Prosecution Insights
Prosecution Insights
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| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19300369 | STORAGE CONTROLLER, STORAGE DEVICE AND STORAGE SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TSUI, DANIEL D | 2132 | §102§103 | Non-Final OA | — | Pending | Aug 14, 2025 |
| 19298703 | DATA STORAGE DEVICE AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | TALUKDAR, ARVIND | 2132 | §101§102 | Non-Final OA | — | Pending | Aug 13, 2025 |
| 19247598 | LOADER DEVICE AND SUBSTRATE TRANSPORT SYSTEM | Samsung Electronics Co., Ltd. | DAVIS, JERROD I | 3656 | §112 | Non-Final OA | — | Pending | Jun 24, 2025 |
| 19247745 | SOLID-STATE IMAGING DEVICE | Samsung Electronics Co., Ltd. | KHAN, USMAN A | 2637 | §103 | Non-Final OA | — | Pending | Jun 24, 2025 |
| 19207831 | FLIP-FLOPS FOR A LOW POWER INTEGRATED CIRCUIT (IC) | Samsung Electronics Co., Ltd. | PUENTES, DANIEL CALRISSIAN | 2836 | §102§103§112 | Non-Final OA | — | Pending | May 14, 2025 |
| 19080623 | ANTENNA STRUCTURE AND ANTENNA DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, HOANG V | 2845 | §103 | Non-Final OA | — | Pending | Mar 14, 2025 |
| 19054222 | SMART STORAGE DEVICE | Samsung Electronics Co., Ltd. | WONG, TITUS | 2181 | §102§112Other | Non-Final OA | — | Pending | Feb 14, 2025 |
| 19054332 | UNIT PIXEL AND IMAGE SENSOR INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CUTLER, ALBERT H | 2637 | §102§103 | Non-Final OA | — | Pending | Feb 14, 2025 |
| 19045834 | DEVICE AND METHOD FOR ANALOG-TO-DIGITAL CONVERSION | Samsung Electronics Co., Ltd. | JEAN PIERRE, PEGUY | 2845 | §103 | Non-Final OA | — | Pending | Feb 05, 2025 |
| 19013161 | DC-DC CONVERTER | Samsung Electronics Co., Ltd. | TIKU, SISAY G | 2838 | §102§112 | Non-Final OA | — | Pending | Jan 08, 2025 |
| 19010980 | VIDEO SIGNAL PROCESSING DEVICE AND VIDEO SIGNAL PROCESSING METHOD | Samsung Electronics Co., Ltd. | BRANIFF, CHRISTOPHER | 2484 | §102§103 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19004901 | CLEANSING COMPOSITION FOR WAFER DICING | Samsung Electronics Co., Ltd. | DELCOTTO, GREGORY R | 1761 | §103 | Non-Final OA | — | Pending | Dec 30, 2024 |
| 18969521 | TEST CIRCUIT AND INTEGRATED CIRCUIT INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PERRY, VICTOR NICHOLAS | 2111 | §103 | Final Rejection | — | Pending | Dec 05, 2024 |
| 18958173 | INTEGRATED CIRCUIT AND TEST SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | WENDEROTH, FREDERICK | 2852 | §103 | Non-Final OA | — | Pending | Nov 25, 2024 |
| 18949501 | PLASMA ETCHING APPARATUS | Samsung Electronics Co., Ltd. | LIGAN, OLUWAFEMI LUCRECE | 1718 | §102§103 | Non-Final OA | — | Pending | Nov 15, 2024 |
| 18938050 | MEMORY DEVICE, MEMORY MODULE INCLUDING THE MEMORY DEVICE, AND OPERATING METHOD OF MEMORY CONTROLLER | Samsung Electronics Co., Ltd. | CHAUDRY, MUJTABA M | 2112 | §102 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18926702 | WIRELESS COMMUNICATION DEVICE, OPERATING METHOD, AND SYSTEM | Samsung Electronics Co., Ltd. | AYOTUNDE, AYODEJI O | 2649 | §103 | Non-Final OA | — | Pending | Oct 25, 2024 |
| 18926508 | METHOD OF DETECTING DEFECTIVE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BOYAR, NOAH WILLIAM | 2669 | §101 | Non-Final OA | — | Pending | Oct 25, 2024 |
| 18914082 | UNIT CELL CIRCUIT AND MEMORY DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, VAN THU T | 2824 | §103 | Final Rejection | — | Pending | Oct 12, 2024 |
| 18910677 | APPARATUS AND METHOD FOR TREATING SUBSTRATE | Samsung Electronics Co., Ltd. | MCCORMACK, JOHN PATRICK | 1714 | §102§103§112 | Non-Final OA | — | Pending | Oct 09, 2024 |
| 18901283 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | CHEN, DAVID Z | 2815 | §102 | Final Rejection | — | Pending | Sep 30, 2024 |
| 18896219 | SEMICONDUCTOR DEVICE INCLUDING BIT LINES | Samsung Electronics Co., Ltd. | RAHMAN, MOIN M | 2898 | §102 | Non-Final OA | — | Pending | Sep 25, 2024 |
| 18892761 | CHUCK FOR WAFER BONDING DEVICE | Samsung Electronics Co., Ltd. | ADDISU, SARA | 3722 | §103 | Non-Final OA | — | Pending | Sep 23, 2024 |
| 18889604 | SEMICONDUCTOR MEMORY DEVICE INCLUDING THREE-DIMENSIONALLY ARRANGED MEMORY CELLS AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | WEGNER, AARON MICHAEL | 2897 | §102§103§112 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18889979 | WIRELESS COMMUNICATION DEVICE AND OPERATING METHOD SUPPORTING CARRIER AGGREGATION | Samsung Electronics Co., Ltd. | KHIRODHAR, MAHARISHI V | 2428 | Other | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18830785 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18829994 | DATA STORAGE DEVICE, SYSTEM INCLUDING THE SAME, AND METHOD OF DOWNLOADING FIRMWARE | Samsung Electronics Co., Ltd. | ST LEGER, GEOFFREY R | 2192 | §103 | Non-Final OA | — | Pending | Sep 10, 2024 |
| 18827292 | MANUFACTURING SEMICONDUCTOR DEVICE USING SELECTIVE DIELECTRIC ON DIELECTRIC (DOD) DEPOSITION PROCESS | Merck Patent GmbH | LEE, DA WEI | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18826508 | METHODS AND SYSTEMS FOR POWER SAVING AND PAGING REDUCTION IN A WIRELESS COMMUNICATION NETWORK | Samsung Electronics Co., Ltd. | RAHMAN, M MOSTAZIR | 2411 | §102§103Other | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18826635 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Samsung Electronics Co., Ltd. | GONZALES, VICENTE ROLANDO | 2899 | §103 | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18825204 | DIFFERENTIAL AMPLIFIER INCLUDING FEEDBACK LOOP CIRCUITS, ELECTRONIC DEVICE, AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | KHAN, AMAAN JAWAD | 2843 | §102§103 | Non-Final OA | — | Pending | Sep 05, 2024 |
| 18825173 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | CHOWDHARY, NIMARTA KAUR | 2898 | §112 | Non-Final OA | — | Pending | Sep 05, 2024 |
| 18822523 | SEMICONDUCTOR WAFER GRINDING WHEEL AND SEMICONDUCTOR WAFER POLISHING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | LARSON, JOHN MICHAEL | 3723 | §102§103§112 | Non-Final OA | — | Pending | Sep 03, 2024 |
| 18823171 | FAN-OUT LEVEL SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SIPLING, KENNETH MARK | 2818 | §102§103 | Non-Final OA | — | Pending | Sep 03, 2024 |
| 18817305 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | VANYO, MICHAEL MOHABIR | 2812 | §103§112 | Non-Final OA | — | Pending | Aug 28, 2024 |
| 18812147 | UNIT PIXEL INCLUDING ONE OR MORE CAPACITORS AND AN IMAGE SENSOR INCLUDING THE SAME | Samsung Electronics Co., Ltd. | PETERSON, CHRISTOPHER K | 2637 | §103 | Final Rejection | 22d overdue | AI Ready | Aug 22, 2024 |
| 18810735 | REFLECTOR FOR GENERATING NEUTRAL BEAMS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | KALISZEWSKI, ALINA ROSE | 2881 | §102§103§112 | Non-Final OA | — | Pending | Aug 21, 2024 |
| 18807004 | APPARATUS AND METHOD FOR COORDINATED SPATIAL REUSE IN WIRELESS COMMUNICATION | Samsung Electronics Co., Ltd. | DUFFY, JAMES P | 2461 | §103§112 | Non-Final OA | — | Pending | Aug 16, 2024 |
| 18805223 | SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER | Samsung Electronics Co., Ltd. | HARRISTON, WILLIAM A | 2899 | §102§103 | Non-Final OA | — | Pending | Aug 14, 2024 |
| 18802083 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SEVEN, EVREN | 2812 | §102§103 | Non-Final OA | — | Pending | Aug 13, 2024 |
| 18800577 | COMPOSITE STRUCTURE | Samsung Electronics Co., Ltd. | LOUGHRAN, RYAN PATRICK | 1731 | §102§103§112 | Non-Final OA | — | Pending | Aug 12, 2024 |
| 18788743 | UNIT AMPLIFICATION CIRCUIT, AMPLIFIER AND RECEIVING CIRCUIT | Samsung Electronics Co., Ltd. | NGUYEN, HIEU P | 2843 | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18786824 | SEMICONDUCTOR PACKAGE HAVING A CORE MODULE | Samsung Electronics Co., Ltd. | AMRAN, WILLIAM HARLEY | 2814 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18782386 | SEMICONDUCTOR PACKAGE HAVING A CONTROLLER | Samsung Electronics Co., Ltd. | GONDARENKO, NATALIA A | 2891 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18778460 | METHOD FOR FABRICATING MASK, METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE MASK, AND THE SEMICONDUCTOR DEVICE FABRICATED USING THE MASK | Samsung Electronics Co., Ltd. | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777300 | IMAGE SENSOR WITH VARYING GRID WIDTH | Samsung Electronics Co., Ltd. | PATEL, REEMA | 2812 | §103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18774426 | MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE | Samsung Electronics Co., Ltd. | OJEH, NDUKA E | 2892 | §102§103§112 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18771535 | FIXED BED REACTORS AND PROCESSES FOR DEHYDRATION OF ALCOHOLS | Braskem S.A. | FADHEL, ALI Z | 1772 | §103§112 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18761918 | SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD FOR THE SAME | Samsung Electronics Co., Ltd. | HAN, JONATHAN | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18754605 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MOTT, ADAM JOSEPH | 2817 | §112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753244 | POWER SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | 2817 | §103§112 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753011 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BEARDSLEY, JONAS TYLER | 2811 | §103§112 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18749965 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | INOUSSA, MOULOUCOULAY | 2818 | §102 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18748414 | WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | GONDARENKO, NATALIA A | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18748354 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | ERDEM, FAZLI | §102 | Non-Final OA | — | Pending | Jun 20, 2024 | |
| 18746562 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | LI, MO | 2818 | §102§112 | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18744766 | FINGERPRINT SENSOR PACKAGE AND DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | FLORES, ROBERTO W | 2621 | §103 | Final Rejection | — | AI Ready | Jun 17, 2024 |
| 18742833 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | CHANG, JAY C | 2817 | §102 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18741416 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | ALBRECHT, PETER M | 2811 | §112 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18739530 | NONVOLATILE MEMORY DEVICE AND OPERATION METHOD THEREOF | Samsung Electronics Co., Ltd. | SMET, UYEN TRAN | 2824 | §102§103 | Non-Final OA | — | Pending | Jun 11, 2024 |
| 18738100 | SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR INTEGRATED CIRCUITS HAVING THE SAME | Samsung Electronics Co., Ltd. | HA, NATHAN W | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18738107 | SEMICONDUCTOR DEVICE INCLUDING A VERTICAL CHANNEL TRANSISTOR | Samsung Electronics Co., Ltd. | DAVIS, SEAN MICHAEL | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18738153 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MEHTA, RATISHA | 2817 | §103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18736228 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TYNES JR., LAWRENCE C | 2899 | §102§103§112 | Non-Final OA | — | Pending | Jun 06, 2024 |
| 18735789 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | HALL, VICTORIA KATHLEEN | 2897 | §112 | Non-Final OA | — | Pending | Jun 06, 2024 |
| 18735507 | SEMICONDUCTOR DEVICE INCLUDING A THROUGH VIA AND A WIRING LAYER | Samsung Electronics Co., Ltd. | WARD, ERIC A | 2891 | §102§103 | Non-Final OA | — | Pending | Jun 06, 2024 |
| 18734610 | ELECTRONIC COMPONENT PACKAGE | Samsung Electronics Co., Ltd. | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18733210 | LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USING THE SAME | Samsung Electronics Co., Ltd. | ANDERSON, ERIK ARTHUR | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18672381 | FINGERPRINT SENSOR PACKAGE CARRIER AND FINGERPRINT SENSOR PACKAGE ASSEMBLY METHOD | Samsung Electronics Co., Ltd. | JIANG, YONG HANG | 2689 | §102§103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18668868 | SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER | Samsung Electronics Co., Ltd. | MUSLIM, SHAWN SHAW | 2897 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18668971 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | YECHURI, SITARAMARAO S | 2893 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18660335 | SEMICONDUCTOR DEVICES INCLUDING CAPACITORS | Samsung Electronics Co., Ltd. | WOLDEGEORGIS, ERMIAS T | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660712 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | REAMES, MATTHEW L | 2896 | §103§112 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660677 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LEE, EUGENE | 2815 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660294 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SUN, YU-HSI DAVID | 2817 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18653101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | GREEN, TELLY D | 2898 | §103§112 | Non-Final OA | — | Pending | May 02, 2024 |
| 18650361 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | YECHURI, SITARAMARAO S | 2893 | §103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18650189 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TRAPANESE, WILLIAM C | 2812 | §102 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18650213 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | HOSSAIN, MOAZZAM | 2898 | §103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18648683 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | 2817 | §103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18648580 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | HAWKINS, IHSAN TAIWO | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18640103 | SYSTEM-ON-CHIP INCLUDING VOLTAGE DROOP DETECTION CIRCUIT AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | SAMPATH, GAYATHRI | 2176 | §103 | Final Rejection | — | AI Ready | Apr 19, 2024 |
| 18640332 | SUBSTRATE PROCESSING APPARATUS AND A SUBSTRATE PROCESSING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | ALANKO, ANITA KAREN | 1713 | §102§103 | Final Rejection | 42d | Pending | Apr 19, 2024 |
| 18639948 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SOWARD, IDA M | 2898 | — | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18631231 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MUSE, ISMAIL A | 2812 | §103 | Final Rejection | — | Pending | Apr 10, 2024 |
| 18628890 | SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE USED FOR THE SAME | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | §103§112 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18627687 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PARVEZ, AZM A | 2892 | §102§103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18626840 | POWER AMPLIFIER CONTROL DEVICE AND OPERATION METHOD THEREFOR | Samsung Electronics Co., Ltd. | NGUYEN, KHANH V | 2843 | §102 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626406 | WIRELESS CHARGING CIRCUIT | Samsung Electronics Co., Ltd. | MIKELS, MATTHEW | §102 | Non-Final OA | — | Pending | Apr 04, 2024 | |
| 18625030 | ELECTROSTATIC CHUCK MODULE | Samsung Electronics Co., Ltd. | CLARKE, MARGARET HATSUE HYDE | §103§112 | Non-Final OA | — | Pending | Apr 02, 2024 | |
| 18624328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WRIGHT, TUCKER J | 2891 | §102§103 | Non-Final OA | — | Pending | Apr 02, 2024 |
| 18623102 | ANTENNA MODULE AND ELECTRIC DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | HALLORAN, THOMAS JAMES | 3648 | §103 | Non-Final OA | 9d | AI Ready | Apr 01, 2024 |
| 18622131 | WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME | Samsung Electronics Co., Ltd. | STEVENSON, ANDRE C | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621413 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, CUONG B | 2818 | §112 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621273 | SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME | Samsung Electronics Co., Ltd. | VETERE, ROBERT A | 1712 | §103 | Final Rejection | — | Pending | Mar 29, 2024 |
| 18619512 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WILLS-BURNS, CHINEYERE D | 2673 | §103§112 | Final Rejection | — | Pending | Mar 28, 2024 |
| 18616418 | SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18615901 | METHOD FOR FABRICATING MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | TRAYWICK, ANDREW PRESTON | 4100 | §103§112 | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18614804 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | GARCES, NELSON Y | 2814 | §102 | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18612648 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | CHANG, JAY C | 2817 | §112 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18611075 | GRINDING WHEEL | Samsung Electronics Co., Ltd. | FARRELL, MICHAEL THADDUES | 3723 | §102Other | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18608838 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME | Samsung Electronics Co., Ltd. | YEMELYANOV, DMITRIY | 2891 | §103§112 | Non-Final OA | — | Pending | Mar 18, 2024 |
| 18608130 | MAGNETIC MEMORY DEVICE | Samsung Electronics Co., Ltd. | MCCUTCHEON, COLIN RUSSELL | 2892 | §102§103§112 | Non-Final OA | — | Pending | Mar 18, 2024 |
| 18601032 | SEMICONDUCTOR MEMORY DEVICE | Samsung Electronics Co., Ltd. | OH, JAEHWAN | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18596869 | SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRICATION METHOD USING THE SAME | Samsung Electronics Co., Ltd. | STONER, KILEY SHAWN | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18594049 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MORA, ONASIS | 4100 | §103 | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18587326 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TRAN, TAN N | 2812 | §102§103 | Final Rejection | — | Pending | Feb 26, 2024 |
| 18442387 | METHOD AND DEVICE FOR CONTROLLING MEMORY | Seoul National University R&Db Foundation | CHOI, WOO H | 3992 | §102§103§112 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18439884 | CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | HALL JR, TYRONE VINCENT | 3723 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18439835 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BOEGEL, CHEVY JACOB | 2812 | §103 | Final Rejection | — | Pending | Feb 13, 2024 |
| 18439634 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18439381 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SMITH, SAMUEL JONATHAN | 2817 | §102 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18438335 | SEMICONDUCTOR PACKAGE IN A STACK FORM | Samsung Electronics Co., Ltd. | FAYETTE, NATHALIE RENEE | 2812 | §102§103§112 | Non-Final OA | — | Pending | Feb 09, 2024 |
| 18437394 | MULTI-BIT CELL AND MULTI-BIT CELL ARRAY INCLUDING THE SAME | Samsung Electronics Co., Ltd. | AGGER, ELIZABETH ROSE | 2824 | §103§112 | Non-Final OA | 40d | AI Ready | Feb 09, 2024 |
| 18427614 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CAMPBELL, SHAUN M | 2893 | §102§103 | Final Rejection | — | Pending | Jan 30, 2024 |
| 18427795 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | NEWTON, VALERIE N | 2897 | §103 | Final Rejection | — | Pending | Jan 30, 2024 |
| 18426868 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18425048 | DEPOSITION SYSTEM AND PROCESSING SYSTEM | Samsung Electronics Co., Ltd. | MILLER, JR, JOSEPH ALBERT | 1712 | §103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18420547 | CHARGING CONTROL INTEGRATED CIRCUIT AND OPERATION METHOD THEREOF | Samsung Electronics Co., Ltd. | AMAYA, CARLOS DAVID | 2836 | §102 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18418765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | STARK, JARRETT J | 2898 | §102 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18417937 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | HAIDER, WASIUL | 2812 | §103 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18414681 | SUBSTRATE PROCESSING APPARATUS | Samsung Electronics Co., Ltd. | BRAYTON, JOHN JOSEPH | 1794 | §102§103 | Final Rejection | — | Pending | Jan 17, 2024 |
| 18413399 | EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | LEE, ALEXANDER N | 1737 | §103§112 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18413115 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MOHAMED-ALY, KAREEM M | 2898 | §103 | Final Rejection | — | Pending | Jan 16, 2024 |
| 18412447 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME | Samsung Electronics Co., Ltd. | PRICE, LYTESHIA M | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18405107 | SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | CRITE, ANTONIO B | 2817 | §103§112 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18402021 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | Pending | Jan 02, 2024 |
| 18399831 | METHOD AND DEVICE FOR IMPLEMENTING VIRTUAL MACHINE INTROSPECTION | Samsung Electronics Co., Ltd. | ROTARU, OCTAVIAN | 3624 | §101§103§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18394992 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | SPINKS, ANTOINETTE T | 2639 | §102§103 | Non-Final OA | 3d overdue | AI Ready | Dec 22, 2023 |
| 18545919 | SUBSTRATE PROCESSING APPARATUS | Samsung Electronics Co., Ltd. | KENDALL, BENJAMIN R | 2896 | §102§103§112 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18545864 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | YONAS, ADAM | 3761 | §102§103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18543114 | PHOTORESIST COMPOSITION | Samsung Electronics Co., Ltd. | COSGROVE, JAYSON D | 1737 | §102§103 | Non-Final OA | — | Pending | Dec 18, 2023 |
| 18541630 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | RAHIM, NILUFA | 2893 | §102§103§112 | Non-Final OA | — | Pending | Dec 15, 2023 |
| 18537903 | STRAIN MEASURING DEVICE | Samsung Electronics Co., Ltd. | PETKOVSEK, DANIEL | 2874 | §103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18537997 | SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD | Samsung Electronics Co., Ltd. | KIM, JEANNE MYON | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18533672 | METHOD OF CONTROLLING ON-DIE TERMINATION AND MEMORY SYSTEM PERFORMING THE SAME | Samsung Electronics Co., Ltd. | TON, MY TRANG | 3992 | Other | Final Rejection | 82d | Pending | Dec 08, 2023 |
| 18529007 | THREE-DIMENSIONAL (3D) VERTICAL MEMORY DEVICE AND METHOD OF MANUFACTURING SAME | Samsung Electronics Co., Ltd. | SQUIRES, BRETT STEPHEN | 2899 | §103§112 | Final Rejection | — | Pending | Dec 05, 2023 |
| 18527856 | APPARATUS AND METHOD FOR NEURAL NETWORK TILING | Samsung Electronics Co., Ltd. | ALSHAHARI, SADIK AHMED | 2121 | §101§102§103§112 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18528501 | INTEGRATED CIRCUIT AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | AISAKA, BRYCE M | 2851 | §102 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18525803 | TRANSFER ROBOT AND STOCKER SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MCCLAIN, GERALD | 3652 | §103 | Final Rejection | 55d | AI Ready | Nov 30, 2023 |
| 18523314 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18521965 | SEMICONDUCTOR CHIP HAVING A FRICTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | VU, VU A | 2897 | §102§103 | Non-Final OA | — | Pending | Nov 28, 2023 |
| 18519211 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LUKE, DANIEL M | 2896 | §103§112 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18520472 | SOURCE VESSEL FOR EUV | Samsung Electronics Co., Ltd. | CHOI, JAMES J | 2878 | §103 | Final Rejection | — | Pending | Nov 27, 2023 |
| 18514715 | SUBSTRATE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | RAHMAN, MOIN M | 2898 | §102 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18512135 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | BIRCH, EKATERINA THOMASA | 2818 | §102§103§112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18511597 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | BRECHT, CHARLES MATTHEW | 2817 | §103 | Final Rejection | — | Pending | Nov 16, 2023 |
| 18510209 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Final Rejection | 71d | Pending | Nov 15, 2023 |
| 18497672 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 7d | AI Ready | Oct 30, 2023 |
| 18498020 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | NADAV, ORI | 2811 | §102§103 | Final Rejection | — | Pending | Oct 30, 2023 |
| 18494103 | EDGE COVERING AND SEMICONDUCTOR MANUFACTURING DEVICE COMPRISING THE SAME | Samsung Electronics Co., Ltd. | IJAZ, MUHAMMAD | 3631 | §102§103 | Final Rejection | 70d | Pending | Oct 25, 2023 |
| 18382546 | SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE | Samsung Electronics Co., Ltd. | LEE, EUGENE | 2815 | §103 | Non-Final OA | 6d | AI Ready | Oct 23, 2023 |
| 18490063 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | LUKE, DANIEL M | 2896 | §103§112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18484087 | SYSTEM AND METHOD FOR AERIAL-ASSISTED FEDERATED LEARNING | Samsung Electronics Co., Ltd. | SHEDRICK, CHARLES TERRELL | 2646 | §103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18378170 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SON, ERIKA HEERA | 2893 | §102§103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18244336 | SEMICONDUCTOR CLEANING COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR USING THE SAME | Samsung Electronics Co., Ltd. | HARRIS, BRITTANY SHARON | 1761 | §103 | Non-Final OA | — | AI Ready | Sep 11, 2023 |
| 18465110 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | THROCKMORTON, ROBERT EMIL | 2818 | §102§103§112 | Non-Final OA | — | AI Ready | Sep 11, 2023 |
| 18464091 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ONUTA, TIBERIU DAN | 2814 | §112 | Final Rejection | 29d | AI Ready | Sep 08, 2023 |
| 18459520 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | IQBAL, HAMNA FATHIMA | 2817 | §103§112 | Final Rejection | 72d | Pending | Sep 01, 2023 |
| 18457535 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ZARNEKE, DAVID A | 2891 | §103 | Final Rejection | — | Pending | Aug 29, 2023 |
| 18239191 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | MILLER, ALEXANDER MICHAEL | 2898 | §103§112 | Final Rejection | 13d | AI Ready | Aug 29, 2023 |
| 18239248 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | MAI, ANH D | 2893 | §103 | Non-Final OA | — | Pending | Aug 29, 2023 |
| 18457504 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 61d | Pending | Aug 29, 2023 |
| 18366322 | APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE BY USING FOCUSED ION BEAM AND SCANNING ELECTRON MICROSCOPE SUPPORTED BY ELECTRON DIFFRACTION PATTERN | Samsung Electronics Co., Ltd. | MCCORMACK, JASON L | 2881 | §103 | Final Rejection | 41d | AI Ready | Aug 07, 2023 |
| 18364763 | OUTPUT MATCHING NETWORK WITH IMPROVED WIDE BAND CHARACTERISTICS AND POWER AMPLIFIER NETWORK INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BARTOL, LANCE TORBJORN | 2843 | §103 | Non-Final OA | 61d | Pending | Aug 03, 2023 |
| 18364127 | MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NARAGHI, ALI | 2817 | §103 | Final Rejection | 27d | AI Ready | Aug 02, 2023 |
| 18361892 | ELECTRO-STATIC DISCHARGE PROTECTION DEVICE | Samsung Electronics Co., Ltd. | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | 33d | AI Ready | Jul 30, 2023 |
| 18354039 | DEPTH EDGES REFINEMENT FOR SPARSELY SUPERVISED MONOCULAR DEPTH ESTIMATION | Samsung Electronics Co., Ltd. | TAYLOR, MEREDITH IREENE DUPAI | 2671 | §103 | Final Rejection | — | Pending | Jul 18, 2023 |
| 18353279 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PRASAD, NEIL R | 2897 | §102§103 | Final Rejection | — | Pending | Jul 17, 2023 |
| 18351748 | METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | BARZYKIN, VICTOR V | 2893 | §103 | Non-Final OA | — | Pending | Jul 13, 2023 |
| 18215205 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Samsung Electronics | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2023 |
| 18342534 | METHOD AND APPARATUS WITH BATTERY PARAMETER OPTIMIZATION FOR TARGET BATTERY | Samsung Electronics Co., Ltd. | GOLD, HENRY JOYNER | 2189 | §101§103§112 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18329784 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG WITH AN UPPER CONDUCTIVE PATTERN FORMED ON AN UPPER SURFACE OF A LOWER CONDUCTIVE PATTERN | Samsung Electronics Co., Ltd. | MAI, ANH D | 2893 | §103 | Final Rejection | 20d | AI Ready | Jun 06, 2023 |
| 18329530 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WEILAND, ADAM DAVID | 2813 | §103 | Non-Final OA | — | Pending | Jun 05, 2023 |
| 18199504 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SENGDARA, VONGSAVANH | 2893 | §103 | Final Rejection | — | Pending | May 19, 2023 |
| 18199553 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TRAN, THANH Y | 2817 | §102 | Final Rejection | — | AI Ready | May 19, 2023 |
| 18319850 | PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD | Samsung Electronics Co., Ltd. | SCHATZ, CHRISTOPHER T | 1746 | §103§112 | Final Rejection | 19d overdue | AI Ready | May 18, 2023 |
| 18320138 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SYLVIA, CHRISTINA A | 2817 | §103 | Final Rejection | 28d | AI Ready | May 18, 2023 |
| 18315261 | DOPPLER MEASUREMENT-BASED HANDOVER | Samsung Electronics Co., Ltd. | LAM, DUNG LE | 2646 | §103 | Non-Final OA | 44d overdue | AI Ready | May 10, 2023 |
| 18143735 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | — | Pending | May 05, 2023 |
| 18296329 | SEMICONDUCTOR DEVICE WITH DEEP SILICIDE FILM | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103 | Non-Final OA | — | AI Ready | Apr 05, 2023 |
| 18193758 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 17d overdue | AI Ready | Mar 31, 2023 |
| 18189349 | IMAGE SENSOR USING METHOD OF DRIVING HYBRID SHUTTER AND IMAGE PROCESSING APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHIU, WESLEY JASON | 2639 | §103 | Non-Final OA | — | Pending | Mar 24, 2023 |
| 18124118 | SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHAN, CANDICE | 2813 | §103 | Final Rejection | 43d | Pending | Mar 21, 2023 |
| 18186849 | SEMICONDUCTOR DEVICE INCLUDING A FORROELECTRIC TRANSISTOR | Samsung Electronics Co., Ltd. | PARK, SAMUEL | 2818 | §103 | Non-Final OA | 4d overdue | AI Ready | Mar 20, 2023 |
| 18185915 | SECURE PROVISIONING OF COMMUNICATIONS CHANNELS | Samsung Electronics Co., Ltd. | KOBROSLI, SHADI HASSAN | 2492 | §103 | Final Rejection | 36d overdue | AI Ready | Mar 17, 2023 |
| 18118775 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | IQBAL, HAMNA FATHIMA | 2817 | §103 | Non-Final OA | — | Pending | Mar 08, 2023 |
| 18112202 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | RAHIM, NILUFA | 2893 | §103 | Non-Final OA | — | Pending | Feb 21, 2023 |
| 18100216 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | — | Pending | Jan 23, 2023 |
| 18086086 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 43d | AI Ready | Dec 21, 2022 |
| 18080013 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | WEGNER, AARON MICHAEL | 2897 | §103 | Non-Final OA | — | Pending | Dec 13, 2022 |
| 17984401 | METHOD AND DEVICE WITH ESTIMATING BATTERY STATE | Samsung Electronics Co., Ltd. | BECKER, BRANDON J | 2857 | §102§103§112 | Final Rejection | 4d overdue | AI Ready | Nov 10, 2022 |
| 18050699 | SEMICONDUCTOR DEVICE, METHOD OF OPERATING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SYSTEM | Samsung Electronics Co., Ltd. | MARU, MATIYAS T | 2148 | §103 | Non-Final OA | — | Pending | Oct 28, 2022 |
| 17944407 | SEMICONDUCTOR DEVICE INCLUDING CELL CAPACITORS AND DECOUPLING CAPACITORS | Samsung Electronics Co., Ltd. | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | — | Pending | Sep 14, 2022 |
| 17867764 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | DIAZ, JOSE R | 2815 | §103 | Non-Final OA | — | Pending | Jul 19, 2022 |
| 17812787 | USER EQUIPMENT AND BASE STATION SUPPORTING DYNAMIC SPECTRUM SHARING, AND COMMUNICATION SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BAIG, ADNAN | 2461 | §103 | Non-Final OA | — | Pending | Jul 15, 2022 |
| 17812461 | STORAGE DEVICE AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | RIGOL, YAIMA | 2135 | §103§112 | Non-Final OA | — | Pending | Jul 14, 2022 |
| 17809212 | METHOD OF IMPEDANCE MATCHING, ELECTRONIC DEVICE AND COMPUTER-READABLE RECORDING MEDIUM | Samsung Electronics Co., Ltd. | LEATHERS, EMILY GORMAN | 2187 | §101§112 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17846245 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | DAS, PINAKI | 2898 | §103 | Final Rejection | 61d | Pending | Jun 22, 2022 |
| 17805735 | POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | DION, MARCEL T | 3723 | §103§112 | Final Rejection | — | AI Ready | Jun 07, 2022 |
| 17831530 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN WITH INTEGRATED CONDUCTIVE STRUCTURE AND INTERCONNECTION | Samsung Electronics | BAUMAN, SCOTT E | 2815 | §103§112 | Final Rejection | 55d | Pending | Jun 03, 2022 |
| 17659135 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | AI Ready | Apr 13, 2022 |
| 17649217 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | Jan 28, 2022 |
| 17646977 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2022 |
| 17475506 | INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE | Samsung Electronics Co., Ltd. | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Non-Final OA | — | Pending | Sep 15, 2021 |