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Last updated: May 29, 2026

Schwabe, Williamson & Wyatt, P.C.

120 pending office actions • 5 clients • 113 examiners • 36 art units • 95 of 120 (79%) have an AI response strategy ready • 273 patents granted in the last 365 days

Portfolio Summary

120
Total Pending OAs
72
Non-Final OAs
30
Final Rejections
18
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 120 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

57
Overdue
2
Due this week
25
Due this month
15
Due in next 60 days
21
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 120 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (57)Due ≤ 7 days (2)Due ≤ 30 days (25)Due ≤ 60 days (15)Due later (21)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

49
Hard (41%)
68
Medium (57%)
3
Easy (2%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§101 + other1 (1%)
§103 only57 (48%)
§102 only7 (6%)
§112 only3 (2%)
Double-patenting + other4 (3%)
Multi-statute (no §101)48 (40%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

2
Life Sciences
2% of docket
6
Information Tech
5% of docket
3
Communications
2% of docket
106
Semiconductors
88% of docket
2
Mechanical / Eng
2% of docket
1
Business / Other
1% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

1,200 h
Manual time on pending OAs
240 h
Time saved (low, 20%)
420 h
Time saved (mid, 35%)
10.5 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
MUNOZ, ANDRES F 2 76.5% +18.1%
VALENZUELA, PATRICIA D 2 90.2% +2.1%
KOO, LAMONT B 2 80.5% +4.9%
TRAN, TRANG Q 2 80.9% +7.0%
ENAD, CHRISTINE A 2 84.2% +10.2%
TURNER, BRIAN 2 83.0% +4.5%
JUNGE, BRYAN R. 2 57.7% +9.0%
STRAUB, D'ARCY WINSTON 1 77.6% +18.8%
LEE, LAURA MICHELLE 1 54.8% +30.9%
NGUYEN, JIMMY T 1 76.8% +23.7%

Quick Wins (5)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 5 ordered by deadline are shown.

App #TitleExaminerDue in
17851985 INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY TURNER, BRIAN 30d overdue
18438450 INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY VALENZUELA, PATRICIA D 34d
17954194 INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS ENAD, CHRISTINE A 34d
18242322 PACKAGE WITH EMBEDDED CAPACITORS TRAN, TRANG Q 55d
17855636 VOLTAGE CONTRAST SCAN AREA ON A WAFER VALENZUELA, PATRICIA D 79d

Hard Cases (49)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
17020200 TANDEM MAGNETICS IN PACKAGE CHAN, TSZFUNG JACKIE 98d overdue
17481234 MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE TRAN, TRANG Q 80d overdue
18072564 FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS BEARDSLEY, JONAS TYLER 45d overdue
17554442 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT ADHIKARI DAWADI, BIPANA 45d overdue
17853500 IN-SITU MULTI-LAYER DIELECTRIC FILMS FOR APPLICATION AS GATE SPACER AND ETCH STOP LAYERS DUREN, TIMOTHY EDWARD 44d overdue
17953206 ELECTROLYTIC SURFACE FINISH ARCHITECTURE ROBINSON, KRYSTAL 28d overdue
17887273 SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS BODNAR, JOHN A 28d overdue
18088542 GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY TYNES JR., LAWRENCE C 26d overdue

Interview Candidates (7)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.

App #TitleExaminerDue in
18654739 SAWMILL CARRIAGE, SAWMILL CARRIAGE KIT, AND METHOD OF USING SAME LEE, LAURA MICHELLE 30d overdue
17710802 DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY ENAD, CHRISTINE A 15d overdue
18896711 PRIVACY SUPPORTING MESSAGING SYSTEMS AND METHODS STRAUB, D'ARCY WINSTON 5d overdue
17553161 INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE MUNOZ, ANDRES F 9d
17954194 INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS ENAD, CHRISTINE A 34d
19033078 INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK MUNOZ, ANDRES F 70d
18649530 MODULAR PRESS NGUYEN, JIMMY T 83d

Client Portfolio (5 clients)

Client (Assignee)Pending OAs
Intel 115
USNR, LLC 2
Verve Group Inc. 1
Norwood Industries 1
APERA Al INC. 1

Top Art Units

Art UnitApps
281216
281810
28979
28938
28988
28997
28177
28747
28147
28115

Pending Office Actions

App #TitleClientExaminerArt UnitStatutesStatusDue inAIFiled
19033078 INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK Intel Corporation MUNOZ, ANDRES F 2818 §103 Final Rejection 70d AI Ready Jan 21, 2025
18896711 PRIVACY SUPPORTING MESSAGING SYSTEMS AND METHODS Verve Group Inc. STRAUB, D'ARCY WINSTON 2491 §103 Non-Final OA 5d overdue Pending Sep 25, 2024
18654739 SAWMILL CARRIAGE, SAWMILL CARRIAGE KIT, AND METHOD OF USING SAME Norwood Industries Inc. LEE, LAURA MICHELLE 3724 §103 Non-Final OA 30d overdue Pending May 03, 2024
18649530 MODULAR PRESS USNR, LLC NGUYEN, JIMMY T 3725 §112 Non-Final OA 83d Pending Apr 29, 2024
18611534 GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS Intel Corporation SENGDARA, VONGSAVANH 2893 §102§103 Non-Final OA 15d AI Ready Mar 20, 2024
18438450 INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY Intel Corporation VALENZUELA, PATRICIA D 2812 §103 Non-Final OA 34d Pending Feb 10, 2024
18390952 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTERNATE ETCH SELECTIVE MATERIAL Intel Corporation KOO, LAMONT B 2813 §102§103 Non-Final OA 22d AI Ready Dec 20, 2023
18543784 CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE GATE TAPS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation CHOI, CALVIN Y 2812 DPOther Non-Final OA 22d AI Ready Dec 18, 2023
18516595 SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITHOUT FIN END GAP Intel Corporation KOO, LAMONT B 2813 §102§103§112 Non-Final OA 40d AI Ready Nov 21, 2023
18376341 BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS Intel Corporation BOYLE, ABBIGALE A 2899 §103§112 Final Rejection 19d AI Ready Oct 03, 2023
18374603 SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTACT TO TRENCH CONTACT Intel Corporation MICHAUD, ROBERT J 2622 §102 Non-Final OA 81d overdue AI Ready Sep 28, 2023
18374582 INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES Intel Corporation SYLVIA, CHRISTINA A 2817 §103 Non-Final OA 5d AI Ready Sep 28, 2023
18242322 PACKAGE WITH EMBEDDED CAPACITORS Intel Corporation TRAN, TRANG Q 2811 §112 Non-Final OA 55d AI Ready Sep 05, 2023
18352111 PRECUT PROCESSING OF LOGS USNR, LLC LINDSAY, BERNARD G 2119 §103 Final Rejection 73d overdue Pending Jul 13, 2023
18037517 METHOD AND SYSTEM FOR IMAGE PROCESSING USING A VISION PIPELINE Apera Al Inc. WALLACE, JOHN R 2682 §103 Non-Final OA 77d overdue Pending May 17, 2023
18130328 METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS USING PROJECTION OPTICS Intel Corporation ABDELAZIEZ, YASSER A 2898 §103 Final Rejection 36d overdue AI Ready Apr 03, 2023
18129879 SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES Intel Corporation SABUR, ALIA 2812 §102§103 Non-Final OA 62d Pending Apr 02, 2023
18129400 BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE Intel Corporation CHAMBLISS, ALONZO 2897 §102§112 Non-Final OA 62d Pending Mar 31, 2023
18129258 METAL INSULATOR METAL (MIM) CAPACITOR ARCHITECTURES Intel Corporation DIAZ, JOSE R 2815 §103 Non-Final OA 16d overdue AI Ready Mar 31, 2023
18193231 CXL-CACHE/MEM PROTOCOL INTERFACE (CPI) LATENCY REDUCTION MECHANISM Intel Corporation LIN, AMIE CHINYU 2436 §101§102§103 Non-Final OA 27d AI Ready Mar 30, 2023
18126702 BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT ON A TRANSISTOR LAYER Intel Corporation LINDSAY JR, WALTER LEE 2852 §102§103 Non-Final OA 61d Pending Mar 27, 2023
18121720 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING TUNED UPPER NANOWIRES Intel Corporation VU, VU A 2897 §102§103 Non-Final OA 50d Pending Mar 15, 2023
18117818 INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE HUMIDITY RELIABILITY ISSUE OF LIQUID METAL INTERCONNECT Intel Corporation DINH, TUAN T 2847 §102§103 Non-Final OA 46d Pending Mar 06, 2023
18177426 PHASE CURRENT BALANCE ARCHITECTURE FOR A MULTI-PHASE POWER CONVERTER Intel Corporation PHAN, RAYMOND NGAN 2175 §102§103§112 Non-Final OA 29d AI Ready Mar 02, 2023
18148578 POWER MANAGEMENT FOR BATTERY GROUP Intel Corporation LEE, JAMES 1725 §102§103 Non-Final OA 61d Pending Dec 30, 2022
18091026 ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES Intel Corporation CHOUDHRY, MOHAMMAD M 2899 §102§103DP Non-Final OA 56d AI Ready Dec 29, 2022
18091207 CHARGE ISOLATION ARCHITECTURE IN VOLTAGE REGULATOR FOR IMPROVED BATTERY LIFE, RESPONSIVENESS AND REDUCED ACOUSTIC NOISE Intel Corporation NGUYEN, PHIL K §102§103 Non-Final OA 3d overdue AI Ready Dec 29, 2022
18090807 INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY Intel Corporation LINDSEY, COLE LEON 2812 §103§112 Non-Final OA 9d overdue AI Ready Dec 29, 2022
18089886 INTEGRATED CIRCUIT STRUCTURES HAVING TWO-TRANSISTOR GAIN CELL Intel Corporation NGUYEN, TUAN DUC 2699 §102§103 Non-Final OA 61d AI Ready Dec 28, 2022
18089908 INTEGRATED CIRCUIT STRUCTURES HAVING STACKED ELECTROSTATIC DISCHARGE (ESD) FOR BACKSIDE POWER DELIVERY Intel Corporation VU, HUNG K 2897 §102§103 Non-Final OA 33d AI Ready Dec 28, 2022
18089471 THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES Intel Corporation PAYEN, MARVIN 2899 §102§103 Non-Final OA 34d AI Ready Dec 27, 2022
18089491 LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES Intel Corporation WOLDEGEORGIS, ERMIAS T 2893 §102§103 Non-Final OA 8d overdue AI Ready Dec 27, 2022
18089489 SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION Intel Corporation ESTRADA, ANGEL R 2841 §102 Non-Final OA 9d AI Ready Dec 27, 2022
18089501 FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS Intel Corporation CHIEM, DINH D 2874 §103 Non-Final OA 20d AI Ready Dec 27, 2022
18088543 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SIGNAL ROUTING FOR FRONT SIDE DRAM Intel Corporation ARORA, AJAY 2892 §103 Non-Final OA 29d AI Ready Dec 24, 2022
18088542 GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY Intel Corporation TYNES JR., LAWRENCE C 2899 §103§112 Non-Final OA 26d overdue AI Ready Dec 24, 2022
18088541 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH Intel Corporation HO, ANTHONY 2817 §102§103 Non-Final OA 15d overdue AI Ready Dec 24, 2022
18088360 CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE Intel Corporation CRUM, JACOB R 2835 §102§103§112 Non-Final OA 62d AI Ready Dec 23, 2022
18085116 LAYER TRANSFER CLAMP FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY Intel Corporation BLACKWELL, ASHLEY NICOLE 2897 §103 Non-Final OA 36d overdue AI Ready Dec 20, 2022
18085258 BRIDGE HUB TILING ARCHITECTURE Intel Corporation QUINTO, KEVIN V 2893 §103 Non-Final OA 72d Pending Dec 20, 2022
18076130 LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT Intel Corporation PAGE, STEVEN MITCHELL CHR 2812 §102 Final Rejection 19d overdue AI Ready Dec 06, 2022
18072564 FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS Intel Corporation BEARDSLEY, JONAS TYLER 2811 §102§103 Non-Final OA 45d overdue AI Ready Nov 30, 2022
18071246 INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES Intel Corporation PENG, CHARLIE YU 2874 §102 Non-Final OA 1d overdue AI Ready Nov 29, 2022
18071116 RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES Intel Corporation FAN, SU JYA 2818 §102§103 Non-Final OA 77d Pending Nov 29, 2022
17958291 PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE Intel Corporation PRENTY, MARK V 2814 §102 Non-Final OA 9d AI Ready Sep 30, 2022
17958279 GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM Intel Corporation IMTIAZ, S M SOHEL 2812 §103 Non-Final OA 13d AI Ready Sep 30, 2022
17958281 DESIGN OF VOLTAGE CONTRAST PROCESS MONITOR Intel Corporation LOPEZ, JORGE ANDRES 2897 §103 Non-Final OA 38d overdue AI Ready Sep 30, 2022
17956779 INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED FOR GATE CONTACT Intel Corporation HAN, JONATHAN 2818 §103 Non-Final OA 32d overdue AI Ready Sep 29, 2022
17955511 MUSHROOMED VIA STRUCTURES FOR TRENCH CONTACT OR GATE CONTACT Intel Corporation RAHMAN, MOHAMMAD A 2898 §102§103 Non-Final OA 12d AI Ready Sep 28, 2022
17955378 OPTICAL COUPLER Intel Corporation RAHLL, JERRY T 2874 §102§103 Non-Final OA 15d overdue AI Ready Sep 28, 2022
17954194 INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS Intel Corporation ENAD, CHRISTINE A 2811 §103 Final Rejection 34d AI Ready Sep 27, 2022
17954292 VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES Intel Corporation DOAN, JENNIFER 2874 §102§103 Non-Final OA 14d AI Ready Sep 27, 2022
17954288 IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS Intel Corporation CHEN, YU 2896 §102§103§112 Non-Final OA 26d AI Ready Sep 27, 2022
17954291 NECKED RIBBON FOR BETTER N WORKFUNCTION FILLING AND DEVICE PERFORMANCE Intel Corporation MENZ, DOUGLAS M 2897 §102§103 Non-Final OA 69d AI Ready Sep 27, 2022
17953873 HIGH ASPECT RATIO METAL GATE CUTS Intel Corporation TURNER, BRIAN 2818 §102§103 Non-Final OA 11d overdue AI Ready Sep 27, 2022
17953206 ELECTROLYTIC SURFACE FINISH ARCHITECTURE Intel Corporation ROBINSON, KRYSTAL 2848 §102§103 Non-Final OA 28d overdue AI Ready Sep 26, 2022
17951995 ALTERING OPERATIONAL CHARACTERISTICS OF A SEMICONDUCTOR DEVICE USING ACCELERATED IONS Intel Corporation FAYETTE, NATHALIE RENEE 2812 §102§103 Non-Final OA 5d overdue AI Ready Sep 23, 2022
17952017 TESTING A SEMICONDUCTOR DEVICE USING X-RAYS Intel Corporation HOQUE, FARHANA AKHTER 2858 §102 Final Rejection 15d AI Ready Sep 23, 2022
17949857 IC PACKAGE WITH LEDS Intel Corporation YEUNG LOPEZ, FEIFEI 2899 §103 Non-Final OA 7d AI Ready Sep 21, 2022
17895916 THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES Intel Corporation AHMADI, MOHSEN 2896 §102§103 Non-Final OA 25d overdue AI Ready Aug 25, 2022
17890005 INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI-HEIGHT STANDARD CELL CIRCUITS Intel Corporation STEVENSON, ANDRE C 2899 §103 Final Rejection 72d Pending Aug 17, 2022
17887273 SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS Intel Corporation BODNAR, JOHN A 2893 §102§103 Non-Final OA 28d overdue AI Ready Aug 12, 2022
17858031 SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER Intel Corporation TRAN, THANH Y 2817 §102§103 Final Rejection 2d overdue AI Ready Jul 05, 2022
17855639 CONTACT ARCHITECTURE FOR 2D STACKED NANORIBBON TRANSISTOR Intel Corporation OH, JIYOUNG 2818 §103§112 Non-Final OA 15d AI Ready Jun 30, 2022
17855636 VOLTAGE CONTRAST SCAN AREA ON A WAFER Intel Corporation VALENZUELA, PATRICIA D 2812 §103 Final Rejection 79d Pending Jun 30, 2022
17853329 DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP) Intel Corporation PARTHASARATHY, ROHIT 2899 §103 Final Rejection 77d AI Ready Jun 29, 2022
17853500 IN-SITU MULTI-LAYER DIELECTRIC FILMS FOR APPLICATION AS GATE SPACER AND ETCH STOP LAYERS Intel Corporation DUREN, TIMOTHY EDWARD 2817 §102§103 Non-Final OA 44d overdue AI Ready Jun 29, 2022
17851985 INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY Intel Corporation TURNER, BRIAN 2818 §103 Non-Final OA 30d overdue AI Ready Jun 28, 2022
17850778 INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE Intel Corporation HOANG, TUAN A 2898 §103 Non-Final OA 23d AI Ready Jun 27, 2022
17848630 HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD Intel Corporation SRINIVASAN, SESHA SAIRAMAN 2812 §103 Non-Final OA 20d AI Ready Jun 24, 2022
17841550 DYNAMIC INPUT POWER MONITOR Intel Corporation YEN, PAUL JUEI-FU 2175 §103 Final Rejection 85d overdue AI Ready Jun 15, 2022
17833568 ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT Intel Corporation FREAL, JOHN BRENDAN 2847 §103 Non-Final OA 71d Pending Jun 06, 2022
17833600 MEMORY PACKAGE ON EXTENDED BASE DIE OVER SOC DIE FOR PACKAGE LAYER COUNT AND FORM FACTOR REDUCTION Intel Corporation ANDREWS, FELIX BRYAN 2812 §103 Final Rejection 120d overdue AI Ready Jun 06, 2022
17826933 USB TYPE-C SUBSYSTEM Intel Corporation UNELUS, ERNEST 2181 §102§103 Non-Final OA 4d overdue AI Ready May 27, 2022
17716940 TECHNIQUES FOR DIE TILING Intel Corporation JUNGE, BRYAN R. 2897 §103 Non-Final OA 69d Pending Apr 08, 2022
17710802 DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY Intel Corporation ENAD, CHRISTINE A 2811 §102§103 Final Rejection 15d overdue AI Ready Mar 31, 2022
17709365 LAYERED 2D SEMICONDUCTORS Intel Corporation FARMER, EMILY NICOLE 2812 §103 Non-Final OA 68d Pending Mar 30, 2022
17709360 BARRIERS TO MODULATE UNDERFILL FLOW Intel Corporation BRASFIELD, QUINTON A 2814 §102§103 Final Rejection 41d Pending Mar 30, 2022
17707371 PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO Intel Corporation POWERS, LAURA C 1785 §103§112DP Final Rejection 1d overdue AI Ready Mar 29, 2022
17703730 LOW PROFILE IMPEDANCE-TUNABLE AND CROSS-TALK CONTROLLED HIGH SPEED HYBRID SOCKET INTERCONNECT Intel Corporation PATEL, TULSIDAS C 2834 §102§103§112 Non-Final OA 42d AI Ready Mar 24, 2022
17694266 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER Intel Corporation SALAZ, SAMMANTHA KATELYN 2892 §103DP Non-Final OA 10d overdue AI Ready Mar 14, 2022
17693150 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADDITIVE GATE STRUCTURES IN A TUB ARCHITECTURE Intel Corporation CRAMER, HALEE PAIGE 2891 §103 Non-Final OA 42d overdue AI Ready Mar 11, 2022
17682804 POWER GATE WITH METAL ON BOTH SIDES Intel Corporation SALERNO, SARAH KATE 2814 §103 Non-Final OA 21d AI Ready Feb 28, 2022
17561733 3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES Intel Corporation TRAN, TIEN 2812 §103 Non-Final OA 5d overdue AI Ready Dec 24, 2021
17561735 SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES Intel Corporation MCCOY, THOMAS WILSON 2814 §103 Non-Final OA 3d overdue AI Ready Dec 24, 2021
17561720 RECONSTITUTED WAFER-TO-WAFER HYBRID BONDING INTERCONNECT ARCHITECTURE WITH KNOWN GOOD DIES Intel Corporation ESIABA, NKECHINYERE OTUOMASIRICH 2817 §102§103 Non-Final OA 33d AI Ready Dec 24, 2021
17561686 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN STRUCTURES WITH SUBSTRATE CONNECTION PORTIONS Intel Corporation HRNJIC, ADIN 2817 §103 Non-Final OA 1d overdue AI Ready Dec 23, 2021
17561681 HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES Intel Corporation NGUYEN, CUONG B 2818 §103 Non-Final OA 5d overdue AI Ready Dec 23, 2021
17561682 INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL Intel Corporation TRICE III, WILLIAM CLARENCE 2893 §103 Non-Final OA 23d AI Ready Dec 23, 2021
17558425 COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT Intel Corporation LIN, JOHN 2815 §103 Final Rejection 141d overdue AI Ready Dec 21, 2021
17558046 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN-LAST STRUCTURES Intel Corporation BERRY, PAUL ANTHONY 2898 §112 Final Rejection 131d overdue AI Ready Dec 21, 2021
17557932 SEMICONDUCTOR STRUCTURE FOR NANORIBBON ARCHITECTURES Intel Corporation STEPHENSON, KENNETH STEPHEN 2898 §103 Non-Final OA 70d Pending Dec 21, 2021
17556660 TECHNIQUES FOR DIE TILING Intel Corporation JUNGE, BRYAN R. 2897 §103 Non-Final OA 27d AI Ready Dec 20, 2021
17554442 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT Intel Corporation ADHIKARI DAWADI, BIPANA 2898 §103§112 Non-Final OA 45d overdue AI Ready Dec 17, 2021
17554456 ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation MILLER, ALEXANDER MICHAEL 2898 §103 Non-Final OA 13d AI Ready Dec 17, 2021
17553161 INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE Intel Corporation MUNOZ, ANDRES F 2818 §102§103 Non-Final OA 9d AI Ready Dec 16, 2021
17485325 OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE Intel Corporation MIHALIOV, DMITRI 2812 §103§112 Final Rejection 72d AI Ready Sep 25, 2021
17485232 COMPLEX FIELD-SHAPING BY FINE VARIATION OF LOCAL MATERIAL DENSITY OR PROPERTIES Intel Corporation WINTERS, SEAN AYERS 2892 §103 Final Rejection 31d overdue AI Ready Sep 24, 2021
17485185 THIN FILM TRANSISTORS HAVING CMOS FUNCTIONALITY INTEGRATED WITH 2D CHANNEL MATERIALS Intel Corporation GREWAL, HEIM KIRIN 2812 §103 Final Rejection 87d overdue AI Ready Sep 24, 2021
17485217 PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS Intel Corporation ANDERSON, WILLIAM H 2817 §103 Final Rejection 66d overdue AI Ready Sep 24, 2021
17484970 TRANSISTOR STRUCTURE WITH A MONOLAYER EDGE CONTACT Intel Corporation RICHARDS, NORMAN DREW 2892 §103 Final Rejection 147d overdue AI Ready Sep 24, 2021
17482275 FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH HETEROGENEOUS APPLICATIONS Intel Corporation ONUTA, TIBERIU DAN 2814 §103 Non-Final OA 188d overdue AI Ready Sep 22, 2021
17481234 MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE Intel Corporation TRAN, TRANG Q 2811 §102§103 Non-Final OA 80d overdue Pending Sep 21, 2021
17481247 DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRATED CIRCUIT Intel Corporation BEDTELYON, JOHN M 2874 §102§103 Non-Final OA 28d AI Ready Sep 21, 2021
17481237 GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF LAYERS Intel Corporation ANDERSON, ERIK ARTHUR 2812 §103§112 Non-Final OA 11d overdue AI Ready Sep 21, 2021
17479031 OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIES ATTACHED TO THE GLASS SUBSTRATE Intel Corporation JORDAN, ANDREW 2874 §103§112 Non-Final OA 23d overdue AI Ready Sep 20, 2021
17357767 SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES Intel Corporation NGUYEN, DUY T V 2818 §103 Non-Final OA 16d AI Ready Jun 24, 2021
17357722 UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONNECT LAYER FOR INTERFACE DISAGGREGATION Intel Corporation CAMPBELL, SHAUN M 2893 §103 Final Rejection 24d overdue AI Ready Jun 24, 2021
17350164 CAPACITORS IN A GLASS SUBSTRATE Intel Corporation DOLE, TIMOTHY J 2800 §103 Final Rejection 79d Pending Jun 17, 2021
17350809 PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE Intel Corporation MANHEIM, MARC ETIENNE 2874 §103 Final Rejection 56d AI Ready Jun 17, 2021
17346990 INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS Intel Corporation HANUMASAGAR, SHAMITA S 2814 §103 Non-Final OA 11d overdue Pending Jun 14, 2021
17133080 METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation KIM, JAHAE 2897 §103 Final Rejection 38d overdue AI Ready Dec 23, 2020
17129854 METAL INSULATOR METAL (MIM) CAPACITOR WITH PEROVSKITE DIELECTRIC Intel Corporation SEHAR, FAKEHA 2893 §103 Non-Final OA 15d overdue AI Ready Dec 21, 2020
17129851 PLATE LINE ARCHITECTURES FOR 3D-FERROELECTRIC RANDOM ACCESS MEMORY (3D-FRAM) Intel Corporation CORNELY, JOHN PATRICK 2812 §103 Final Rejection 88d overdue AI Ready Dec 21, 2020
17129846 NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF METAL DEFINED PADS Intel Corporation NELSON, JACOB THEODORE 2815 §103 Final Rejection 89d overdue AI Ready Dec 21, 2020
17031719 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS Intel Corporation NGUYEN, THANH T 2893 §103 Non-Final OA 218d overdue Pending Sep 24, 2020
17020200 TANDEM MAGNETICS IN PACKAGE Intel Corporation CHAN, TSZFUNG JACKIE 2837 §102§103 Final Rejection 98d overdue AI Ready Sep 14, 2020
16940117 SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS Intel Corporation BOULGHASSOUL, YOUNES 2814 §102 Non-Final OA 39d AI Ready Jul 27, 2020
16912136 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING STRAINED SOURCE OR DRAIN STRUCTURES ON GATE DIELECTRIC LAYER Intel Corporation XU, ZHIJUN 2818 §103 Non-Final OA 34d AI Ready Jun 25, 2020
15859415 PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Intel Corporation MIYOSHI, JESSE Y 2898 §103 Non-Final OA 62d AI Ready Dec 30, 2017

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