Prosecution Insights
Prosecution Insights
147 pending office actions • 4 clients • 124 examiners • 30 art units • 65 of 147 (44%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 52 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 52 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 2 (1%) |
| §103 only | 63 (43%) |
| §102 only | 11 (7%) |
| §112 only | 6 (4%) |
| Double-patenting only | 3 (2%) |
| Multi-statute (no §101) | 61 (41%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| HANUMASAGAR, SHAMITA S | 5 | 73.7% | -10.3% |
| MUNOZ, ANDRES F | 3 | 76.4% | +18.3% |
| SALAZ, SAMMANTHA KATELYN | 3 | 88.9% | +17.6% |
| DEGRASSE, IAN ISAAC | 2 | 79.2% | +1.4% |
| JUNGE, BRYAN R. | 2 | 58.0% | +9.0% |
| TURNER, BRIAN | 2 | 83.2% | +4.5% |
| DINH, TUAN T | 2 | 78.7% | +22.4% |
| VU, HUNG K | 2 | 87.6% | +9.3% |
| PAGE, STEVEN MITCHELL CHR | 2 | 83.3% | +9.0% |
| SMITH, SAMUEL JONATHAN | 2 | 82.6% | +6.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18121264 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | PAGE, STEVEN MITCHELL CHR | — |
| 18090816 | INTEGRATED CIRCUIT STRUCTURES HAVING BIT-COST SCALING WITH RELAXED TRANSISTOR AREA | PAGE, STEVEN MITCHELL CHR | — |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | SALAZ, SAMMANTHA KATELYN | — |
| 17507010 | DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS | SMITH, SAMUEL JONATHAN | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18072564 | FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS | BEARDSLEY, JONAS TYLER | 45d overdue |
| 17853500 | IN-SITU MULTI-LAYER DIELECTRIC FILMS FOR APPLICATION AS GATE SPACER AND ETCH STOP LAYERS | DUREN, TIMOTHY EDWARD | 44d overdue |
| 17887273 | SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS | BODNAR, JOHN A | 28d overdue |
| 18088542 | GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY | TYNES JR., LAWRENCE C | 26d overdue |
| 17895916 | THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES | AHMADI, MOHSEN | 25d overdue |
| 17955378 | OPTICAL COUPLER | RAHLL, JERRY T | 15d overdue |
| 17129854 | METAL INSULATOR METAL (MIM) CAPACITOR WITH PEROVSKITE DIELECTRIC | SEHAR, FAKEHA | 15d overdue |
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | SALAZ, SAMMANTHA KATELYN | 10d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | SALAZ, SAMMANTHA KATELYN | 10d overdue |
| 17553161 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | MUNOZ, ANDRES F | 9d |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | MUNOZ, ANDRES F | 70d |
| 18400772 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | MUNOZ, ANDRES F | — |
| 18139083 | SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS | DINH, TUAN T | — |
| 17889962 | PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION | SALAZ, SAMMANTHA KATELYN | — |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | SALAZ, SAMMANTHA KATELYN | — |
| 17553189 | POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS | DINH, TUAN T | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 143 |
| Simonds International LLC | 2 |
| Verve Group Inc. | 1 |
| USNR, LLC | 1 |
| Art Unit | Apps |
|---|---|
| 2818 | 17 |
| 2893 | 16 |
| 2812 | 15 |
| 2897 | 12 |
| 2898 | 10 |
| 2899 | 8 |
| 2814 | 8 |
| 2874 | 7 |
| 2817 | 6 |
| 2892 | 4 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19088493 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG | Intel Corporation | DEGRASSE, IAN ISAAC | 2818 | §102 | Non-Final OA | — | Pending | Mar 24, 2025 |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103 | Non-Final OA | 70d | AI Ready | Jan 21, 2025 |
| 18940191 | PERFORMANCE AND RANGE OF INDOOR CLIENT DEVICES BY APPLYING REGULATED EIRP LIMITS OF SUBORDINATE DEVICES | Intel Corporation | NGUYEN, HAI V | §103 | Non-Final OA | — | Pending | Nov 07, 2024 | |
| 18918478 | ELECTRICAL INTERCONNECT BRIDGE | Intel Corporation | MCALLISTER, MICHAEL F | §103 | Non-Final OA | — | Pending | Oct 17, 2024 | |
| 18896711 | PRIVACY SUPPORTING MESSAGING SYSTEMS AND METHODS | Verve Group Inc. | STRAUB, D'ARCY WINSTON | 2491 | §103Other | Non-Final OA | 5d overdue | Pending | Sep 25, 2024 |
| 18763777 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH GATE-ALL-AROUND DEVICES ABOVE INSULATOR SUBSTRATES | Intel Corporation | BOULGHASSOUL, YOUNES | DP | Non-Final OA | — | Pending | Jul 03, 2024 | |
| 18740068 | MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER | Intel Corporation | SOWARD, IDA M | §103 | Non-Final OA | — | Pending | Jun 11, 2024 | |
| 18732393 | GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | AMER, MOUNIR S | DP | Non-Final OA | — | Pending | Jun 03, 2024 | |
| 18654855 | TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SINGLE DIE | Intel Corporation | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | May 03, 2024 |
| 18649530 | MODULAR PRESS | USNR, LLC | NGUYEN, JIMMY T | 3725 | §102§112Other | Non-Final OA | 83d | Pending | Apr 29, 2024 |
| 18636037 | AUTOMATIC FEEDING, GRINDING, AND SORTING OF WOODWORKING KNIVES | Simonds International LLC | GUMP, MICHAEL ANTHONY | 3723 | §112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18611534 | GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS | Intel Corporation | SENGDARA, VONGSAVANH | 2893 | §103 | Final Rejection | 15d | AI Ready | Mar 20, 2024 |
| 18400772 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Intel Corporation | MUNOZ, ANDRES F | 2818 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18391023 | SINGLE DAMASCENE VIA PROFILES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | KARIMY, TIMOR | 2818 | §103 | Non-Final OA | — | Pending | Dec 20, 2023 |
| 18521734 | OPTICAL COUPLER WITH DIFFERENT WAVEGUIDE MATERIALS | Intel Corporation | WONG, ERIC K | 2874 | §103 | Final Rejection | — | AI Ready | Nov 28, 2023 |
| 18383370 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP VIA SUBSTRATE CONTACTS FOR SUB-FIN ELECTRICAL CONTACT | Intel Corporation | TRAN, TAN N | 2812 | §102§103 | Non-Final OA | — | AI Ready | Oct 24, 2023 |
| 18376341 | BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS | Intel Corporation | BOYLE, ABBIGALE A | 2899 | §103§112 | Final Rejection | 19d | AI Ready | Oct 03, 2023 |
| 18374603 | SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTACT TO TRENCH CONTACT | Intel Corporation | MICHAUD, ROBERT J | 2622 | §102 | Non-Final OA | 81d overdue | AI Ready | Sep 28, 2023 |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Intel Corporation | STARK, JARRETT J | 2898 | §103 | Non-Final OA | — | AI Ready | Sep 11, 2023 |
| 18216275 | TECHNIQUES FOR DIE TILING | Intel Corporation | JUNGE, BRYAN R. | 2897 | §103 | Final Rejection | — | AI Ready | Jun 29, 2023 |
| 18214898 | INTEGRATED CIRCUIT STRUCTURES WITH DIFFERENTIAL EPITAXIAL SOURCE OR DRAIN DENT | Intel Corporation | KIM, TONG-HO | §102§103 | Non-Final OA | — | Pending | Jun 27, 2023 | |
| 18204212 | PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY | Intel Corporation | TORNOW, MARK W | §103 | Non-Final OA | — | Pending | May 31, 2023 | |
| 18202678 | INTEGRATED CIRCUIT STRUCTURES WITH PARTIAL CHANNEL CAP REMOVAL | Intel Corporation | TURNER, BRIAN | §102§103 | Non-Final OA | — | Pending | May 26, 2023 | |
| 18200967 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING FIN ISOLATION REGIONS | Intel Corporation | TURNER, BRIAN | §102§103 | Non-Final OA | — | Pending | May 23, 2023 | |
| 18313242 | ROBUST PLATFORM LOW POWER MODE VIA EMBEDDED CONTROLLER-BASED HEALTH POLICY TO CORRECT ANOMALOUS COMPUTER IDLE CONDITIONS | Intel Corporation | FATIMA, AYMAN | §103 | Non-Final OA | — | Pending | May 05, 2023 | |
| 18143831 | THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC MATERIALS FOR POWER DELIVERY APPLICATIONS | Intel Corporation | MCCUTCHEON, COLIN RUSSELL | §102§103 | Non-Final OA | — | Pending | May 05, 2023 | |
| 18140146 | THROUGH-SILICON VIA DIE | Intel Corporation | ISAAC, STANETTA D | §102 | Non-Final OA | — | Pending | Apr 27, 2023 | |
| 18140465 | RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE ANTENNA AND THE RF DIE | Intel Corporation | JONES, ERIC W | §102§103 | Non-Final OA | — | Pending | Apr 27, 2023 | |
| 18139083 | SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS | Intel Corporation | DINH, TUAN T | §102§103 | Non-Final OA | — | Pending | Apr 25, 2023 | |
| 18138440 | GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE | Intel Corporation | WALL, VINCENT | §102§103 | Non-Final OA | — | Pending | Apr 24, 2023 | |
| 18137360 | REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE | Intel Corporation | MARUF, SHEIKH | — | Non-Final OA | — | Pending | Apr 20, 2023 | |
| 18130582 | AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER | Intel Corporation | ARROYO, TERESA M | 2893 | §103§112 | Non-Final OA | — | Pending | Apr 04, 2023 |
| 18129873 | INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS | Intel Corporation | CHEN, YU | 2896 | §103 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129874 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DRAIN CONTACT HAVING ENHANCED CONTACT AREA | Intel Corporation | BRECHT, CHARLES MATTHEW | 2824 | §102 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129880 | DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION | Intel Corporation | OJEH, NDUKA E | 2893 | §103 | Non-Final OA | — | Pending | Apr 02, 2023 |
| 18129879 | SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES | Intel Corporation | SABUR, ALIA | 2812 | §102§103 | Non-Final OA | 62d | Pending | Apr 02, 2023 |
| 18193127 | METHOD AND APPARATUS TO ALLOW ADJUSTMENT OF THE CORE AVAILABILITY MASK PROVIDED TO SYSTEM SOFTWARE | Intel Corporation | HOANG, PHUONG N | 2196 | §101§103 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18128848 | 2D FILLERS FOR REDUCED CTE FOR PID | Intel Corporation | VU, HUNG K | 2812 | §103§112 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18126851 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION | Intel Corporation | MCCALL SHEPARD, SONYA D | 2847 | §102§103 | Non-Final OA | — | Pending | Mar 27, 2023 |
| 18123838 | BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS | Intel Corporation | NGUYEN, DUY T V | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18121264 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Intel Corporation | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | — | Pending | Mar 14, 2023 |
| 18120904 | REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) | Intel Corporation | SMITH, SAMUEL JONATHAN | 2897 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18116721 | TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | BODNAR, JOHN A | 2893 | §103§112 | Non-Final OA | — | Pending | Mar 02, 2023 |
| 18174007 | NANORIBBON-BASED TRANSISTORS WITH ETCH STOP LAYER TO ASSIST SUBFIN REMOVAL | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103§112 | Non-Final OA | — | Pending | Feb 24, 2023 |
| 18090807 | INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY | Intel Corporation | LINDSEY, COLE LEON | 2812 | §103 | Final Rejection | 9d overdue | AI Ready | Dec 29, 2022 |
| 18091022 | ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18090816 | INTEGRATED CIRCUIT STRUCTURES HAVING BIT-COST SCALING WITH RELAXED TRANSISTOR AREA | Intel Corporation | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Final Rejection | — | AI Ready | Dec 29, 2022 |
| 18089865 | INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY | Intel Corporation | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18089957 | DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS | Intel Corporation | HALL, VICTORIA KATHLEEN | 2897 | §102§112 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18089877 | INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS | Intel Corporation | JEFFERSON, QUOVAUNDA | 2899 | §103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18089494 | DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES | Intel Corporation | MILLER, JAMI VALENTINE | 2818 | §102 | Non-Final OA | — | Pending | Dec 27, 2022 |
| 18089501 | FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS | Intel Corporation | CHIEM, DINH D | 2874 | §103§112 | Final Rejection | 20d | AI Ready | Dec 27, 2022 |
| 18089476 | THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA | Intel Corporation | LOPEZ, JORGE ANDRES | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2022 |
| 18088542 | GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY | Intel Corporation | TYNES JR., LAWRENCE C | 2899 | §103§112 | Final Rejection | 26d overdue | AI Ready | Dec 24, 2022 |
| 18088547 | SELF-ALIGNED BACKBONE FOR FORKSHEET TRANSISTORS | Intel Corporation | SHEKER, RHYS PONIENTE | 2813 | §102§103 | Non-Final OA | — | Pending | Dec 24, 2022 |
| 18088546 | GALLIUM NITRIDE (GAN) TRANSISTORS WITH LATERAL DRAIN DEPLETION | Intel Corporation | NICELY, JOSEPH C | 2813 | §103 | Final Rejection | — | AI Ready | Dec 24, 2022 |
| 18088552 | INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS | Intel Corporation | BLACKWELL, ASHLEY NICOLE | 2897 | §102§103 | Final Rejection | — | AI Ready | Dec 24, 2022 |
| 18088360 | CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE | Intel Corporation | CRUM, JACOB R | 2835 | §102§103§112 | Non-Final OA | 62d | AI Ready | Dec 23, 2022 |
| 18085106 | LAYER TRANSFER DIODE OR THIN-FILM RESISTOR FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY | Intel Corporation | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 20, 2022 |
| 18085258 | BRIDGE HUB TILING ARCHITECTURE | Intel Corporation | QUINTO, KEVIN V | 2893 | §103 | Non-Final OA | 72d | Pending | Dec 20, 2022 |
| 18084275 | EMBEDDED MEMORY FOR GLASS CORE PACKAGES | Intel Corporation | FERNANDES, ERROL V | 2893 | §103 | Final Rejection | — | AI Ready | Dec 19, 2022 |
| 18075360 | SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT | Intel Corporation | ZARNEKE, DAVID A | 2891 | §102§103§112 | Non-Final OA | — | AI Ready | Dec 05, 2022 |
| 18072564 | FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS | Intel Corporation | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Final Rejection | 45d overdue | AI Ready | Nov 30, 2022 |
| 18071246 | INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES | Intel Corporation | PENG, CHARLIE YU | 2874 | §103 | Final Rejection | 1d overdue | AI Ready | Nov 29, 2022 |
| 18071116 | RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES | Intel Corporation | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | 77d | Pending | Nov 29, 2022 |
| 18071337 | SCALABLE COHERENT PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURE | Intel Corporation | SINGH, DALZID E | 2635 | §103 | Final Rejection | — | Pending | Nov 29, 2022 |
| 17983433 | GUIDE DRESSER, CUTTER HEADS AND METHODS OF USE THEREOF | Simonds International LLC | CADUGAN, ERICA E | 3722 | §112 | Non-Final OA | — | Pending | Nov 09, 2022 |
| 17983226 | BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING | Intel Corporation | FOX, BRANDON C | 2818 | §103 | Final Rejection | — | Pending | Nov 08, 2022 |
| 17958279 | GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103 | Final Rejection | 13d | AI Ready | Sep 30, 2022 |
| 17958288 | PLUG IN A METAL LAYER | Intel Corporation | VU, DAVID | 2818 | §102 | Non-Final OA | — | Pending | Sep 30, 2022 |
| 17956760 | SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING | Intel Corporation | VU, VU A | 2897 | §102 | Non-Final OA | — | AI Ready | Sep 29, 2022 |
| 17956775 | SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | SMITH, BRADLEY | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 29, 2022 |
| 17956753 | DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE | Intel Corporation | MENZ, DOUGLAS M | 2897 | §103 | Final Rejection | — | AI Ready | Sep 29, 2022 |
| 17956750 | NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS | Intel Corporation | CHOI, WILLIAM C | 2874 | §102 | Non-Final OA | — | Pending | Sep 29, 2022 |
| 17955378 | OPTICAL COUPLER | Intel Corporation | RAHLL, JERRY T | 2874 | §102§103 | Final Rejection | 15d overdue | AI Ready | Sep 28, 2022 |
| 17954291 | NECKED RIBBON FOR BETTER N WORKFUNCTION FILLING AND DEVICE PERFORMANCE | Intel Corporation | MENZ, DOUGLAS M | 2897 | §102§103 | Non-Final OA | 69d | AI Ready | Sep 27, 2022 |
| 17953213 | SURFACE FINISH WITH METAL DOME | Intel Corporation | MELLINGER, CORBYN DAVID | 2899 | §102§103 | Non-Final OA | — | Pending | Sep 26, 2022 |
| 17951995 | ALTERING OPERATIONAL CHARACTERISTICS OF A SEMICONDUCTOR DEVICE USING ACCELERATED IONS | Intel Corporation | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 5d overdue | AI Ready | Sep 23, 2022 |
| 17952031 | COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS | Intel Corporation | NAVARRO, HUGO IVAN | 2858 | §103§112 | Final Rejection | — | AI Ready | Sep 23, 2022 |
| 17952017 | TESTING A SEMICONDUCTOR DEVICE USING X-RAYS | Intel Corporation | HOQUE, FARHANA AKHTER | 2858 | §102 | Final Rejection | 15d | AI Ready | Sep 23, 2022 |
| 17895916 | THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES | Intel Corporation | AHMADI, MOHSEN | 2896 | §103§112 | Final Rejection | 25d overdue | AI Ready | Aug 25, 2022 |
| 17891738 | THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES | Intel Corporation | NIELSEN, DEREK LANG | 2899 | §103 | Final Rejection | — | Pending | Aug 19, 2022 |
| 17889962 | PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Non-Final OA | — | AI Ready | Aug 17, 2022 |
| 17890005 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI-HEIGHT STANDARD CELL CIRCUITS | Intel Corporation | STEVENSON, ANDRE C | 2899 | §103 | Non-Final OA | 72d | Pending | Aug 17, 2022 |
| 17889229 | SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES | Intel Corporation | FAN, SU JYA | 2818 | §103§112 | Non-Final OA | — | AI Ready | Aug 16, 2022 |
| 17887273 | SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS | Intel Corporation | BODNAR, JOHN A | 2893 | §102§103§112 | Final Rejection | 28d overdue | AI Ready | Aug 12, 2022 |
| 17886278 | ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES | Intel Corporation | CHI, SUBERR L | 2893 | §112 | Final Rejection | — | AI Ready | Aug 11, 2022 |
| 17858031 | SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER | Intel Corporation | TRAN, THANH Y | 2817 | §102§103 | Final Rejection | 2d overdue | AI Ready | Jul 05, 2022 |
| 17855608 | INTEGRATED CIRCUIT STRUCTURES HAVING RECESSED CHANNEL TRANSISTOR | Intel Corporation | CHUNG, ANDREW | 2898 | §102§103 | Final Rejection | — | Pending | Jun 30, 2022 |
| 17855636 | VOLTAGE CONTRAST SCAN AREA ON A WAFER | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 79d | Pending | Jun 30, 2022 |
| 17855573 | INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL TRANSISTOR | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Non-Final OA | — | Pending | Jun 30, 2022 |
| 17853329 | DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP) | Intel Corporation | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | 77d | AI Ready | Jun 29, 2022 |
| 17853500 | IN-SITU MULTI-LAYER DIELECTRIC FILMS FOR APPLICATION AS GATE SPACER AND ETCH STOP LAYERS | Intel Corporation | DUREN, TIMOTHY EDWARD | 2817 | §102§103§112 | Non-Final OA | 44d overdue | AI Ready | Jun 29, 2022 |
| 17851967 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND POWER DELIVERY | Intel Corporation | KNUDSON, BRAD ALLAN | 2817 | §103 | Non-Final OA | — | Pending | Jun 28, 2022 |
| 17851979 | INTEGRATED CIRCUIT STRUCTURES HAVING INVERTERS WITH CONTACTS BETWEEN NANOWIRES | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §102§103 | Non-Final OA | — | AI Ready | Jun 28, 2022 |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | AI Ready | Jun 27, 2022 |
| 17848643 | ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE | Intel Corporation | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §102§103 | Final Rejection | — | Pending | Jun 24, 2022 |
| 17833568 | ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT | Intel Corporation | FREAL, JOHN BRENDAN | 2847 | §103 | Non-Final OA | 71d | Pending | Jun 06, 2022 |
| 17826933 | USB TYPE-C SUBSYSTEM | Intel Corporation | UNELUS, ERNEST | 2181 | §102§103 | Non-Final OA | 4d overdue | AI Ready | May 27, 2022 |
| 17743913 | EMBEDDED ROUTING LAYER FOR INLINE CIRCUIT EDIT | Intel Corporation | AU, BAC H | 2898 | §102§103 | Non-Final OA | — | Pending | May 13, 2022 |
| 17716940 | TECHNIQUES FOR DIE TILING | Intel Corporation | JUNGE, BRYAN R. | 2897 | §103 | Non-Final OA | 69d | Pending | Apr 08, 2022 |
| 17710669 | SELF-DOCKING SELF-ALIGNED OPTICAL PCB CONNECTOR FOR SEMICONDUCTOR PACKAGES | Intel Corporation | PATEL, PREET BAKUL | 2874 | §103 | Final Rejection | — | Pending | Mar 31, 2022 |
| 17710837 | INTEGRATED CIRCUIT STRUCTURES WITH FULL-WRAP CONTACT STRUCTURE | Intel Corporation | BERRY, PAUL ANTHONY | 2898 | §103 | Non-Final OA | — | Pending | Mar 31, 2022 |
| 17710802 | DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY | Intel Corporation | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 15d overdue | AI Ready | Mar 31, 2022 |
| 17709365 | LAYERED 2D SEMICONDUCTORS | Intel Corporation | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 68d | Pending | Mar 30, 2022 |
| 17707708 | GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE | Intel Corporation | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 29, 2022 |
| 17707371 | PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO | Intel Corporation | POWERS, LAURA C | 1785 | §101§103§112DP | Final Rejection | 1d overdue | AI Ready | Mar 29, 2022 |
| 17707536 | GROOVED PACKAGE | Intel Corporation | PARENDO, KEVIN A | 2896 | §102§103 | Non-Final OA | — | Pending | Mar 29, 2022 |
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | Intel Corporation | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Non-Final OA | 10d overdue | AI Ready | Mar 14, 2022 |
| 17685632 | FIN ISOLATION STRUCTURES FORMED AFTER GATE METALLIZATION | Intel Corporation | BOATMAN, CASEY PAUL | 2893 | §102§103§112 | Non-Final OA | — | AI Ready | Mar 03, 2022 |
| 17561735 | SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | 3d overdue | AI Ready | Dec 24, 2021 |
| 17561733 | 3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES | Intel Corporation | TRAN, TIEN | 2812 | §103 | Final Rejection | 5d overdue | AI Ready | Dec 24, 2021 |
| 17561682 | INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL | Intel Corporation | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Final Rejection | 23d | AI Ready | Dec 23, 2021 |
| 17561670 | POWER DELIVERY USING BACKSIDE POWER FOR STITCHED DIES | Intel Corporation | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | — | AI Ready | Dec 23, 2021 |
| 17561681 | HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES | Intel Corporation | NGUYEN, CUONG B | 2818 | §103 | Final Rejection | 5d overdue | AI Ready | Dec 23, 2021 |
| 17557932 | SEMICONDUCTOR STRUCTURE FOR NANORIBBON ARCHITECTURES | Intel Corporation | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Non-Final OA | 70d | Pending | Dec 21, 2021 |
| 17558061 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE PLUG LANDED ON DIELECTRIC ANCHOR | Intel Corporation | CRAMER, HALEE PAIGE | 2891 | §103 | Final Rejection | — | AI Ready | Dec 21, 2021 |
| 17554456 | ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Final Rejection | 13d | AI Ready | Dec 17, 2021 |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | Intel Corporation | ADHIKARI DAWADI, BIPANA | 2898 | §112 | Non-Final OA | 45d overdue | AI Ready | Dec 17, 2021 |
| 17553189 | POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS | Intel Corporation | DINH, TUAN T | 2848 | §103 | Non-Final OA | — | AI Ready | Dec 16, 2021 |
| 17553161 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103 | Final Rejection | 9d | AI Ready | Dec 16, 2021 |
| 17549550 | INTEGRATED CIRCUIT STRUCTURES HAVING VERSATILE CHANNEL PLACEMENT | Intel Corporation | YI, CHANGHYUN | 2800 | §102§103 | Final Rejection | — | Pending | Dec 13, 2021 |
| 17485325 | OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE | Intel Corporation | MIHALIOV, DMITRI | 2812 | §103§112 | Non-Final OA | 72d | AI Ready | Sep 25, 2021 |
| 17485294 | ELIMINATION OF SUB-FIN LEAKAGE IN STACKED NANOSHEET ARCHITECTURES | Intel Corporation | NETTLES, CORALIE ANN | 2893 | §102§103 | Final Rejection | — | AI Ready | Sep 24, 2021 |
| 17485232 | COMPLEX FIELD-SHAPING BY FINE VARIATION OF LOCAL MATERIAL DENSITY OR PROPERTIES | Intel Corporation | WINTERS, SEAN AYERS | 2892 | §103 | Final Rejection | 31d overdue | AI Ready | Sep 24, 2021 |
| 17485202 | CMOS INTEGRATION OF 2D MATERIAL BY END ETCH | Intel Corporation | MIHALIOV, DMITRI | 2812 | §103§112 | Final Rejection | — | Pending | Sep 24, 2021 |
| 17482228 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG | Intel Corporation | DEGRASSE, IAN ISAAC | 2818 | §103 | Non-Final OA | — | AI Ready | Sep 22, 2021 |
| 17481237 | GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF LAYERS | Intel Corporation | ANDERSON, ERIK ARTHUR | 2812 | §112 | Non-Final OA | 11d overdue | AI Ready | Sep 21, 2021 |
| 17479031 | OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIES ATTACHED TO THE GLASS SUBSTRATE | Intel Corporation | JORDAN, ANDREW | 2874 | §103 | Final Rejection | 23d overdue | AI Ready | Sep 20, 2021 |
| 17507010 | DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS | Intel Corporation | SMITH, SAMUEL JONATHAN | 2817 | §103 | Non-Final OA | — | AI Ready | Sep 17, 2021 |
| 17357895 | NANORIBBON SUBFIN ISOLATION BY BACKSIDE SILICON SUBSTRATE REMOVAL WITH EPI PROTECTION | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Non-Final OA | — | Pending | Jun 24, 2021 |
| 17357722 | UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONNECT LAYER FOR INTERFACE DISAGGREGATION | Intel Corporation | CAMPBELL, SHAUN M | 2893 | §103 | Final Rejection | 24d overdue | AI Ready | Jun 24, 2021 |
| 17356056 | DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESULTING THEREFROM | Intel Corporation | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 23, 2021 |
| 17353275 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE PASS-THROUGH CONTACT | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 21, 2021 |
| 17353263 | INTEGRATED CIRCUIT STRUCTURES HAVING PLUGGED METAL GATES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Final Rejection | — | Pending | Jun 21, 2021 |
| 17350164 | CAPACITORS IN A GLASS SUBSTRATE | Intel Corporation | DOLE, TIMOTHY J | 2800 | §103 | Non-Final OA | 79d | Pending | Jun 17, 2021 |
| 17346990 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §103 | Non-Final OA | 11d overdue | Pending | Jun 14, 2021 |
| 17346999 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE VIA BAR | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103 | Final Rejection | — | AI Ready | Jun 14, 2021 |
| 17232010 | THROUGH GATE FIN ISOLATION | Intel Corporation | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | — | Pending | Apr 15, 2021 |
| 17211751 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP | Intel Corporation | ANDERSON, WILLIAM H | 2817 | §103 | Non-Final OA | — | Pending | Mar 24, 2021 |
| 17191615 | PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS | Intel Corporation | XU, ZHIJUN | 2818 | §103 | Non-Final OA | — | Pending | Mar 03, 2021 |
| 17129854 | METAL INSULATOR METAL (MIM) CAPACITOR WITH PEROVSKITE DIELECTRIC | Intel Corporation | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | 15d overdue | AI Ready | Dec 21, 2020 |
| 17031719 | 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS | Intel Corporation | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | 218d overdue | Pending | Sep 24, 2020 |
| 16898198 | HIGH SPEED MEMORY SYSTEM INTEGRATION | Intel Corporation | MONTALVO, EVA Y | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jun 10, 2020 |
| 16803887 | INTERPOSER HEAT SPREADER | Intel Corporation | HAN, JONATHAN | 2818 | §102§103§112 | Final Rejection | — | Pending | Feb 27, 2020 |
| 16542960 | PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | MIYOSHI, JESSE Y | 2898 | §112 | Final Rejection | — | AI Ready | Aug 16, 2019 |
| 15859415 | PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Intel Corporation | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | 62d | AI Ready | Dec 30, 2017 |
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