Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
173 pending office actions • 5 clients • 137 examiners • 32 art units • 55 of 173 (32%) have an AI response strategy ready
SCHWABE, WILLIAMSON & WYATT, P.C. is a high-volume firm with 16645 career applications, specializing in Semiconductors, Circuits & Optics. The firm holds a high resolved allowance rate of 90.05 percent. Prosecution typically involves 3.46 office actions per allowance, reflecting a persistent effort to overcome examiner rejections in the semiconductor field. This average indicates that the firm is willing to engage in multiple rounds of negotiation to secure patent rights for its clients.
The firm is currently managing 135 pending office actions. This active workload is part of its large historical footprint of 16645 applications. The 90.05 percent allowance rate is an excellent metric for a firm of this size and specialization. With 3.46 office actions per allowance, the firm's historical data provides a clear expectation of the effort and time required to achieve a patent grant across its extensive application base. This profile highlights a firm with deep experience and a highly successful track record in a technically demanding sector.
Based on the USPTO statutory response window for each pending office action. 46 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 46 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 3 (2%) |
| §103 only | 60 (35%) |
| §102 only | 12 (7%) |
| §112 only | 7 (4%) |
| Double-patenting only | 3 (2%) |
| Double-patenting + other | 1 (1%) |
| Multi-statute (no §101) | 86 (50%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| HANUMASAGAR, SHAMITA S | 6 | 76.9% | -7.5% |
| TURNER, BRIAN | 4 | 83.4% | +4.4% |
| BOULGHASSOUL, YOUNES | 3 | 88.3% | +7.0% |
| WOLDEGEORGIS, ERMIAS T | 3 | 70.9% | +11.9% |
| BLACKWELL, ASHLEY NICOLE | 3 | 97.2% | -1.1% |
| SALAZ, SAMMANTHA KATELYN | 3 | 86.2% | +9.3% |
| NGUYEN, JIMMY T | 2 | 76.5% | +24.2% |
| BOWEN, ADAM S | 2 | 96.5% | +2.4% |
| HENRY, CALEB E | 2 | 86.8% | +6.0% |
| TRAN, TRANG Q | 2 | 81.3% | +7.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17851985 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY | TURNER, BRIAN | 30d overdue |
| 16940117 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | BOULGHASSOUL, YOUNES | 39d |
| 18242322 | PACKAGE WITH EMBEDDED CAPACITORS | TRAN, TRANG Q | 55d |
| 18763777 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH GATE-ALL-AROUND DEVICES ABOVE INSULATOR SUBSTRATES | BOULGHASSOUL, YOUNES | — |
| 18654855 | TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SINGLE DIE | BOWEN, ADAM S | — |
| 17958302 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | BOULGHASSOUL, YOUNES | — |
| 17889962 | PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION | SALAZ, SAMMANTHA KATELYN | — |
| 17561518 | INTEGRATED CIRCUITS WITH GATE PLUGS TO INDUCE COMPRESSIVE CHANNEL STRAIN | BLACKWELL, ASHLEY NICOLE | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17481234 | MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE | TRAN, TRANG Q | 80d overdue |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | ADHIKARI DAWADI, BIPANA | 45d overdue |
| 18654739 | SAWMILL CARRIAGE, SAWMILL CARRIAGE KIT, AND METHOD OF USING SAME | LEE, LAURA MICHELLE | 30d overdue |
| 17953873 | HIGH ASPECT RATIO METAL GATE CUTS | TURNER, BRIAN | 11d overdue |
| 17346990 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS | HANUMASAGAR, SHAMITA S | 11d overdue |
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | SALAZ, SAMMANTHA KATELYN | 10d overdue |
| 18089491 | LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES | WOLDEGEORGIS, ERMIAS T | 8d overdue |
| 17826933 | USB TYPE-C SUBSYSTEM | UNELUS, ERNEST | 4d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18089491 | LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES | WOLDEGEORGIS, ERMIAS T | 8d overdue |
| 18649530 | MODULAR PRESS | NGUYEN, JIMMY T | 83d |
| 19023571 | SAWMILL BED ASSEMBLY | NGUYEN, JIMMY T | — |
| 18080907 | GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY | WOLDEGEORGIS, ERMIAS T | — |
| 18071257 | SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE | WOLDEGEORGIS, ERMIAS T | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 166 |
| Norwood Industries | 2 |
| USNR, LLC | 2 |
| Simonds International LLC | 2 |
| Verve Group Inc. | 1 |
| Art Unit | Apps |
|---|---|
| 2893 | 17 |
| 2818 | 16 |
| 2812 | 12 |
| 2897 | 11 |
| 2814 | 11 |
| 2898 | 9 |
| 2899 | 5 |
| 2891 | 4 |
| 2874 | 4 |
| 2815 | 4 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19088493 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG | Intel Corporation | DEGRASSE, IAN ISAAC | 2818 | §102 | Non-Final OA | — | Pending | Mar 24, 2025 |
| 19059871 | STATIC RANDOM-ACCESS MEMORY | Intel Corporation | NGUYEN, VIET Q | §102 | Non-Final OA | — | Pending | Feb 21, 2025 | |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103 | Non-Final OA | 70d | AI Ready | Jan 21, 2025 |
| 19023571 | SAWMILL BED ASSEMBLY | Norwood Industries Inc. | NGUYEN, JIMMY T | §102§103§112 | Non-Final OA | — | Pending | Jan 16, 2025 | |
| 19000286 | LOG AND CANT OPTIMIZATION | USNR, LLC | ZERVOS, NIKOLAOS PHILLIP | §102§103§112 | Non-Final OA | — | Pending | Dec 23, 2024 | |
| 18940191 | PERFORMANCE AND RANGE OF INDOOR CLIENT DEVICES BY APPLYING REGULATED EIRP LIMITS OF SUBORDINATE DEVICES | Intel Corporation | NGUYEN, HAI V | §103 | Non-Final OA | — | Pending | Nov 07, 2024 | |
| 18902427 | STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT | Intel Corporation | MOONEY, MICHAEL P | §102 | Non-Final OA | — | Pending | Sep 30, 2024 | |
| 18896711 | PRIVACY SUPPORTING MESSAGING SYSTEMS AND METHODS | Verve Group Inc. | STRAUB, D'ARCY WINSTON | 2491 | §103Other | Non-Final OA | 5d overdue | Pending | Sep 25, 2024 |
| 18798574 | HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW | Intel Corporation | BEDTELYON, JOHN M | §102 | Non-Final OA | — | Pending | Aug 08, 2024 | |
| 18787886 | OPTICAL COHERENT RECEIVER ON A CHIP | Intel Corporation | LAMBERT, DAVID W | §103 | Non-Final OA | — | Pending | Jul 29, 2024 | |
| 18774351 | BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES | Intel Corporation | LEE, CHEUNG | DP | Non-Final OA | — | Pending | Jul 16, 2024 | |
| 18767458 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT ISLAND STRUCTURES | Intel Corporation | HARRISTON, WILLIAM A | §102Other | Non-Final OA | — | Pending | Jul 09, 2024 | |
| 18763777 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH GATE-ALL-AROUND DEVICES ABOVE INSULATOR SUBSTRATES | Intel Corporation | BOULGHASSOUL, YOUNES | §112DP | Non-Final OA | — | Pending | Jul 03, 2024 | |
| 18755987 | LAYOUT DESIGN SPECIFICATIONS AND METHODOLOGY FOR GENERATING SEMICONDUCTOR CHIP METAL INTERCONNECT LAYOUT FABRICS | Intel Corporation | PETERSON, ERIK T | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 | |
| 18757013 | CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATION ON BOTH SIDES | Intel Corporation | NIX, NORA TAYLOR | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18755189 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH IMPROVED CAP | Intel Corporation | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18740068 | MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER | Intel Corporation | SOWARD, IDA M | §103 | Non-Final OA | — | Pending | Jun 11, 2024 | |
| 18734746 | CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE | Intel Corporation | BOWEN, ADAM S | Other | Non-Final OA | — | Pending | Jun 05, 2024 | |
| 18732393 | GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | AMER, MOUNIR S | DP | Non-Final OA | — | Pending | Jun 03, 2024 | |
| 18654855 | TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SINGLE DIE | Intel Corporation | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | May 03, 2024 |
| 18654739 | SAWMILL CARRIAGE, SAWMILL CARRIAGE KIT, AND METHOD OF USING SAME | Norwood Industries Inc. | LEE, LAURA MICHELLE | 3724 | §102§103 | Final Rejection | 30d overdue | Pending | May 03, 2024 |
| 18653815 | GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME | Intel Corporation | HENRY, CALEB E | 2818 | §102§103 | Non-Final OA | — | Pending | May 02, 2024 |
| 18649530 | MODULAR PRESS | USNR, LLC | NGUYEN, JIMMY T | 3725 | §102§112Other | Non-Final OA | 83d | Pending | Apr 29, 2024 |
| 18636037 | AUTOMATIC FEEDING, GRINDING, AND SORTING OF WOODWORKING KNIVES | Simonds International LLC | GUMP, MICHAEL ANTHONY | 3723 | §101§103§112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18611534 | GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS | Intel Corporation | SENGDARA, VONGSAVANH | 2893 | §103 | Non-Final OA | 15d | AI Ready | Mar 20, 2024 |
| 18438450 | INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 34d | Pending | Feb 10, 2024 |
| 18390952 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTERNATE ETCH SELECTIVE MATERIAL | Intel Corporation | KOO, LAMONT B | 2813 | §103 | Final Rejection | 22d | AI Ready | Dec 20, 2023 |
| 18566483 | ARTIFICIAL INTELLIGENCE REGULATORY MECHANISMS | Intel Corporation | BHAT, VIBHA NARAYAN | §101§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 | |
| 18381887 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING BOTTOM-UP OXIDATION APPROACH | Intel Corporation | PATEL, REEMA | 2812 | §112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18374596 | MICROELECTRONIC ASSEMBLIES | Intel Corporation | KARIMY, TIMOR | 2818 | §103§112 | Final Rejection | — | Pending | Sep 28, 2023 |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Intel Corporation | STARK, JARRETT J | 2898 | §103 | Non-Final OA | — | AI Ready | Sep 11, 2023 |
| 18242322 | PACKAGE WITH EMBEDDED CAPACITORS | Intel Corporation | TRAN, TRANG Q | 2811 | §112 | Final Rejection | 55d | AI Ready | Sep 05, 2023 |
| 18240106 | INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG | Intel Corporation | KIM, TONG-HO | §103Other | Non-Final OA | — | Pending | Aug 30, 2023 | |
| 18223413 | INTEGRATED CIRCUIT STRUCTURES HAVING THROUGH-STACK THERMAL SINK FOR DUAL-SIDED DEVICES | Intel Corporation | MATTABONI, TIMOTHY JAMES | §103 | Non-Final OA | — | Pending | Jul 18, 2023 | |
| 18219018 | INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | §102§103§112 | Non-Final OA | — | Pending | Jul 06, 2023 | |
| 18216914 | CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | STUESSY, NOLAN GABRIEL | §102 | Non-Final OA | — | Pending | Jun 30, 2023 | |
| 18216325 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT DIFFERENTIATED ACCESS | Intel Corporation | KNUDSON, BRAD ALLAN | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18216315 | STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS | Intel Corporation | MCCOY, THOMAS WILSON | §102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 | |
| 18343255 | REGIONAL BRIGHTNESS CONTROL SCHEME FOR DISPLAY POWER SAVING | Intel Corporation | PEARSON, AMANDA HYEONWOO | §103 | Non-Final OA | — | Pending | Jun 28, 2023 | |
| 18215748 | INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED END CAP | Intel Corporation | BOEGEL, CHEVY JACOB | §102§103 | Non-Final OA | — | Pending | Jun 28, 2023 | |
| 18214898 | INTEGRATED CIRCUIT STRUCTURES WITH DIFFERENTIAL EPITAXIAL SOURCE OR DRAIN DENT | Intel Corporation | KIM, TONG-HO | §102§103 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18214252 | INTEGRATED CAPACITOR | Intel Corporation | GHEYAS, SYED I | §102§103 | Non-Final OA | — | Pending | Jun 26, 2023 | |
| 18214244 | INTEGRATED CAPACITOR | Intel Corporation | LIU, MIKKA H | §102§103§112 | Non-Final OA | — | Pending | Jun 26, 2023 | |
| 18214262 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY | Intel Corporation | FOX, BRANDON C | §103Other | Non-Final OA | — | Pending | Jun 26, 2023 | |
| 18214271 | CONDUCTIVE LINES HAVING MOLYBDENUM LINER AND TUNGSTEN FILL FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | VU, DAVID | §102§103 | Non-Final OA | — | Pending | Jun 26, 2023 | |
| 18340794 | ENHANCING TEMPERATURE STABILITY IN REFERENCE CLOCK APPLICATIONS USING RESONATOR ARRAYS | Intel Corporation | SHIN, JEFFREY M | §102§103 | Non-Final OA | — | Pending | Jun 23, 2023 | |
| 18212824 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE PLUG LAST APPROACH | Intel Corporation | LIU, MIKKA H | §102§103§112 | Non-Final OA | — | Pending | Jun 22, 2023 | |
| 18212382 | INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR ISOLATION | Intel Corporation | LIU, XIAOMING | §103 | Non-Final OA | — | Pending | Jun 21, 2023 | |
| 18338176 | DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY | Intel Corporation | LIU, XIAOMING | §103 | Non-Final OA | — | Pending | Jun 20, 2023 | |
| 18332420 | PLATFORM AND PLATFORM COMPONENT DEBUG BY MULTIPLE DEBUGGING SYSTEMS | Intel Corporation | MANOSKEY, JOSEPH D | §101§102§112 | Non-Final OA | — | Pending | Jun 09, 2023 | |
| 18204212 | PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY | Intel Corporation | TORNOW, MARK W | §103 | Non-Final OA | — | Pending | May 31, 2023 | |
| 18204204 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT STITCHING | Intel Corporation | ROBERTSON, NOAH CHRISTOPHER | §102§103 | Non-Final OA | — | Pending | May 31, 2023 | |
| 18202678 | INTEGRATED CIRCUIT STRUCTURES WITH PARTIAL CHANNEL CAP REMOVAL | Intel Corporation | TURNER, BRIAN | §102§103 | Non-Final OA | — | Pending | May 26, 2023 | |
| 18200967 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING FIN ISOLATION REGIONS | Intel Corporation | TURNER, BRIAN | §102§103 | Non-Final OA | — | Pending | May 23, 2023 | |
| 18199269 | LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS | Intel Corporation | LEE, PETE T | §102§103§112 | Non-Final OA | — | Pending | May 18, 2023 | |
| 18318659 | SWITCHED-CAPACITOR VOLTAGE CONVERTER WITH SELECTIVE DECOUPLING CAPACITANCE | Intel Corporation | CORDOVA RODRIGUEZ, ULARISLAO | 2827 | §102§103 | Non-Final OA | — | Pending | May 16, 2023 |
| 18141887 | NITRIDE ETCH FOR CONSISTENT STEP HEIGHT FOR TSV REVEAL IN THE VIA MID FLOW | Intel Corporation | ERDEM, FAZLI | §102 | Final Rejection | — | Pending | May 01, 2023 | |
| 18140465 | RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE ANTENNA AND THE RF DIE | Intel Corporation | JONES, ERIC W | §103 | Final Rejection | — | Pending | Apr 27, 2023 | |
| 18140346 | SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STRUCTURES | Intel Corporation | HAMADYK, ANNA N | §102§103 | Non-Final OA | — | Pending | Apr 27, 2023 | |
| 18140361 | ANTENNA MODULE WITH CAPACITIVE COUPLING | Intel Corporation | ISLAM, HASAN Z | §103 | Non-Final OA | — | Pending | Apr 27, 2023 | |
| 18130584 | EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY | Intel Corporation | AHMAD, KHAJA | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 04, 2023 |
| 18130582 | AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER | Intel Corporation | ARROYO, TERESA M | 2893 | §103§112 | Non-Final OA | — | Pending | Apr 04, 2023 |
| 18129871 | INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION | Intel Corporation | BOOTH, RICHARD A | 2812 | §102§103§112 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129872 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING | Intel Corporation | TRAN, DZUNG | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129873 | INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS | Intel Corporation | CHEN, YU | 2896 | §102§103 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129879 | SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES | Intel Corporation | SABUR, ALIA | 2812 | §103§112 | Final Rejection | 62d | Pending | Apr 02, 2023 |
| 18129878 | DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION | Intel Corporation | HENRY, CALEB E | 2818 | §102§103 | Final Rejection | — | Pending | Apr 02, 2023 |
| 18128733 | DEVICE UNDER TEST (DUT) STRUCTURES IN FILL REGIONS OF PRODUCT DIE FOR VOLTAGE CONTRAST (VC) DEFECT DETECTION FOR IMPROVED YIELD LEARNING | Intel Corporation | GHEYAS, SYED I | 2858 | §103 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18126857 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY | Intel Corporation | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | — | Pending | Mar 27, 2023 |
| 18126134 | GLASS CORE SUBSTRATE WITH LGA NOTCH | Intel Corporation | HOSSAIN, MOAZZAM | 2898 | §102§103 | Final Rejection | — | Pending | Mar 24, 2023 |
| 18123838 | BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS | Intel Corporation | NGUYEN, DUY T V | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18121720 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING TUNED UPPER NANOWIRES | Intel Corporation | VU, VU A | 2897 | §102§103 | Final Rejection | 50d | Pending | Mar 15, 2023 |
| 18121331 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Intel Corporation | MANDALA, MICHELLE | 2483 | §102§103Other | Non-Final OA | — | Pending | Mar 14, 2023 |
| 18121264 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Intel Corporation | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | — | Pending | Mar 14, 2023 |
| 18120761 | EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCREASE OVERALL SYSTEM POWER DENSITY | Intel Corporation | TRAN, BINH BACH THANH | 2847 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18120172 | HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER | Intel Corporation | RAHMAN, MOHAMMAD A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Mar 10, 2023 |
| 18117818 | INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE HUMIDITY RELIABILITY ISSUE OF LIQUID METAL INTERCONNECT | Intel Corporation | DINH, TUAN T | 2847 | §102§103 | Final Rejection | 46d | Pending | Mar 06, 2023 |
| 18116721 | TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | BODNAR, JOHN A | 2893 | §103§112 | Non-Final OA | — | Pending | Mar 02, 2023 |
| 18174007 | NANORIBBON-BASED TRANSISTORS WITH ETCH STOP LAYER TO ASSIST SUBFIN REMOVAL | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103§112 | Final Rejection | — | Pending | Feb 24, 2023 |
| 18090838 | DOUBLE INTERCONNECTS FOR STITCHED DIES | Intel Corporation | NADAV, ORI | §103 | Non-Final OA | — | Pending | Dec 29, 2022 | |
| 18091028 | ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES | Intel Corporation | SAMPLE, DAVID R | 1784 | §102§103 | Final Rejection | — | Pending | Dec 29, 2022 |
| 18091207 | CHARGE ISOLATION ARCHITECTURE IN VOLTAGE REGULATOR FOR IMPROVED BATTERY LIFE, RESPONSIVENESS AND REDUCED ACOUSTIC NOISE | Intel Corporation | NGUYEN, PHIL K | §103 | Final Rejection | 3d overdue | AI Ready | Dec 29, 2022 | |
| 18089877 | INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §103 | Non-Final OA | — | AI Ready | Dec 28, 2022 |
| 18089945 | TRANSISTOR INCLUDING WIDE BAND GAP MATERIALS | Intel Corporation | WALL, VINCENT | 2898 | §103 | Final Rejection | — | Pending | Dec 28, 2022 |
| 18089489 | SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION | Intel Corporation | ESTRADA, ANGEL R | 2841 | §103 | Final Rejection | 9d | AI Ready | Dec 27, 2022 |
| 18089501 | FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS | Intel Corporation | CHIEM, DINH D | 2874 | §103§112 | Non-Final OA | 20d | AI Ready | Dec 27, 2022 |
| 18089491 | LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES | Intel Corporation | WOLDEGEORGIS, ERMIAS T | 2893 | §102§103 | Non-Final OA | 8d overdue | AI Ready | Dec 27, 2022 |
| 18089476 | THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA | Intel Corporation | LOPEZ, JORGE ANDRES | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2022 |
| 18089499 | DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING | Intel Corporation | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §102§103 | Final Rejection | — | Pending | Dec 27, 2022 |
| 18088546 | GALLIUM NITRIDE (GAN) TRANSISTORS WITH LATERAL DRAIN DEPLETION | Intel Corporation | NICELY, JOSEPH C | 2813 | §102§103 | Final Rejection | — | AI Ready | Dec 24, 2022 |
| 18088552 | INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS | Intel Corporation | BLACKWELL, ASHLEY NICOLE | 2897 | §102§103 | Non-Final OA | — | AI Ready | Dec 24, 2022 |
| 18088360 | CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE | Intel Corporation | CRUM, JACOB R | 2835 | §102§103§112 | Final Rejection | 62d | AI Ready | Dec 23, 2022 |
| 18085122 | LAYER TRANSFER TRANSISTOR FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY | Intel Corporation | MILLER, JAMI VALENTINE | 2818 | §102§103 | Final Rejection | — | Pending | Dec 20, 2022 |
| 18084275 | EMBEDDED MEMORY FOR GLASS CORE PACKAGES | Intel Corporation | FERNANDES, ERROL V | 2893 | §103 | Non-Final OA | — | AI Ready | Dec 19, 2022 |
| 18080907 | GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY | Intel Corporation | WOLDEGEORGIS, ERMIAS T | 2893 | §103§112 | Final Rejection | — | AI Ready | Dec 14, 2022 |
| 18076130 | LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT | Intel Corporation | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | 19d overdue | AI Ready | Dec 06, 2022 |
| 18075360 | SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103 | Final Rejection | — | AI Ready | Dec 05, 2022 |
| 18071257 | SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE | Intel Corporation | WOLDEGEORGIS, ERMIAS T | 2893 | §103 | Final Rejection | — | AI Ready | Nov 29, 2022 |
| 18071237 | GLASS EMBEDDED TRUE AIR CORE INDUCTORS | Intel Corporation | BOATMAN, CASEY PAUL | 2893 | §102§103§112 | Final Rejection | — | Pending | Nov 29, 2022 |
| 17983433 | GUIDE DRESSER, CUTTER HEADS AND METHODS OF USE THEREOF | Simonds International LLC | CADUGAN, ERICA E | 3722 | §112 | Non-Final OA | — | Pending | Nov 09, 2022 |
| 17958302 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Intel Corporation | BOULGHASSOUL, YOUNES | 2814 | §102 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17956753 | DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE | Intel Corporation | MENZ, DOUGLAS M | 2897 | §103 | Non-Final OA | — | AI Ready | Sep 29, 2022 |
| 17956760 | SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING | Intel Corporation | VU, VU A | 2897 | §102 | Non-Final OA | — | AI Ready | Sep 29, 2022 |
| 17954288 | IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS | Intel Corporation | CHEN, YU | 2896 | §102§103§112 | Final Rejection | 26d | AI Ready | Sep 27, 2022 |
| 17953873 | HIGH ASPECT RATIO METAL GATE CUTS | Intel Corporation | TURNER, BRIAN | 2818 | §102§103 | Non-Final OA | 11d overdue | AI Ready | Sep 27, 2022 |
| 17943915 | COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS | Intel Corporation | FAN, SU JYA | 2818 | §103§112 | Final Rejection | — | Pending | Sep 13, 2022 |
| 17889962 | PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Final Rejection | — | AI Ready | Aug 17, 2022 |
| 17890005 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI-HEIGHT STANDARD CELL CIRCUITS | Intel Corporation | STEVENSON, ANDRE C | 2899 | §103 | Non-Final OA | 72d | Pending | Aug 17, 2022 |
| 17889229 | SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES | Intel Corporation | FAN, SU JYA | 2818 | §103§112 | Non-Final OA | — | AI Ready | Aug 16, 2022 |
| 17886278 | ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES | Intel Corporation | CHI, SUBERR L | 2893 | §112 | Non-Final OA | — | AI Ready | Aug 11, 2022 |
| 17855639 | CONTACT ARCHITECTURE FOR 2D STACKED NANORIBBON TRANSISTOR | Intel Corporation | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 15d | AI Ready | Jun 30, 2022 |
| 17853487 | EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU ENABLED PACKAGES | Intel Corporation | PURVIS, SUE A | 2815 | §112 | Final Rejection | — | Pending | Jun 29, 2022 |
| 17852039 | SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT | Intel Corporation | LIU, BENJAMIN T | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2022 |
| 17851967 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND POWER DELIVERY | Intel Corporation | KNUDSON, BRAD ALLAN | 2817 | §103 | Final Rejection | — | Pending | Jun 28, 2022 |
| 17851985 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY | Intel Corporation | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 30d overdue | AI Ready | Jun 28, 2022 |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Non-Final OA | — | AI Ready | Jun 27, 2022 |
| 17848630 | HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD | Intel Corporation | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Final Rejection | 20d | AI Ready | Jun 24, 2022 |
| 17849188 | EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jun 24, 2022 |
| 17833568 | ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT | Intel Corporation | FREAL, JOHN BRENDAN | 2847 | §102§103 | Final Rejection | 71d | Pending | Jun 06, 2022 |
| 17826933 | USB TYPE-C SUBSYSTEM | Intel Corporation | UNELUS, ERNEST | 2181 | §102§103 | Non-Final OA | 4d overdue | AI Ready | May 27, 2022 |
| 17743954 | DESIGNS TO ENABLE INLINE CIRCUIT EDIT | Intel Corporation | PARIHAR, SUCHIN | 2851 | §102§103 | Non-Final OA | 29d | AI Ready | May 13, 2022 |
| 17711434 | GATE SPACERS WITH ADJACENT UNIFORM EPITAXIAL MATERIAL | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103§112 | Non-Final OA | — | Pending | Apr 01, 2022 |
| 17709365 | LAYERED 2D SEMICONDUCTORS | Intel Corporation | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 68d | Pending | Mar 30, 2022 |
| 17709360 | BARRIERS TO MODULATE UNDERFILL FLOW | Intel Corporation | BRASFIELD, QUINTON A | 2814 | §102§103 | Non-Final OA | 41d | Pending | Mar 30, 2022 |
| 17707536 | GROOVED PACKAGE | Intel Corporation | PARENDO, KEVIN A | 2896 | §102§103 | Final Rejection | — | Pending | Mar 29, 2022 |
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Non-Final OA | 10d overdue | AI Ready | Mar 14, 2022 |
| 17693150 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADDITIVE GATE STRUCTURES IN A TUB ARCHITECTURE | Intel Corporation | CRAMER, HALEE PAIGE | 2891 | §103 | Non-Final OA | 42d overdue | AI Ready | Mar 11, 2022 |
| 17561733 | 3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES | Intel Corporation | TRAN, TIEN | 2812 | §103 | Non-Final OA | 5d overdue | AI Ready | Dec 24, 2021 |
| 17561686 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN STRUCTURES WITH SUBSTRATE CONNECTION PORTIONS | Intel Corporation | HRNJIC, ADIN | 2817 | §103 | Final Rejection | 1d overdue | AI Ready | Dec 23, 2021 |
| 17561518 | INTEGRATED CIRCUITS WITH GATE PLUGS TO INDUCE COMPRESSIVE CHANNEL STRAIN | Intel Corporation | BLACKWELL, ASHLEY NICOLE | 2800 | §103 | Final Rejection | — | Pending | Dec 23, 2021 |
| 17561681 | HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES | Intel Corporation | NGUYEN, CUONG B | 2818 | §103 | Non-Final OA | 5d overdue | AI Ready | Dec 23, 2021 |
| 17561670 | POWER DELIVERY USING BACKSIDE POWER FOR STITCHED DIES | Intel Corporation | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | — | AI Ready | Dec 23, 2021 |
| 17561682 | INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL | Intel Corporation | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Final Rejection | 23d | AI Ready | Dec 23, 2021 |
| 17557579 | DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER | Intel Corporation | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | — | Pending | Dec 21, 2021 |
| 17556660 | TECHNIQUES FOR DIE TILING | Intel Corporation | JUNGE, BRYAN R. | 2897 | §103 | Final Rejection | 27d | AI Ready | Dec 20, 2021 |
| 17556602 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §102§103 | Non-Final OA | — | AI Ready | Dec 20, 2021 |
| 17554456 | ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Non-Final OA | 13d | AI Ready | Dec 17, 2021 |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Non-Final OA | 45d overdue | AI Ready | Dec 17, 2021 |
| 17553189 | POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS | Intel Corporation | DINH, TUAN T | 2848 | §103 | Non-Final OA | — | AI Ready | Dec 16, 2021 |
| 17549550 | INTEGRATED CIRCUIT STRUCTURES HAVING VERSATILE CHANNEL PLACEMENT | Intel Corporation | YI, CHANGHYUN | 2800 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2021 |
| 17485325 | OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE | Intel Corporation | MIHALIOV, DMITRI | 2812 | §103 | Non-Final OA | 72d | AI Ready | Sep 25, 2021 |
| 17485202 | CMOS INTEGRATION OF 2D MATERIAL BY END ETCH | Intel Corporation | MIHALIOV, DMITRI | 2812 | §103§112 | Non-Final OA | — | Pending | Sep 24, 2021 |
| 17485291 | HIGH-K OR FERROELECTRIC GATE OXIDE WITH ZERO-SIO2 IL PROCESS FOR TRANSISTOR | Intel Corporation | NGUYEN, KHIEM D | 2800 | §103Other | Final Rejection | — | Pending | Sep 24, 2021 |
| 17485294 | ELIMINATION OF SUB-FIN LEAKAGE IN STACKED NANOSHEET ARCHITECTURES | Intel Corporation | NETTLES, CORALIE ANN | 2893 | §102§103 | Non-Final OA | — | AI Ready | Sep 24, 2021 |
| 17482747 | LOCALIZED HIGH PERMEABILITY MAGNETIC REGIONS IN GLASS PATCH FOR ENHANCED POWER DELIVERY | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | — | Pending | Sep 23, 2021 |
| 17482804 | IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES | Intel Corporation | CHAN, TSZFUNG JACKIE | 2837 | §103§112 | Non-Final OA | — | Pending | Sep 23, 2021 |
| 17481257 | MOAT PROTECTION TO PREVENT CRACK PROPAGATION IN GLASS CORE SUBSTRATES OR GLASS INTERPOSERS | Intel Corporation | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | — | Pending | Sep 21, 2021 |
| 17481234 | MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE | Intel Corporation | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 80d overdue | Pending | Sep 21, 2021 |
| 17481266 | GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICATIONS | Intel Corporation | CHIEM, DINH D | 2874 | §103§112 | Non-Final OA | — | AI Ready | Sep 21, 2021 |
| 17479031 | OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIES ATTACHED TO THE GLASS SUBSTRATE | Intel Corporation | JORDAN, ANDREW | 2874 | §103 | Non-Final OA | 23d overdue | AI Ready | Sep 20, 2021 |
| 17507010 | DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS | Intel Corporation | SMITH, SAMUEL JONATHAN | 2817 | §103 | Final Rejection | — | AI Ready | Sep 17, 2021 |
| 17358551 | BURIED POWER RAIL WITH A SILICIDE LAYER FOR WELL BIASING | Intel Corporation | DIAZ, JOSE R | 2815 | §102§103 | Final Rejection | — | Pending | Jun 25, 2021 |
| 17357895 | NANORIBBON SUBFIN ISOLATION BY BACKSIDE SILICON SUBSTRATE REMOVAL WITH EPI PROTECTION | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Non-Final OA | — | Pending | Jun 24, 2021 |
| 17357896 | ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY | Intel Corporation | DIAZ, JOSE R | 2815 | §102§103 | Final Rejection | — | Pending | Jun 24, 2021 |
| 17356056 | DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESULTING THEREFROM | Intel Corporation | CAMPBELL, SHAUN M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jun 23, 2021 |
| 17353275 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE PASS-THROUGH CONTACT | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Final Rejection | — | Pending | Jun 21, 2021 |
| 17353263 | INTEGRATED CIRCUIT STRUCTURES HAVING PLUGGED METAL GATES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 21, 2021 |
| 17350169 | COAXIAL STRUCTURE IN A GLASS SUBSTRATE | Intel Corporation | WEGNER, AARON MICHAEL | 2897 | §103§112 | Non-Final OA | — | Pending | Jun 17, 2021 |
| 17350184 | MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE | Intel Corporation | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | — | AI Ready | Jun 17, 2021 |
| 17350809 | PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE | Intel Corporation | MANHEIM, MARC ETIENNE | 2874 | §102§103 | Non-Final OA | 56d | AI Ready | Jun 17, 2021 |
| 17346964 | STENT AND WRAP CONTACT | Intel Corporation | BLACKWELL, ASHLEY NICOLE | 2897 | §103 | Non-Final OA | — | AI Ready | Jun 14, 2021 |
| 17346990 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | 11d overdue | Pending | Jun 14, 2021 |
| 17346999 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE VIA BAR | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | — | AI Ready | Jun 14, 2021 |
| 17347015 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING BACKSIDE REMOVAL APPROACH | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 14, 2021 |
| 17232010 | THROUGH GATE FIN ISOLATION | Intel Corporation | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | — | Pending | Apr 15, 2021 |
| 17211751 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP | Intel Corporation | ANDERSON, WILLIAM H | 2817 | §102§103 | Final Rejection | — | Pending | Mar 24, 2021 |
| 17129838 | STIFFENER AND SOCKET EMBEDDED METAL INSERT ARCHITECTURES FOR POWER DELIVERY | Intel Corporation | LOKE, STEVEN HO YIN | 2818 | §102§112 | Non-Final OA | — | Pending | Dec 21, 2020 |
| 17126636 | MICROELECTRONIC STRUCTURES INCLUDING BRIDGES | Intel Corporation | PIZARRO CRESPO, MARCOS D | 2814 | §112 | Non-Final OA | — | Pending | Dec 18, 2020 |
| 17031719 | 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS | Intel Corporation | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | 218d overdue | Pending | Sep 24, 2020 |
| 16940117 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Intel Corporation | BOULGHASSOUL, YOUNES | 2814 | §102 | Final Rejection | 39d | AI Ready | Jul 27, 2020 |
| 16912136 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING STRAINED SOURCE OR DRAIN STRUCTURES ON GATE DIELECTRIC LAYER | Intel Corporation | XU, ZHIJUN | 2818 | §103 | Final Rejection | 34d | AI Ready | Jun 25, 2020 |
| 16803887 | INTERPOSER HEAT SPREADER | Intel Corporation | HAN, JONATHAN | 2818 | §102§103§112 | Non-Final OA | — | Pending | Feb 27, 2020 |
| 15859415 | PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | MIYOSHI, JESSE Y | 2898 | §112 | Final Rejection | 62d | AI Ready | Dec 30, 2017 |
IP Author helps law firms respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial