205 pending office actions • 2 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Samsung Electronics Co., Ltd. | 162 |
| Samsung Electronics Co., Ltd. | 43 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 19033726 | Untitled | Samsung Electronics Co., Ltd. | CHAPPELL, DANIEL C | 2135 | Non-Final OA | |
| 19090060 | Untitled | Samsung Electronics Co., Ltd. | BERMAN, JASON | 1794 | Non-Final OA | |
| 19019994 | STORAGE DEVICE, STORAGE SYSTEM INCLUDING THE SAME, AND METHOD OF OPERATING THE SAME | Samsung Electronics Co., Ltd. | MENDEL, JULIAN SCOTT | 2133 | Non-Final OA | Jan 14, 2025 |
| 19010662 | HYBRID UNINTERRUPTIBLE POWER SUPPLY | Samsung Electronics Co., Ltd. | GANNON, LEVI | 2849 | Non-Final OA | Jan 06, 2025 |
| 18929849 | MEMORY DEVICE HAVING REDUCED AREA | Samsung Electronics Co., Ltd. | TRAN, MICHAEL THANH | 2827 | Non-Final OA | Oct 29, 2024 |
| 18912862 | PAM3 TRANSMITTER, OPERATING METHOD OF PAM3 TRANSMITTER AND ELECTRONIC DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TSE, YOUNG TOI | 2632 | Non-Final OA | Oct 11, 2024 |
| 18899570 | LITHOGRAPHY TRACK SYSTEM | Samsung Electronics Co., Ltd. | NGUYEN, HUNG | 2882 | Non-Final OA | Sep 27, 2024 |
| 18897676 | MEMORY DEVICE AND STORAGE DEVICE INCLUDING THE SAME | Samsung Electronics Co., Ltd. | WELLS, KENNETH B | 2842 | Non-Final OA | Sep 26, 2024 |
| 18897025 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | ALROBAIE, KHAMDAN N | 2824 | Non-Final OA | Sep 26, 2024 |
| 18884268 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | PERSAUD, DEORAM | 2882 | Non-Final OA | Sep 13, 2024 |
| 18818812 | METHODS AND SEMICONDUCTOR INTEGRATED CIRCUITS FOR MANAGING LOGICAL BEHAVIOUR OF FLOATING INPUT PIN | Samsung Electronics Co., Ltd. | CHANG, DANIEL D | 2844 | Non-Final OA | Aug 29, 2024 |
| 18814749 | STORAGE MEMORY DEVICE HAVING MULTI TIME PROGRAMMABLE MEMORY AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | CHEN, XUXING | 2176 | Non-Final OA | Aug 26, 2024 |
| 18791587 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | PHUNG, NHIM THI | 2825 | Non-Final OA | Aug 01, 2024 |
| 18789762 | INTERFACE CIRCUITS, NON-VOLATILE MEMORY DEVICES, AND MEMORY CONTROLLERS HAVING ENHANCED OUTPUT DRIVERS THEREIN | Samsung Electronics Co., Ltd. | AGGER, ELIZABETH ROSE | 2824 | Non-Final OA | Jul 31, 2024 |
| 18781171 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | CORMIER, DAVID G | 1711 | Non-Final OA | Jul 23, 2024 |
| 18773949 | MAGNETIC MEMORY DEVICE | Samsung Electronics Co., Ltd. | TRAN, ANTHAN | 2825 | Non-Final OA | Jul 16, 2024 |
| 18772836 | 3D PRINTING APPARATUS AND 3D PRINTING METHOD | Samsung Electronics Co., Ltd. | MORENO HERNANDEZ, JERZI H | 1743 | Non-Final OA | Jul 15, 2024 |
| 18771727 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | PHAM, THOMAS T | 1713 | Non-Final OA | Jul 12, 2024 |
| 18743588 | SEMICONDUCTOR TRANSISTORS PROVIDING VARIOUS OPERATING VOLTAGES | Samsung Electronics Co., Ltd. | MALEK, MALIHEH | 2813 | Final Rejection | Jun 14, 2024 |
| 18669633 | MEMORY DEVICES AND OPERATING METHODS THEREOF | Samsung Electronics Co., Ltd. | CHO, SUNG IL | 2825 | Non-Final OA | May 21, 2024 |
| 18663360 | VOLTAGE CONVERTER AND OPERATING METHOD OF VOLTAGE CONVERTER | Samsung Electronics Co., Ltd. | TORRES-RIVERA, ALEX | 2838 | Non-Final OA | May 14, 2024 |
| 18657015 | PLASMA DIAGNOSIS DEVICE AND MANUFACTURING METHOD OF PLASMA DIAGNOSIS DEVICE | Samsung Electronics Co., Ltd. | AURORA, REENA | 2858 | Non-Final OA | May 07, 2024 |
| 18610982 | METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | ALANKO, ANITA KAREN | 1713 | Non-Final OA | Mar 20, 2024 |
| 18609802 | SEMICONDUCTOR TEST DEVICES, SYSTEMS INCLUDING THE SAME, AND METHODS FOR TESTING THE SAME | Samsung Electronics Co., Ltd. | MONSUR, NASIMA | 2858 | Final Rejection | Mar 19, 2024 |
| 18596020 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | LAOBAK, ANDREW KEELAN | 1713 | Non-Final OA | Mar 05, 2024 |
| 18590406 | FOCUS RING ALIGNMENT APPARATUS | Samsung Electronics Co., Ltd. | BAND, MICHAEL A | 1794 | Non-Final OA | Feb 28, 2024 |
| 18583285 | PAD CONDITIONERS | Samsung Electronics Co., Ltd. | HAWKINS, JASON KHALIL | 3723 | Non-Final OA | Feb 21, 2024 |
| 18582722 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | ONUTA, TIBERIU DAN | 2814 | Non-Final OA | Feb 21, 2024 |
| 18441578 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ZHU, SHENG-BAI | 2897 | Non-Final OA | Feb 14, 2024 |
| 18435198 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | PRIDEMORE, NATHAN ANDREW | 2898 | Non-Final OA | Feb 07, 2024 |
| 18434041 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | DAS, PINAKI | 2898 | Non-Final OA | Feb 06, 2024 |
| 18432182 | METHOD OF FORMING PHOTORESIST PATTERNS AND BAKING EQUIPMENT | Samsung Electronics Co., Ltd. | NGUYEN, HUNG | 2882 | Non-Final OA | Feb 05, 2024 |
| 18427977 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | ZABEL, ANDREW JOHN | 2818 | Non-Final OA | Jan 31, 2024 |
| 18426694 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | OJEH, NDUKA E | 2892 | Non-Final OA | Jan 30, 2024 |
| 18422471 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | GEYER, SCOTT B | 2812 | Non-Final OA | Jan 25, 2024 |
| 18419694 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | WARREN, MATTHEW E | 2817 | Non-Final OA | Jan 23, 2024 |
| 18417764 | TRAINING SCANNING ELECTRON MICROSCOPY IMAGE SELECTION METHOD AND SEM EQUIPMENT ALIGNMENT METHOD USING THE SAME | Samsung Electronics Co., Ltd. | HANSEN, CONNOR LEVI | 2672 | Non-Final OA | Jan 19, 2024 |
| 18417810 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SARKAR, ASOK K | 2891 | Non-Final OA | Jan 19, 2024 |
| 18417089 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | HO, ANTHONY | 2817 | Non-Final OA | Jan 19, 2024 |
| 18416041 | MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY | Samsung Electronics Co., Ltd. | PATEL, DEVANG R | 1735 | Non-Final OA | Jan 18, 2024 |
| 18416151 | SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME | Samsung Electronics Co., Ltd. | BODNAR, JOHN A | 2893 | Non-Final OA | Jan 18, 2024 |
| 18414796 | NOISE FILTERING METHOD AND SCANNING ELECTRON MICROSCOPE (SEM) EQUIPMENT ALIGNMENT METHOD USING THE SAME | Samsung Electronics Co., Ltd. | LIN, JESSICA YIFANG | 2668 | Non-Final OA | Jan 17, 2024 |
| 18412778 | MAGNETIC MEMORY DEVICE | Samsung Electronics Co., Ltd. | NICELY, JOSEPH C | 2813 | Non-Final OA | Jan 15, 2024 |
| 18407789 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | WALLER, LATONYA RENEE | 2811 | Non-Final OA | Jan 09, 2024 |
| 18404198 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHOI, CALVIN Y | 2812 | Non-Final OA | Jan 04, 2024 |
| 18403259 | SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PROTECTIVE LAYER AND OUTER PROTECTIVE LAYER | Samsung Electronics Co., Ltd. | NGUYEN, DUY T V | 2818 | Non-Final OA | Jan 03, 2024 |
| 18399872 | STORAGE DEVICES THAT SUPPORT SUB-BLOCK RECLAIM OPERATIONS THEREIN UPON DETECTION OF UNCORRECTABLE ERRORS | Samsung Electronics Co., Ltd. | AGGER, ELIZABETH ROSE | 2824 | Final Rejection | Dec 29, 2023 |
| 18398336 | SEMICONDUCTOR MEMORY DEVICES | Samsung Electronics Co., Ltd. | LOPEZ, JORGE ANDRES | 2897 | Non-Final OA | Dec 28, 2023 |
| 18398370 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF | Samsung Electronics Co., Ltd. | MCCUTCHEON, COLIN RUSSELL | 2892 | Non-Final OA | Dec 28, 2023 |
| 18396813 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BRASFIELD, QUINTON A | 2814 | Non-Final OA | Dec 27, 2023 |
| 18393786 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Dec 22, 2023 |
| 18394524 | APPARATUS FOR CLEANING A SEMICONDUCTOR FABRICATION CHAMBER | Samsung Electronics Co., Ltd. | MARKMAN, MAKENA | 3723 | Non-Final OA | Dec 22, 2023 |
| 18394926 | SEMICONDUCTOR DEVICES HAVING ENHANCED KEY PATTERNS THEREIN AND METHODS OF FABRICATING SAME | Samsung Electronics Co., Ltd. | KHALIFA, MOATAZ | 2815 | Non-Final OA | Dec 22, 2023 |
| 18392481 | SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD | Samsung Electronics Co., Ltd. | GHYKA, ALEXANDER G | 2812 | Non-Final OA | Dec 21, 2023 |
| 18391759 | CEILING STORAGE SYSTEM | Samsung Electronics Co., Ltd. | ADAMS, GREGORY W | 3652 | Non-Final OA | Dec 21, 2023 |
| 18391993 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | WALL, VINCENT | 2898 | Non-Final OA | Dec 21, 2023 |
| 18390258 | VERTICAL TYPE MEMORY DEVICE | Samsung Electronics Co., Ltd. | YECHURI, SITARAMARAO S | 2893 | Non-Final OA | Dec 20, 2023 |
| 18544670 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | GREEN, TELLY D | 2898 | Non-Final OA | Dec 19, 2023 |
| 18545328 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | WRIGHT, TUCKER J | 2891 | Non-Final OA | Dec 19, 2023 |
| 18538260 | MEMORY DEVICE FOR BIASING DUMMY GLOBAL BITLINE | Samsung Electronics Co., Ltd. | TRAN, ANTHAN | 2825 | Final Rejection | Dec 13, 2023 |
| 18538631 | SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | Non-Final OA | Dec 13, 2023 |
| 18537013 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | WARD, DAVID WILLIAM | 2891 | Non-Final OA | Dec 12, 2023 |
| 18533899 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | TIVARUS, CRISTIAN ALEXANDRU | 2899 | Non-Final OA | Dec 08, 2023 |
| 18531883 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | SPALLA, DAVID C | 2893 | Non-Final OA | Dec 07, 2023 |
| 18530763 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SEHAR, FAKEHA | 2893 | Non-Final OA | Dec 06, 2023 |
| 18529365 | MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES | Samsung Electronics Co., Ltd. | BERMUDEZ LOZADA, ALFREDO | 2825 | Non-Final OA | Dec 05, 2023 |
| 18522352 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MOJADDEDI, OMAR F | 2898 | Non-Final OA | Nov 29, 2023 |
| 18519501 | WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME | Samsung Electronics Co., Ltd. | LEE, CHEUNG | 2812 | Non-Final OA | Nov 27, 2023 |
| 18517562 | IMAGE SENSORS HAVING HIGH DENSITY SUBPIXELS THEREIN WITH ENHANCED PIXEL SEPARATION STRUCTURES | Samsung Electronics Co., Ltd. | WHALEN, DANIEL B | 2893 | Non-Final OA | Nov 22, 2023 |
| 18515797 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | AU, BAC H | 2898 | Non-Final OA | Nov 21, 2023 |
| 18515334 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Samsung Electronics Co., Ltd. | CHANG, JAY C | 2817 | Non-Final OA | Nov 21, 2023 |
| 18515441 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PATEL, REEMA | 2812 | Non-Final OA | Nov 21, 2023 |
| 18513011 | SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | BRECHT, CHARLES MATTHEW | 2817 | Non-Final OA | Nov 17, 2023 |
| 18509925 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | NETTLES, CORALIE ANN | 2893 | Non-Final OA | Nov 15, 2023 |
| 18509493 | IMAGE SENSORS AND MANUFACTURING METHODS OF THE SAME | Samsung Electronics Co., Ltd. | CUNNINGHAM, KIERAN MURRAY | 2893 | Non-Final OA | Nov 15, 2023 |
| 18509104 | APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | GROSS, CARSON | 1746 | Non-Final OA | Nov 14, 2023 |
| 18507204 | SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | ALAM, MOHAMMED R | 2897 | Non-Final OA | Nov 13, 2023 |
| 18504981 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | CHAUDHARY, RUDRA BAHADUR | 2811 | Non-Final OA | Nov 08, 2023 |
| 18504226 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | GREEN, TELLY D | 2898 | Non-Final OA | Nov 08, 2023 |
| 18502702 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | NICELY, JOSEPH C | 2813 | Non-Final OA | Nov 06, 2023 |
| 18502715 | MAGNETIC MEMORY DEVICES | Samsung Electronics Co., Ltd. | KNUDSON, BRAD ALLAN | 2817 | Non-Final OA | Nov 06, 2023 |
| 18501120 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | BELL, LAUREN R | 2896 | Non-Final OA | Nov 03, 2023 |
| 18500797 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | FERNANDES, ERROL V | 2893 | Non-Final OA | Nov 02, 2023 |
| 18497039 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | HARRISTON, WILLIAM A | 2899 | Non-Final OA | Oct 30, 2023 |
| 18494792 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | SYLVIA, CHRISTINA A | 2817 | Non-Final OA | Oct 26, 2023 |
| 18493166 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | OJEH, NDUKA E | 2892 | Non-Final OA | Oct 24, 2023 |
| 18492946 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | LINDSEY, COLE LEON | 2812 | Non-Final OA | Oct 24, 2023 |
| 18493234 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURES AND METHODS FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | JANG, BO BIN | 2818 | Non-Final OA | Oct 24, 2023 |
| 18493041 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Oct 24, 2023 |
| 18492170 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LEBENTRITT, MICHAEL | 2893 | Non-Final OA | Oct 23, 2023 |
| 18491204 | IMAGE SENSORS | Samsung Electronics Co., Ltd. | BAIG, ANEESA RIAZ | 2814 | Non-Final OA | Oct 20, 2023 |
| 18489472 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF | Samsung Electronics Co., Ltd. | AHMED, MEHEK | 2812 | Non-Final OA | Oct 18, 2023 |
| 18489189 | SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | WARD, ERIC A | 2891 | Non-Final OA | Oct 18, 2023 |
| 18489493 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | Non-Final OA | Oct 18, 2023 |
| 18487644 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | RIRIE, EVERETT TRAJAN | 2897 | Non-Final OA | Oct 16, 2023 |
| 18486831 | SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | LOHAKARE, PRATIKSHA JAYANT | 2818 | Non-Final OA | Oct 13, 2023 |
| 18486853 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | SOWARD, IDA M | 2898 | Non-Final OA | Oct 13, 2023 |
| 18483543 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | REAMES, MATTHEW L | 2896 | Non-Final OA | Oct 10, 2023 |
| 18483331 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME, AND ELECTRONIC SYSTEMS INCLUDING SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | WOLDEGEORGIS, ERMIAS T | 2893 | Non-Final OA | Oct 09, 2023 |
| 18483312 | SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | HENRY, CALEB E | 2818 | Non-Final OA | Oct 09, 2023 |
| 18482154 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | HAN, JONATHAN | 2818 | Non-Final OA | Oct 06, 2023 |
| 18479591 | SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TYNES JR., LAWRENCE C | 2899 | Non-Final OA | Oct 02, 2023 |
| 18476688 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | SPALLA, DAVID C | 2893 | Non-Final OA | Sep 28, 2023 |
| 18476415 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | TRAN, DZUNG | 2893 | Non-Final OA | Sep 28, 2023 |
| 18475530 | PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES THAT PROVIDE INCREASED YIELD AND RELIABILITY | Samsung Electronics Co., Ltd. | YASMEEN, NISHATH | 2811 | Non-Final OA | Sep 27, 2023 |
| 18475290 | INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT | Samsung Electronics Co., Ltd. | TURNER, BRIAN | 2818 | Final Rejection | Sep 27, 2023 |
| 18471259 | TRANSMISSION ELECTRON MICROSCOPE IMAGE PROCESSING APPARATUS, FACILITY SYSTEM HAVING THE SAME, AND OPERATING METHOD THEREOF | Samsung Electronics Co., Ltd. | YANG, JIANXUN | 2662 | Non-Final OA | Sep 20, 2023 |
| 18469627 | INTEGRATED CIRCUIT INCLUDING STANDARD CELLS AND METHOD OF DESIGNING THE SAME | Samsung Electronics Co., Ltd. | PAGE, STEVEN MITCHELL CHR | 2812 | Non-Final OA | Sep 19, 2023 |
| 18468192 | MOLDING APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE AND MOLDING METHOD OF SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PENCE, JETHRO M | 1717 | Non-Final OA | Sep 15, 2023 |
| 18466289 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CHANG, JAY C | 2817 | Non-Final OA | Sep 13, 2023 |
| 18465405 | SEMICONDUCTOR DEVICES HAVING GATE ELECTRODES WITH RING-SHAPED SEGMENTS THEREIN | Samsung Electronics Co., Ltd. | CUNNINGHAM, KIERAN MURRAY | 2893 | Non-Final OA | Sep 12, 2023 |
| 18464348 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | Sep 11, 2023 |
| 18463550 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Sep 08, 2023 |
| 18462614 | SEMICONDUCTOR MEMORY DEVICE | Samsung Electronics Co., Ltd. | QUINTO, KEVIN V | 2893 | Non-Final OA | Sep 07, 2023 |
| 18462636 | APERTURE DRIVING MODULES, CAMERA MODULES INCLUDING THE SAME AND METHODS OF OPERATING THE APERTURE DRIVING MODULE | Samsung Electronics Co., Ltd. | TREHAN, AKSHAY | 2639 | Non-Final OA | Sep 07, 2023 |
| 18239319 | NEURAL NETWORK SYSTEMS WITH PROTECTION LOGIC AND OPERATION METHODS THEREOF | Samsung Electronics Co., Ltd. | TEKLE, DANIEL T | 2481 | Non-Final OA | Aug 29, 2023 |
| 18455943 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | Aug 25, 2023 |
| 18454105 | INTEGRATED CIRCUIT DEVICES AND METHODS OF FORMING THE SAME | Samsung Electronics Co., Ltd. | GARCES, NELSON Y | 2814 | Final Rejection | Aug 23, 2023 |
| 18454206 | SEMICONDUCTOR MEMORY DEVICE | Samsung Electronics Co., Ltd. | VU, HUNG K | 2897 | Non-Final OA | Aug 23, 2023 |
| 18454110 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Aug 23, 2023 |
| 18453026 | CHIP PROTECTION DEVICE | Samsung Electronics Co., Ltd. | WRIGHT, TUCKER J | 2891 | Non-Final OA | Aug 21, 2023 |
| 18450730 | IMAGE SENSOR WITH ENHANCED MULTI-SUBSTRATE STRUCTURES AND INTERCONNECTS | Samsung Electronics Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Aug 16, 2023 |
| 18448290 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | CHIN, EDWARD | 2893 | Non-Final OA | Aug 11, 2023 |
| 18447479 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME | Samsung Electronics Co., Ltd. | KENDALL, BENJAMIN R | 2896 | Non-Final OA | Aug 10, 2023 |
| 18446920 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | SEDOROOK, DAVID PAUL | 2812 | Final Rejection | Aug 09, 2023 |
| 18446844 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | JEAN BAPTISTE, WILNER | 2899 | Non-Final OA | Aug 09, 2023 |
| 18366355 | GUIDE PIN, SYSTEM FOR PRECISELY CONTROLLING SPECIMEN INCLUDING THE SAME, AND METHOD FOR OBSERVING SPECIMEN USING THE SAME | Samsung Electronics Co., Ltd. | TANDY, LAURA ELOISE | 2881 | Non-Final OA | Aug 07, 2023 |
| 18364521 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | SIPLING, KENNETH MARK | 2818 | Non-Final OA | Aug 03, 2023 |
| 18364434 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MENZ, LAURA MARY | 2813 | Non-Final OA | Aug 02, 2023 |
| 18360056 | SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | LIU, BENJAMIN T | 2893 | Non-Final OA | Jul 27, 2023 |
| 18359031 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | OH, JAEHWAN | 2899 | Non-Final OA | Jul 26, 2023 |
| 18358160 | LIQUID SUPPLY SYSTEM | Samsung Electronics Co., Ltd. | SHAO, PHILLIP Y | 1776 | Non-Final OA | Jul 25, 2023 |
| 18356682 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | SYLVIA, CHRISTINA A | 2817 | Non-Final OA | Jul 21, 2023 |
| 18356324 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | Non-Final OA | Jul 21, 2023 |
| 18356325 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Jul 21, 2023 |
| 18355450 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | VU, DAVID | 2818 | Non-Final OA | Jul 20, 2023 |
| 18354777 | FLIP CHIP SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | CLINTON, EVAN GARRETT | 2899 | Final Rejection | Jul 19, 2023 |
| 18354919 | VOLATILE MEMORY DEVICE INCLUDED IN MEMORY SYSTEM AND METHOD FOR EXTENDING LIFE EXPECTANCY THEREOF | Samsung Electronics Co., Ltd. | CYGIEL, GARY W | 2137 | Final Rejection | Jul 19, 2023 |
| 18354191 | LOAD PORT MODULE AND DRIVING METHOD THEREOF | Samsung Electronics Co., Ltd. | BROTHERS, LAURENCE RAPHAEL | 3655 | Non-Final OA | Jul 18, 2023 |
| 18352177 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | DOAN, THERESA T | 2814 | Non-Final OA | Jul 13, 2023 |
| 18350999 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | Jul 12, 2023 |
| 18345130 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | NIX, NORA TAYLOR | 2891 | Final Rejection | Jun 30, 2023 |
| 18342182 | SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CULLEN, PATRICK LAWRENCE | 2899 | Non-Final OA | Jun 27, 2023 |
| 18341066 | VERTICAL NON-VOLATILE MEMORY DEVICES AND METHODS FOR MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | RAMALLO, GUSTAVO G | 2812 | Non-Final OA | Jun 26, 2023 |
| 18340440 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | TURNER, BRIAN | 2818 | Non-Final OA | Jun 23, 2023 |
| 18340101 | SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | LEE, EUGENE | 2815 | Non-Final OA | Jun 23, 2023 |
| 18338471 | ELECTRONIC DEVICE AND METHOD OF TESTING ELECTRONIC DEVICE | Samsung Electronics Co., Ltd. | ALSHACK, OSMAN M | 2112 | Non-Final OA | Jun 21, 2023 |
| 18338037 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TIVARUS, CRISTIAN ALEXANDRU | 2899 | Final Rejection | Jun 20, 2023 |
| 18335336 | PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN | Samsung Electronics Co., Ltd. | MULERO FLORES, ERIC MANUEL | 2898 | Non-Final OA | Jun 15, 2023 |
| 18335186 | INTEGRATED CIRCUIT DEVICES | Samsung Electronics Co., Ltd. | PHAM, HOAI V | 2892 | Non-Final OA | Jun 15, 2023 |
| 18332876 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | CHIN, EDWARD | 2893 | Non-Final OA | Jun 12, 2023 |
| 18332238 | MULTI-WAVELENGTH SELECTION METHOD FOR OVERLAY MEASUREMENT, AND OVERLAY MEASUREMENT METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING MULTI-WAVELENGTHS | Samsung Electronics Co., Ltd. | PARK, HYUN D | 2857 | Non-Final OA | Jun 09, 2023 |
| 18331296 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | Jun 08, 2023 |
| 18331397 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | RAMALLO, GUSTAVO G | 2812 | Non-Final OA | Jun 08, 2023 |
| 18206139 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | YUSHINA, GALINA G | 2811 | Non-Final OA | Jun 06, 2023 |
| 18328395 | METHOD OF MANUFACTURING PHOTOMASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | FRASER, STEWART A | 1724 | Non-Final OA | Jun 02, 2023 |
| 18328298 | CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | REYES, JOSHUA NATHANIEL PI | 1718 | Non-Final OA | Jun 02, 2023 |
| 18326145 | INTEGRATED CIRCUIT DEVICE | Samsung Electronics Co., Ltd. | ANDERSON, WILLIAM H | 2817 | Non-Final OA | May 31, 2023 |
| 18321164 | APPARATUS FOR HEATING WAFER | Samsung Electronics Co., Ltd. | FISHER, WESLEY LE | 3745 | Non-Final OA | May 22, 2023 |
| 18320456 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | CHANG, JAY C | 2817 | Non-Final OA | May 19, 2023 |
| 18320513 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | GREEN, TELLY D | 2898 | Non-Final OA | May 19, 2023 |
| 18319135 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PHAM, LONG | 2897 | Non-Final OA | May 17, 2023 |
| 18317387 | SEMICONDUCTOR MEASUREMENT APPARATUS | Samsung Electronics Co., Ltd. | TABA, MONICA TERESA | 2878 | Final Rejection | May 15, 2023 |
| 18316682 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | MENZ, DOUGLAS M | 2897 | Final Rejection | May 12, 2023 |
| 18315689 | HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES | Samsung Electronics Co., Ltd. | JEAN BAPTISTE, WILNER | 2899 | Non-Final OA | May 11, 2023 |
| 18312191 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | May 04, 2023 |
| 18311289 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | MENZ, LAURA MARY | 2813 | Non-Final OA | May 03, 2023 |
| 18140905 | INTEGRATED CIRCUIT DEVICES | Samsung Electronics Co., Ltd. | NGUYEN, CUONG B | 2818 | Non-Final OA | Apr 28, 2023 |
| 18309113 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Apr 28, 2023 |
| 18308222 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | NGUYEN, CUONG B | 2818 | Non-Final OA | Apr 27, 2023 |
| 18308401 | MAGNETIC MEMORY DEVICES | Samsung Electronics Co., Ltd. | GHYKA, ALEXANDER G | 2812 | Non-Final OA | Apr 27, 2023 |
| 18303607 | INTEGRATED CIRCUIT INCLUDING MULTI-HEIGHT CELLS AND METHOD OF DESIGNING THE SAME | Samsung Electronics Co., Ltd. | KAO, SOPHIA WEI-CHUN | 2817 | Non-Final OA | Apr 20, 2023 |
| 18302832 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | MUSE, ISMAIL A | 2812 | Final Rejection | Apr 19, 2023 |
| 18301403 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | PARKER, JOHN M | 2899 | Non-Final OA | Apr 17, 2023 |
| 18299795 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PHAM, LONG | 2897 | Non-Final OA | Apr 13, 2023 |
| 18299117 | IMAGE SENSORS HAVING GRATING STRUCTURES THEREIN THAT PROVIDE ENHANCED DIFFRACTION OF INCIDENT LIGHT | Samsung Electronics Co., Ltd. | GREWAL, HEIM KIRIN | 2812 | Non-Final OA | Apr 12, 2023 |
| 18131436 | OPTICAL PROXIMITY CORRECTION METHOD USING NEURAL JACOBIAN MATRIX AND METHOD OF MANUFACTURING MASK BY USING THE OPTICAL PROXIMITY CORRECTION METHOD | Samsung Electronics Co., Ltd. | ALAM, MOHAMMED | 2851 | Non-Final OA | Apr 06, 2023 |
| 18296511 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | TURNER, BRIAN | 2818 | Final Rejection | Apr 06, 2023 |
| 18295867 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | KOO, LAMONT B | 2813 | Non-Final OA | Apr 05, 2023 |
| 18191212 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | TYNES JR., LAWRENCE C | 2899 | Final Rejection | Mar 28, 2023 |
| 18188627 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | PHAM, LONG | 2897 | Non-Final OA | Mar 23, 2023 |
| 18185526 | PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES | Samsung Electronics Co., Ltd. | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Mar 17, 2023 |
| 18120038 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | RONO, VINCENT KIPKEMOI | 2891 | Non-Final OA | Mar 10, 2023 |
| 18171433 | METHOD OF TRAINING BINARIZED NEURAL NETWORK WITH PARAMETERIZED WEIGHT CLIPPING AND MEMORY DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | BOSTWICK, SIDNEY VINCENT | 2124 | Final Rejection | Feb 20, 2023 |
| 18110950 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | RONO, VINCENT KIPKEMOI | 2891 | Non-Final OA | Feb 17, 2023 |
| 18169721 | SEMICONDUCTOR DEVICE HAVING LOW-BANDGAP INTERFACIAL LAYER IN THE CAPACITOR | Samsung Electronics Co., Ltd. | PAGE, STEVEN MITCHELL CHR | 2812 | Non-Final OA | Feb 15, 2023 |
| 18109296 | SEMICONDUCTOR DEVICE | Samsung Electronics Co., Ltd. | OZDEN, ILKER NMN | 2812 | Non-Final OA | Feb 14, 2023 |
| 18163573 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Samsung Electronics Co., Ltd. | XU, ZHIJUN | 2818 | Non-Final OA | Feb 02, 2023 |
| 18160297 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Samsung Electronics Co., Ltd. | LEE, DA WEI | 2817 | Non-Final OA | Jan 26, 2023 |
| 18095576 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Samsung Electronics Co., Ltd. | LEE, WOO KYUNG | 2815 | Final Rejection | Jan 11, 2023 |
| 18152211 | SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | SALERNO, SARAH KATE | 2814 | Non-Final OA | Jan 10, 2023 |
| 18149709 | NONVOLATILE MEMORY DEVICES, METHODS OF MANUFACTURING NONVOLATILE MEMORY DEVICE, AND ELECTRONIC SYSTEMS INCLUDING NONVOLATILE MEMORY DEVICE | Samsung Electronics Co., Ltd. | GOODWIN, DAVID J | 2817 | Non-Final OA | Jan 04, 2023 |
| 18149749 | CELL LIBRARIES, COMPUTING SYSTEMS, AND METHODS FOR DESIGNING AN INTEGRATED CIRCUIT | Samsung Electronics Co., Ltd. | MEMULA, SURESH | 2851 | Non-Final OA | Jan 04, 2023 |
| 18065531 | IMAGE SENSOR INCLUDING STACKED CHIPS | Samsung Electronics Co., Ltd. | PATERSON, BRIGITTE A | 2896 | Non-Final OA | Dec 13, 2022 |
| 18052252 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Samsung Electronics Co., Ltd. | SUN, YU-HSI DAVID | 2817 | Final Rejection | Nov 03, 2022 |
| 18048205 | METHOD OF CORRECTING A DESIGN LAYOUT OF A SEMICONDUCTOR DEVICE, A COMPUTING DEVICE PERFORMING THE SAME AND A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | ALAWDI, ANWER AHMED | 2851 | Final Rejection | Oct 20, 2022 |
| 17936473 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | CHIU, TSZ K | 2898 | Non-Final OA | Sep 29, 2022 |
| 17930820 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Samsung Electronics Co., Ltd. | MUNOZ, ANDRES F | 2818 | Non-Final OA | Sep 09, 2022 |
| 17821763 | STATIC CMOS-BASED FULL ADDER CIRCUITS | Samsung Electronics Co., Ltd. | YAARY, MICHAEL D | 2151 | Non-Final OA | Aug 23, 2022 |
| 17884695 | SEMICONDUCTOR PACKAGE | Samsung Electronics Co., Ltd. | WEGNER, AARON MICHAEL | 2897 | Final Rejection | Aug 10, 2022 |
| 17868126 | SEMICONDUCTOR DEVICES | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | Non-Final OA | Jul 19, 2022 |
| 17828170 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND METHODS OF FABRICATING THE DEVICES | Samsung Electronics Co., Ltd. | SWANSON, WALTER H | 2815 | Non-Final OA | May 31, 2022 |
| 17731615 | SEMICONDUCTOR DEVICES HAVING STRESSED ACTIVE REGIONS THEREIN THAT SUPPORT ENHANCED CARRIER MOBILITY | Samsung Electronics Co., Ltd. | LI, MEIYA | 2811 | Final Rejection | Apr 28, 2022 |
| 17689558 | IMAGE SENSOR | Samsung Electronics Co., Ltd. | AUTORE JR, MARIO ANDRES | 2897 | Non-Final OA | Mar 08, 2022 |
| 17405138 | PHOTORESIST COMPOSITIONS, METHODS FOR FORMING PATTERN USING THE SAME, AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Samsung Electronics Co., Ltd. | CHU, JOHN S Y | 1737 | Final Rejection | Aug 18, 2021 |
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