35d overdue | Pending | Aug 01, 2023 |
| 18228333 | Micro-Electro-Mechanical System (MEMS) Thermal Sensor | JOHNSON, CHRISTOPHER A | 2899 | §102 | Non-Final OA | 23d | Pending | Jul 31, 2023 |
| 18362835 | MAGNETIC TUNNEL JUNCTION STRUCTURES AND RELATED METHODS | BEARDSLEY, JONAS TYLER | 2811 | §103 | Non-Final OA | 41d | Pending | Jul 31, 2023 |
| 18362649 | System Formed Through Package-In-Package Formation | SHAMSUZZAMAN, MOHAMMED | 2897 | §103 | Non-Final OA | 8d overdue | Pending | Jul 31, 2023 |
| 18362266 | CONTROLLED DOPING IN A GATE DIELECTRIC LAYER | HOANG, TUAN A | 2898 | §112 | Final Rejection | 2d overdue | Pending | Jul 31, 2023 |
| 18361832 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | §103 | Non-Final OA | 33d | Pending | Jul 29, 2023 |
| 18361569 | BENT FIN DEVICES | KOO, LAMONT B | 2813 | §103 | Non-Final OA | 10d overdue | Pending | Jul 28, 2023 |
| 18360447 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING | NETTLES, CORALIE ANN | 2893 | §103 | Non-Final OA | 23d overdue | Pending | Jul 27, 2023 |
| 18358634 | Integrated Circuits Having Protruding Interconnect Conductors | GEYER, SCOTT B | 2812 | Other | Non-Final OA | 12d | Pending | Jul 25, 2023 |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 18d overdue | Pending | Jul 19, 2023 |
| 18352556 | MATERIALS AND METHODS FOR FORMING RESIST BOTTOM LAYER | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | 40d | Pending | Jul 14, 2023 |
| 18352055 | DEVICE HAVING MULTIPHASE DIELECTRIC LAYER AND METHOD | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 40d | Pending | Jul 13, 2023 |
| 18221160 | Methods Of Forming Contact Structure In Semiconductor Devices | MCCUTCHEON, COLIN RUSSELL | 2892 | §103 | Non-Final OA | 10d overdue | Pending | Jul 12, 2023 |
| 18350429 | SEMICONDUCTOR DEVICES WITH IMPROVED GATE CONTROL | HOANG, TUAN A | 2898 | §103 | Non-Final OA | 61d | Pending | Jul 11, 2023 |
| 18348967 | Cut Metal Gate Refill With Buffer Layer | WELLINGTON, ANDREA L | 2800 | §103 | Non-Final OA | 42d overdue | Pending | Jul 07, 2023 |
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 56d overdue | Pending | Jul 07, 2023 |
| 18344635 | CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME | KOCH, GEORGE R | 1745 | §103 | Non-Final OA | 14d | Pending | Jun 29, 2023 |
| 18344615 | SEMICONDUCTOR DEVICE | BEARDSLEY, JONAS TYLER | 2811 | §103 | Final Rejection | 84d | Pending | Jun 29, 2023 |
| 18343680 | DEVICE HAVING HYBRID NANOSHEET STRUCTURE AND METHOD | DAS, PINAKI | 2898 | §103 | Non-Final OA | 30d | Pending | Jun 28, 2023 |
| 18341897 | SEMICONDUCTOR PACKAGE AND METHOD | MAZUMDER, DIDARUL A | 2812 | §103 | Non-Final OA | 17d overdue | Pending | Jun 27, 2023 |
| 18339672 | DYNAMIC EXHAUST FOR CHEMICAL PROCESSING | MALLON, BRETT PETERSON | 3762 | §103 | Final Rejection | 8d overdue | Pending | Jun 22, 2023 |
| 18335852 | PHOTO LIGAND DESIGN FOR EUV OR E-BEAM METALLIC PHOTORESISTS | CHU, JOHN S Y | 1737 | §103 | Non-Final OA | 49d overdue | Pending | Jun 15, 2023 |
| 18335741 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | PIZARRO CRESPO, MARCOS D | 2814 | §102 | Non-Final OA | 36d overdue | Pending | Jun 15, 2023 |
| 18334695 | Integrated Circuit Package and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | 14d | Pending | Jun 14, 2023 |
| 18333197 | SRAM CELL WITH BALANCED WRITE PORT | JUNGE, BRYAN R. | 2897 | §102 | Non-Final OA | 40d | Pending | Jun 12, 2023 |
| 18331305 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | MIHALIOV, DMITRI | 2812 | §103 | Non-Final OA | 10d overdue | Pending | Jun 08, 2023 |
| 18330492 | VOLTAGE SUPPLY SELECTION CIRCUIT | CHEN, SIBIN | 2896 | Other | Non-Final OA | 31d overdue | Pending | Jun 07, 2023 |
| 18330229 | FIELD EFFECT TRANSISTOR WITH STRAINED CHANNELS AND METHOD | DUREN, TIMOTHY EDWARD | 2817 | §103 | Final Rejection | 27d | Pending | Jun 06, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 13d | Pending | Jun 05, 2023 |
| 18328982 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §103 | Non-Final OA | 15d overdue | Pending | Jun 05, 2023 |
| 18328502 | CRYSTALLIZATION TEMPERATURE REDUCTION OF HIGH-K DIELECTRIC LAYER | SARKER-NAG, AKHEE | 2893 | §103 | Non-Final OA | 38d overdue | Pending | Jun 02, 2023 |
| 18328207 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | OZDEN, ILKER NMN | 2812 | §103 | Final Rejection | 34d | Pending | Jun 02, 2023 |
| 18328656 | ETCHING APPARATUS AND METHOD | KACKAR, RAM N | 1716 | §103 | Non-Final OA | 70d | Pending | Jun 02, 2023 |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | KIELIN, ERIK J | 2814 | §112 | Non-Final OA | 17d overdue | Pending | Jun 01, 2023 |
| 18324036 | HEAT DISSIPATION IN SEMICONDUCTOR DEVICES | GREEN, TELLY D | 2898 | §103 | Non-Final OA | 61d | Pending | May 25, 2023 |
| 18201099 | APPARATUS AND METHODS FOR HANDLING DIE CARRIERS | JARRETT, RONALD P | 3652 | Other | Non-Final OA | 33d | Pending | May 23, 2023 |
| 18317003 | METHOD AND SYSTEM FOR PERFORMING CHEMICAL MECHANICAL POLISHING | ZAWORSKI, JONATHAN R | 3723 | §103 | Non-Final OA | 52d overdue | Pending | May 12, 2023 |
| 18314356 | Bond Films for Reduced Thermal Resistance and Methods Forming the Same | DULKA, JOHN P | 2817 | §103 | Final Rejection | 63d | Pending | May 09, 2023 |
| 18313705 | METHOD OF MODELING A MASK BY TAKING INTO ACCOUNT OF MASK PATTERN EDGE INTERACTION | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §103 | Non-Final OA | 30d | Pending | May 08, 2023 |
| 18310925 | CROSS-LINKABLE PHOTORESIST FOR EXTREME ULTRAVIOLET LITHOGRAPHY | LEE, ALEXANDER N | 1737 | §103 | Non-Final OA | 38d overdue | Pending | May 02, 2023 |
| 18297922 | Multi-Layer Inner Spacers and Methods Forming the Same | STEVENSON, ANDRE C | 2899 | §103 | Non-Final OA | 55d | Pending | Apr 10, 2023 |
| 18298351 | IMAGE SENSOR | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | 16d overdue | Pending | Apr 10, 2023 |
| 18128129 | Passive Device Dies With Measurement Structures | NGUYEN, DUY T V | 2818 | §103 | Final Rejection | 2d overdue | Pending | Mar 29, 2023 |
| 18191702 | GATE STRUCTURE FOR SEMICONDUCTOR DEVICES | JUNGE, BRYAN R. | 2897 | §103 | Non-Final OA | 60d overdue | Pending | Mar 28, 2023 |
| 18188929 | PRE-TREATMENT APPARATUS | TUROCY, DAVID P | 1718 | §103 | Non-Final OA | 46d | Pending | Mar 23, 2023 |
| 18124980 | ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES | KOO, LAMONT B | 2813 | §103 | Final Rejection | 76d | Pending | Mar 22, 2023 |
| 18188314 | Crystallization of High-K Dielectric Layer | HOANG, TUAN A | 2898 | §103 | Non-Final OA | 15d | Pending | Mar 22, 2023 |
| 18187233 | Semiconductor Devices and Methods of Designing and Forming the Same | ANDERSON, ERIK ARTHUR | 2812 | §112 | Non-Final OA | 32d overdue | Pending | Mar 21, 2023 |
| 18175266 | SWITCHABLE POWER SUPPLY | TRAN, NGUYEN | 2838 | §103 | Non-Final OA | 14d | Pending | Feb 27, 2023 |
| 18113561 | NOVEL GATE FEATURE IN FINFET DEVICE | NARAGHI, ALI | 2817 | Other | Non-Final OA | 28d overdue | Pending | Feb 23, 2023 |
| 18167741 | SWITCHABLE SUBSTRATE FOR EXTREME ULTRAVIOLET OR E-BEAM METALLIC RESIST | LAN, YAN | 1782 | §103 | Non-Final OA | 8d | Pending | Feb 10, 2023 |
| 18163746 | CFET SRAM WITH BUTT CONNECTION ON ACTIVE AREA | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | 2d overdue | Pending | Feb 02, 2023 |
| 18156978 | INTEGRATED CIRCUIT INCLUDING EFUSE CELL | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | 15d overdue | Pending | Jan 19, 2023 |
| 18153532 | Semiconductor Device and Method of Manufacture | VU, HUNG K | 2897 | §103 | Non-Final OA | 74d overdue | Pending | Jan 12, 2023 |
| 18153978 | CHILLER SYSTEM WITH INTELLIGENT CONTROL | AHMED, ISTIAQUE | 2116 | §103 | Non-Final OA | 46d overdue | Pending | Jan 12, 2023 |
| 18153116 | Photonic Package and Method of Manufacture | MANHEIM, MARC ETIENNE | 2874 | §103 | Non-Final OA | 2d overdue | Pending | Jan 11, 2023 |
| 18152511 | Semiconductor Devices and Methods of Manufacture | HOSSAIN, MOAZZAM | 2898 | §112 | Non-Final OA | 2d overdue | Pending | Jan 10, 2023 |
| 18152502 | INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | 26d overdue | Pending | Jan 10, 2023 |
| 18152409 | Defect Inspection System and Method | REVERMAN, CHAD ANDREW | 2877 | §103 | Final Rejection | 54d | Pending | Jan 10, 2023 |
| 18152314 | Water Cooling System for Semiconductor Package | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Final Rejection | 34d | Pending | Jan 10, 2023 |
| 18151643 | INTEGRATED CIRCUIT PACKAGES AND METHODS | TOBERGTE, NICHOLAS J | 2817 | §102 | Non-Final OA | 44d overdue | Pending | Jan 09, 2023 |
| 18151714 | Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resulting Structures | ONUTA, TIBERIU DAN | 2814 | §103 | Final Rejection | 2d overdue | Pending | Jan 09, 2023 |
| 18151792 | FILM MODIFICATION FOR GATE CUT PROCESS | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Final Rejection | 71d | Pending | Jan 09, 2023 |
| 18151856 | Die Structures and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | 13d | Pending | Jan 09, 2023 |
| 18150912 | SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING | PATERSON, BRIGITTE A | 2896 | §102 | Non-Final OA | 22d | Pending | Jan 06, 2023 |
| 18151222 | Integrated Circuit Packages and Methods of Forming the Same | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 46d | Pending | Jan 06, 2023 |
| 18150474 | Transistor Gate Structures and Methods of Forming the Same | CHIN, EDWARD | 2893 | §103 | Final Rejection | 54d | Pending | Jan 05, 2023 |
| 18150642 | Gate Isolation Regions and Fin Isolation Regions and Method Forming the Same | ENAD, CHRISTINE A | 2811 | §112 | Non-Final OA | 42d | Pending | Jan 05, 2023 |
| 18150034 | Packaged Memory Device and Method | GOODWIN, DAVID J | 2817 | — | Final Rejection | 171d overdue | Pending | Jan 04, 2023 |
| 18149265 | Via Structures | BOULGHASSOUL, YOUNES | 2814 | §103 | Final Rejection | 34d | Pending | Jan 03, 2023 |
| 18066762 | IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME | NARAGHI, ALI | 2817 | DPOther | Non-Final OA | 70d | Pending | Dec 15, 2022 |
| 17976313 | VERTICAL NOISE REDUCTION IN 3D STACKED SEMICONDUCTOR DEVICES | WHALEN, DANIEL B | 2893 | Other | Final Rejection | 57d | Pending | Oct 28, 2022 |
| 17929180 | Dielectric Blocking Layer and Method Forming the Same | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §103 | Final Rejection | 34d | Pending | Sep 01, 2022 |
| 17898075 | Integrated Circuit Packages and Methods of Forming the Same | GREEN, TELLY D | 2898 | §103 | Final Rejection | 61d | Pending | Aug 29, 2022 |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | 35d | Pending | Aug 26, 2022 |
| 17892344 | SEMICONDUCTOR PACKAGE AND METHOD | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | 132d overdue | Pending | Aug 22, 2022 |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 28d | Pending | Aug 19, 2022 |
| 17819381 | Semiconductor Device and Method of Manufacture | ISAAC, STANETTA D | 2898 | §103 | Non-Final OA | 295d overdue | Pending | Aug 12, 2022 |
| 17818785 | Semiconductor Device and Method | KOO, LAMONT B | 2813 | §103 | Non-Final OA | 46d overdue | Pending | Aug 10, 2022 |
| 17884636 | PMOSFET SOURCE DRAIN | NARAGHI, ALI | 2817 | §103 | Non-Final OA | 28d | Pending | Aug 10, 2022 |
| 17818230 | EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES | BOULGHASSOUL, YOUNES | 2814 | §112 | Non-Final OA | 14d | Pending | Aug 08, 2022 |
| 17883128 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE | KLUNK, MARGARET D | 1716 | §103 | Non-Final OA | 14d | Pending | Aug 08, 2022 |
| 17879556 | ISOLATION STRUCTURES IN IMAGE SENSORS | TRAN, TAN N | 2812 | §103 | Non-Final OA | 27d | Pending | Aug 02, 2022 |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 8d overdue | Pending | Aug 02, 2022 |
| 17815968 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | HSIEH, HSIN YI | 2899 | §103 | Final Rejection | 72d | Pending | Jul 29, 2022 |
| 17876779 | MULTI-TIP OPTICAL COUPLING DEVICES | MOONEY, MICHAEL P | 2874 | §103 | Non-Final OA | 42d overdue | Pending | Jul 29, 2022 |
| 17876438 | APPARATUS AND METHODS FOR EFFECTIVE IMPURITY GETTERING | GRAY, AARON J | 2897 | §103 | Non-Final OA | 31d overdue | Pending | Jul 28, 2022 |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 2817 | §103 | Final Rejection | 100d overdue | Pending | Jul 27, 2022 |
| 17875199 | SOIC CHIP ARCHITECTURE | PATERSON, BRIGITTE A | 2896 | §103 | Non-Final OA | 79d | Pending | Jul 27, 2022 |
| 17815088 | Semiconductor Package and Method | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 5d overdue | Pending | Jul 26, 2022 |
| 17872750 | Semiconductor Package and Method of Manufacturing the Same | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | 13d | Pending | Jul 25, 2022 |
| 17871890 | IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME | NARAGHI, ALI | 2817 | §103 | Final Rejection | 72d | Pending | Jul 22, 2022 |
| 17870251 | SLURRY RECYCLING FOR CHEMICAL MECHANICAL POLISHING SYSTEM | KEYWORTH, PETER | 1777 | §103 | Non-Final OA | 29d | Pending | Jul 21, 2022 |
| 17870423 | Fan-Out Packages and Methods of Forming the Same | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 19d overdue | Pending | Jul 21, 2022 |
| 17860228 | USING REDUCED READ ENERGY BASED ON THE PARTIAL-SUM | GUDAS, JAKOB OSCAR | 2151 | §101 | Non-Final OA | 70d | Pending | Jul 08, 2022 |
| 17858970 | DOPANT PROFILE CONTROL IN GATE STRUCTURES FOR SEMICONDUCTOR DEVICES | NEWTON, VALERIE N | 2897 | §103 | Non-Final OA | 111d overdue | Pending | Jul 06, 2022 |
| 17848875 | METHOD FOR ISOLATION STRUCTURE FORMATION WITH RECESSED SOURCE/DRAIN EPITAXY STRUCTURES | CHIU, TSZ K | 2898 | §103 | Final Rejection | 3d overdue | Pending | Jun 24, 2022 |
| 17840362 | Molding Structures for Integrated Circuit Packages and Methods of Forming the Same | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | 10d overdue | Pending | Jun 14, 2022 |
| 17806329 | Packages Including Interconnect Die Embedded in Package Substrates | KIELIN, ERIK J | 2814 | §102 | Non-Final OA | 71d | Pending | Jun 10, 2022 |
| 17836628 | FIN PROFILE MODULATION | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | 27d | Pending | Jun 09, 2022 |
| 17834606 | INTEGRATED CIRCUIT (IC) DESIGN METHODS USING PROCESS FRIENDLY CELL ARCHITECTURES | TAT, BINH C | 2851 | §102 | Final Rejection | 16d | Pending | Jun 07, 2022 |
| 17752730 | ON-LINE ANALYSIS SYSTEM AND METHOD FOR SPECIALTY GASSES | GZYBOWSKI, MICHAEL STANLEY | 1798 | §103 | Final Rejection | 30d | Pending | May 24, 2022 |
| 17740618 | Semiconductor Devices and Methods of Manufacture | STARK, JARRETT J | 2898 | §103 | Non-Final OA | 7d | Pending | May 10, 2022 |
| 17738293 | Radiation Control in Semiconductor Processing | REVERMAN, CHAD ANDREW | 2877 | §103 | Non-Final OA | 16d overdue | Pending | May 06, 2022 |
| 17734975 | POLYMER CROSSLINK DE-CROSSLINK PROCESSES FOR RESIST PATTERNING | CHU, JOHN S Y | 1737 | §103 | Non-Final OA | 89d overdue | Pending | May 02, 2022 |
| 17713014 | Semiconductor Device and Method of Forming the Same | CHEEK, EDWARD RHETT | 2813 | §103 | Non-Final OA | 10d overdue | Pending | Apr 04, 2022 |
| 17705804 | Semiconductor Devices and Methods of Formation | NARAGHI, ALI | 2817 | §103 | Non-Final OA | 34d | Pending | Mar 28, 2022 |
| 17654886 | FILM DEPOSITION AND TREATMENT PROCESS FOR SEMICONDUCTOR DEVICES | PRASAD, NEIL R | 2897 | §103 | Final Rejection | 14d | Pending | Mar 15, 2022 |
| 17654627 | SEMICONDUCTOR DEVICE AND METHOD | NETTLES, CORALIE ANN | 2893 | §103 | Non-Final OA | 50d overdue | Pending | Mar 14, 2022 |
| 17675558 | Methods of Manufacturing Semiconductor Devices | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | 29d | Pending | Feb 18, 2022 |
| 17651615 | Method of Forming a Semiconductor Device with a Low Dielectric Constant Dielectric Layer | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | 51d overdue | Pending | Feb 18, 2022 |
| 17651329 | Oxygen-Free Protection Layer Formation in Wafer Bonding Process | CULLEN, PATRICK LAWRENCE | 2899 | §112 | Non-Final OA | 8d | Pending | Feb 16, 2022 |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102 | Non-Final OA | 15d overdue | Pending | Feb 15, 2022 |
| 17457728 | Hybrid Dielectric Scheme in Packages | MAIGA, SIDI MOHAMED | 2847 | §103 | Non-Final OA | 17d overdue | Pending | Dec 06, 2021 |
| 17457709 | Laser-Assisted Epitaxy and Etching for Manufacturing Integrated Circuits | SONG, MATTHEW J | 1714 | §103 | Non-Final OA | 70d | Pending | Dec 06, 2021 |
| 17476418 | FIELD EFFECT TRANSISTOR AND METHOD | BEARDSLEY, JONAS TYLER | 2811 | §103 | Non-Final OA | 15d overdue | Pending | Sep 15, 2021 |
| 17396948 | Semiconductor Device and Method | TRAN, DZUNG | 2893 | §103 | Final Rejection | 33d | Pending | Aug 09, 2021 |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | 31d overdue | Pending | Jul 22, 2021 |
| 17374811 | ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION | RAHMAN, MOIN M | 2898 | §103 | Final Rejection | 28d | Pending | Jul 13, 2021 |
| 17352133 | DEPOSITION SYSTEM AND METHOD | KURPLE, KARL | 1717 | §103 | Final Rejection | 26d | Pending | Jun 18, 2021 |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | WOLDEGEORGIS, ERMIAS T | 2893 | §103 | Non-Final OA | 4d overdue | Pending | Jun 04, 2021 |
| 17232319 | SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD | SWEELY, KURT D | 1718 | §103 | Final Rejection | 50d | Pending | Apr 16, 2021 |
| 17215555 | Chip on Package Structure and Method | MIYOSHI, JESSE Y | 2898 | §103 | Final Rejection | 42d overdue | Pending | Mar 29, 2021 |
| 17150044 | FINFET DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | 79d | Pending | Jan 15, 2021 |
| 17107420 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103 | Non-Final OA | 30d | Pending | Nov 30, 2020 |
| 17001446 | Metal Contacts on Metal Gates and Methods Thereof | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | 59d overdue | Pending | Aug 24, 2020 |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | CHAMPION, RICHARD DAVID | 1737 | §103 | Final Rejection | 35d | Pending | May 08, 2020 |
| 16585859 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | §103 | Final Rejection | 17d overdue | Pending | Sep 27, 2019 |
| 16520210 | EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | 69d | Pending | Jul 23, 2019 |
| 16283838 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | 31d overdue | Pending | Feb 25, 2019 |
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