Prosecution Insights
Prosecution Insights
91 pending office actions • 1 client • 76 examiners • 23 art units • 0 of 91 (0%) have an AI response strategy ready • 398 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 91 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 91 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 71 (78%) |
| §102 only | 8 (9%) |
| §112 only | 6 (7%) |
| No statute on record | 6 (7%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| TRAN, TAN N | 3 | 86.6% | +10.1% |
| MCCOY, THOMAS WILSON | 3 | 92.9% | +12.5% |
| VALENZUELA, PATRICIA D | 3 | 90.2% | +2.1% |
| BOULGHASSOUL, YOUNES | 3 | 88.3% | +7.3% |
| CULBERT, CHRISTOPHER A | 2 | 41.5% | +4.9% |
| FARMER, EMILY NICOLE | 2 | 93.8% | +8.7% |
| BOATMAN, CASEY PAUL | 2 | 82.4% | +13.7% |
| ENAD, CHRISTINE A | 2 | 84.2% | +10.2% |
| PIZARRO CRESPO, MARCOS D | 2 | 65.8% | +14.9% |
| PRIDEMORE, NATHAN ANDREW | 2 | 73.8% | +20.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 46d overdue |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 42d overdue |
| 18485602 | GATE FORMATION PROCESS | FARMER, EMILY NICOLE | 23d overdue |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | TRAN, TAN N | 17d overdue |
| 18348851 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METHOD FOR FORMING SAME | ENAD, CHRISTINE A | 5d overdue |
| 18327628 | OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATING THEREOF | BOULGHASSOUL, YOUNES | 4d overdue |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | FARMER, EMILY NICOLE | 9d |
| 17818230 | EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES | BOULGHASSOUL, YOUNES | 14d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17859982 | Strained Channel Field Effect Transistor | PIZARRO CRESPO, MARCOS D | 268d overdue |
| 18335741 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | PIZARRO CRESPO, MARCOS D | 36d overdue |
| 17464980 | Semiconductor Structures With Densly Spaced Contact Features | PRIDEMORE, NATHAN ANDREW | 36d overdue |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | TRAN, TAN N | 17d overdue |
| 18348851 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METHOD FOR FORMING SAME | ENAD, CHRISTINE A | 5d overdue |
| 18321609 | METHOD OF FORMING CONTACT STRUCTURES | PRIDEMORE, NATHAN ANDREW | 7d |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | MCCOY, THOMAS WILSON | 15d |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | MCCOY, THOMAS WILSON | 21d |
| Client (Assignee) | Pending OAs |
|---|---|
| TSMC | 91 |
| Art Unit | Apps |
|---|---|
| 2898 | 13 |
| 2812 | 12 |
| 2818 | 10 |
| 2814 | 9 |
| 2811 | 6 |
| 2893 | 6 |
| 2899 | 4 |
| 2891 | 4 |
| 2817 | 4 |
| 2815 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19027299 | MTJ DEVICE PERFORMANCE BY ADDING STRESS MODULATION LAYER TO MTJ DEVICE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | KLIMOWICZ, WILLIAM JOSEPH | 2688 | Other | Non-Final OA | 21d | Pending | Jan 17, 2025 |
| 18889003 | PHOTOLITHOGRAPHY APPARATUS AND METHOD OF OPERATING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | PERSAUD, DEORAM | 2882 | §103 | Non-Final OA | 71d | Pending | Sep 18, 2024 |
| 18782988 | IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING | Taiwan Semiconductor Manufacturing Co., Ltd. | CHEN, CHIA WEI A | 2637 | §103 | Non-Final OA | 8d overdue | Pending | Jul 24, 2024 |
| 18781018 | Metal Contacts on Metal Gates and Methods Thereof | Taiwan Semiconductor Manufacturing Co., Ltd. | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | 36d overdue | Pending | Jul 23, 2024 |
| 18757659 | SEMICONDUCTOR STRUCTURE HAVING BOTH GATE-ALL-AROUND DEVICES AND PLANAR DEVICES | Taiwan Semiconductor Manufacturing Co., Ltd. | GEBREMARIAM, SAMUEL A | 2811 | §112 | Non-Final OA | 19d overdue | Pending | Jun 28, 2024 |
| 18757949 | PHOTORESIST FOR SEMICONDUCTOR FABRICATION | Taiwan Semiconductor Manufacturing Company, Ltd. | CHU, JOHN S Y | 1737 | §112 | Non-Final OA | 29d | Pending | Jun 28, 2024 |
| 18751423 | SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE | Taiwan Semiconductor Manufacturing Co., Ltd. | LUND, JEFFRIE ROBERT | 1716 | Other | Non-Final OA | 34d | Pending | Jun 24, 2024 |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | Taiwan Semiconductor Manufacturing Co., Ltd. | TRAN, TAN N | 2812 | §103 | Non-Final OA | 17d overdue | Pending | May 30, 2024 |
| 18655568 | MEMORY DEVICES WITH GATE ALL AROUND TRANSISTORS | Taiwan Semiconductor Manufacturing Co., Ltd. | TRAN, ANTHAN | 2825 | §103 | Non-Final OA | 36d overdue | Pending | May 06, 2024 |
| 18615403 | GATE STRUCTURE AND PATTERNING METHOD | Taiwan Semiconductor Manufacturing Co., Ltd. | OH, JAEHWAN | 2899 | §103 | Non-Final OA | 48d | Pending | Mar 25, 2024 |
| 18421373 | ELECTRON MICROSCOPE DETECTOR AND RELATED METHODS | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCORMACK, JASON L | 2881 | §103 | Non-Final OA | 14d | Pending | Jan 24, 2024 |
| 18406836 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CONDUCTIVE VIAS | Taiwan Semiconductor Manufacturing Company, Ltd. | PEREZ GUTIERREZ, RAFAEL | 2642 | §103 | Non-Final OA | 16d | Pending | Jan 08, 2024 |
| 18531007 | ETCH STOP LAYERS | Taiwan Semiconductor Manufacturing Company, Ltd. | YI, CHANGHYUN | 2812 | §103 | Non-Final OA | 3d overdue | Pending | Dec 06, 2023 |
| 18531089 | BACK-END ACTIVE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOU, SHIH TSUN A | 2811 | §103 | Non-Final OA | 14d | Pending | Dec 06, 2023 |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | Taiwan Semiconductor Manufacturing Company, Ltd. | BEARDSLEY, JONAS TYLER | 2811 | §103 | Non-Final OA | 14d | Pending | Dec 04, 2023 |
| 18526473 | CONTACT GATE ISOLATION | Taiwan Semiconductor Manufacturing Company, Ltd. | ADHIKARI DAWADI, BIPANA | 2898 | §103 | Non-Final OA | 22d | Pending | Dec 01, 2023 |
| 18524445 | Backside Via and Dual Side Power Rail For Epitaxial Source/Drain Structure | Taiwan Semiconductor Manufacturing Company, Ltd. | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Non-Final OA | 41d | Pending | Nov 30, 2023 |
| 18524627 | FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Co., Ltd. | FAN, SU JYA | 2818 | §103 | Non-Final OA | 26d overdue | Pending | Nov 30, 2023 |
| 18524533 | METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | AU, BAC H | 2898 | §103 | Non-Final OA | 38d overdue | Pending | Nov 30, 2023 |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | §103 | Non-Final OA | 21d | Pending | Nov 30, 2023 |
| 18524514 | Semiconductor Structures and Methods of Forming Same | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TAN N | 2812 | §103 | Non-Final OA | 34d | Pending | Nov 30, 2023 |
| 18521569 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | Taiwan Semiconductor Manufacturing Company, Ltd. | GARCES, NELSON Y | 2814 | §103 | Non-Final OA | 21d | Pending | Nov 28, 2023 |
| 18515921 | Radical Treatment in Supercritical Fluid for Gate Dielectric Quality Improvement to CFET Structure | Taiwan Semiconductor Manufacturing Company, Ltd. | LI, MEIYA | 2811 | §112 | Non-Final OA | 62d | Pending | Nov 21, 2023 |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 9d | Pending | Nov 17, 2023 |
| 18512570 | INNER SPACERS FOR MULTI-GATE TRANSISTORS AND MANUFACTURING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TAN N | 2812 | §103 | Non-Final OA | 34d | Pending | Nov 17, 2023 |
| 18505668 | DEVICE PERFORMANCE DIVERSIFICATION | Taiwan Semiconductor Manufacturing Company, Ltd. | YEMELYANOV, DMITRIY | 2891 | §103 | Non-Final OA | 6d | Pending | Nov 09, 2023 |
| 18504398 | SEMICONDUCTOR FABRICATION PROCESSES FOR DEFECT REDUCTION | Taiwan Semiconductor Manufacturing Company, Ltd. | PATEL, REEMA | 2812 | §112 | Non-Final OA | 41d | Pending | Nov 08, 2023 |
| 18504714 | CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS | Taiwan Semiconductor Manufacturing Co., Ltd. | JEFFERSON, QUOVAUNDA | 2899 | Other | Non-Final OA | 49d overdue | Pending | Nov 08, 2023 |
| 18498305 | OXYGEN CONTROL DURING GATE FORMATION FOR IMPROVED CHANNEL MOBILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | 30d | Pending | Oct 31, 2023 |
| 18494073 | SRAM STRUCTURE WITH DUAL SIDE POWER RAILS | Taiwan Semiconductor Manufacturing Company, Ltd. | INOUSSA, MOULOUCOULAY | 2818 | §102 | Non-Final OA | 2d overdue | Pending | Oct 25, 2023 |
| 18492382 | Contact Formation Method and Related Structure | Taiwan Semiconductor Manufacturing Company, Ltd. | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103 | Non-Final OA | 45d overdue | Pending | Oct 23, 2023 |
| 18492258 | EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | §103 | Non-Final OA | 83d | Pending | Oct 23, 2023 |
| 18492111 | MULTI-PORT SRAM CELL WITH ENLARGED CONTACT VIAS | Taiwan Semiconductor Manufacturing Company, Ltd. | KUSUMAKAR, KAREN M | 2897 | §102 | Non-Final OA | 60d | Pending | Oct 23, 2023 |
| 18485602 | GATE FORMATION PROCESS | Taiwan Semiconductor Manufacturing Company, Ltd. | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 23d overdue | Pending | Oct 12, 2023 |
| 18481679 | BACKSIDE DIELECTRIC PLUG | Taiwan Semiconductor Manufacturing Company, Ltd. | TAYLOR, EARL N | 2896 | §102 | Non-Final OA | 9d | Pending | Oct 05, 2023 |
| 18478365 | THRESHOLD VOLTAGE TUNING OF NFET VIA IMPLEMENTATION OF AN ALUMINUM-FREE CONDUCTIVE LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | AHMED, SHAHED | 2813 | §103 | Non-Final OA | 42d | Pending | Sep 29, 2023 |
| 18474606 | THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, DAO H | 2818 | §103 | Non-Final OA | 46d | Pending | Sep 26, 2023 |
| 18470614 | Semiconductor Device Having FIN Structure and Method of Forming Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | BODNAR, JOHN A | 2893 | §103 | Non-Final OA | 79d | Pending | Sep 20, 2023 |
| 18469911 | MEMORY DEVICES WITH A BACKSIDE READ WORD LINE | Taiwan Semiconductor Manufacturing Company, Ltd. | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | 40d | Pending | Sep 19, 2023 |
| 18467412 | METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 33d | Pending | Sep 14, 2023 |
| 18467200 | Semiconductor Device Package with Thermal Module | Taiwan Semiconductor Manufacturing Company, Ltd. | BOATMAN, CASEY PAUL | 2893 | §103 | Non-Final OA | 57d | Pending | Sep 14, 2023 |
| 18456291 | ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES | Taiwan Semiconductor Manufacturing Company, Ltd. | JUNG, MICHAEL YOO LIM | 2817 | §103 | Non-Final OA | 7d | Pending | Aug 25, 2023 |
| 18446733 | Spacer Structures for Nano-Sheet-Based Devices | Taiwan Semiconductor Manufacturing Company, Ltd. | WINTERS, SEAN AYERS | 2892 | §103 | Non-Final OA | 31d overdue | Pending | Aug 09, 2023 |
| 18365667 | METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | MINNEY, GABRIEL SEBASTIAN | 2897 | §103 | Non-Final OA | 42d overdue | Pending | Aug 04, 2023 |
| 18361832 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Co., Ltd. | MILLER, JAMI VALENTINE | 2818 | §103 | Non-Final OA | 33d | Pending | Jul 29, 2023 |
| 18361569 | BENT FIN DEVICES | Taiwan Semiconductor Manufacturing Co., Ltd. | KOO, LAMONT B | 2813 | §103 | Non-Final OA | 10d overdue | Pending | Jul 28, 2023 |
| 18360510 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company Ltd. | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | 14d | Pending | Jul 27, 2023 |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | LUKE, DANIEL M | 2896 | §103 | Final Rejection | 5d | Pending | Jul 25, 2023 |
| 18358634 | Integrated Circuits Having Protruding Interconnect Conductors | Taiwan Semiconductor Manufacturing Co., Ltd. | GEYER, SCOTT B | 2812 | Other | Non-Final OA | 12d | Pending | Jul 25, 2023 |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 46d overdue | Pending | Jul 25, 2023 |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | Other | Non-Final OA | 42d overdue | Pending | Jul 21, 2023 |
| 18353732 | Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 32d overdue | Pending | Jul 17, 2023 |
| 18352556 | MATERIALS AND METHODS FOR FORMING RESIST BOTTOM LAYER | Taiwan Semiconductor Manufacturing Co., Ltd. | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | 40d | Pending | Jul 14, 2023 |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BERRY, PAUL ANTHONY | 2898 | §103 | Non-Final OA | 37d overdue | Pending | Jul 14, 2023 |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 10, 2023 |
| 18349298 | INTEGRATION OF MEMORY CELL AND LOGIC CELL | Taiwan Semiconductor Manufacturing Company, Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Final Rejection | 30d overdue | Pending | Jul 10, 2023 |
| 18348780 | MULTI-GATE DEVICE AND RELATED METHODS | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 26d | Pending | Jul 07, 2023 |
| 18348851 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METHOD FOR FORMING SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | §112 | Final Rejection | 5d overdue | Pending | Jul 07, 2023 |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | 15d | Pending | Jun 15, 2023 |
| 18335741 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | §102 | Non-Final OA | 36d overdue | Pending | Jun 15, 2023 |
| 18335525 | FEEDTHROUGH VIA BETWEEN ACTIVE REGIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | 46d overdue | Pending | Jun 15, 2023 |
| 18333197 | SRAM CELL WITH BALANCED WRITE PORT | Taiwan Semiconductor Manufacturing Co., Ltd. | JUNGE, BRYAN R. | 2897 | §102 | Non-Final OA | 40d | Pending | Jun 12, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | Taiwan Semiconductor Manufacturing Co., Ltd. | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 13d | Pending | Jun 05, 2023 |
| 18327628 | OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | BOULGHASSOUL, YOUNES | 2814 | §103 | Non-Final OA | 4d overdue | Pending | Jun 01, 2023 |
| 18323688 | LAYOUT OF SCRIBE LINE FEATURES | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, DA WEI | 2817 | §102 | Non-Final OA | 9d | Pending | May 25, 2023 |
| 18321609 | METHOD OF FORMING CONTACT STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | PRIDEMORE, NATHAN ANDREW | 2898 | §103 | Non-Final OA | 7d | Pending | May 22, 2023 |
| 18316146 | P-DIPOLE MATERIAL FOR STACKED TRANSISTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | HOANG, TUAN A | 2898 | §103 | Non-Final OA | 2d overdue | Pending | May 11, 2023 |
| 18313705 | METHOD OF MODELING A MASK BY TAKING INTO ACCOUNT OF MASK PATTERN EDGE INTERACTION | Taiwan Semiconductor Manufacturing Co., Ltd. | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §103 | Non-Final OA | 30d | Pending | May 08, 2023 |
| 18308982 | SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | HAN, JONATHAN | 2818 | §103 | Non-Final OA | 4d overdue | Pending | Apr 28, 2023 |
| 18298031 | METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING | Taiwan Semiconductor Manufacturing Company, Ltd. | TANDY, LAURA ELOISE | 2881 | §103 | Non-Final OA | 66d overdue | Pending | Apr 10, 2023 |
| 18188196 | Metal-Insulator-Metal Capacitors And Methods Of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, DUY T V | 2818 | Other | Final Rejection | 16d overdue | Pending | Mar 22, 2023 |
| 18182144 | Source/Drain Contacts And Methods For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | HOANG, TUAN A | 2898 | §103 | Final Rejection | 46d | Pending | Mar 10, 2023 |
| 18181430 | Multi-Gate Devices And Method Of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | CHUNG, ANDREW | 2898 | §103 | Non-Final OA | 50d overdue | Pending | Mar 09, 2023 |
| 18161555 | SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | HARRISON, MONICA D | 2815 | §103 | Non-Final OA | 11d overdue | Pending | Jan 30, 2023 |
| 18157054 | METHOD OF MODULATING MULTI-GATE DEVICE CHANNELS AND STRUCTURES THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | NIX, NORA TAYLOR | 2891 | §103 | Non-Final OA | 80d overdue | Pending | Jan 19, 2023 |
| 18150863 | PHASE-CHANGE DEVICE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | AMER, MOUNIR S | 2818 | §103 | Non-Final OA | 19d | Pending | Jan 06, 2023 |
| 18149265 | Via Structures | Taiwan Semiconductor Manufacturing Co., Ltd. | BOULGHASSOUL, YOUNES | 2814 | §103 | Final Rejection | 34d | Pending | Jan 03, 2023 |
| 17884636 | PMOSFET SOURCE DRAIN | Taiwan Semiconductor Manufacturing Co., Ltd. | NARAGHI, ALI | 2817 | §103 | Non-Final OA | 28d | Pending | Aug 10, 2022 |
| 17818230 | EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Co., Ltd. | BOULGHASSOUL, YOUNES | 2814 | §112 | Non-Final OA | 14d | Pending | Aug 08, 2022 |
| 17881430 | Methods For Forming Isolation Structures | Taiwan Semiconductor Manufacturing Company, Ltd. | BOATMAN, CASEY PAUL | 2893 | §103 | Non-Final OA | 40d | Pending | Aug 04, 2022 |
| 17815968 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | Taiwan Semiconductor Manufacturing Co., Ltd. | HSIEH, HSIN YI | 2899 | §103 | Final Rejection | 72d | Pending | Jul 29, 2022 |
| 17876966 | Semiconductor Structure With Source/Drain Contact Plugs And Method For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAMER, HALEE PAIGE | 2891 | §103 | Non-Final OA | 155d overdue | Pending | Jul 29, 2022 |
| 17815861 | Memory Device and Method of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | GREEN, TELLY D | 2898 | §103 | Final Rejection | 9d overdue | Pending | Jul 28, 2022 |
| 17814905 | Structure and Method for Single Gate Non-Volatile Memory Device | Taiwan Semiconductor Manufacturing Company, Ltd. | BELL, LAUREN R | 2896 | §103 | Non-Final OA | 29d | Pending | Jul 26, 2022 |
| 17812991 | INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TIEN | 2812 | §103 | Non-Final OA | 34d | Pending | Jul 15, 2022 |
| 17859982 | Strained Channel Field Effect Transistor | Taiwan Semiconductor Manufacturing Company, Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | 268d overdue | Pending | Jul 07, 2022 |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | Taiwan Semiconductor Manufacturing Company, Ltd. | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | 24d overdue | Pending | Apr 26, 2022 |
| 17726705 | Metal Interconnects And Method Of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | 8d overdue | Pending | Apr 22, 2022 |
| 17721723 | Semiconductor Structure And Method For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | FOX, BRANDON C | 2818 | §102 | Non-Final OA | 28d | Pending | Apr 15, 2022 |
| 17464980 | Semiconductor Structures With Densly Spaced Contact Features | Taiwan Semiconductor Manufacturing Company, Ltd. | PRIDEMORE, NATHAN ANDREW | 2898 | §103 | Non-Final OA | 36d overdue | Pending | Sep 02, 2021 |
| 17001446 | Metal Contacts on Metal Gates and Methods Thereof | Taiwan Semiconductor Manufacturing Co., Ltd. | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | 59d overdue | Pending | Aug 24, 2020 |
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