Prosecution Insights
Prosecution Insights
232 pending office actions • 4 clients • 204 examiners • 81 art units • 45 of 232 (19%) have an AI response strategy ready • 423 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 54 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 54 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 3 (1%) |
| §103 only | 159 (69%) |
| §102 only | 9 (4%) |
| §112 only | 12 (5%) |
| No statute on record | 49 (21%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHIU, WESLEY JASON | 3 | 61.6% | +27.8% |
| REAMES, MATTHEW L | 3 | 76.9% | +18.0% |
| MENZ, LAURA MARY | 3 | 87.5% | +8.5% |
| LI, MEIYA | 3 | 68.9% | +25.5% |
| PARK, SAMUEL | 3 | 84.4% | +23.8% |
| KO, TONY | 2 | 87.8% | +2.4% |
| NGUYEN, HUNG | 2 | 90.7% | +8.9% |
| ERDEM, FAZLI | 2 | 85.4% | +15.9% |
| JEFFERSON, QUOVAUNDA | 2 | 79.1% | +8.6% |
| MOHAMED-ALY, KAREEM M | 2 | — | — |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | MENZ, LAURA MARY | 11d overdue |
| 18191291 | SEMICONDUCTOR MEMORY DEVICE | PARK, SAMUEL | 10d overdue |
| 18486416 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | ERDEM, FAZLI | 1d overdue |
| 18367549 | INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME | MENZ, LAURA MARY | 49d |
| 18952436 | METHOD OF CORRECTING REGISTRATION ERRORS, METHOD OF MANUFACTURING MASK, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT | NGUYEN, HUNG | — |
| 18474887 | METHOD AND APPARATUS FOR DETECTING CLUSTERS OF WAFER DEFECTS | NGUYEN, HUNG | — |
| 18461040 | SEMICONDUCTOR PACKAGE | MENZ, LAURA MARY | — |
| 18351422 | SEMICONDUCTOR DEVICE INCLUDING SPACER STRUCTURE HAVING OXIDIZED REGION | PARK, SAMUEL | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18453808 | AUTOMATED SIMULATION METHOD BASED ON DATABASE IN SEMICONDUCTOR DESIGN PROCESS, AUTOMATED SIMULATION GENERATION DEVICE AND SEMICONDUCTOR DESIGN AUTOMATION SYSTEM PERFORMING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | LIN, JASON | — |
| 17809212 | METHOD OF IMPEDANCE MATCHING, ELECTRONIC DEVICE AND COMPUTER-READABLE RECORDING MEDIUM | LEATHERS, EMILY GORMAN | — |
| 17697516 | FLOATING POINT OPERATION CIRCUIT PERFORMING A FUSED MULTIPLICATION AND ADDITION OPERATION, A METHOD OF OPERATING THE SAME AND AN INTEGRATED CIRCUIT INCLUDING THE SAME | GUDAS, JAKOB OSCAR | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18457313 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | LI, MEIYA | 19d overdue |
| 18191291 | SEMICONDUCTOR MEMORY DEVICE | PARK, SAMUEL | 10d overdue |
| 18486416 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | ERDEM, FAZLI | 1d overdue |
| 19002078 | IMAGE SENSOR, APPLICATION PROCESSOR AND IMAGE SENSING DEVICE | CHIU, WESLEY JASON | — |
| 18891528 | IMAGE SENSOR AND ELECTRONIC DEVICE INCLUDING THE SAME | CHIU, WESLEY JASON | — |
| 18667258 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | ERDEM, FAZLI | — |
| 18641488 | SEMICONDUCTOR MEMORY DEVICE INCLUDING A VERTICAL CHANNEL TRANSISTOR | REAMES, MATTHEW L | — |
| 18406265 | SEMICONDUCTOR DEVICE INCLUDING A BURIED CELL ARRAY TRANSISTOR (BCAT) STRUCTURE AND MANUFACTURING METHOD THEREOF | REAMES, MATTHEW L | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Samsung | 229 |
| Samsung Electronics Co., Ltd. | 1 |
| Samsung Electyronics Co., Ltd. | 1 |
| Samsung Electronics | 1 |
| Art Unit | Apps |
|---|---|
| 2817 | 17 |
| 2893 | 16 |
| 2898 | 15 |
| 2812 | 13 |
| 2897 | 10 |
| 2818 | 9 |
| 2899 | 8 |
| 2639 | 5 |
| 2813 | 5 |
| 2896 | 4 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19230763 | Untitled | Samsung Electronics Co., Ltd. | BULLOCK, JOSHUA | — | Non-Final OA | — | Pending | ||
| 19086358 | Untitled | Samsung Electronics Co., Ltd. | MATIN, TASNIMA | 2135 | — | Non-Final OA | — | Pending | |
| 19187451 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | TISSIRE, ABDELAAZIZ | 2638 | §103 | Non-Final OA | — | Pending | Apr 23, 2025 |
| 19174421 | IMAGE SENSORS INCLUDING PHASE DETECTION PIXEL | Samsung Electronics Co., Ltd. | MOREHEAD III, JOHN H | §103 | Non-Final OA | — | Pending | Apr 09, 2025 | |
| 19027343 | MEMORY REPAIR CIRCUIT, A MEMORY REPAIR METHOD, AND A MEMORY DEVICE | Samsung Electronics Co., Ltd. | HASAN, MOHAMMAD S | 2138 | §103 | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19024247 | ADAPTIVE VOLTAGE CONTROL CIRCUIT AND CONTROL METHOD THEREOF | Samsung Electronics Co., Ltd. | PARK, SANGHYUK | 2623 | §103 | Non-Final OA | 56d | Pending | Jan 16, 2025 |
| 19010480 | OUTPUT DRIVER AND OUTPUT BUFFER CIRCUIT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | RICHARDSON, JANY | 2844 | — | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19004594 | INTEGRATED CIRCUIT FOR CONVERTING VOLTAGE AND POWER MANAGEMENT INTEGRATED CIRCUIT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHEN, SIBIN | 2896 | §102 | Final Rejection | — | Pending | Dec 30, 2024 |
| 19002078 | IMAGE SENSOR, APPLICATION PROCESSOR AND IMAGE SENSING DEVICE | Samsung Electronics Co., Ltd. | CHIU, WESLEY JASON | 2639 | — | Non-Final OA | — | Pending | Dec 26, 2024 |
| 18999741 | STORAGE DEVICE FOR TRANSMITTING DATA HAVING AN EMBEDDED COMMAND IN BOTH DIRECTIONS OF A SHARED CHANNEL, AND A METHOD OF OPERATING THE STORAGE DEVICE | Samsung Electronics Co., Ltd. | CHOE, YONG J | 2135 | §103 | Non-Final OA | 71d | Pending | Dec 23, 2024 |
| 18990000 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | KO, TONY | 2878 | — | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18977727 | ERROR CORRECTION CIRCUIT, STORAGE CONTROLLER INCLUDING ERROR CORRECTION CIRCUIT, AND STORAGE DEVICE INCLUDING STORAGE CONTROLLER | Samsung Electronics Co., Ltd. | BRITT, CYNTHIA H | 2111 | — | Non-Final OA | — | Pending | Dec 11, 2024 |
| 18977157 | MAGNETIC MEMORY APPARATUS INCLUDING A MAGNETIC TUNNEL JUNCTION STRUCTURE | Samsung Electronics Co., Ltd. | HO, HOAI V | — | Non-Final OA | — | Pending | Dec 11, 2024 | |
| 18969521 | TEST CIRCUIT AND INTEGRATED CIRCUIT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PERRY, VICTOR NICHOLAS | 2111 | §103 | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18965458 | MEMORY DEVICE, A STORAGE DEVICE INCLUDING THE MEMORY DEVICE, AND AN OPERATION METHOD OF THE STORAGE DEVICE | Samsung Electronics Co., Ltd. | PHAM, KAITLYN HUNG | 2133 | §103 | Final Rejection | — | AI Ready | Dec 02, 2024 |
| 18954739 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PHAM, LY D | — | Non-Final OA | — | Pending | Nov 21, 2024 | |
| 18952436 | METHOD OF CORRECTING REGISTRATION ERRORS, METHOD OF MANUFACTURING MASK, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT | Samsung Electronics Co., Ltd. | NGUYEN, HUNG | 2882 | §103 | Non-Final OA | — | Pending | Nov 19, 2024 |
| 18950847 | IMAGE SENSOR WITH PIXEL SEPARATION STRUCTURE | Samsung Electronics Co., Ltd. | KO, TONY | 2878 | — | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18915791 | PHASE INTERPOLATOR AND MEMORY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MAI, LAM T | 2845 | — | Non-Final OA | — | Pending | Oct 15, 2024 |
| 18915876 | SEMICONDUCTOR SYSTEM FOR REDUCING OPERATING TIME AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | FATIMA, AYMAN | 2176 | §102 | Non-Final OA | 46d | AI Ready | Oct 15, 2024 |
| 18916318 | STORAGE DEVICE INCLUDING REDUNDANCY MEMORY CELL AND REPAIR METHOD OF FAIL MEMORY CELL INCLUDED IN STORAGE DEVICE | Samsung Electronics Co., Ltd. | TORRES, JOSEPH D | 2112 | §103 | Non-Final OA | — | Pending | Oct 15, 2024 |
| 18914082 | UNIT CELL CIRCUIT AND MEMORY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, VAN THU T | 2824 | §103 | Non-Final OA | — | Pending | Oct 12, 2024 |
| 18908191 | LEVEL SHIFTER AND MEMORY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | YEAMAN, JAMES G | 2842 | §103 | Final Rejection | 2d overdue | AI Ready | Oct 07, 2024 |
| 18901283 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | CHEN, DAVID Z | 2815 | — | Non-Final OA | — | Pending | Sep 30, 2024 |
| 18891528 | IMAGE SENSOR AND ELECTRONIC DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHIU, WESLEY JASON | 2639 | §103 | Non-Final OA | — | Pending | Sep 20, 2024 |
| 18890089 | METHOD AND DEVICE OF PREDICTING A FAILURE OF A STORAGE DEVICE | Samsung Electronics Co., Ltd. | GUYTON, PHILIP A | 2113 | §103 | Final Rejection | 42d overdue | AI Ready | Sep 19, 2024 |
| 18830733 | MEMORY DEVICE, AN OPERATING METHOD OF THE MEMORY DEVICE, AND A MEMORY MODULE INCLUDING THE MEMORY DEVICE | Samsung Electronics Co., Ltd. | ZAMAN, FAISAL M | 2175 | — | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18814719 | SEMICONDUCTOR DEVICE INSPECTION DEVICE AND SEMICONDUCTOR DEVICE INSPECTION METHOD | Samsung Electronics Co., Ltd. | PICON-FELICIANO, ANA J | 2482 | §103 | Final Rejection | — | Pending | Aug 26, 2024 |
| 18812147 | UNIT PIXEL INCLUDING ONE OR MORE CAPACITORS AND AN IMAGE SENSOR INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PETERSON, CHRISTOPHER K | 2637 | §103 | Final Rejection | 22d overdue | AI Ready | Aug 22, 2024 |
| 18797062 | METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF USER EQUIPMENT IN WIRELESS COMMUNICATION | Samsung Electronics Co., Ltd. | CHENG, CHI TANG P | §103 | Non-Final OA | — | Pending | Aug 07, 2024 | |
| 18788595 | ESD PROTECTION CIRCUIT AND DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | AL-TAWEEL, MUAAMAR QAHTAN | 2838 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788442 | APPARATUS FOR TRANSMITTING AND RECEIVING A SIGNAL, A METHOD OF OPERATING THE SAME, A MEMORY DEVICE, AND A METHOD OF OPERATING THE MEMORY DEVICE | Samsung Electronics Co., Ltd. | KIM, SEOKJIN | 2844 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18783876 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | YILMAKASSAYE, SURAFEL | 2639 | §103 | Final Rejection | — | Pending | Jul 25, 2024 |
| 18764785 | METHOD OF CONTROLLING STORAGE DEVICE | Samsung Electronics Co., Ltd. | CHOWDHURY, SUBIR KUMAR | 2132 | §103 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18755803 | TEMPORAL AGGREGATION FOR DYNAMIC CHANNEL PRUNING AND SCALING | Samsung Electronics Co., Ltd. | LI, RUIPING | 2676 | — | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18754350 | MEMORY CONTROLLER AND STORAGE DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | THAMMAVONG, PRASITH | 2137 | §103 | Non-Final OA | 13d | AI Ready | Jun 26, 2024 |
| 18754533 | METHOD OF INSPECTING A SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | GARCIA, PAULO ANDRES | 2669 | — | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753198 | METHOD OF INSPECTING A MARK ENGRAVED ON A SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WELLS, HEATH E | 2664 | — | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18744766 | FINGERPRINT SENSOR PACKAGE AND DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | FLORES, ROBERTO W | 2621 | §103 | Non-Final OA | — | AI Ready | Jun 17, 2024 |
| 18739593 | RF CIRCUIT AND OPERATION METHOD THEREFOR | Samsung Electronics Co., Ltd. | PEREZ, ANGELICA | 2649 | — | Non-Final OA | — | Pending | Jun 11, 2024 |
| 18735313 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | LEE, EUGENE | §103 | Non-Final OA | — | Pending | Jun 06, 2024 | |
| 18676949 | RF CIRCUIT INCLUDING SWITCH FOR ISOLATION AND WIRELESS COMMUNICATION DEVICE INCLUDING SAME | Samsung Electronics Co., Ltd. | HUANG, WEN WU | 2648 | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18672381 | FINGERPRINT SENSOR PACKAGE CARRIER AND FINGERPRINT SENSOR PACKAGE ASSEMBLY METHOD | Samsung Electronics Co., Ltd. | JIANG, YONG HANG | 2689 | §102 | Final Rejection | — | Pending | May 23, 2024 |
| 18670957 | DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE | Samsung Electronics Co., Ltd. | BENNETT, CHARLEE | 1718 | §103 | Final Rejection | 44d overdue | AI Ready | May 22, 2024 |
| 18667258 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ERDEM, FAZLI | — | Non-Final OA | — | Pending | May 17, 2024 | |
| 18664590 | SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTIVE POST | Samsung Electronics Co., Ltd. | HO, TU TU V | §103 | Non-Final OA | — | Pending | May 15, 2024 | |
| 18663258 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | WHALEN, DANIEL B | §103 | Non-Final OA | — | Pending | May 14, 2024 | |
| 18660507 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | STEVENSON, ANDRE C | §103 | Non-Final OA | — | Pending | May 10, 2024 | |
| 18653116 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS | Samsung Electronics Co., Ltd. | JEFFERSON, QUOVAUNDA | §103 | Non-Final OA | — | Pending | May 02, 2024 | |
| 18653139 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | HALL, VICTORIA KATHLEEN | §103 | Non-Final OA | — | Pending | May 02, 2024 | |
| 18648683 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | §103 | Non-Final OA | — | Pending | Apr 29, 2024 | |
| 18642633 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MINNEY, GABRIEL SEBASTIAN | — | Non-Final OA | — | Pending | Apr 22, 2024 | |
| 18641488 | SEMICONDUCTOR MEMORY DEVICE INCLUDING A VERTICAL CHANNEL TRANSISTOR | Samsung Electronics Co., Ltd. | REAMES, MATTHEW L | — | Non-Final OA | — | Pending | Apr 22, 2024 | |
| 18640332 | SUBSTRATE PROCESSING APPARATUS AND A SUBSTRATE PROCESSING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | ALANKO, ANITA KAREN | 1713 | §103 | Non-Final OA | 42d | Pending | Apr 19, 2024 |
| 18639948 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SOWARD, IDA M | — | Non-Final OA | — | Pending | Apr 18, 2024 | |
| 18638939 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | GHEYAS, SYED I | §103 | Non-Final OA | — | Pending | Apr 18, 2024 | |
| 18637827 | SEMICONDUCTOR CHIP STRUCTURE | Samsung Electronics Co., Ltd. | MOHAMED-ALY, KAREEM M | — | Non-Final OA | — | Pending | Apr 17, 2024 | |
| 18635073 | MEMORY CONTROLLER FOR PERFORMING EFFICIENT ERROR CORRECTION CODE (ECC) DECODING AND A STORAGE DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | SCHELL, JOSEPH O | 2114 | §112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18631484 | METHODS AND SYSTEMS FOR HANDLING COLLISION OF SIGNALING MESSAGES IN A WIRELESS COMMUNICATION SYSTEM | Samsung Electronics Co., Ltd. | GHOWRWAL, OMAR J | 2463 | — | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18631231 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MUSE, ISMAIL A | — | Non-Final OA | — | Pending | Apr 10, 2024 | |
| 18628896 | SEMICONDUCTOR TEST DEVICE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | PATEL, PARESH H | 2858 | §103 | Non-Final OA | 61d | Pending | Apr 08, 2024 |
| 18626444 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | JUNGE, BRYAN R. | §103 | Non-Final OA | — | Pending | Apr 04, 2024 | |
| 18624884 | MEMORY DEVICE AND INITIALIZING METHOD THEREOF | Samsung Electronics Co., Ltd. | CHEN, XIAOCHUN L | 2824 | §103 | Final Rejection | — | Pending | Apr 02, 2024 |
| 18621273 | SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME | Samsung Electronics Co., Ltd. | VETERE, ROBERT A | — | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18619512 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WILLS-BURNS, CHINEYERE D | — | Non-Final OA | — | Pending | Mar 28, 2024 | |
| 18613868 | ONE-TIME PROGRAMMABLE MEMORY DEVICE | Samsung Electronics Co., Ltd. | PHAN, STEVE QUOC | 2817 | §103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18613248 | TRANSMITTER ADAPTIVELY SELECTING DIGITAL PREDISTORTION MODE, DIGITAL PREDISTORTER AND TRAINING METHOD THEREOF | Samsung Electronics Co., Ltd. | WENDELL, ANDREW | 2648 | §103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18613338 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | WARD, ERIC A | §103 | Non-Final OA | — | Pending | Mar 22, 2024 | |
| 18612282 | PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME | Samsung Electronics Co., Ltd. | LIU, MIKKA H | — | Non-Final OA | — | Pending | Mar 21, 2024 | |
| 18610612 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD | Samsung Electronics Co., Ltd. | TRAC, JONATHAN KHANH | 4100 | §103 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18610651 | SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES | Samsung Electronics Co., Ltd. | DIALLO, MAMADOU L | 2897 | §112 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18609327 | LIGHT EMITTING DISPLAY APPARATUS | Samsung Electronics Co., Ltd. | VLCEK, JACOB ALEXANDER | §103 | Non-Final OA | — | Pending | Mar 19, 2024 | |
| 18605956 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | NGUYEN, NIKI HOANG | 2818 | — | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18604875 | SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACIAL MATERIAL PATTERNS | Samsung Electronics Co., Ltd. | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18601009 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TRAPANESE, WILLIAM C | 2812 | — | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18601032 | SEMICONDUCTOR MEMORY DEVICE | Samsung Electronics Co., Ltd. | OH, JAEHWAN | 2899 | §103 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18599789 | METHOD, A DEVICE, COMPUTER EQUIPMENT, AND COMPUTER-READABLE STORAGE MEDIUM FOR PERFORMING ANTENNA CONTROL | Samsung Electronics Co., Ltd. | PHAM, TUAN | 2649 | — | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18595666 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | LOHAKARE, PRATIKSHA JAYANT | 2818 | — | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18596286 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LIU, XIAOMING | 2812 | §103 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18595216 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS | Samsung Electronics Co., Ltd. | KAO, SOPHIA WEI-CHUN | 2817 | — | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18591310 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CHOI, CALVIN Y | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591486 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | JUNG, MICHAEL YOO LIM | 2817 | — | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18587326 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TRAN, TAN N | 2812 | — | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18582847 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582798 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | WARD, ERIC A | 2891 | — | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18581483 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | FERNANDES, ERROL V | 2893 | — | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18442668 | INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE, AND METHOD OF DESIGNING LAYOUT OF SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | HOANG, DZUNG T | 2898 | — | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18439835 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BOEGEL, CHEVY JACOB | 2812 | — | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18438357 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ANDERSON, ERIK ARTHUR | 2812 | §103 | Non-Final OA | — | Pending | Feb 09, 2024 |
| 18434913 | STORAGE CONTROLLER, AN OPERATING METHOD OF THE SAME, AND A STORAGE SYSTEM | Samsung Electronics Co., Ltd. | MENDEL, JULIAN SCOTT | 2133 | §103 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18432459 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | STARK, JARRETT J | 2898 | §103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18430837 | RF FRONT-END MODULE AND METHOD OF TRANSMITTING SIGNALS BASED ON THE SAME | Samsung Electronics Co., Ltd. | HU, RUI MENG | 2643 | §103 | Final Rejection | — | AI Ready | Feb 02, 2024 |
| 18428931 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | YI, CHANGHYUN | 2812 | — | Non-Final OA | — | Pending | Jan 31, 2024 |
| 18427622 | SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | PARENDO, KEVIN A | 2896 | — | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18427614 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CAMPBELL, SHAUN M | 2893 | §103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18422660 | 3-DIMENSIONAL (3D) FERROELECTRIC RANDOM ACCESS MEMORY (FeRAM) AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | WIEGAND, TYLER J | 2812 | §103 | Non-Final OA | — | Pending | Jan 25, 2024 |
| 18418765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | STARK, JARRETT J | 2898 | — | Non-Final OA | — | Pending | Jan 22, 2024 |
| 18419469 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MUSLIM, SHAWN SHAW | 2897 | — | Non-Final OA | — | Pending | Jan 22, 2024 |
| 18418868 | CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD | Samsung Electronics Co., Ltd. | SWEELY, KURT D | 1718 | §103 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18417254 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MANN, WILLIAM ROBERT | 2897 | §103 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18414681 | SUBSTRATE PROCESSING APPARATUS | Samsung Electronics Co., Ltd. | BRAYTON, JOHN JOSEPH | 1794 | — | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18413115 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MOHAMED-ALY, KAREEM M | 2898 | — | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18411164 | WIRING STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME | Samsung Electronics Co., Ltd. | LI, WEI | 2899 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18406265 | SEMICONDUCTOR DEVICE INCLUDING A BURIED CELL ARRAY TRANSISTOR (BCAT) STRUCTURE AND MANUFACTURING METHOD THEREOF | Samsung Electronics Co., Ltd. | REAMES, MATTHEW L | 2896 | §112 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18403842 | ELECTRONIC DEVICE FOR PLAYING VIDEO AND OPERATING METHOD OF THE SAME | Samsung Electronics Co., Ltd. | PARK, SUNGHYOUN | 2484 | §103 | Final Rejection | — | Pending | Jan 04, 2024 |
| 18403204 | INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELECTIVELY DEPOSITING THIN FILM | Samsung Electronics Co., Ltd. | WALTERS JR, ROBERT S | 1787 | — | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402021 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | — | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18399831 | METHOD AND DEVICE FOR IMPLEMENTING VIRTUAL MACHINE INTROSPECTION | Samsung Electronics Co., Ltd. | ROTARU, OCTAVIAN | 3624 | §103 | Final Rejection | — | Pending | Dec 29, 2023 |
| 18396918 | CHEMICAL MECHANICAL POLISHING APPARATUS | Samsung Electronics Co., Ltd. | DELRUE, BRIAN CHRISTOPHER | 3745 | §103 | Non-Final OA | 62d | Pending | Dec 27, 2023 |
| 18395821 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | RAHMAN, MOHAMMAD A | 2898 | §112 | Non-Final OA | — | Pending | Dec 26, 2023 |
| 18395839 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | TRAN, TAN N | 2812 | §103 | Non-Final OA | — | Pending | Dec 26, 2023 |
| 18396071 | INTERNAL VOLTAGE GENERATION CIRCUIT OF SMART CARD AND SMART CARD INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PHAM, QUANG | 2685 | §112 | Non-Final OA | — | Pending | Dec 26, 2023 |
| 18395827 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Dec 26, 2023 |
| 18544560 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | SHAMSUZZAMAN, MOHAMMED | 2897 | §103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18543379 | WIRELESS COMMUNICATION DEVICE AND OPERATING METHOD OF THE SAME | Samsung Electronics Co., Ltd. | SINGH, AMNEET | 2633 | §112 | Non-Final OA | — | Pending | Dec 18, 2023 |
| 18533262 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | — | Pending | Dec 08, 2023 |
| 18533672 | METHOD OF CONTROLLING ON-DIE TERMINATION AND MEMORY SYSTEM PERFORMING THE SAME | Samsung Electronics Co., Ltd. | TON, MY TRANG | 3992 | Other | Non-Final OA | 82d | Pending | Dec 08, 2023 |
| 18532230 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Dec 07, 2023 |
| 18529007 | THREE-DIMENSIONAL (3D) VERTICAL MEMORY DEVICE AND METHOD OF MANUFACTURING SAME | Samsung Electronics Co., Ltd. | SQUIRES, BRETT STEPHEN | 2899 | §112 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18525803 | TRANSFER ROBOT AND STOCKER SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MCCLAIN, GERALD | 3652 | §103 | Non-Final OA | 55d | AI Ready | Nov 30, 2023 |
| 18525479 | AUDIO AMPLIFIER AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | SHAMIRYAN, NAREH | 2843 | §103 | Non-Final OA | — | Pending | Nov 30, 2023 |
| 18521965 | SEMICONDUCTOR CHIP HAVING A FRICTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | VU, VU A | 2897 | §103 | Non-Final OA | — | Pending | Nov 28, 2023 |
| 18520453 | SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE | Samsung Electronics Co., Ltd. | OZDEN, ILKER NMN | 2812 | §103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18520472 | SOURCE VESSEL FOR EUV | Samsung Electronics Co., Ltd. | CHOI, JAMES J | 2878 | §103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18515780 | SUBSTRATE POLISHING APPARATUS | Samsung Electronics Co., Ltd. | HUANG, STEVEN | 3723 | §103 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18512135 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | BIRCH, EKATERINA THOMASA | 2818 | §102 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18511597 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | BRECHT, CHARLES MATTHEW | 2817 | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18510209 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Non-Final OA | 71d | Pending | Nov 15, 2023 |
| 18506346 | SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | COLLINS, HAMNER FITZHUGH | 2818 | §102 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18505057 | SOURCE GAS NOZZLE AND SEMICONDUCTOR WAFER PROCESSING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | ZERVIGON, RUDY | 1716 | §103 | Non-Final OA | — | Pending | Nov 08, 2023 |
| 18503690 | SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER | Samsung Electronics Co., Ltd. | ANDERSON, WILLIAM H | 2817 | §103 | Final Rejection | 36d | AI Ready | Nov 07, 2023 |
| 18502232 | USER EQUIPMENT PERFORMING BLIND DECODING AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | BELETE, BERHANU D | 2418 | §103 | Final Rejection | — | Pending | Nov 06, 2023 |
| 18502352 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | ANDERSON, ERIK ARTHUR | 2812 | §103 | Non-Final OA | — | Pending | Nov 06, 2023 |
| 18502055 | APPARATUS FOR SUPPLYING TREATING MATERIAL AND SYSTEM FOR SUPPLYING THE TREATING MATERIAL | Samsung Electronics Co., Ltd. | PATTERSON, MICHAEL CHRISTOPHER | 3754 | §103 | Final Rejection | — | Pending | Nov 05, 2023 |
| 18501970 | ROTATIONAL INTERFACE, CARRIER TRANSFER SYSTEM INCLUDING THE SAME, AND SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | MYERS, GLENN F | 3652 | §103 | Final Rejection | 42d overdue | AI Ready | Nov 03, 2023 |
| 18498574 | IMAGE SENSOR AND METHOD OF MANUFACTURING THEREOF | Samsung Electronics Co., Ltd. | JUNG, MICHAEL YOO LIM | 2817 | §103 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18499117 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18384912 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TOBERGTE, NICHOLAS J | 2817 | §103 | Non-Final OA | — | Pending | Oct 30, 2023 |
| 18498020 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | NADAV, ORI | 2811 | §103 | Non-Final OA | — | Pending | Oct 30, 2023 |
| 18495020 | IMAGE SENSOR FOR SECURING IMAGE HAVING HIGH DYNAMIC ILLUMINATION RANGE | Samsung Electronics Co., Ltd. | GILES, NICHOLAS G | 2639 | §103 | Non-Final OA | 216d overdue | AI Ready | Oct 26, 2023 |
| 18494103 | EDGE COVERING AND SEMICONDUCTOR MANUFACTURING DEVICE COMPRISING THE SAME | Samsung Electronics Co., Ltd. | IJAZ, MUHAMMAD | 3631 | §103 | Non-Final OA | 70d | Pending | Oct 25, 2023 |
| 18383543 | REFLECTIVE MASK FOR EXTREME ULTRAVIOLET LITHOGRAPHY AND A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | SULLIVAN, CALEEN O | §103 | Non-Final OA | — | Pending | Oct 25, 2023 | |
| 18382205 | IMAGE SENSOR AND IMAGE SENSOR PACKAGE | Samsung Electronics Co., Ltd. | DYKES, LAURA M | 2892 | §103 | Final Rejection | — | AI Ready | Oct 20, 2023 |
| 18381711 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | YECHURI, SITARAMARAO S | 2893 | §103 | Final Rejection | 10d overdue | AI Ready | Oct 19, 2023 |
| 18380422 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TRAN, DZUNG | 2893 | §103 | Non-Final OA | 39d | AI Ready | Oct 16, 2023 |
| 18486416 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | ERDEM, FAZLI | 2812 | §103 | Final Rejection | 1d overdue | AI Ready | Oct 13, 2023 |
| 18378191 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | — | Pending | Oct 10, 2023 |
| 18484087 | SYSTEM AND METHOD FOR AERIAL-ASSISTED FEDERATED LEARNING | Samsung Electronics Co., Ltd. | SHEDRICK, CHARLES TERRELL | 2646 | §103 | Final Rejection | — | Pending | Oct 10, 2023 |
| 18482680 | INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | HAN, JONATHAN | 2818 | §103 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18481872 | SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Samsung Electronics Co., Ltd. | REAMES, MATTHEW L | 2896 | §103 | Non-Final OA | — | Pending | Oct 05, 2023 |
| 18374792 | FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | 41d | AI Ready | Sep 29, 2023 |
| 18474887 | METHOD AND APPARATUS FOR DETECTING CLUSTERS OF WAFER DEFECTS | Samsung Electronics Co., Ltd. | NGUYEN, HUNG | 2853 | §112 | Non-Final OA | — | Pending | Sep 26, 2023 |
| 18473126 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | SANDVIK, BENJAMIN P | 2812 | §102 | Non-Final OA | — | Pending | Sep 22, 2023 |
| 18471504 | IMAGE PROCESSING METHOD AND IMAGE PROCESSING SYSTEM | Samsung Electronics Co., Ltd. | GALERA, PATRICK PAUL CONTRER | 2617 | §103 | Final Rejection | — | Pending | Sep 21, 2023 |
| 18471534 | WAFER POLISHING SYSTEM, SIMULATION AND CONTROL METHOD THEREOF | Samsung Electronics Co., Ltd. | TAHIR, NOOR MOHAMMAD ISM | 2893 | §103 | Non-Final OA | — | Pending | Sep 21, 2023 |
| 18369248 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Non-Final OA | — | Pending | Sep 18, 2023 |
| 18369242 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electyronics Co., Ltd. | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Non-Final OA | — | Pending | Sep 18, 2023 |
| 18367549 | INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | MENZ, LAURA MARY | 2813 | §103 | Non-Final OA | 49d | Pending | Sep 13, 2023 |
| 18244342 | IMAGE SENSOR AND MANUFACTURING METHOD OF THE SAME | Samsung Electronics Co., Ltd. | CUDA, BRENNEN STUART | 2818 | §103 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18244546 | SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE | Samsung Electronics Co., Ltd. | TOBERGTE, NICHOLAS J | 2817 | §103 | Final Rejection | 45d overdue | AI Ready | Sep 11, 2023 |
| 18243185 | METHOD FOR MANUFACTURING MASK PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE MASK PATTERN | Samsung Electronics Co., Ltd. | MCDONALD, JASON ANDREW | 2898 | §103 | Final Rejection | — | Pending | Sep 07, 2023 |
| 18462010 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD | Samsung Electronics Co., Ltd. | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | — | Pending | Sep 06, 2023 |
| 18461040 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MENZ, LAURA MARY | 2813 | §103 | Non-Final OA | — | Pending | Sep 05, 2023 |
| 18459766 | CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | SENGDARA, VONGSAVANH | 2893 | §103 | Non-Final OA | — | AI Ready | Sep 01, 2023 |
| 18459520 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | IQBAL, HAMNA FATHIMA | 2817 | §103 | Non-Final OA | 72d | Pending | Sep 01, 2023 |
| 18457535 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | — | Pending | Aug 29, 2023 |
| 18457504 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 61d | Pending | Aug 29, 2023 |
| 18457313 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | §103 | Final Rejection | 19d overdue | AI Ready | Aug 28, 2023 |
| 18453378 | PLASMA PROCESSING APPARATUS AND METHOD | Samsung Electronics Co., Ltd. | YU, YUECHUAN | 1718 | §103 | Non-Final OA | — | Pending | Aug 22, 2023 |
| 18453808 | AUTOMATED SIMULATION METHOD BASED ON DATABASE IN SEMICONDUCTOR DESIGN PROCESS, AUTOMATED SIMULATION GENERATION DEVICE AND SEMICONDUCTOR DESIGN AUTOMATION SYSTEM PERFORMING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | LIN, JASON | 2117 | §101 | Final Rejection | — | Pending | Aug 22, 2023 |
| 18453529 | SEMICONDUCTOR DEVICE INCLUDING NANOSHEET TRANSISTOR | Samsung Electronics Co., Ltd. | JEFFERSON, QUOVAUNDA | 2899 | §103 | Final Rejection | — | Pending | Aug 22, 2023 |
| 18234987 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Aug 17, 2023 |
| 18449078 | OPTICAL PROXIMITY CORRECTION (OPC) METHOD AND METHOD OF MANUFACTURING MASK BY USING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, NHA T | — | Non-Final OA | — | Pending | Aug 14, 2023 | |
| 18231838 | SEMICONDUCTOR DEVICE HAVING A BONDED STRUCTURE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | HOQUE, MOHAMMAD M | 2817 | §102 | Final Rejection | 4d overdue | AI Ready | Aug 09, 2023 |
| 18231284 | VERTICAL MEMORY DEVICE | Samsung Electronics Co., Ltd. | BOULGHASSOUL, YOUNES | 2814 | §103 | Final Rejection | 36d overdue | AI Ready | Aug 08, 2023 |
| 18366322 | APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE BY USING FOCUSED ION BEAM AND SCANNING ELECTRON MICROSCOPE SUPPORTED BY ELECTRON DIFFRACTION PATTERN | Samsung Electronics Co., Ltd. | MCCORMACK, JASON L | 2881 | §103 | Non-Final OA | 41d | AI Ready | Aug 07, 2023 |
| 18364763 | OUTPUT MATCHING NETWORK WITH IMPROVED WIDE BAND CHARACTERISTICS AND POWER AMPLIFIER NETWORK INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BARTOL, LANCE TORBJORN | 2843 | §103 | Non-Final OA | 61d | Pending | Aug 03, 2023 |
| 18355514 | LOW DROPOUT (LDO) REGULATOR AND ELECTRONIC DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | RIVERA-PEREZ, CARLOS O | 2838 | §103 | Final Rejection | 49d overdue | AI Ready | Jul 20, 2023 |
| 18223124 | STORAGE DEVICE AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, STEVE N | 2111 | §103 | Final Rejection | 97d overdue | AI Ready | Jul 18, 2023 |
| 18353279 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PRASAD, NEIL R | 2897 | §102 | Non-Final OA | — | Pending | Jul 17, 2023 |
| 18351748 | METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BARZYKIN, VICTOR V | 2893 | §112 | Final Rejection | — | Pending | Jul 13, 2023 |
| 18351422 | SEMICONDUCTOR DEVICE INCLUDING SPACER STRUCTURE HAVING OXIDIZED REGION | Samsung Electronics Co., Ltd. | PARK, SAMUEL | 2818 | §103 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | MENZ, LAURA MARY | 2813 | §103 | Final Rejection | 11d overdue | AI Ready | Jul 11, 2023 |
| 18217655 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PARTHASARATHY, ROHIT | 2899 | §103 | Final Rejection | 31d overdue | AI Ready | Jul 03, 2023 |
| 18216632 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ESKRIDGE, CORY W | 3624 | §112 | Non-Final OA | 75d | Pending | Jun 30, 2023 |
| 18343367 | CASCODE AMPLIFIER WITH IMPROVED AMPLIFICATION CHARACTERISTICS | Samsung Electronics Co., Ltd. | SHAMIRYAN, NAREH | 2843 | §103 | Non-Final OA | — | Pending | Jun 28, 2023 |
| 18342011 | METHOD OF CORRECTING LAYOUT FOR SEMICONDUCTOR PROCESS USING MACHINE LEARNING, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME, AND LAYOUT CORRECTION SYSTEM PERFORMING THE SAME | Samsung Electronics Co., Ltd. | LIN, ARIC | 2851 | — | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18341142 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MEMULA, SURESH | 2851 | — | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18341345 | SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY | Samsung Electronics Co., Ltd. | YAP, DOUGLAS ANTHONY | 2800 | §103 | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18211316 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | KHALIFA, MOATAZ | 2817 | §103 | Final Rejection | — | Pending | Jun 19, 2023 |
| 18329784 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG WITH AN UPPER CONDUCTIVE PATTERN FORMED ON AN UPPER SURFACE OF A LOWER CONDUCTIVE PATTERN | Samsung Electronics Co., Ltd. | MAI, ANH D | 2893 | §103 | Non-Final OA | 20d | AI Ready | Jun 06, 2023 |
| 18201932 | SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD | Samsung Electronics Co., Ltd. | NGUYEN, PHUONG T | 3761 | §103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18199504 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SENGDARA, VONGSAVANH | 2893 | §103 | Non-Final OA | — | Pending | May 19, 2023 |
| 18199553 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TRAN, THANH Y | 2817 | §102 | Non-Final OA | — | AI Ready | May 19, 2023 |
| 18195970 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SON, ERIKA HEERA | 2893 | §112 | Non-Final OA | 22d | AI Ready | May 11, 2023 |
| 18315261 | DOPPLER MEASUREMENT-BASED HANDOVER | Samsung Electronics Co., Ltd. | LAM, DUNG LE | 2646 | §103 | Non-Final OA | 44d overdue | AI Ready | May 10, 2023 |
| 18143735 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | — | Pending | May 05, 2023 |
| 18143187 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | HOANG, TUAN A | 2898 | §103 | Non-Final OA | 60d | Pending | May 04, 2023 |
| 18142700 | INTERFACE CIRCUIT FOR CONTROLLING OUTPUT IMPEDANCE OF A TRANSMISSION CIRCUIT AND AN IMAGE SENSOR INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CLEARY, THOMAS J | 2175 | §103 | Non-Final OA | — | Pending | May 03, 2023 |
| 18310366 | METHOD, DEVICE, AND ELECTRONIC APPARATUS FOR SECURELY PASSING DATA | Samsung Electronics Co., Ltd. | ARYAL, AAYUSH | 2435 | §103 | Non-Final OA | 71d | Pending | May 01, 2023 |
| 18305676 | NON-LINEAR MULTI-DIMENSIONAL COST FUNCTION FOR ARTIFICIAL INTELLIGENCE INFERENCE | Samsung Electronics Co., Ltd. | BOSTWICK, SIDNEY VINCENT | 2124 | §103 | Non-Final OA | 32d overdue | AI Ready | Apr 24, 2023 |
| 18304930 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | §103 | Final Rejection | — | Pending | Apr 21, 2023 |
| 18192031 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | 19d | AI Ready | Mar 29, 2023 |
| 18191291 | SEMICONDUCTOR MEMORY DEVICE | Samsung Electronics Co., Ltd. | PARK, SAMUEL | 2818 | §103 | Non-Final OA | 10d overdue | AI Ready | Mar 28, 2023 |
| 18189349 | IMAGE SENSOR USING METHOD OF DRIVING HYBRID SHUTTER AND IMAGE PROCESSING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHIU, WESLEY JASON | 2639 | §103 | Non-Final OA | — | Pending | Mar 24, 2023 |
| 18188311 | THREE DIMENSIONAL NON-VOLATILE MEMORY DEVICE | Samsung Electronics Co., Ltd. | LEE, DA WEI | 2817 | §103 | Final Rejection | 9d overdue | AI Ready | Mar 22, 2023 |
| 18124118 | SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHAN, CANDICE | 2813 | §103 | Non-Final OA | 43d | Pending | Mar 21, 2023 |
| 18185915 | SECURE PROVISIONING OF COMMUNICATIONS CHANNELS | Samsung Electronics Co., Ltd. | KOBROSLI, SHADI HASSAN | 2492 | §103 | Final Rejection | 36d overdue | AI Ready | Mar 17, 2023 |
| 18118775 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | IQBAL, HAMNA FATHIMA | 2817 | §103 | Final Rejection | — | Pending | Mar 08, 2023 |
| 18178507 | SEMICONDUCTOR PACKAGE INCLUDING CONNECTION LAYER | Samsung Electronics Co., Ltd. | TYNES JR., LAWRENCE C | 2899 | §112 | Non-Final OA | — | Pending | Mar 05, 2023 |
| 18108125 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 33d | Pending | Feb 10, 2023 |
| 18102265 | METHOD AND APPARATUS WITH IMAGE RECONSTRUCTION | Samsung Electronics Co., Ltd. | GOEBEL, EMMA ROSE | 2662 | §103 | Final Rejection | — | AI Ready | Jan 27, 2023 |
| 18100216 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | NETTLES, CORALIE ANN | 2893 | §103 | Non-Final OA | — | Pending | Jan 23, 2023 |
| 18086086 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | 43d | AI Ready | Dec 21, 2022 |
| 18065870 | PROCESS PROXIMITY CORRECTION METHOD AND COMPUTING DEVICE FOR THE SAME | Samsung Electronics Co., Ltd. | ALAWDI, ANWER AHMED | 2851 | §103 | Non-Final OA | 55d | Pending | Dec 14, 2022 |
| 18080024 | SEMICONDUCTOR DEVICE INCLUDING A DUMMY POWER PAD AND A PAD PLACEMENT METHOD THEREOF | Samsung Electronics Co., Ltd. | ZHU, SHENG-BAI | 2897 | §103 | Final Rejection | — | AI Ready | Dec 13, 2022 |
| 17993055 | GAS SUPPLY MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | Samsung Electronics Co., Ltd. | SWEELY, KURT D | 1718 | §103 | Final Rejection | 25d overdue | AI Ready | Nov 23, 2022 |
| 17961688 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG AND SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | PARK, SAMUEL | 2818 | §103 | Non-Final OA | — | AI Ready | Oct 07, 2022 |
| 17935119 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | LI, MEIYA | 2800 | §103 | Non-Final OA | — | Pending | Sep 25, 2022 |
| 17812787 | USER EQUIPMENT AND BASE STATION SUPPORTING DYNAMIC SPECTRUM SHARING, AND COMMUNICATION SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BAIG, ADNAN | 2461 | §103 | Non-Final OA | — | Pending | Jul 15, 2022 |
| 17865478 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Final Rejection | — | Pending | Jul 15, 2022 |
| 17810036 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | RIRIE, EVERETT TRAJAN | 2800 | §103 | Final Rejection | — | Pending | Jun 30, 2022 |
| 17809212 | METHOD OF IMPEDANCE MATCHING, ELECTRONIC DEVICE AND COMPUTER-READABLE RECORDING MEDIUM | Samsung Electronics Co., Ltd. | LEATHERS, EMILY GORMAN | 2187 | §101 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17846245 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | DAS, PINAKI | 2898 | §103 | Final Rejection | 61d | Pending | Jun 22, 2022 |
| 17805735 | POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | DION, MARCEL T | 3723 | §103 | Non-Final OA | — | AI Ready | Jun 07, 2022 |
| 17831530 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN WITH INTEGRATED CONDUCTIVE STRUCTURE AND INTERCONNECTION | Samsung Electronics | BAUMAN, SCOTT E | 2815 | §103 | Final Rejection | 55d | Pending | Jun 03, 2022 |
| 17718795 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | SCHODDE, CHRISTOPHER A | 2898 | §103 | Non-Final OA | — | AI Ready | Apr 12, 2022 |
| 17697516 | FLOATING POINT OPERATION CIRCUIT PERFORMING A FUSED MULTIPLICATION AND ADDITION OPERATION, A METHOD OF OPERATING THE SAME AND AN INTEGRATED CIRCUIT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | GUDAS, JAKOB OSCAR | 2151 | §101 | Non-Final OA | — | Pending | Mar 17, 2022 |
| 17646977 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2022 |
| 17475506 | INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE | Samsung Electronics Co., Ltd. | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Non-Final OA | — | Pending | Sep 15, 2021 |
| 17348841 | COMPUTING DEVICE COMPENSATED FOR ACCURACY REDUCTION CAUSED BY PRUNING AND OPERATION METHOD THEREOF | Samsung Electronics Co., Ltd. | KAPOOR, DEVAN | 2126 | §103 | Non-Final OA | — | Pending | Jun 16, 2021 |
| 17128362 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | NARAGHI, ALI | 2817 | §103 | Non-Final OA | 11d overdue | AI Ready | Dec 21, 2020 |
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