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Last updated: April 19, 2026

Schwabe, Williamson & Wyatt, P.C.

171 pending office actions • 7 clients

Portfolio Summary

171
Total Pending OAs
50
Final Rejections
121
Non-Final OAs

Client Portfolio (7 clients)

Client (Assignee)Pending OAs
Intel Corporation 161
Intel Corporation 4
USNR, LLC 2
Verve Group Inc. 1
Norwood Industries Inc. 1
Apera Al Inc. 1
Intel Corporation 1

Pending Office Actions

App #TitleClientExaminerArt UnitStatusFiled
19033078 INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK Intel Corporation MUNOZ, ANDRES F 2818 Non-Final OA Jan 21, 2025
18896711 PRIVACY SUPPORTING MESSAGING SYSTEMS AND METHODS Verve Group Inc. STRAUB, D'ARCY WINSTON 2491 Non-Final OA Sep 25, 2024
18732408 TILT HOISTS AND LUMBER UNSTACKING SYSTEMS USNR, LLC ADAMS, GREGORY W 3652 Final Rejection Jun 03, 2024
18654739 SAWMILL CARRIAGE, SAWMILL CARRIAGE KIT, AND METHOD OF USING SAME Norwood Industries Inc. LEE, LAURA MICHELLE 3724 Non-Final OA May 03, 2024
18611534 GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS Intel Corporation SENGDARA, VONGSAVANH 2893 Non-Final OA Mar 20, 2024
18438450 INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY Intel Corporation VALENZUELA, PATRICIA D 2812 Non-Final OA Feb 10, 2024
18400761 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES Intel Corporation PIZARRO CRESPO, MARCOS D 2814 Non-Final OA Dec 29, 2023
18390952 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTERNATE ETCH SELECTIVE MATERIAL Intel Corporation KOO, LAMONT B 2813 Non-Final OA Dec 20, 2023
18391023 SINGLE DAMASCENE VIA PROFILES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation KARIMY, TIMOR 2818 Non-Final OA Dec 20, 2023
18543784 CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE GATE TAPS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation CHOI, CALVIN Y 2812 Non-Final OA Dec 18, 2023
18523592 PHOTONIC SYSTEM WITH MARKER TONE Intel Corporation SINGH, DALZID E 2635 Non-Final OA Nov 29, 2023
18521694 OPTICAL COUPLER WITH DIFFERENT WAVEGUIDE MATERIALS Intel Corporation TAVLYKAEV, ROBERT FUATOVICH 2896 Non-Final OA Nov 28, 2023
18521734 OPTICAL COUPLER WITH DIFFERENT WAVEGUIDE MATERIALS Intel Corporation WONG, ERIC K 2874 Non-Final OA Nov 28, 2023
18496672 OPTICAL MODE CONVERTOR Intel Corporation PENG, CHARLIE YU 2874 Non-Final OA Oct 27, 2023
18383370 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP VIA SUBSTRATE CONTACTS FOR SUB-FIN ELECTRICAL CONTACT Intel Corporation TRAN, TAN N 2812 Non-Final OA Oct 24, 2023
18376341 BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS Intel Corporation BOYLE, ABBIGALE A 2899 Final Rejection Oct 03, 2023
18375858 CHANNEL DEPOPULATION FOR FORKSHEET TRANSISTORS Intel Corporation VERDES, RICKY 2898 Non-Final OA Oct 02, 2023
18374603 SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTACT TO TRENCH CONTACT Intel Corporation MICHAUD, ROBERT J 2622 Non-Final OA Sep 28, 2023
18374582 INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES Intel Corporation SYLVIA, CHRISTINA A 2817 Non-Final OA Sep 28, 2023
18372542 MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE Intel Corporation CHIN, EDWARD 2893 Non-Final OA Sep 25, 2023
18244689 PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES Intel Corporation STARK, JARRETT J 2898 Final Rejection Sep 11, 2023
18459184 INTEGRATED SILICON (SI) TUNABLE LASER Intel Corporation RADKOWSKI, PETER 2874 Non-Final OA Aug 31, 2023
18352111 PRECUT PROCESSING OF LOGS USNR, LLC LINDSAY, BERNARD G 2119 Final Rejection Jul 13, 2023
18271791 NOVEL DESIGN FOR FIBER ARRAY UNIT (FAU) FOR OPTICAL TRANSCEIVER PRODUCTS Intel Corporation TRAN, HOANG Q 2874 Final Rejection Jul 11, 2023
18216275 TECHNIQUES FOR DIE TILING Intel Corporation JUNGE, BRYAN R. 2897 Non-Final OA Jun 29, 2023
18037517 METHOD AND SYSTEM FOR IMAGE PROCESSING USING A VISION PIPELINE Apera Al Inc. WALLACE, JOHN R 2682 Non-Final OA May 17, 2023
18130328 METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS USING PROJECTION OPTICS Intel Corporation ABDELAZIEZ, YASSER A 2898 Final Rejection Apr 03, 2023
18193231 CXL-CACHE/MEM PROTOCOL INTERFACE (CPI) LATENCY REDUCTION MECHANISM Intel Corporation LIN, AMIE CHINYU 2436 Non-Final OA Mar 30, 2023
18126857 INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY Intel Corporation WARD, DAVID WILLIAM 2891 Non-Final OA Mar 27, 2023
18177426 PHASE CURRENT BALANCE ARCHITECTURE FOR A MULTI-PHASE POWER CONVERTER Intel Corporation PHAN, RAYMOND NGAN 2175 Non-Final OA Mar 02, 2023
18174007 NANORIBBON-BASED TRANSISTORS WITH ETCH STOP LAYER TO ASSIST SUBFIN REMOVAL Intel Corporation GARCES, NELSON Y 2814 Non-Final OA Feb 24, 2023
18091970 PROCESS-VOLTAGE-TEMPERATURE TOLERANT REPLICA FEEDBACK PULSE GENERATOR CIRCUIT FOR PULSED LATCH Intel Corporation O TOOLE, COLLEEN J 2849 Non-Final OA Dec 30, 2022
18091207 CHARGE ISOLATION ARCHITECTURE IN VOLTAGE REGULATOR FOR IMPROVED BATTERY LIFE, RESPONSIVENESS AND REDUCED ACOUSTIC NOISE Intel Corporation NGUYEN, PHIL K Non-Final OA Dec 29, 2022
18090822 INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL SHARED GATE HIGH-DRIVE THIN FILM TRANSISTORS Intel Corporation KIM, TONG-HO 2811 Non-Final OA Dec 29, 2022
18091034 PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING Intel Corporation FERNANDES, ERROL V 2893 Non-Final OA Dec 29, 2022
18090807 INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY Intel Corporation LINDSEY, COLE LEON 2812 Non-Final OA Dec 29, 2022
18091028 ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES Intel Corporation SAMPLE, DAVID R 1784 Non-Final OA Dec 29, 2022
18090816 INTEGRATED CIRCUIT STRUCTURES HAVING BIT-COST SCALING WITH RELAXED TRANSISTOR AREA Intel Corporation PAGE, STEVEN MITCHELL CHR 2812 Non-Final OA Dec 29, 2022
18091022 ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES Intel Corporation JOHNSON, CHRISTOPHER A 2899 Non-Final OA Dec 29, 2022
18089931 DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER Intel Corporation LOHAKARE, PRATIKSHA JAYANT 2818 Non-Final OA Dec 28, 2022
18089877 INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS Intel Corporation JEFFERSON, QUOVAUNDA 2899 Non-Final OA Dec 28, 2022
18089957 DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS Intel Corporation HALL, VICTORIA KATHLEEN 2897 Non-Final OA Dec 28, 2022
18089908 INTEGRATED CIRCUIT STRUCTURES HAVING STACKED ELECTROSTATIC DISCHARGE (ESD) FOR BACKSIDE POWER DELIVERY Intel Corporation VU, HUNG K 2897 Non-Final OA Dec 28, 2022
18089865 INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY Intel Corporation LIU, BENJAMIN T 2893 Non-Final OA Dec 28, 2022
18089476 THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA Intel Corporation LOPEZ, JORGE ANDRES 2897 Non-Final OA Dec 27, 2022
18089471 THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES Intel Corporation PAYEN, MARVIN 2899 Non-Final OA Dec 27, 2022
18089491 LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES Intel Corporation WOLDEGEORGIS, ERMIAS T 2893 Non-Final OA Dec 27, 2022
18089489 SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION Intel Corporation ESTRADA, ANGEL R 2841 Non-Final OA Dec 27, 2022
18089494 DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES Intel Corporation MILLER, JAMI VALENTINE 2818 Non-Final OA Dec 27, 2022
18089501 FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS Intel Corporation CHIEM, DINH D 2874 Non-Final OA Dec 27, 2022
18089483 TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS Intel Corporation FERNANDES, ERROL V 2893 Non-Final OA Dec 27, 2022
18088542 GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY Intel Corporation TYNES JR., LAWRENCE C 2899 Non-Final OA Dec 24, 2022
18088552 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS Intel Corporation BLACKWELL, ASHLEY NICOLE 2897 Non-Final OA Dec 24, 2022
18088546 GALLIUM NITRIDE (GAN) TRANSISTORS WITH LATERAL DRAIN DEPLETION Intel Corporation NICELY, JOSEPH C 2813 Non-Final OA Dec 24, 2022
18088547 SELF-ALIGNED BACKBONE FOR FORKSHEET TRANSISTORS Intel Corporation SHEKER, RHYS PONIENTE 2813 Non-Final OA Dec 24, 2022
18088541 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH Intel Corporation HO, ANTHONY 2817 Non-Final OA Dec 24, 2022
18088543 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SIGNAL ROUTING FOR FRONT SIDE DRAM Intel Corporation ARORA, AJAY 2892 Non-Final OA Dec 24, 2022
18088360 CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE Intel Corporation CRUM, JACOB R 2835 Non-Final OA Dec 23, 2022
18069269 ADAPTIVE VOLTAGE SHUTDOWN DEMOTION Intel Corporation PATEL, NIMESH G 2176 Non-Final OA Dec 21, 2022
18085116 LAYER TRANSFER CLAMP FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY Intel Corporation BLACKWELL, ASHLEY NICOLE 2897 Non-Final OA Dec 20, 2022
18085122 LAYER TRANSFER TRANSISTOR FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY Intel Corporation MILLER, JAMI VALENTINE 2818 Non-Final OA Dec 20, 2022
18084275 EMBEDDED MEMORY FOR GLASS CORE PACKAGES Intel Corporation FERNANDES, ERROL V 2893 Non-Final OA Dec 19, 2022
18081362 IN CORE LARGE AREA CAPACITORS Intel Corporation LIAN, ESTHER NGUN HLEI MA 2847 Non-Final OA Dec 14, 2022
18080907 GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY Intel Corporation WOLDEGEORGIS, ERMIAS T 2893 Non-Final OA Dec 14, 2022
18076130 LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT Intel Corporation PAGE, STEVEN MITCHELL CHR 2812 Non-Final OA Dec 06, 2022
18073213 INTEGRATED CIRCUIT STRUCTURES WITH CAVITY SPACERS Intel Corporation KIM, TONG-HO 2811 Non-Final OA Dec 01, 2022
18072569 INTEGRATED CIRCUIT STRUCTURE WITH RECESSED TRENCH CONTACT AND DEEP BOUNDARY VIA Intel Corporation FERNANDES, ERROL V 2893 Non-Final OA Nov 30, 2022
18072564 FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS Intel Corporation BEARDSLEY, JONAS TYLER 2811 Non-Final OA Nov 30, 2022
18071901 OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT Intel Corporation RODRIGUEZ VILLANU, SANDRA MILENA 2898 Non-Final OA Nov 30, 2022
18071257 SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE Intel Corporation WOLDEGEORGIS, ERMIAS T 2893 Non-Final OA Nov 29, 2022
18071246 INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES Intel Corporation PENG, CHARLIE YU 2874 Non-Final OA Nov 29, 2022
17983425 PROVIDING HARDWARE FEEDBACK INFORMATION IN A VIRTUAL ENVIRONMENT Intel Corporation KESSLER, GREGORY AARON 2197 Non-Final OA Nov 09, 2022
17958279 GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM Intel Corporation IMTIAZ, S M SOHEL 2812 Non-Final OA Sep 30, 2022
17958291 PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE Intel Corporation PRENTY, MARK V 2814 Non-Final OA Sep 30, 2022
17958281 DESIGN OF VOLTAGE CONTRAST PROCESS MONITOR Intel Corporation LOPEZ, JORGE ANDRES 2897 Non-Final OA Sep 30, 2022
17937212 FORMING METAL GATE CUTS USING MULTIPLE PASSES FOR DEPTH CONTROL Intel Corporation KIM, TONG-HO 2811 Final Rejection Sep 30, 2022
17956753 DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE Intel Corporation MENZ, DOUGLAS M 2897 Non-Final OA Sep 29, 2022
17956760 SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING Intel Corporation VU, VU A 2897 Final Rejection Sep 29, 2022
17956779 INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED FOR GATE CONTACT Intel Corporation HAN, JONATHAN 2818 Non-Final OA Sep 29, 2022
17955513 INTEGRATED CIRCUIT STRUCTURES WITH UNIFORM EPITAXIAL SOURCE OR DRAIN CUT Intel Corporation LEE, WOO KYUNG 2815 Final Rejection Sep 28, 2022
17955378 OPTICAL COUPLER Intel Corporation RAHLL, JERRY T 2874 Non-Final OA Sep 28, 2022
17955485 INTEGRATED CIRCUIT STRUCTURES WITH CHANNEL CAP REDUCTION Intel Corporation ENAD, CHRISTINE A 2811 Non-Final OA Sep 28, 2022
17955511 MUSHROOMED VIA STRUCTURES FOR TRENCH CONTACT OR GATE CONTACT Intel Corporation RAHMAN, MOHAMMAD A 2898 Non-Final OA Sep 28, 2022
17954288 IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS Intel Corporation CHEN, YU 2896 Non-Final OA Sep 27, 2022
17954292 VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES Intel Corporation DOAN, JENNIFER 2874 Non-Final OA Sep 27, 2022
17954194 INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS Intel Corporation ENAD, CHRISTINE A 2811 Final Rejection Sep 27, 2022
17953873 HIGH ASPECT RATIO METAL GATE CUTS Intel Corporation TURNER, BRIAN 2818 Non-Final OA Sep 27, 2022
17953206 ELECTROLYTIC SURFACE FINISH ARCHITECTURE Intel Corporation ROBINSON, KRYSTAL 2848 Non-Final OA Sep 26, 2022
17953210 DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE Intel Corporation FREAL, JOHN BRENDAN 2847 Non-Final OA Sep 26, 2022
17952017 TESTING A SEMICONDUCTOR DEVICE USING X-RAYS Intel Corporation HOQUE, FARHANA AKHTER 2858 Final Rejection Sep 23, 2022
17951995 ALTERING OPERATIONAL CHARACTERISTICS OF A SEMICONDUCTOR DEVICE USING ACCELERATED IONS Intel Corporation FAYETTE, NATHALIE RENEE 2812 Non-Final OA Sep 23, 2022
17952031 COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS Intel Corporation NAVARRO, HUGO IVAN 2858 Non-Final OA Sep 23, 2022
17950926 DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation HAN, JONATHAN 2818 Non-Final OA Sep 22, 2022
17949857 IC PACKAGE WITH LEDS Intel Corporation YEUNG LOPEZ, FEIFEI 2899 Non-Final OA Sep 21, 2022
17942415 DYNAMIC VOLTAGE AND FREQUENCY SCALING FOR MEMORY IN HETEROGENEOUS CORE ARCHITECTURES Intel Corporation CLEARY, THOMAS J 2175 Non-Final OA Sep 12, 2022
17895916 THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES Intel Corporation AHMADI, MOHSEN 2896 Non-Final OA Aug 25, 2022
17894868 INTEGRATED CIRCUIT STRUCTURES HAVING MAGNETIC VIAS AND BACKSIDE POWER DELIVERY Intel Corporation TRICE III, WILLIAM CLARENCE 2893 Final Rejection Aug 24, 2022
17892930 ANGLED BAFFLES ON GLASS EDGE FOR CAVITATION PROTECTION Intel Corporation AMER, MOUNIR S 2818 Non-Final OA Aug 22, 2022
17891738 THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES Intel Corporation NIELSEN, DEREK LANG 2899 Non-Final OA Aug 19, 2022
17889229 SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES Intel Corporation FAN, SU JYA 2818 Non-Final OA Aug 16, 2022
17887273 SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS Intel Corporation BODNAR, JOHN A 2893 Non-Final OA Aug 12, 2022
17886278 ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES Intel Corporation CHI, SUBERR L 2893 Non-Final OA Aug 11, 2022
17858031 SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER Intel Corporation TRAN, THANH Y 2817 Final Rejection Jul 05, 2022
17855639 CONTACT ARCHITECTURE FOR 2D STACKED NANORIBBON TRANSISTOR Intel Corporation OH, JIYOUNG 2818 Final Rejection Jun 30, 2022
17853597 STACKED TRANSCEIVER AND WAVEGUIDE LAUNCHER ARRAY Intel Corporation PHAM, TUAN 2649 Non-Final OA Jun 29, 2022
17850769 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING COMMON METAL GATES AND HAVING GATE DIELECTRICS WITH AN OPPOSITE POLARITY DIPOLE LAYER Intel Corporation LEE, DA WEI 2817 Non-Final OA Jun 27, 2022
17850778 INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE Intel Corporation HOANG, TUAN A 2898 Non-Final OA Jun 27, 2022
17850078 SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC FOR TRANSITION METAL DICHALCOGENIDE GROWTH FOR STACKED 2D CHANNELS Intel Corporation FOX, BRANDON C 2818 Final Rejection Jun 27, 2022
17850623 STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH Intel Corporation SALAZ, SAMMANTHA KATELYN 2892 Final Rejection Jun 27, 2022
17849352 COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES Intel Corporation BAIG, ANEESA RIAZ 2814 Final Rejection Jun 24, 2022
17848630 HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD Intel Corporation SRINIVASAN, SESHA SAIRAMAN 2812 Non-Final OA Jun 24, 2022
17848624 SILICON NITRIDE LAYER UNDER A COPPER PAD Intel Corporation CLINTON, EVAN GARRETT 2899 Non-Final OA Jun 24, 2022
17841550 DYNAMIC INPUT POWER MONITOR Intel Corporation YEN, PAUL JUEI-FU 2175 Final Rejection Jun 15, 2022
17833580 EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT Intel Corporation NGUYEN, KHIEM D 2892 Final Rejection Jun 06, 2022
17833600 MEMORY PACKAGE ON EXTENDED BASE DIE OVER SOC DIE FOR PACKAGE LAYER COUNT AND FORM FACTOR REDUCTION Intel Corporation ANDREWS, FELIX BRYAN 2812 Final Rejection Jun 06, 2022
17833589 MEMORY ON PACKAGE (MOP) ARCHITECTURE Intel Corporation LE, THAO P 2818 Non-Final OA Jun 06, 2022
17833608 ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY Intel Corporation JUNG, MICHAEL YOO LIM 2817 Non-Final OA Jun 06, 2022
17826933 USB TYPE-C SUBSYSTEM Intel Corporation UNELUS, ERNEST 2181 Final Rejection May 27, 2022
17743954 DESIGNS TO ENABLE INLINE CIRCUIT EDIT Intel Corporation PARIHAR, SUCHIN 2851 Final Rejection May 13, 2022
17743948 INLINE CIRCUIT EDIT Intel Corporation AU, BAC H 2898 Final Rejection May 13, 2022
17710791 SELECTIVE PASSIVATION FOR EPI GROWTH IN PRESENCE OF METALLIC CONTACTS Intel Corporation FAYETTE, NATHALIE RENEE 2812 Non-Final OA Mar 31, 2022
17710802 DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY Intel Corporation ENAD, CHRISTINE A 2811 Non-Final OA Mar 31, 2022
17707358 MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRICS FOR HSIO PACKAGING Intel Corporation SAWYER, STEVEN T 2847 Final Rejection Mar 29, 2022
17707371 PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO Intel Corporation POWERS, LAURA C 1785 Final Rejection Mar 29, 2022
17693150 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADDITIVE GATE STRUCTURES IN A TUB ARCHITECTURE Intel Corporation CRAMER, HALEE PAIGE 2891 Non-Final OA Mar 11, 2022
17682804 POWER GATE WITH METAL ON BOTH SIDES Intel Corporation SALERNO, SARAH KATE 2814 Non-Final OA Feb 28, 2022
17561726 SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES Intel Corporation ZARNEKE, DAVID A 2891 Non-Final OA Dec 24, 2021
17561733 3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES Intel Corporation TRAN, TIEN 2812 Non-Final OA Dec 24, 2021
17561735 SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES Intel Corporation MCCOY, THOMAS WILSON 2814 Non-Final OA Dec 24, 2021
17561670 POWER DELIVERY USING BACKSIDE POWER FOR STITCHED DIES Intel Corporation ZHU, SHENG-BAI 2897 Final Rejection Dec 23, 2021
17561681 HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES Intel Corporation NGUYEN, CUONG B 2818 Non-Final OA Dec 23, 2021
17561686 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN STRUCTURES WITH SUBSTRATE CONNECTION PORTIONS Intel Corporation HRNJIC, ADIN 2817 Non-Final OA Dec 23, 2021
17561682 INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL Intel Corporation TRICE III, WILLIAM CLARENCE 2893 Non-Final OA Dec 23, 2021
17558425 COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT Intel Corporation LIN, JOHN 2815 Final Rejection Dec 21, 2021
17557995 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN STRUCTURES WITH REGROWN CENTRAL PORTIONS Intel Corporation NGUYEN, CUONG B 2818 Final Rejection Dec 21, 2021
17558046 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN-LAST STRUCTURES Intel Corporation BERRY, PAUL ANTHONY 2898 Final Rejection Dec 21, 2021
17558061 INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE PLUG LANDED ON DIELECTRIC ANCHOR Intel Corporation CRAMER, HALEE PAIGE 2891 Non-Final OA Dec 21, 2021
17556660 TECHNIQUES FOR DIE TILING Intel Corporation JUNGE, BRYAN R. 2897 Non-Final OA Dec 20, 2021
17554456 ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation MILLER, ALEXANDER MICHAEL 2898 Non-Final OA Dec 17, 2021
17553189 POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS Intel Corporation DINH, TUAN T 2848 Non-Final OA Dec 16, 2021
17553161 INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE Intel Corporation MUNOZ, ANDRES F 2818 Non-Final OA Dec 16, 2021
17553214 COUPLED FINS WITH BLIND TRENCH STRUCTURES Intel Corporation MAIGA, SIDI MOHAMED 2847 Non-Final OA Dec 16, 2021
17549497 INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLASS VIAS Intel Corporation YAP, DOUGLAS ANTHONY 2899 Non-Final OA Dec 13, 2021
17548027 INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT FLYOVER STRUCTURE Intel Corporation ENAD, CHRISTINE A 2811 Final Rejection Dec 10, 2021
17547745 OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING Intel Corporation TAN, DAVE 2897 Final Rejection Dec 10, 2021
17485325 OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE Intel Corporation MIHALIOV, DMITRI 2812 Non-Final OA Sep 25, 2021
17485198 REPAIR AND PERFORMANCE CHIPLET Intel Corporation VERDES, RICKY 2898 Final Rejection Sep 24, 2021
17485294 ELIMINATION OF SUB-FIN LEAKAGE IN STACKED NANOSHEET ARCHITECTURES Intel Corporation NETTLES, CORALIE ANN 2893 Non-Final OA Sep 24, 2021
17485217 PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS Intel Corporation ANDERSON, WILLIAM H 2817 Final Rejection Sep 24, 2021
17484970 TRANSISTOR STRUCTURE WITH A MONOLAYER EDGE CONTACT Intel Corporation RICHARDS, NORMAN DREW 2892 Final Rejection Sep 24, 2021
17485232 COMPLEX FIELD-SHAPING BY FINE VARIATION OF LOCAL MATERIAL DENSITY OR PROPERTIES Intel Corporation WINTERS, SEAN AYERS 2892 Final Rejection Sep 24, 2021
17485185 THIN FILM TRANSISTORS HAVING CMOS FUNCTIONALITY INTEGRATED WITH 2D CHANNEL MATERIALS Intel Corporation GREWAL, HEIM KIRIN 2812 Final Rejection Sep 24, 2021
17481247 DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRATED CIRCUIT Intel Corporation BEDTELYON, JOHN M 2874 Non-Final OA Sep 21, 2021
17481266 GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICATIONS Intel Corporation CHIEM, DINH D 2874 Final Rejection Sep 21, 2021
17481245 DAM SURROUNDING A DIE ON A SUBSTRATE Intel Corporation YASMEEN, NISHATH 2811 Final Rejection Sep 21, 2021
17479155 THIN FILM TRANSISTORS HAVING FIN STRUCTURES INTEGRATED WITH 2D CHANNEL MATERIALS Intel Corporation NGUYEN, CUONG B 2818 Final Rejection Sep 20, 2021
17479031 OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIES ATTACHED TO THE GLASS SUBSTRATE Intel Corporation JORDAN, ANDREW 2874 Final Rejection Sep 20, 2021
17473099 FINE BUMP PITCH DIE TO DIE TILING INCORPORATING AN INVERTED GLASS INTERPOSER Intel Corporation BAIG, ANEESA RIAZ 2814 Final Rejection Sep 13, 2021
17357767 SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES Intel Corporation NGUYEN, DUY T V 2818 Final Rejection Jun 24, 2021
17357729 FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN HYBRID BONDING SELF ASSEMBLY Intel Corporation OH, JIYOUNG 2818 Final Rejection Jun 24, 2021
17357722 UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONNECT LAYER FOR INTERFACE DISAGGREGATION Intel Corporation CAMPBELL, SHAUN M 2893 Final Rejection Jun 24, 2021
17356023 SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE Intel Corporation WOLDEGEORGIS, ERMIAS T 2893 Final Rejection Jun 23, 2021
17350184 MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE Intel Corporation ANGUIANO, MICHAEL 2899 Non-Final OA Jun 17, 2021
17346999 INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE VIA BAR Intel Corporation HANUMASAGAR, SHAMITA S 2814 Non-Final OA Jun 14, 2021
17346964 STENT AND WRAP CONTACT Intel Corporation BLACKWELL, ASHLEY NICOLE 2897 Final Rejection Jun 14, 2021
17133080 METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation KIM, JAHAE 2897 Final Rejection Dec 23, 2020
17129851 PLATE LINE ARCHITECTURES FOR 3D-FERROELECTRIC RANDOM ACCESS MEMORY (3D-FRAM) Intel Corporation CORNELY, JOHN PATRICK 2812 Final Rejection Dec 21, 2020
17129846 NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF METAL DEFINED PADS Intel Corporation NELSON, JACOB THEODORE 2815 Final Rejection Dec 21, 2020
17020200 TANDEM MAGNETICS IN PACKAGE Intel Corporation CHAN, TSZFUNG JACKIE 2837 Final Rejection Sep 14, 2020
16940117 SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS Intel Corporation BOULGHASSOUL, YOUNES 2814 Non-Final OA Jul 27, 2020
16542960 PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation MIYOSHI, JESSE Y 2898 Non-Final OA Aug 16, 2019

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