Prosecution Insights
Prosecution Insights
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| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19290528 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | SAAD, ERIN BARRY | 1735 | §103§112 | Non-Final OA | — | Pending | Aug 05, 2025 |
| 19286970 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | RAMIREZ, ALEXANDRE XAVIER | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jul 31, 2025 |
| 19283746 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | — | Pending | Jul 29, 2025 |
| 19269489 | LATCH CIRCUITS AND METHODS FOR OPERATING THE SAME | O NEILL, PATRICK | — | §112 | Non-Final OA | — | Pending | Jul 15, 2025 |
| 19259508 | FLIP-FLOP CIRCUIT AND METHOD | O NEILL, PATRICK | 2836 | DP | Non-Final OA | — | Pending | Jul 03, 2025 |
| 19254164 | IMPEDANCE MATCHING CIRCUIT AND METHOD | CHEN, PATRICK C | 2836 | §102DP | Non-Final OA | — | Pending | Jun 30, 2025 |
| 19255872 | INTEGRATED CIRCUIT HAVING LATCH WITH TRANSISTORS OF DIFFERENT GATE WIDTHS | O NEILL, PATRICK | 2836 | §102§112DP | Non-Final OA | — | Pending | Jun 30, 2025 |
| 19255856 | WAFER PROCESSING METHOD | RODRIGUEZ, MICHAEL P | 1715 | §102§103§112DP | Non-Final OA | — | Pending | Jun 30, 2025 |
| 19252149 | IMAGE SENSOR PIXEL AND METAL SHIELDING OF CHARGE STORAGE DEVICE OF IMAGE SENSOR PIXEL FORMED BY ONE STEP PROCESS | HALIYUR, PADMA | 2637 | §103Other | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19252413 | GATED TRI-STATE INVERTER, AND METHOD OF OPERATING SAME | JAGER, RYAN C | 2842 | §112DP | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19253186 | DATA SEQUENCING CIRCUIT | VERBRUGGE, KEVIN | 2132 | Other | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19251693 | TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS | O NEILL, PATRICK | 2842 | §102DP | Non-Final OA | — | Pending | Jun 26, 2025 |
| 19247229 | SEMICONDUCTOR DEVICE INCLUDING DECOUPLING SYSTEM | RETEBO, METASEBIA T | 2842 | DP | Non-Final OA | — | Pending | Jun 24, 2025 |
| 19245452 | ELECTRONIC CIRCUIT AND METHOD FOR OPERATING THE SAME | PEREZ, JAMES M | 2631 | §112DP | Non-Final OA | — | Pending | Jun 23, 2025 |
| 19243074 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | TAN, DAVE | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19241406 | SHIFT REGISTER HAVING LOW POWER MODE | O NEILL, PATRICK | 2836 | §102§112DP | Non-Final OA | — | Pending | Jun 18, 2025 |
| 19241088 | SEMICONDUCTOR DEVICE HAVING HYSTERESIS BLOCK | WELLS, KENNETH B | 2836 | §102§103§112DP | Non-Final OA | — | Pending | Jun 17, 2025 |
| 19237327 | METHOD FOR PROCESSING SEMICONDUCTOR WAFER | ROSTAMI, MOHAMMAD S | 2154 | §103Other | Final Rejection | — | Pending | Jun 13, 2025 |
| 19235541 | METHOD OF FORMING PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER | GOLDEN, ANDREW J | 1726 | §103 | Final Rejection | — | Pending | Jun 11, 2025 |
| 19214788 | Pulse Width Control Apparatus and Method | JAGER, RYAN C | — | §102§103Other | Non-Final OA | — | Pending | May 21, 2025 |
| 19211749 | CHEMICAL DISPENSING SYSTEM | GARDNER, NICOLE | 3753 | §102§112Other | Non-Final OA | — | Pending | May 19, 2025 |
| 19206002 | DE-TAPE TOOL | CAILLOUET, CHRISTOPHER C | 1745 | §102DP | Non-Final OA | — | Pending | May 12, 2025 |
| 19200973 | SYSTEM AND SEMICONDUCTOR DEVICE THEREIN | JAGER, RYAN C | 2842 | §102DP | Non-Final OA | — | Pending | May 07, 2025 |
| 19197279 | Level Shifter With Inside Self-Protection High Bias Generator | RETEBO, METASEBIA T | 2836 | §102§103 | Non-Final OA | — | Pending | May 02, 2025 |
| 19194045 | MEMORY DEVICE, READ CLOCK GENERATION CIRCUIT, AND METHOD FOR CONTROLLING READ OPERATION IN MEMORY DEVICE | HIDALGO, FERNANDO N | 2827 | DP | Non-Final OA | — | Pending | Apr 30, 2025 |
| 19176227 | AMMONIUM FLUORIDE PRE-CLEAN PROTECTION | LE, TUNG X | 2845 | Other | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19176327 | Device and Method for Diagnosis of the Same | BRADEN, GRACE VICTORIA | 2112 | §103 | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19176354 | Overdrive I/O ESD Protection Network | WELLS, KENNETH B | 2842 | §103§112 | Final Rejection | — | Pending | Apr 11, 2025 |
| 19171607 | ION EXPOSURE METHOD AND APPARATUS | ASFAW, MESFIN T | 2882 | §102§103 | Non-Final OA | — | Pending | Apr 07, 2025 |
| 19169567 | EUV WAFER DEFECT IMPROVEMENT AND METHOD OF COLLECTING NONCONDUCTIVE PARTICLES | WHITESELL, STEVEN H | — | Other | Non-Final OA | — | Pending | Apr 03, 2025 |
| 19089163 | Bio-Detector Device for Bio-Targets | BALL, JOHN C | 1795 | DP | Non-Final OA | — | Pending | Mar 25, 2025 |
| 19088255 | REDUCE MASK DEFECT IMPACT BY CONTAMINATION DECOMPOSE | WHITESELL, STEVEN H | 1759 | §102§103Other | Non-Final OA | — | Pending | Mar 24, 2025 |
| 19084896 | LITHOGRAPHY APPARATUS AND METHOD FOR OPERATING THE SAME | ASFAW, MESFIN T | 2882 | §102§103 | Non-Final OA | — | Pending | Mar 20, 2025 |
| 19084239 | WIDTH ADJUSTMENT OF EUV RADIATION BEAM | PERSAUD, DEORAM | 2882 | §102§103Other | Non-Final OA | — | Pending | Mar 19, 2025 |
| 19075364 | LOW-DROPOUT (LDO) REGULATOR WITH A FEEDBACK CIRCUIT | GBLENDE, JEFFREY A | 2838 | DP | Non-Final OA | — | Pending | Mar 10, 2025 |
| 19070730 | Sub-Word Line Driver Placement For Memory Device | YANG, HAN | 2824 | §102 | Non-Final OA | — | Pending | Mar 05, 2025 |
| 19069350 | Programmable Regulator Voltage Controlled Ring Oscillator | GANNON, LEVI | 2849 | §102Other | Non-Final OA | 14d | Pending | Mar 04, 2025 |
| 19068296 | METHOD OF USING WAFER STAGE | NGUYEN, HUNG | 2882 | §103DP | Non-Final OA | — | Pending | Mar 03, 2025 |
| 19069048 | ONE TIME PROGRAMMABLE MEMORY | CHEN, XIAOCHUN L | 2824 | §103§112DP | Non-Final OA | — | Pending | Mar 03, 2025 |
| 19064089 | LOW-DROPOUT (LDO) VOLTAGE REGULATOR | QUDDUS, NUSRAT | 2838 | §103Other | Non-Final OA | — | Pending | Feb 26, 2025 |
| 19064203 | MEMORY DEVICES WITH IMPROVED BIT LINE LOADING | SIDDIQUE, MUSHFIQUE | 2825 | §102§103 | Non-Final OA | — | Pending | Feb 26, 2025 |
| 19064599 | LOW DROPOUT REGULATOR CIRCUITS, INPUT/OUTPUT DEVICE, AND METHODS FOR OPERATING A LOW DROPOUT REGULATOR | TIKU, SISAY G | 2838 | §103 | Non-Final OA | — | Pending | Feb 26, 2025 |
| 19061365 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | HOANG, HUAN | — | Other | Non-Final OA | — | Pending | Feb 24, 2025 |
| 19059384 | MEMORY DEVICE WITH ADDITIONAL WRITE BIT LINES | CHO, SUNG IL | 2825 | §102§103Other | Non-Final OA | — | Pending | Feb 21, 2025 |
| 19056851 | MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT | MCCLAIN, GERALD | 3652 | §102DP | Non-Final OA | — | Pending | Feb 19, 2025 |
| 19055872 | MERGED BIT LINES FOR HIGH DENSITY MEMORY ARRAY | TECHANE, MUNA A | 2827 | §102§103 | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19056022 | CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH | GAMBETTA, KELLY M | 1718 | §102§103§112 | Final Rejection | — | Pending | Feb 18, 2025 |
| 19056350 | INTEGRATED CIRCUIT AND METHOD OF OPERATING SAME | ALHWAMDEH, KAREEM FUAD | 2112 | §103 | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19055771 | BUFFER CONTROL OF MULTIPLE MEMORY BANKS | HIDALGO, FERNANDO N | 2827 | §112DP | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19052420 | Device and Method for Measuring a Duty Cycle of a Clock Signal | MAINI, RAHUL | 2858 | §103§112Other | Non-Final OA | — | Pending | Feb 13, 2025 |
| 19050140 | CAPACITOR-LESS LOW-DROPOUT REGULATOR WITH DYNAMIC FREQUENCY COMPENSATION | PEREZ, BRYAN REYNALDO | 2838 | §102 | Non-Final OA | — | Pending | Feb 11, 2025 |
| 19049935 | Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit | JEAN PIERRE, PEGUY | 2845 | DP | Non-Final OA | — | Pending | Feb 10, 2025 |
| 19047669 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SECK, AHMED F | 2834 | §103 | Non-Final OA | — | Pending | Feb 07, 2025 |
| 19047179 | LOW NOISE RING OSCILLATOR DEVICES AND METHODS | SHIN, JEFFREY M | 2836 | Other | Final Rejection | 30d overdue | Pending | Feb 06, 2025 |
| 19045904 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | CHOI, WOO H | 3992 | §102§112 | Non-Final OA | — | Pending | Feb 05, 2025 |
| 19044697 | Circuit for Outputting a Stepdown Voltage and Method for Stepping Down a Voltage | JACKSON, LAKAISHA | 2838 | §103Other | Non-Final OA | — | Pending | Feb 04, 2025 |
| 19043906 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | HIDALGO, FERNANDO N | 2827 | DP | Non-Final OA | — | Pending | Feb 03, 2025 |
| 19038298 | Novel Bank Design with Differential Bulk Bias in eFuse Array | BUI, THA-O H | 2825 | §103 | Non-Final OA | — | Pending | Jan 27, 2025 |
| 19038311 | MEMORY DEVICE WITH SOURCE LINE CONTROL | HOANG, HUAN | 2827 | §102§103Other | Non-Final OA | — | Pending | Jan 27, 2025 |
| 19038241 | NOVEL DYNAMIC INHIBIT VOLTAGE TO REDUCE WRITE POWER FOR RANDOM-ACCESS MEMORY | ALROBAIE, KHAMDAN N | 2824 | §102 | Non-Final OA | — | Pending | Jan 27, 2025 |
| 19035772 | INTEGRATED CIRCUIT | TANG, ANTHONY THINH | 2827 | §103 | Non-Final OA | — | Pending | Jan 23, 2025 |
| 19032570 | SYSTEM AND METHOD FOR DYNAMICALLY CONTROLLING TEMPERATURE OF THERMOSTATIC RETICLES | RIDDLE, CHRISTINA A | 2882 | Other | Final Rejection | — | Pending | Jan 21, 2025 |
| 19032136 | METHOD FOR INSPECTING SEMICONDUCTOR DEVICE AND SYSTEM THEREOF | KIDWELL, KAITLYN ELIZABETH | 2877 | §103 | Non-Final OA | — | Pending | Jan 20, 2025 |
| 19030111 | PHYSICAL UNCLONABLE FUNCTION (PUF) SECURITY KEY GENERATION | SAADOUN, HASSAN | 2435 | Other | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19026389 | MEMORY DEVICES AND METHODS OF FORMING THE SAME | LEBOEUF, JEROME LARRY | 2824 | §102§103§112 | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19025060 | EUV LIGHT SOURCE CONTAMINATION MONITORING SYSTEM | KIM, PETER B | 2882 | §103Other | Non-Final OA | — | Pending | Jan 16, 2025 |
| 19021205 | MEMORY DEVICE, MEMORY CELL READ CIRCUIT, AND CONTROL METHOD FOR MISMATCH COMPENSATION | RADKE, JAY W | 2827 | §112DP | Non-Final OA | — | Pending | Jan 15, 2025 |
| 19020305 | MEMORY DEVICE AND METHOD FOR OPERATING THE SAME | HUANG, MIN | 2827 | §103Other | Non-Final OA | — | Pending | Jan 14, 2025 |
| 19015027 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | NGUYEN, HUNG | 2882 | §112DP | Non-Final OA | — | Pending | Jan 09, 2025 |
| 19012272 | SEMICONDUCTOR DEVICE INCLUDING I/O SYSTEM, AND METHOD OF OPERATING THE SAME | WELLS, KENNETH B | 2842 | DP | Final Rejection | — | Pending | Jan 07, 2025 |
| 19012199 | MEMORY ARRAY CONNECTIONS | LAPPAS, JASON | 2827 | §103 | Non-Final OA | — | Pending | Jan 07, 2025 |
| 19011147 | SRAM POWER-UP RANDOM NUMBER GENERATOR | REECE, CHRISTOPHER LANE | 2824 | §103Other | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19011055 | MEMORY DEVICE WITH A BIAS CIRCUIT | CHO, SUNG IL | 2825 | DP | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19007022 | CHARGE PUMP SYSTEM WITH LOW RIPPLE OUTPUT VOLTAGE | LEBOEUF, JEROME LARRY | 2824 | DP | Non-Final OA | — | Pending | Dec 31, 2024 |
| 19004992 | IMPRINT APPARATUS AND METHOD THEREOF | KIM, YUNJU | 1742 | §103 | Non-Final OA | — | Pending | Dec 30, 2024 |
| 19002035 | FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT | KIM, PETER B | 2882 | §112DP | Non-Final OA | — | Pending | Dec 26, 2024 |
| 18999478 | COMPUTE-IN-MEMORY SYSTEMS AND METHODS FOR OPERATING THE SAME | LUU, PHO M | 2824 | §102 | Non-Final OA | — | Pending | Dec 23, 2024 |
| 18990122 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | TRAN, MICHAEL THANH | 2827 | §102§112Other | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18982288 | CORRECTING DISRUPTION OF A NETWORK DURING A VIRTUAL MEETING | CELANI, NICHOLAS P | 2449 | §103§112Other | Final Rejection | — | Pending | Dec 16, 2024 |
| 18981800 | MEMORY CELL WITH UNIPOLAR SELECTORS | LAPPAS, JASON | 2827 | §103 | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18974840 | SEMICONDUCTOR MANUFACTURING METHOD | TRAN, BINH X | 1713 | §112DP | Non-Final OA | — | Pending | Dec 10, 2024 |
| 18973767 | NON-VOLATILE MEMORY CIRCUIT AND METHOD | HOANG, HUAN | 2827 | DP | Non-Final OA | — | Pending | Dec 09, 2024 |
| 18974300 | SENSE AMPLIFIER | HO, HOAI V | — | Other | Non-Final OA | — | Pending | Dec 09, 2024 |
| 18970786 | MULTIPLEXING CIRCUIT, OUTPUT STAGE, AND SEMICONDUCTOR DEVICE | RETEBO, METASEBIA T | 2842 | §103§112 | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18969335 | NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS | GRAY, SUNGHEE Y | 2877 | DP | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18968729 | MEMORY CELL ARRAY CIRCUIT AND METHOD OF FORMING THE SAME | ALROBAIE, KHAMDAN N | 2824 | DP | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18968343 | RETICLE CARRIER AND ASSOCIATED METHODS | KIM, PETER B | 2882 | §103§112Other | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18962220 | METHOD FOR INSPECTING PATTERN DEFECTS | TON, TRI T | 2877 | DP | Non-Final OA | — | Pending | Nov 27, 2024 |
| 18959723 | WET PROCESS SYSTEM AND PROCESS FOR USING THE SAME | AYALEW, TINSAE B | 1711 | §102§103§112 | Final Rejection | — | Pending | Nov 26, 2024 |
| 18955387 | MIM EFUSE MEMORY DEVICES AND FABRICATION METHOD THEREOF | HO, HOAI V | 2827 | §102§103 | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18953096 | CHIP PROBING APPARATUS, CHIP PROBING METHOD AND SHIFT DETECTION PATTERN | POTHEN, FEBA | 2858 | §102§103§112 | Non-Final OA | — | Pending | Nov 20, 2024 |
| 18952719 | MULTIPLE LAYER DUAL PORT MEMORY CELL MANUFACTURING METHOD | LEBOEUF, JEROME LARRY | 2824 | §102 | Non-Final OA | — | Pending | Nov 19, 2024 |
| 18948565 | MEMORY DEVICE HAVING BITLINE SEGMENTED INTO BITLINE SEGMENTS AND RELATED METHOD FOR OPERATING MEMORY DEVICE | REECE, CHRISTOPHER LANE | 2824 | §103§112 | Non-Final OA | — | Pending | Nov 15, 2024 |
| 18949192 | Systems and Methods for Generating Synthesizable Netlists From Register Transfer Level Designs | LIN, ARIC | 2851 | §103Other | Non-Final OA | — | Pending | Nov 15, 2024 |
| 18946996 | PROBE HEAD ASSEMBLY AND PROBE CARD ASSEMBLY | HOLLINGTON, JERMELE M | 2858 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18948432 | PROBE NEEDLE, PROBE CARD STRUCTURE AND METHOD OF TESTING A DEVICE UNDER TEST | MILLER, DANIEL R | 2858 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18947475 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | WELLS, JAMES STEVEN | 2825 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18948078 | ONE TIME PROGRAMMABLE (OTP) MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) | TANG, ANTHONY THINH | 2827 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18947761 | NEW DESIGN OF EUV VESSEL PERIMETER FLOW AUTO ADJUSTMENT | ASFAW, MESFIN T | 2882 | §103 | Final Rejection | — | Pending | Nov 14, 2024 |
| 18945457 | TESTING APPARATUS AND ITS CONDUCTIVE TERMINAL | NGUYEN, TUNG X | 2858 | §102 | Non-Final OA | — | Pending | Nov 12, 2024 |
| 18943158 | FITTINGS FOR WAFER CLEANING SYSTEMS | DUNWOODY, AARON M | 3679 | DP | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18943712 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HARRISON, MONICA D | 2815 | Other | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18940456 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | BENNETT, CHARLEE | 1718 | §102§103§112 | Non-Final OA | — | Pending | Nov 07, 2024 |
| 18938961 | MEMORY DEVICE WITH WRITE PULSE TRIMMING | ALROBAIE, KHAMDAN N | 2824 | §102§103Other | Non-Final OA | — | Pending | Nov 06, 2024 |
| 18937037 | SENSE AMPLIFIER, MEMORY DEVICE AND OPERATION METHOD THEREOF | TRAN, ANTHAN | 2825 | §102Other | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18937208 | Systems and Methods for Controlling Power Management Operations in a Memory Device | HO, HOAI V | 2827 | §102§103 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18931576 | METHODS AND SYSTEMS FOR REDUCING PARTICULATE DEPOSITION ON PHOTOMASK | NGUYEN, HUNG | 2882 | §103 | Final Rejection | — | Pending | Oct 30, 2024 |
| 18921069 | FeRAM MFM STRUCTURE WITH SELECTIVE ELECTRODE ETCH | WARD, ERIC A | — | §103 | Non-Final OA | — | Pending | Oct 21, 2024 |
| 18917587 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SEMICONDUCTOR DEVICE STRUCTURE | SPALLA, DAVID C | 2893 | §102DP | Non-Final OA | — | Pending | Oct 16, 2024 |
| 18895432 | IMAGE ENCRYPTION CIRCUIT AND METHOD FOR OPERATING THE SAME | TRUONG, LAWRENCE QUANG | 2434 | §112 | Non-Final OA | — | Pending | Sep 25, 2024 |
| 18893799 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | CRAVER, CHARLES R | 3992 | §102§103 | Non-Final OA | — | Pending | Sep 23, 2024 |
| 18891129 | CLEANING APPARATUS AND METHOD FOR CLEANING ITEMS USED IN SEMICONDUCTOR FABRICATION | CARRILLO, BIBI SHARIDAN | 1711 | §103§112 | Final Rejection | — | Pending | Sep 20, 2024 |
| 18889962 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | ERDEM, FAZLI | 2812 | §102 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18889003 | PHOTOLITHOGRAPHY APPARATUS AND METHOD OF OPERATING THE SAME | PERSAUD, DEORAM | 2882 | §102§103 | Final Rejection | 71d | Pending | Sep 18, 2024 |
| 18808284 | APPARATUS AND METHOD FOR OPTICAL INSPECTION OF EUV PELLICLES | KIM, PETER B | 2882 | §103 | Final Rejection | — | Pending | Aug 19, 2024 |
| 18807429 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | RAYAN, MIHIR K | 2622 | §102 | Non-Final OA | — | Pending | Aug 16, 2024 |
| 18802241 | SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION | JORDAN, ANDREW | 2874 | §102§103 | Non-Final OA | — | Pending | Aug 13, 2024 |
| 18798980 | MEMORY DEVICES WITH VIA STRUCTRUES AND METHODS OF MANUFACTURING THEREOF | SHAMSUZZAMAN, MOHAMMED | — | §103§112 | Non-Final OA | — | Pending | Aug 09, 2024 |
| 18794560 | MEMORY DEVICES WITH REDUCED TIMING VARIATION AND METHODS FOR OPERATING THE SAME | HILTUNEN, THOMAS J | 2836 | §102§112 | Non-Final OA | 8d | Pending | Aug 05, 2024 |
| 18795067 | INSPECTION APPARATUS AND METHODS OF USING THE SAME | WONG, ALLEN C | 2488 | §103 | Non-Final OA | 9d | Pending | Aug 05, 2024 |
| 18789686 | METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL | BOOKER, KELVIN | 2119 | §101§102§103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791308 | MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE | RAMALLO, GUSTAVO G | 2812 | §112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791384 | METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790025 | Integrated Reference Electrode And Fluid Dispenser | FISHER, BRITTANY I | 1796 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790264 | GATE-ALL-AROUND STRUCTURES AND MANUFACTURING METHOD THEREOF | RAHMAN, MOHAMMAD A | 2898 | §112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790492 | SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA SURROUNDINGS | SHAH, NEEL D | 2858 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789988 | METHOD OF MAKING SEMICONDUCTOR DEVICE | HAN, JONATHAN | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791421 | IN-CHIP THERMOELECTRIC DEVICE | MOWLA, GOLAM | 1721 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790831 | Fin-Based Field Effect Transistors | FAN, SU JYA | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791279 | INTEGRATED CIRCUIT HAVING STACKED PICK-UP REGIONS | DINKE, BITEW A | 2812 | §103Other | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18788409 | SEMICONDUCTOR DEVICES WITH THRESHOLD VOLTAGE MODULATION LAYER | HUNTER III, CARNELL | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788134 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | GREEN, TELLY D | — | §103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789172 | SEMICONDUCTOR DEVICE STRUCTURE WITH HYBRID FINS | YEMELYANOV, DMITRIY | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788413 | TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788979 | LOW-RESISTANCE COPPER INTERCONNECTS | LUKE, DANIEL M | 2896 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788741 | Radical Treatment in Supercritical Fluid for Gate Dielectric Quality Improvement to CFET Structure | LI, MEIYA | — | §112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788538 | PHASE CHANGE RANDOM ACCESS MEMORY (PCRAM) DEVICE WITH INCREASED PACKING DENSITY AND METHOD OF MAKING SAME | OH, JIYOUNG | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789164 | METAL FUSE STRUCTURE BY VIA LANDING | HATFIELD, MARSHALL MU-NUO | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788787 | METHOD OF MEASURING ELECTRO-OPTIC CHARACTERISTIC OF A TRAVELING WAVE MACH-ZEHNDER MODULATOR AND DEVICE FOR SAME | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789530 | CONTACT METALLIZATION PROCESS | MALEK, MALIHEH | 2813 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788380 | CONTROL OF DYNAMIC GAS LOCK FLOW INLETS OF AN INTERMEDIATE FOCUS CAP | CHANG, HANWAY | 2878 | §102§103Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789619 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789206 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | KHALIFA, MOATAZ | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788823 | SEMICONDUCTOR DEVICE HAVING WIDE TUNING RANGE VARACTOR AND METHOD OF MANUFACTURING THE SAME | SLUTSKER, JULIA | 2891 | §102§103Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789086 | METHOD FOR FORMING SEMICONDUCTOR DEVICE | KNUDSON, BRAD ALLAN | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789104 | SEMICONDUCTOR STRUCTURE WITH ISOLATION FEATURE | LEE, WOO KYUNG | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789514 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | ASSOUMAN, HERVE-LOUIS Y | — | Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788783 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME | SANDVIK, BENJAMIN P | 2812 | §102Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789569 | SEMICONDUCTOR DEVICES HAVING PARASITIC CHANNEL STRUCTURES | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | — | Pending | Jul 30, 2024 |
| 18788671 | Grounded Metal Ring Structure For Through-Silicon Via | GUMEDZOE, PENIEL M | 2899 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788450 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789652 | MEMORY ARRAY CIRCUITS, MEMORY STRUCTURES, AND METHODS FOR FABRICATING A MEMORY ARRAY CIRCUIT | HOANG, HUAN | 2154 | DP | Final Rejection | 42d overdue | AI Ready | Jul 30, 2024 |
| 18788414 | SEMICONDUCTOR STRUCTURE HAVING EPITAXIAL STRUCTURE | SANDVIK, BENJAMIN P | 2812 | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788145 | MAKEUP AIR HANDLING UNIT IN SEMICONDUCTOR FABRICATION BUILDING AND METHOD FOR CLEANING AIR USING THE SAME | LAWRENCE JR, FRANK M | 1776 | §102§103§112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788322 | CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES | YUSHINA, GALINA G | 2811 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789555 | Static Random Access Memory With Pre-Charge Circuit | ARROYO, TERESA M | 2893 | §103§112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789554 | Isolation Structures Of Semiconductor Devices | LEE, WOO KYUNG | 2815 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788253 | THIN FILM TRANSISTOR BASED LIGHT SENSOR | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789069 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC STRESSOR | CHIN, EDWARD | — | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788287 | STRUCTURE FOR DETECTING/MONITORING PROCESS CHARGING DAMAGE DUE TO METAL AND ISOLATION WELL CHARGING | KIM, JAY C | 2815 | §112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789197 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | TRICE III, WILLIAM CLARENCE | 2827 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788172 | MULTIPLEXER CELL AND SEMICONDUCTOR DEVICE HAVING CAMOUFLAGE DESIGN, AND METHOD FOR FORMING MULTIPLEXER CELL | ASSOUMAN, HERVE-LOUIS Y | 2812 | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788133 | THIN FILM DEPOSITION WITH IMPROVED CONTROL OF PRECURSOR | MOORE, KARLA A | 1716 | §103§112 | Final Rejection | — | Pending | Jul 30, 2024 |
| 18787573 | PASSIVATION LAYERS WITH ROUNDED CORNERS | LINDSEY, COLE LEON | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786591 | TRANSISTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF HBNC LAYER | LOHAKARE, PRATIKSHA JAYANT | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786797 | FIELD-EFFECT TRANSISTOR DEVICE WITH GATE SPACER STRUCTURE | SPALLA, DAVID C | 2893 | §103DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786700 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | ANDREWS, FELIX BRYAN | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787422 | METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION BEYOND RETICLE LIMIT | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787608 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | LEE, WOO KYUNG | 2815 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787928 | RETICLE ENCLOSURE FOR LITHOGRAPHY SYSTEMS | WHITESELL, STEVEN H | 2682 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787569 | CAPACITOR IN NANOSHEET | DYKES, LAURA M | 2892 | §102§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787572 | FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | YI, CHANGHYUN | 2812 | §102§103§112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787960 | INTERCONNECTION FOR A MEMORY ARRAY AND METHODS FOR FORMING THE SAME | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787321 | METHODS AND SYSTEMS FOR IMPROVING PLASMA IGNITION STABILITY | BRAYTON, JOHN JOSEPH | 1713 | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788031 | MULTI-GATE SEMICONDUCTOR DEVICE WITH INNER SPACER AND FABRICATION METHOD THEREOF | GEYER, SCOTT B | 2812 | §102 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788108 | METHOD AND SYSTEM FOR REDUCING WORK-IN-PROCESS | WORKU, KIDEST | 2119 | §112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788116 | CIRCUIT AND METHOD TO ENHANCE EFFICIENCY OF SEMICONDUCTOR DEVICE | CHOE, HENRY | 2843 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787801 | SYSTEM AND METHOD FOR A LOW VOLTAGE SUPPLY BANDGAP | PERENY, TYLER J | 2843 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786595 | INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE DEVICE | SHEN, MATTHEW LIANFENG | 2897 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786614 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | BELOUSOV, ALEXANDER | 2818 | §102Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786587 | SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHODS THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786599 | SEMICONDUCTOR DEVICE INCLUDING A FINFET STRUCTURE AND METHOD FOR FABRICATING THE SAME | ZHU, SHENG-BAI | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786619 | MEMORY DEVICES | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786740 | SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE SAME | KNUDSON, BRAD ALLAN | 2817 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787840 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | HALL, VICTORIA KATHLEEN | 2897 | §112DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786836 | DUAL AMPOULE SEPARATOR PLATE AND METHOD | MELLOTT, JAMES M | 1759 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786561 | METHOD OF FORMING SEMICONDUCTOR DEVICES | HO, TU TU V | 2818 | §102 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786568 | MRAM STACKS, MRAM DEVICES AND METHODS OF FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | §112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786563 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK | GOODLING, DEVIN KIRK | 2898 | §103§112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786475 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | NELSON, JACOB THEODORE | 2815 | §102§103§112 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18785024 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | SEHAR, FAKEHA | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786260 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | TRICE III, WILLIAM CLARENCE | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785076 | FinFET Device With High-K Metal Gate Stack | BEARDSLEY, JONAS TYLER | 2811 | Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785869 | METHODS OF FORMING SEMICONDUCTOR DEVICES | LIU, XIAOMING | 2812 | DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785774 | SEMICONDUCTOR STRUCTURES WITH MULTIPLE THRESHOLD VOLTAGE OFFERINGS AND METHODS THEREOF | DINKE, BITEW A | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785878 | CANTILEVER WITH ETCH CHAMBER FLOW DESIGN | CROWELL, ANNA M | 1716 | §102§103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786268 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | TRICE III, WILLIAM CLARENCE | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785966 | METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING | RAHMAN, KHATIB A | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785488 | SELECTIVE DUAL SILICIDE FORMATION | BOWEN, ADAM S | — | §102§103Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785414 | SYSTEMS AND METHODS FOR PRODUCING ULTRAPURE WATER FOR SEMICONDUCTOR FABRICATION PROCESSES | DRODGE, JOSEPH W | 1773 | §102§112DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785022 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | NGUYEN, KIET TUAN | 2881 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786057 | SYSTEM AND METHOD FOR AUTOMATED MATERIAL HANDLING MANAGEMENT | LOGAN, KYLE O | 3655 | §112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785612 | APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES | WOLDEGEORGIS, ERMIAS T | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785032 | VENT PORT DIFFUSER | ROST, ANDREW J | 3753 | §103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18784139 | SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER | DINKE, BITEW A | 2812 | §102§103Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784089 | Ferroelectric Memory Device and Method of Manufacturing the Same | IMTIAZ, S M SOHEL | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783474 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING DEHYDRATING CHEMICAL, AND METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | LEE, WOO KYUNG | 2815 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783824 | BOND PAD WITH ENHANCED RELIABILITY | DIALLO, MAMADOU L | 2897 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783538 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784297 | ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784525 | APPARATUS AND METHOD FOR GENERATING EXTREME ULTRAVIOLET RADIATION | NGUYEN, KIET TUAN | 2881 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783574 | DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE | HOSSAIN, MOAZZAM | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784851 | NOISE DETECTING CIRCUIT AND ASSOCIATED SYSTEM AND METHOD | CHOE, HENRY | 2843 | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783486 | IMPLANTATION MASK FORMATION | VU, DAVID | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783569 | CAPACITOR DEVICE WITH SELF ALIGNED SPACER | DIAZ, JOSE R | 2815 | §102§103DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784860 | METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | NIELSEN, DEREK LANG | 2899 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784553 | SEMICONDUCTOR MEMORY DEVICES WITH DIELECTRIC FIN STRUCTURES | NGUYEN, SOPHIA T | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783502 | BARRIER LAYER FOR AN INTERCONNECT STRUCTURE | LIU, XIAOMING | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784544 | CHANNEL LAST PROCESS FOR DUMMY GATE VOID DEFECT REDUCTION | LE, THAO P | 2818 | §102Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784888 | METHOD FOR CLEANING OHT VEHICLE | JENNINGS, MICHAEL DEANGILO | 3723 | §102§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784645 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GEYER, SCOTT B | 2812 | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783518 | Epitaxial Source/Drain Structures for Multigate Devices and Methods of Fabricating Thereof | DINKE, BITEW A | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783529 | BARRIER STRUCTURE CONFIGURED TO INCREASE PERFORMANCE OF III-V DEVICES | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783997 | STOPPER BUMP STRUCTURES FOR MEMS DEVICE | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782050 | STORAGE ENVIRONMENT MONITORING SYSTEM AND METHODS OF OPERATION | PAN, YUHUI R | 2116 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782351 | SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782651 | METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE | BENNETT, CHARLEE | 1718 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782515 | TUNING GATE LENGTHS IN MULTI-GATE FIELD EFFECT TRANSISTORS | HATFIELD, MARSHALL MU-NUO | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782676 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | KIM, JEANNE MYON | 2898 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782179 | SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL | MCDONALD, RODNEY GLENN | 1713 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782660 | METHOD FOR FORMING SEMICONDUCTOR MEMORY DEVICE | MALSAWMA, LALRINFAMKIM HMAR | 2892 | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782962 | HYBRID SEMICONDUCTOR DEVICE | YI, CHANGHYUN | 2812 | §112Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783192 | HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782159 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | BELOUSOV, ALEXANDER | 2818 | §102 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782716 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE | GHEYAS, SYED I | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783071 | SEMICONDUCTOR DEVICES USING CARBON NANOTUBES | NGUYEN, SOPHIA T | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782439 | HIGH ASPECT RATIO BOSCH DEEP ETCH | CHAMBLISS, ALONZO | 2897 | §102DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782415 | GATE-ALL-AROUND HIGH-DENSITY AND HIGH-SPEED SRAM CELLS | SARKER-NAG, AKHEE | 2893 | §112DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782342 | AIRFLOW DETECTION DEVICE AND METHODS OF USE | SCHMITT, BENJAMIN R | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783105 | Metal Rail Conductors For Non-Planar Semiconductor Devices | ASSOUMAN, HERVE-LOUIS Y | 2812 | §102Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782291 | INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME | AU, BAC H | — | §103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780534 | APPARATUS AND METHOD FOR SUBSTRATE HANDLING | GATES, ERIC ANDREW | 3722 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780501 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | NGUYEN, NIKI HOANG | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781323 | SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | HUNTER III, CARNELL | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780802 | GUARD RING AND MANUFACTURING METHOD THEREOF | SNOW, COLLEEN ERIN | — | §102§103§112 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18782005 | SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE | VANYO, MICHAEL MOHABIR | 2812 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781599 | Ion Beam Etching Apparatus And Method | MCCORMACK, JASON L | 2881 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781361 | SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED | LINDSEY, COLE LEON | 2812 | §102§103 | Final Rejection | — | Pending | Jul 23, 2024 |
| 18780969 | Protective Liner for Source/Drain Contact to Prevent Electrical Bridging While Minimizing Resistance | YI, CHANGHYUN | 2812 | §102§103§112Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781435 | EUV LITHOGRAPHY APPARATUS | CHANG, HANWAY | 2878 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781293 | SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | VU, VU A | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780581 | INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781008 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | TAYLOR, EARL N | 2896 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781105 | OVERHANGING SOURCE/DRAIN CONTACT | JONES, ERIC W | 2892 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781081 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | KLEIN, JORDAN M | 2893 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780477 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | PRASAD, NEIL R | 2897 | §102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781335 | SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780959 | SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION STRUCTURE | BRASFIELD, QUINTON A | 2814 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779188 | IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE | ROLAND, CHRISTOPHER M | 2893 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780029 | REDUCING RC DELAY IN SEMICONDUCTOR DEVICES | VALENZUELA, PATRICIA D | 2812 | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779643 | Magnetic Layer for Magnetic Random Access Memory (MRAM) by Moment Enhancement | DIAZ, JOSE R | 2815 | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779305 | DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE | WARD, ERIC A | 2891 | §102§103§112Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779710 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | CHIU, TSZ K | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779844 | DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS | SARKER-NAG, AKHEE | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779180 | CLADDING STRUCTURE FOR SEMICONDUCTOR WAVEGUIDE | ENDRESEN, KIRSTEN DANIELA | 2874 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779109 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, DAO H | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779221 | METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES | LEE, ALVIN LYNGHI | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779252 | STILTED PAD STRUCTURE | VU, DAVID | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779425 | METHOD FOR ELIMINATING DIVOT FORMATION AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME | AHMED, SHAHED | 2813 | §103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779535 | Via Structures | NIX, NORA TAYLOR | 2891 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780436 | METHOD OF FORMING PACKAGE STRUCTURE | NIX, NORA TAYLOR | 2891 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779097 | SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | SMITH, BRADLEY | 2817 | §103§112Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779063 | SYSTEM AND METHOD FOR TESTING A FILTER | SCHMITT, BENJAMIN R | 2852 | DP | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778985 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778989 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | MICHAUD, NICHOLAS BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778990 | SPACER SCHEME AND METHOD FOR MRAM | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778946 | DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DIALLO, MAMADOU L | 2897 | DP | Non-Final OA | — | Pending | Jul 20, 2024 |
| 18777807 | STRAP TECHNOLOGY TO IMPROVE ESD HBM PERFORMANCE | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778106 | OVERHEAD HOIST TRANSPORT DEVICE AND METHOD OF USING THE SAME | MYERS, GLENN F | 3652 | §103 | Final Rejection | — | Pending | Jul 19, 2024 |
| 18777573 | OPTICAL MODULATOR AND PACKAGE | STAHL, MICHAEL J | 2874 | §103Other | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778563 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777885 | CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS DEVICE | CRITE, ANTONIO B | — | §102 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778189 | SONAR SENSOR IN PROCESSING CHAMBER | OH, JAEHWAN | 2899 | DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778727 | SEMICONDUCTOR DEVICES | SQUIRES, BRETT STEPHEN | 2899 | §103Other | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | GEBREMARIAM, SAMUEL A | 2811 | §112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776816 | SEMICONDUCTOR STRUCTURE WITH COMPOSITE OXIDE LAYER | HOANG, TUAN A | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776833 | METHOD AND APPARATUS FOR MITIGATING CONTAMINATION | CHANG, HANWAY | 2878 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776288 | METHOD OF MANUFACTURING AN OPTICAL SENSOR | LIU, MIKKA H | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776346 | SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFERENT THICKNESSES | CRAWFORD EASON, LATANYA N | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776282 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | HOANG, TUAN A | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776228 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MUSE, ISMAIL A | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775591 | Fin Field-Effect Transistor With Void and Method of Forming The Same | STEPHENSON, KENNETH STEPHEN | 2898 | §101DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775982 | SEMICONDUCTOR DEVICE WITH GATE ISOLATION STRUCTURE AND METHOD FOR FORMING THE SAME | KOO, LAMONT B | — | §102§103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775100 | WAFER LEVEL IMAGE SENSOR PACKAGE | CROSS, XIA L | 2892 | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774988 | METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICONDUCTOR SUBSTRATE | CHIU, TSZ K | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774961 | DEVICE FOR MEASURING FREQUENCY RESPONSE OF A WAFER | ZAAB, SHARAH | 2857 | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775482 | METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMAL INTERFACE MATERIAL | VALENZUELA, PATRICIA D | 2812 | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775939 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | FOX, BRANDON C | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775749 | CLEANING CHAMBER FOR METAL OXIDE REMOVAL | REYES, JOSHUA NATHANIEL PI | 1718 | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775598 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§112Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775130 | INTEGRATED CHIP WITH INTER-WIRE CAVITIES | CLINTON, EVAN GARRETT | 2899 | §102 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775457 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DANG, PHUC T | 2897 | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774843 | PACKAGE STRUCTURE | CHANG, JAY C | 2817 | §112 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774903 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | NGUYEN, NIKI HOANG | 2818 | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773923 | SEMICONDUCTOR DEVICE AND RELATED METHODS | BOATMAN, CASEY PAUL | 2893 | §102 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774408 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773592 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | LE, THAO P | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773200 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KOO, LAMONT B | — | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773250 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | FOX, BRANDON C | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773243 | AMPLIFIER WITH VCO-BASED ADC | NGUYEN, HIEU P | 2843 | Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772382 | CELL PLACEMENT OPTIMIZATION | BOWEN, ADAM S | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773342 | MEMORY DEVICE | RADKE, JAY W | — | §103§112Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772634 | STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE | ASSOUMAN, HERVE-LOUIS Y | 2812 | §102§103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772650 | TUNGSTEN VIA FOR A MAGNETIC TUNNEL JUNCTION INTERCONNECT | MILLER, JAMI VALENTINE | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772304 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | CUNNINGHAM, KIERAN MURRAY | 2893 | §103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772677 | INTEGRATED CIRCUIT DEVICE AND METHOD | YEAMAN, JAMES G | 2842 | §102§103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772736 | Image Sensors With Dummy Pixel Structures | ZARNEKE, DAVID A | 2891 | Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772364 | CAPPING LAYER OVER FET FERAM TO INCREASE CHARGE MOBILITY | DIAZ, JOSE R | 2815 | §102DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773466 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | GUMEDZOE, PENIEL M | 2899 | §102 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772713 | Epitaxial Structures For Semiconductor Devices | KIM, TONG-HO | 2811 | §102Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773284 | BALANCED NEGATIVE BITLINE VOLTAGE FOR A WRITE ASSIST CIRCUIT | YOHA, CONNIE C | 2825 | Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773229 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LE, THAO P | 2818 | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772224 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | LEE, EUGENE | 2815 | §102 | Non-Final OA | — | Pending | Jul 14, 2024 |
| 18772124 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | Jul 13, 2024 |
| 18772123 | SEMICONDUCTOR DEVICES INCLUDING METAL GATE PROTECTION AND METHODS OF FABRICATION THEREOF | KIM, TONG-HO | 2811 | §102§112Other | Non-Final OA | — | Pending | Jul 13, 2024 |
| 18771255 | METHODS OF MANUFACTURING SPIN-ORBIT-TORQUE MAGNETIC DEVICE | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771945 | MAGNETIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF | BERNSTEIN, ALLISON | 2824 | §102§103DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771578 | CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES | TAYLOR, EARL N | 2896 | §102 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771757 | IMAGING DEVICE | WILLIAMS, DON J | 2878 | DP | Final Rejection | — | Pending | Jul 12, 2024 |
| 18771652 | SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF FORMING THE SAME | GOODLING, DEVIN KIRK | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771815 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | HO, TU TU V | 2818 | §102 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770758 | INTEGRATED CIRCUIT WITH EMBEDDED HIGH-DENSITY AND HIGH-CURRENT SRAM MACROS | KIM, TONG-HO | 2811 | §102Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771095 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | BELOUSOV, ALEXANDER | 2818 | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770372 | Gate Isolation for Multigate Device | NGUYEN, NIKI HOANG | 2818 | §102Other | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769407 | MEMORY DEVICE INCLUDING DUAL CONTROL CIRCUITS | CHO, SUNG IL | 2825 | §102 | Final Rejection | 5d | Pending | Jul 11, 2024 |
| 18770367 | SOURCE/DRAIN EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769807 | STACKED SEMICONDUCTOR STRUCTURE | NGUYEN, DAO H | 2818 | §112 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770177 | SEMICONDUCTOR DEVICE WITH BACKSIDE CONTACT AND METHODS OF FORMING SUCH | NGUYEN, DAO H | 2818 | §103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770166 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE | SEHAR, FAKEHA | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769412 | INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE | QUINTO, KEVIN V | — | §102 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769425 | SEMICONDUCTOR PACKAGE STRUCTURE | PETERSON, ERIK T | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770299 | DUAL CRYSTAL ORIENTATION FOR SEMICONDUCTOR DEVICES | SANDVIK, BENJAMIN P | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769957 | ACTIVE REGION CUT PROCESS | HOANG, TUAN A | 2898 | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768426 | ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR DEVICES | GREEN, TELLY D | — | §102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769278 | SHALLOW TRENCH ISOLATION STRUCTURES HAVING UNIFORM STEP HEIGHTS | NGUYEN, THU VAN | 2898 | §101§102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768948 | INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT LAYOUT | HO, TU TU V | 2818 | §103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769182 | SEMICONDUCTOR DEVICE | SLUTSKER, JULIA | 2891 | §102§103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769334 | MEMORY DEVICE | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768421 | VERTICAL INTERCONNECT STRUCTURES WITH INTEGRATED CIRCUITS | LE, THAO P | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768284 | INTEGRATED CIRCUITS AND METHODS FOR POWER DELIVERY | SLUTSKER, JULIA | 2891 | §102Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769271 | DUAL METAL CAPPED VIA CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES | HARRISTON, WILLIAM A | 2899 | §102Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768125 | SEMICONDUCTOR DEVICE WITH GATE CUT STRUCTURE AND METHOD OF FORMING THE SAME | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769246 | AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL | GOODLING, DEVIN KIRK | 2898 | §102§103§112DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768993 | FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME | MOONEY, MICHAEL P | 2874 | DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768995 | STRUCTURE AND METHOD FOR MRAM DEVICES | NGUYEN, NIKI HOANG | 2818 | §102§103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767722 | ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZATION | PETERSON, ERIK T | 2898 | §102§103§112DP | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767205 | SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT | PHAM, HOAI V | 2892 | §102§112 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766674 | PACKAGE STRUCTURE | ULLAH, ELIAS | 2893 | §102 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767168 | SEMICONDUCTOR DEVICE WITH FIN STRUCTURES | KIM, TONG-HO | 2811 | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767571 | Work Function Layers For Transistor Gate Electrodes | SLUTSKER, JULIA | 2891 | §103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767939 | SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN | PHAM, HOAI V | 2892 | §102§103§112 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18765661 | ARCING PROTECTION METHOD, PROCESSING TOOL AND FABRICATION SYSTEM | LOPEZ ALVAREZ, OLVIN | 2117 | DP | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765738 | IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766582 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SNOW, COLLEEN ERIN | 2899 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765356 | PACKAGE | PRASAD, NEIL R | 2897 | §102§103Other | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766358 | PELLICLE STRUCTURE FOR EUV LITHOGRAPHY AND METHODS OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §102§103DP | Final Rejection | — | Pending | Jul 08, 2024 |
| 18766003 | STRUCTURE AND METHOD FOR FINFET DEVICE WITH SOURCE/DRAIN MODULATION | BOWEN, ADAM S | 2897 | Other | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765271 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DINKE, BITEW A | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 07, 2024 |
| 18764936 | SEMICONDUCTOR DEVICE WITH DIELECTRIC STRUCTURE IN CHANNEL REGION AND MANUFACTURING METHODS THEREOF | PHAM, LONG | 2897 | §102 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18764945 | SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME | GREEN, TELLY D | 2898 | DP | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18764951 | GATE-ALL-AROUND DEVICES | PHAM, LONG | 2897 | §102§112 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18763239 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | BERNSTEIN, ALLISON | — | Other | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18762685 | PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER AND METHOD OF FABRICATING THE SAME | CROSS, XIA L | 2892 | §102 | Final Rejection | 9d overdue | Pending | Jul 03, 2024 |
| 18761335 | SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF | NGUYEN, SOPHIA T | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18761592 | AIR CURTAIN FOR DEFECT REDUCTION | MCCLAIN, GERALD | 3652 | §102§103Other | Final Rejection | 33d | Pending | Jul 02, 2024 |
| 18760276 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | LINDSEY, COLE LEON | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18761238 | SEMICONDUCTOR PACKAGE | TRAN, THANH Y | 2817 | §102§103DP | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18757531 | PACKAGE STRUCTURE | SEVEN, EVREN | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758180 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | PARKER, JOHN M | 2899 | §103Other | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758212 | ETCHING APPARATUS AND METHODS OF CLEANING THEREOF | BRAYTON, JOHN JOSEPH | 1713 | §101§102§103Other | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757663 | PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MORE VAPOR CHAMBERS OVER IC CHIPS | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18759006 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | LEE, CHEUNG | 2812 | §103DP | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758214 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAC, JONATHAN KHANH | 3653 | §102§103 | Final Rejection | 39d | Pending | Jun 28, 2024 |
| 18758948 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | KIM, TONG-HO | 2811 | §102§103Other | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18759419 | SEMICONDUCTOR DEVICES WITH INSULATION FEATURES | ABEL, GARY ROBERT | 2897 | §103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18755895 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | SABUR, ALIA | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18756544 | NON-PLANAR TRANSISTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | OJEH, NDUKA E | 2892 | §112DP | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18757043 | MEMORY CIRCUITS WITH MULTI-ROW STORAGE CELLS AND METHODS FOR OPERATING THE SAME | KROFCHECK, MICHAEL C | 2138 | §103 | Final Rejection | — | Pending | Jun 27, 2024 |
| 18754948 | SEMICONDUCTOR INTEGRATED CIRCUIT | ERDEM, FAZLI | 2812 | §103 | Non-Final OA | 12d | Pending | Jun 26, 2024 |
| 18754706 | BACKSIDE CAPACITOR TECHNIQUES | GREEN, TELLY D | 2898 | §103Other | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753293 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HARRISON, MONICA D | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753091 | CHIP PACKAGE HAVING MULTIPLE CHIPS | JUNG, MICHAEL YOO LIM | 2817 | §102§103DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753024 | SEMICONDUCTOR DEVICE WITH GATE CUT FEATURE AND METHOD FOR FORMING THE SAME | LEE, CHEUNG | 2812 | DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753738 | CIRCUIT AND METHOD FOR RECEIVER WITH TRACK PATH | PUENTES, DANIEL CALRISSIAN | 2849 | §103§112 | Non-Final OA | 35d | Pending | Jun 25, 2024 |
| 18753139 | METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS | FAN, SU JYA | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18752388 | THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGULATOR POWER DELIVERY | TRAN, THANH Y | 2817 | Other | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18749921 | IMAGE SENSING STRUCTURE AND MANUFACTURING METHOD THEREOF | SEDOROOK, DAVID PAUL | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18750097 | ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME | MUSE, ISMAIL A | 2812 | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18749029 | SEMICONDUCTOR DEVICE HAVING CUT METAL GATE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18748250 | CONTACT AND VIA STRUCTURES | LEBENTRITT, MICHAEL | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18747457 | SEMICONDUCTOR STRUCTURE FOR REDUCING STRAY CAPACITANCE AND METHOD OF FORMING THE SAME | NADAV, ORI | 2811 | §103§112 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18746930 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18746081 | FIN-TYPE FIELD EFFECT TRANSISTOR | WARD, DAVID WILLIAM | 2891 | §103§112Other | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18745121 | MEMORY DEVICE, METHOD OF MANUFACTURING, AND METHOD OF OPERATING | SMET, UYEN TRAN | 2824 | §103 | Final Rejection | — | Pending | Jun 17, 2024 |
| 18744306 | STATIC RANDOM ACCESS MEMORY DEVICE | NELSON, JACOB THEODORE | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18741837 | SEMICONDUCTOR PHOTONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | PENG, CHARLIE YU | 2874 | §103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18742353 | MULTI-BIT DEVICE, LAYOUT, AND METHOD | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18741963 | Contact Structures In Semiconductor Devices | BOWEN, ADAM S | 2897 | §102 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18741248 | SEMICONDUCTOR DEVICE | BRASWELL, DONALD H.B. | 2825 | §103 | Final Rejection | — | Pending | Jun 12, 2024 |
| 18740625 | MEMORY DEVICE WITH MULTIPLE MEMORY CELL ARCHITECTURES | HARBOTTLE, CHARLOTTE ELIZABETH | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18741714 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | GREEN, TELLY D | 2898 | §103Other | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18740881 | SEMICONDUCTOR PACKAGE STRUCTURE | PRASAD, NEIL R | 2897 | §102§103Other | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18739603 | OPTICAL MODULATORS FOR PHOTONICS DEVICES AND METHODS THEREFOR | BLEVINS, JERRY M | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jun 11, 2024 |
| 18737615 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | ONUTA, TIBERIU DAN | 2814 | §103 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18734190 | SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING | SALERNO, SARAH KATE | 2814 | §102§103 | Non-Final OA | 9d | Pending | Jun 05, 2024 |
| 18733880 | PACKAGE STRUCTURE WITH REWIRING LAYER AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | §102§103 | Final Rejection | 30d overdue | Pending | Jun 05, 2024 |
| 18734575 | IMAGE SENSOR DEVICES AND METHODS OF FORMATION | HOSSAIN, MOAZZAM | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18733387 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | PARENDO, KEVIN A | — | §102§103§112 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18733512 | SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE | AU, BAC H | 2898 | §103 | Final Rejection | 26d | Pending | Jun 04, 2024 |
| 18731465 | DEVICE WITH EPITAXIAL SOURCE/DRAIN REGION | WINTERS, SEAN AYERS | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731821 | BONDED STRUCTURE WITH HALF-OVAL BONDING PAD PAIR DESIGN AND METHOD OF FORMING THE SAME | JEAN BAPTISTE, WILNER | 2899 | §102 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731031 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | LIU, BENJAMIN T | 2893 | §102§103 | Non-Final OA | — | Pending | May 31, 2024 |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | May 31, 2024 |
| 18678783 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BERNSTEIN, ALLISON | 2824 | §103 | Final Rejection | — | Pending | May 30, 2024 |
| 18679251 | PACKAGE AND MANUFACTURING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §102§103§112 | Non-Final OA | — | Pending | May 30, 2024 |
| 18677191 | INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18676841 | PIXEL ISOLATION STRUCTURE FOR IMAGE SENSOR | KLEIN, JORDAN M | 2893 | §102§103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18676649 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | SMITH, SAMUEL JONATHAN | 2817 | §102§103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18675090 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ZHU, SHENG-BAI | 2897 | §102§103 | Non-Final OA | — | Pending | May 27, 2024 |
| 18674894 | APPARATUS INCLUDING COOLING STRUCTURE | SEVEN, EVREN | 2812 | §102§103 | Non-Final OA | — | Pending | May 26, 2024 |
| 18673488 | METHOD OF OPERATING A PROCESSING APPARATUS | FITZGERALD, JOHN P | 2855 | §102§103DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18673792 | SEMICONDUCTOR ISOLATION STRUCTURE FOR INJECTION SUPPRESSION AND METHOD OF MAKING THEREOF | RAMIREZ, ALEXANDRE XAVIER | 2812 | §102§103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18673432 | SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18673328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | GUMEDZOE, PENIEL M | 2899 | §103§112 | Non-Final OA | — | Pending | May 24, 2024 |
| 18673204 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | MUNOZ, ANDRES F | 2818 | §103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18672733 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BRADFORD, PETER | 2897 | §102§103§112 | Non-Final OA | — | Pending | May 23, 2024 |
| 18672076 | SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATION THAN A LOCAL INTERCONNECT LINE | NGUYEN, DUY T V | 2818 | DP | Non-Final OA | — | Pending | May 23, 2024 |
| 18672526 | QUANTUM COMPUTING SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | PRIDEMORE, NATHAN ANDREW | 2898 | §103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18671164 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | RODELA, EDUARDO A | 2893 | DP | Non-Final OA | — | Pending | May 22, 2024 |
| 18671460 | Hybrid Vapor Chamber Lid | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | May 22, 2024 |
| 18671605 | ESD CLAMP CIRCUIT WITH LATCH | MEHARI, YEMANE | 2838 | §103 | Non-Final OA | — | Pending | May 22, 2024 |
| 18669948 | SEMICONDUCTOR STRUCTURE WITH REDUCED BODY LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME | CRITE, ANTONIO B | 2817 | §102 | Non-Final OA | — | Pending | May 21, 2024 |
| 18669560 | SEMICONDUCTOR DEVICE AND FORMING METHO OF THE SAME | HOLLWEG, THOMAS A | 2874 | §102§103 | Non-Final OA | — | Pending | May 21, 2024 |
| 18668809 | CHIP PACKAGE STRUCTURE WITH ADHESIVE WALL STRUCTURE AND METHOD FOR FORMING THE SAME | MARIN, JACOB RAUL | 2818 | §103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18669089 | SEMICONDUCTOR STRUCTURE WITH BARRIER AND METHOD FOR MANUFACTURING THE SAME | SABUR, ALIA | 2812 | §103 | Final Rejection | 34d | Pending | May 20, 2024 |
| 18666982 | SEMICONDUCTOR STRUCTURE HAVING VERTICAL CHANNELS AND METHOD FOR MANUFACTURING THE SAME | BOEGEL, CHEVY JACOB | 2812 | §102§103 | Non-Final OA | — | Pending | May 17, 2024 |
| 18666761 | METHOD FOR FORMING THERMAL CONDUCTOR MATERIAL FILM AND STACKING STRUCTURE FORMD THEREWITH | JOHNSON, CHRISTOPHER A | 2899 | §103§112 | Non-Final OA | — | Pending | May 16, 2024 |
| 18666777 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | ROLAND, CHRISTOPHER M | 2893 | §102§103 | Non-Final OA | — | Pending | May 16, 2024 |
| 18664837 | MEMORY DEVICE | STUESSY, NOLAN GABRIEL | 2812 | §102§103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18664301 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | REAMES, MATTHEW L | 2896 | §102§112Other | Non-Final OA | — | Pending | May 15, 2024 |
| 18664402 | RING STRUCTURE FOR FILM RESISTOR | PARKER, JOHN M | 2899 | §102§103§112 | Non-Final OA | — | Pending | May 15, 2024 |
| 18664291 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME | BERNSTEIN, ALLISON | 2824 | §102§103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18663771 | PHOTONIC INTEGRATED CIRCUIT AND CONTROLLING METHOD THEREOF FOR VERTICAL OPTICAL COMPUTING | NGUYEN, DUNG T | 2871 | §103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18663776 | POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL | OH, JAEHWAN | 2899 | §102 | Final Rejection | 28d | Pending | May 14, 2024 |
| 18663606 | HEAT CLEANING SYSTEM AND METHOD FOR CMP PAD BY-PRODUCT CONTROL | MACARTHUR, SYLVIA | 1713 | §103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18662308 | SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION | JORDAN, ANDREW | 2874 | §103 | Final Rejection | — | Pending | May 13, 2024 |
| 18662286 | SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN UNIT WITH TUNNEL LAYER AND METHOD FOR MANUFACTURING THE SAME | LOHAKARE, PRATIKSHA JAYANT | 2818 | §103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662168 | HIGHLY PHYSICAL ION RESISTIVE SPACER TO DEFINE CHEMICAL DAMAGE FREE SUB 60NM MRAM DEVICES | CRITE, ANTONIO B | 2817 | §103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662586 | PACKAGE STRUCTURE WITH A BARRIER LAYER | JANG, BO BIN | 2898 | §102 | Non-Final OA | — | Pending | May 13, 2024 |
| 18661000 | MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE | BERNSTEIN, ALLISON | 2824 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660641 | SEMICONDUCTOR PROCESSING APPARATUS | ISLAM, MOHAMMAD K | 2857 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660582 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | WARD, ERIC A | 2891 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660959 | ROM DEVICE, LAYOUT, AND METHOD | BRECHT, CHARLES MATTHEW | 2817 | §103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18659212 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | DAS, PINAKI | 2898 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18660154 | PACKAGE AND MANUFACTURING METHOD THEREOF | ABDELAZIEZ, YASSER A | 2898 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | BODNAR, JOHN A | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18657842 | APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING | PHAM, THOMAS T | 1713 | §103 | Final Rejection | 2d overdue | Pending | May 08, 2024 |
| 18658786 | DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME | MINNEY, GABRIEL SEBASTIAN | 2897 | §102§103 | Non-Final OA | — | Pending | May 08, 2024 |
| 18658212 | SEMICONDUCTOR PHOTONICS DEVICES AND METHODS OF FORMATION | CHIEM, DINH D | 2874 | §103 | Final Rejection | — | Pending | May 08, 2024 |
| 18656782 | GATE-ALL-AROUND TRANSISTOR HAVING MULTIPLE GATE LENGTHS | SEDOROOK, DAVID PAUL | 2812 | §103 | Non-Final OA | — | Pending | May 07, 2024 |
| 18656666 | EPITAXIAL STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD FORMING THEREOF | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | May 07, 2024 |
| 18655466 | SEMICONDUCTOR DEVICES HAVING CONTACT FIELD PLATES AND METHODS FOR FORMING THE SAME | GEBREMARIAM, SAMUEL A | 2811 | §102§112 | Non-Final OA | — | Pending | May 06, 2024 |
| 18655769 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18656348 | LOW-RESISTANCE SOURCE/DRAIN FEATURES | LEE, ALVIN LYNGHI | 2813 | §103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18654018 | SINGLE-PHOTON AVALANCHE DIODE (SPAD) SENSOR, SEMICONDUCTOR STRUCTURE INCLUDING SPAD SENSOR, AND METHOD FOR FORMING THE SAME | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | May 03, 2024 |
| 18654441 | SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION | ANYA, IGWE U | 2891 | §102 | Non-Final OA | — | Pending | May 03, 2024 |
| 18651776 | WAFER TRANSPORT CONTAINER | ACKUN, JACOB K | 3652 | DP | Non-Final OA | — | Pending | May 01, 2024 |
| 18651321 | INTEGRATED CIRCUIT PACKAGES | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18650905 | Gate Structures For Semiconductor Devices | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18648884 | BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18649262 | Dielectric Frame Structures to Mitigate Lay-Out-Dependent Effect in Semiconductor Devices | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18648510 | METHODS FOR FORMING SEMICONDUCTOR STRUCTURE | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18646964 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ELLIOTT, DANIEL KURT | — | §102§103§112Other | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18647151 | SYSTEMS AND METHODS FOR TESTING SEMICONDUCTOR DEVICE | NGUYEN, TRUNG Q | 2858 | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18647384 | CHAMBER WALL POLYMER PROTECTION SYSTEM AND METHOD | LEE, AIDEN Y | 1718 | §102§103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646458 | ADHESION OF A PACKAGE COMPONENT TO A HEAT SINK | GONZALES, VICENTE ROLANDO | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646444 | Epitaxial Structures in Image Sensors | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645564 | LOW DROPOUT REGULATOR WITH ALTERNATIVE LOOP CONTROL | LEE, JYE-JUNE | 2838 | §103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645747 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646677 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | LEE, EUGENE | 2898 | §102§103§112 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645608 | Device and Method for Generating a Temperature-Independent Reference Voltage | NOVAK, PETER MICHAEL | 2838 | §103 | Non-Final OA | 8d overdue | Pending | Apr 25, 2024 |
| 18646723 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | ROBERTSON, NOAH CHRISTOPHER | 2812 | §103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644451 | THERMAL PERFORMANCE OF STACKED DIES | NICELY, JOSEPH C | 2813 | §103§112 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18644231 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | KIELIN, ERIK J | 2893 | §103 | Final Rejection | — | Pending | Apr 24, 2024 |
| 18644188 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | LINDSEY, COLE LEON | 2812 | §103 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18644209 | CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME | GEYER, SCOTT B | 2812 | §102 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18643788 | Integrated Circuit Package Structure with Thermelectric Self-Cooling Device | TRAN, DZUNG | 2893 | §103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643789 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | REAMES, MATTHEW L | 2896 | §112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18642897 | GAIN-CELL RANDOM ACCESS MEMORY WITH ENHANCED RETENTION | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18642872 | SEMICONDUCTOR DEVICE HAVING NANOSTRUCTURE TRANSISTOR AND METHODS OF FABRICATION THEREOF | SOWARD, IDA M | 2898 | §102§112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18640939 | SYSTEMS AND METHODS FOR AUTOMATED ANALYSIS OF VOLTAGE CONTRAST DEFECTS IN INTEGRATED CIRCUIT INSPECTION | FREDERIKSEN, DAVID B | 2858 | §101 | Final Rejection | — | Pending | Apr 19, 2024 |
| 18641017 | SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABRICATING THEREOF | AHMADI, MOHSEN | 2896 | §103§112 | Non-Final OA | — | Pending | Apr 19, 2024 |
| 18640921 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | SPRENGER, JAIME LYNN | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 19, 2024 |
| 18638982 | RADIATION SOURCE APPARATUS AND METHOD FOR OPERATING THE SAME | WHITESELL, STEVEN H | 1759 | §102§103§112 | Final Rejection | — | Pending | Apr 18, 2024 |
| 18639105 | SEMICONDUCTOR STRUCTURE WITH REDUCED CURRENT LEAKAGE AND METHOD FOR MANUFACTURING THE SAME | MARIN, JACOB RAUL | 2818 | §103§112 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18638088 | SEMICONDUCTOR ELECTRODE STRUCTURES AND METHODS OF FORMING SAME | ANDREWS, FELIX BRYAN | 2881 | §103 | Non-Final OA | — | Pending | Apr 17, 2024 |
| 18635911 | MEMORY DEVICE AND OPERATING METHOD THEREOF | LUONG, DUY HAN | 2825 | §103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635103 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | WEILAND, ADAM DAVID | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635478 | TAPERED LIGHT ABSORPTION STRUCTURE FOR INTEGRATED CIRCUIT PHOTODETECTOR | SMITH, CHAD | 2874 | §102 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635310 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18634774 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | VU, DAVID | 2818 | §102 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18633920 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, DAO H | 2818 | §102§103§112 | Final Rejection | — | Pending | Apr 12, 2024 |
| 18633485 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | NIX, NORA TAYLOR | 2891 | §102 | Final Rejection | — | Pending | Apr 11, 2024 |
| 18631979 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | LEE, DA WEI | 2817 | §103§112 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18631525 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SCHOENHOLTZ, JOSEPH | 2893 | §103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18631274 | SEMICONDUCTOR STRUCTURE | DINKE, BITEW A | 2812 | §102§103§112 | Final Rejection | — | Pending | Apr 10, 2024 |
| 18630307 | SEMICONDUCTOR WAVEGUIDE HEATER WITH HEATER CONTACTS | BLEVINS, JERRY M | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18629679 | POLISHING PAD WITH HEAT DISSIPATION PATTERN | NEIBAUR, ROBERT F | 3723 | §102§103 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18629474 | FRONTSIDE AND BACKSIDE BIT LINES IN A MEMORY ARRAY | MINNEY, GABRIEL SEBASTIAN | 2897 | §103§112 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18627570 | METAL-INSULATOR-METAL DEVICE STRUCTURES AND METHODS OF FORMING THE SAME | CHOU, SHIH TSUN A | 2811 | §103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627686 | Structure and Method of an Integrated Circuit Having Silicon Photonic Integration | MANHEIM, MARC ETIENNE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627507 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | WOODARD, AUSTIN TAYLOR | 2893 | §103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627885 | CONDUCTIVE PATH WITH REDUCED RESISTANCE | PUNCHBEDDELL, SEYON ALI-SIMAH | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18626988 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THEREOF | CLINTON, EVAN GARRETT | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626386 | SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME | DEO, DUY VU NGUYEN | 1713 | §102§103 | Final Rejection | — | Pending | Apr 04, 2024 |
| 18626435 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MICKEY, TERESA NICOLE | 2897 | §103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626948 | SEMICONDUCTOR PHOTONICS DEVICES AND METHODS OF FORMATION | PENG, CHARLIE YU | 2874 | §102 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626638 | METHOD FOR TREATING TWO SUBSTRATES AND SEMICONDUCTOR APPARATUS FOR PERFORMING THE TREATMENT | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626960 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18625788 | SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL | SNOW, COLLEEN ERIN | 2899 | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18623050 | ANALYSIS METHOD AND ANALYSIS DEVICE | PARIHAR, SUCHIN | 2851 | §102 | Non-Final OA | — | Pending | Apr 01, 2024 |
| 18619734 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING | PARVEZ, AZM A | 2892 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619632 | GATE STRUCTURE DISPOSED BETWEEN FIN STRUCTURES TO DECREASE LEAKAGE IN GAIN CELL RANDOM ACCESS MEMORY (GCRAM) | PARVEZ, AZM A | — | §102§103§112 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | DINKE, BITEW A | 2812 | §103 | Final Rejection | — | Pending | Mar 27, 2024 |
| 18618312 | HYBRID BULK SEMICONDUCTOR AND SEMICONDUCTOR ON INSULATOR (SOI) SUBSTRATE AND METHODS OF FORMATION | PETERSON, ERIK T | 2898 | §102§112 | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18618482 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | DYKES, LAURA M | 2892 | §102§103Other | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18616674 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | RAHMAN, MOHAMMAD A | 2898 | §102§112 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18614756 | METHOD OF FORMING PACKAGE STRUCTURE | SALERNO, SARAH KATE | 2814 | §102 | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18615866 | MEMORY DEVICE AND METHOD | CHEN, XIAOCHUN L | 2824 | §112Other | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18615459 | MAGNETIC TUNNEL JUNCTION DEVICES | MILLER, JAMI VALENTINE | 2818 | §103 | Final Rejection | 16d | Pending | Mar 25, 2024 |
| 18615579 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | DEO, DUY VU NGUYEN | 1713 | §102§103 | Final Rejection | — | Pending | Mar 25, 2024 |
| 18614445 | EUV LITHOGRAPHY MASK BLANKS, EUV MASKS AND METHODS | FRASER, STEWART A | 1724 | §103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18614098 | CHANNEL STRUCTURES IN SEMICONDUCTOR DEVICES | SENGDARA, VONGSAVANH | 2893 | §102 | Final Rejection | — | Pending | Mar 22, 2024 |
| 18611797 | INTEGRATED CIRCUIT CHIP HAVING VIA TOWERS FOR POWER CONNECTION AND METHOD OF FORMING THE SAME | MANDALA, MICHELLE | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18612386 | INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARASITIC CAPACITANCE | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18607714 | Semiconductor Device Including a Voltage Regulator and an Integrated Circuit Module | HILTUNEN, THOMAS J | 2836 | §102§103 | Non-Final OA | 8d overdue | Pending | Mar 18, 2024 |
| 18605724 | PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18605515 | SYSTEMS AND METHODS FOR RECOVERY OF AN IMPAIRED VEHICLE ON A SUSPENDED TRACK | LIN, CHENG XI | 3615 | §102§103 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | 9d overdue | Pending | Mar 14, 2024 |
| 18603629 | IMAGE SENSORS AND METHOD OF MANUFACTURING THE SAME | TRAN, TRANG Q | 2811 | §102§112 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603779 | INTEGRATED CIRCUIT PACKAGES | CRITE, ANTONIO B | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603729 | VIA STRUCTURE FOR MULTI-STACKED CHIPS | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603469 | Analog Cell Structure | ELLIOTT, DANIEL KURT | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18602163 | THERMAL CONDUCTIVE BONDING STRUCTURE | DULKA, JOHN P | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18602854 | STACKED TRANSISTORS AND METHOD OF FORMING THE SAME | WRIGHT, TUCKER J | 2891 | §102 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18601191 | SLOW WAVE INDUCTIVE STRUCTURE | HINSON, RONALD | 2837 | §103 | Final Rejection | 36d overdue | Pending | Mar 11, 2024 |
| 18599383 | INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS | GOODLING, DEVIN KIRK | 2898 | §102§103 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18599702 | CHANNEL EXTENSION STRUCTURES FOR SEMICONDUCTOR DEVICES | BELL, LAUREN R | 2896 | §102§103§112 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18599830 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | FREY, KIMBERLY NEWMAN | 4100 | §102 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18597966 | SEMICONDUCTOR DEVICES HAVING A PATTERNED CONTACT | RAMALLO, GUSTAVO G | 2812 | §112 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18598197 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MORA, ONASIS | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597846 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18595440 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | HRNJIC, ADIN | 2817 | §102§103§112 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18596600 | PACKAGE STRUCTURE | PETKOVSEK, DANIEL | 2874 | §103 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18595429 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WALL, VINCENT | 2898 | §103 | Final Rejection | 22d | Pending | Mar 05, 2024 |
| 18596416 | METHOD OF FORMING NANOSTRUCTURE DEVICE AND RELATED STRUCTURE | YI, CHANGHYUN | 2812 | §103 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18593954 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 03, 2024 |
| 18593247 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | DEGRASSE, IAN ISAAC | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18591992 | SEMICONDUCTOR DEVICE | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591700 | BONDING TOOL FOR BONDING DIES ONTO SUBSTRATES AND METHODS OF USE | HENRY, CALEB E | 2818 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18590957 | SEMICONDUCTOR DEVICE AND METHOD OF ARRANGING AN INTERFACE OF A SEMICONDUCTOR DEVICE | RAMPERSAUD, PRIYA M | 2897 | §102 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591282 | IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR DEVICES | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591047 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | BOOTH, RICHARD A | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18592029 | Source/Drains for Stacked Device Structures and Methods of Fabrication Thereof | STEPHENSON, KENNETH STEPHEN | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18589669 | SELECTIVE DEPOSITION METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME | ROBERTSON, NOAH CHRISTOPHER | 2812 | §102§103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Feb 28, 2024 |
| 18590911 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BRECHT, CHARLES MATTHEW | 2817 | §103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18590175 | Diffusion Barrier Layers in Semiconductor Devices | LIU, XIAOMING | 2812 | §103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18588942 | SEMICONDUCTOR DEVICE HAVING NANOSHEETS | HOANG, TUAN A | 2898 | §102 | Final Rejection | — | Pending | Feb 27, 2024 |
| 18588069 | INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREADER LAYERS | KIELIN, ERIK J | 2814 | §102§103§112 | Non-Final OA | — | Pending | Feb 27, 2024 |
| 18586596 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18584092 | SEMICONDUCTOR DEVICE | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §103 | Final Rejection | — | Pending | Feb 22, 2024 |
| 18584047 | WAVEGUIDE WITH TRANSITIONAL PORTION AND METHOD OF FABRICATING SAME | CHIEM, DINH D | 2874 | §103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18583044 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | MULERO FLORES, ERIC MANUEL | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582781 | PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582702 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18583209 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | BAUMAN, SCOTT E | 2815 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582953 | MEMORY CELL STRUCTURES WITH GATE-CUT FEATURES ON CELL BOUNDARIES | MORA, ONASIS | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582200 | PIXEL SENSOR ARRAYS AND METHODS OF FORMATION | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18582288 | BACK END LINE OF MEMORY DEVICE | CHI, SUBERR L | 2893 | §112 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18444896 | IMAGE SENSOR AND METHOD OF MANUFACTURING IMAGE SENSOR | HOSSAIN, MOAZZAM | 2898 | §103 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18581058 | SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES | DYKES, LAURA M | 2892 | §103§112 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18444092 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | HOQUE, MOHAMMAD M | 2817 | §102§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18443616 | DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF | GARCES, NELSON Y | 2814 | §102§103 | Final Rejection | — | Pending | Feb 16, 2024 |
| 18444268 | IC Structure with Stress-Release Pattern to Enhance Package Yield | GONDARENKO, NATALIA A | 2891 | §103§112 | Final Rejection | — | Pending | Feb 16, 2024 |
| 18442381 | HIGH VOLTAGE DEVICE WITH BOOSTED BREAKDOWN VOLTAGE | GUPTA, RAJ R | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18443158 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHODS | ALBRECHT, PETER M | 2811 | §112 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18440671 | DELAMINATION DETECTION STRUCTURE | KAO, SOPHIA WEI-CHUN | 2817 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18438538 | DUAL DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | WEGNER, AARON MICHAEL | 2897 | §102§103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18435128 | SEMICONDUCTOR DEVICES HAVING FERROELECTRIC MEMORY CELLS AND METHODS OF FORMING THE SAME | CHEEK, EDWARD RHETT | 2813 | §102§103 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18435685 | SEMICONDUCTOR STRUCTURE WITH BLOCKING FEATURES FORMED WITHIN BASE EPITAXY LAYERS AND METHOD FOR MANUFACTURING THE SAME | YEMELYANOV, DMITRIY | 3616 | §102§103§112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18433450 | SEMICONDUCTOR MANUFACTURING TOOL AND METHOD OF OPERATING THE SAME | NGUYEN, KHIEM D | 2116 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433509 | TRAPPING FILM FOR DEEP TRENCH ISOLATION STRUCTURE | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433934 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WARREN, MATTHEW E | 2815 | — | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433412 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | GOODLING, DEVIN KIRK | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18434559 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | NGUYEN, CUONG B | 2818 | §112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18432197 | INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432058 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | FAN, SU JYA | 2818 | §103§112 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432027 | SEMICONDUCTOR STRUCTURE INCLUDING HIGH THERMAL CONDUCTIVITY MATERIAL AND METHOD OF FORMING THE SAME | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Feb 04, 2024 |
| 18431950 | SEMICONDUCTOR DEVICES WITH LOWERED EPITAXIAL SOURCE/DRAIN REGIONS AND METHODS OF FABRICATION THEREOF | DYKES, LAURA M | 2892 | §102§103§112Other | Non-Final OA | — | Pending | Feb 03, 2024 |
| 18431140 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | §102 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18430507 | SEMICONDUCTOR DEVICE | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | — | Pending | Feb 01, 2024 |
| 18428623 | BIT LINE STRUCTURE FOR MEMORY DEVICES | TRAN, TAN N | 2812 | §103 | Final Rejection | — | Pending | Jan 31, 2024 |
| 18428230 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | DINKE, BITEW A | 2812 | §103 | Final Rejection | 76d | Pending | Jan 31, 2024 |
| 18426664 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | TORNOW, MARK W | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18427248 | MEMORY DEVICES HAVING MIDDLE STRAP AREAS FOR ROUTING POWER SIGNALS | STORMES, JOSEPH FIDELIS | 2825 | §103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18425264 | THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE | NGUYEN, CUONG B | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425352 | SEMICONDUCTOR STRUCTURE | PETERSON, ERIK T | 2898 | §102§112 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18426140 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CHOI, CALVIN Y | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18423888 | OPTICAL SIGNAL REDIRECTION STRUCTURE FOR PHOTONICS DEVICE | ALANKO, ANITA KAREN | 1713 | §102§103§112 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | SANDVIK, BENJAMIN P | 2812 | §103 | Final Rejection | — | Pending | Jan 26, 2024 |
| 18423745 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIM, SU C | 2899 | §103 | Final Rejection | — | Pending | Jan 26, 2024 |
| 18424455 | SEALING ARTICLES FOR PLASMA RESISTANCE APPLICATIONS | SANDERS, JAMES M | 1743 | §103§112 | Final Rejection | 9d | Pending | Jan 26, 2024 |
| 18421399 | PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421026 | SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND METHODS OF FORMING SAME | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421267 | ANTI-SLIP COMPOSITIONS AND COMPONENTS FOR SEMICONDUCTOR WAFER HANDLING SYSTEMS | ROBINSON, CHANCEITY N | 1737 | §103§112 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18420232 | MICRO-ELECTROMECHANICAL MICROPHONES AND METHODS OF FORMING THE SAME | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18420674 | PHOTONIC DEVICE AND FABRICATING METHOD THEREOF | LEE, CHEUNG | 2874 | §102 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18418142 | POLISHING APPARATUS AND POLISHING METHOD USING THE SAME | RIRIE, EVERETT TRAJAN | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18417128 | PELLICLE FOR EUV APPLICATIONS | FRASER, STEWART A | 1724 | §103§112 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18415986 | Extreme Ultraviolet (EUV) Mask and Method of Fabrication Thereof | TRAYWICK, ANDREW PRESTON | 1737 | §103§112 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18416800 | THIN FILM RESISTOR AND METHODS OF FORMING THE SAME | YEUNG LOPEZ, FEIFEI | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18416715 | FERROELECTRIC NON-VOLATILE MEMORY AND METHODS OF FORMATION | ALAM, MOHAMMED R | 2897 | §112 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415487 | SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD THEREOF | REIDA, MOLLY KAY | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415330 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | KOO, LAMONT B | 2813 | §103 | Final Rejection | — | Pending | Jan 17, 2024 |
| 18415616 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | MILLER, MICHAEL G | 2817 | §103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18414622 | APPARATUSES AND METHODS FOR ASSESSING DEEP ULTRAVIOLET REFLECTIVITY OF A PELLICLE FOR AN EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY MASK | AKANBI, ISIAKA O | 2877 | §102 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18414480 | METHOD AND SYSTEM FOR OBTAINING OPTICAL CRITICAL DIMENSION | SOUNDRANAYAGAM, RAYAPPU NMN | 2858 | §102 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415267 | Semiconductor Device Including A Pulse Amplitude Modulation Driver | LAM, TUAN THIEU | 2843 | §102 | Final Rejection | — | Pending | Jan 17, 2024 |
| 18415192 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18413079 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | BOEGEL, CHEVY JACOB | 2812 | §103 | Final Rejection | — | Pending | Jan 16, 2024 |
| 18413276 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | GREEN, TELLY D | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18414245 | SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WARD, ERIC A | 2891 | §103 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18413062 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18412581 | SEMICONDUCTOR DEVICE | PRICE, LYTESHIA M | 2818 | §103§112 | Non-Final OA | — | Pending | Jan 14, 2024 |
| 18412209 | DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS | ONUTA, TIBERIU DAN | 2814 | §103 | Final Rejection | — | Pending | Jan 12, 2024 |
| 18411620 | Static Random-Access Memory Device with Enhanced Isolation Structure and Increased Packing Density | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18412071 | DEPOSITION TOOL WITH DIELECTRIC COATED CHAMBER SIDEWALLS TO IMPROVE ELECTROMANGNETIC FIELD UNIFORMITY | TADAYYON ESLAMI, TABASSOM | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411595 | Contact Structures in Semiconductor Devices | GRAHAM, KRETELIA | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411041 | SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME | BOOTH, RICHARD A | 2812 | §102§103 | Final Rejection | — | Pending | Jan 12, 2024 |
| 18411422 | MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM | MOHAMED-ALY, KAREEM M | 2898 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411226 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | TRAN, TIEN | 2812 | §103 | Final Rejection | — | Pending | Jan 12, 2024 |
| 18411392 | SEMICONDUCTOR PACKAGE STRUCTURE | WOODARD, AUSTIN TAYLOR | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18409915 | METHODS FOR SELECTIVE METAL CAP FORMATION | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409829 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | PRASAD, NEIL R | 2897 | §103 | Final Rejection | — | Pending | Jan 11, 2024 |
| 18410303 | SEMICONDUCTOR STRUCTURE HAVING NON-SILICIDE SOURCE/DRAIN CONTACT AND METHOD FOR MANUFACTURING THE SAME | TYNES JR., LAWRENCE C | 2899 | §103§112 | Final Rejection | — | Pending | Jan 11, 2024 |
| 18410734 | ONE-TIME-PROGRAMMABLE MEMORY ARRAY HAVING DIFFERENT DEVICE CHARACTERISTICS AND METHODS OF MANUFACTURING THEREOF | WOLDEGEORGIS, ERMIAS T | 2893 | §103§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410302 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | MENZ, LAURA MARY | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410813 | MULTI-LAYER ALIGNMENT MARK STRUCTURE | CHOWDHARY, NIMARTA KAUR | 2898 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409827 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | §102§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18408782 | DEVICE HAVING ALTERNATING ROWS OF CORRESPONDING FIRST AND SECOND ROW-ARCHITECTURES AND METHOD OF MANUFACTURING SAME | AISAKA, BRYCE M | 2851 | §112 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18408944 | TRANSISTOR STRUCTURE WITH HIGHER JUNCTION BREAKDOWN VOLTAGE | TRAN, TIEN | 2812 | §103 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18408487 | SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | HUNTER III, CARNELL | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407436 | SEMICONDUCTOR DEVICE AND SYSTEM FOR OPTICAL SIGNAL PROCESSING | GREEN, TAJANAE NICOLE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407524 | SEMICONDUCTOR DEVICE WITH HYBRID SUBSTRATE AND MANUFACTURING METHODS THEREOF | CHAMBLISS, ALONZO | 2897 | §112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407368 | PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR DEVICE USING THE SAME | KENDALL, BENJAMIN R | 2896 | §102 | Final Rejection | — | Pending | Jan 08, 2024 |
| 18407342 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ARORA, AJAY | 2892 | §102 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18406238 | METHODS AND COMPUTER-READABLE MEDIUM RELATED TO FERROELECTRIC MEMORY | WINTERS, SEAN AYERS | 2892 | §102§103 | Final Rejection | — | Pending | Jan 08, 2024 |
| 18406246 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | REAMES, MATTHEW L | 2896 | §103§112 | Final Rejection | — | Pending | Jan 08, 2024 |
| 18405951 | ONE-TIME-PROGRAMMABLE MEMORY DEVICES WITH HIGH SECURITY AND METHODS OF MANUFACTURING THEREOF | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18403779 | PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING PHOTOELECTRIC DEVICE | CAPUTO, LISA M | 2874 | §102§103 | Final Rejection | 5d overdue | Pending | Jan 04, 2024 |
| 18404233 | EPITAXIAL STRUCTURES IN SEMICONDUCTOR DEVICES | CIESLEWICZ, ANETA B | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404290 | SEMICONDUCTOR STRUCTURE INCLUDING MICRO WELLS WITH DIFFERENT HEIGHTS | MIHALIOV, DMITRI | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403747 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403757 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | ADHIKARI DAWADI, BIPANA | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404515 | SOURCE/DRAIN STRUCTURE DOPANT CLUSTER DESIGN | GREAVING, JASON JAMES | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404345 | BACKSIDE CONTACT RESISTANCE REDUCTION | LOPEZ, JORGE ANDRES | 2897 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404187 | SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL GATE VIA AND METHOD FOR MANUFACTURING THE SAME | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403735 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | CAPUTO, LISA M | 2874 | §103§112 | Final Rejection | 21d | Pending | Jan 04, 2024 |
| 18404467 | REDUCTION OF SIZE OF EDGE CELL REGION IN MEMORY DEVICES | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103 | Final Rejection | — | Pending | Jan 04, 2024 |
| 18403616 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403455 | INSPECTION SYSTEM AND METHOD FOR OPERATING THEREOF | YAZBACK, MAHER | 2877 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403148 | INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUBSTRATE | GOODLING, DEVIN KIRK | 2898 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402976 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | FARMER, EMILY NICOLE | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401853 | PACKAGE STRUCTURE, DIE STRUCTURE AND METHOD FOR FORMING THE PACKAGE STRUCTURE | YEMELYANOV, DMITRIY | 2891 | §103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402035 | CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME | ANYA, IGWE U | 2891 | §102 | Final Rejection | — | Pending | Jan 02, 2024 |
| 18401948 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | MAI, ANH D | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18400440 | SEMICONDUCTOR DIE AND METHODS OF FORMATION | PHAM, THOMAS T | 1713 | §103§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18398951 | METHODS AND DEVICES THAT INCLUDE A GATE CONTACT THAT ABUTS A DIELECTRIC REGION THAT HAS A LOW-K DIELECTRIC | WRIGHT, TUCKER J | 2891 | §102 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398856 | SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A VERTICAL CHANNEL | JEAN BAPTISTE, WILNER | 2899 | §103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398937 | PHOTONICS DEVICE WITH BACKSIDE TRANSMISSIVE REGION | HAN, JONATHAN | 2818 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398925 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | CHOU, SHIH TSUN A | 2811 | §103 | Final Rejection | — | Pending | Dec 28, 2023 |
| 18397398 | REDUCTION OF METAL LOSS DURING GATE PATTERNING | TRAN, TONY | 2893 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2023 |
| 18396662 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | SENGDARA, VONGSAVANH | 2893 | §102 | Final Rejection | 9d overdue | Pending | Dec 26, 2023 |
| 18395841 | IMAGE SENSORS AND METHODS OF MANUFACTURE | WINTERS, SEAN AYERS | 2892 | §102§103§112 | Final Rejection | 55d | Pending | Dec 26, 2023 |
| 18395728 | SEMICONDUCTOR DEVICE FOR HIGH-VOLTAGE APPLICATION | SARKER-NAG, AKHEE | 2893 | §102§103§112 | Non-Final OA | — | Pending | Dec 25, 2023 |
| 18393711 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | SHEKER, RHYS PONIENTE | 2813 | §103 | Non-Final OA | — | Pending | Dec 22, 2023 |
| 18393890 | SEMICONDUCTOR DEVICES AND METHODS THEREOF WITH SELECTIVELY FORMED ISOLATION LAYERS | GOODLING, DEVIN KIRK | 2898 | §103§112 | Non-Final OA | — | Pending | Dec 22, 2023 |
| 18391546 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | STARK, JARRETT J | 2898 | §103 | Non-Final OA | — | Pending | Dec 20, 2023 |
| 18535546 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME | DOAN, NGHIA M | 2851 | §103Other | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18535477 | METHOD AND APPARATUS FOR MONITORING AN EXTREME ULTRAVIOLET RADIATION SOURCE | NGUYEN, KIET TUAN | 2881 | §102§112 | Non-Final OA | 24d overdue | Pending | Dec 11, 2023 |
| 18530248 | LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND METHOD FOR FORMING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | §102§103 | Non-Final OA | — | Pending | Dec 06, 2023 |
| 18527532 | IMAGE SENSOR WITH METAL-INSULATOR-METAL STORAGE ELEMENTS | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18527714 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | CHANG, JAY C | 2817 | §112 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Final Rejection | 14d | Pending | Dec 04, 2023 |
| 18526473 | CONTACT GATE ISOLATION | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Final Rejection | 22d | Pending | Dec 01, 2023 |
| 18526083 | CHIP TESTING STRUCTURE | PATEL, PARESH H | 2858 | §103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526529 | METHODS FOR IMPROVING DEPTH LOADING IN TRANSISTORS | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526121 | METHOD OF SMOOTHENING PROFILE OF PHOTORESIST | EOFF, ANCA | 1722 | §102§103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18524445 | Backside Via and Dual Side Power Rail For Epitaxial Source/Drain Structure | CUNNINGHAM, KIERAN MURRAY | 2893 | §102§103 | Final Rejection | 41d | Pending | Nov 30, 2023 |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | 21d | Pending | Nov 30, 2023 |
| 18524282 | In-Situ Tungsten for Gate Stack of Multigate Device | ISAAC, STANETTA D | 2898 | §102§103 | Non-Final OA | — | Pending | Nov 30, 2023 |
| 18522479 | OPTICAL FIBER CONNECTOR, PHOTONIC INTEGRATED CIRCUIT AND PHOTONIC PACKAGING STRUCTURE USING THE SAME | MANHEIM, MARC ETIENNE | 2874 | §102§103§112 | Final Rejection | 54d | Pending | Nov 29, 2023 |
| 18522634 | METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | PAYEN, MARVIN | 2899 | §103 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18523531 | CHARGE PUMP CIRCUITS WITH BACKSIDE FLY CAPACITORS AND METHODS OF MANUFACTURING THEREOF | ONUTA, TIBERIU DAN | 2814 | §103 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18522662 | SYSTEM AND STRUCTURE INCLUDING A PELLICLE | ANGEBRANNDT, MARTIN J | 1737 | §102§103DP | Final Rejection | — | Pending | Nov 29, 2023 |
| 18522583 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STRUCTURE | CHEN, YU | 2896 | §102§103§112 | Final Rejection | — | Pending | Nov 29, 2023 |
| 18521913 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | LIU, BENJAMIN T | 2893 | §102§103 | Final Rejection | 40d | Pending | Nov 28, 2023 |
| 18519805 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | TURNER, BRIAN | 2894 | §102§103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18519452 | POWER PERFORMANCE AREA ATTRACTIVE MULTIPLE TRANSISTOR ANTI-FUSE BIT CELL LAYOUT STRUCTURE | VU, HUNG K | 2897 | §103 | Final Rejection | — | Pending | Nov 27, 2023 |
| 18519633 | SRAM HAVING CFET STACKS AND METHOD OF MANUFACTURING SAME | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18518151 | SRAM ARCHITECTURE FOR CONVOLUTIONAL NEURAL NETWORK APPLICATION | SIDDIQUE, MUSHFIQUE | 2825 | §112 | Final Rejection | — | Pending | Nov 22, 2023 |
| 18517078 | Defect Monitor | ANDREWS, BRENT J | 2858 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18515503 | METHOD OF DESIGNING SEMICONDUCTOR DEVICE | DINH, PAUL | 2851 | §102 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18514410 | VIAS WITH SELECTED GRAIN DISTRIBUTION | GONDARENKO, NATALIA A | 2891 | §103 | Final Rejection | — | Pending | Nov 20, 2023 |
| 18512411 | CONDUCTOR SCHEME SELECTION AND TRACK PLANNING FOR MIXED-DIAGONAL-MANHATTAN ROUTING | AISAKA, BRYCE M | 2851 | §112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18512686 | PHOTONIC DEVICE FORMED USING SELF-ALIGNED PROCESSES | WEILAND, ADAM DAVID | 2813 | §103 | Final Rejection | — | Pending | Nov 17, 2023 |
| 18512339 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SANDVIK, BENJAMIN P | 2812 | §103§112 | Final Rejection | — | Pending | Nov 17, 2023 |
| 18511666 | PROTECTION AGAINST PLASMA INDUCED DAMAGES | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18509343 | METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD FOR CLASSIFYING SEMICONDUCTOR STRUCTURE | LI, LARRY | 2881 | §103§112 | Final Rejection | — | Pending | Nov 15, 2023 |
| 18509235 | SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18508423 | PHOTORESIST COMPOSITION | ANGEBRANNDT, MARTIN J | 1737 | §102§103§112 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18507402 | FIBER ARRAY UNIT INTEGRATED WITH LIGHT GUIDING ELEMENTS AND METHOD FOR FORMING THE SAME | TRAN, HOANG Q | 2874 | §103 | Final Rejection | 34d | Pending | Nov 13, 2023 |
| 18507100 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18506142 | NON-VOLATILE MEMERY CELL AND METHOD OF FORMING THE SAME | NGUYEN, VAN THU T | 2824 | §102 | Final Rejection | — | Pending | Nov 10, 2023 |
| 18505274 | RESISTOR-DIODE LADDER, ESD PROTECTION CIRCUIT INCLUDING SAME, SEMICONDUCTOR DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING SAME | CHA, GRACE YEH-EUN SAET | 2897 | §102§103 | Non-Final OA | — | Pending | Nov 09, 2023 |
| 18505632 | GATE ISOLATION FEATURES | KOO, LAMONT B | 2813 | §103 | Final Rejection | 10d overdue | Pending | Nov 09, 2023 |
| 18503189 | PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF | JORDAN, ANDREW | 2874 | §102§103 | Final Rejection | 29d | Pending | Nov 07, 2023 |
| 18503425 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | GREEN, TELLY D | 2898 | §103Other | Final Rejection | — | Pending | Nov 07, 2023 |
| 18502792 | INTERCONNECTION STRUCTURE | WARD, ERIC A | 2891 | §103 | Final Rejection | — | Pending | Nov 06, 2023 |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | KOO, LAMONT B | 2813 | §103 | Final Rejection | 50d overdue | Pending | Nov 06, 2023 |
| 18502377 | INTEGRATED CIRCUIT DESIGN FLOW WITH LAYOUT ADJUSTMENT | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Nov 06, 2023 |
| 18500896 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | FAN, SU JYA | 2818 | §102§103 | Final Rejection | — | Pending | Nov 02, 2023 |
| 18500878 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18385563 | ADDITIVES FOR METALLIC PHOTORESIST | EOFF, ANCA | 1722 | §102§103§112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18498369 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | WELLS, JAMES STEVEN | 2825 | §103§112 | Final Rejection | 77d overdue | Pending | Oct 31, 2023 |
| 18498305 | OXYGEN CONTROL DURING GATE FORMATION FOR IMPROVED CHANNEL MOBILITY | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | 30d | Pending | Oct 31, 2023 |
| 18498596 | NEURAL NETWORK CIRCUIT AND METHOD FOR FORMING THE SAME | KING, DOUGLAS | 2824 | §103§112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18497643 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | KAO, SOPHIA WEI-CHUN | 2817 | §102§103 | Non-Final OA | — | Pending | Oct 30, 2023 |
| 18498031 | DUMMY DIES AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 21d | Pending | Oct 30, 2023 |
| 18495411 | Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The Same | HALL, VICTORIA KATHLEEN | 2897 | §103§112 | Final Rejection | — | Pending | Oct 26, 2023 |
| 18493981 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | NGUYEN, SOPHIA T | 2893 | §102§103§112 | Final Rejection | — | Pending | Oct 25, 2023 |
| 18493768 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | LEBENTRITT, MICHAEL | 2893 | §102§103 | Final Rejection | 14d | Pending | Oct 24, 2023 |
| 18492777 | DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMING THE SAME | GOFF II, JOHN L | 1746 | §102§103 | Final Rejection | — | Pending | Oct 24, 2023 |
| 18491889 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SYLVIA, CHRISTINA A | 2817 | §102 | Non-Final OA | — | Pending | Oct 23, 2023 |
| 18492033 | IMAGE SENSING SYSTEM AND METHOD THEREOF | TRIDICO, JOHN CESARE | 3645 | §102§103 | Non-Final OA | — | Pending | Oct 23, 2023 |
| 18490081 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | LUKE, DANIEL M | 2896 | §112 | Final Rejection | 6d | Pending | Oct 19, 2023 |
| 18488659 | SEMICONDUCTOR DEVICE WITH METAL GATE STRUCTURE AND FABRICATION METHOD THEREOF | CHEN, YU | 2896 | §103 | Final Rejection | — | Pending | Oct 17, 2023 |
| 18488506 | Systems and Methods for an Internal Clock Tree Structure in a Memory Device | WELLS, JAMES STEVEN | 2825 | §102§103§112 | Non-Final OA | — | Pending | Oct 17, 2023 |
| 18488028 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MINNEY, GABRIEL SEBASTIAN | 2897 | §103 | Final Rejection | 14d | Pending | Oct 16, 2023 |
| 18487451 | SEMICONDUCTOR DEVICE WITH NON-CONFORMAL WORK FUNCTION LAYERS AND METHODS OF FABRICATION THEREOF | RIRIE, EVERETT TRAJAN | 2897 | §103 | Final Rejection | — | Pending | Oct 16, 2023 |
| 18486203 | METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Final Rejection | — | Pending | Oct 13, 2023 |
| 18379870 | PHOTORESIST MATERIAL AND METHOD FOR LITHOGRAPHY | WALKE, AMANDA C | 1722 | §102§103 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18486382 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | ISAAC, STANETTA D | 2898 | §102§103 | Final Rejection | 30d | Pending | Oct 13, 2023 |
| 18486561 | STRUCTURE AND METHOD FOR HIGH-VOLTAGE DEVICE | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18486876 | ETCH TOOL WITH SPINEL-BASED COMPOSITE MATERIAL COMPONENTS | JANSSEN, REBECCA | 1733 | §103§112 | Final Rejection | — | Pending | Oct 13, 2023 |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18484405 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | AHMED, MEHEK | 2812 | §102§103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18484051 | PHOTORESIST COMPOSITION | WALKE, AMANDA C | 1722 | §103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18376136 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Final Rejection | — | Pending | Oct 03, 2023 |
| 18480482 | ELECTROSTATIC FIELD STRENGTH MEASURING APPARATUS, DETECTING APPARATUS, METHOD OF MEASURING ELECTROSTATIC FIELD STRENGTH OF TARGET OBJECT | FREDERIKSEN, DAVID B | 2858 | §112 | Non-Final OA | — | Pending | Oct 03, 2023 |
| 18480372 | METHOD FOR MODELING CROSS DIE COUPLING CAP IMPACT | LIN, ARIC | 2851 | §102§103 | Non-Final OA | — | Pending | Oct 03, 2023 |
| 18476394 | METHODOLOGY FOR PREDICTION OF PPA DESIGN | MEMULA, SURESH | 2851 | §103 | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18476922 | STANDARD CELL SPACING QUALITY CHECKING | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | — | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18475965 | STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND BOTTOM SOURCE/DRAIN FEATURES | DINKE, BITEW A | 2812 | §103 | Final Rejection | 28d overdue | Pending | Sep 27, 2023 |
| 18474606 | THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES | NGUYEN, DAO H | 2818 | §103 | Final Rejection | 46d | Pending | Sep 26, 2023 |
| 18473706 | PHOTOSENSOR HAVING GATE-ALL-AROUND STRUCTURE AND METHOD FOR FORMING THE PHOTOSENSOR | NARAGHI, ALI | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 25, 2023 |
| 18472267 | SEMICONDUCTOR PROCESSING APPARATUS FOR GENERATING PLASMA | ALEJANDRO MULERO, LUZ L | 1716 | §102§103§112 | Non-Final OA | — | Pending | Sep 22, 2023 |
| 18472862 | MEMORY DEVICE WITH TWISTED BIT LINES AND METHODS OF MANUFACTURING THE SAME | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | — | Pending | Sep 22, 2023 |
| 18371577 | RADIO FREQUENCY INDUCTOR | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | 20d | Pending | Sep 22, 2023 |
| 18473185 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SMITH, SAMUEL JONATHAN | 2817 | §103 | Non-Final OA | 62d | Pending | Sep 22, 2023 |
| 18472695 | Corner Reinforcement Structure for Package Interconnect | AHMADI, MOHSEN | 2896 | §103§112 | Final Rejection | — | Pending | Sep 22, 2023 |
| 18470614 | Semiconductor Device Having FIN Structure and Method of Forming Thereof | BODNAR, JOHN A | 2893 | §103 | Final Rejection | 79d | Pending | Sep 20, 2023 |
| 18469094 | SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A HYDROGEN ABSORPTION LAYER | ADROVEL, WILLIAM | 2898 | §102§103 | Final Rejection | — | Pending | Sep 18, 2023 |
| 18469014 | THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES | SEHAR, FAKEHA | 2893 | §103§112 | Final Rejection | — | Pending | Sep 18, 2023 |
| 18369099 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | NADAV, ORI | 2811 | §103§112 | Non-Final OA | 30d | Pending | Sep 15, 2023 |
| 18467979 | INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | — | Pending | Sep 15, 2023 |
| 18467412 | METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103 | Final Rejection | 33d | Pending | Sep 14, 2023 |
| 18368387 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | GOODLING, DEVIN KIRK | 2898 | §103§112 | Final Rejection | — | Pending | Sep 14, 2023 |
| 18467684 | SEMICONDUCTOR DEVICE, RESISTIVE DEVICE, AND METHOD OF OBTAINING ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR DEVICE | ARORA, AJAY | 2892 | §102 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18367605 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | — | Pending | Sep 13, 2023 |
| 18466004 | MAGNETIC TUNNEL JUNCTION (MTJ) STRUCTURE AND MEMORY CELL | SPRENGER, JAIME LYNN | 2893 | §103 | Final Rejection | 13d | Pending | Sep 13, 2023 |
| 18464815 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | TRAN, THANH Y | 2817 | §102 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18464508 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | CHA, GRACE YEH-EUN SAET | 2897 | §103 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18464839 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | ENAD, CHRISTINE A | 2811 | §102§103 | Final Rejection | 62d | Pending | Sep 11, 2023 |
| 18244040 | METHODS FOR FORMING GATE OXIDE LAYER FOR HIGH-VOLTAGE TRANSISTOR | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | — | Pending | Sep 08, 2023 |
| 18463062 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | NGUYEN, DAO H | 2818 | §102§103§112 | Final Rejection | — | Pending | Sep 07, 2023 |
| 18461538 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §102§103§112 | Final Rejection | 27d | Pending | Sep 06, 2023 |
| 18461328 | INTERCONNECTION STRUCTURE | KUSUMAKAR, KAREN M | 2897 | §102§103 | Non-Final OA | — | Pending | Sep 05, 2023 |
| 18460594 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Final Rejection | 28d | Pending | Sep 04, 2023 |
| 18240843 | Semiconductor Structures with Compact Copper Conductive Features | CHAU, LISA N | — | §102§103 | Non-Final OA | — | Pending | Aug 31, 2023 |
| 18459089 | STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND DIE LEVEL BONDING PACKAGES | KIELIN, ERIK J | 2814 | §103§112 | Final Rejection | — | Pending | Aug 31, 2023 |
| 18239999 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF | RAMIREZ, ALEXANDRE XAVIER | 2812 | §103§112 | Non-Final OA | 83d | Pending | Aug 30, 2023 |
| 18240033 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MILLER, ALEXANDER MICHAEL | 2898 | §102§103 | Final Rejection | 27d | Pending | Aug 30, 2023 |
| 18455211 | REDUCED RESIDUE AT ETCHED STRUCTURE SIDEWALLS | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | — | Pending | Aug 24, 2023 |
| 18454128 | SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME | PHAM, THANHHA S | 2812 | §102§103§112 | Final Rejection | — | Pending | Aug 23, 2023 |
| 18451263 | SEMICONDUCTOR STRUCTURE | ZARNEKE, DAVID A | 2891 | §102§103 | Final Rejection | 22d | Pending | Aug 17, 2023 |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | CHAN, CANDICE | 2813 | §102§103§112 | Non-Final OA | 42d overdue | Pending | Aug 15, 2023 |
| 18450358 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 28d | Pending | Aug 15, 2023 |
| 18447826 | ONE-TIME PROGRAMMABLE MEMORY BIT CELL COMPRISING TWO OR MORE ANTIFUSE MEMORY CELLS | NGUYEN, VAN THU T | 2824 | §103 | Final Rejection | — | Pending | Aug 10, 2023 |
| 18447568 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | LEE, ALEXANDER N | 1737 | §103§112 | Non-Final OA | 69d | Pending | Aug 10, 2023 |
| 18232580 | MEMORY DEVICES WITH PARTIALLY MISALIGNED GAP LOCATIONS AND METHODS OF MANUFACTURING THEREOF | WOLDEGEORGIS, ERMIAS T | 2893 | §103§112 | Non-Final OA | 27d | Pending | Aug 10, 2023 |
| 18447580 | MULTI-SILICIDE STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME | PARIHAR, SUCHIN | 2851 | §102 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18448101 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447964 | METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447750 | SEMICONDUCTOR DEVICE HAVING NANOSHEETS | HOANG, TUAN A | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447340 | TRANSFER FIN FIELD EFFECT TRANSISTOR (finFET) OF A PIXEL SENSOR HAVING A PLURALITY OF CHANNEL FINS COUPLING THE N-TYPE REGION OF A PHOTODIODE TO AN EXTENSION REGION OF FLOATING DIFFUSION (FD) | MAI, ANH D | 2893 | §103§112 | Non-Final OA | 61d | Pending | Aug 10, 2023 |
| 18232758 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | PENCE, JETHRO M | 1717 | §112 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18232264 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18446563 | STRUCTURE AND METHOD FOR MRAM DEVICES | HRNJIC, ADIN | 2817 | §103§112 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18447125 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18446549 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | HALL, VICTORIA KATHLEEN | 2897 | §112 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18446413 | PACKAGE STRUCTURE HAVING DAM STRUCTURE | BOYLE, ABBIGALE A | 2899 | §102§103 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | TURNER, BRIAN | 2818 | §102§103§112 | Final Rejection | 15d | Pending | Aug 08, 2023 |
| 18446424 | EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | §103 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18366776 | REDUCED CROSS-TALK IN COLOR AND INFRARED IMAGE SENSOR | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18231540 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18366937 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | STEPHENSON, KENNETH STEPHEN | 2898 | §102 | Final Rejection | 8d | Pending | Aug 08, 2023 |
| 18366175 | PIXEL SENSOR INCLUDING REFRACTION STRUCTURES | NARAGHI, ALI | 2817 | §103 | Final Rejection | 12d | Pending | Aug 07, 2023 |
| 18366531 | Dopant Concentration Boost in Epitaxially Formed Material | ISAAC, STANETTA D | 2898 | §102§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18365234 | SEMICONDUCTOR PACKAGE | SMITH, CHAD | 2874 | §102§103 | Final Rejection | — | Pending | Aug 04, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | 28d | Pending | Aug 01, 2023 |
| 18362213 | MASK-FREE PROCESS FOR IMPROVING DRAIN TO GATE BREAKDOWN VOLTAGE IN SEMICONDUCTOR DEVICES | GUPTA, RAJ R | 2893 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18361816 | METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE | TRAN, PABLO N | 2643 | §112Other | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18360853 | EXTREME ULTRAVIOLET LITHOGRAPHY METHOD AND EUV PHOTOMASK | FRASER, STEWART A | 1724 | §102§103 | Final Rejection | — | Pending | Jul 28, 2023 |
| 18227731 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | ENAD, CHRISTINE A | 2811 | DP | Final Rejection | — | Pending | Jul 28, 2023 |
| 18360178 | SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 5d | Pending | Jul 27, 2023 |
| 18226849 | Methods and Structure for Shielding Semiconductors From Ultraviolet Light | WALL, VINCENT | 2898 | §103 | Non-Final OA | 35d overdue | Pending | Jul 27, 2023 |
| 18359128 | INTEGRATED CIRCUIT DESIGN METHOD AND SYSTEM | NGUYEN, NHA T | 2851 | §103 | Final Rejection | — | Pending | Jul 26, 2023 |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | LUKE, DANIEL M | 2896 | §103 | Non-Final OA | 5d | Pending | Jul 25, 2023 |
| 18358522 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | KOO, LAMONT B | 2813 | §103 | Final Rejection | 61d | Pending | Jul 25, 2023 |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 46d overdue | Pending | Jul 25, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18224065 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | TRAN, TRANG Q | 2811 | §103§112 | Non-Final OA | — | Pending | Jul 20, 2023 |
| 18354603 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | MOVVA, AMAR | 2800 | §103 | Final Rejection | — | Pending | Jul 18, 2023 |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | BERRY, PAUL ANTHONY | 2898 | §103 | Final Rejection | 37d overdue | Pending | Jul 14, 2023 |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 10, 2023 |
| 18348741 | ELECTROSTATIC DISCHARGE IN GALLIUM NITRIDE DEVICES | PARK, SAMUEL | 2818 | §103 | Final Rejection | — | Pending | Jul 07, 2023 |
| 18348343 | NOVEL STORAGE GATE FINFET FOR NON-VOLATILE MEMORY | BRADFORD, PETER | 2897 | §102§103 | Final Rejection | 38d overdue | Pending | Jul 06, 2023 |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Jul 06, 2023 |
| 18346959 | CONDUCTIVE CONTACT OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | — | Pending | Jul 05, 2023 |
| 18347329 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | MIHALIOV, DMITRI | 2812 | §103 | Final Rejection | 40d | Pending | Jul 05, 2023 |
| 18346544 | MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | 14d | Pending | Jul 03, 2023 |
| 18346772 | SEMICONDUCTOR DEVICE HAVING LOW-RESISTANCE GATE CONNECTOR | NARAGHI, ALI | 2817 | §103 | Final Rejection | 3d overdue | Pending | Jul 03, 2023 |
| 18346267 | METHOD AND SYSTEM OF ARRANGING PATTERNS OF SEMICONDUCTOR DEVICE | REAMES, MATTHEW L | 1737 | §102§112Other | Non-Final OA | — | Pending | Jul 02, 2023 |
| 18346219 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | RAHMAN, MOIN M | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 01, 2023 |
| 18344860 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | CHUNG, ANDREW | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18345988 | SEMICONDUCTOR DEVICE HAVING DIELECTRIC GATE ISOLATION SECTION | HOSSAIN, MOAZZAM | 2800 | §102§103 | Final Rejection | 45d overdue | Pending | Jun 30, 2023 |
| 18216829 | METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCANNING | JANG, BO BIN | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18344857 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | GOODWIN, DAVID J | 2817 | §102Other | Final Rejection | 1d overdue | Pending | Jun 30, 2023 |
| 18338715 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | 4d overdue | Pending | Jun 21, 2023 |
| 18338673 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | NARAGHI, ALI | 2817 | §103 | Final Rejection | 70d | Pending | Jun 21, 2023 |
| 18338381 | DIELECTRIC WAVEGUIDE FOR TRANSMITTING ELECTRICAL SIGNAL AND METHOD OF FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jun 21, 2023 |
| 18337267 | STACKED TRANSISTORS IN MEMORY CIRCUIT AND METHOD OF OPERATING SAME | BERMUDEZ LOZADA, ALFREDO | 2825 | §103 | Final Rejection | 46d overdue | Pending | Jun 19, 2023 |
| 18336435 | PACKAGE STRUCTURE WITH DUMMY DIE | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 63d | Pending | Jun 16, 2023 |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | 15d | Pending | Jun 15, 2023 |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | FERNANDES, ERROL V | 2893 | §102 | Final Rejection | 26d | Pending | Jun 12, 2023 |
| 18329271 | PROTECTIVE PACKAGE ASSEMBLY | SPICER, JENINE MARIE | 3736 | §103 | Final Rejection | — | Pending | Jun 05, 2023 |
| 18329063 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | CHEEK, EDWARD RHETT | 2813 | §103 | Non-Final OA | 61d | Pending | Jun 05, 2023 |
| 18327082 | SEMICONDUCTOR DEVICES | SIPLING, KENNETH MARK | 2818 | §103 | Non-Final OA | — | Pending | Jun 01, 2023 |
| 18327590 | PLASMA PROCESSING APPARATUS AND METHOD | MCDONALD, RODNEY GLENN | 1794 | §102§103 | Non-Final OA | — | Pending | Jun 01, 2023 |
| 18325699 | OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | 28d | Pending | May 30, 2023 |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | GRAHAM, KRETELIA | 2817 | §103 | Final Rejection | 15d overdue | Pending | May 29, 2023 |
| 18323483 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | SMITH, CHAD | 2874 | §102§103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | §102§103 | Non-Final OA | 53d overdue | Pending | May 24, 2023 |
| 18321844 | METHOD FOR PERFORMING TRENCH ISOLATION PROCESS | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | May 23, 2023 |
| 18322045 | ELECTRONIC DEVICE | YAP, DOUGLAS ANTHONY | 2899 | §103 | Non-Final OA | — | Pending | May 23, 2023 |
| 18200939 | SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD | WITTENBERG, STEFANIE S | 1795 | §103 | Final Rejection | — | Pending | May 23, 2023 |
| 18321268 | PIEZOELECTRIC DEVICE HAVING PIEZOELECTRIC STRUCTURE DISPOSED BETWEEN PATTERNED CONDUCTIVE STRUCTURES | NGUYEN, DONGHAI D | 2837 | §102§103 | Non-Final OA | — | Pending | May 22, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | May 22, 2023 |
| 18320219 | PLASMA ETCHING SYSTEM HAVING FOCUS RING WITH PROLONGED LIFETIME | CHEN, KEATH T | 1716 | §103 | Non-Final OA | — | Pending | May 19, 2023 |
| 18320398 | PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | May 19, 2023 |
| 18197968 | FINFET DEVICE STRUCTURE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 82d | Pending | May 16, 2023 |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | CHEN, JACK S J | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 12, 2023 |
| 18314968 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | SALAZ, SAMMANTHA KATELYN | 2892 | §102§103 | Final Rejection | 3d overdue | Pending | May 10, 2023 |
| 18311243 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | PIZARRO CRESPO, MARCOS D | 2814 | §102§103 | Non-Final OA | — | Pending | May 03, 2023 |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | LE, THAO P | 2818 | §103 | Non-Final OA | 34d | Pending | Apr 28, 2023 |
| 18308117 | METHOD FOR METAL PATTERNING | VALENZUELA, PATRICIA D | 2815 | §103 | Non-Final OA | — | Pending | Apr 27, 2023 |
| 18307002 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | ANDERSON, WILLIAM H | 2817 | §103 | Non-Final OA | — | Pending | Apr 25, 2023 |
| 18305514 | SEMICONDUCTOR DEVICE STRUCTURE WITH EXPANSION FILM AND METHOD FOR FORMING THE SAME | HOANG, TUAN A | 2898 | §102§103 | Non-Final OA | — | Pending | Apr 24, 2023 |
| 18304350 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Apr 21, 2023 |
| 18303822 | ISOLATION OF ADJACENT STRUCTURES | MUNOZ, ANDRES F | 2818 | §102§103§112 | Non-Final OA | — | Pending | Apr 20, 2023 |
| 18303551 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18302972 | OPTICAL DIGITAL-TO-ANALOG CONVERTER | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18302154 | Energy-Efficient Recurrent Neural Network Accelerator | KHAN, SHAHID K | 2146 | §101§103 | Final Rejection | 15d | Pending | Apr 18, 2023 |
| 18300513 | METAL ISOLATION TESTING IN THE CONTEXT OF MEMORY CELLS | PARIHAR, SUCHIN | 2851 | §112 | Non-Final OA | — | Pending | Apr 14, 2023 |
| 18298277 | Isolation Structures in Semiconductor Devices | KOO, LAMONT B | 2813 | §103 | Final Rejection | — | Pending | Apr 10, 2023 |
| 18131562 | CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING | COMLEY, ALEXANDER BRYANT | 3746 | §102§103 | Final Rejection | — | Pending | Apr 06, 2023 |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | GREEN, TELLY D | 2898 | §102Other | Non-Final OA | 29d | Pending | Mar 20, 2023 |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 20d | Pending | Mar 17, 2023 |
| 18185232 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURE | SON, ERIKA HEERA | 2893 | §103 | Final Rejection | 34d | Pending | Mar 16, 2023 |
| 18184666 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | KOO, LAMONT B | 2813 | §103 | Final Rejection | 22d | Pending | Mar 16, 2023 |
| 18182657 | LEAKAGE CURRENT REDUCTION FOR CONTINUOUS ACTIVE REGIONS | RAHMAN, MOIN M | 2800 | §103 | Final Rejection | — | Pending | Mar 13, 2023 |
| 18182406 | WAFER POLISHING HEAD, SYSTEM THEREOF, AND METHOD USING THE SAME | CHANG, SUKWOO JAMES | 3723 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18118498 | PELLICLE AND METHOD OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103§112 | Non-Final OA | — | Pending | Mar 07, 2023 |
| 18178522 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | RONO, VINCENT KIPKEMOI | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 05, 2023 |
| 18177144 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIELIN, ERIK J | 2814 | §102§103§112 | Non-Final OA | 70d | Pending | Mar 02, 2023 |
| 18171384 | SIMULATION MODEL AUTHENTICATION | GAN, CHUEN-MEEI | 4100 | §101§103 | Non-Final OA | — | Pending | Feb 20, 2023 |
| 18170845 | Interconnect Structure for Improving Memory Performance and/or Logic Performance | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | — | Pending | Feb 17, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103§112 | Final Rejection | 8d | Pending | Feb 16, 2023 |
| 18110838 | METHOD OF MANUFACTURING PHOTO MASKS | COSGROVE, JAYSON D | 1737 | §103 | Non-Final OA | — | Pending | Feb 16, 2023 |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | PATEL, REEMA | 2812 | §112 | Final Rejection | 21d | Pending | Feb 15, 2023 |
| 18169579 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Non-Final OA | — | Pending | Feb 15, 2023 |
| 18169594 | VOLTAGE SUPPLY SELECTION CIRCUIT AND METHODS FOR OPERATING THE SAME | ALMO, KHAREEM E | 2836 | §103 | Final Rejection | — | Pending | Feb 15, 2023 |
| 18109116 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | PETERSON, ERIK T | 2898 | §103 | Non-Final OA | — | Pending | Feb 13, 2023 |
| 18167081 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | — | Pending | Feb 10, 2023 |
| 18107658 | MULTICHANNEL TRANSISTORS WITH SOURCE/DRAIN REGIONS HAVING WAVY INNER PROFILES AND METHODS FOR MANUFACTURING THEREOF | DUREN, TIMOTHY EDWARD | 2817 | §103 | Non-Final OA | — | Pending | Feb 09, 2023 |
| 18166109 | METHODS FOR FORMING SEMICONDUCTOR PACKAGE | DAS, PINAKI | 2898 | §103 | Non-Final OA | — | Pending | Feb 08, 2023 |
| 18165669 | ETCHING PROCESS WITH PROTECTED REGION | MCCUTCHEON, COLIN RUSSELL | 2892 | §102§103 | Non-Final OA | — | Pending | Feb 07, 2023 |
| 18163878 | COMPUTING CIRCUIT, COMPUTING METHOD, AND DECODER | DE LA GARZA, CARLOS HEBERTO | 2182 | §103§112 | Non-Final OA | — | Pending | Feb 03, 2023 |
| 18162714 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Feb 01, 2023 |
| 18099951 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103§112 | Final Rejection | 34d | Pending | Jan 22, 2023 |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Non-Final OA | 3d overdue | Pending | Jan 20, 2023 |
| 18157252 | DATA COMPUTATION CIRCUIT AND METHOD | GUDAS, JAKOB OSCAR | 2151 | §101§102§103 | Non-Final OA | — | Pending | Jan 20, 2023 |
| 18099348 | SEMICONDUCTOR DEVICE | LASASSO, VICTOR JOSEPH | 2898 | §103§112 | Final Rejection | 21d | Pending | Jan 20, 2023 |
| 18099405 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | HOANG, TUAN A | 2898 | §103 | Non-Final OA | 69d | Pending | Jan 20, 2023 |
| 18099097 | SEMICONDUCTOR MANUFACTURING METHOD | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | 30d | Pending | Jan 19, 2023 |
| 18156414 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | PIZARRO CRESPO, MARCOS D | 2814 | §102§103 | Non-Final OA | 4d overdue | Pending | Jan 19, 2023 |
| 18156847 | SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION | MUNOZ, ANDRES F | 2818 | §112 | Non-Final OA | — | Pending | Jan 19, 2023 |
| 18153700 | GATE PROFILE TUNING FOR MULTIGATE DEVICE | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18152938 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | RONO, VINCENT KIPKEMOI | 2891 | §102§103 | Final Rejection | — | Pending | Jan 11, 2023 |
| 18152157 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Jan 10, 2023 |
| 18150810 | COMPUTATION METHOD AND COMPUTATION APPARATUS WITH INPUT SWAPPING | WAJE, CARLO C | 2151 | §101§112 | Non-Final OA | — | Pending | Jan 06, 2023 |
| 18151141 | SEMICONDUCTOR DEVICE INCLUDING A BLOCKING LAYER | WALL, VINCENT | 2898 | §103 | Final Rejection | 60d | Pending | Jan 06, 2023 |
| 18150617 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELECTRICAL BREAKDOWN PERFORMANCE, AND METHOD FOR MANUFACTURING THE SAME | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18150362 | PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Final Rejection | 76d | Pending | Jan 05, 2023 |
| 18150027 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | §103 | Final Rejection | 7d | Pending | Jan 04, 2023 |
| 18149215 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | 45d overdue | Pending | Jan 03, 2023 |
| 17899865 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THEREOF | BERRY, PAUL ANTHONY | 2898 | §103§112 | Non-Final OA | — | Pending | Aug 31, 2022 |
| 17897196 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | — | Pending | Aug 28, 2022 |
| 17896081 | MEMORY DEVICE AND METHOD OF MAKING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | 42d overdue | Pending | Aug 26, 2022 |
| 17896093 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 35d overdue | Pending | Aug 26, 2022 |
| 17894169 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Aug 24, 2022 |
| 17890571 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | BOULGHASSOUL, YOUNES | 2814 | §112 | Non-Final OA | — | Pending | Aug 18, 2022 |
| 17890883 | Defect Reduction Through Scheme Of Conductive Pad Layer And Capping Layer | AUTORE JR, MARIO ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Aug 18, 2022 |
| 17819982 | SYSTEM FOR PROCESSING SEMICONDUCTOR DEVICE, METHOD FOR FORMING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROTECTIVE STRUCTURE ON CHAMBER | TALBOT, BRIAN K | 1712 | §103 | Non-Final OA | — | Pending | Aug 16, 2022 |
| 17887490 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Aug 14, 2022 |
| 17887499 | A Semiconductor Package Comprising An Underfill Material That Extends to, And is Coplanar With, A Bottom Surface Of An Electrical Device | MIHALIOV, DMITRI | 2812 | §103 | Non-Final OA | — | Pending | Aug 14, 2022 |
| 17819482 | POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17887122 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | KIELIN, ERIK J | 2814 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17886053 | INSPECTION METHOD FOR PELLICLE MEMBRANE OF LITHOGRAPHY SYSTEM | FABIAN JR, ROBERTO | 2877 | §103 | Non-Final OA | 63d | Pending | Aug 11, 2022 |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | 22d | Pending | Aug 11, 2022 |
| 17818369 | PHOTOMASK AND METHOD OF MANUFACTURING THE SAME | CLEVELAND, MICHAEL B | 1737 | §103 | Non-Final OA | — | Pending | Aug 09, 2022 |
| 17882047 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | NELSON, HUNTER JARED | 2828 | §103 | Non-Final OA | 11d overdue | Pending | Aug 05, 2022 |
| 17880676 | TARGET MATERIAL IDENTIFICATION METHOD | FRITCHMAN, REBECCA M | 1758 | §103 | Final Rejection | 4d overdue | Pending | Aug 04, 2022 |
| 17817249 | SEMICONDUCTOR DEVICE WITH POLYGONAL PROFILES FROM THE TOP VIEW AND METHOD FOR FORMING THE SAME | OH, JIYOUNG | 2818 | §103§112 | Non-Final OA | — | Pending | Aug 03, 2022 |
| 17817025 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ADHIKARI DAWADI, BIPANA | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 03, 2022 |
| 17880019 | EXTREME ULTRAVIOLET MASK WITH DIFFUSION BARRIER LAYER | CLEVELAND, MICHAEL B | 1700 | §102§103 | Final Rejection | — | Pending | Aug 03, 2022 |
| 17876737 | DEVICE WITH TAPERED INSULATION STRUCTURE AND RELATED METHODS | ASHBAHIAN, ERIC K | 2891 | §102§103 | Final Rejection | 42d overdue | Pending | Jul 29, 2022 |
| 17873170 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §103 | Final Rejection | — | Pending | Jul 26, 2022 |
| 17873146 | FLUIDIC CARTRIDGE MODULE, BIOSENSOR DEVICE, METHOD OF DETECTING ANALYTE IN SAMPLE | HERBERT, MADISON TAYLOR | 1758 | §102§103§112 | Non-Final OA | 9d overdue | Pending | Jul 26, 2022 |
| 17873060 | 3D SEMICONDUCTOR PACKAGE | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2022 |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | ISAAC, STANETTA D | 2898 | §103 | Final Rejection | 27d | Pending | Jul 24, 2022 |
| 17814382 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | HENRY, CALEB E | 2818 | §102 | Non-Final OA | — | Pending | Jul 22, 2022 |
| 17870770 | FIELD EFFECT TRANSISTOR WITH ISOLATION STRUCTURE AND METHOD | DAS, PINAKI | 2898 | §102 | Non-Final OA | — | Pending | Jul 21, 2022 |
| 17813212 | MULTIPLE NON-ACTIVE DIES IN A MULTI-DIE PACKAGE | KOLB, THADDEUS J | 2817 | §103§112 | Final Rejection | — | Pending | Jul 18, 2022 |
| 17866924 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | LIN, JOHN | 2815 | §103§112 | Final Rejection | — | Pending | Jul 18, 2022 |
| 17866532 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | §102§103 | Final Rejection | 34d | Pending | Jul 17, 2022 |
| 17862422 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | §103§112 | Final Rejection | 2d overdue | Pending | Jul 12, 2022 |
| 17811876 | THIN FILM DEPOSITION WITH IMPROVED CONTROL OF PRECURSOR | MOORE, KARLA A | 1716 | §102§103§112 | Non-Final OA | — | Pending | Jul 11, 2022 |
| 17862372 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | TAN, DAVE | 2897 | §103 | Final Rejection | — | Pending | Jul 11, 2022 |
| 17861234 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | CRAWFORD EASON, LATANYA N | 2813 | §103§112 | Final Rejection | 17d overdue | Pending | Jul 10, 2022 |
| 17858971 | SEMICONDUCTOR PACKAGE WITH INTEGRATED CIRCUIT CHIP COUPLERS | OH, JIYOUNG | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17810626 | PACKAGE STRUCTURE WITH FAN-OUT STRUCTURE | BELL, LAUREN R | 2896 | §103 | Final Rejection | 6d | Pending | Jul 04, 2022 |
| 17855550 | EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY | LOGIE, MICHAEL J | 2881 | §103§112 | Non-Final OA | 27d | Pending | Jun 30, 2022 |
| 17854388 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH DEEP CONTACT STRUCTURE | LOKE, STEVEN HO YIN | 2800 | §103 | Final Rejection | — | Pending | Jun 30, 2022 |
| 17852768 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | HUNTER III, CARNELL | 2893 | §103 | Final Rejection | — | Pending | Jun 29, 2022 |
| 17853543 | SEMICONDUCTOR STRUCTURE HAVING CONTACT PLUG | ZHU, SHENG-BAI | 2897 | §103§112 | Final Rejection | 22d overdue | Pending | Jun 29, 2022 |
| 17809432 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING | ANGUIANO, MICHAEL | 2899 | §103 | Non-Final OA | — | Pending | Jun 28, 2022 |
| 17851569 | SEMICONDUCTOR DEVICE INCLUDING ANTI-FUSE CELL STRUCTURE | SENGDARA, VONGSAVANH | 2893 | §103 | Final Rejection | 53d overdue | Pending | Jun 28, 2022 |
| 17850734 | STACKED IMAGE SENSORS AND METHODS OF MANUFACTURING THEREOF | FLECK, LINDA JOAN | 2812 | §103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17809099 | HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | XU, ZHIJUN | 2818 | §103 | Final Rejection | 27d | Pending | Jun 27, 2022 |
| 17838253 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Final Rejection | 72d | Pending | Jun 12, 2022 |
| 17837664 | GRAPHENE-CLAD METAL INTERCONNECT | CHEN, DAVID Z | 2815 | §103§112 | Final Rejection | 34d | Pending | Jun 10, 2022 |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | REIDA, MOLLY KAY | 2899 | §103 | Non-Final OA | 8d overdue | Pending | Jun 06, 2022 |
| 17833439 | Semiconductor Device Simulation Platform | ALAWDI, ANWER AHMED | 2851 | §103 | Non-Final OA | — | Pending | Jun 06, 2022 |
| 17832696 | SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING | ZAWORSKI, JONATHAN R | 3723 | §103§112 | Final Rejection | 55d | Pending | Jun 06, 2022 |
| 17833440 | BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS | MARIN, JACOB RAUL | 2818 | §103 | Final Rejection | — | Pending | Jun 06, 2022 |
| 17832443 | Passive Device Structure | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Final Rejection | — | Pending | Jun 03, 2022 |
| 17805109 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | KHALIFA, MOATAZ | 2817 | §102§103 | Non-Final OA | — | Pending | Jun 02, 2022 |
| 17825411 | SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME | KHALIFA, MOATAZ | 2817 | §103 | Final Rejection | 27d | Pending | May 26, 2022 |
| 17825698 | SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING | XU, ZHIJUN | 2818 | §103 | Final Rejection | — | Pending | May 26, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | SON, ERIKA HEERA | 2893 | §103§112 | Non-Final OA | 18d overdue | Pending | May 23, 2022 |
| 17744585 | INSULATED-GATE BIPOLAR TRANSISTOR (IGBT) DEVICE WITH 3D ISOLATION | NADAV, ORI | 2811 | §103 | Non-Final OA | — | Pending | May 13, 2022 |
| 17663108 | PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | 78d overdue | Pending | May 12, 2022 |
| 17740367 | MULTI-CHIPLET ENERGY-EFFICIENT DNN ACCELERATOR ARCHITECTURE | HALES, BRIAN J | 2125 | §101§103§112 | Final Rejection | — | Pending | May 10, 2022 |
| 17736772 | MANUFACTURING METHOD OF EUV PHOTO MASKS | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | May 04, 2022 |
| 17730217 | SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | BOYLE, ABBIGALE A | 2899 | §103 | Non-Final OA | 40d | Pending | Apr 27, 2022 |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | GOODWIN, DAVID J | 2817 | §102 | Non-Final OA | 24d overdue | Pending | Apr 26, 2022 |
| 17726705 | Metal Interconnects And Method Of Forming The Same | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | 8d overdue | Pending | Apr 22, 2022 |
| 17726036 | PHOTORESIST COMPOSITION WITH NOVEL SOLVENT | CHU, JOHN S Y | 1737 | §103§112 | Final Rejection | — | Pending | Apr 21, 2022 |
| 17726494 | FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Apr 21, 2022 |
| 17725439 | METHOD FOR FORMING CONDUCTIVE FEATURE | NETTLES, CORALIE ANN | 2893 | §103§112 | Non-Final OA | — | Pending | Apr 20, 2022 |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | FORD, NATHAN K | 1716 | §103 | Final Rejection | 10d overdue | Pending | Apr 18, 2022 |
| 17722386 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | NGUYEN, SOPHIA T | 2893 | §103§112 | Non-Final OA | — | Pending | Apr 18, 2022 |
| 17721814 | NEUROMORPHIC FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICE WITH ANTI-FERROELECTRIC BUFFER LAYER | SMITH, BRADLEY | 2817 | §112 | Final Rejection | — | Pending | Apr 15, 2022 |
| 17721723 | Semiconductor Structure And Method For Forming The Same | FOX, BRANDON C | 2818 | §103 | Final Rejection | 28d | Pending | Apr 15, 2022 |
| 17720935 | COMPUTE-IN MEMORY (CIM) DEVICE AND COMPUTING METHOD THEREOF | BUI, KENNY KIM | 2182 | §103§112 | Final Rejection | — | Pending | Apr 14, 2022 |
| 17721345 | ELECTRONIC APPARATUS, SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF | LANDAU, MATTHEW C | 2800 | §103 | Non-Final OA | — | Pending | Apr 14, 2022 |
| 17710218 | METHOD FOR LITHOGRAPHY USING MIDDLE LAYER WITH POROUS TOP SURFACE | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Mar 31, 2022 |
| 17697822 | EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | §103 | Final Rejection | 23d | Pending | Mar 17, 2022 |
| 17691359 | SEMICONDUCTOR DEVICE STRUCTURE WITH GLUE LAYER AND METHOD FOR FORMING THE SAME | RONO, VINCENT KIPKEMOI | 2891 | §103 | Final Rejection | — | Pending | Mar 10, 2022 |
| 17688647 | FORMATION METHOD OF CHIP PACKAGE | CHEN, YU | 2896 | §103§112 | Final Rejection | 26d | Pending | Mar 07, 2022 |
| 17685584 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | 28d | Pending | Mar 03, 2022 |
| 17679463 | SURFACE TREATMENT TO PHOTOSENSITIVE LAYER | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Feb 24, 2022 |
| 17674569 | METHOD OF CHEMICAL MECHANICAL POLISH OPERATION AND CHEMICAL MECHANICAL POLISHING SYSTEM | ZAWORSKI, JONATHAN R | 3723 | §103§112 | Final Rejection | — | Pending | Feb 17, 2022 |
| 17585252 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | CRAMER, HALEE PAIGE | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 26, 2022 |
| 17584716 | MEMORY DEVICE WITH DUAL CHANNEL TRANSISTOR | BAUMAN, SCOTT E | 2815 | §103 | Non-Final OA | 3d overdue | Pending | Jan 26, 2022 |
| 17570710 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 07, 2022 |
| 17558105 | COMPUTE IN MEMORY ACCUMULATOR | WAJE, CARLO C | 2151 | §102§103 | Final Rejection | — | Pending | Dec 21, 2021 |
| 17460909 | SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME | CIESLEWICZ, ANETA B | 2893 | §103 | Non-Final OA | 12d | Pending | Aug 30, 2021 |
| 17396523 | METHOD OF GENERATING LAYOUT DIAGRAM INCLUDING DUMMY PATTERN CONVERSION AND SYSTEM OF GENERATING SAME | LIN, ARIC | 2851 | §103 | Final Rejection | — | Pending | Aug 06, 2021 |
| 17367631 | APPARATUS AND METHOD FOR SUBSTRATE HANDLING | GATES, ERIC ANDREW | 3722 | §103 | Final Rejection | 3d overdue | Pending | Jul 06, 2021 |
| 17340838 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | LEE, ALEXANDER N | 1737 | §103 | Non-Final OA | 9d | Pending | Jun 07, 2021 |
| 17340069 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Final Rejection | 5d | Pending | Jun 06, 2021 |
| 17303524 | METHOD FOR FORMING DEEP TRENCH ISOLATION IN AN IMAGING SENSOR BY SEPARATELY FORMING FIRST SET OF DEEP TRENCHES IN FIRST DIRECTION THEN FORMING SECOND SET OF DEEP TRENCHES IN SECOND DIRECTION | MAI, ANH D | 2893 | §103§112 | Non-Final OA | 28d overdue | Pending | Jun 01, 2021 |
| 17335985 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING | LI, MEIYA | 2811 | §112 | Final Rejection | 22d | Pending | Jun 01, 2021 |
| 17302880 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | LEE, ALEXANDER N | 1737 | §112 | Final Rejection | — | Pending | May 14, 2021 |
| 17321158 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | CHEN, YU | 2896 | §103§112 | Non-Final OA | — | Pending | May 14, 2021 |
| 17246496 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Apr 30, 2021 |
| 17232563 | VALVE BOX MODULE, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KLUNK, MARGARET D | 1716 | §103§112 | Non-Final OA | 17d overdue | Pending | Apr 16, 2021 |
| 17220269 | INTEGRATED CIRCUIT STRUCTURE | LIN, ARIC | 2851 | §103§112 | Non-Final OA | 58d overdue | Pending | Apr 01, 2021 |
| 17120702 | SRAM MEMORY HAVING SUBARRAYS WITH COMMON IO BLOCK | CHO, SUNG IL | 2825 | §102 | Final Rejection | — | Pending | Dec 14, 2020 |
| 17111014 | INTEGRATED CIRCUIT LAYOUT DIAGRAM SYSTEM | LIN, ARIC | 2851 | §103 | Non-Final OA | 58d overdue | Pending | Dec 03, 2020 |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 10d overdue | Pending | Nov 25, 2020 |
| 16600888 | DYNAMIC RANGE AND LINEARITY OF RESISTIVE ELEMENTS FOR ANALOG COMPUTING | RUTTEN, JAMES D | 2121 | §103§112 | Non-Final OA | — | Pending | Oct 14, 2019 |
| 16549153 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | §103§112 | Non-Final OA | — | Pending | Aug 23, 2019 |
| 19288643 | EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER | DEGRASSE, IAN ISAAC | 2818 | §103 | Final Rejection | — | Pending | Aug 01, 2025 |
| 19283688 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | §103§112DP | Non-Final OA | — | Pending | Jul 29, 2025 |
| 19267415 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING | NETTLES, CORALIE ANN | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2025 |
| 19259701 | SEMICONDUCTOR PACKAGE AND METHOD | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2025 |
| 19228490 | METHOD FOR DEPOSITING TARGET MATERIAL IN DEPOSITION CHAMBER WITH TILTABLE WORKPIECE HOLDER | CHEN, BRET P | 1718 | §112DP | Non-Final OA | — | Pending | Jun 04, 2025 |
| 19217595 | SYSTEM AND METHOD FOR DETECTING CONTAMINATION OF THIN-FILMS | AMARA, MOHAMED K | 2877 | §103§112 | Non-Final OA | — | Pending | May 23, 2025 |
| 19189538 | WAFER POSITIONING METHOD AND APPARATUS | AHMED, JAMIL | 2877 | DP | Non-Final OA | — | Pending | Apr 25, 2025 |
| 19186135 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | KO, TONY | 2878 | §102§112 | Non-Final OA | — | Pending | Apr 22, 2025 |
| 19091549 | OPTICAL SYSTEM INCLUDING OPTICAL FILTER AND CORRESPONDING METHOD | ASFAW, MESFIN T | 2882 | §102§103 | Non-Final OA | — | Pending | Mar 26, 2025 |
| 19022593 | MEMORY DEVICE INCLUDING A WORD LINE WITH PORTIONS WITH DIFFERENT SIZES IN DIFFERENT METAL LAYERS | ALROBAIE, KHAMDAN N | 2824 | DP | Non-Final OA | — | Pending | Jan 15, 2025 |
| 18981187 | METHOD AND APPARATUS FOR NOISE INJECTION FOR PUF GENERATOR CHARACTERIZATION | PATEL, HARESH N | 2496 | §103Other | Non-Final OA | — | Pending | Dec 13, 2024 |
| 18981155 | VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES | SAENZ, ALBERTO | 3723 | §103Other | Non-Final OA | — | Pending | Dec 13, 2024 |
| 18979108 | AIR CURTAIN DEVICE AND WORKPIECE PROCESSING TOOL | MYERS, GLENN F | 3652 | DP | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18973300 | Photoresist and Method | TRAN, BINH X | 1713 | §102§103Other | Non-Final OA | — | Pending | Dec 09, 2024 |
| 18952808 | HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM | JOERGER, KAITLIN S | 3655 | §103§112Other | Non-Final OA | — | Pending | Nov 19, 2024 |
| 18895019 | SEMICONDUCTOR PACKAGES AND THE MANUFACTURING PROCESSES THEREOF | NGUYEN, DAO H | 2818 | §102§103 | Non-Final OA | — | Pending | Sep 24, 2024 |
| 18885851 | FETS and Methods of Forming FETS | SANDVIK, BENJAMIN P | 2812 | DP | Non-Final OA | — | Pending | Sep 16, 2024 |
| 18826347 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH INNER SPACER | HOANG, DZUNG T | 2898 | §102§103 | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18816317 | METHOD TO ACHIEVE LOW CONTACT RESISTANCE AND THE STRUCTURES THEREOF | GONDARENKO, NATALIA A | 2891 | §102§103 | Non-Final OA | — | Pending | Aug 27, 2024 |
| 18801087 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | GREEN, TAJANAE NICOLE | 2874 | §102§103 | Non-Final OA | — | Pending | Aug 12, 2024 |
| 18790674 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | LUKE, DANIEL M | 2896 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790354 | DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMANCE OF AN ANTENNA SWITCH | ARMAND, MARC ANTHONY | 2813 | DP | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790273 | CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE | KIELIN, ERIK J | 2814 | §102§103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790326 | SEMICONDUCTOR DEVICE | SYLVIA, CHRISTINA A | 2817 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791017 | 3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS | TRINH, MINH N | 3729 | §112DP | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790119 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | SYLVIA, CHRISTINA A | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790913 | SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER | KACKAR, RAM N | 1716 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791291 | SEMICONDUCTOR DEVICE AND LAYOUT THEREOF | CAMPBELL, SHAUN M | 2893 | §102 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790296 | METHOD AND APPARATUS FOR LOGIC CELL-BASED PUF GENERATORS | KORZUCH, WILLIAM R | 2400 | §102§112Other | Non-Final OA | 7d | Pending | Jul 31, 2024 |
| 18790122 | SEMICONDUCTOR DEVICE AND METHOD | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789778 | Photonic Package and Method of Manufacture | CHIEM, DINH D | — | §103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790426 | STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE | BUI, THA-O H | 2825 | §103 | Final Rejection | 2d overdue | Pending | Jul 31, 2024 |
| 18789808 | Via for Component Electrode Connection | JONES, ERIC W | 2892 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791201 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE | EMPIE, NATHAN H | — | §101§102Other | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790277 | Ferroelectric Device and Methods of Fabrication Thereof | TAN, DAVE | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791313 | OPTICAL WAVEGUIDE TERMINATION | WONG, ERIC K | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790227 | SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY | PARK, SAMUEL | 2818 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789349 | SEMICONDUCTOR DEVICE AND METHOD | HARRISTON, WILLIAM A | 2899 | §102Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788363 | DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES | YUSHINA, GALINA G | 2811 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789042 | FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING | GONDARENKO, NATALIA A | 2891 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789176 | SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS | YI, CHANGHYUN | 2812 | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789438 | SEMICONDUCTOR PACKAGE INCLUDING CAVITY-MOUNTED DEVICE | VU, HUNG K | 2897 | §102§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789467 | MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL | YAP, DOUGLAS ANTHONY | 2899 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788881 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ISAAC, STANETTA D | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788481 | Chuck Design and Method for Wafer | NEJAD, MAHDI H | 3723 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788956 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | RAHMAN, MOHAMMAD A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789598 | SYSTEMS AND METHODS FOR WAFER BOND MONITORING | GHYKA, ALEXANDER G | 2812 | §103DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788591 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789465 | INTEGRATED CIRCUIT WITH NANOSTRUCTURE TRANSISTORS AND BOTTOM DIELECTRIC INSULATORS | RAHMAN, MOHAMMAD A | 2898 | §102§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789443 | Method of Manufacturing Semiconductor Devices Including The Steps of Removing One or More of the Nanotubes from the Stack of Nanotubes, and/or Removing Spacers that Surrounds Each of the Plurality of Nanotubes, and Forming Gate Dielectric and/or Gate Electrode to the Nanotubes | WOLDEGEORGIS, ERMIAS T | 2893 | §112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789462 | SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS | SOWARD, IDA M | 2898 | §112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789256 | GATE STRUCTURE AND METHOD | KIM, TONG-HO | — | §102§103Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788697 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18787765 | SURFACE CLEAN SYSTEM AND METHOD | PARIHAR, PRADHUMAN | 1731 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787978 | SEMICONDUCTOR DEVICE, METHOD AND TOOL OF MANUFACTURE | TRINH, MINH N | 3729 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787212 | PACKAGE STRUCTURE AND METHOD | BRASFIELD, QUINTON A | 2814 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786886 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | 2898 | §103DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787208 | CONTACT PLUG | JEFFERSON, QUOVAUNDA | 2899 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786787 | PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | PENG, CHARLIE YU | 2874 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786724 | Conductive Features with Air Spacer and Method of Forming Same | CRAWFORD EASON, LATANYA N | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786873 | SEMICONDUCTOR DEVICE AND METHOD | CHANG, JAY C | — | §112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787131 | DEPOSITION WINDOW ENLARGEMENT | JEFFERSON, QUOVAUNDA | 2899 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786693 | Interconnect Structure of Semiconductor Device and Method of Forming Same | BOEGEL, CHEVY JACOB | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786808 | SOURCE/DRAIN REGIONS OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | MULERO FLORES, ERIC MANUEL | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787399 | PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND METHODS OF FORMING THE SAME | KIM, TONG-HO | — | Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787915 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | KLUNK, MARGARET D | 1716 | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786711 | PACKAGE AND METHOD OF FORMING SAME | CONNELLY, MICHELLE R | 2874 | §102§103Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787838 | BACKSIDE POWER RAIL AND METHODS OF FORMING THE SAME | YI, CHANGHYUN | 2812 | §112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787736 | LITHOGRAPHY THERMAL CONTROL | CHANG, HANWAY | 2878 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787996 | FIELD EFFECT TRANSISTOR AND METHOD | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787277 | SEMICONDUCTOR DEVICE WITH TUNABLE EPITAXY STRUCTURES AND METHOD OF FORMING THE SAME | DAS, PINAKI | 2898 | §102§103§112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787531 | Semiconductor Devices and Methods | YI, CHANGHYUN | 2812 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787005 | POST-FORMATION MENDS OF DIELECTRIC FEATURES | SPALLA, DAVID C | 2893 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786939 | ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME | GUMEDZOE, PENIEL M | 2899 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786788 | INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME | MANDALA, MICHELLE | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786531 | GATE STRUCTURES IN TRANSISTORS AND METHOD OF FORMING SAME | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786525 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | NGUYEN, SOPHIA T | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786524 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | SON, ERIKA HEERA | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786529 | SEMICONDUCTOR DEVICE HAVING A MULTILAYER SOURCE/DRAIN REGION AND METHODS OF MANUFACTURE | LOHAKARE, PRATIKSHA JAYANT | 2818 | §103DP | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786532 | Nanostructure Field-Effect Transistor Device and Method of Forming | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786485 | Semiconductor Package and Method of Manufacturing The Same | CHANG, JAY C | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786465 | Semiconductor Device and Method of Forming the Same | CHEEK, EDWARD RHETT | 2813 | §103 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786469 | Electroless Plating Method for Metal Gate Fill | KIM, TONG-HO | — | Other | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786482 | PACKAGE AND METHOD OF FABRICATING THE SAME | TRAN, TRANG Q | 2811 | §102§112 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786276 | EMBEDDED BACKSIDE PCRAM DEVICE STRUCTURE | KING, DOUGLAS | 2824 | §103§112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785512 | GATE STRUCTURE AND METHOD | KIM, TONG-HO | 2811 | §102Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785410 | Dummy Fin Structures and Methods of Forming Same | NGUYEN, NIKI HOANG | 2818 | DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785596 | SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING STRUCTURES | RAHMAN, MOHAMMAD A | 2898 | §102§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785335 | DIE ON DIE BONDING STRUCTURE | JEAN BAPTISTE, WILNER | 2899 | Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785934 | Spacers for Semiconductor Devices Including Backside Power Rails | PARKER, JOHN M | 2899 | DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785430 | ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE | TYNES JR., LAWRENCE C | 2899 | §112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785172 | RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785053 | Semiconductor Devices and Methods of Manufacture | VU, VU A | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785067 | BONDING SYSTEM AND METHOD FOR USING THE SAME | WRIGHT, ALEXANDER SCOTT | 1745 | §103§112 | Final Rejection | 40d | Pending | Jul 26, 2024 |
| 18785842 | INTEGRATED CIRCUIT DEVICE | HO, TU TU V | 2818 | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786265 | Wafer Bonding Apparatus and Method | LINDSEY, COLE LEON | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786023 | PACKAGE STRUCTURE | HAWKINS, IHSAN TAIWO | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785442 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | HSIEH, HSIN YI | 2899 | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785381 | SEMICONDUCTOR DEVICES WITH IMPROVED CAPACITORS | MIYOSHI, JESSE Y | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18783614 | FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT | GHYKA, ALEXANDER G | 2812 | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783544 | TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL | SLUTSKER, JULIA | 2891 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784711 | INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE | ALBRECHT, PETER M | 2811 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783597 | MULTIPLE THRESHOLD VOLTAGE IMPLEMENTATION THROUGH LANTHANUM INCORPORATION | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784233 | HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS | FAN, SU JYA | 2818 | §102§103Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784164 | BONDING STRUCTURE AND METHOD OF FORMING SAME | DIALLO, MAMADOU L | 2897 | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784190 | PERFORMING ANNEALING PROCESS TO IMPROVE FIN QUALITY OF A FINFET SEMICONDUCTOR | TRAN, TONY | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783688 | IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING | CHAMBLISS, ALONZO | 2897 | §102§112DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784638 | NOVEL MIM STRUCTURE | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784624 | INTEGRATED CIRCUIT WITH NANOSHEET TRANSISTORS WITH METAL GATE PASSIVATION | WINTERS, SEAN AYERS | 2892 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784531 | SEMICONDUCTOR DEVICE WITH S/D BOTTOM ISOLATION AND METHODS OF FORMING THE SAME | LEE, CHEUNG | 2812 | §102§103DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784428 | INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | VU, HUNG K | 2897 | §112DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783501 | SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD | GREEN, TELLY D | 2898 | §102§103§112Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784872 | Structure and Method for MRAM Devices with a Slot Via | CRITE, ANTONIO B | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783563 | Integrated Hybrid Standard Cell Structure with Gate-All-Around Device | KIM, TONG-HO | 2811 | §102Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783789 | PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783905 | SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF | GUMEDZOE, PENIEL M | 2899 | §102§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783885 | DUMMY HYBRID FILM FOR SELF ALIGNMENT CONTACT FORMATION | BERNSTEIN, ALLISON | 2824 | §102§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784490 | FIELD EFFECT TRANSISTOR WITH GATE ISOLATION STRUCTURE AND METHOD | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783848 | NFET with Aluminum-Free Work-Function Layer and Method Forming Same | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784735 | APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE | SOTO, JANICE M | 2855 | §102§103Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784570 | SEMICONDUCTOR DEVICES | BOWEN, ADAM S | — | Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783807 | 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME | GEYER, SCOTT B | 2812 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783347 | INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING | MUNOZ, ANDRES F | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782667 | SYSTEM AND METHOD FOR DYNAMICALLY ADJUSTING THIN-FILM DEPOSITION PARAMETERS | KHUU, HIEN DIEU THI | 2116 | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782335 | AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782253 | MULTI-LEVEL STACKING OF WAFERS AND CHIPS | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783157 | Multi-Gate Device Integration with Separated Fin-Like Field Effect Transistor Cells and Gate-All-Around Transistor Cells | ASSOUMAN, HERVE-LOUIS Y | 2812 | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782794 | Patterning Semiconductor Devices and Structures Resulting Therefrom | JOHNSON, CHRISTOPHER A | 2899 | §103§112Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783146 | CAPACITOR, MEMORY DEVICE, AND METHOD | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782124 | Semiconductor Device and Method of Manufacture | KIM, TONG-HO | 2811 | §102Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782167 | CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS | JEFFERSON, QUOVAUNDA | 2899 | Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782255 | Dual Dopant Source/Drain Regions and Methods of Forming Same | WILCZEWSKI, MARY A | 2898 | §103§112DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783352 | SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE | WILCZEWSKI, MARY A | 2898 | §102§103DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782460 | INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME | SEDOROOK, DAVID PAUL | 2812 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782900 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING DEPOSITION | RAHIM, NILUFA | 2893 | §102§103 | Final Rejection | — | Pending | Jul 24, 2024 |
| 18782354 | HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED CIRCUITS | JEAN BAPTISTE, WILNER | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783031 | PACKAGED DEVICE WITH OPTICAL PATHWAY | NGUYEN, KHIEM D | 2892 | §102§103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782219 | TRANSISTOR GATE STRUCTURES | KIM, TONG-HO | 2811 | §102§103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782846 | GATE STRUCTURE FOR SEMICONDUCTOR DEVICE | KIM, TONG-HO | 2811 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782176 | NANO TRANSISTORS WITH SOURCE/DRAIN HAVING SIDE CONTACTS TO 2-D MATERIAL | PATEL, REEMA | 2812 | §102Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780834 | GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHODS OF FORMATION THEREOF | LEE, CHEUNG | 2812 | §112DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781022 | METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES | TRAN, THANH Y | 2817 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781476 | SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS | MAI, ANH D | 2893 | §103§112 | Final Rejection | — | Pending | Jul 23, 2024 |
| 18780927 | GATE-ALL-AROUND DEVICES HAVING SELF-ALIGNED CAPPING BETWEEN CHANNEL AND BACKSIDE POWER RAIL | YI, CHANGHYUN | 2812 | §112DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780824 | Semiconductor Device and Manufacturing Method of Semiconductor Device | CRAWFORD EASON, LATANYA N | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781455 | Method for Reducing Line-End Space in Integrated Circuit Patterning | JEFFERSON, QUOVAUNDA | 2899 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781604 | SEMICONDUCTOR DEVICE AND METHOD | NGUYEN, KHIEM D | 2892 | §102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781018 | Metal Contacts on Metal Gates and Methods Thereof | CULBERT, CHRISTOPHER A | 2815 | §102§103 | Non-Final OA | 36d overdue | Pending | Jul 23, 2024 |
| 18780838 | Fully Self-Aligned Interconnect Structure | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780842 | TRANSISTOR SOURCE/DRAIN REGIONS | WIEGAND, TYLER J | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781059 | SEMICONDUCTOR DEVICE AND METHOD | TRAN, TAN N | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780748 | CUT METAL GATE IN MEMORY MACRO EDGE AND MIDDLE STRAP | MEHTA, RATISHA | 2817 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780679 | Dielectric Fins With Different Dielectric Constants and Sizes in Different Regions of a Semiconductor Device | BEARDSLEY, JONAS TYLER | 2811 | §101§102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779804 | EPITAXIAL SOURCE/DRAIN STRUCTURE AND METHOD | HAIDER, WASIUL | 2812 | Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779329 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME | TYNES JR., LAWRENCE C | 2899 | Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779489 | SEMICONDUCTOR DEVICES WITH ENHANCED CARRIER MOBILITY | XU, ZHIJUN | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779954 | FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS | BRASFIELD, QUINTON A | 2814 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779444 | Source/Drain Contact with Low-K Contact Etch Stop Layer and Method of Fabricating Thereof | SPALLA, DAVID C | 2893 | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779268 | SEMICONDUCTOR DEVICES | SUN, YU-HSI DAVID | 2817 | Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779190 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780150 | INNER SPACER FEATURES FOR MULTI-GATE TRANSISTORS | SPALLA, DAVID C | 2893 | §102§103DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780081 | MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS | NGUYEN, CUONG B | 2872 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778763 | Integrated Circuit Package and Method | DANG, PHUC T | 2897 | §103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777772 | WAFER SINGULATION INCLUDING MULTIPLE LASER GROOVING | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777250 | METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR DEVICES | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776388 | Semiconductor Device Structure and Method for Forming the Same | DINKE, BITEW A | 2812 | §103Other | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776617 | SEMICONDUCTOR DEVICES | KIM, TONG-HO | 2811 | §102§103Other | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777198 | SEMICONDUCTOR DEVICES | GHYKA, ALEXANDER G | 2812 | §102DP | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777240 | NANOSTRUCTURE DEVICE WITH REDUCED HIGH-K DIELECTRIC AREA AND RELATED METHOD | JONES, ERIC W | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18775879 | HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM | GUMEDZOE, PENIEL M | 2899 | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775995 | SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER | OH, JIYOUNG | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775706 | VOID ELIMINATION FOR GAP-FILLING IN HIGH-ASPECT RATIO TRENCHES | STEVENSON, ANDRE C | 2899 | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775341 | METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS | VU, HUNG K | — | §103Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775943 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING | BOWEN, ADAM S | 2897 | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775646 | NANOSHEET FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774323 | BURIED METAL TRACK AND METHODS FORMING SAME | QUINTO, KEVIN V | 2893 | §102 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774643 | Semiconductor Device with Cut Metal Gate and Method of Manufacture | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773070 | ETCHING BACK AND SELECTIVE DEPOSITION OF METAL GATE | ASHBAHIAN, ERIC K | 2891 | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773308 | FIELD EFFECT TRANSISTOR WITH FIN ISOLATION STRUCTURE AND METHOD | NGUYEN, DAO H | — | §112 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773367 | UNDERLAYER OF MULTILAYER STRUCTURE AND METHODS OF USE THEREOF | LEBENTRITT, MICHAEL | 2893 | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772445 | MAGNETIC TUNNEL JUNCTION DEVICE AND METHOD OF FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772438 | Heat Dissipation in Semiconductor Packages and Methods of Forming Same | PRASAD, NEIL R | 2897 | §102§103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18771714 | GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771503 | EPITAXIAL BACKSIDE CONTACT | KIM, TONG-HO | 2811 | Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771181 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING | ASSOUMAN, HERVE-LOUIS Y | 2812 | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770919 | METHODS OF FORMING EPITAXIAL STRUCTURES IN FIN-LIKE FIELD EFFECT TRANSISTORS | TRAN, THANH Y | 2817 | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770750 | Semiconductor Device and Method of Manufacture | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771191 | Photonic Semiconductor Device And Method | RAHLL, JERRY T | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770349 | SEMICONDUCTOR DEVICE WITH FUNNEL SHAPE SPACER AND METHODS OF FORMING THE SAME | LEE, CHEUNG | 2812 | §102DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769875 | FINFETS WITH EPITAXY REGIONS HAVING MIXED WAVY AND NON-WAVY PORTIONS | LEE, CHEUNG | 2812 | §102 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770052 | NMOS and PMOS Transistor Gates with Hafnium Oxide Layers and Lanthanum Oxide Layers | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768942 | SEMICONDUCTOR DEVICE INCLUDING COMBINATION ROWS | HAWKINS, IHSAN TAIWO | 2899 | §102§103§112 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768952 | Semiconductor Device Structure With Uniform Threshold Voltage Distribution and Method of Forming the Same | NGUYEN, DAO H | 2818 | §102 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768357 | LATCH-UP PREVENTION | KIM, TONG-HO | 2811 | §103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769227 | STRUCTURES AND METHODS FOR TRENCH ISOLATION | SALERNO, SARAH KATE | 2814 | DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768881 | FINFET PITCH SCALING | HOANG, TUAN A | 2898 | §102§103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18766996 | METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OUT REDISTRIBUTION LAYER (RDL) TO ACCOMMODATE ELECTRICAL CONNECTORS | SEVEN, EVREN | 2812 | §102 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766767 | Self-Aligned Contact Hard Mask Structure of Semiconductor Device and Method of Forming Same | KEAGY, ROSE ALYSSA | 2818 | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766881 | FIN FIELD-EFFECT TRANSISTOR DEVICES AND METHODS OF FORMING THE SAME | SLUTSKER, JULIA | 2891 | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766336 | BSI CHIP WITH BACKSIDE ALIGNMENT MARK | TAYLOR, EARL N | 2896 | §102§112 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766300 | SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES | JONES, ERIC W | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766402 | MINIMIZATION OF SILICON GERMANIUM FACETS IN PLANAR METAL OXIDE SEMICONDUCTOR STRUCTURES | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766246 | COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS | KIELIN, ERIK J | 2814 | DP | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18762706 | DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR | DIALLO, MAMADOU L | 2897 | DP | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18763852 | SYSTEM FOR STORING CHEMICAL LIQUID AND METHOD FOR ADJUSTING GAS CONCENTRATION IN CHEMICAL LIQUID | MACARTHUR, SYLVIA | 1716 | §102§103§112 | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18761653 | SHALLOW TRENCH ISOLATION (STI) CONTACT STRUCTURES AND METHODS OF FORMING SAME | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18761640 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18760120 | Semiconductor Package and Method | SYLVIA, CHRISTINA A | 2817 | §103§112 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18760800 | EPITAXY REGIONS WITH LARGE LANDING AREAS FOR CONTACT PLUGS | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18756609 | PLANAR AND NON-PLANAR FET-BASED ELECTROSTATIC DISCHARGE PROTECTION DEVICES | JEFFERSON, QUOVAUNDA | 2899 | DP | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18753744 | Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same | GREEN, TELLY D | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18752172 | SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP | HOANG, TUAN A | — | §103§112Other | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18749013 | LAYOUT STRUCTURE INCLUDING ANTI-FUSE CELL | SMET, UYEN TRAN | 2824 | §102 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18747623 | NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME | KOO, LAMONT B | 2813 | §102 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18746181 | Contact for Semiconductor Device and Method of Forming Thereof | TAYLOR, EARL N | 2896 | §102§103§112 | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18745760 | Etch Profile Control Of Polysilicon Structures Of Semiconductor Devices | DULKA, JOHN P | 2817 | §102§112 | Non-Final OA | — | Pending | Jun 17, 2024 |
| 18743529 | HIGH-DENSITY MEMORY CELLS AND LAYOUTS THEREOF | SMET, UYEN TRAN | 2824 | §102§112 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18744471 | METHOD AND DEVICE TO INCREASE NANOSHEET DEVICE WIDTH | TYNES JR., LAWRENCE C | 2899 | §102§103§112 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18741654 | DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKING THE SAME | VU, VU A | 2897 | §103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18740705 | ELECTRO-MIGRATION REDUCTION | KUSUMAKAR, KAREN M | 2897 | §102Other | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18741756 | ANTENNA DEVICE | MUSE, ISMAIL A | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18738443 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE | BRASFIELD, QUINTON A | 2814 | §103DP | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18738236 | BARRIER-FREE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF | DANG, PHUC T | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18738774 | SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME | RONO, VINCENT KIPKEMOI | — | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18731752 | OPTICAL FIBER COUPLING STRUCTURE FOR PHOTONIC PACKAGE | LE, UYEN CHAU N | 2874 | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18679788 | SEMICONDUCTOR PACKAGE AND METHOD | IQBAL, HAMNA FATHIMA | 2817 | §102§103 | Final Rejection | — | Pending | May 31, 2024 |
| 18679046 | SINGLE PHOTON AVALANCHE DIODE FOR EXTREME ULTRAVIOLET PHOTON DETECTION AND RELATED METHODS | PHAM, LONG | — | §102§103 | Non-Final OA | — | Pending | May 30, 2024 |
| 18674134 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | BOOTH, RICHARD A | — | Other | Non-Final OA | — | Pending | May 24, 2024 |
| 18674634 | LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF | RODELA, EDUARDO A | 2893 | §103DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18673546 | ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING | CHI, SUBERR L | 2893 | §112 | Non-Final OA | — | Pending | May 24, 2024 |
| 18672410 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | PENG, CHARLIE YU | 4100 | §102§103Other | Non-Final OA | — | Pending | May 23, 2024 |
| 18671732 | Contact Structures With Deposited Silicide Layers | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | May 22, 2024 |
| 18668960 | Forming Isolation Regions for Separating Fins and Gate Stacks | KOO, LAMONT B | — | §102§103§112 | Non-Final OA | — | Pending | May 20, 2024 |
| 18669102 | CHEMICAL MECHANICAL POLISHING METHOD | GUMP, MICHAEL ANTHONY | 3723 | §103DP | Non-Final OA | — | Pending | May 20, 2024 |
| 18667981 | METHODS OF FORMING PHOTONIC DEVICES | HO, ANTHONY | 2817 | DP | Non-Final OA | — | Pending | May 17, 2024 |
| 18667509 | STRUCTURE FOR FRINGING CAPACITANCE CONTROL | KIM, TONG-HO | 2891 | §103Other | Non-Final OA | — | Pending | May 17, 2024 |
| 18666517 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | — | Pending | May 16, 2024 |
| 18664767 | High-K Gate Dielectric and Method Forming Same | JUNGE, BRYAN R. | 2897 | §103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18663915 | TREATMENT PROCESS FOR WAFER BONDING PROCESSES | YUSHINA, GALINA G | — | §102§103§112 | Non-Final OA | — | Pending | May 14, 2024 |
| 18662374 | DUAL SILICIDE STRUCTURE AND METHODS THEREOF | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | May 13, 2024 |
| 18658480 | DETACHABLE FIBER ARRAY UNIT FITTING WITH GUIDE PINS | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | May 08, 2024 |
| 18657170 | DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAME | OZDEN, ILKER NMN | 2812 | §102§103§112DP | Non-Final OA | — | Pending | May 07, 2024 |
| 18655833 | CONNECTION BETWEEN SOURCE/DRAIN AND GATE | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18655999 | SEMICONDUCTOR DEVICE AND METHOD | KOLB, THADDEUS J | 2817 | §102§103§112 | Non-Final OA | — | Pending | May 06, 2024 |
| 18648917 | Die Stacking Structure and Method Forming Same | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18646459 | PLANARIZATION PROCESS AND METHOD | PHAM, THOMAS T | 1713 | §103Other | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644770 | Semiconductor Device and Method of Manufacture | AHMAD, KHAJA | 2813 | §102§103Other | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18643031 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18642330 | Forming Source And Drain Features In Semiconductor Devices | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18641764 | SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT | PARKER, JOHN M | 2899 | §102§103§112 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18635461 | NEGATIVE CAPACITANCE TRANSISTOR WITH EXTERNAL FERROELECTRIC STRUCTURE | CAMPBELL, SHAUN M | 2893 | §102 | Final Rejection | — | Pending | Apr 15, 2024 |
| 18632132 | NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE | TURNER, BRIAN | 2818 | DP | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18630164 | INTERCONNECTION STRUCTURE | BOULGHASSOUL, YOUNES | 2814 | §102Other | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18627789 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628173 | SEMICONDUCTOR PACKAGE AND METHOD | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628006 | DEVICE AND METHOD FOR IMPROVED CMP PROCESS WITH CMP HEAD | HAWKINS, JASON KHALIL | 3723 | §103 | Final Rejection | — | Pending | Apr 05, 2024 |
| 18627334 | PROCESSING AND MEMORY DEVICE AND SYSTEM | WESTBROOK, MICHAEL L | 2139 | §103 | Final Rejection | — | Pending | Apr 04, 2024 |
| 18626242 | RESIST UNDERLAYER COMPOSITION | COSGROVE, JAYSON D | 1737 | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18623490 | THRESHOLD VOLTAGE TUNING FOR CFETS HAVING COMMON GATES | LEE, ALVIN LYNGHI | 2813 | §102§103§112 | Non-Final OA | — | Pending | Apr 01, 2024 |
| 18619459 | PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING THE SAME | AHMAD, KHAJA | 2813 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619758 | SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES | FAYETTE, NATHALIE RENEE | 2812 | §102§103§112 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619983 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | MOONEY, MICHAEL P | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18609511 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING | MORA, ONASIS | 4100 | §103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18609870 | SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FORMING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18606495 | PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE SAME | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18606497 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18603046 | Semiconductor Structure with Gate Isolation Layer and Manufacturing Method Thereof | NICELY, JOSEPH C | 2813 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18602392 | INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF | KIELIN, ERIK J | 2814 | §102§103 | Final Rejection | — | Pending | Mar 12, 2024 |
| 18601074 | GATE-ALL-AROUND DEVICE WITH DIFFERENT CHANNEL SEMICONDUCTOR MATERIALS AND METHOD OF FORMING THE SAME | BOWEN, ADAM S | 2897 | §102Other | Final Rejection | — | Pending | Mar 11, 2024 |
| 18600172 | INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS OF FORMING THE SAME | HARBOTTLE, CHARLOTTE ELIZABETH | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18599797 | ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES | JOHNSON, CHRISTOPHER A | 2899 | §112 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18597219 | SEMICONDUCTOR DEVICE AND METHOD | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596123 | MECHANISMS FOR GROWING EPITAXY STRUCTURE OF FINFET DEVICE | CRITE, ANTONIO B | 2817 | §103 | Final Rejection | — | Pending | Mar 05, 2024 |
| 18594694 | WAVEGUIDES AND METHODS OF FORMING THE SAME | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103 | Final Rejection | — | Pending | Mar 04, 2024 |
| 18591792 | FORMING ISOLATION REGIONS WITH LOW PARASITIC CAPACITANCE AND REDUCED DAMAGE | LI, MEIYA | 2811 | §112 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591758 | SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF MANUFACTURING THE SAME | RIRIE, EVERETT TRAJAN | 2897 | §102§103§112 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18590271 | SEMICONDUCTOR PACKAGE AND METHOD | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18587104 | SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMING THE SAME | TRAN, TAN N | 2812 | §103 | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18584080 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18581604 | Methods, Structures and Devices for Intra-Connection Structures | MUNOZ, ANDRES F | 2818 | §102§103§112 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18582070 | CARRIER WAFER DEBONDING PROCESS AND METHOD | CUDA, BRENNEN STUART | 2818 | §103 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18442758 | SEMICONDUCTOR PACKAGE AND METHODS | MICHAUD, NICHOLAS BRIAN | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18437960 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | CAPUTO, LISA M | 2874 | §102 | Final Rejection | 40d | Pending | Feb 09, 2024 |
| 18433908 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18434222 | EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME | ADROVEL, WILLIAM | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18434553 | DEVICE OF DIELECTRIC LAYER | DINKE, BITEW A | 2812 | §103 | Final Rejection | — | Pending | Feb 06, 2024 |
| 18431187 | PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §102§103 | Final Rejection | 26d | Pending | Feb 02, 2024 |
| 18428315 | SEMICONDUCTOR DEVICE AND METHOD | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2024 |
| 18420550 | TREATMENT FOR TUNING THRESHOLD VOLTAGES OF TRANSISTORS | AHMED, SHAHED | 2813 | §102§103 | Final Rejection | — | Pending | Jan 23, 2024 |
| 18416410 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | MOHAMED-ALY, KAREEM M | 2898 | §102§103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415770 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | §102§103§112 | Non-Final OA | 21d | Pending | Jan 18, 2024 |
| 18412779 | SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME | LI, MEIYA | 2811 | §103§112 | Non-Final OA | — | Pending | Jan 15, 2024 |
| 18411675 | SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND TRENCH ISOLATION ETCHBACK | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18410329 | VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS | TRAN, TAN N | 2812 | §102§112 | Final Rejection | 22d | Pending | Jan 11, 2024 |
| 18408932 | SEMICONDUCTOR DEVICE AND METHOD | MEHTA, RATISHA | 2817 | §102 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18405526 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHOD | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405973 | INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18404776 | MULTILAYER PROTECTION COATING WITH LAYERS OF DIFFERENT FUNCTIONS ON CARBON NANOTUBE | ANGEBRANNDT, MARTIN J | 1737 | §102§103Other | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404266 | INTEGRATED CIRCUIT PACKAGE AND METHOD | KEAGY, ROSE ALYSSA | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403326 | SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403298 | PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403418 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME | ADROVEL, WILLIAM | 2898 | §103§112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401846 | PACKAGES WITH DTCS ON OTHER DEVICE DIES AND METHODS OF FORMING THE SAME | SPRENGER, JAIME LYNN | 2893 | §103 | Final Rejection | — | Pending | Jan 02, 2024 |
| 18530102 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §102§103§112 | Final Rejection | 9d | Pending | Dec 05, 2023 |
| 18526445 | SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME | TURNER, BRIAN | 2818 | §102§103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526496 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | ABEL, GARY ROBERT | 2897 | §103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526786 | OPTICAL DEVICE AND METHODS OF MANUFACTURE | PEACE, RHONDA S | 2874 | §102§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18524386 | MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF | CIESLEWICZ, ANETA B | 2893 | §103§112 | Final Rejection | 5d | Pending | Nov 30, 2023 |
| 18521726 | ADJUSTABLE NOZZLE DEVICE | TADESSE, YEWEBDAR T | 1717 | §102§103 | Final Rejection | 1d overdue | Pending | Nov 28, 2023 |
| 18521701 | SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATING THE SAME | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | — | Pending | Nov 28, 2023 |
| 18521931 | METAL SOURCE/DRAIN FEATURES | TURNER, BRIAN | 2818 | §102§103§112 | Non-Final OA | — | Pending | Nov 28, 2023 |
| 18517577 | Gradually Changed Dummy Pattern Distribution Around TSVs | BLACKWELL, ASHLEY NICOLE | 2897 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18516431 | CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES | HUNTER III, CARNELL | 2893 | §103Other | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | 71d | Pending | Nov 20, 2023 |
| 18514859 | SPACE FILLING DEVICE FOR WET BENCH | ZHANG, RICHARD Z | 1714 | §103§112Other | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18510523 | SEAL RING STRUCTURE AND METHOD OF FORMING SAME | PARTHASARATHY, ROHIT | 2899 | §102§103§112 | Non-Final OA | — | Pending | Nov 15, 2023 |
| 18508015 | SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES WITH STRUCTURES HAVING REDUCED PARASITIC CIRCUIT | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18506747 | DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FORMING SAME | WEILAND, ADAM DAVID | 2813 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18506864 | LOW VOLUME SHRINKAGE, HIGH ETCH RESISTANCE AND HIGH RESOLUTION PHOTORESISTS | ANGEBRANNDT, MARTIN J | 1737 | §103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18506366 | IMMERSION COOLING SYSTEM AND METHODS | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18491237 | MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME | KEAGY, ROSE ALYSSA | 2818 | §103 | Non-Final OA | — | Pending | Oct 20, 2023 |
| 18488592 | IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME | NARAGHI, ALI | 2817 | §102§103§112 | Non-Final OA | — | Pending | Oct 17, 2023 |
| 18482632 | INTEGRATED CIRCUIT PACKAGES AND METHODS | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18482217 | Heat Dissipating Structure and Methods of Forming The Same | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18471739 | Integrated Circuit Packages and Methods of Forming the Same | ENAD, CHRISTINE A | 2811 | — | Final Rejection | 36d | Pending | Sep 21, 2023 |
| 18467020 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | MANHEIM, MARC ETIENNE | 2874 | §102§103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | CUTLER, ETHAN EDWARD | 2892 | §103 | Final Rejection | 10d overdue | Pending | Sep 12, 2023 |
| 18462499 | FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Sep 07, 2023 |
| 18240065 | SEMICONDUCTOR PACKAGE AND METHOD | PARENDO, KEVIN A | 2896 | §103 | Non-Final OA | 31d overdue | Pending | Aug 30, 2023 |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Final Rejection | 1d overdue | Pending | Aug 29, 2023 |
| 18454702 | METHOD OF PHYSICAL VAPOR DEPOSITION WITH INTERMIXING REDUCTION | MCCLURE, CHRISTINA D | 1718 | §103 | Non-Final OA | — | Pending | Aug 23, 2023 |
| 18448337 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | ROLAND, CHRISTOPHER M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18232986 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18232719 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103§112 | Non-Final OA | 146d overdue | Pending | Aug 10, 2023 |
| 18232718 | Contact Structure For Semiconductor Device | AU, BAC H | 2898 | §103 | Final Rejection | 12d | Pending | Aug 10, 2023 |
| 18446858 | WAFER DRYING SYSTEM | YUEN, JESSICA JIPING | 3762 | §103§112 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18232181 | Profile Control Of Gate Structures In Semiconductor Devices | HOANG, TUAN A | 2898 | §103 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18446753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | LI, MEIYA | 2811 | §112DP | Final Rejection | 17d overdue | Pending | Aug 09, 2023 |
| 18366370 | STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | 66d overdue | Pending | Aug 07, 2023 |
| 18364614 | METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARIZATION | BAUMAN, SCOTT E | 2815 | §103 | Final Rejection | — | Pending | Aug 03, 2023 |
| 18364588 | Warm Wafer After Ion Cryo-Implantation | CHOI, JAMES J | 2878 | §103 | Non-Final OA | — | Pending | Aug 03, 2023 |
| 18364332 | PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | THOMASON, DARBY MARGARET | 2874 | §102§103 | Non-Final OA | — | Pending | Aug 02, 2023 |
| 18363554 | FINFET DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 01, 2023 |
| 18228288 | Biological Device And Biosensing Method Thereof | EOM, ROBERT J | 1797 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362755 | SEMICONDUCTOR DEVICE | KOO, LAMONT B | 2813 | §103 | Final Rejection | — | Pending | Jul 31, 2023 |
| 18361569 | BENT FIN DEVICES | KOO, LAMONT B | 2813 | §103 | Final Rejection | 10d overdue | Pending | Jul 28, 2023 |
| 18361609 | EUV RETICLE WITH EMBEDDED PROCESS ASSISTANCE LAYER AND METHOD OF MANUFACTURING THE EUV RETICLE | CHACKO DAVIS, DABORAH | 1737 | §103 | Final Rejection | — | Pending | Jul 28, 2023 |
| 18361704 | SEMICONDUCTOR DEVICES WITH DIELECTRIC FINS AND METHOD FOR FORMING THE SAME | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18361298 | DOSE REDUCTION BOTTOM ANTI-REFLECTIVE COATING FOR METALLIC PHOTORESIST | CHACKO DAVIS, DABORAH | 1737 | §102§103 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18359180 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18356408 | OPTIMIZED CELL LAYOUT | AISAKA, BRYCE M | — | §102§103 | Non-Final OA | — | Pending | Jul 21, 2023 |
| 18352055 | DEVICE HAVING MULTIPHASE DIELECTRIC LAYER AND METHOD | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 40d | Pending | Jul 13, 2023 |
| 18351099 | Volume-Less Dipole Incorporation into CFET Having Common Gate | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18350429 | SEMICONDUCTOR DEVICES WITH IMPROVED GATE CONTROL | HOANG, TUAN A | 2898 | §102§103 | Final Rejection | 61d | Pending | Jul 11, 2023 |
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 56d overdue | Pending | Jul 07, 2023 |
| 18348967 | Cut Metal Gate Refill With Buffer Layer | HOSSAIN, MOAZZAM | 2800 | §103§112 | Final Rejection | 42d overdue | Pending | Jul 07, 2023 |
| 18336382 | GALLIUM NITRIDE DEVICE WITH ARTIFICIAL FIELD PLATES | NEWTON, VALERIE N | 2897 | §103 | Non-Final OA | — | Pending | Jun 16, 2023 |
| 18334695 | Integrated Circuit Package and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 14d | Pending | Jun 14, 2023 |
| 18334650 | Redistribution Lines and The Method Forming the Same Through Stitching | ABRAHAM, JOSE K | 3729 | §112 | Non-Final OA | — | Pending | Jun 14, 2023 |
| 18330229 | FIELD EFFECT TRANSISTOR WITH STRAINED CHANNELS AND METHOD | DUREN, TIMOTHY EDWARD | 2817 | §103 | Non-Final OA | 27d | Pending | Jun 06, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 13d | Pending | Jun 05, 2023 |
| 18328982 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §103 | Non-Final OA | 15d overdue | Pending | Jun 05, 2023 |
| 18328502 | CRYSTALLIZATION TEMPERATURE REDUCTION OF HIGH-K DIELECTRIC LAYER | SARKER-NAG, AKHEE | 2893 | §103 | Non-Final OA | 38d overdue | Pending | Jun 02, 2023 |
| 18324036 | HEAT DISSIPATION IN SEMICONDUCTOR DEVICES | GREEN, TELLY D | 2898 | §103 | Final Rejection | 61d | Pending | May 25, 2023 |
| 18319854 | Optical Devices and Methods of Manufacture | CHU, CHRIS H | 2874 | §103 | Non-Final OA | — | Pending | May 18, 2023 |
| 18314446 | Complementary Field Effect Transistors and Methods of Forming the Same | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 28d | Pending | May 09, 2023 |
| 18313705 | METHOD OF MODELING A MASK BY TAKING INTO ACCOUNT OF MASK PATTERN EDGE INTERACTION | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102§103 | Non-Final OA | 30d | Pending | May 08, 2023 |
| 18128061 | Epitaxial Structures In Semiconductor Devices | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | Pending | Mar 29, 2023 |
| 18186413 | Optical Device and Method of Manufacture | ST CYR, DANIEL | 2876 | §103 | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18163746 | CFET SRAM WITH BUTT CONNECTION ON ACTIVE AREA | RAHIM, NILUFA | 2893 | §102§103 | Non-Final OA | 2d overdue | Pending | Feb 02, 2023 |
| 18153978 | CHILLER SYSTEM WITH INTELLIGENT CONTROL | AHMED, ISTIAQUE | 2116 | §102§103 | Final Rejection | 46d overdue | Pending | Jan 12, 2023 |
| 18152314 | Water Cooling System for Semiconductor Package | HIBBERT, DANIEL JOHNATHAN | 2899 | §102§103§112 | Non-Final OA | 34d | Pending | Jan 10, 2023 |
| 18152390 | METHOD OF SACRIFICIAL NANOSTRUCTURE REPLACEMENT IN SEMICONDUCTOR DEVICES | XU, ZHIJUN | 2818 | §103 | Final Rejection | — | Pending | Jan 10, 2023 |
| 18151629 | INTEGRATED CIRCUIT PACKAGE AND METHOD | GREEN, TELLY D | 2898 | §103 | Non-Final OA | — | Pending | Jan 09, 2023 |
| 18151843 | DUAL BAND FAN OUT DEVICE AND METHOD | MILLER, ALEXANDER MICHAEL | 2898 | §103§112 | Non-Final OA | — | Pending | Jan 09, 2023 |
| 18151856 | Die Structures and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | 13d | Pending | Jan 09, 2023 |
| 18149265 | Via Structures | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Non-Final OA | 34d | Pending | Jan 03, 2023 |
| 17929180 | Dielectric Blocking Layer and Method Forming the Same | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §103§112 | Non-Final OA | 34d | Pending | Sep 01, 2022 |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 35d | Pending | Aug 26, 2022 |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 28d | Pending | Aug 19, 2022 |
| 17884636 | PMOSFET SOURCE DRAIN | NARAGHI, ALI | 2817 | §103 | Final Rejection | 28d | Pending | Aug 10, 2022 |
| 17818785 | Semiconductor Device and Method | KOO, LAMONT B | 2813 | §103 | Final Rejection | 46d overdue | Pending | Aug 10, 2022 |
| 17883128 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE | KLUNK, MARGARET D | 1716 | §103§112 | Final Rejection | 14d | Pending | Aug 08, 2022 |
| 17881128 | SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF | BELL, LAUREN R | 2896 | §103§112 | Non-Final OA | — | Pending | Aug 04, 2022 |
| 17879529 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 02, 2022 |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 8d overdue | Pending | Aug 02, 2022 |
| 17815968 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | HSIEH, HSIN YI | 2899 | §102§103 | Non-Final OA | 72d | Pending | Jul 29, 2022 |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 2817 | §103§112 | Non-Final OA | 100d overdue | Pending | Jul 27, 2022 |
| 17875322 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17875108 | ANTENNA DIODE CIRCUIT | THOMAS, LUCY M | 2838 | §103 | Final Rejection | — | Pending | Jul 27, 2022 |
| 17872750 | Semiconductor Package and Method of Manufacturing the Same | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 13d | Pending | Jul 25, 2022 |
| 17872160 | Source/Drain Via Having Reduced Resistance | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Jul 25, 2022 |
| 17814725 | Semiconductor Device and Method | WILCZEWSKI, MARY A | 2898 | §102§103§112 | Non-Final OA | 26d | Pending | Jul 25, 2022 |
| 17870251 | SLURRY RECYCLING FOR CHEMICAL MECHANICAL POLISHING SYSTEM | KEYWORTH, PETER | 1777 | §103§112 | Final Rejection | 29d | Pending | Jul 21, 2022 |
| 17813700 | MITIGATION OF TIME DEPENDENT DIELECTRIC BREAKDOWN | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | — | Pending | Jul 20, 2022 |
| 17858985 | Inner Spacers for Gate-All-Around Semiconductor Devices | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17809039 | SEMICONDUCTOR PACKAGE AND METHOD | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17837312 | HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | GUPTA, RAJ R | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2022 |
| 17833208 | Semiconductor Device and Method Forming Same | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | — | Pending | Jun 06, 2022 |
| 17750145 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | TUROCY, DAVID P | 1718 | §103§112 | Final Rejection | — | Pending | May 20, 2022 |
| 17663683 | Semiconductor Package and Method | SCHODDE, CHRISTOPHER A | 2898 | §103 | Final Rejection | — | Pending | May 17, 2022 |
| 17745562 | EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER | DEGRASSE, IAN ISAAC | 2818 | §103 | Non-Final OA | — | Pending | May 16, 2022 |
| 17663278 | SEMICONDUCTOR DEVICE AND METHOD | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | May 13, 2022 |
| 17739259 | Semiconductor Device Including Air Spacer and Method of Manufacture | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Non-Final OA | — | Pending | May 09, 2022 |
| 17661325 | Method of Bonding Active Dies and Dummy Dies and Structures Thereof | LANDAU, MATTHEW C | 2891 | §112 | Non-Final OA | — | Pending | Apr 29, 2022 |
| 17705804 | Semiconductor Devices and Methods of Formation | NARAGHI, ALI | 2817 | §103 | Final Rejection | 34d | Pending | Mar 28, 2022 |
| 17652398 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | NGUYEN, SOPHIA T | 2893 | §103§112 | Final Rejection | — | Pending | Feb 24, 2022 |
| 17582563 | SEMICONDUCTOR DEVICE AND METHOD | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §103§112 | Non-Final OA | — | Pending | Jan 24, 2022 |
| 17648431 | Atomic Layer Etching to Reduce Pattern Loading in High-K Dielectric Layer | STEVENSON, ANDRE C | 2899 | §103 | Non-Final OA | — | Pending | Jan 20, 2022 |
| 17457709 | Laser-Assisted Epitaxy and Etching for Manufacturing Integrated Circuits | SONG, MATTHEW J | 1714 | §103 | Final Rejection | 70d | Pending | Dec 06, 2021 |
| 17461656 | Semiconductor Device and Methods of Manufacture | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Aug 30, 2021 |
| 17352133 | DEPOSITION SYSTEM AND METHOD | KURPLE, KARL | 1717 | §103§112 | Non-Final OA | 26d | Pending | Jun 18, 2021 |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | WOLDEGEORGIS, ERMIAS T | 2893 | §103 | Final Rejection | 4d overdue | Pending | Jun 04, 2021 |
| 17215555 | Chip on Package Structure and Method | MIYOSHI, JESSE Y | 2898 | §103§112 | Non-Final OA | 42d overdue | Pending | Mar 29, 2021 |
| 17150044 | FINFET DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 79d | Pending | Jan 15, 2021 |
| 17114267 | Fin-Like Field Effect Transistors Having High Mobility Strained Channels and Methods of Fabrication Thereof | RAHIM, NILUFA | 2800 | §103 | Non-Final OA | — | Pending | Dec 07, 2020 |
| 16927638 | Pre-Clean for Contacts | ALEJANDRO MULERO, LUZ L | 1716 | §103 | Final Rejection | — | Pending | Jul 13, 2020 |
| 16900174 | Semiconductor Devices with Integrated Passive Devices | HRNJIC, ADIN | 2817 | §103§112 | Non-Final OA | — | Pending | Jun 12, 2020 |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | 35d | Pending | May 08, 2020 |
| 16655156 | CONDUCTIVE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | — | Pending | Oct 16, 2019 |
| 16585859 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | §103 | Final Rejection | 17d overdue | Pending | Sep 27, 2019 |
| 16525978 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | LIN, JOHN | 2815 | §103§112 | Non-Final OA | — | Pending | Jul 30, 2019 |
| 16395895 | PCRAM STRUCTURE | CHEN, YU | 2896 | §103 | Final Rejection | — | Pending | Apr 26, 2019 |
| 16283838 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | 31d overdue | Pending | Feb 25, 2019 |
| 19184149 | CANTILEVER NANOELECTROMECHANICAL DECODER CIRCUIT AND METHODS FOR FORMING THE SAME | LUU, PHO M | 2824 | DP | Non-Final OA | — | Pending | Apr 21, 2025 |
| 19184312 | One-Time Programmable (OTP) Memory and Method of Operating the Same | BUI, THA-O H | 2825 | §103Other | Non-Final OA | — | Pending | Apr 21, 2025 |
| 19176369 | Pre-Charging Bit Lines Through Charge-Sharing | CHO, SUNG IL | 2825 | §102§103§112Other | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19002874 | Methods and Systems for Improving Transfer Efficiency of an Automated Material Handling System | TIGHE, BRENDAN P | 3652 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2024 |
| 18991823 | AUTOMATED MATERIAL HANDLING SYSTEM | BROTHERS, LAURENCE RAPHAEL | 3655 | §102§103 | Non-Final OA | — | Pending | Dec 23, 2024 |
| 18991653 | MULTIPLE SINGULATED DIE TEST STRUCTURE AND METHODS OF FORMING AND USING THE SAME | HOQUE, FARHANA AKHTER | 2858 | §102 | Non-Final OA | — | Pending | Dec 22, 2024 |
| 18991656 | METHOD FOR ERROR CORRECTION CODING WITH MULTIPLE HASH GROUPINGS AND DEVICE FOR PERFORMING THE SAME | BRITT, CYNTHIA H | 2111 | §112DP | Non-Final OA | — | Pending | Dec 22, 2024 |
| 18979763 | Systems and Methods for Multi-Phase Clock Generation | POOS, JOHN W | 2896 | §102Other | Final Rejection | — | Pending | Dec 13, 2024 |
| 18947402 | THERMOELECTRIC TEMPERATURE CONTROLLER FOR A TESTER AND METHODS OF OPERATING THE SAME | RIOS RUSSO, RAUL J | 2858 | §112 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18915263 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MANUFACTURE | VU, VU A | — | §102 | Non-Final OA | — | Pending | Oct 14, 2024 |
| 18889666 | PACKAGE SUBSTRATE INCLUDING FIBER-REINFORCED DIELECTRIC LAYER, PACKAGE STRUCTURE INCLUDING THE PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME | FARMER, EMILY NICOLE | 2812 | §102§103 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18808430 | POLISHING MATERIAL SUPPLY SYSTEM AND RELATED METHODS | HUANG, STEVEN | 3723 | §102§103 | Non-Final OA | — | Pending | Aug 19, 2024 |
| 18792873 | SURFACE INSPECTION TOOL FOR TRANSFER TOOLS AND METHODS OF USING THE SAME | TON, TRI T | 2877 | §103 | Final Rejection | — | Pending | Aug 02, 2024 |
| 18789812 | WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER | MELLOTT, JAMES M | 1718 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789786 | SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF | MANDALA, MICHELLE | 2893 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790728 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | PAYEN, MARVIN | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789289 | DUAL POWER STRUCTURE WITH EFFICIENT LAYOUT | CAMPBELL, SHAUN M | 2893 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18786733 | Integrated Circuit Having a High Cell Density | SLUTSKER, JULIA | 2891 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787153 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788036 | PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAGE AND METHODS FOR FORMING THE SAME | MOONEY, MICHAEL P | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788082 | ORGANIC GATE TFT-TYPE STRESS SENSORS AND METHOD OF MAKING AND USING THE SAME | FOX, BRANDON C | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787593 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | WINTERS, SEAN AYERS | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786948 | CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METHODS FOR FORMING THE SAME | VU, DAVID | 2818 | §102 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786520 | METAL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING THE SAME | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786510 | SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS BETWEEN SEMICONDUCTOR DIES AND METHODS OF FORMING THE SAME | TRAN, THANH Y | 2817 | DP | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18785009 | METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE LAYERS AND METHODS OF FORMING THE SAME | DULKA, JOHN P | 2817 | §112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785091 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18784583 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH BOTTOM SELF-ALIGNED VIA LANDING | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783713 | PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET | MURATA, AUSTIN | 1718 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783478 | RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME | KIM, JAY C | 2815 | §112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784424 | RESISTIVE MEMORY DEVICE WITH ENHANCED LOCAL ELECTRIC FIELD AND METHODS OF FORMING THE SAME | MICHAUD, NICHOLAS BRIAN | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782095 | ION IMPLANTATION SYSTEM | NGUYEN, KIET TUAN | 2881 | §101§103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780592 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | YI, CHANGHYUN | 2812 | §102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781858 | SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME | DIAZ, JOSE R | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779006 | THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-MODULATED ACTIVE REGION AND METHODS FOR FORMING THE SAME | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18779005 | DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR DIE PACKAGING AND METHODS OF FORMING THE SAME | NGUYEN, DUY T V | — | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18779047 | MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS | LEE, EUGENE | 2815 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18779020 | ACCESS TRANSISTORS IN A DUAL GATE LINE CONFIGURATION AND METHODS FOR FORMING THE SAME | WALL, VINCENT | 2898 | §112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18777672 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | GOODLING, DEVIN KIRK | 2898 | §103§112DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777640 | CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME | DIAZ, JOSE R | 2815 | §102§112 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18770886 | MICRO-ELECTROMECHANICAL SYSTEM DEVICE USING A METALLIC MOVABLE PART AND METHODS FOR FORMING THE SAME | VU, VU A | — | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771613 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PASSIVE DEVICE AND METHODS OF MAKING THE SAME | LE, THAO P | 2818 | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770392 | PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME | NGUYEN, NIKI HOANG | 2818 | §112DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769949 | NOZZLE WITH SUPPORT STRUCTURES FOR USE IN A PICK-AND-PLACE MACHINE AND METHODS OF USING THE SAME | KIM, SANG K | 3654 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768080 | Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same | NGUYEN, NIKI HOANG | 2818 | §102Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18757668 | THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18756313 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18747849 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | GOODWIN, DAVID J | 2817 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18734669 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION CIRCUIT | MUSE, ISMAIL A | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18731672 | EMERGENCY RESPONSE SYSTEM | CHUNG, MONG-SHUNE | 2118 | §103Other | Non-Final OA | 43d overdue | Pending | Jun 03, 2024 |
| 18667673 | POLISHING APPARATUS | MACARTHUR, SYLVIA | 1716 | §102§103 | Non-Final OA | — | Pending | May 17, 2024 |
| 18666902 | CAPACITOR INTEGRATED PASSIVE DEVICE WITH COMMON GROUNDED THROUGH-SUBSTRATE-VIA AND SUBSTRATE BACKSIDE CONDUCTOR AND METHODS OF FORMING THE SAME | BELOUSOV, ALEXANDER | 2818 | §102 | Non-Final OA | — | Pending | May 17, 2024 |
| 18661971 | SEMICONDUCTOR MODULE INCLUDING A CORNER DIE OVER A SIDE OF A SEMICONDUCTOR DIE, PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR MODULE AND METHODS OF FORMING THE SAME | SCHODDE, CHRISTOPHER A | 2898 | §102§103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18661037 | PICK-AND-PLACE ALIGNMENT MARKS FOR SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MAKING THE SAME | FREY, KIMBERLY NEWMAN | 2817 | §103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18654173 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ISAAC, STANETTA D | — | §102 | Non-Final OA | — | Pending | May 03, 2024 |
| 18641416 | CATALYTIC METAL PLATE IN A METAL-INSULATOR-METAL CAPACITOR AND METHODS OF FORMING THE SAME | BENTON, CHLOE ELAINE | 2899 | §102§103§112 | Non-Final OA | — | Pending | Apr 21, 2024 |
| 18631094 | LOW-RESISTANCE CONTACT TO TOP ELECTRODES FOR MEMORY CELLS AND METHODS FOR FORMING THE SAME | CHIU, TSZ K | 2898 | §102 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18629037 | MEMORY DEVICE INCLUDING MULTIPLICATE SOURCE LINES AND METHODS OF FORMING THE SAME | LEE, CHEUNG | 2812 | §102 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18625292 | RESISTIVE MEMORY CELL TOP ELECTRODE CONTACT WITH REDUCED CORNER EROSION AND METHOD OF FORMING THE SAME | SUN, MICHAEL BRENNAN | 2892 | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18613172 | SEMICONDUCTOR DIES HAVING ELECTRICAL ISOLATION LAYERS AND METHODS OF MAKING THE SAME | GUMEDZOE, PENIEL M | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18596501 | VERTICAL HETEROSTRUCTURE SEMICONDUCTOR MEMORY CELL AND METHODS FOR MAKING THE SAME | LEE, CHEUNG | 2812 | §102§103DP | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18440331 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ARROYO, TERESA M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18434886 | ELECTROPLATING PROCESS USING A PROXIMITY MASK WITH AN OVERHANG AND AN APPARATUS FOR PERFORMING THE SAME | VAN, LUAN V | 1795 | §112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18424960 | SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE WITH VARIABLE RESISTIVITY EPITAXIAL SEMICONDUCTOR LAYERS AND METHODS OF MAKING THE SAME | RAHMAN, MOIN M | 2898 | §103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18421102 | TUNABLE PHOTONIC COUPLERS FOR ELECTRONIC/PHOTONIC SYSTEMS AND METHODS OF FORMING THE SAME | LEPISTO, RYAN A | 2874 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18415751 | WAFER RETAINING DEVICE | NEJAD, MAHDI H | 3723 | §102§103§112 | Final Rejection | 23d | Pending | Jan 18, 2024 |
| 18412736 | EXHAUST DEVICE | ANDERSON II, STEVEN S | 3762 | §102 | Final Rejection | — | Pending | Jan 15, 2024 |
| 18406543 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | GONZALES, VICENTE ROLANDO | 2899 | §103 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18402778 | SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DIE PACKAGES AND METHODS OF FORMING THE SAME | GHYKA, ALEXANDER G | 2812 | §112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18515320 | MULTI-TIER SEMICONDUCTOR DIE STACKS USING METAL-TO-METAL BONDING AND METHODS OF FORMING THE SAME | WINTERS, SEAN AYERS | 2892 | §102§103 | Final Rejection | — | Pending | Nov 21, 2023 |
| 18511976 | MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRUCTURE | TUGBANG, ANTHONY D | 3729 | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18470557 | FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHODS OF FORMING THE SAME | PATERSON, BRIGITTE A | 2896 | §102§103 | Final Rejection | 29d | Pending | Sep 20, 2023 |
| 18464399 | SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS FOR FORMING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §103 | Final Rejection | 26d | Pending | Sep 11, 2023 |
| 18455698 | PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 2817 | §102§103 | Final Rejection | 8d overdue | Pending | Aug 25, 2023 |
| 18230756 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | BOATMAN, CASEY PAUL | 2893 | §102§103 | Non-Final OA | 71d | Pending | Aug 07, 2023 |
| 18230719 | DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION CONTROL AND METHODS FOR USING THE SAME | GAMINO, CARLOS J | 2899 | §102§103§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18230720 | SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-WAFER BONDING AND METHODS OF FORMING THE SAME | BARZYKIN, VICTOR V | 2893 | §102§103 | Final Rejection | 21d | Pending | Aug 07, 2023 |
| 18362251 | SYSTEMS FOR IMPROVED EFFICIENCY OF BALL MOUNT CLEANING AND METHODS FOR USING THE SAME | ORTA, LAUREN GRACE | 1711 | §103§112 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362192 | MEMORY CHIPLET HAVING MULTIPLE ARRAYS OF MEMORY DEVICES AND METHODS OF FORMING THE SAME | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18206876 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ZHONG, XIN Y | 2855 | §102§103 | Final Rejection | 26d overdue | Pending | Jun 07, 2023 |
| 18321129 | PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 29d overdue | Pending | May 22, 2023 |
| 18144277 | MATERIAL PROCESSING MODELING | HOPKINS, DAVID ANDREW | 2188 | §101§102§103§112 | Non-Final OA | — | Pending | May 08, 2023 |
| 18309874 | PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FORMING THE PACKAGE MODULE | MOJADDEDI, OMAR F | 2898 | §102§103§112 | Non-Final OA | — | Pending | May 01, 2023 |
| 18304533 | SPREADER CONFIGURATION FOR PHASE CHANGE MATERIAL (PCM) SWITCH AND METHODS OF FORMING THE SAME | FOX, BRANDON C | 2818 | §103 | Final Rejection | — | Pending | Apr 21, 2023 |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | CHAN, CANDICE | 2813 | §102§103§112 | Non-Final OA | 40d | Pending | Mar 27, 2023 |
| 18110009 | THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 40d | Pending | Feb 15, 2023 |
| 17953135 | SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH ENHANCED OVERLAY TOLERANCE AND METHODS OF FORMING THE SAME | LASASSO, VICTOR JOSEPH | 2898 | §102§103 | Non-Final OA | — | Pending | Sep 26, 2022 |
| 17874366 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17851072 | RADIO FREQUENCY SWITCH FOR MULTI-BAND FILTER APPLICATIONS AND METHODS FOR FORMING THE SAME | KOLAHDOUZAN, HAJAR | 2898 | §103 | Final Rejection | — | Pending | Jun 28, 2022 |
| 17842672 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 28d | Pending | Jun 16, 2022 |
| 17749204 | BOOTH MULTIPLIER FOR COMPUTE-IN-MEMORY | LE, PHAT NGOC | 2182 | §102§103 | Final Rejection | — | Pending | May 20, 2022 |
| 17738169 | TRANSISTOR STRUCTURE HAVING REDUCED CONTACT RESISTANCE AND METHODS OF FORMING THE SAME | WINTERS, SEAN AYERS | 2892 | §103 | Non-Final OA | 78d overdue | Pending | May 06, 2022 |
| 17716010 | PROCESSING APPARATUS AND METHOD OF MANUFACTURE | LOGIE, MICHAEL J | 2800 | §102§103 | Final Rejection | — | Pending | Apr 08, 2022 |
| 17654927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | BELL, LAUREN R | 2896 | §102§103 | Non-Final OA | 1d overdue | Pending | Mar 15, 2022 |
| 17653780 | SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORMATION AND REMOVAL | NETTLES, CORALIE ANN | 2893 | §103 | Non-Final OA | 54d | Pending | Mar 07, 2022 |
| 17650312 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Feb 08, 2022 |
| 17647263 | SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Final Rejection | — | Pending | Jan 06, 2022 |
| 17367698 | SEMICONDUCTOR ARRANGEMENT INCLUDING A SPACER ADJACENT A CONDUCTIVE LAYER AND METHOD OF MAKING | WINTERS, SEAN AYERS | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 06, 2021 |
| 17306414 | THIN-FILM TRANSISTORS HAVING HYBRID CRYSTALLINE SEMICONDUCTOR CHANNEL LAYER AND METHODS OF FORMING THE SAME | CHEN, JACK S J | 2893 | §112 | Non-Final OA | — | Pending | May 03, 2021 |
| 19088150 | VOLTAGE REGULATOR CIRCUIT AND METHOD | GBLENDE, JEFFREY A | 2838 | DP | Non-Final OA | — | Pending | Mar 24, 2025 |
| 19012197 | LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME | PERENY, TYLER J | 2843 | Other | Final Rejection | — | Pending | Jan 07, 2025 |
| 19006992 | SHARED DECODER CIRCUIT AND METHOD | TRAN, MICHAEL THANH | 2827 | §102§112 | Non-Final OA | — | Pending | Dec 31, 2024 |
| 18790469 | COUPLING MONITORING SYSTEM | SMITH, MAURICE C | 2877 | §102§103§112 | Final Rejection | — | Pending | Jul 31, 2024 |
| 18748954 | OSCILLATOR CIRCUIT, LAYOUT, AND METHOD | SHIN, JEFFREY M | 2836 | §102 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18630807 | SEMICONDUCTOR DEVICE | ANDERSON, WILLIAM H | 2817 | §102§112 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18598580 | METHOD OF FABRICATING TRANSISTOR HAVING EXPANDED GATE STRUCTURE, AND TRANSISTOR FABRICATED THEREBY | DINKE, BITEW A | 2812 | §103 | Final Rejection | — | Pending | Mar 07, 2024 |
| 18526337 | METHOD FOR OPTIMIZING FLOOR PLAN FOR AN INTEGRATED CIRCUIT | GARBOWSKI, LEIGH M | 2851 | §103DP | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18195058 | SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY | RIRIE, EVERETT TRAJAN | 2897 | §103 | Non-Final OA | 66d overdue | Pending | May 09, 2023 |
| 18141073 | HEATING MODULE AND PROGRAM CONTROL METHOD FOR PUMPING LINE OF SEMICONDUCTOR PROCESSING TOOL | BOWMAN, ANDREW J | 1717 | §103 | Non-Final OA | — | Pending | Apr 28, 2023 |
| 18103698 | SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IMPROVED RELIABILITY | PURVIS, SUE A | 2800 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2023 |
| 18093472 | LOW RESISTANCE BOTTOM ELECTRODE VIA | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18093537 | ADDITIVES FOR METALLIC PHOTORESIST | CHU, JOHN S Y | 1737 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 17737308 | FERAM DEVICE AND METHOD OF MANUFACTURING | SABUR, ALIA | 2812 | §103§112 | Final Rejection | — | Pending | May 05, 2022 |