Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
215 pending office actions • 5 clients • 195 examiners • 61 art units • 38 of 215 (18%) have an AI response strategy ready • 1,328 patents granted in the last 365 days
Morgan, Lewis & Bockius LLP (WA)(SEC) operates as a patent law firm in Semiconductors, Circuits & Optics. The firm has managed 1919 career applications, achieving a resolved allowance rate of 97.44 percent. Prosecution is highly efficient, averaging only 2.1 office actions per allowance.
The firm currently has 147 pending office actions. The 2.1 average office actions per allowance suggests a very direct path to grant, with the firm effectively overcoming examiner rejections in few cycles. This performance is established across 1919 career applications in the Semiconductors, Circuits & Optics technology area.
The 97.44 percent allowance rate demonstrates a high level of success for resolved applications. Practitioners can anticipate a streamlined prosecution process given the 2.1 average office actions per allowance. With 147 pending office actions, the firm maintains a significant active workload in this technical field.
Based on the USPTO statutory response window for each pending office action. 37 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 37 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 1 (0%) |
| §101 + other | 5 (2%) |
| §103 only | 86 (40%) |
| §102 only | 17 (8%) |
| §112 only | 6 (3%) |
| Double-patenting only | 1 (0%) |
| Multi-statute (no §101) | 96 (45%) |
| No statute on record | 3 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SMITH, SAMUEL JONATHAN | 3 | 83.7% | +5.7% |
| LEE, EUGENE | 3 | 81.9% | +5.8% |
| GOODWIN, DAVID J | 3 | 67.4% | +16.5% |
| WEGNER, AARON MICHAEL | 2 | 73.7% | -3.6% |
| LEE, DA WEI | 2 | 80.4% | +15.4% |
| GONDARENKO, NATALIA A | 2 | 72.8% | +20.5% |
| INOUSSA, MOULOUCOULAY | 2 | 85.6% | +8.2% |
| CHANG, JAY C | 2 | 85.3% | +13.9% |
| ANDERSON, ERIK ARTHUR | 2 | 94.8% | +12.0% |
| GHEYAS, SYED I | 2 | 82.5% | +3.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18188311 | THREE DIMENSIONAL NON-VOLATILE MEMORY DEVICE | LEE, DA WEI | 9d overdue |
| 18382546 | SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE | LEE, EUGENE | 6d |
| 18779407 | MEMORY DEVICE INCLUDING POWER GATING SWITCH | INOUSSA, MOULOUCOULAY | — |
| 18749965 | SEMICONDUCTOR PACKAGE | INOUSSA, MOULOUCOULAY | — |
| 18742833 | SEMICONDUCTOR PACKAGE | CHANG, JAY C | — |
| 18735313 | SEMICONDUCTOR DEVICE | LEE, EUGENE | — |
| 18648683 | SEMICONDUCTOR PACKAGE | SMITH, SAMUEL JONATHAN | — |
| 18612648 | SEMICONDUCTOR PACKAGE | CHANG, JAY C | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18319850 | PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD | SCHATZ, CHRISTOPHER T | 19d overdue |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | MENZ, LAURA MARY | 11d overdue |
| 17984401 | METHOD AND DEVICE WITH ESTIMATING BATTERY STATE | BECKER, BRANDON J | 4d overdue |
| 18394992 | IMAGE SENSOR | SPINKS, ANTOINETTE T | 3d overdue |
| 18366922 | INTEGRATED CIRCUIT DEVICE | STEPHENSON, KENNETH STEPHEN | 3d overdue |
| 18497672 | SEMICONDUCTOR PACKAGE | TRAN, TRANG Q | 7d |
| 18554706 | METHODS AND SYSTEMS FOR PROVIDING COMMUNICATION BETWEEN A MULTI-SIM USER EQUIPMENT AND NETWORKS | LAFONTANT, GARY | 12d |
| 18239191 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | MILLER, ALEXANDER MICHAEL | 13d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18188311 | THREE DIMENSIONAL NON-VOLATILE MEMORY DEVICE | LEE, DA WEI | 9d overdue |
| 18086086 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | GOODWIN, DAVID J | 43d |
| 18827292 | MANUFACTURING SEMICONDUCTOR DEVICE USING SELECTIVE DIELECTRIC ON DIELECTRIC (DOD) DEPOSITION PROCESS | LEE, DA WEI | — |
| 18782386 | SEMICONDUCTOR PACKAGE HAVING A CONTROLLER | GONDARENKO, NATALIA A | — |
| 18748414 | WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME | GONDARENKO, NATALIA A | — |
| 18742833 | SEMICONDUCTOR PACKAGE | CHANG, JAY C | — |
| 18733210 | LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USING THE SAME | ANDERSON, ERIK ARTHUR | — |
| 18612648 | SEMICONDUCTOR PACKAGE | CHANG, JAY C | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Samsung | 211 |
| MERCK PATENT GMBH | 1 |
| Seoul National University | 1 |
| Samsung Electronics | 1 |
| Samsung Electronics | 1 |
| Art Unit | Apps |
|---|---|
| 2898 | 14 |
| 2817 | 13 |
| 2893 | 10 |
| 2818 | 9 |
| 2812 | 6 |
| 2897 | 6 |
| 4100 | 5 |
| 2815 | 4 |
| 2811 | 4 |
| 2637 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19298703 | DATA STORAGE DEVICE AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | TALUKDAR, ARVIND | 2132 | §101§102 | Non-Final OA | — | Pending | Aug 13, 2025 |
| 19247745 | SOLID-STATE IMAGING DEVICE | Samsung Electronics Co., Ltd. | KHAN, USMAN A | 2637 | §103 | Non-Final OA | — | Pending | Jun 24, 2025 |
| 19247598 | LOADER DEVICE AND SUBSTRATE TRANSPORT SYSTEM | Samsung Electronics Co., Ltd. | DAVIS, JERROD I | 3656 | §112 | Non-Final OA | — | Pending | Jun 24, 2025 |
| 19174421 | IMAGE SENSORS INCLUDING PHASE DETECTION PIXEL | Samsung Electronics Co., Ltd. | MOREHEAD III, JOHN H | §102§103 | Non-Final OA | — | Pending | Apr 09, 2025 | |
| 19080623 | ANTENNA STRUCTURE AND ANTENNA DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, HOANG V | 2845 | §103 | Non-Final OA | — | Pending | Mar 14, 2025 |
| 19063952 | CLOSED-LOOP ANTENNA IMPEDANCE TUNING SYSTEM AND DRIVING | Samsung Electronics Co., Ltd. | CHANG, DANIEL D | 2845 | §103 | Non-Final OA | — | Pending | Feb 26, 2025 |
| 19054222 | SMART STORAGE DEVICE | Samsung Electronics Co., Ltd. | WONG, TITUS | §102§112Other | Non-Final OA | — | Pending | Feb 14, 2025 | |
| 19054332 | UNIT PIXEL AND IMAGE SENSOR INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CUTLER, ALBERT H | 2637 | §102§103 | Non-Final OA | — | Pending | Feb 14, 2025 |
| 19045834 | DEVICE AND METHOD FOR ANALOG-TO-DIGITAL CONVERSION | Samsung Electronics Co., Ltd. | JEAN PIERRE, PEGUY | §103 | Non-Final OA | — | Pending | Feb 05, 2025 | |
| 19014441 | SYSTOLIC ARRAY, PROCESSING CIRCUIT INCLUDING SYSTOLIC ARRAY, AND ELECTRONIC DEVICE | Samsung Electronics Co., Ltd. | PETRANEK, JACOB ANDREW | 2183 | §103 | Final Rejection | — | Pending | Jan 09, 2025 |
| 19013161 | DC-DC CONVERTER | Samsung Electronics Co., Ltd. | TIKU, SISAY G | §102§112 | Non-Final OA | — | Pending | Jan 08, 2025 | |
| 19010980 | VIDEO SIGNAL PROCESSING DEVICE AND VIDEO SIGNAL PROCESSING METHOD | Samsung Electronics Co., Ltd. | BRANIFF, CHRISTOPHER | 2484 | §102§103 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19004901 | CLEANSING COMPOSITION FOR WAFER DICING | Samsung Electronics Co., Ltd. | DELCOTTO, GREGORY R | §103 | Non-Final OA | — | Pending | Dec 30, 2024 | |
| 18969521 | TEST CIRCUIT AND INTEGRATED CIRCUIT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PERRY, VICTOR NICHOLAS | 2111 | §103 | Final Rejection | — | Pending | Dec 05, 2024 |
| 18969572 | VOLTAGE REGULATOR CIRCUIT, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND OPERATING METHOD OF THE SAME | Samsung Electronics Co., Ltd. | SHAW, LAUREN ASHLEY | §102§103 | Non-Final OA | — | Pending | Dec 05, 2024 | |
| 18958173 | INTEGRATED CIRCUIT AND TEST SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | WENDEROTH, FREDERICK | §103 | Non-Final OA | — | Pending | Nov 25, 2024 | |
| 18949501 | PLASMA ETCHING APPARATUS | Samsung Electronics Co., Ltd. | LIGAN, OLUWAFEMI LUCRECE | §102§103 | Non-Final OA | — | Pending | Nov 15, 2024 | |
| 18949110 | NON-VOLATILE MEMORY DEVICE, CONTROLLER, AND MEMORY SYSTEM | Samsung Electronics Co., Ltd. | MERANT, GUERRIER | 2111 | §103 | Final Rejection | 20d | AI Ready | Nov 15, 2024 |
| 18938050 | MEMORY DEVICE, MEMORY MODULE INCLUDING THE MEMORY DEVICE, AND OPERATING METHOD OF MEMORY CONTROLLER | Samsung Electronics Co., Ltd. | CHAUDRY, MUJTABA M | 2112 | §102 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18926508 | METHOD OF DETECTING DEFECTIVE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BOYAR, NOAH WILLIAM | §101 | Non-Final OA | — | Pending | Oct 25, 2024 | |
| 18926702 | WIRELESS COMMUNICATION DEVICE, OPERATING METHOD, AND SYSTEM | Samsung Electronics Co., Ltd. | AYOTUNDE, AYODEJI O | §103 | Non-Final OA | — | Pending | Oct 25, 2024 | |
| 18916318 | STORAGE DEVICE INCLUDING REDUNDANCY MEMORY CELL AND REPAIR METHOD OF FAIL MEMORY CELL INCLUDED IN STORAGE DEVICE | Samsung Electronics Co., Ltd. | TORRES, JOSEPH D | 2112 | §103 | Non-Final OA | — | Pending | Oct 15, 2024 |
| 18914082 | UNIT CELL CIRCUIT AND MEMORY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, VAN THU T | 2824 | §103 | Non-Final OA | — | Pending | Oct 12, 2024 |
| 18910677 | APPARATUS AND METHOD FOR TREATING SUBSTRATE | Samsung Electronics Co., Ltd. | MCCORMACK, JOHN PATRICK | 1714 | §102§103§112 | Non-Final OA | — | Pending | Oct 09, 2024 |
| 18901283 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | CHEN, DAVID Z | 2815 | §102 | Final Rejection | — | Pending | Sep 30, 2024 |
| 18892761 | CHUCK FOR WAFER BONDING DEVICE | Samsung Electronics Co., Ltd. | ADDISU, SARA | 3722 | §103 | Non-Final OA | — | Pending | Sep 23, 2024 |
| 18889604 | SEMICONDUCTOR MEMORY DEVICE INCLUDING THREE-DIMENSIONALLY ARRANGED MEMORY CELLS AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | WEGNER, AARON MICHAEL | §102§103§112 | Non-Final OA | — | Pending | Sep 19, 2024 | |
| 18889979 | WIRELESS COMMUNICATION DEVICE AND OPERATING METHOD SUPPORTING CARRIER AGGREGATION | Samsung Electronics Co., Ltd. | KHIRODHAR, MAHARISHI V | Other | Non-Final OA | — | Pending | Sep 19, 2024 | |
| 18830715 | COOLING STATION | Samsung Electronics Co., Ltd. | RUPPERT, ERIC S | 3763 | §102§103§112 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18830785 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | CULLEN, PATRICK LAWRENCE | §103 | Non-Final OA | — | Pending | Sep 11, 2024 | |
| 18829994 | DATA STORAGE DEVICE, SYSTEM INCLUDING THE SAME, AND METHOD OF DOWNLOADING FIRMWARE | Samsung Electronics Co., Ltd. | ST LEGER, GEOFFREY R | §103 | Non-Final OA | — | Pending | Sep 10, 2024 | |
| 18826635 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Samsung Electronics Co., Ltd. | GONZALES, VICENTE ROLANDO | §103 | Non-Final OA | — | Pending | Sep 06, 2024 | |
| 18827292 | MANUFACTURING SEMICONDUCTOR DEVICE USING SELECTIVE DIELECTRIC ON DIELECTRIC (DOD) DEPOSITION PROCESS | Merck Patent GmbH | LEE, DA WEI | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18823171 | FAN-OUT LEVEL SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SIPLING, KENNETH MARK | §102§103 | Non-Final OA | — | Pending | Sep 03, 2024 | |
| 18822523 | SEMICONDUCTOR WAFER GRINDING WHEEL AND SEMICONDUCTOR WAFER POLISHING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | LARSON, JOHN MICHAEL | §102§103§112 | Non-Final OA | — | Pending | Sep 03, 2024 | |
| 18814719 | SEMICONDUCTOR DEVICE INSPECTION DEVICE AND SEMICONDUCTOR DEVICE INSPECTION METHOD | Samsung Electronics Co., Ltd. | PICON-FELICIANO, ANA J | 2482 | §103 | Non-Final OA | — | Pending | Aug 26, 2024 |
| 18812147 | UNIT PIXEL INCLUDING ONE OR MORE CAPACITORS AND AN IMAGE SENSOR INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PETERSON, CHRISTOPHER K | 2637 | §103 | Final Rejection | 22d overdue | AI Ready | Aug 22, 2024 |
| 18810735 | REFLECTOR FOR GENERATING NEUTRAL BEAMS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | KALISZEWSKI, ALINA ROSE | §102§103§112 | Non-Final OA | — | Pending | Aug 21, 2024 | |
| 18807004 | APPARATUS AND METHOD FOR COORDINATED SPATIAL REUSE IN WIRELESS COMMUNICATION | Samsung Electronics Co., Ltd. | DUFFY, JAMES P | §103§112 | Non-Final OA | — | Pending | Aug 16, 2024 | |
| 18802083 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SEVEN, EVREN | §102§103 | Non-Final OA | — | Pending | Aug 13, 2024 | |
| 18800577 | COMPOSITE STRUCTURE | Samsung Electronics Co., Ltd. | LOUGHRAN, RYAN PATRICK | §102§103§112 | Non-Final OA | — | Pending | Aug 12, 2024 | |
| 18788743 | UNIT AMPLIFICATION CIRCUIT, AMPLIFIER AND RECEIVING CIRCUIT | Samsung Electronics Co., Ltd. | NGUYEN, HIEU P | §102 | Non-Final OA | — | Pending | Jul 30, 2024 | |
| 18786824 | SEMICONDUCTOR PACKAGE HAVING A CORE MODULE | Samsung Electronics Co., Ltd. | AMRAN, WILLIAM HARLEY | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 | |
| 18782527 | SECURITY NETWORK SYSTEM MOUNTED INSIDE VEHICLE AND COMMUNICATION METHOD OF THE SAME | Samsung Electronics Co., Ltd. | WANG, HARRIS C | 2439 | §103§112 | Final Rejection | 34d | AI Ready | Jul 24, 2024 |
| 18782386 | SEMICONDUCTOR PACKAGE HAVING A CONTROLLER | Samsung Electronics Co., Ltd. | GONDARENKO, NATALIA A | §103 | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18779407 | MEMORY DEVICE INCLUDING POWER GATING SWITCH | Samsung Electronics Co., Ltd. | INOUSSA, MOULOUCOULAY | §102 | Non-Final OA | — | Pending | Jul 22, 2024 | |
| 18778460 | METHOD FOR FABRICATING MASK, METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE MASK, AND THE SEMICONDUCTOR DEVICE FABRICATED USING THE MASK | Samsung Electronics Co., Ltd. | KIM, TONG-HO | DP | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18777300 | IMAGE SENSOR WITH VARYING GRID WIDTH | Samsung Electronics Co., Ltd. | PATEL, REEMA | 2812 | §103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18761415 | ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE ELECTRONIC DEVICE | Samsung Electronics Co., Ltd. | ISAAC, STANETTA D | §102§103 | Non-Final OA | — | Pending | Jul 02, 2024 | |
| 18755803 | TEMPORAL AGGREGATION FOR DYNAMIC CHANNEL PRUNING AND SCALING | Samsung Electronics Co., Ltd. | LI, RUIPING | 2676 | §102§103 | Final Rejection | — | Pending | Jun 27, 2024 |
| 18754531 | BARRIER LAYER REMOVAL DEVICE AND BARRIER LAYER REMOVAL METHOD | Samsung Electronics Co., Ltd. | CROWELL, ANNA M | 1713 | §102§103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753244 | POWER SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | §103§112 | Non-Final OA | — | Pending | Jun 25, 2024 | |
| 18753011 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BEARDSLEY, JONAS TYLER | §103§112 | Non-Final OA | — | Pending | Jun 25, 2024 | |
| 18749965 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | INOUSSA, MOULOUCOULAY | §102 | Non-Final OA | — | Pending | Jun 21, 2024 | |
| 18748414 | WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | GONDARENKO, NATALIA A | §102§103§112 | Non-Final OA | — | Pending | Jun 20, 2024 | |
| 18744766 | FINGERPRINT SENSOR PACKAGE AND DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | FLORES, ROBERTO W | 2621 | §103 | Final Rejection | — | AI Ready | Jun 17, 2024 |
| 18742833 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | CHANG, JAY C | §102 | Non-Final OA | — | Pending | Jun 13, 2024 | |
| 18741416 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | ALBRECHT, PETER M | §112 | Non-Final OA | — | Pending | Jun 12, 2024 | |
| 18739548 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BULLARD-CONNOR, GENEVIEVE GRACE | §103 | Non-Final OA | — | Pending | Jun 11, 2024 | |
| 18739950 | SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | ASSOUMAN, HERVE-LOUIS Y | §102§103 | Non-Final OA | — | Pending | Jun 11, 2024 | |
| 18738153 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MEHTA, RATISHA | §103 | Non-Final OA | — | Pending | Jun 10, 2024 | |
| 18738107 | SEMICONDUCTOR DEVICE INCLUDING A VERTICAL CHANNEL TRANSISTOR | Samsung Electronics Co., Ltd. | DAVIS, SEAN MICHAEL | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 | |
| 18736228 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TYNES JR., LAWRENCE C | §102§103§112 | Non-Final OA | — | Pending | Jun 06, 2024 | |
| 18735789 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | HALL, VICTORIA KATHLEEN | §112 | Non-Final OA | — | Pending | Jun 06, 2024 | |
| 18735313 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | LEE, EUGENE | §103 | Non-Final OA | — | Pending | Jun 06, 2024 | |
| 18734610 | ELECTRONIC COMPONENT PACKAGE | Samsung Electronics Co., Ltd. | WATTS, JEREMY DANIEL | §102§103 | Non-Final OA | — | Pending | Jun 05, 2024 | |
| 18733210 | LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USING THE SAME | Samsung Electronics Co., Ltd. | ANDERSON, ERIK ARTHUR | §102§103 | Non-Final OA | — | Pending | Jun 04, 2024 | |
| 18676799 | MAGNETIC TUNNEL JUNCTION ELEMENT AND MEMORY DEVICE INCLUDING MAGNETIC TUNNEL JUNCTION ELEMENT | Samsung Electronics Co., Ltd. | JUNG, MICHAEL YOO LIM | §102§103Other | Non-Final OA | — | Pending | May 29, 2024 | |
| 18670378 | SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | GHEYAS, SYED I | §102§103§112 | Non-Final OA | — | Pending | May 21, 2024 | |
| 18668868 | SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER | Samsung Electronics Co., Ltd. | MUSLIM, SHAWN SHAW | §102§103 | Non-Final OA | — | Pending | May 20, 2024 | |
| 18668971 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | YECHURI, SITARAMARAO S | §102§103 | Non-Final OA | — | Pending | May 20, 2024 | |
| 18660294 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SUN, YU-HSI DAVID | §102§103 | Non-Final OA | — | Pending | May 10, 2024 | |
| 18660335 | SEMICONDUCTOR DEVICES INCLUDING CAPACITORS | Samsung Electronics Co., Ltd. | WOLDEGEORGIS, ERMIAS T | §102§103§112 | Non-Final OA | — | Pending | May 10, 2024 | |
| 18660677 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LEE, EUGENE | §102§103 | Non-Final OA | — | Pending | May 10, 2024 | |
| 18660712 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | REAMES, MATTHEW L | §103§112 | Non-Final OA | — | Pending | May 10, 2024 | |
| 18653101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | GREEN, TELLY D | §103§112 | Non-Final OA | — | Pending | May 02, 2024 | |
| 18650361 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | YECHURI, SITARAMARAO S | §103 | Non-Final OA | — | Pending | Apr 30, 2024 | |
| 18650189 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TRAPANESE, WILLIAM C | §102 | Non-Final OA | — | Pending | Apr 30, 2024 | |
| 18648683 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | §103 | Non-Final OA | — | Pending | Apr 29, 2024 | |
| 18648580 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | HAWKINS, IHSAN TAIWO | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 | |
| 18640332 | SUBSTRATE PROCESSING APPARATUS AND A SUBSTRATE PROCESSING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | ALANKO, ANITA KAREN | 1713 | §102§103 | Final Rejection | 42d | Pending | Apr 19, 2024 |
| 18640103 | SYSTEM-ON-CHIP INCLUDING VOLTAGE DROOP DETECTION CIRCUIT AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | SAMPATH, GAYATHRI | 2176 | §103 | Final Rejection | — | AI Ready | Apr 19, 2024 |
| 18639948 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SOWARD, IDA M | — | Non-Final OA | — | Pending | Apr 18, 2024 | |
| 18628890 | SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE USED FOR THE SAME | Samsung Electronics Co., Ltd. | LI, MEIYA | §103§112 | Non-Final OA | — | Pending | Apr 08, 2024 | |
| 18627687 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PARVEZ, AZM A | §102§103§112 | Non-Final OA | — | Pending | Apr 05, 2024 | |
| 18626444 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | JUNGE, BRYAN R. | §102§103 | Non-Final OA | — | Pending | Apr 04, 2024 | |
| 18626840 | POWER AMPLIFIER CONTROL DEVICE AND OPERATION METHOD THEREFOR | Samsung Electronics Co., Ltd. | NGUYEN, KHANH V | §102 | Non-Final OA | — | Pending | Apr 04, 2024 | |
| 18624328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WRIGHT, TUCKER J | §102§103 | Non-Final OA | — | Pending | Apr 02, 2024 | |
| 18623102 | ANTENNA MODULE AND ELECTRIC DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | HALLORAN, THOMAS JAMES | 3648 | §103 | Non-Final OA | 9d | AI Ready | Apr 01, 2024 |
| 18621273 | SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME | Samsung Electronics Co., Ltd. | VETERE, ROBERT A | §103 | Final Rejection | — | Pending | Mar 29, 2024 | |
| 18622131 | WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME | Samsung Electronics Co., Ltd. | STEVENSON, ANDRE C | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18621413 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, CUONG B | §112 | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18619512 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WILLS-BURNS, CHINEYERE D | §103§112 | Final Rejection | — | Pending | Mar 28, 2024 | |
| 18616418 | SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, DUY T V | §103 | Non-Final OA | — | Pending | Mar 26, 2024 | |
| 18615901 | METHOD FOR FABRICATING MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | TRAYWICK, ANDREW PRESTON | 4100 | §103§112 | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18612648 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | CHANG, JAY C | §112 | Non-Final OA | — | Pending | Mar 21, 2024 | |
| 18610612 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD | Samsung Electronics Co., Ltd. | TRAC, JONATHAN KHANH | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18608130 | MAGNETIC MEMORY DEVICE | Samsung Electronics Co., Ltd. | MCCUTCHEON, COLIN RUSSELL | 4100 | §102§103§112 | Non-Final OA | — | Pending | Mar 18, 2024 |
| 18608838 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME | Samsung Electronics Co., Ltd. | YEMELYANOV, DMITRIY | §103§112 | Non-Final OA | — | Pending | Mar 18, 2024 | |
| 18601032 | SEMICONDUCTOR MEMORY DEVICE | Samsung Electronics Co., Ltd. | OH, JAEHWAN | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18596869 | SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRICATION METHOD USING THE SAME | Samsung Electronics Co., Ltd. | STONER, KILEY SHAWN | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18594049 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MORA, ONASIS | 4100 | §103 | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18587326 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TRAN, TAN N | 2812 | §102§103 | Final Rejection | — | Pending | Feb 26, 2024 |
| 18444592 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC SYSTEM | Samsung Electronics Co., Ltd. | GHEYAS, SYED I | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18442387 | METHOD AND DEVICE FOR CONTROLLING MEMORY | Seoul National University R&Db Foundation | CHOI, WOO H | 3992 | §102§103§112 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18439884 | CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | HALL JR, TYRONE VINCENT | 3723 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18439835 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BOEGEL, CHEVY JACOB | 2812 | §103 | Final Rejection | — | Pending | Feb 13, 2024 |
| 18439634 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18439381 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | 2817 | §102 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18438335 | SEMICONDUCTOR PACKAGE IN A STACK FORM | Samsung Electronics Co., Ltd. | FAYETTE, NATHALIE RENEE | 2812 | §102§103§112 | Non-Final OA | — | Pending | Feb 09, 2024 |
| 18437394 | MULTI-BIT CELL AND MULTI-BIT CELL ARRAY INCLUDING THE SAME | Samsung Electronics Co., Ltd. | AGGER, ELIZABETH ROSE | 2824 | §103§112 | Non-Final OA | 40d | AI Ready | Feb 09, 2024 |
| 18438357 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ANDERSON, ERIK ARTHUR | 2812 | §103 | Non-Final OA | — | Pending | Feb 09, 2024 |
| 18437236 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS | Samsung Electronics Co., Ltd. | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Feb 08, 2024 |
| 18434913 | STORAGE CONTROLLER, AN OPERATING METHOD OF THE SAME, AND A STORAGE SYSTEM | Samsung Electronics Co., Ltd. | MENDEL, JULIAN SCOTT | 2133 | §103§112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18426868 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18427795 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | NEWTON, VALERIE N | 2897 | §103 | Final Rejection | — | Pending | Jan 30, 2024 |
| 18427676 | SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD | Samsung Electronics Co., Ltd. | SCHINDLER, DAVID M | 2858 | §103§112 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18425048 | DEPOSITION SYSTEM AND PROCESSING SYSTEM | Samsung Electronics Co., Ltd. | MILLER, JR, JOSEPH ALBERT | 1712 | §103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18420547 | CHARGING CONTROL INTEGRATED CIRCUIT AND OPERATION METHOD THEREOF | Samsung Electronics Co., Ltd. | AMAYA, CARLOS DAVID | §102 | Non-Final OA | — | Pending | Jan 23, 2024 | |
| 18418765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | STARK, JARRETT J | 2898 | §102 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18418868 | CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD | Samsung Electronics Co., Ltd. | SWEELY, KURT D | 1718 | §103 | Non-Final OA | — | Pending | Jan 22, 2024 |
| 18417254 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MANN, WILLIAM ROBERT | 2897 | §103 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18417937 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | HAIDER, WASIUL | 2812 | §103 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18413399 | EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | LEE, ALEXANDER N | §103§112 | Non-Final OA | — | Pending | Jan 16, 2024 | |
| 18413115 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MOHAMED-ALY, KAREEM M | 2898 | §103 | Final Rejection | — | Pending | Jan 16, 2024 |
| 18412447 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME | Samsung Electronics Co., Ltd. | PRICE, LYTESHIA M | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18410992 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | HENRY, CALEB E | 2818 | §102 | Final Rejection | 26d | AI Ready | Jan 11, 2024 |
| 18403842 | ELECTRONIC DEVICE FOR PLAYING VIDEO AND OPERATING METHOD OF THE SAME | Samsung Electronics Co., Ltd. | PARK, SUNGHYOUN | 2484 | §103 | Final Rejection | — | Pending | Jan 04, 2024 |
| 18402021 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | Pending | Jan 02, 2024 |
| 18399831 | METHOD AND DEVICE FOR IMPLEMENTING VIRTUAL MACHINE INTROSPECTION | Samsung Electronics Co., Ltd. | ROTARU, OCTAVIAN | 3624 | §101§103§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18394992 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | SPINKS, ANTOINETTE T | 2639 | §102§103 | Final Rejection | 3d overdue | AI Ready | Dec 22, 2023 |
| 18545864 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | YONAS, ADAM | §102§103 | Non-Final OA | — | Pending | Dec 19, 2023 | |
| 18543114 | PHOTORESIST COMPOSITION | Samsung Electronics Co., Ltd. | COSGROVE, JAYSON D | §102§103 | Non-Final OA | — | Pending | Dec 18, 2023 | |
| 18542890 | METHOD AND APPARATUS FOR INFERRING SEMICONDUCTOR MEASUREMENT RESULTS BASED ON ARTIFICIAL INTELLIGENCE | Samsung Electronics Co., Ltd. | LANE, THOMAS BERNARD | §102Other | Non-Final OA | — | Pending | Dec 18, 2023 | |
| 18541630 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | RAHIM, NILUFA | 2893 | §102§103§112 | Non-Final OA | — | Pending | Dec 15, 2023 |
| 18537997 | SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD | Samsung Electronics Co., Ltd. | KIM, JEANNE MYON | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18537903 | STRAIN MEASURING DEVICE | Samsung Electronics Co., Ltd. | PETKOVSEK, DANIEL | 2874 | §103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18533672 | METHOD OF CONTROLLING ON-DIE TERMINATION AND MEMORY SYSTEM PERFORMING THE SAME | Samsung Electronics Co., Ltd. | TON, MY TRANG | 3992 | Other | Final Rejection | 82d | Pending | Dec 08, 2023 |
| 18529007 | THREE-DIMENSIONAL (3D) VERTICAL MEMORY DEVICE AND METHOD OF MANUFACTURING SAME | Samsung Electronics Co., Ltd. | SQUIRES, BRETT STEPHEN | 2899 | §103§112 | Final Rejection | — | Pending | Dec 05, 2023 |
| 18527856 | APPARATUS AND METHOD FOR NEURAL NETWORK TILING | Samsung Electronics Co., Ltd. | ALSHAHARI, SADIK AHMED | §101§102§103§112 | Non-Final OA | — | Pending | Dec 04, 2023 | |
| 18521965 | SEMICONDUCTOR CHIP HAVING A FRICTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | VU, VU A | 2897 | §102§103 | Final Rejection | — | Pending | Nov 28, 2023 |
| 18520472 | SOURCE VESSEL FOR EUV | Samsung Electronics Co., Ltd. | CHOI, JAMES J | 2878 | §103 | Final Rejection | — | Pending | Nov 27, 2023 |
| 18519211 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LUKE, DANIEL M | 2896 | §103§112 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18514715 | SUBSTRATE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | RAHMAN, MOIN M | 2898 | §102 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18512135 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | BIRCH, EKATERINA THOMASA | 2818 | §102§103§112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18511597 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | BRECHT, CHARLES MATTHEW | 2817 | §103 | Final Rejection | — | Pending | Nov 16, 2023 |
| 18510209 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Final Rejection | 71d | Pending | Nov 15, 2023 |
| 18502232 | USER EQUIPMENT PERFORMING BLIND DECODING AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | BELETE, BERHANU D | 2418 | §103 | Final Rejection | — | Pending | Nov 06, 2023 |
| 18499117 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18498020 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | NADAV, ORI | 2811 | §102§103 | Final Rejection | — | Pending | Oct 30, 2023 |
| 18497672 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 7d | AI Ready | Oct 30, 2023 |
| 18382546 | SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE | Samsung Electronics Co., Ltd. | LEE, EUGENE | 2815 | §103 | Final Rejection | 6d | AI Ready | Oct 23, 2023 |
| 18490063 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | LUKE, DANIEL M | 2896 | §103§112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18486546 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, DAO H | 2818 | §102Other | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18378170 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SON, ERIKA HEERA | 2893 | §102§103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18554706 | METHODS AND SYSTEMS FOR PROVIDING COMMUNICATION BETWEEN A MULTI-SIM USER EQUIPMENT AND NETWORKS | Samsung Electronics Co., Ltd. | LAFONTANT, GARY | 2646 | §102§103 | Final Rejection | 12d | AI Ready | Oct 10, 2023 |
| 18484087 | SYSTEM AND METHOD FOR AERIAL-ASSISTED FEDERATED LEARNING | Samsung Electronics Co., Ltd. | SHEDRICK, CHARLES TERRELL | 2646 | §103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18474455 | ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNECTION BUMP USING THE SAME, AND VACUUM JIG FOR SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | RUFO, RYAN C | 3722 | §102§112 | Non-Final OA | — | Pending | Sep 26, 2023 |
| 18244336 | SEMICONDUCTOR CLEANING COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR USING THE SAME | Samsung Electronics Co., Ltd. | HARRIS, BRITTANY SHARON | 1761 | §103 | Non-Final OA | — | AI Ready | Sep 11, 2023 |
| 18465110 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | THROCKMORTON, ROBERT EMIL | 2818 | §102§103§112 | Non-Final OA | — | AI Ready | Sep 11, 2023 |
| 18464091 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ONUTA, TIBERIU DAN | 2814 | §112 | Final Rejection | 29d | AI Ready | Sep 08, 2023 |
| 18459766 | CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | AI Ready | Sep 01, 2023 |
| 18459520 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | IQBAL, HAMNA FATHIMA | 2817 | §103§112 | Final Rejection | 72d | Pending | Sep 01, 2023 |
| 18457504 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 61d | Pending | Aug 29, 2023 |
| 18239191 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MILLER, ALEXANDER MICHAEL | 2898 | §103§112 | Final Rejection | 13d | AI Ready | Aug 29, 2023 |
| 18457535 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ZARNEKE, DAVID A | 2891 | §103 | Final Rejection | — | Pending | Aug 29, 2023 |
| 18457313 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | §103 | Non-Final OA | 19d overdue | AI Ready | Aug 28, 2023 |
| 18366922 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | STEPHENSON, KENNETH STEPHEN | 2898 | §102§103§112 | Final Rejection | 3d overdue | AI Ready | Aug 08, 2023 |
| 18366322 | APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE BY USING FOCUSED ION BEAM AND SCANNING ELECTRON MICROSCOPE SUPPORTED BY ELECTRON DIFFRACTION PATTERN | Samsung Electronics Co., Ltd. | MCCORMACK, JASON L | 2881 | §103 | Final Rejection | 41d | AI Ready | Aug 07, 2023 |
| 18364763 | OUTPUT MATCHING NETWORK WITH IMPROVED WIDE BAND CHARACTERISTICS AND POWER AMPLIFIER NETWORK INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BARTOL, LANCE TORBJORN | 2843 | §103 | Non-Final OA | 61d | Pending | Aug 03, 2023 |
| 18361892 | ELECTRO-STATIC DISCHARGE PROTECTION DEVICE | Samsung Electronics Co., Ltd. | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | 33d | AI Ready | Jul 30, 2023 |
| 18354039 | DEPTH EDGES REFINEMENT FOR SPARSELY SUPERVISED MONOCULAR DEPTH ESTIMATION | Samsung Electronics Co., Ltd. | TAYLOR, MEREDITH IREENE DUPAI | 2671 | §102§103 | Final Rejection | — | Pending | Jul 18, 2023 |
| 18353279 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PRASAD, NEIL R | 2897 | §102 | Final Rejection | — | Pending | Jul 17, 2023 |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | MENZ, LAURA MARY | 2813 | §102§103 | Non-Final OA | 11d overdue | AI Ready | Jul 11, 2023 |
| 18216675 | EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TURNER, BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18215205 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Samsung Electronics | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2023 |
| 18342534 | METHOD AND APPARATUS WITH BATTERY PARAMETER OPTIMIZATION FOR TARGET BATTERY | Samsung Electronics Co., Ltd. | GOLD, HENRY JOYNER | 2859 | §101§103§112 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18214861 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | BERRY, PAUL ANTHONY | 2898 | §103§112 | Final Rejection | — | AI Ready | Jun 27, 2023 |
| 18341345 | SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY | Samsung Electronics Co., Ltd. | YAP, DOUGLAS ANTHONY | 2800 | §102§103§112 | Non-Final OA | — | Pending | Jun 26, 2023 |
| 18329784 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG WITH AN UPPER CONDUCTIVE PATTERN FORMED ON AN UPPER SURFACE OF A LOWER CONDUCTIVE PATTERN | Samsung Electronics Co., Ltd. | MAI, ANH D | 2893 | §103 | Final Rejection | 20d | AI Ready | Jun 06, 2023 |
| 18329530 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WEILAND, ADAM DAVID | 2813 | §103 | Non-Final OA | — | Pending | Jun 05, 2023 |
| 18199504 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SENGDARA, VONGSAVANH | 2893 | §103 | Final Rejection | — | Pending | May 19, 2023 |
| 18199553 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TRAN, THANH Y | 2817 | §102 | Final Rejection | — | AI Ready | May 19, 2023 |
| 18319850 | PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD | Samsung Electronics Co., Ltd. | SCHATZ, CHRISTOPHER T | 1746 | §103§112 | Final Rejection | 19d overdue | AI Ready | May 18, 2023 |
| 18320138 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SYLVIA, CHRISTINA A | 2817 | §103 | Final Rejection | 28d | AI Ready | May 18, 2023 |
| 18315261 | DOPPLER MEASUREMENT-BASED HANDOVER | Samsung Electronics Co., Ltd. | LAM, DUNG LE | 2646 | §103 | Non-Final OA | 44d overdue | AI Ready | May 10, 2023 |
| 18143735 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | — | Pending | May 05, 2023 |
| 18305676 | NON-LINEAR MULTI-DIMENSIONAL COST FUNCTION FOR ARTIFICIAL INTELLIGENCE INFERENCE | Samsung Electronics Co., Ltd. | BOSTWICK, SIDNEY VINCENT | 2124 | §103 | Non-Final OA | 32d overdue | AI Ready | Apr 24, 2023 |
| 18296329 | SEMICONDUCTOR DEVICE WITH DEEP SILICIDE FILM | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103 | Non-Final OA | — | AI Ready | Apr 05, 2023 |
| 18189349 | IMAGE SENSOR USING METHOD OF DRIVING HYBRID SHUTTER AND IMAGE PROCESSING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHIU, WESLEY JASON | 2639 | §103 | Non-Final OA | — | Pending | Mar 24, 2023 |
| 18188311 | THREE DIMENSIONAL NON-VOLATILE MEMORY DEVICE | Samsung Electronics Co., Ltd. | LEE, DA WEI | 2817 | §103 | Non-Final OA | 9d overdue | AI Ready | Mar 22, 2023 |
| 18186849 | SEMICONDUCTOR DEVICE INCLUDING A FORROELECTRIC TRANSISTOR | Samsung Electronics Co., Ltd. | PARK, SAMUEL | 2818 | §103 | Non-Final OA | 4d overdue | AI Ready | Mar 20, 2023 |
| 18185915 | SECURE PROVISIONING OF COMMUNICATIONS CHANNELS | Samsung Electronics Co., Ltd. | KOBROSLI, SHADI HASSAN | 2492 | §103 | Final Rejection | 36d overdue | AI Ready | Mar 17, 2023 |
| 18118775 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | IQBAL, HAMNA FATHIMA | 2817 | §103 | Non-Final OA | — | Pending | Mar 08, 2023 |
| 18179664 | WIRELESS ELECTRONIC DEVICE WITH TOTAL EXPOSURE RATIO (TER) CONTROL AND OPERATION METHOD THEREOF | Samsung Electronics Co., Ltd. | DEAN, RAYMOND S | 2645 | §103 | Final Rejection | 34d | AI Ready | Mar 07, 2023 |
| 18112202 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | — | Pending | Feb 21, 2023 |
| 18108125 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | 33d | Pending | Feb 10, 2023 |
| 18100216 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | — | Pending | Jan 23, 2023 |
| 18086086 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 43d | AI Ready | Dec 21, 2022 |
| 18080013 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | WEGNER, AARON MICHAEL | 2897 | §103 | Non-Final OA | — | Pending | Dec 13, 2022 |
| 17984401 | METHOD AND DEVICE WITH ESTIMATING BATTERY STATE | Samsung Electronics Co., Ltd. | BECKER, BRANDON J | 2857 | §102§103§112 | Final Rejection | 4d overdue | AI Ready | Nov 10, 2022 |
| 18050699 | SEMICONDUCTOR DEVICE, METHOD OF OPERATING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SYSTEM | Samsung Electronics Co., Ltd. | MARU, MATIYAS T | 2148 | §103 | Non-Final OA | — | Pending | Oct 28, 2022 |
| 17944407 | SEMICONDUCTOR DEVICE INCLUDING CELL CAPACITORS AND DECOUPLING CAPACITORS | Samsung Electronics Co., Ltd. | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | — | Pending | Sep 14, 2022 |
| 17867764 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | DIAZ, JOSE R | 2815 | §103 | Non-Final OA | — | Pending | Jul 19, 2022 |
| 17812787 | USER EQUIPMENT AND BASE STATION SUPPORTING DYNAMIC SPECTRUM SHARING, AND COMMUNICATION SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BAIG, ADNAN | 2461 | §103 | Non-Final OA | — | Pending | Jul 15, 2022 |
| 17812461 | STORAGE DEVICE AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | RIGOL, YAIMA | 2135 | §103§112 | Final Rejection | — | Pending | Jul 14, 2022 |
| 17809212 | METHOD OF IMPEDANCE MATCHING, ELECTRONIC DEVICE AND COMPUTER-READABLE RECORDING MEDIUM | Samsung Electronics Co., Ltd. | LEATHERS, EMILY GORMAN | 2187 | §101§112 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17846245 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | DAS, PINAKI | 2898 | §103 | Final Rejection | 61d | Pending | Jun 22, 2022 |
| 17805735 | POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | DION, MARCEL T | 3723 | §103§112 | Final Rejection | — | AI Ready | Jun 07, 2022 |
| 17831530 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN WITH INTEGRATED CONDUCTIVE STRUCTURE AND INTERCONNECTION | Samsung Electronics | BAUMAN, SCOTT E | 2815 | §103§112 | Final Rejection | 55d | Pending | Jun 03, 2022 |
| 17732412 | COMPUTING DEVICE FOR PREDICTING DATA FOR TRANSISTOR MODELING, TRANSISTOR MODELING APPARATUS HAVING THE SAME, AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | HOCKER, JOHN PAUL | 2189 | §103§112 | Non-Final OA | — | Pending | Apr 28, 2022 |
| 17659135 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | AI Ready | Apr 13, 2022 |
| 17649217 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | Jan 28, 2022 |
| 17646977 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | TRAN, TONY | 2893 | §103 | Final Rejection | — | Pending | Jan 04, 2022 |
| 17475506 | INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE | Samsung Electronics Co., Ltd. | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Non-Final OA | — | Pending | Sep 15, 2021 |
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