144 pending office actions • 6 clients
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 19027299 | MTJ DEVICE PERFORMANCE BY ADDING STRESS MODULATION LAYER TO MTJ DEVICE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | KLIMOWICZ, WILLIAM JOSEPH | 2688 | Non-Final OA | Jan 17, 2025 |
| 18784033 | Semiconductor Device For Logic and Memory Co-Optimization | Taiwan Semiconductor Manufacturing Co., Ltd. | TRAN, ANH Q | 2844 | Non-Final OA | Jul 25, 2024 |
| 18782988 | IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING | Taiwan Semiconductor Manufacturing Co., Ltd. | CHEN, CHIA WEI A | 2637 | Non-Final OA | Jul 24, 2024 |
| 18782714 | METHOD FOR FORMING A MAMR STRUCTURE BASED ON A TMR - SPIN TORQUE OSCILLATOR (STO) HAVING SEED LAYER AND CAPPING LAYER OF METAL OXIDE | Taiwan Semiconductor Manufacturing Company, Ltd. | MAI, ANH D | 2893 | Non-Final OA | Jul 24, 2024 |
| 18781018 | Metal Contacts on Metal Gates and Methods Thereof | Taiwan Semiconductor Manufacturing Co., Ltd. | CULBERT, CHRISTOPHER A | 2815 | Final Rejection | Jul 23, 2024 |
| 18757659 | SEMICONDUCTOR STRUCTURE HAVING BOTH GATE-ALL-AROUND DEVICES AND PLANAR DEVICES | Taiwan Semiconductor Manufacturing Co., Ltd. | GEBREMARIAM, SAMUEL A | 2811 | Non-Final OA | Jun 28, 2024 |
| 18757949 | PHOTORESIST FOR SEMICONDUCTOR FABRICATION | Taiwan Semiconductor Manufacturing Company, Ltd. | CHU, JOHN S Y | 1737 | Final Rejection | Jun 28, 2024 |
| 18751423 | SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE | Taiwan Semiconductor Manufacturing Co., Ltd. | LUND, JEFFRIE ROBERT | 1716 | Non-Final OA | Jun 24, 2024 |
| 18655568 | MEMORY DEVICES WITH GATE ALL AROUND TRANSISTORS | Taiwan Semiconductor Manufacturing Co., Ltd. | TRAN, ANTHAN | 2825 | Non-Final OA | May 06, 2024 |
| 18615403 | GATE STRUCTURE AND PATTERNING METHOD | Taiwan Semiconductor Manufacturing Co., Ltd. | OH, JAEHWAN | 2899 | Non-Final OA | Mar 25, 2024 |
| 18600394 | BOTTOM-UP METAL GATE FOR STACKED DEVICE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOU, SHIH TSUN A | 2811 | Non-Final OA | Mar 08, 2024 |
| 18444268 | IC Structure with Stress-Release Pattern to Enhance Package Yield | Taiwan Semiconductor Manufacturing Company, Ltd. | GONDARENKO, NATALIA A | 2891 | Non-Final OA | Feb 16, 2024 |
| 18437635 | STACKED MULTI-GATE DEVICE WITH CONTACT FEATURE AND METHODS FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | DOAN, THERESA T | 2814 | Non-Final OA | Feb 09, 2024 |
| 18425264 | THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, CUONG B | 2818 | Non-Final OA | Jan 29, 2024 |
| 18421373 | ELECTRON MICROSCOPE DETECTOR AND RELATED METHODS | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCORMACK, JASON L | 2881 | Non-Final OA | Jan 24, 2024 |
| 18413960 | SEMICONDUCTOR STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | BAUMAN, SCOTT E | 2815 | Non-Final OA | Jan 16, 2024 |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | Taiwan Semiconductor Manufacturing Company, Ltd. | TUTTLE, ETHAN ALEXANDER | 2897 | Non-Final OA | Jan 09, 2024 |
| 18407524 | SEMICONDUCTOR DEVICE WITH HYBRID SUBSTRATE AND MANUFACTURING METHODS THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | CHAMBLISS, ALONZO | 2897 | Non-Final OA | Jan 09, 2024 |
| 18406836 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CONDUCTIVE VIAS | Taiwan Semiconductor Manufacturing Company, Ltd. | RIVAS, CRISTIAN O | 2642 | Non-Final OA | Jan 08, 2024 |
| 18405919 | IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Jan 05, 2024 |
| 18405318 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | BELL, LAUREN R | 2896 | Non-Final OA | Jan 05, 2024 |
| 18403056 | Volumeless Threshold Voltage Tuning for Stacked Device Structures | Taiwan Semiconductor Manufacturing Company, Ltd. | MENZ, LAURA MARY | 2813 | Non-Final OA | Jan 03, 2024 |
| 18531007 | ETCH STOP LAYERS | Taiwan Semiconductor Manufacturing Company, Ltd. | YI, CHANGHYUN | 2812 | Non-Final OA | Dec 06, 2023 |
| 18531089 | BACK-END ACTIVE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOU, SHIH TSUN A | 2811 | Non-Final OA | Dec 06, 2023 |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | Taiwan Semiconductor Manufacturing Company, Ltd. | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Dec 04, 2023 |
| 18526878 | FORMATION OF GATE-ALL-AROUND DEVICES AND STRUCTURES THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | NICELY, JOSEPH C | 2813 | Non-Final OA | Dec 01, 2023 |
| 18526828 | CONTACT AIR GAP FORMATION AND STRUCTURES THEREOF | Taiwan Semiconductor Manufacturing Co., Ltd. | BOWEN, ADAM S | 2897 | Non-Final OA | Dec 01, 2023 |
| 18526473 | CONTACT GATE ISOLATION | Taiwan Semiconductor Manufacturing Company, Ltd. | ADHIKARI DAWADI, BIPANA | 2898 | Non-Final OA | Dec 01, 2023 |
| 18524282 | In-Situ Tungsten for Gate Stack of Multigate Device | Taiwan Semiconductor Manufacturing Company, Ltd. | ISAAC, STANETTA D | 2898 | Non-Final OA | Nov 30, 2023 |
| 18524533 | METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | AU, BAC H | 2898 | Non-Final OA | Nov 30, 2023 |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Nov 30, 2023 |
| 18524627 | FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Co., Ltd. | FAN, SU JYA | 2818 | Non-Final OA | Nov 30, 2023 |
| 18521701 | SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATING THE SAME | Taiwan Semiconductor Manufacturing Co., Ltd. | ASSOUMAN, HERVE-LOUIS Y | 2812 | Non-Final OA | Nov 28, 2023 |
| 18521569 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | Taiwan Semiconductor Manufacturing Company, Ltd. | GARCES, NELSON Y | 2814 | Non-Final OA | Nov 28, 2023 |
| 18517945 | ISOLATION STRUCTURES FOR MULTI-GATE DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, TONG-HO | 2811 | Non-Final OA | Nov 22, 2023 |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Nov 17, 2023 |
| 18512570 | INNER SPACERS FOR MULTI-GATE TRANSISTORS AND MANUFACTURING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TAN N | 2812 | Non-Final OA | Nov 17, 2023 |
| 18505668 | DEVICE PERFORMANCE DIVERSIFICATION | Taiwan Semiconductor Manufacturing Company, Ltd. | YEMELYANOV, DMITRIY | 2891 | Non-Final OA | Nov 09, 2023 |
| 18505631 | Semiconductor Device and Method of Fabricating Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | YEMELYANOV, DMITRIY | 2891 | Non-Final OA | Nov 09, 2023 |
| 18504398 | SEMICONDUCTOR FABRICATION PROCESSES FOR DEFECT REDUCTION | Taiwan Semiconductor Manufacturing Company, Ltd. | PATEL, REEMA | 2812 | Non-Final OA | Nov 08, 2023 |
| 18504714 | CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS | Taiwan Semiconductor Manufacturing Co., Ltd. | JEFFERSON, QUOVAUNDA | 2899 | Non-Final OA | Nov 08, 2023 |
| 18498900 | Semiconductor Device Having Dielectric Material Treated with Microwave Plasma and Method of Fabricating Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | LAOBAK, ANDREW KEELAN | 1713 | Non-Final OA | Oct 31, 2023 |
| 18494073 | SRAM STRUCTURE WITH DUAL SIDE POWER RAILS | Taiwan Semiconductor Manufacturing Company, Ltd. | INOUSSA, MOULOUCOULAY | 2818 | Non-Final OA | Oct 25, 2023 |
| 18492382 | Contact Formation Method and Related Structure | Taiwan Semiconductor Manufacturing Company, Ltd. | PALANISWAMY, KRISHNA JAYANTHI | 2899 | Non-Final OA | Oct 23, 2023 |
| 18491486 | VARACTORS HAVING INCREASED TUNING RATIO | Taiwan Semiconductor Manufacturing Company, Ltd. | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Oct 20, 2023 |
| 18488805 | COMPACT EFUSE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | DIALLO, MAMADOU L | 2897 | Non-Final OA | Oct 17, 2023 |
| 18488659 | SEMICONDUCTOR DEVICE WITH METAL GATE STRUCTURE AND FABRICATION METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, YU | 2896 | Non-Final OA | Oct 17, 2023 |
| 18485602 | GATE FORMATION PROCESS | Taiwan Semiconductor Manufacturing Company, Ltd. | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Oct 12, 2023 |
| 18481679 | BACKSIDE DIELECTRIC PLUG | Taiwan Semiconductor Manufacturing Company, Ltd. | TAYLOR, EARL N | 2896 | Non-Final OA | Oct 05, 2023 |
| 18475965 | STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND BOTTOM SOURCE/DRAIN FEATURES | Taiwan Semiconductor Manufacturing Company, Ltd. | DINKE, BITEW A | 2812 | Non-Final OA | Sep 27, 2023 |
| 18470614 | Semiconductor Device Having FIN Structure and Method of Forming Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | BODNAR, JOHN A | 2893 | Non-Final OA | Sep 20, 2023 |
| 18469911 | MEMORY DEVICES WITH A BACKSIDE READ WORD LINE | Taiwan Semiconductor Manufacturing Company, Ltd. | RAHIM, NILUFA | 2893 | Non-Final OA | Sep 19, 2023 |
| 18467072 | Molybdenum-Containing Device-Level Interconnects and Methods of Fabrication Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | HAIDER, WASIUL | 2812 | Non-Final OA | Sep 14, 2023 |
| 18456291 | ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES | Taiwan Semiconductor Manufacturing Company, Ltd. | JUNG, MICHAEL YOO LIM | 2817 | Non-Final OA | Aug 25, 2023 |
| 18446549 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | HALL, VICTORIA KATHLEEN | 2897 | Final Rejection | Aug 09, 2023 |
| 18446917 | METHOD AND STRUCTURE FOR DIODES WITH BACKSIDE CONTACTS | Taiwan Semiconductor Manufacturing Company, Ltd. | MIYOSHI, JESSE Y | 2898 | Final Rejection | Aug 09, 2023 |
| 18446733 | Spacer Structures for Nano-Sheet-Based Devices | Taiwan Semiconductor Manufacturing Company, Ltd. | WINTERS, SEAN AYERS | 2892 | Non-Final OA | Aug 09, 2023 |
| 18366370 | STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE | Taiwan Semiconductor Manufacturing Co., Ltd. | KOO, LAMONT B | 2813 | Non-Final OA | Aug 07, 2023 |
| 18365667 | METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | MINNEY, GABRIEL SEBASTIAN | 2897 | Non-Final OA | Aug 04, 2023 |
| 18365470 | CHANNEL WIDTH MODULATION | Taiwan Semiconductor Manufacturing Company, Ltd. | TANG, ALICE W | 2814 | Non-Final OA | Aug 04, 2023 |
| 18364614 | METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARIZATION | Taiwan Semiconductor Manufacturing Co., Ltd. | BAUMAN, SCOTT E | 2815 | Non-Final OA | Aug 03, 2023 |
| 18361832 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Co., Ltd. | MILLER, JAMI VALENTINE | 2818 | Non-Final OA | Jul 29, 2023 |
| 18361569 | BENT FIN DEVICES | Taiwan Semiconductor Manufacturing Co., Ltd. | KOO, LAMONT B | 2813 | Non-Final OA | Jul 28, 2023 |
| 18361622 | LEAKAGE REDUCTION METHODS AND STRUCTURES THEREOF | Taiwan Semiconductor Manufacturing Co., Ltd. | PARKER, JOHN M | 2899 | Non-Final OA | Jul 28, 2023 |
| 18361402 | BOTTOM ANTIREFLECTIVE COATING MATERIALS | Taiwan Semiconductor Manufacturing Co., Ltd. | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Jul 28, 2023 |
| 18360510 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company Ltd. | ISAAC, STANETTA D | 2898 | Non-Final OA | Jul 27, 2023 |
| 18359747 | REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | LU, JIONG-PING | 1713 | Final Rejection | Jul 26, 2023 |
| 18358634 | Integrated Circuits Having Protruding Interconnect Conductors | Taiwan Semiconductor Manufacturing Co., Ltd. | GEYER, SCOTT B | 2812 | Non-Final OA | Jul 25, 2023 |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 25, 2023 |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | LUKE, DANIEL M | 2896 | Final Rejection | Jul 25, 2023 |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 21, 2023 |
| 18355688 | GATE DIELECTRIC LAYERS FOR STACKED MULTI-GATE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, TONG-HO | 2811 | Non-Final OA | Jul 20, 2023 |
| 18353732 | Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | OH, JIYOUNG | 2818 | Non-Final OA | Jul 17, 2023 |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | Jul 14, 2023 |
| 18352556 | MATERIALS AND METHODS FOR FORMING RESIST BOTTOM LAYER | Taiwan Semiconductor Manufacturing Co., Ltd. | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Jul 14, 2023 |
| 18352847 | Structure and Method for High-Voltage Device | Taiwan Semiconductor Manufacturing Company, Ltd. | DOAN, THERESA T | 2814 | Non-Final OA | Jul 14, 2023 |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 10, 2023 |
| 18349298 | INTEGRATION OF MEMORY CELL AND LOGIC CELL | Taiwan Semiconductor Manufacturing Company, Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | Final Rejection | Jul 10, 2023 |
| 18348868 | SELECTIVE SIN CAPPING ON METAL GATE FOR METAL OXIDATION PREVENTION | Taiwan Semiconductor Manufacturing Company, Ltd. | AU, BAC H | 2898 | Non-Final OA | Jul 07, 2023 |
| 18348851 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METHOD FOR FORMING SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | Final Rejection | Jul 07, 2023 |
| 18348780 | MULTI-GATE DEVICE AND RELATED METHODS | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jul 07, 2023 |
| 18340253 | Phase Change Material In An Electronic Switch Having A Flat Profile | Taiwan Semiconductor Manufacturing Company, Ltd. | NETTLES, CORALIE ANN | 2893 | Non-Final OA | Jun 23, 2023 |
| 18335525 | FEEDTHROUGH VIA BETWEEN ACTIVE REGIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | TRICE III, WILLIAM CLARENCE | 2893 | Non-Final OA | Jun 15, 2023 |
| 18335741 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Jun 15, 2023 |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | MCCOY, THOMAS WILSON | 2814 | Final Rejection | Jun 15, 2023 |
| 18334630 | NOISE TRANSISTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | TRICE III, WILLIAM CLARENCE | 2893 | Non-Final OA | Jun 14, 2023 |
| 18333197 | SRAM CELL WITH BALANCED WRITE PORT | Taiwan Semiconductor Manufacturing Co., Ltd. | JUNGE, BRYAN R. | 2897 | Non-Final OA | Jun 12, 2023 |
| 18332028 | DIELECTRIC FEATURES FOR PARASITIC CAPACITANCE REDUCTION | Taiwan Semiconductor Manufacturing Company, Ltd. | DUREN, TIMOTHY EDWARD | 2817 | Final Rejection | Jun 09, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | Taiwan Semiconductor Manufacturing Co., Ltd. | WILCZEWSKI, MARY A | 2898 | Final Rejection | Jun 05, 2023 |
| 18329166 | VIAS and Via Rails for Source/Drain Metal Full Contact | Taiwan Semiconductor Manufacturing Company, Ltd. | PHAM, THANHHA S | 2812 | Non-Final OA | Jun 05, 2023 |
| 18327628 | OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Jun 01, 2023 |
| 18324729 | WRAP-AROUND SILICIDE LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | FAYETTE, NATHALIE RENEE | 2812 | Non-Final OA | May 26, 2023 |
| 18323688 | LAYOUT OF SCRIBE LINE FEATURES | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, DA WEI | 2817 | Non-Final OA | May 25, 2023 |
| 18321609 | METHOD OF FORMING CONTACT STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | PRIDEMORE, NATHAN ANDREW | 2898 | Non-Final OA | May 22, 2023 |
| 18316146 | P-DIPOLE MATERIAL FOR STACKED TRANSISTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | HOANG, TUAN A | 2898 | Non-Final OA | May 11, 2023 |
| 18315232 | N-DIPOLE MATERIAL FOR STACKED TRANSISTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | HOANG, TUAN A | 2898 | Non-Final OA | May 10, 2023 |
| 18308982 | SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | HAN, JONATHAN | 2818 | Non-Final OA | Apr 28, 2023 |
| 18308003 | SEAL RING STRUCTURE FOR MULTI-GATE DEVICE AND THE METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | DAS, PINAKI | 2898 | Non-Final OA | Apr 27, 2023 |
| 18304913 | BACKSIDE VIA AND METAL GATE SEPARATION | Taiwan Semiconductor Manufacturing Company, Ltd. | DAS, PINAKI | 2898 | Non-Final OA | Apr 21, 2023 |
| 18304527 | THROUGH VIA WITH GUARD RING STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, DAO H | 2818 | Non-Final OA | Apr 21, 2023 |
| 18302430 | SEMICONDUCTOR DEVICE WITH PHASE-CHANGE MATERIAL AND METHOD FOR MANUFACTURING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | AMER, MOUNIR S | 2818 | Non-Final OA | Apr 18, 2023 |
| 18301524 | GUARD RING STRUCTURE AND METHOD FORMING SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | HOANG, TUAN A | 2898 | Non-Final OA | Apr 17, 2023 |
| 18298629 | SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES | Taiwan Semiconductor Manufacturing Company, Ltd. | LIU, XIAOMING | 2812 | Non-Final OA | Apr 11, 2023 |
| 18298031 | METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING | Taiwan Semiconductor Manufacturing Company, Ltd. | TANDY, LAURA ELOISE | 2881 | Non-Final OA | Apr 10, 2023 |
| 18188082 | STRUCTURE AND METHOD FOR DEEP TRENCH CAPACITOR | Taiwan Semiconductor Manufacturing Company, Ltd. | BODNAR, JOHN A | 2893 | Non-Final OA | Mar 22, 2023 |
| 18183574 | Image Sensor Structures And Methods For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | PARENDO, KEVIN A | 2896 | Non-Final OA | Mar 14, 2023 |
| 18181430 | Multi-Gate Devices And Method Of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | CHUNG, ANDREW | 2898 | Non-Final OA | Mar 09, 2023 |
| 18166016 | OPTICAL DEVICE AND METHOD OF FABRICATING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | SMITH, CHAD | 2874 | Non-Final OA | Feb 08, 2023 |
| 18165772 | Thermal Dissipation Structures and Methods for Forming Same | Taiwan Semiconductor Manufacturing Company, Ltd. | WEGNER, AARON MICHAEL | 2897 | Final Rejection | Feb 07, 2023 |
| 18163539 | SEMICONDUCTOR STRUCTURE WITH TREATED GATE DIELECTRIC LAYER AND METHOD FOR MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | SRINIVASAN, SESHA SAIRAMAN | 2812 | Non-Final OA | Feb 02, 2023 |
| 18161555 | SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | HARRISON, MONICA D | 2815 | Non-Final OA | Jan 30, 2023 |
| 18159773 | Metal Gate Interconnect for Forksheet and Related Semiconductor Structures | Taiwan Semiconductor Manufacturing Company, Ltd. | BOEGEL, CHEVY JACOB | 2812 | Final Rejection | Jan 26, 2023 |
| 18159878 | Semiconductor Devices with Frontside and Backside Power Rails | Taiwan Semiconductor Manufacturing Company, Ltd. | BERNSTEIN, ALLISON | 2824 | Non-Final OA | Jan 26, 2023 |
| 18159814 | Structure and Method for Gate-All-Around Devices with Dielectric Interposer | Taiwan Semiconductor Manufacturing Company, Ltd. | SIPLING, KENNETH MARK | 2818 | Final Rejection | Jan 26, 2023 |
| 18157054 | METHOD OF MODULATING MULTI-GATE DEVICE CHANNELS AND STRUCTURES THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | NIX, NORA TAYLOR | 2891 | Non-Final OA | Jan 19, 2023 |
| 18155491 | IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | MUNOZ, ANDRES F | 2818 | Non-Final OA | Jan 17, 2023 |
| 18150863 | PHASE-CHANGE DEVICE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | AMER, MOUNIR S | 2818 | Non-Final OA | Jan 06, 2023 |
| 18149265 | Via Structures | Taiwan Semiconductor Manufacturing Co., Ltd. | BOULGHASSOUL, YOUNES | 2814 | Final Rejection | Jan 03, 2023 |
| 17986155 | Magnetoresistive Random Access Memory Cell And Fabricating The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | Final Rejection | Nov 14, 2022 |
| 17892820 | IMAGE SENSOR STRUCTURE FOR STRAY LIGHT NOISE REDUCTION | Taiwan Semiconductor Manufacturing Company, Ltd. | CUTLER, ETHAN EDWARD | 2892 | Non-Final OA | Aug 22, 2022 |
| 17884636 | PMOSFET SOURCE DRAIN | Taiwan Semiconductor Manufacturing Co., Ltd. | NARAGHI, ALI | 2817 | Non-Final OA | Aug 10, 2022 |
| 17818230 | EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Co., Ltd. | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Aug 08, 2022 |
| 17882817 | HIGH VOLTAGE DEVICE | Taiwan Semiconductor Manufacturing Co., Ltd. | WILCZEWSKI, MARY A | 2898 | Final Rejection | Aug 08, 2022 |
| 17876966 | Semiconductor Structure With Source/Drain Contact Plugs And Method For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | CRAMER, HALEE PAIGE | 2891 | Non-Final OA | Jul 29, 2022 |
| 17876819 | Miniature-Target-Detecting Transistors With Different Gate Structures | Taiwan Semiconductor Manufacturing Company, Ltd. | KARIMY, TIMOR | 2818 | Non-Final OA | Jul 29, 2022 |
| 17815884 | WAVY-SHAPED EPITAXIAL SOURCE/DRAIN STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TONY | 2893 | Final Rejection | Jul 28, 2022 |
| 17815861 | Memory Device and Method of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | GREEN, TELLY D | 2898 | Final Rejection | Jul 28, 2022 |
| 17814905 | Structure and Method for Single Gate Non-Volatile Memory Device | Taiwan Semiconductor Manufacturing Company, Ltd. | BELL, LAUREN R | 2896 | Non-Final OA | Jul 26, 2022 |
| 17872439 | Semiconductor Device With Facet S/D Feature And Methods Of Forming The Same | Taiwan Semiconductor Manufacturing Co., Ltd. | NARAGHI, ALI | 2817 | Non-Final OA | Jul 25, 2022 |
| 17870341 | CO-OPTIMIZATION OF MEMORY AND LOGIC DEVICES BY SOURCE/DRAIN MODULATION AND STRUCTURES THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | GREWAL, HEIM KIRIN | 2812 | Non-Final OA | Jul 21, 2022 |
| 17868635 | Methods Of Forming Metal Gate Spacer | Taiwan Semiconductor Manufacturing Co., Ltd. | CULBERT, CHRISTOPHER A | 2815 | Final Rejection | Jul 19, 2022 |
| 17859982 | Strained Channel Field Effect Transistor | Taiwan Semiconductor Manufacturing Company, Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Jul 07, 2022 |
| 17833440 | BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | MARIN, JACOB RAUL | 2818 | Non-Final OA | Jun 06, 2022 |
| 17832580 | Semiconductor Devices With Reduced Leakage Current And Methods Of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | ADHIKARI DAWADI, BIPANA | 2898 | Final Rejection | Jun 04, 2022 |
| 17832522 | Guard Ring Design For Through Via | Taiwan Semiconductor Manufacturing Company, Ltd. | CIESLEWICZ, ANETA B | 2893 | Final Rejection | Jun 03, 2022 |
| 17832443 | Passive Device Structure | Taiwan Semiconductor Manufacturing Company, Ltd. | SRINIVASAN, SESHA SAIRAMAN | 2817 | Non-Final OA | Jun 03, 2022 |
| 17752577 | Isolation Features For Semiconductor Devices And Methods Of Fabricating The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | SMITH, BRADLEY | 2817 | Final Rejection | May 24, 2022 |
| 17751363 | MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | STEVENSON, ANDRE C | 2899 | Final Rejection | May 23, 2022 |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | Taiwan Semiconductor Manufacturing Company, Ltd. | GOODWIN, DAVID J | 2817 | Non-Final OA | Apr 26, 2022 |
| 17726705 | Metal Interconnects And Method Of Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, DAVID WILLIAM | 2891 | Final Rejection | Apr 22, 2022 |
| 17721723 | Semiconductor Structure And Method For Forming The Same | Taiwan Semiconductor Manufacturing Company, Ltd. | FOX, BRANDON C | 2818 | Non-Final OA | Apr 15, 2022 |
| 17703668 | SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | ROLAND, CHRISTOPHER M | 2893 | Non-Final OA | Mar 24, 2022 |
| 17001446 | Metal Contacts on Metal Gates and Methods Thereof | Taiwan Semiconductor Manufacturing Co., Ltd. | CULBERT, CHRISTOPHER A | 2815 | Non-Final OA | Aug 24, 2020 |
| 16721166 | Methods for Reducing Scratch Defects in Chemical Mechanical Planarization | Taiwan Semiconductor Manufacturing Co., Ltd. | BAUMAN, SCOTT E | 2815 | Non-Final OA | Dec 19, 2019 |
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